BC847 series 45 V, 100 mA NPN general-purpose transistors Rev. 8 — 20 August 2012 Product data sheet 1. Product profile 1.1 General description NPN general-purpose transistors in Surface-Mounted Device (SMD) plastic packages. Table 1. Product overview Type number[1] Package NXP JEITA JEDEC BC847 SOT23 - TO-236AB PNP complement BC857 BC847A BC857A BC847B BC857B BC847C BC847W BC857C SOT323 SC-70 - BC857W BC847AW BC857AW BC847BW BC857BW BC847CW BC847T BC857CW SOT416 SC-75 - BC857T BC847AT BC857AT BC847BT BC857BT BC847CT BC857CT BC847AM SOT883 SC-101 - BC857AM BC847BM BC857BM BC847CM BC857CM [1] Valid for all available selection groups. 1.2 Features and benefits General-purpose transistors SMD plastic packages Three different gain selections 1.3 Applications General-purpose switching and amplification BC847 series NXP Semiconductors 45 V, 100 mA NPN general-purpose transistors 1.4 Quick reference data Table 2. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VCEO collector-emitter voltage open base - - 45 V IC collector current - - 100 mA hFE DC current gain 110 - 800 hFE group A VCE = 5 V; IC = 2 mA 110 180 220 hFE group B 200 290 450 hFE group C 420 520 800 2. Pinning information Table 3. Pin Pinning Description Simplified outline Graphic symbol SOT23, SOT323, SOT416 1 base 2 emitter 3 collector 3 3 1 1 2 2 sym021 006aaa144 SOT883 1 base 2 emitter 1 3 collector 2 3 3 1 Transparent top view 2 sym021 BC847_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 20 August 2012 © NXP B.V. 2012. All rights reserved. 2 of 18 BC847 series NXP Semiconductors 45 V, 100 mA NPN general-purpose transistors 3. Ordering information Table 4. Ordering information Type number[1] BC847 Package Name Description Version - plastic surface-mounted package; 3 leads SOT23 SC-70 plastic surface-mounted package; 3 leads SOT323 SC-75 plastic surface-mounted package; 3 leads SOT416 SC-101 leadless ultra small plastic package; 3 solder lands; body 1.0 0.6 0.5 mm SOT883 BC847A BC847B BC847C BC847W BC847AW BC847BW BC847CW BC847T BC847AT BC847BT BC847CT BC847AM BC847BM BC847CM [1] Valid for all available selection groups. 4. Marking Table 5. Type number Marking code[1] Type number Marking code[1] BC847 1H* BC847T 1N BC847A 1E* BC847AT 1E BC847B 1F* BC847BT 1F BC847C 1G* BC847CT 1G BC847W 1H* BC847AM D4 BC847AW 1E* BC847BM D5 BC847BW 1F* BC847CM D6 BC847CW 1G* [1] BC847_SER Product data sheet Marking codes * = placeholder for manufacturing site code All information provided in this document is subject to legal disclaimers. Rev. 8 — 20 August 2012 © NXP B.V. 2012. All rights reserved. 3 of 18 BC847 series NXP Semiconductors 45 V, 100 mA NPN general-purpose transistors 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCBO collector-base voltage open emitter - 50 V VCEO collector-emitter voltage open base - 45 V VEBO emitter-base voltage open collector - 6 V IC collector current - 100 mA ICM peak collector current single pulse; tp 1 ms - 200 mA IBM peak base current single pulse; tp 1 ms - 100 mA Ptot total power dissipation Tamb 25 C SOT23 - 250 mW SOT323 - 200 mW - 150 mW - 250 mW [1] SOT416 [2] SOT883 Tj junction temperature - 150 C Tamb ambient temperature 65 +150 C Tstg storage temperature 65 +150 C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB with 60 m copper strip line, standard footprint. 6. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Rth(j-a) thermal resistance from junction to ambient in free air Min Typ Max Unit SOT23 - - 500 K/W SOT323 - - 625 K/W SOT416 - - 833 K/W - - 500 K/W [2] SOT883 BC847_SER Product data sheet [1] [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB with 60 m copper strip line, standard footprint. All information provided in this document is subject to legal disclaimers. Rev. 8 — 20 August 2012 © NXP B.V. 2012. All rights reserved. 4 of 18 BC847 series NXP Semiconductors 45 V, 100 mA NPN general-purpose transistors 7. Characteristics Table 8. Characteristics Tamb = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit ICBO collector-base cut-off current VCB = 30 V; IE = 0 A - - 15 nA VCB = 30 V; IE = 0 A; Tj = 150 C - - 5 A IEBO emitter-base cut-off current VEB = 5 V; IC = 0 A - - 100 nA hFE DC current gain VCE = 5 V; IC = 10 A hFE group A - 90 - hFE group B - 150 - hFE group C - 270 - 110 - 800 hFE group A 110 180 220 hFE group B 200 290 450 hFE group C 420 520 800 DC current gain VCEsat VBEsat VBE BC847_SER Product data sheet VCE = 5 V; IC = 2 mA collector-emitter saturation voltage IC = 10 mA; IB = 0.5 mA - 90 200 mV IC = 100 mA; IB = 5 mA [1] - 200 400 mV base-emitter saturation voltage IC = 10 mA; IB = 0.5 mA [2] - 700 - mV IC = 100 mA; IB = 5 mA [2] - 900 - mV IC = 2 mA; VCE = 5 V [2] base-emitter voltage 580 660 700 mV IC = 10 mA; VCE = 5 V - - 770 mV fT transition frequency VCE = 5 V; IC = 10 mA; f = 100 MHz 100 - - MHz Cc collector capacitance VCB = 10 V; IE = ie = 0 A; f = 1 MHz - - 1.5 pF Ce emitter capacitance VEB = 0.5 V; IC = ic = 0 A; f = 1 MHz - 11 - pF NF noise figure IC = 200 A; VCE = 5 V; RS = 2 k; f = 1 kHz; B = 200 Hz - 2 10 dB [1] Pulse test: tp 300 s; = 0.02. [2] VBE decreases by approximately 2 mV/K with increasing temperature. All information provided in this document is subject to legal disclaimers. Rev. 8 — 20 August 2012 © NXP B.V. 2012. All rights reserved. 5 of 18 BC847 series NXP Semiconductors 45 V, 100 mA NPN general-purpose transistors mgt723 400 hFE mgt724 1200 VBE (mV) 1000 (1) 300 (1) 800 (2) (2) 200 600 (3) 400 (3) 100 200 0 10−1 1 10 102 0 10−1 103 1 10 102 I C (mA) VCE = 5 V VCE = 5 V (1) Tamb = 150 C (1) Tamb = 55 C (2) Tamb = 25 C (2) Tamb = 25 C (3) Tamb = 55 C (3) Tamb = 150 C Fig 1. Group A: DC current gain as a function of collector current; typical values mgt725 103 103 I C (mA) VCEsat (mV) Fig 2. Group A: Base-emitter voltage as a function of collector current; typical values mgt726 1200 VBEsat (mV) 1000 (1) 800 (2) 102 600 (1) (3) (2) 400 (3) 200 10 10−1 1 10 102 0 10−1 103 1 IC/IB = 20 IC/IB = 10 (1) Tamb = 150 C (1) Tamb = 55 C (2) Tamb = 25 C (2) Tamb = 25 C (3) Tamb = 55 C (3) Tamb = 150 C Fig 3. Group A: Collector-emitter saturation voltage as a function of collector current; typical values BC847_SER Product data sheet 10 102 103 I C (mA) I C (mA) Fig 4. Group A: Base-emitter saturation voltage as a function of collector current; typical values All information provided in this document is subject to legal disclaimers. Rev. 8 — 20 August 2012 © NXP B.V. 2012. All rights reserved. 6 of 18 BC847 series NXP Semiconductors 45 V, 100 mA NPN general-purpose transistors mgt727 600 VBE (mV) 1000 hFE (1) 500 mgt728 1200 (1) 800 400 (2) (2) 300 600 200 400 (3) 100 0 10−1 1 10 (3) 200 102 0 10−2 103 10−1 1 10 I C (mA) VCE = 5 V VCE = 5 V (1) Tamb = 150 C (1) Tamb = 55 C (2) Tamb = 25 C (2) Tamb = 25 C (3) Tamb = 55 C Fig 5. 102 103 I C (mA) (3) Tamb = 150 C Group B: DC current gain as a function of collector current; typical values mgt729 104 VCEsat (mV) Fig 6. Group B: Base-emitter voltage as a function of collector current; typical values mgt730 1200 VBEsat (mV) 1000 (1) 103 800 (2) 600 (3) 102 400 (1) 200 (3) (2) 10 10−1 1 10 102 0 10−1 103 1 IC/IB = 20 IC/IB = 10 (1) Tamb = 150 C (1) Tamb = 55 C (2) Tamb = 25 C (2) Tamb = 25 C (3) Tamb = 55 C (3) Tamb = 150 C Fig 7. Group B: Collector-emitter saturation voltage as a function of collector current; typical values BC847_SER Product data sheet 10 102 103 I C (mA) I C (mA) Fig 8. Group B: Base-emitter saturation voltage as a function of collector current; typical values All information provided in this document is subject to legal disclaimers. Rev. 8 — 20 August 2012 © NXP B.V. 2012. All rights reserved. 7 of 18 BC847 series NXP Semiconductors 45 V, 100 mA NPN general-purpose transistors mgt731 1200 VBE (mV) 1000 hFE 1000 mgt732 1200 (1) (1) 800 800 (2) (2) 600 400 600 (3) 400 (3) 200 200 0 10−1 1 10 102 103 0 10−2 10−1 1 10 I C (mA) VCE = 5 V VCE = 5 V (1) Tamb = 150 C (1) Tamb = 55 C (2) Tamb = 25 C (2) Tamb = 25 C (3) Tamb = 55 C Fig 9. 102 103 I C (mA) (3) Tamb = 150 C Group C: DC current gain as a function of collector current; typical values mgt733 104 VCEsat (mV) Fig 10. Group C: Base-emitter voltage as a function of collector current; typical values mgt734 1200 VBEsat (mV) 1000 (1) 103 800 (2) 600 (3) 102 400 (1) 200 (3) (2) 10 10−1 1 10 102 103 0 10−1 1 I C (mA) IC/IB = 20 IC/IB = 10 (1) Tamb = 55 C (2) Tamb = 25 C (2) Tamb = 25 C (3) Tamb = 55 C (3) Tamb = 150 C Fig 11. Group C: Collector-emitter saturation voltage as a function of collector current; typical values Product data sheet 102 103 I C (mA) (1) Tamb = 150 C BC847_SER 10 Fig 12. Group C: Base-emitter saturation voltage as a function of collector current; typical values All information provided in this document is subject to legal disclaimers. Rev. 8 — 20 August 2012 © NXP B.V. 2012. All rights reserved. 8 of 18 BC847 series NXP Semiconductors 45 V, 100 mA NPN general-purpose transistors 8. Package outline 3.0 2.8 1.1 0.9 3 0.45 0.15 2.5 1.4 2.1 1.2 1 2 0.48 0.38 1.9 0.15 0.09 Dimensions in mm 04-11-04 Fig 13. Package outline SOT23 (TO-236AB) 2.2 1.8 1.1 0.8 0.45 0.15 3 2.2 1.35 2.0 1.15 1 2 0.4 0.3 0.25 0.10 1.3 Dimensions in mm 04-11-04 Fig 14. Package outline SOT323 (SC-70) BC847_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 20 August 2012 © NXP B.V. 2012. All rights reserved. 9 of 18 BC847 series NXP Semiconductors 45 V, 100 mA NPN general-purpose transistors 0.95 0.60 1.8 1.4 3 0.45 0.15 1.75 0.9 1.45 0.7 1 2 0.30 0.15 0.25 0.10 1 Dimensions in mm 04-11-04 Fig 15. Package outline SOT416 (SC-75) 0.62 0.55 0.55 0.47 0.50 0.46 3 0.30 0.22 0.65 0.30 0.22 2 1.02 0.95 1 0.20 0.12 0.35 Dimensions in mm 03-04-03 Fig 16. Package outline SOT883 (SC-101) BC847_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 20 August 2012 © NXP B.V. 2012. All rights reserved. 10 of 18 BC847 series NXP Semiconductors 45 V, 100 mA NPN general-purpose transistors 9. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number[2] Package BC847 SOT23 Description Packing quantity 3000 5000 10000 4 mm pitch, 8 mm tape and reel -215 - -235 SOT323 4 mm pitch, 8 mm tape and reel -115 - -135 SOT416 4 mm pitch, 8 mm tape and reel -115 - -135 SOT883 2 mm pitch, 8 mm tape and reel - - -315 BC847A BC847B BC847C BC847W BC847AW BC847BW BC847CW BC847T BC847AT BC847BT BC847CT BC847AM BC847BM BC847CM BC847_SER Product data sheet [1] For further information and the availability of packing methods, see Section 13. [2] Valid for all available selection groups. All information provided in this document is subject to legal disclaimers. Rev. 8 — 20 August 2012 © NXP B.V. 2012. All rights reserved. 11 of 18 BC847 series NXP Semiconductors 45 V, 100 mA NPN general-purpose transistors 10. Soldering 3.3 2.9 1.9 solder lands solder resist 3 2 1.7 solder paste 0.6 (3×) 0.7 (3×) occupied area Dimensions in mm 0.5 (3×) 0.6 (3×) 1 sot023_fr Fig 17. Reflow soldering footprint SOT23 (TO-236AB) 2.2 1.2 (2×) 1.4 (2×) solder lands 4.6 solder resist 2.6 occupied area Dimensions in mm 1.4 preferred transport direction during soldering 2.8 4.5 sot023_fw Fig 18. Wave soldering footprint SOT23 (TO-236AB) BC847_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 20 August 2012 © NXP B.V. 2012. All rights reserved. 12 of 18 BC847 series NXP Semiconductors 45 V, 100 mA NPN general-purpose transistors 2.65 1.85 1.325 solder lands solder resist 2 2.35 0.6 (3×) 3 solder paste 1.3 1 occupied area 0.5 (3×) Dimensions in mm 0.55 (3×) sot323_fr Fig 19. Reflow soldering footprint SOT323 (SC-70) 4.6 2.575 1.425 (3×) solder lands solder resist occupied area 1.8 3.65 2.1 09 (2×) Dimensions in mm preferred transport direction during soldering sot323_fw Fig 20. Wave soldering footprint SOT323 (SC-70) BC847_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 20 August 2012 © NXP B.V. 2012. All rights reserved. 13 of 18 BC847 series NXP Semiconductors 45 V, 100 mA NPN general-purpose transistors 2.2 1.7 solder lands solder resist 1 0.85 2 solder paste 0.5 (3×) occupied area Dimensions in mm 0.6 (3×) 1.3 sot416_fr Fig 21. Reflow soldering footprint SOT416 (SC-75) 1.3 0.7 R0.05 (12×) solder lands solder resist 0.9 0.6 0.7 solder paste 0.25 (2×) occupied area 0.3 (2×) 0.3 0.4 (2×) 0.4 Dimensions in mm sot883_fr Fig 22. Reflow soldering footprint SOT883 (SC-101) BC847_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 20 August 2012 © NXP B.V. 2012. All rights reserved. 14 of 18 BC847 series NXP Semiconductors 45 V, 100 mA NPN general-purpose transistors 11. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes BC847_SER v.8 20120820 Product data sheet - Modifications: BC847_BC547_SER v.7 • Type numbers removed: BC847B/DG, BC847BW/DG, BC847AT/DG, BC857, BC857B and BC857C • Section 12 “Legal information”: updated BC847_BC547_SER v.7 20081210 Product data sheet - BC847_BC547_SER v.6 BC847_BC547_SER v.6 20050519 Product data sheet - - BC847_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 20 August 2012 © NXP B.V. 2012. All rights reserved. 15 of 18 BC847 series NXP Semiconductors 45 V, 100 mA NPN general-purpose transistors 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 12.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. BC847_SER Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 8 — 20 August 2012 © NXP B.V. 2012. All rights reserved. 16 of 18 BC847 series NXP Semiconductors 45 V, 100 mA NPN general-purpose transistors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BC847_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 20 August 2012 © NXP B.V. 2012. All rights reserved. 17 of 18 BC847 series NXP Semiconductors 45 V, 100 mA NPN general-purpose transistors 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Thermal characteristics . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Packing information . . . . . . . . . . . . . . . . . . . . 11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information. . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 20 August 2012 Document identifier: BC847_SER