MS2209 RF & MICROWAVE TRANSISTORS AVIONICS APPLICATIONS Features • • • • • 225 MHz BANDWIDTH COMMON BASE GOLD METALLIZATION CLASS C OPERATION POUT = 90 W MIN. WITH 8.4 dB GAIN DESCRIPTION: The MS2209 is a broadband, high peak pulse power silicon NPN bipolar device specifically designed for avionics applications requiring broad bandwidth with moderate duty cycles and pulse width constraints such as ground/ship based DME/TACAN. This device is also designed for specialized applications including JTIDS applications when duty cycle is moderately higher. Gold metallization and emitter ballasting assure high reliability under Class C amplifier operation. ABSOLUTE MAXIMUM RATINGS (Tcase = 25°C) Symbol VCC IC PDISS TJ TSTG Parameter Value Unit Collector Supply Voltage 50 V Device Current 7.0 A Power Dissipation 220 W Junction Temperature (RF Pulsed Operation) +200 °C -65 to +200 °C 0.80 °C/W Storage Temperature Thermal Data RTH(J-C) Junction-case Thermal Resistance Rev B- September 2008 Microsemi reserves the right to change, without notice, the specifications and information contained herein. Visit our web site at www.microsemi.com or contact our factory direct. MS2209 ELECTRICAL SPECIFICATIONS (Tcase = 25°C) STATIC Symbol Value Test Conditions Min. Typ. Max. Unit BVCBO IC = 40mA IE = 0mA 65 --- --- V BVEBO IE = 10mA IC=0mA 3.0 --- --- V BVCER IC= 40mA RBE = 10Ω 65 --- --- V ICBO VCB= 35 V ------ --- 12 mA hFE VCE = 5 V 20 --- 120 --- IC = 2A DYNAMIC Symbol Value Test Conditions Min. Typ. Max. Unit POUT f = 960-1215MHz VCC = 50V PIN = 13W 90 100 --- W GP f = 960-1215MHz VCC = 50V PIN = 13W 8.4 --- --- dB ηC f = 960-1215MHz VCC = 50V PIN = 13W 38 44 --- % f = 960MHz VCC = 50V PIN = 13W VSWR 10:1 Pulse Width = 10 µs Duty Cycle = 10% IMPEDANCE DATA Freq Zin (Ω) Zcl (Ω) 960 5+j9.0 10.2-j8.8 1025 6+j8.0 9.5-j7.6 1090 6.8+j7.2 9.0-j6.2 1150 6.3+j7.0 8.4-j5.0 1215 5.8+j7.8 7.0-j3.7 Vcc=50v Pout=90w Microsemi reserves the right to change, without notice, the specifications and information contained herein. Visit our web site at www.microsemi.com or contact our factory direct. MS2209 TEST CIRCUIT Microsemi reserves the right to change, without notice, the specifications and information contained herein. Visit our web site at www.microsemi.com or contact our factory direct. MS2209 PACKAGE MECHANICAL DATA Microsemi reserves the right to change, without notice, the specifications and information contained herein. Visit our web site at www.microsemi.com or contact our factory direct.