SO D3 23F TDZxJ series Single Zener diodes Rev. 2 — 29 July 2011 Product data sheet 1. Product profile 1.1 General description General-purpose Zener diodes in a SOD323F (SC-90) very small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits Non-repetitive peak reverse power dissipation: 180 W Total power dissipation: 500 mW Very small plastic package suitable for surface-mounted design Low differential resistance AEC-Q101 qualified 1.3 Applications General regulation functions 1.4 Quick reference data Table 1. Symbol VF Ptot Quick reference data Parameter Conditions forward voltage IF = 100 mA [1] total power dissipation Tamb 25 C [2] Min Typ Max Unit - - 1.1 V - - 500 mW [1] Pulse test: tp 300 s; 0.02. [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for cathode 16 mm2. 2. Pinning information Table 2. Pin Pinning Description 1 cathode 2 anode Simplified outline Graphic symbol [1] 1 2 1 2 006aaa152 [1] The marking bar indicates the cathode. TDZxJ series NXP Semiconductors Single Zener diodes 3. Ordering information Table 3. Ordering information Type number TDZxJ series Package Name Description Version SC-90 plastic surface-mounted package; 2 leads SOD323F 4. Marking Table 4. TDZXJ_SER Product data sheet Marking codes Type number Marking code Type number Marking code TDZ2V4J 3A TDZ9V1J 3Q TDZ2V7J 3B TDZ10J 3R TDZ3V0J 3C TDZ11J 3S TDZ3V3J 3D TDZ12J 3T TDZ3V6J 3E TDZ13J 3U TDZ3V9J 3F TDZ15J 3V TDZ4V3J 3G TDZ16J 3W TDZ4V7J 3H TDZ18J 3Y TDZ5V1J 3J TDZ20J 3Z TDZ5V6J JQ TDZ22J 4A TDZ6V2J 3K TDZ24J 4B TDZ6V8J 3L TDZ27J 4C TDZ7V5J 3N TDZ30J 4D TDZ8V2J 3P - - All information provided in this document is subject to legal disclaimers. Rev. 2 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 2 of 12 TDZxJ series NXP Semiconductors Single Zener diodes 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit IF forward current - 250 mA - see Table 8 and 10 TDZ2V4J to TDZ5V6J - 180 W TDZ6V2J to TDZ6V8J - 100 W - 40 W IZSM non-repetitive peak reverse current [1] PZSM non-repetitive peak reverse power dissipation [1] TDZ7V5J to TDZ30J Tamb 25 C [2] Ptot total power dissipation - 500 mW Tj junction temperature - 150 C Tamb ambient temperature 55 +150 C Tstg storage temperature 65 +150 C [1] tp = 100 s; square wave; Tj = 25 C before surge. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 16 mm2. 6. Thermal characteristics Table 6. Symbol Thermal characteristics Parameter Conditions Rth(j-a) thermal resistance from junction to ambient Rth(j-sp) thermal resistance from junction to solder point in free air Min Typ Max Unit [1] - - 250 K/W [2] - - 25 K/W [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 16 mm2. [2] Soldering point of cathode tab. 7. Characteristics Table 7. Characteristics Tj = 25 C unless otherwise specified. Symbol Parameter VF forward voltage [1] TDZXJ_SER Product data sheet Conditions Min Typ Max Unit IF = 10 mA - - 0.9 V IF = 100 mA - - 1.1 V [1] Pulse test: tp 300 s; 0.02. All information provided in this document is subject to legal disclaimers. Rev. 2 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 3 of 12 TDZxJ series NXP Semiconductors Single Zener diodes Table 8. Characteristics per type; Zener TDZ2V4J to Zener TDZ24J Tj = 25 C unless otherwise specified. TDZxxxJ Working voltage VZ (V) Differential resistance Reverse current Temperature coefficient I (A) R rdif () SZ (mV/K) Diode capacitance Cd (pF)[1] Non-repetitive peak reverse current IZSM (A)[2] IZ = 5 mA IZ = 1 mA IZ = 5 mA IZ = 5 mA Min Max Max Max Max VR (V) Min Max Max Max 2V4 2.35 2.45 400 100 50 1.0 3.5 0 450 15 2V7 2.65 2.75 450 100 20 1.0 3.5 0 440 15 3V0 2.94 3.06 500 95 10 1.0 3.5 0 425 15 3V3 3.23 3.37 500 95 5 1.0 3.5 0 410 15 3V6 3.53 3.67 500 90 5 1.0 3.5 0 390 15 3V9 3.82 3.98 500 90 3 1.0 3.5 0 370 15 4V3 4.21 4.39 600 90 3 1.0 3.5 0 350 15 4V7 4.61 4.79 500 80 3 2.0 3.5 0.2 325 15 5V1 5.00 5.20 480 60 2 2.0 2.7 1.2 300 15 5V6 5.49 5.71 400 40 10 2.5 2 2.5 275 15 6V2 6.08 6.32 150 10 3 4.0 0.4 3.7 250 12 6V8 6.66 6.94 80 15 2 4.0 1.2 4.5 215 12 7V5 7.5 7.65 80 10 1 5.0 2.5 5.3 170 4.0 8V2 8.04 8.36 80 10 0.70 5.0 3.2 6.2 150 4.0 9V1 8.92 9.28 100 10 0.50 6.0 3.8 7.0 120 3.0 10 9.80 10.20 150 10 0.20 7.0 4.5 8.0 110 3.0 11 10.80 11.20 150 10 0.10 8.0 5.4 9.0 108 2.5 12 11.80 12.20 150 10 0.10 8.0 6.0 10 105 2.5 13 12.70 13.30 170 10 0.10 8.0 7.0 11 103 2.5 15 14.70 15.30 200 15 0.05 10.5 9.2 13 99 2.0 16 15.70 16.30 200 20 0.05 11.2 10.4 14 97 1.5 18 17.6 18.4 225 20 0.05 12.6 12.4 16 93 1.5 20 19.6 20.4 225 20 0.05 14.0 14.4 18 88 1.5 22 21.6 22.4 250 25 0.05 15.4 16.4 20 84 1.25 24 23.5 24.5 250 30 0.05 16.8 18.4 22 80 1.25 [1] f = 1 MHz; VR = 0 V [2] tp = 100 s; square wave; Tj = 25 C before surge. Table 9. Characteristics per type; Zener TDZ5V6J Tj = 25 C unless otherwise specified. TDZxxxJ Working voltage Differential resistance Temperature coefficient VZ (V) rdif () SZ (mV/K) IZ = 10 mA 5V6 TDZXJ_SER Product data sheet IZ = 0.5 mA IZ = 10 mA IZ = 5 mA Min Max Max Max Min Max 5.20 6.00 500 7 1.7 2.8 All information provided in this document is subject to legal disclaimers. Rev. 2 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 4 of 12 TDZxJ series NXP Semiconductors Single Zener diodes Table 10. Characteristics per type; Zener TDZ27J to Zener TDZ30J Tj = 25 C unless otherwise specified. TDZxxxJ Working voltage Differential resistance Reverse current r () VZ (V) dif IR (A) Temperature coefficient Diode capacitance SZ (mV/K) Cd (pF)[1] Non-repetitive peak reverse current IZSM (A)[2] IZ = 2 mA IZ = 0.5 mA IZ = 2 mA IZ = 2 mA Min Max Max Max Max VR (V) Min Max Max Max 27 26.5 27.5 250 40 0.05 18.9 21.4 25.3 73 1 30 29.4 30.6 250 40 0.05 21 24.4 29.4 66 1 [1] f = 1 MHz; VR = 0 V [2] tp = 100 s; square wave; Tj = 25 C before surge. 006aac671 103 mbg781 300 PZSM (W) IF (mA) 102 200 (1) (2) (3) 10 100 (4) 1 10–4 10–3 0 0.6 10–2 tp (s) 0.8 1 VF (V) Tj = 25 C (1) TDZ2V4J to TDZ5V6J (2) TDZ6V2J to TDZ6V8J (3) TDZ7V5J to TDZ30J; Tj = 25 C before surge (4) TDZ7V5J to TDZ30J; Tj = 150 C before surge Fig 1. Non-repetitive peak reverse power dissipation as a function of pulse duration; maximum values TDZXJ_SER Product data sheet Fig 2. Forward current as a function of forward voltage; typical values All information provided in this document is subject to legal disclaimers. Rev. 2 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 5 of 12 TDZxJ series NXP Semiconductors Single Zener diodes mld444 0.5 SZ (mV/K) mld445 12 15 SZ (mV/K) 4V7 13 12 11 10 9V1 8V2 7V5 6V8 6V2 5V6 5V1 0 8 4V3 −0.5 2V4 4 2V7 3V9 −1 3V6 −1.5 0 3V3 3V0 −2 10−1 1 −4 10−1 102 10 1 Fig 3. IZ (mA) TDZ2V4J to TDZ4V7J TDZ5V1J to TDZ15J Tj = 25 C to 150 C Tj = 25 C to 150 C Temperature coefficient as a function of working current; typical values Fig 4. 006aaa996 50 102 10 IZ (mA) Temperature coefficient as a function of working current; typical values 006aac672 30 VZ(nom) (V) = 2.7 IZ (mA) 3.3 VZ(nom) (V) = 10 IZ (mA) 3.9 40 4.7 5.6 6.8 20 8.2 12 30 15 20 10 18 22 10 0 0 0 2 4 6 8 0 10 10 20 30 VZ (V) VZ (V) Fig 5. 27 TDZ2V7J to TDZ6V6J TDZ10J to TDZ27J Tj = 25 C Tj = 25 C Working current as a function of working voltage; typical values Fig 6. Working current as a function of working voltage; typical values 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. TDZXJ_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 6 of 12 TDZxJ series NXP Semiconductors Single Zener diodes 9. Package outline 1.35 1.15 0.80 0.65 0.5 0.3 1 2.7 2.3 1.8 1.6 2 0.40 0.25 Dimensions in mm Fig 7. 0.25 0.10 04-09-13 Package outline SOD323F (SC-90) 10. Packing information Table 11. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number TDZxJ series [1] TDZXJ_SER Product data sheet Package SOD323F Description 4 mm pitch, 8 mm tape and reel Packing quantity 3000 10000 -115 -135 For further information and the availability of packing methods, see Section 14. All information provided in this document is subject to legal disclaimers. Rev. 2 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 7 of 12 TDZxJ series NXP Semiconductors Single Zener diodes 11. Soldering 3.05 2.2 2.1 solder lands solder resist 0.5 (2×) 1.65 0.95 0.6 (2×) solder paste occupied area 0.5 (2×) 0.6 (2×) Dimensions in mm sod323f_fr Reflow soldering is the only recommended soldering method. Fig 8. TDZXJ_SER Product data sheet Reflow soldering footprint SOD323F (SC-90) All information provided in this document is subject to legal disclaimers. Rev. 2 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 8 of 12 TDZxJ series NXP Semiconductors Single Zener diodes 12. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes TDZXJ_SER v.2 20110729 Product data sheet - TDZ5V6J v.1 Modifications: TDZ5V6J v.1 TDZXJ_SER Product data sheet • Added type numbers TDZ2V4J, TDZ2V7J, TDZ3V0J, TDZ3V3J, TDZ3V6J, TDZ3V9J, TDZ4V3J, TDZ4V7J, TDZ5V1J, TDZ6V2J, TDZ6V8J, TDZ7V5J, TDZ8V2J, TDZ9V1J, TDZ10J, TDZ11J, TDZ12J, TDZ13J, TDZ15J, TDZ16J, TDZ18J, TDZ20J, TDZ22J, TDZ24J, TDZ27J and TDZ30J. • • Added Table 8 to 10. Updated Figure 1 to 4 and added Figure 5 and 6. 20100823 Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 2 — 29 July 2011 - © NXP B.V. 2011. All rights reserved. 9 of 12 TDZxJ series NXP Semiconductors Single Zener diodes 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. 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Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. 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All rights reserved. 10 of 12 TDZxJ series NXP Semiconductors Single Zener diodes Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] TDZXJ_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 11 of 12 TDZxJ series NXP Semiconductors Single Zener diodes 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 Packing information . . . . . . . . . . . . . . . . . . . . . 7 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 29 July 2011 Document identifier: TDZXJ_SER