slusaq3g_pm

PACKAGE MATERIALS INFORMATION
www.ti.com
16-Oct-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
UCC27523DGNR
MSOPPower
PAD
UCC27523DR
UCC27523DSDR
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DGN
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
SON
DSD
8
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
UCC27523DSDT
SON
DSD
8
250
180.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
UCC27524DGNR
MSOPPower
PAD
DGN
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
UCC27524DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UCC27524DSDR
SON
DSD
8
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
UCC27524DSDT
SON
DSD
8
250
180.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
UCC27525DGNR
MSOPPower
PAD
DGN
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
UCC27525DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UCC27525DSDR
SON
DSD
8
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
UCC27525DSDT
SON
DSD
8
250
180.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
UCC27526DSDR
SON
DSD
8
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
UCC27526DSDT
SON
DSD
8
250
180.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Oct-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
UCC27523DGNR
MSOP-PowerPAD
DGN
8
2500
364.0
364.0
27.0
UCC27523DR
SOIC
D
8
2500
367.0
367.0
35.0
UCC27523DSDR
SON
DSD
8
3000
367.0
367.0
35.0
UCC27523DSDT
SON
DSD
8
250
210.0
185.0
35.0
UCC27524DGNR
MSOP-PowerPAD
DGN
8
2500
364.0
364.0
27.0
UCC27524DR
SOIC
D
8
2500
367.0
367.0
35.0
UCC27524DSDR
SON
DSD
8
3000
367.0
367.0
35.0
UCC27524DSDT
SON
DSD
8
250
210.0
185.0
35.0
UCC27525DGNR
MSOP-PowerPAD
DGN
8
2500
364.0
364.0
27.0
UCC27525DR
SOIC
D
8
2500
367.0
367.0
35.0
UCC27525DSDR
SON
DSD
8
3000
367.0
367.0
35.0
UCC27525DSDT
SON
DSD
8
250
210.0
185.0
35.0
UCC27526DSDR
SON
DSD
8
3000
367.0
367.0
35.0
UCC27526DSDT
SON
DSD
8
250
210.0
185.0
35.0
Pack Materials-Page 2