PDF Drawing

Leiterplatten-Layout Vorschlag für SMT
PCB-Layout Proposal for SMT
0,8
1,6 -0,03
Verpackt im Gurt nach DIN IEC 60286-3
Verpackungseinheit: 560 Stück
2 ±0,05
2,2
Packaging unit: 560 pcs
7,6
1,27
Tape on Reel Packaging according to DIN IEC 60286-3
1,27
2,21 ±0,03
5 x 1,27 = 6,35
10,77 ±0,03
7,2
7,2
9,6
5,2
330
Abspulrichtung - Reel off Direction
b6
b1
0,75 -0,05
4,25
24
8,37
1,55
1,27
1,5 -0,03
Anforderungsstufe 1
3,05
Performance Level 1
Kontaktbereich vergoldet
16
Mating Area gold plating
1,27
4,5
5 x 1,27 = 6,35
9,37
Anschlussbereich verzinnt 4-6 µm
Terminal Area 4-6 µm tin plating
Koplanarität der Anschlüsse ≤ 0,1 mm
Coplanarity Area of Termination ≤ 0,1 mm
12,7
mit Verriegelung
1
Copyright by ERNI GmbH
Proprietary notice pursuant to ISO 16016 to be observed.
2
3,27
1,5
with locking mechanism
Tolerances
Information:
3:1
Scale
All Dimensions
in mm
All rights reserved.
Only for Information.
To ensure that this is the latest
version of this drawing, please
contact one of the ERNI companies
before using.
Designation
Subject to modification without
prior notice.
Drawing will not be updated.
Federl. SMC-Q 12-SMD-BA7
Female SMC-Q 12-SMD-type7
254262
www.ERNI.com
b
23.04.2014
Index
Date
Class
SMCQ
I
A3