BAT54CV Two Schottky barrier double diodes in ultra small SOT666 package Rev. 02 — 15 January 2010 Objective data sheet 1. Product profile 1.1 General description Two planar Schottky barrier double diodes with common cathodes and an integrated guard ring for stress protection encapsulated in a SOT666 ultra small SMD plastic package. 1.2 Features Low forward voltage Low capacitance Ultra small SMD plastic package Flat leads: excellent coplanarity and improved thermal behavior 1.3 Applications Ultra high-speed switching Voltage clamping Line termination Inverse-polarity protection 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter VR IF Conditions Min Typ Max Unit continuous reverse voltage - - 30 V continuous forward current - - 200 mA BAT54CV NXP Semiconductors Two Schottky barrier double diodes in ultra small SOT666 package 2. Pinning information Table 2. Pinning Pin Description Simplified outline 1 anode (diode 1) 2 anode (diode 2) 3 common cathode (diode 3, 4) 4 anode (diode 3) 5 anode (diode 4) 6 common cathode (diode 1, 2) 6 5 4 1 2 3 Symbol 6 5 4 1 2 3 sym057 3. Ordering information Table 3. Ordering information Type number BAT54CV Package Name Description Version - plastic surface mounted package; 6 leads SOT666 4. Marking Table 4. Marking codes Type number Marking code BAT54CV C5 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per diode VR continuous reverse voltage - 30 V IF continuous forward current - 200 mA IFRM repetitive peak forward current tp ≤ 10 ms; δ ≤ 0.5 - 0.85 A IFSM non-repetitive peak forward current tp = 8.3 ms - 2 A Tj junction temperature - 125 °C Tamb ambient temperature −65 +125 °C Tstg storage temperature −65 +150 °C BAT54CV_2 Objective data sheet © NXP B.V. 2010. All rights reserved. Rev. 02 — 15 January 2010 2 of 9 BAT54CV NXP Semiconductors Two Schottky barrier double diodes in ultra small SOT666 package Table 5. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions total power dissipation Tamb ≤ 25 °C Min Max Unit - 440 mW Per device Ptot [1] [1] Refer to SOT666 standard mounting conditions. 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Rth(j-a) thermal resistance from junction to ambient in free air [1][2] [1] Refer to SOT666 standard mounting conditions. [2] Reflow soldering is the only recommended soldering method. Min Typ Max Unit - - 225 K/W 7. Characteristics Table 7. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit forward voltage see Figure 1; IF = 0.1 mA - - 240 mV IF = 1 mA - - 320 mV IF = 10 mA - - 400 mV IF = 30 mA - - 500 mV IF = 100 mA - - 800 mV Per diode VF IR reverse current VR = 25 V; see Figure 2 - - 2 μA Cd diode capacitance VR = 1 V; f = 1 MHz; see Figure 3 - - 10 pF [1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02. BAT54CV_2 Objective data sheet [1] © NXP B.V. 2010. All rights reserved. Rev. 02 — 15 January 2010 3 of 9 BAT54CV NXP Semiconductors Two Schottky barrier double diodes in ultra small SOT666 package msa892 103 IF (mA) msa893 103 IR (μA) (1) (2) (3) 102 (1) 102 (2) 10 10 1 10−1 (1) (2) (3) 0 1 0.4 0.8 VF (V) (3) 10−1 0 1.2 10 (1) Tamb = 125 °C (1) Tamb = 125 °C (2) Tamb = 85 °C (2) Tamb = 85 °C (3) Tamb = 25 °C Fig 1. 20 VR (V) 30 (3) Tamb = 25 °C Forward current as a function of forward voltage; typical values Fig 2. Reverse current as a function of reverse voltage; typical values msa891 15 Cd (pF) 10 5 0 0 10 20 VR (V) 30 Tamb = 25 °C; f = 1 MHz Fig 3. Diode capacitance as a function of reverse voltage; typical values BAT54CV_2 Objective data sheet © NXP B.V. 2010. All rights reserved. Rev. 02 — 15 January 2010 4 of 9 BAT54CV NXP Semiconductors Two Schottky barrier double diodes in ultra small SOT666 package 8. Package outline Plastic surface-mounted package; 6 leads SOT666 D E A X Y S S HE 6 5 4 pin 1 index A 1 2 e1 c 3 bp w M A Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A bp c D E e e1 HE Lp w y mm 0.6 0.5 0.27 0.17 0.18 0.08 1.7 1.5 1.3 1.1 1.0 0.5 1.7 1.5 0.3 0.1 0.1 0.1 OUTLINE VERSION REFERENCES IEC JEDEC JEITA ISSUE DATE 04-11-08 06-03-16 SOT666 Fig 4. EUROPEAN PROJECTION Package outline SOT666 BAT54CV_2 Objective data sheet © NXP B.V. 2010. All rights reserved. Rev. 02 — 15 January 2010 5 of 9 BAT54CV NXP Semiconductors Two Schottky barrier double diodes in ultra small SOT666 package 9. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description BAT54CV SOT666 4 mm pitch, 8 mm tape and reel Packing quantity 4000 [1] -115 For further information and the availability of packing methods, see Section 12. BAT54CV_2 Objective data sheet © NXP B.V. 2010. All rights reserved. Rev. 02 — 15 January 2010 6 of 9 BAT54CV NXP Semiconductors Two Schottky barrier double diodes in ultra small SOT666 package 10. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes BAT54CV_2 20100115 Objective data sheet - BAT54CV_1 Modifications: BAT54CV_1 • This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • • Table 2 “Pinning”: updated Figure 4 “Package outline SOT666”: updated 20040922 Objective data sheet BAT54CV_2 Objective data sheet - - © NXP B.V. 2010. All rights reserved. Rev. 02 — 15 January 2010 7 of 9 BAT54CV NXP Semiconductors Two Schottky barrier double diodes in ultra small SOT666 package 11. Legal information 11.1 Data sheet status Document status[1][2] Product status[3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. Definition [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 11.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BAT54CV_2 Objective data sheet © NXP B.V. 2010. All rights reserved. Rev. 02 — 15 January 2010 8 of 9 BAT54CV NXP Semiconductors Two Schottky barrier double diodes in ultra small SOT666 package 13. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 11.1 11.2 11.3 11.4 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Packing information . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 2 2 2 2 3 3 5 6 7 8 8 8 8 8 8 9 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 15 January 2010 Document identifier: BAT54CV_2