PACKAGE MATERIALS INFORMATION www.ti.com 16-Jun-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device UCC27423DGNR Package Package Pins Type Drawing MSOPPower PAD SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 UCC27423DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC27424DGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 UCC27424DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC27424DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC27425DGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 UCC27425DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 16-Jun-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UCC27423DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0 UCC27423DR SOIC D 8 2500 340.5 338.1 20.6 UCC27424DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0 UCC27424DR SOIC D 8 2500 367.0 367.0 35.0 UCC27424DR SOIC D 8 2500 340.5 338.1 20.6 UCC27425DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0 UCC27425DR SOIC D 8 2500 340.5 338.1 20.6 Pack Materials-Page 2