Security & Chip Card ICs SLE 66CX182PE 8/16-Bit Security Controller with enhanced instruction set for large memories in 0.22 µm CMOS Technology 136-Kbytes ROM, 5052 Bytes RAM, 18-Kbytes EEPROM 1100-Bit Advanced Crypto Engine certified RSA 2048-bit library available Dual Key Triple DES Preliminary Short Product Information 02.04 SLE 66CX182PE Short Product Information Ref.: SPI_SLE 66CX182PE_0204 This document contains preliminary information on a new product under development. Details are subject to change without notice. Revision History: Current Version 02.04 Previous Releases: Page Important: Further information is confidential and on request. Please contact: Infineon Technologies AG in Munich, Germany, Security & Chip Card ICs, Tel +49 - (0)89 234-80000 Fax +49 - (0)89 234-81000 E-Mail: [email protected] Edition 2004 Published by Infineon Technologies AG, CC Applications Group St.-Martin-Strasse 53, D-81541 München © Infineon Technologies AG 2002 All Rights Reserved. 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Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. SLE 66CX182PE 16-Bit Security Controller with enhanced instruction set for large memories in 0.22µm CMOS Technology 136-Kbyte ROM, 5052 Bytes RAM, 18-Kbyte EEPROM 1100-Bit ACE and Dual Key Triple DES Accelerator Features • • • New New • • Instruction set opcode compatible with standard SAB 8051 processor New New • • • New • • • New • • • • New • Internal Clock with up to 33 MHz: Programmable internal frequency (PLL x1, x2, x3, x4 and free running mode(s)). Adjustable internal frequency according to available power or required performance • • Addressable memory up to 16 Mbyte Additional enhanced instructions for direct physical memory access of >64kByte • • • Typically saves up to 90 % code space and increases execution speed up to 80 % Dedicated, non-standard architecture with execution time 6 times faster than standard SAB 8051 processor at same external clock. (Up to 18 times faster using internal frequency PLL x 3 compared to external clock). • • • 136 Kbytes User ROM for application programs 18 Kbytes MicroSlim-EEPROM for increased memory requirements in mobile applications 4 Kbytes XRAM, 256 bytes internal RAM, 700 bytes Crypto RAM. Increased internal clock frequency for maximum performance Internal frequency ist automatically adjusted to guarantee a given limited power consumption Two 16-bit Autoreload Timer Power saving sleep mode Ext. Clock freq. 1 up to 7.5 MHz for int. Clock up to 33 MHz UART for handling serial interface in accordance with ISO/IEC 7816 part 3 supporting transmission protocols T=1 and T=0 Supply voltage range:1.8 V, 3.0 V, 5.0 V Support of current current consumption limits by GSM / UICC applications < 10 mA @ 5.5 V < 6 mA @ 3.3 V < 4 mA @ 1.98 V Dual Key Triple DES (DDES) • • • Advanced Crypto Engine: MicroSlim-EEPROM Enhanced Memory Management and Protection Unit (MMU) with application and user defined segments • • • • • Downward compatibility to existing SLE 66CxxxP products for existing masks without using the new features • • New 8/16-bit microcomputer in 0.22 µm CMOS technology Up to 1100 bit RSA calculation in Hardware Up to 2048 bit RSA calculation in software with RSA 2048 crypto library (CC EAL 5+ certified within SLE66CX322P, refer to product brief) New New Supports Elliptic Curves over GF[p] • • • • • CC EAL5+ certification according to BSI-PP-0002 planned • • • True Random Number Generator with Firmware test function CRC Module 16-bit Interrupt Module Code executions during E²-programming for faster personalization • Operating Temperature range: -25 to +85°C Storing temperature range: –40° to +125°C ESD protection larger than 6 kV (HBM) Typical Erase + Write time ≤ 2.9 ms Enhanced ECC module controlled by OS Reading and programming byte by byte Platform prepared for flash-like erasing of E²-segments up to 2 kB Flexible page mode for 1 to 64 bytes write/erase operation 32 bytes security area (OTP) Fast personalization mode ≤ 1.0 ms Minimum of 500.000 write/erase cycles @ 25°C per page. Maximum of 16.500.000 write/erase cycles per sector Typical data retention of 10 years @ 25°C EEPROM programming voltage generated on chip Preliminary - Short Product Information 3/9 02.04 SLE 66CX182PE Memory Management and Protection Unit New • • • • • New • • Addressable memory of up to 16 Mbyte Anti Snooping • • Separates OS (system mode) and application (user mode) System routines called by interrupts • • OS can restrict access to peripherals in application mode Variable application orientated segments defined and controlled by OS • • • • • • • • • • Enhanced multi-application support by 16 descriptors for system application mode. Targeted Certifications • • • Enhanced sensor concept: • • • • • • Low and high voltage sensors • Light Sensor • Glitch Sensors Temperature Sensor CC EAL5+ VISA level 3 CAST HW-& SW-Tools (Emulator, ROM Monitor, Card Emulator, Simulator, Softmasking) Application notes Supported Standards Life Test Function for Sensors (UMSLC) • • • • Bus confusion Security reset detection Current control oscillator ISO/IEC 7816 EMV 2000 GSM 11.11, 11.12, 11.18 ETSI TS 102 221 Document References Sparkling SFR encryption for DDES and ACE, CRC module and RNG • • • 32 bytes security PROM, hardware protected for batch-, wafer-, die- individual security data. Unique chip identification number for each chip Additional memory for customer-defined security FabKey on request • MED – memory encryption/decryption device for XRAM, ROM and EEPROM • Security optimized layout and layout scrambling Confidential Data Book SLE 66CxxxPE Qualification report Chip delivery specification for wafer with chip-layout (die size, orientation,...) Module specification package, etc. containing description of Qualification report module Development Tools Overview Fast IRAM erase • Enhanced Error correction unit (ECU) • • • Irreversible Lock - Out of test-mode • Preliminary - Short Product Information Hardware countermeasures controlled by True Random Number Generator Support Frequency sensors and filters Testmode • Non standard dedicated Smart Card CPU – Core Active Shield with automatic and user controlled attack detection • Memory Security New Effective HW-countermeasures against SEMA/DEMA, SPA/DPA, DFA and Timing-Attacks Code execution from XRAM possible Security Features • Automatic randomization smoothing of power profile 4/9 Short Product Information Software Development Kit SDK CC Short Product Information Card Emulator CE66P Short Product Information ROM Monitor RM66P Short Product Information Emulator ET66P Hitex or ET66P KSC Short Product Information Smart Mask Package 02.04 SLE 66CX182PE Performance Advanced Crypto Engine (typical values, based on internal test results) New Operation Modulus Calculation Time Exponent 5MHz 15 MHz 33 MHz* Modular Exponentiation RSA Encrypt / RSA Signature Verify 1024 bit 2048 bit 17 bit 17 bit 20 ms 630 ms 7 ms 210 ms 3 ms 96 ms Modular Exponentiation RSA Decrypt / RSA Signature Generate 1024 bit 1024 bit 820 ms 273 ms 124 ms Modular Exponentiation using CRT RSA Decrypt / RSA Signature Generate eq.1024 bit eq.1024 bit 250 ms eq.2048 bit eq.2048 bit 1840 ms 83 ms 614 ms 38 ms 279 ms DSA Signature Generate 512 bit 160 bit 97ms 32 ms 15 ms DSA Signature Verify 512 bit 160 bit 117 ms 39 ms 18 ms DSA Signature Generate 1024 bit 160 bit 438 ms 146 ms 66 ms DSA Signature Verify 1024 bit 160 bit 711 ms 237 ms 108 ms * preliminary values Performance DDES- Accelerator (typical values, based on internal test results) Operation Data Block Length Encryption Time for an 8-Byte Block incl. Data Transfer New 5 MHz 15 MHz 33 MHz* 56-bit Single DES Encryption 64 bit 23 µs 8 µs 3.5 µs 112-bit Triple DES Encryption 64 bit 35 µs 12 µs 5.3 µs * preliminary values Preliminary - Short Product Information 5/9 02.04 SLE 66CX182PE Ordering Information Type SLE 66CX182PE C SLE 66CX182PE M5 Package 1 Die (sawn, unsawn) M5.1 Voltage Temperature Range Range Frequency Range (int. clock frequency 1.8 V; 3.0 V; 5.0 V – 25°C to + 70°C or or or 3.0 V; 5.0 V – 25°C to + 85°C 1 MHz - 7.5 MHz Up to 33 MHz Frequency Range (ext. clock frequency) 1 MHz - 5 MHz For ordering information please refer to the databook and contact your sales representative. Production sites for SLE 66CX182PE: • 1 Dresden (Germany), UMC (Taiwan), Altis (France). available as wire-bonded module (M5) for embedding in plastic cards or as die (C) for customer packaging Preliminary - Short Product Information 6/9 02.04 SLE 66CX182PE Pin Configuration VCC GND CLK RST SLE 66CX182PE I/O Figure 1: Pin Configuration Pin Definitions and Functions Symbol Function VCC Operating voltage RST Reset input CLK Processor clock input GND Ground I/O Bi-directional data port Preliminary - Short Product Information 7/9 02.04 SLE 66CX182PE General Description The SLE66CX182PE is a member of the improved 66PE-series of Infineon Technologies. This high performance security crypto controller is manufactured in advanced 0.22 µm CMOS technology. It is downward compatible to existing 66P controller derivatives. The well known ECO2000 8/16 bit CPU provides the high efficiency of the SAB 8051 instruction set extended by additional powerful instructions together with enhanced performance, memory sizes and security features compared to existing 66P derivatives. Performance: The internal clock frequency can be adjusted to a level up to 33 MHz either as a multiple of 1,2,3,4 to the external frequency or independent of the clock rate of the terminal with the help of the internal clock. It is adjustable according to either available power requirements or required performance: • New Increased internal clock frequency for maximum performance, e.g. for high performance with max. frequency in payment applications or crypto operations. • Automatically adjusted frequency for a max. given power consumption, e.g. by GSM or UMTS requirements. Memory: The SLE66CX182PE offers 136 Kbytes of User-ROM, 256 byte internal RAM, 4096 byte XRAM and 18 Kbytes MicroSlim-EEPROM, to fulfill the requirements mainly for DDA payment and ID applications. The large ROM size allows to place applications in the ROM-mask and to keep the E²PROM free for customer data. In addition it saves mask development costs, as one mask may be used for different customer projects. The enhanced Memory Management and Protection Unit allows a secure separation of the operating system and different applications. It allows to separate the memories in application orientated segments, which can be controlled by the OS. Furthermore, the MMU makes a secure downloading of applications possible even after personalization of a card. These new features suit the requirements of the next generation of multi application operating systems. Voltage Clock Reset ROM 136 Kbyte XRAM 4 Kbyte 16-Bit CPU with MMU & ECO 2000 Instruction Set EEPROM 18 Kbyte DES Accelerator Advanced Crypto Engine Address-/Data Bus Sleep Mode Logic Sensors/Filters Interrupt Voltage Regulator two 16-bit Timer CRC Random Number Generator UART Clock generated Figure 2: Block Diagram SLE 66CX182PE The new platform is designed to address up to 16Mbyte. However this feature is only available upon request and will clearly require a change in the existing tool environment. In addition, new instructions have been implemented in the design for an efficient direct access of physical memory >64KByte up to 16 MByte. Preliminary - Short Product Information 8/9 02.04 SLE 66CX182PE Security features: Since the very beginning, security is an integrated part of Infineons product development, as proved by various certificates (ITSEC, CC, Proton, VISA, ZKA, Mondex). The so called “integral security concept” for the 66P series ensures: • • • A secret storage of any confidential code, data and keys Protection against side channel attacks such as: Simple Power Analysis (SPA) , Differential Power Analysis (DPA), Protection against Differential Fault Analysis (DFA), Electromagnetic Emanation Attack (EMA) and other possible HW or SW attacks Peripherals: The CRC module allows the easy generation of checksums according to ISO/IEC 3309 (16-Bit-CRC). To minimize the overall power consumption, the chip card controller IC offers a sleep mode. The UART supports the halfduplex transmission protocols T=0 and T=1 according to ISO/IEC 7816-3. All relevant transmission parameters can be adjusted by software, as e.g. the clock division factor, direct/inverse convention and the number of stop bits. Additionally, the I/O port can be driven by communication routines realized in software. The Advanced Crypto Engine (ACE) is equipped with its own RAM of 700 bytes and supports all of today known publickey algorithms based on large integer modular arithmetic. It allows fast and efficient calculation either in HW or supported by software of e.g. RSA operations and EC (Elliptic Curves) algorithms for key lengths up to 2048-bit. For all of it’s crypto controller using the ACE, Infineon offers a tailor made RSA 2048-bit library. This library is a powerful multifunctional crypto library for the SLE 66CXxxP family. It provides arithmetic functions for easy programming the Advanced Crypto Engine (ACE). In addition it provides a full implementation of RSA Sign, Verify and Key generation including powerful SPA/DPA and DFA counter measures. It supports RSA up to 2048 bit key length. These RSA functionality has already been certified according to Common Criteria EAL5+ on an existing crypto controller, the SLE66CX322P. The HW-DES module supports symmetric crypto algorithms according to the Data Encryption Standard in the Electronic Code Book Mode. The random number generator (RNG) is able to supply the CPU with true random numbers on all conditions. The advanced sensor concept includes various sensors for any kind of attack scenarios and even more important a “Life Test ” for sensors. As an important feature, the chip provides an on-chip security, which fulfills the strong security requirements of a Common Criteria evaluation at an EAL5+ level. In conclusion, the SLE 66CX182PE fulfills all the requirements of today's chip card applications, and is especially designed for DDA payment and ID-applications incl. digital signatures. The SLE66CX182PE integrates outstanding memory sizes, additional peripherals in combination with enhanced performance and optimized power consumption on a minimized die size. Preliminary - Short Product Information 9/9 02.04