PHILIPS PCT2075

PCT2075
I2C-bus Fm+, 1 degree C accuracy, digital temperature sensor
and thermal watchdog
Rev. 3 — 21 May 2013
Product data sheet
1. General description
The PCT2075 is a temperature-to-digital converter featuring 1 C accuracy over 25 C
to +100 C range. It uses an on-chip band gap temperature sensor and Sigma-Delta
A-to-D conversion technique with an overtemperature detection output that is a drop-in
replacement for other LM75 series thermal sensors. The device contains a number of data
registers: Configuration register (Conf) to store the device settings such as device
operation mode, OS operation mode, OS polarity and OS fault queue; temperature
register (Temp) to store the digital temp reading, set-point registers (Tos and Thyst) to
store programmable overtemperature shutdown and hysteresis limits, and programmable
temperature sensor sampling time Tidle, that can be communicated by a controller via the
2-wire serial I2C-bus Fast-mode Plus interface.
The PCT2075 also includes an open-drain output (OS) which becomes active when the
temperature exceeds the programmed limits. The OS output operates in either of two
selectable modes: OS comparator mode or OS interrupt mode. Its active state can be
selected as either HIGH or LOW. The fault queue that defines the number of consecutive
faults in order to activate the OS output is programmable as well as the set-point limits.
The PCT2075 can be configured for different operation conditions. It can be set in normal
mode to periodically monitor the ambient temperature, or in shut-down mode to minimize
power consumption.
The temperature register always stores an 11-bit two’s complement data, giving a
temperature resolution of 0.125 C. This high temperature resolution is particularly useful
in applications of measuring precisely the thermal drift or runaway. When the device is
accessed the conversion in process is not interrupted (that is, the I2C-bus section is totally
independent of the Sigma-Delta converter section) and accessing the device continuously
without waiting at least one conversion time between communications will not prevent the
device from updating the Temp register with a new conversion result. The new conversion
result will be available immediately after the Temp register is updated. It is also possible to
read just one of the temperature register bytes without lock-up.
The PCT2075 powers up in the normal operation mode with the OS in comparator mode,
temperature threshold of 80 C and hysteresis of 75 C, so that it can be used as a
stand-alone thermostat with those pre-defined temperature set points. The default
set points can be modified during manufacture and ordered under custom part number.
There are three selectable logic address pins with three logic states so that 27 8-pin
devices or three 6-pin devices can be connected on the same bus without address
conflict.
PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
2. Features and benefits














Pin-for-pin replacement for LM75 series but allows up to 27 devices on the bus
Power supply range from 2.7 V to 5.5 V
Temperatures range from 55 C to +125 C
Frequency range 20 kHz to 1 MHz with SMBus time-out to prevent hanging up the bus
1 MHz Fast-mode Plus 30 mA SDA drive allows more devices on the same bus but is
backward compatible to Fast-mode and Standard-mode
11-bit ADC that offers a temperature resolution of 0.125 C
Temperature accuracy of:
 1 C (max.) from 25 C to +100 C
 2 C (max.) from 55 C to +125 C
Programmable temperature threshold and hysteresis set points during operation
Supply current of <1.0 A in shut-down mode for power conservation
Stand-alone operation as thermostat at power-up
ESD protection exceeds 2000 V HBM per JESD22-A114 and 1000 V CDM per
JESD22-C101
Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
Small 8-pin package types: SO8, TSSOP8 and 2 mm  3 mm HWSON8
Small 6-pin package type: TSOP6
3. Applications




PCT2075
Product data sheet
System thermal management
Personal computers
Electronics equipment
Industrial controllers
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PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
4. Ordering information
Table 1.
Ordering information
Type number
Topside
mark
Package
Name
Description
Version
PCT2075D
PCT2075
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
PCT2075DP
P2075
TSSOP8
plastic thin shrink small outline package; 8 leads;
body width 3 mm
SOT505-1
PCT2075DP/Q900
P2075
TSSOP8
plastic thin shrink small outline package; 8 leads;
body width 3 mm
SOT505-1
PCT2075TP
075
HWSON8
plastic thermal enhanced very very thin small outline package; SOT1069-2
no leads; 8 terminals, 2  3  0.8 mm
PCT2075GV
075
TSOP6
plastic thin small outline package; 6 leads
SOT1353-1
4.1 Ordering options
Table 2.
Ordering options
Type number
Orderable
part number
Package
Packing method
Minimum
order
quantity
Temperature
PCT2075D
PCT2075D,118
SO8
Reel 13” Q1/T1
*standard mark SMD
2500
Tamb = 55 C to +125 C
PCT2075DP
PCT2075DP,118
TSSOP8
Reel 13” Q1/T1
*standard mark SMD
2500
Tamb = 55 C to +125 C
PCT2075DP/Q900
PCT2075DP/Q900J
TSSOP8
Reel 13” Q1/T1
*standard mark SMD
2500
Tamb = 55 C to +125 C
PCT2075TP
PCT2075TP,147
HWSON8 Reel 7” Q2/T3
*standard mark
4000
Tamb = 55 C to +125 C
PCT2075GV
PCT2075GVH
TSOP6
3000
Tamb = 55 C to +125 C
PCT2075
Product data sheet
Reel 7” Q3/T4
*standard mark
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PCT2075
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I2C-bus Fm+ digital temperature sensor and thermal watchdog
5. Block diagram
VCC
PCT2075
BIAS
REFERENCE
BAND GAP
TEMP SENSOR
POINTER
REGISTER
CONFIGURATION
REGISTER
COUNTER
TEMPERATURE
REGISTER
TIDLE/TIMER
TOS
REGISTER
COMPARATOR/
INTERRUPT
THYST
REGISTER
11-BIT
SIGMA-DELTA
A-to-D
CONVERTER
OSCILLATOR
POWER-ON
RESET
OS
LOGIC CONTROL AND INTERFACE
002aag634
A2
Fig 1.
A1
A0
SCL SDA
GND
Block diagram of PCT2075
6. Pinning information
6.1 Pinning
SDA
1
8
VCC
SCL
2
7
A0
OS
3
6
A1
A2
PCT2075D
GND
5
4
SDA
1
SCL
2
OS
3
GND
4
PCT2075DP
PCT2075DP/Q900
VCC
7
A0
6
A1
5
A2
002aag636
002aag635
Fig 2.
8
Pin configuration for SO8
Fig 3.
Pin configuration for TSSOP8
terminal 1
index area
SDA
1
8
VCC
SCL
2
7
A0
OS
3
6
A1
GND
4
5
A2
A0
PCT2075TP
GND
VCC
1
6
SDA
2 PCT2075GV 5
OS
3
SCL
4
002aag637
Transparent top view
Fig 4.
PCT2075
Product data sheet
Pin configuration for HWSON8
002aag638
Fig 5.
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Rev. 3 — 21 May 2013
Pin configuration for TSOP6
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PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
6.2 Pin description
Table 3.
Pin
Description
SDA
1
Digital I/O. I2C-bus serial bidirectional data line; open-drain.
SCL
2
Digital input. I2C-bus serial clock input.
OS
3
Overtemp Shutdown output; open-drain.
GND
4[1]
Ground. To be connected to the system ground.
A2
5
Digital input. User-defined address bit 2.
A1
6
Digital input. User-defined address bit 1.
A0
7
Digital input. User-defined address bit 0.
VCC
8
Power supply.
[1]
HWSON8 package die supply ground is connected to both the GND pin and the exposed center pad. The
GND pin must be connected to supply ground for proper device operation. For enhanced thermal,
electrical, and board-level performance, the exposed pad should be soldered to the board using a
corresponding thermal pad on the board, and for proper head conduction through the board thermal vias
need to be incorporated in the PCB in the thermal pad region.
Table 4.
Symbol
PCT2075
Product data sheet
Pin description for SO8, TSSOP8 and HWSON8
Symbol
Pin description for TSOP6
Pin
Description
A0
1
Digital input. User-defined address bit 0.
GND
2
Ground. To be connected to the system ground.
VCC
3
Power supply.
SCL
4
Digital input. I2C-bus serial clock input.
OS
5
Overtemp Shutdown output; open-drain.
SDA
6
Digital I/O. I2C-bus serial bidirectional data line; open-drain.
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PCT2075
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I2C-bus Fm+ digital temperature sensor and thermal watchdog
7. Functional description
7.1 General operation
The PCT2075 uses the on-chip band gap sensor to measure the device temperature with
the resolution of 0.125 C and stores the 11-bit two’s complement digital data, resulted
from 11-bit A-to-D conversion, into the device Temp register. This Temp register can be
read at any time by a controller on the I2C-bus. Reading temperature data does not affect
the conversion in progress during the read operation.
The PCT2075 can be set to operate in either mode: normal or shutdown. In normal
operation mode, the temp-to-digital conversion is executed every 100 ms or other
programmed value and the Temp register is updated at the end of each conversion.
During each ‘conversion period’ (Tconv) of about 100 ms, the device takes only about
28 ms, called ‘temperature conversion time’ (tconv(T)), to complete a temperature-to-data
conversion and then becomes idle for the time remaining in the period. This feature is
implemented to significantly reduce the device power dissipation.
In shutdown mode, the device becomes idle, data conversion is disabled and the Temp
register holds the latest result; however, the device I2C-bus interface is still active and
register write/read operation can be performed. The device operation mode is controllable
by programming bit B0 of the configuration register. The temperature conversion is
initiated when the device is powered-up or put back into normal mode from shutdown.
In addition, at the end of each conversion in normal mode, the temperature data (or Temp)
in the Temp register is automatically compared with the overtemperature shutdown
threshold data (or Tots) stored in the Tos register, and the hysteresis data (or Thys) stored
in the Thyst register, in order to set the state of the device OS output accordingly. The
device Tos and Thyst registers are write/read capable, and both operate with 9-bit
two’s complement digital data. To match with this 9-bit operation, the Temp register uses
only the 9 MSB bits of its 11-bit data for the comparison. Tots must always be higher than
Thys.
The way that the OS output responds to the comparison operation depends upon the OS
operation mode selected by configuration bit B1, and the user-defined fault queue defined
by configuration bits B3 and B4.
In OS comparator mode, the OS output behaves like a thermostat. It becomes active
when the Temp exceeds the Tots, and is reset when the Temp drops below the Thys.
Reading the device registers or putting the device into shutdown does not change the
state of the OS output. The OS output in this case can be used to control cooling fans or
thermal switches.
In OS interrupt mode, the OS output is used for thermal interruption. When the device is
powered-up, the OS output is first activated only when the Temp exceeds the Tots, then it
remains active indefinitely until being reset by a read of any register. Once the OS output
has been activated by crossing Tots and then reset, it can be activated again only when
the Temp drops below the Thys; then again, it remains active indefinitely until being reset
by a read of any register. The OS interrupt operation would be continued in this sequence:
Tots trip, Reset, Thys trip, Reset, Tots trip, Reset, Thys trip, Reset, etc. Putting the device
into the shutdown mode by setting the bit 0 of the configuration register also resets the OS
output.
PCT2075
Product data sheet
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PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
In both cases, comparator mode and interrupt mode, the OS output is activated only if a
number of consecutive faults, defined by the device fault queue, has been met. The fault
queue is programmable and stored in the two bits, B3 and B4, of the Configuration
register. Also, the OS output active state is selectable as HIGH or LOW by setting
accordingly the configuration register bit B2.
At power-up, the PCT2075 is put into normal operation mode in OS comparator mode, the
Tots is set to 80 C, the Thys is set to 75 C, the OS active state is selected LOW and the
fault queue is equal to 1. The temp reading data is 0 C and not updated until the first
conversion is completed in about 28 ms. The default Tots and Thys is set at the factory and
can be modified on custom part number.
The OS response to the temperature is illustrated in Figure 6.
Tots
Thys
reading temperature limits
OS reset
OS active
OS output in comparator mode
OS reset
(1)
(1)
(1)
OS active
OS output in interrupt mode
002aah455
(1) OS is reset by either reading register or putting the device in shutdown mode. It is assumed that
the fault queue is met at each Tots and Thys crossing point.
Fig 6.
OS response to temperature
7.2 I2C-bus serial interface
The device can be connected to a compatible 2-wire serial interface Fast-mode Plus
I2C-bus as a slave device under the control of a controller or master device, using two
device terminals, SCL and SDA. The controller must provide the SCL clock signal and
write/read data to/from the device through the SDA terminal. Notice that if the I2C-bus
common pull-up resistors have not been installed as required for I2C-bus, then an external
pull-up resistor, about 1.5 k, is needed for each of these two terminals. The bus
communication protocols are described in Section 7.10.
PCT2075
Product data sheet
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PCT2075
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I2C-bus Fm+ digital temperature sensor and thermal watchdog
7.2.1 Bus fault time-out
If the SDA line is held LOW for longer than tto (25 ms minimum; guaranteed at 35 ms
maximum), the device will reset to the idle state (SDA released) and wait for a new START
condition. This ensures that the device will never hang up the bus should there be
conflicts in the transmission sequence. The bus fault time-out can be disabled during
manufacture and shipped under custom part number.
7.3 Slave address
To communicate with the device, the master must first address slave devices via a slave
address byte. The slave address byte consists of seven address bits, and a direction bit
indicating the intent of executing a read or write operation. The device features three
address pins to allow up to 27 devices to be addressed on a single bus interface. Table 5
describes the pin logic levels used to properly connect up to 27 8-pin devices. Table 6
describes the pin logic levels used to properly connect up to three 6-pin devices.
‘1’ indicates the pin is connected to the supply (VCC); ‘0’ indicates the pin is connected to
GND; ‘Float’ indicates the pin is left unconnected. The states of pins A0/A1/A2 are
sampled only at power-up. After sampling the address is latched to minimize power
dissipation associated with detection.
Table 5.
PCT2075 address table (SO8, TSSOP8, HWSON8 packages)
No.
PCT2075
Product data sheet
Address pin coding
Slave address
A2
A1
A0
1
0
0
0
1001 000
2
0
0
1
1001 001
3
0
1
0
1001 010
4
0
1
1
1001 011
5
1
0
0
1001 100
6
1
0
1
1001 101
7
1
1
0
1001 110
8
1
1
1
1001 111
9
floating
0
0
1110 000
10
floating
0
floating
1110 001
11
floating
0
1
1110 010
12
floating
1
0
1110 011
13
floating
1
floating
1110 100
14
floating
1
1
1110 101
15
floating
floating
0
1110 110
16
floating
floating
1
1110 111
17
0
floating
0
0101 000
18
0
floating
1
0101 001
19
1
floating
0
0101 010
20
1
floating
1
0101 011
21
0
0
floating
0101 100
22
0
1
floating
0101 101
23
1
0
floating
0101 110
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PCT2075
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I2C-bus Fm+ digital temperature sensor and thermal watchdog
Table 5.
PCT2075 address table (SO8, TSSOP8, HWSON8 packages) …continued
No.
Address pin coding
Slave address
A2
A1
A0
24
1
1
floating
0101 111
25
0
floating
floating
0110 101
26
1
floating
floating
0110 110
27
floating
floating
floating
0110 111
Table 6.
PCT2075 address table (TSOP6 package)
No.
Address pin coding
Slave address
A0
1
0
1001 000
2
float
1001 001
3
1
1001 010
7.4 Register list
The PCT2075 contains four data registers beside the pointer register as listed in Table 7.
The pointer value, read/write capability and default content at power-up of the registers
are also shown in Table 7.
PCT2075
Product data sheet
Table 7.
Register table
Register
name
Pointer
value
R/W
POR
state
Description
Conf
01h
R/W
00h
Configuration register: contains a single 8-bit data
byte; to set the device operating condition; default = 0.
Temp
00h
read only
0000h
Temperature register: contains two 8-bit data bytes;
to store the measured Temp data.
Tos
03h
R/W
5000h
Overtemperature shutdown threshold register:
contains two 8-bit data bytes; to store the
overtemperature shutdown Tots limit; default = 80 C.
Thyst
02h
R/W
4B00h
Hysteresis register: contains two 8-bit data bytes;
to store the hysteresis Thys limit; default = 75 C.
Tidle
04h
R/W
00h
Temperature conversion cycle default to 100 ms.
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PCT2075
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I2C-bus Fm+ digital temperature sensor and thermal watchdog
7.4.1 Pointer register
The Pointer register contains an 8-bit data byte, of which the three LSB bits represent the
pointer value of the other five registers, and the other five MSB bits are equal to 0, as
shown in Table 8 and Table 9. The Pointer register is not accessible to the user, but is
used to select the data register for write/read operation by including the pointer data byte
in the bus command.
Table 8.
Pointer register
B7
B6
B5
B4
B3
B[2:0]
0
0
0
0
0
pointer value
Table 9.
Pointer value
B2
B1
B0
Selected register
0
0
0
Temperature register (Temp)
0
0
1
Configuration register (Conf)
0
1
0
Hysteresis register (Thyst)
0
1
1
Overtemperature shutdown register (Tos)
1
0
1
Idle register (Tidle)
Because the Pointer value is latched into the Pointer register when the bus command
(which includes the pointer byte) is executed, a read from the device may or may not
include the pointer byte in the statement. To read again a register that has been recently
read and the pointer has been preset, the pointer byte does not have to be included. To
read a register that is different from the one that has been recently read, the pointer byte
must be included. However, a write to the device must always include the pointer byte in
the statement. The bus communication protocols are described in Section 7.10.
At power-up, the Pointer value is equal to 000b and the Temp register is selected; users
can then read the Temp data without specifying the pointer byte.
Anything not shown in Table 9 is reserved and should not be used.
PCT2075
Product data sheet
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PCT2075
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I2C-bus Fm+ digital temperature sensor and thermal watchdog
7.4.2 Configuration register
The Configuration register (Conf) is a write/read register and contains an 8-bit
non-complement data byte that is used to configure the device for different operation
conditions. Table 10 shows the bit assignments of this register.
Table 10. Conf register
Legend: * = default value.
Bit
Symbol
Access
Value
Description
B[7:5]
reserved
R/W
000*
reserved for manufacturer’s use; should be kept as
zeroes for normal operation
B[4:3]
OS_F_QUE[1:0] R/W
B2
OS_POL
B1
OS fault queue programming
00*
queue value = 1
01
queue value = 2
10
queue value = 4
11
queue value = 6
R/W
OS polarity selection
0*
OS active LOW
1
OS active HIGH
OS_COMP_INT R/W
B0
SHUTDOWN
OS operation mode selection
0*
OS comparator
1
OS interrupt
R/W
device operation mode selection
0*
normal
1
shutdown
7.4.3 Temperature register
The Temperature register (Temp) holds the digital result of temperature measurement or
monitor at the end of each analog-to-digital conversion. This register is read-only and
contains two 8-bit data bytes consisting of one Most Significant Byte (MSByte) and one
Least Significant Byte (LSByte). However, only 11 bits of those two bytes are used to store
the Temp data in two’s complement format with the resolution of 0.125 C. Table 11 shows
the bit arrangement of the Temp data in the data bytes.
Table 11.
Temp register
MSByte
LSByte
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
X
X
X
X
X
When reading register Temp, all 16 bits of the two data bytes (MSByte and LSByte) are
provided to the bus and should be all collected by the controller for a valid temperature
reading. However, only the 11 most significant bits should be used, and the five least
significant bits of the LSByte are zero and should be ignored. One of the ways to calculate
the Temp value in C from the 11-bit Temp data is:
1. If the Temp data MSByte bit D10 = 0, then the temperature is positive and Temp value
(C) = +(Temp data)  0.125 C.
2. If the Temp data MSByte bit D10 = 1, then the temperature is negative and
Temp value (C) = (two’s complement of Temp data)  0.125 C.
PCT2075
Product data sheet
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PCT2075
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I2C-bus Fm+ digital temperature sensor and thermal watchdog
Examples of the Temp data and value are shown in Table 12.
Table 12.
Temp register value
11-bit binary
(two’s complement)
Hexadecimal value
Decimal value
Value
011 1111 1000
3F8
1016
+127.000 C
011 1111 0111
3F7
1015
+126.875 C
011 1111 0001
3F1
1009
+126.125 C
011 1110 1000
3E8
1000
+125.000 C
000 1100 1000
0C8
200
+25.000 C
000 0000 0001
001
1
+0.125 C
000 0000 0000
000
0
0.000 C
111 1111 1111
7FF
1
0.125 C
111 0011 1000
738
200
25.000 C
110 0100 1001
649
439
54.875 C
110 0100 1000
648
440
55.000 C
For 9-bit Temp data application in replacing the industry standard LM75, just use only
9 MSB bits of the two bytes and disregard 7 LSB of the LSByte. The 9-bit Temp data with
0.5 C resolution of the device is defined exactly in the same way as for the standard
LM75 and it is here similar to the Tos and Thyst registers.
A single byte read (MSByte) of the Temp register is allowed. Then the temperature
resolution will be 1.00 C instead.
7.4.4 Overtemperature shutdown threshold (Tos) and hysteresis (Thyst) registers
These two registers, are write/read registers, and also called set-point registers. They are
used to store the user-defined temperature limits, called overtemperature shutdown
threshold (Tots) and hysteresis temperature (Thys), for the device watchdog operation. At
the end of each conversion the Temp data will be compared with the data stored in these
two registers in order to set the state of the device OS output; see Section 7.1.
Each of the set-point registers contains two 8-bit data bytes consisting of one MSByte and
one LSByte in the same format as the Temperature register. However, only 9 bits of the
two bytes are used to store the set-point data in two’s complement format with the
resolution of 0.5 C. Table 13 and Table 14 show the bit arrangement of the Tos data and
Thyst data in the data bytes.
Notice that because only 9-bit data are used in the set-point registers, the device uses
only the 9 MSB of the Temp data for data comparison.
Table 13.
Tos register
MSByte
PCT2075
Product data sheet
LSByte
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
D8
D7
D6
D5
D4
D3
D2
D1
D0
X
X
X
X
X
X
X
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PCT2075
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I2C-bus Fm+ digital temperature sensor and thermal watchdog
Table 14.
Thyst register
MSByte
LSByte
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
D8
D7
D6
D5
D4
D3
D2
D1
D0
X
X
X
X
X
X
X
When a set-point register is read, all 16 bits are provided to the bus and must be collected
by the controller for a valid temperature. However, only the 9 most significant bits should
be used and the 7 LSB of the LSByte are equal to zero and should be ignored.
A single byte read of either Tos or Thyst is allowed.
Table 15 shows examples of the limit data and value.
Table 15.
Tos and Thyst limit data and value
11-bit binary
(two’s complement)
Hexadecimal value
Decimal value
Value
0 1111 1010
0FA
250
+125.0 C
0 0011 0010
032
50
+25.0 C
0 0000 0001
001
1
+0.5 C
0 0000 0000
000
0
0.0 C
1 1111 1111
1FF
1
0.5 C
1 1100 1110
1CE
50
25.0 C
1 1001 0010
192
110
55.0 C
7.4.5 Tidle register
For the device temperature sensor, the temperature is measured periodically to save
power. When the temperature is being measured, the device burns approximately 70 A
active current. Since the ambient temperature changes slowly, it is unnecessary to let the
temperature measurement continuously active. Instead, the device temperature sensor is
set to idle for a user-specified time to save power after temperature measurement is done.
The Tidle register allows users to specify the sampling period to measure the
temperature. The register is composed of 5-bit values TIDLE[4:0] at pointer address 04h.
The values of TIDLE[7:5] are ‘don’t care’ and have no effect on the temperature
measurement period. The temperature measurement period can be calculated by
TIDLE[4:0]  100 ms. For example, if TIDLE[4:0] = 00001, the temperature sampling is
‘00001’  100 ms = 100 ms. the temperature sensor allows a sampling period from
100 ms to 3.1 s by programming Tidle. If Tidle is set to ‘00000’, it will be treated the same
as Tidle = ‘00001’ and the temperature sensor will measure temperature at 100 ms
period.
Table 16. Tidle - Temperature idle register (address 04h) bit allocation
Temperature idle register contains the value of time in between temperature measurements.
TIDLE[4:0] is the 5-bit Tidle value. Tidle  100 ms is the temperature sampling period.
Bit
7
6
5
4
3
2
1
0
Symbol
-
-
-
TIDLE[4]
TIDLE[3]
TIDLE[2]
TIDLE[1]
TIDLE[0]
Reset
-
-
-
0
0
0
0
1
Access
-
-
-
R/W
R/W
R/W
R/W
R/W
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PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
The device temperature sensor powers up to measure temperature every 100 ms, with
Tidle = 00001 by default. For the PCT2075 with 11-bit accuracy, the ADC conversion is
about 28 ms. As a result, the PCT2075 will be idle for (100 ms  28 ms) = 72 ms between
two temperature measurements.
7.5 OS output and polarity
The OS output is an open-drain output and its state represents results of the device
watchdog operation as described in Section 7.1. In order to observe this output state, an
external pull-up resistor is needed. The resistor should be as large as possible, up to
1.5 k, to minimize the Temp reading error due to internal heating by the high OS sinking
current.
The OS output active state can be selected as HIGH or LOW by programming bit B2
(OS_POL) of register Conf: setting bit OS_POL to logic 1 selects OS active HIGH and
setting bit B2 to logic 0 sets OS active LOW. At power-up, bit OS_POL is equal to logic 0
and the OS active state is LOW.
7.6 OS comparator and interrupt modes
As described in Section 7.1, the device OS output responds to the result of the
comparison between register Temp data and the programmed limits, in registers Tos and
Thyst, in different ways depending on the selected OS mode: OS comparator or
OS interrupt. The OS mode is selected by programming bit B1 (OS_COMP_INT) of
register Conf: setting bit OS_COMP_INT to logic 1 selects the OS interrupt mode, and
setting to logic 0 selects the OS comparator mode. At power-up, bit OS_COMP_INT is
equal to logic 0 and the OS comparator is selected.
The main difference between the two modes is that in OS comparator mode, the OS
output becomes active when Temp has exceeded Tots and reset when Temp has dropped
below Thys, reading a register or putting the device into shutdown mode does not change
the state of the OS output; while in OS interrupt mode, once it has been activated either
by exceeding Tots or dropping below Thys, the OS output will remain active indefinitely until
reading a register, then the OS output is reset.
Temperature limits Tots and Thys must be selected so that Tots > Thys. Otherwise, the OS
output state will be undefined.
PCT2075
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PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
7.7 OS fault queue
Fault queue is defined as the number of faults that must occur consecutively to activate
the OS output. It is provided to avoid false tripping due to noise. Because faults are
determined at the end of data conversions, fault queue is also defined as the number of
consecutive conversions returning a temperature trip. The value of fault queue is
selectable by programming the two bits B4 and B3 (OS_F_QUE[1:0]) in register Conf.
Notice that the programmed data and the fault queue value are not the same. Table 17
shows the one-to-one relationship between them. At power-up, fault queue data = 0 and
fault queue value = 1.
Table 17.
Fault queue table
Fault queue data
Fault queue value
OS_F_QUE[1]
OS_F_QUE[0]
Decimal
0
0
1
0
1
2
1
0
4
1
1
6
7.8 Shutdown mode
The device operation mode is selected by programming bit B0 (SHUTDOWN) of register
Conf. Setting bit SHUTDOWN to logic 1 will put the device into shutdown mode. Resetting
bit SHUTDOWN to logic 0 will return the device to normal mode.
In shutdown mode, the PCT2075 draws a small current of <1.0 A and the power
dissipation is minimized; the temperature conversion stops, but the I2C-bus interface
remains active and register write/read operation can be performed. When the shutdown is
set, the OS output will be unchanged in comparator mode and reset in interrupt mode.
7.9 Power-up default and power-on reset
The PCT2075 always powers-up in its default state with:
•
•
•
•
•
•
•
Normal operation mode
OS comparator mode
Tots = 80 C (or as specified for the custom part number)
Thys = 75 C (or as specified for the custom part number)
OS output active state is LOW
Pointer value is logic 000 (Temp)
SMBus time-out enabled (or as specified for the custom part number)
When the power supply voltage is dropped below the device power-on reset level of
approximately 1.0 V (POR) for over 2 s and then rises up again, the PCT2075 will be
reset to its default condition as listed above.
In some applications a higher or lower default Tots and Thys values or no SMBus time-out
may be required. Please contact NXP for information on custom part number.
PCT2075
Product data sheet
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PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
7.10 Protocols for writing and reading the registers
The communication between the host and the device must strictly follow the rules as
defined by the I2C-bus management. The protocols for device register read/write
operations are illustrated in Figure 7 to Figure 12 together with the following definitions:
1. Before a communication, the I2C-bus must be free or not busy. It means that the SCL
and SDA lines must both be released by all devices on the bus, and they become
HIGH by the bus pull-up resistors.
2. The host must provide SCL clock pulses necessary for the communication. Data is
transferred in a sequence of 9 SCL clock pulses for every 8-bit data byte followed by
1-bit status of the acknowledgement.
3. During data transfer, except the START and STOP signals, the SDA signal must be
stable while the SCL signal is HIGH. It means that the SDA signal can be changed
only during the LOW duration of the SCL line.
4. S: START signal, initiated by the host to start a communication, the SDA goes from
HIGH to LOW while the SCL is HIGH.
5. RS: RE-START signal, same as the START signal, to start a read command that
follows a write command.
6. P: STOP signal, generated by the host to stop a communication, the SDA goes from
LOW to HIGH while the SCL is HIGH. The bus becomes free thereafter.
7. W: write bit, when the write/read bit = LOW in a write command.
8. R: read bit, when the write/read bit = HIGH in a read command.
9. A: device acknowledge bit, returned by the device. It is LOW if the device works
properly and HIGH if not. The host must release the SDA line during this period in
order to give the device the control on the SDA line.
10. A’: master acknowledge bit, not returned by the device, but set by the master or host
in reading 2-byte data. During this clock period, the host must set the SDA line to
LOW in order to notify the device that the first byte has been read for the device to
provide the second byte onto the bus.
11. NA: Not Acknowledge bit. During this clock period, both the device and host release
the SDA line at the end of a data transfer, the host is then enabled to generate the
STOP signal.
12. In a write protocol, data is sent from the host to the device and the host controls the
SDA line, except during the clock period when the device sends the device
acknowledgement signal to the bus.
13. In a read protocol, data is sent to the bus by the device and the host must release the
SDA line during the time that the device is providing data onto the bus and controlling
the SDA line, except during the clock period when the master sends the master
acknowledgement signal to the bus.
14. For best temperature accuracy both temperature bytes should be read as shown in
Figure 11 and Figure 12, but for a quick less accurate check/reduce bus transmission
then only one byte, the MSByte, needs to be read as shown in Figure 9.
PCT2075
Product data sheet
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16 of 37
PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
1
2
3
4
1
0
0
1
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
0
0
0
0
0
0
0
1
A
0
0
0
4
5
6
7
8
9
SCL
SDA
S
A2 A1 A0 W
A
device address
START
pointer byte
write
P
configuration data byte
device
acknowledge
device
acknowledge
Fig 7.
D4 D3 D2 D1 D0 A
device
acknowledge
STOP
001aad624
Write configuration register (1-byte data)
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
(next)
SCL
SDA
S
1
0
0
1
A2
A1
A0 W
0
A
0
0
device address
0
0
0
0
1
A
RS (next)
pointer byte
START
device
acknowledge
1
2
3
4
5
6
7
1
0
0
1
A2
A1
RE-START
device
acknowledge
write
8
9
A0 R
A
1
2
3
4
5
6
7
8
9
SCL (cont.)
SDA (cont.)
D7 D6 D5 D4 D3 D2 D1 D0 NA
device address
data byte from device
STOP
master not
acknowledged
read
device
acknowledge
Fig 8.
P
001aad625
Read configuration register including pointer byte (1-byte data)
1
2
3
4
5
6
7
1
0
0
1
A2
A1
8
9
A0 R
A
1
2
3
4
5
6
7
8
9
SCL
SDA
S
device address
START
D7 D6 D5 D4 D3 D2 D1 D0 NA
data byte from device
read
device
acknowledge
Fig 9.
P
master not
acknowledged
STOP
001aad626
Read configuration or temp register with preset pointer (1-byte data)
PCT2075
Product data sheet
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PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
SCL
(next)
SDA
S
1
0
0
1
A2
A1
A0
W
A
0
0
0
device address
0
0
device
acknowledge
3
4
P0
(next)
A
device
acknowledge
write
2
P1
pointer byte
START
1
0
5
6
7
8
9
1
2
3
4
5
6
7
8
9
SCL (cont.)
SDA (cont.)
D7 D6 D5 D4 D3 D2 D1 D0 A
D7 D6 D5 D4 D3 D2 D1 D0
MSByte data
A
P
LSByte data
STOP
device
acknowledge
device
acknowledge
002aad036
Fig 10. Write Tos or Thyst register (2-byte data)
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
0
SCL
SDA
(next)
S
1
0
0
1
A2 A1 A0 W A
0
0
device address
START
0
0
0
0
P1 P0 A RS (next)
pointer byte
1
2
3
4
device
acknowledge
5 6 7 8
1
0
0
1
A2 A1 A0 R
RE-START
device
acknowledge
write
9
A
1
2
3
4
5
6
7
8
1
9
2
3
4
5
6
7
8
9
SCL (cont)
SDA (cont)
D7 D6 D5 D4 D3 D2 D1 D0 A'
device address
D7 D6 D5 D4 D3 D2 D1 D0 NA
MSByte from device
LSByte from device
master
acknowledge
read
device
acknowledge
P
STOP
master not
acknowledged
002aad037
Fig 11. Read Temp, Tos or Thyst register including pointer byte (2-byte data)
1
2
3
4
1
0
0
1
5
6
7
8
9
A2 A1 A0 R
A
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
SCL
SDA
S
device address
START
D7 D6 D5 D4 D3 D2 D1 D0 A' D7 D6 D5 D4 D3 D2 D1 D0 NA
MSByte from device
read
device
acknowledge
master
acknowledge
P
LSByte from device
master not
acknowledged
STOP
002aad038
Fig 12. Read Temp, Tos or Thyst register with preset pointer (2-byte data)
PCT2075
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PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
8. Application design-in information
8.1 Typical application
power supply
0.1 μF
BUS
1.5 kΩ
PULL-UP
RESISTORS
1.5 kΩ
SCL
I2C-BUS
SDA
A2
A1
DIGITAL LOGIC
1.5 kΩ
VCC
A0
8
2
1
PCT2075
3
OS
DETECTOR OR
INTERRUPT LINE
5
6
7
4
GND
002aag640
Fig 13. PCT2075 typical application
8.2 Temperature accuracy
Because the local channel of the temperature sensor measures its own die temperature
that is transferred from its body, the temperature of the device body must be stabilized and
saturated for it to provide the stable readings. Because the device operates at a
low-power level, the thermal gradient of the device package has a minor effect on the
measurement. The accuracy of the measurement is more dependent upon the definition
of the environment temperature, which is affected by different factors: the printed-circuit
board on which the device is mounted; the air flow contacting the device body (if the
ambient air temperature and the printed-circuit board temperature are much different,
then the measurement may not be stable because of the different thermal paths between
the die and the environment). The stabilized temperature liquid of a thermal bath will
provide the best temperature environment when the device is completely dipped into it. A
thermal probe with the device mounted inside a sealed-end metal tube located in
consistent temperature air also provides a good method of temperature measurement.
8.3 Noise effect
The device design includes the implementation of basic features for a good noise
immunity:
• The 50 ns low-pass filter on both the bus pins SCL and SDA;
• The hysteresis of the threshold voltages to the bus input signals SCL and SDA, about
500 mV minimum;
• All pins have ESD protection circuitry to prevent damage during electrical surges. The
ESD protection on the address, OS, SCL and SDA pins it to ground. The latch-back
based device breakdown voltage of address/OS is typically 11 V and SCL/SDA is
typically 9.5 V at any supply voltage but will vary over process and temperature. Since
PCT2075
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19 of 37
PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
there are no protection diodes from SCL or SDA to VCC, the device will not hold the
I2C lines LOW when VCC is not supplied and therefore allow continued I2C-bus
operation if the device is de-powered.
However, good layout practices and extra noise filters are recommended when the device
is used in a very noisy environment:
•
•
•
•
Use decoupling capacitors at VCC pin.
Keep the digital traces away from switching power supplies.
Apply proper terminations for the long board traces.
Add capacitors to the SCL and SDA lines to increase the low-pass filter
characteristics.
9. Limiting values
Table 18. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VCC
supply voltage
VI
input voltage
II
Conditions
Min
Max
Unit
0.3
+6.0
V
at input pins
0.3
+6.0
V
input current
at input pins
5.0
+5.0
mA
IO(sink)
output sink current
on pin OS
-
60
mA
VO
output voltage
on pin OS
0.3
+6.0
V
Tstg
storage temperature
65
+150
C
Tj
junction temperature
-
150
C
10. Recommended operating conditions
PCT2075
Product data sheet
Table 19.
Recommended operating characteristics
Symbol
Parameter
Min
Typ
Max
Unit
VCC
supply voltage
2.7
-
5.5
V
Tamb
ambient temperature
55
-
+125
C
Conditions
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PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
11. Static characteristics
Table 20. Static characteristics
VCC = 2.7 V to 5.5 V; Tamb = 55 C to +125 C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
Tacc
temperature accuracy
Tamb = 25 C to +100 C
1
-
+1
C
Tamb = 55 C to +125 C
2
-
+2
C
Tres
temperature resolution
11-bit digital temp data
-
0.125
-
C
tconv(T)
temperature conversion
time
normal mode
-
28
-
ms
Tconv
conversion period
normal mode
-
0.1
3.2
s
VPOR
power-on reset voltage
-
-
2.6
V
ICC(AV)
average supply current
I2C-bus
inactive
-
125
300
A
I2C-bus
active;
-
-
400
A
Tamb = 25 C
-
<0.1
-
A
Tamb = 85 C
-
<1
-
A
Tamb = 125 C
-
-
20
A
normal mode:
normal mode:
fSCL = 1000 kHz
shutdown mode
VIH
HIGH-level input voltage
digital pins (SCL, SDA, A2 to A0)
0.7  VCC -
VCC + 0.3 V
VIL
LOW-level input voltage
digital pins
0.3
-
0.3  VCC V
VI(hys)
hysteresis of input voltage SCL and SDA pins
-
300
-
mV
-
150
-
mV
IIH
HIGH-level input current
Tamb = 25 C
-
<0.1
-
A
Tamb = 85 C
(PCT2075D, DP and TP only)
-
<1
-
A
Tamb = 85 C (PCT2075GV only)
-
<2
-
A
Tamb = 125 C
(PCT2075D, DP and TP only)
-
-
10
A
Tamb = 125 C (PCT2075GV only)
A2, A1, A0 pins
digital pins; VI = VCC
-
-
20
A
IIL
LOW-level input current
digital pins; VI = 0 V
1.0
-
+1.0
A
VOL
LOW-level output voltage
OS pin; IOL = 20 mA
-
-
0.4
V
SDA pin; IOL = 20 mA
-
-
0.4
V
A
ILO
output leakage current
SDA and OS pins; VOH = VCC
-
-
20
Nfault
number of faults
programmable; conversions in
overtemperature-shutdown fault
queue
1
-
6
Tots
overtemperature
shutdown temperature
default value
-
80
-
C
Thys
hysteresis temperature
default value
-
75
-
C
Ci
input capacitance
digital pins
-
20
-
pF
[1]
Typical values are at VCC = 3.3 V and Tamb = 25 C.
PCT2075
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PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
002aah437
250
002aah438
400
IDD
(μA)
IDD
(μA)
200
300
150
200
100
50
VDD = 5.5 V
4.5 V
3.3 V
2.7 V
0
−75
−25
25
75
125
Tamb (°C)
Fig 14. Average supply current versus temperature;
I2C-bus inactive
002aah439
10
100 VDD = 5.5 V
4.5 V
3.3 V
2.7 V
0
−25
−75
25
75
Fig 15. Average supply current versus temperature;
I2C-bus active
002aah440
0.40
IDD
(μA)
125
Tamb (°C)
VOL
(V)
8
0.30
VDD = 5.5 V
4.5 V
3.3 V
2.7 V
6
VDD = 5.5 V
4.5 V
3.3 V
2.7 V
0.20
4
0.10
2
0
−75
−25
25
75
0
−75
125
Tamb (°C)
Fig 16. Shutdown mode supply current
versus temperature
25
75
125
Tamb (°C)
Fig 17. LOW-level output voltage on OS pin
versus temperature; IOL = 4 mA
002aah441
80
−25
002aah442
1.0
IIL
(μA)
IOL
(mA)
0.6
60
VDD = 5.5 V
4.5 V
3.3 V
2.7 V
0.2
40
VDD = 5.5 V
4.5 V
3.3 V
2.7 V
−0.2
20
0
−75
−0.6
−25
25
75
125
Tamb (°C)
Fig 18. LOW-level output current on OS pin
versus temperature; VOL = 0.4 V
PCT2075
Product data sheet
−1.0
−75
−25
25
75
125
Tamb (°C)
Fig 19. LOW-level input current versus temperature;
digital pins
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PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
002aah443
10
IIH
(μA)
8
002aah453
0.40
VDD = 5.5 V
4.5 V
3.3 V
2.7 V
VOL
(V)
0.30
VDD = 5.5 V
4.5 V
3.3 V
2.7 V
6
0.20
4
0.10
2
0
−75
−25
25
75
0
−75
125
Tamb (°C)
Fig 20. HIGH-level input current versus temperature;
digital pins
25
75
002aah444
2.0
IOL
(mA)
125
Tamb (°C)
Fig 21. LOW-level output voltage on SDA pin
versus temperature; IOL = 20 mA
002aah454
80
−25
Tacc
(°C)
60
40
1.0
VDD = 5.5 V
4.5 V
3.3 V
2.7 V
0
20
0
−75
−1.0
−25
25
75
125
Tamb (°C)
002aah451
2.0
1.0
1.0
−25
25
75
125
Tamb (°C)
Fig 24. Power-on reset threshold voltage
versus temperature; rising VCC
Product data sheet
75
125
Tamb (°C)
002aah452
VPOR
(V)
2.0
PCT2075
25
3.0
Vth(POR)
(V)
0
−75
−25
Fig 23. Temperature accuracy versus temperature;
VCC = 2.8 V to 5.5 V
Fig 22. LOW-level output current on SDA pin
versus temperature; VOL = 0.4 V
3.0
−2.0
−75
0
−75
−25
25
75
125
Tamb (°C)
Fig 25. Power-on reset voltage versus temperature;
falling VCC
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PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
12. Dynamic characteristics
Table 21. I2C-bus interface dynamic characteristics[1]
VCC = 2.7 V to 5.5 V; Tamb = 55 C to +125 C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fSCL
SCL clock frequency
see Figure 26
20
-
1000
kHz
tHIGH
HIGH period of the SCL clock
0.26
-
-
s
tLOW
LOW period of the SCL clock
0.5
-
-
s
tHD;STA
hold time (repeated) START condition
0.26
-
-
s
tSU;DAT
data set-up time
50
-
-
ns
tHD;DAT
data hold time
0
-
-
ns
tSU;STO
set-up time for STOP condition
0.26
-
-
s
tf
fall time
-
120
-
ns
tto(SMBus)
SMBus time-out time
25
-
35
ms
SDA and OS outputs;
CL = 450 pF; IOL = 30 mA
[2][3]
[1]
These specifications are guaranteed by design and not tested in production.
[2]
This is the SDA time LOW for reset of serial interface.
[3]
Holding the SDA line LOW for a time greater than tto will cause the device to reset SDA to the idle state of the serial bus communication
(SDA set HIGH).
0.7 × VCC
0.3 × VCC
SDA
tLOW
tf
tSU;DAT
tr
tHD;STA
tSP
tf
tBUF
tr
0.7 × VCC
0.3 × VCC
SCL
tHD;STA
S
tHIGH
tHD;DAT
tSU;STA
tSU;STO
Sr
P
S
002aah456
Fig 26. Timing diagram
PCT2075
Product data sheet
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PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
13. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
HE
v M A
Z
5
8
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
inches
0.069
0.010 0.057
0.004 0.049
0.01
0.019 0.0100
0.014 0.0075
0.20
0.19
0.16
0.15
0.05
0.01
0.01
0.004
0.028
0.012
0.244
0.039 0.028
0.041
0.228
0.016 0.024
θ
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT96-1
076E03
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 27. Package outline SOT96-1 (SO8)
PCT2075
Product data sheet
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PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
D
E
SOT505-1
A
X
c
y
HE
v M A
Z
5
8
A2
pin 1 index
(A3)
A1
A
θ
Lp
L
1
4
detail X
e
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(2)
e
HE
L
Lp
v
w
y
Z(1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.45
0.25
0.28
0.15
3.1
2.9
3.1
2.9
0.65
5.1
4.7
0.94
0.7
0.4
0.1
0.1
0.1
0.70
0.35
6°
0°
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-04-09
03-02-18
SOT505-1
Fig 28. Package outline SOT505-1 (TSSOP8)
PCT2075
Product data sheet
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Rev. 3 — 21 May 2013
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26 of 37
PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
HWSON8: plastic thermal enhanced very very thin small outline package; no leads;
8 terminals; body 2 x 3 x 0.75 mm
SOT1069-2
X
B
D
A
A2
A
E
A1
A3
terminal 1
index area
detail X
e1
terminal 1
index area
e
1
4
C
C A B
C
v
w
b
y
y1 C
L
K
E2
8
5
D2
0
1
scale
Dimensions
Unit
mm
2 mm
A(1)
A1
A2
max 0.80 0.05 0.65
nom 0.75 0.02 0.55
min 0.70 0.00 0.45
A3
b
D(1)
D2
E(1)
E2
0.2
0.30
0.25
0.18
2.1
2.0
1.9
1.6
1.5
1.4
3.1
3.0
2.9
1.6
1.5
1.4
e
0.5
e1
1.5
K
L
0.40 0.45
0.35 0.40
0.30 0.35
v
0.1
w
y
y1
0.05 0.05 0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
References
Outline
version
IEC
JEDEC
JEITA
SOT1069-2
---
MO-229
---
sot1069-2_po
European
projection
Issue date
09-11-18
12-04-18
Fig 29. Package outline SOT1069-2 (HWSON8)
PCT2075
Product data sheet
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Rev. 3 — 21 May 2013
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27 of 37
PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
76233ODVWLFWKLQVPDOORXWOLQHSDFNDJHOHDGV
627
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'
;
$
(
\
+(
Y
$
4
$
$
$
SLQLQGH[
F
/S
$
/
GHWDLO;
H
ES
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PP
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'LPHQVLRQVPPDUHWKHRULJLQDOGLPHQVLRQV
8QLW
PP
PD[
QRP
PLQ
$
$
$
$
ES
F
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(
H
+(
/
/S
4
Y
Z
\
VRWBSR
5HIHUHQFHV
2XWOLQH
YHUVLRQ
,(&
-('(&
-(,7$
627
6&
(XURSHDQ
SURMHFWLRQ
,VVXHGDWH
Fig 30. Package outline SOT1353-1 (TSOP6)
PCT2075
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 21 May 2013
© NXP B.V. 2013. All rights reserved.
28 of 37
PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
PCT2075
Product data sheet
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PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
14.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 31) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 22 and 23
Table 22.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
 350
< 2.5
235
220
 2.5
220
220
Table 23.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 31.
PCT2075
Product data sheet
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30 of 37
PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 31. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Soldering: PCB footprints
5.50
0.60 (8×)
1.30
4.00
6.60
7.00
1.27 (6×)
solder lands
occupied area
placement accuracy ± 0.25
Dimensions in mm
sot096-1_fr
Fig 32. SOT96-1 (SO8); reflow soldering
PCT2075
Product data sheet
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Rev. 3 — 21 May 2013
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31 of 37
PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
1.20 (2×)
0.60 (6×)
enlarged solder land
0.3 (2×)
1.30
4.00
6.60
7.00
1.27 (6×)
5.50
board direction
solder lands
occupied area
solder resist
placement accurracy ± 0.25
Dimensions in mm
sot096-1_fw
Fig 33. SOT96-1 (SO8); wave soldering
3.600
2.950
0.125
0.725
0.125
5.750
3.200
3.600
5.500
1.150
0.600
0.450
0.650
solder lands
occupied area
Dimensions in mm
sot505-1_fr
Fig 34. SOT505-1 (TSSOP8); reflow soldering
PCT2075
Product data sheet
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32 of 37
PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
Footprint information for reflow soldering of HWSON8 package
SOT1069-2
Gx
D
P
C
nSPx
Hy
SPy
Gy
SLy
By
Ay
nSPy
SPx
SLx
solder land
solder paste deposit
solder land plus solder paste
occupied area
DIMENSIONS in mm
P
Ay
By
C
D
SLx
SLy
SPx
SPy
Gx
Gy
Hy
nSPx
nSPy
0.5
3.45
2.2
0.625
0.25
1.6
1.6
0.6
0.6
2.25
3.25
3.7
1
1
Issue date
12-02-09
12-02-22
sot1069-2_fr
Fig 35. SOT1069-2 (HWSON8); reflow soldering
PCT2075
Product data sheet
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Rev. 3 — 21 May 2013
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33 of 37
PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
16. Abbreviations
Table 24.
Abbreviations
Acronym
Description
A-to-D
Analog-to-Digital
CDM
Charged Device Model
ESD
ElectroStatic Discharge
HBM
Human Body Model
I2C-bus
Inter-Integrated Circuit bus
I/O
Input/Output
LSB
Least Significant Bit
LSByte
Least Significant Byte
MSB
Most Significant Bit
MSByte
Most Significant Byte
PCB
Printed-Circuit Board
POR
Power-On Reset
17. Revision history
Table 25.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PCT2075 v.3
20130521
Product data sheet
-
PCT2075 v.2
Modifications:
•
Table 20 “Static characteristics”: added HIGH-level input current (IIH) characteristics for
type number PCT2075GV (at Tamb = 85 C and Tamb = 125 C conditions)
PCT2075 v.2
20130506
Product data sheet
-
PCT2075 v.1
PCT2075 v.1
20130405
Product data sheet
-
-
PCT2075
Product data sheet
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PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PCT2075
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 21 May 2013
© NXP B.V. 2013. All rights reserved.
35 of 37
PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PCT2075
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 21 May 2013
© NXP B.V. 2013. All rights reserved.
36 of 37
PCT2075
NXP Semiconductors
I2C-bus Fm+ digital temperature sensor and thermal watchdog
20. Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
7.1
7.2
7.2.1
7.3
7.4
7.4.1
7.4.2
7.4.3
7.4.4
7.4.5
7.5
7.6
7.7
7.8
7.9
7.10
8
8.1
8.2
8.3
9
10
11
12
13
14
14.1
14.2
14.3
14.4
15
16
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 6
General operation . . . . . . . . . . . . . . . . . . . . . . . 6
I2C-bus serial interface . . . . . . . . . . . . . . . . . . . 7
Bus fault time-out . . . . . . . . . . . . . . . . . . . . . . . 8
Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Register list . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Pointer register . . . . . . . . . . . . . . . . . . . . . . . . 10
Configuration register . . . . . . . . . . . . . . . . . . . 11
Temperature register . . . . . . . . . . . . . . . . . . . 11
Overtemperature shutdown threshold (Tos)
and hysteresis (Thyst) registers . . . . . . . . . . . 12
Tidle register . . . . . . . . . . . . . . . . . . . . . . . . . . 13
OS output and polarity . . . . . . . . . . . . . . . . . . 14
OS comparator and interrupt modes . . . . . . . 14
OS fault queue . . . . . . . . . . . . . . . . . . . . . . . . 15
Shutdown mode . . . . . . . . . . . . . . . . . . . . . . . 15
Power-up default and power-on reset . . . . . . 15
Protocols for writing and reading the registers 16
Application design-in information . . . . . . . . . 19
Typical application . . . . . . . . . . . . . . . . . . . . . 19
Temperature accuracy . . . . . . . . . . . . . . . . . . 19
Noise effect. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 20
Recommended operating conditions. . . . . . . 20
Static characteristics. . . . . . . . . . . . . . . . . . . . 21
Dynamic characteristics . . . . . . . . . . . . . . . . . 24
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 25
Soldering of SMD packages . . . . . . . . . . . . . . 29
Introduction to soldering . . . . . . . . . . . . . . . . . 29
Wave and reflow soldering . . . . . . . . . . . . . . . 29
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 29
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 30
Soldering: PCB footprints. . . . . . . . . . . . . . . . 31
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 34
18
18.1
18.2
18.3
18.4
19
20
Legal information . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
35
35
35
35
36
36
37
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 21 May 2013
Document identifier: PCT2075