Leiterplatten-Layout Vorschlag für SMT PCB-Layout Proposal for SMT 0,8 1,6 -0,03 Verpackt im Gurt nach DIN IEC 60286-3 Verpackungseinheit: 560 Stück 2 ±0,05 2,2 Packaging unit: 560 pcs 7,6 1,27 Tape on Reel Packaging according to DIN IEC 60286-3 1,27 2,21 ±0,03 5 x 1,27 = 6,35 10,77 ±0,03 7,2 7,2 9,6 5,2 330 Abspulrichtung - Reel off Direction b6 b1 0,75 -0,05 4,25 24 8,37 1,55 1,27 1,5 -0,03 Anforderungsstufe 1 3,05 Performance Level 1 Kontaktbereich vergoldet 16 Mating Area gold plating 1,27 4,5 5 x 1,27 = 6,35 9,37 Anschlussbereich verzinnt 4-6 µm Terminal Area 4-6 µm tin plating Koplanarität der Anschlüsse ≤ 0,1 mm Coplanarity Area of Termination ≤ 0,1 mm 12,7 mit Verriegelung 1 Copyright by ERNI GmbH Proprietary notice pursuant to ISO 16016 to be observed. 2 3,27 1,5 with locking mechanism Tolerances Information: 3:1 Scale All Dimensions in mm All rights reserved. Only for Information. To ensure that this is the latest version of this drawing, please contact one of the ERNI companies before using. Designation Subject to modification without prior notice. Drawing will not be updated. Federl. SMC-Q 12-SMD-BA7 Female SMC-Q 12-SMD-type7 254262 www.ERNI.com b 23.04.2014 Index Date Class SMCQ I A3