PACKAGE OPTION ADDENDUM www.ti.com 16-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) UCC27523D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) UCC27523DGN ACTIVE MSOPPowerPAD DGN 8 80 UCC27523DGNR ACTIVE MSOPPowerPAD DGN 8 UCC27523DR ACTIVE SOIC D UCC27523DSDR ACTIVE SON UCC27523DSDT ACTIVE UCC27524D MSL Peak Temp Op Temp (°C) Device Marking (3) CU NIPDAU (4/5) Level-1-260C-UNLIM -40 to 140 27523 Green (RoHS CU NIPDAUAG & no Sb/Br) Level-1-260C-UNLIM -40 to 140 27523 2500 Green (RoHS CU NIPDAUAG & no Sb/Br) Level-1-260C-UNLIM -40 to 140 27523 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 140 27523 DSD 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 140 27523 SON DSD 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 140 27523 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 140 27524 UCC27524DGN ACTIVE MSOPPowerPAD DGN 8 80 Green (RoHS CU NIPDAUAG & no Sb/Br) Level-1-260C-UNLIM -40 to 140 27524 UCC27524DGNR ACTIVE MSOPPowerPAD DGN 8 2500 Green (RoHS CU NIPDAUAG & no Sb/Br) Level-1-260C-UNLIM -40 to 140 27524 UCC27524DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 140 27524 UCC27524DSDR ACTIVE SON DSD 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 140 SBA UCC27524DSDT ACTIVE SON DSD 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 140 SBA UCC27524P ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 140 27524 UCC27525D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 140 27525 UCC27525DGN ACTIVE MSOPPowerPAD DGN 8 80 Green (RoHS CU NIPDAUAG & no Sb/Br) Level-1-260C-UNLIM -40 to 140 27525 UCC27525DGNR ACTIVE MSOPPowerPAD DGN 8 2500 Green (RoHS CU NIPDAUAG & no Sb/Br) Level-1-260C-UNLIM -40 to 140 27525 UCC27525DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) Level-1-260C-UNLIM -40 to 140 27525 CU NIPDAU Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 16-Oct-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) UCC27525DSDR ACTIVE SON DSD 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 140 27525 UCC27525DSDT ACTIVE SON DSD 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 140 27525 UCC27526DSDR ACTIVE SON DSD 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 140 SCB UCC27526DSDT ACTIVE SON DSD 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 140 SCB (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 16-Oct-2013 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3