PACKAGE MATERIALS INFORMATION www.ti.com 16-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing UCC27523DGNR MSOPPower PAD UCC27523DR UCC27523DSDR SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 SON DSD 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 UCC27523DSDT SON DSD 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 UCC27524DGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 UCC27524DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC27524DSDR SON DSD 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 UCC27524DSDT SON DSD 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 UCC27525DGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 UCC27525DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC27525DSDR SON DSD 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 UCC27525DSDT SON DSD 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 UCC27526DSDR SON DSD 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 UCC27526DSDT SON DSD 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 16-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UCC27523DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0 UCC27523DR SOIC D 8 2500 367.0 367.0 35.0 UCC27523DSDR SON DSD 8 3000 367.0 367.0 35.0 UCC27523DSDT SON DSD 8 250 210.0 185.0 35.0 UCC27524DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0 UCC27524DR SOIC D 8 2500 367.0 367.0 35.0 UCC27524DSDR SON DSD 8 3000 367.0 367.0 35.0 UCC27524DSDT SON DSD 8 250 210.0 185.0 35.0 UCC27525DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0 UCC27525DR SOIC D 8 2500 367.0 367.0 35.0 UCC27525DSDR SON DSD 8 3000 367.0 367.0 35.0 UCC27525DSDT SON DSD 8 250 210.0 185.0 35.0 UCC27526DSDR SON DSD 8 3000 367.0 367.0 35.0 UCC27526DSDT SON DSD 8 250 210.0 185.0 35.0 Pack Materials-Page 2