PHILIPS SOT347

PDF: 1999 Apr 16
Philips Semiconductors
Package outline
Ceramic single-ended flat package; heatsink mounted; 2 mounting holes;
12 in-line tin (Sn) plated leads
SOT347
D
y
U
q
A
P
F
S
U1
G
E
L
1
12
e
Z
b
c
v A
w M
Q
A
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
b
c
D
E
e
F
G
L
min.
P
Q
q
S
U
U1
v
w
y
Z
max.
mm
6.0
5.6
0.51
0.38
0.25
36.2
35.8
18.2
17.8
2.54
2.0
25.5
24.5
6
4.15
3.85
1.8
19
3.5
3.4
34.4
34.0
22.2
21.8
0.3
0.25
0.1
4.1
OUTLINE
VERSION
SOT347
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
97-06-28