74AHCT541A Octal buffer/line driver; 3-state Rev. 5 — 13 June 2016 Product data sheet 1. General description The 74AHCT541A is an 8-bit buffer/line driver with 3-state outputs and TTL inputs. The device features two output enables (OE1 and OE2). A HIGH on OEn causes the associated outputs to assume a high-impedance OFF-state. Designed to operate over a VCC range from 4.5 V to 5.5 V, the inputs are TTL compatible, which allows the device to be used to translate from 3.3 V to 5 V. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device is fully specified for partial Power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. 2. Features and benefits Direct interface with TTL levels Supply voltage range from 4.5 V to 5.5 V Typical tpd of 2.8 ns at 5 V Typical VOL(p) < 0.8 V at VCC = 5 V, Tamb = 25 C Typical VOH(v) > 2.3 V at VCC = 5 V, Tamb = 25 C Supports mixed-mode voltage operation on all ports IOFF circuitry provides partial Power-down mode operation Latch-up performance exceeds 250 mA per JESD 78 Class II ESD protection: HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 3kV MM JESD22-A115-A exceeds 200 V CDM JESD22-C101E exceeds 2kV Multiple package options Specified from 40 C to +85 C and from 40 C to +125 C 74AHCT541A NXP Semiconductors Octal buffer/line driver; 3-state 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name 74AHCT541APW 40 C to +125 C 74AHCT541ABQ TSSOP20 40 C to +125 C Description Version plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 DHVQFN20 plastic dual in-line compatible thermal enhanced very SOT764-1 thin quad flat package; no leads; 20 terminals; body 2.5 4.5 0.85 mm 4. Functional diagram $ < $ < $ < $ < $ < $ $ $ < < < 2( 2( PQD Fig 1. Logic symbol 74AHCT541A Product data sheet (1 PQD Fig 2. IEC logic symbol All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 2 of 14 74AHCT541A NXP Semiconductors Octal buffer/line driver; 3-state 5. Pinning information 5.1 Pinning 9&& 2( $+&7$ WHUPLQDO LQGH[DUHD $+&7$ $ 2( $ < $ < 2( $ 9&& 2( $ < $ < $ < $ < $ < $ $ < $ $ < $ < $ $ < *1' < < *1' < < *1' < DDD 7UDQVSDUHQWWRSYLHZ DDD (1) This is not a supply pin. The substrate is attached to this pad using conductive die attach material. There is no electrical or mechanical requirement to solder this pad. However, if it is soldered, the solder land should remain floating or be connected to GND. Fig 3. Pin configuration TSSOP20 Fig 4. Pin configuration DHVQFN20 5.2 Pin description Table 2. Pin description Symbol Pin Description OE1 1 output enable input (active LOW) A0 to A7 2, 3, 4, 5, 6, 7, 8, 9 data input GND 10 ground (0 V) Y0 to Y7 18, 17, 16, 15, 14, 13, 12, 11 data output OE2 19 output enable input (active LOW) VCC 20 supply voltage 74AHCT541A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 3 of 14 74AHCT541A NXP Semiconductors Octal buffer/line driver; 3-state 6. Functional description Table 3. Functional table[1] Control Input Output OE1 OE2 An Yn L L L L L L H H X H X Z H X X Z [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage VI input voltage VO output voltage Conditions active mode Min Max Unit 0.5 +7.0 V [1] 0.5 +7.0 V [2][3] 0.5 VCC + 0.5 V [2] 0.5 +7.0 V power-down or 3-state mode IIK input clamping current VI < 0 V 20 - mA IOK output clamping current VO < 0 V 20 - mA IO output current VO = 0 V to VCC - 25 mA ICC supply current - 75 mA IGND ground current 75 - mA Tstg storage temperature 65 +150 C - 500 mW total power dissipation Ptot Tamb = 40 C to +125 C [4] [1] The minimum input voltage ratings may be exceeded if the input current ratings are observed. [2] The output voltage ratings may be exceeded if the output current ratings are observed. [3] This value is limited to 7.0 V maximum. [4] For TSSOP20 package: above 100 C the value of Ptot derates linearly with 10 mW/K. For DHVQFN20 package: above 110 C the value of Ptot derates linearly with 12.5 mW/K. 74AHCT541A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 4 of 14 74AHCT541A NXP Semiconductors Octal buffer/line driver; 3-state 8. Recommended operating conditions Table 5. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions VCC supply voltage VI input voltage VO output voltage Tamb ambient temperature t/V input transition rise and fall rate Min Max Unit 4.5 5.5 V 0 5.5 V active mode 0 VCC V power-down or 3-state mode 0 5.5 V 40 +125 C - 20 VCC = 5.0 V 0.5 V ns/V 9. Static characteristics Table 6. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 C Conditions 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2 - - 2 - 2 - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - - 0.8 - 0.8 - 0.8 V VOH HIGH-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = 50 A IO = 8 mA VOL LOW-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = 50 A IO = 8 mA 4.4 4.5 - 4.4 - 4.4 - V 3.94 - - 3.8 - 3.7 - V - 0 0.1 - 0.1 - 0.1 V - - 0.36 - 0.44 - 0.55 V IOZ OFF-state VCC = 5.5 V; VI = VIH or VIL; output current VO = GND to 5.5 V - - 0.25 - 2.5 - 2.5 A IOFF power-off leakage current VI or VO = GND to 5.5 V; VCC = 0 V - - 0.5 - 5 - 5 A II input leakage current VI = VCC or GND; VCC = 0 V to 5.5 V - - 0.1 - 1 - 1 A ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 2 - 20 - 20 A ICC additional per input pin; VI = 3.4 V; supply current IO = 0 A; other pins at VCC or GND; VCC = 5.5 V - - 1.35 - 1.5 - 1.5 mA 74AHCT541A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 5 of 14 74AHCT541A NXP Semiconductors Octal buffer/line driver; 3-state 10. Dynamic characteristics Table 7. Dynamic characteristics GND = 0 V. For test circuit see Figure 7. Symbol Parameter propagation delay tpd enable time ten 25 C Conditions 40 C to +85 C 40 C to +125 C Unit Min Typ[1] Max Min Max Min Max CL = 15 pF - 2.8 6.9 1 8 1 8 ns CL = 50 pF - 4.4 7.9 1 9 1 9 ns - 3.9 11.3 1 13 1 13 ns - 5.5 12.3 1 14 1 14 ns CL = 15 pF - 3.6 7.5 1 8 1 8 ns CL = 50 pF - 5.4 11.9 1 13.5 1 13.5 ns An to Yn; see Figure 5 [2] VCC = 4.5 V to 5.5 V OEn to Yn; see Figure 6 VCC = 4.5 V to 5.5 V CL = 15 pF CL = 50 pF disable time OEn to Yn; see Figure 6 tdis [2] VCC = 4.5 V to 5.5 V tsk(o) skew VCC = 4.5 V to 5.5 V; CL = 50 pF - - 1 - 1 - 1 ns CI input capacitance VI = VCC or GND; VCC = 5 V - 2 6 - 6 - 6 pF CO output capacitance VO = VCC or GND; VCC = 5 V - 5 - - - - - pF CPD power dissipation capacitance per buffer; CL = 0 pF; f = 10 MHz; VI = GND to VCC - 9 - - - - - pF [3] [1] Typical values are measured at Tamb = 25 C and VCC = 5 V. [2] tpd is the same as tPLH and tPHL. ten is the same as tPZL and tPZH. tdis is the same as tPLZ and tPHZ. [3] CPD is used to determine the dynamic power dissipation PD (W). PD = CPD VCC2 fi + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts. 74AHCT541A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 6 of 14 74AHCT541A NXP Semiconductors Octal buffer/line driver; 3-state Table 8. Noise characteristics GND = 0 V. For test circuit see Figure 7. Symbol Parameter Tamb = 25 C Conditions Unit Min Typ Max VCC = 5 V; CL = 50 pF VOL(p) LOW-level output voltage (peak) - 0.5 1.5 V VOL(v) LOW-level output voltage (valley) 1.5 0.3 - V VOH(v) HIGH-level output voltage (valley) - 4.5 - V VIH(AC) AC HIGH-level input voltage (dynamic) 2 - - V VIL(AC) AC LOW-level input voltage (dynamic) - - 0.8 V 11. Waveforms 9, 90 $QLQSXW *1' W 3+/ W 3/+ 92+ <QRXWSXW 90 92/ PQD Measurement points are given in Table 9. VOL and VOH are typical voltage output levels that occur with the output load. Fig 5. Propagation delay input (An) to output (Yn) 9, 2(QLQSXW 90 *1' W 3/= W 3=/ 9&& RXWSXW /2:WR2)) 2))WR/2: 90 9; 92/ W 3+= 92+ W 3=+ 9< RXWSXW +,*+WR2)) 2))WR+,*+ *1' 90 RXWSXWV HQDEOHG RXWSXWV GLVDEOHG RXWSXWV HQDEOHG PQD Measurement points are given in Table 9. VOL and VOH are typical voltage output levels that occur with the output load. Fig 6. enable and disable times 74AHCT541A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 7 of 14 74AHCT541A NXP Semiconductors Octal buffer/line driver; 3-state Table 9. Measurement points Input Output VM VM VX VY 1.5 V 0.5VCC VOL + 0.3 V VOH 0.3 V 9, W: QHJDWLYH SXOVH 90 9 9, WI WU WU WI SRVLWLYH SXOVH 9 90 90 90 W: 9&& 9&& 9, * 92 5/ 6 RSHQ '87 &/ 57 DDG Test data is given in Table 10. Definitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator CL = Load capacitance including jig and probe capacitance RL = Load resistor S1 = Test selection switch Fig 7. Table 10. Test circuit for measuring switching times Test data Input VI Load tr, tf GND to 3.0 V 3.0 ns 74AHCT541A Product data sheet S1 position CL RL tPHL, tPLH tPZH, tPHZ tPZL, tPLZ 15 pF, 50 pF 1 k open GND VCC All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 8 of 14 74AHCT541A NXP Semiconductors Octal buffer/line driver; 3-state 12. Package outline 76623SODVWLFWKLQVKULQNVPDOORXWOLQHSDFNDJHOHDGVERG\ZLGWKPP ' 627 ( $ ; F +( \ Y 0 $ = 4 $ SLQLQGH[ $ $ $ ș /S / H GHWDLO; Z 0 ES PP VFDOH ',0(16,216PPDUHWKHRULJLQDOGLPHQVLRQV 81,7 $ PD[ $ $ $ ES F ' ( H +( / /S 4 Y Z \ = ș PP R R 1RWHV 3ODVWLFRUPHWDOSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 3ODVWLFLQWHUOHDGSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 287/,1( 9(56,21 627 Fig 8. 5()(5(1&(6 ,(& -('(& -(,7$ (8523($1 352-(&7,21 ,668('$7( 02 Package outline SOT360-1 (TSSOP20) 74AHCT541A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 9 of 14 74AHCT541A NXP Semiconductors Octal buffer/line driver; 3-state '+94)1SODVWLFGXDOLQOLQHFRPSDWLEOHWKHUPDOHQKDQFHGYHU\WKLQTXDGIODWSDFNDJHQROHDGV WHUPLQDOVERG\[[PP % ' 627 $ $ $ ( F GHWDLO; WHUPLQDO LQGH[DUHD WHUPLQDO LQGH[DUHD H & H E Y Z & $ % & \ & \ / (K H ; 'K PP VFDOH 'LPHQVLRQVPPDUHWKHRULJLQDOGLPHQVLRQV 8QLW PP $ $ E PD[ QRP PLQ F ' 'K ( (K H H / Y Z \ \ 1RWH 3ODVWLFRUPHWDOSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 5HIHUHQFHV 2XWOLQH YHUVLRQ ,(& -('(& -(,7$ 627 02 Fig 9. VRWBSR (XURSHDQ SURMHFWLRQ ,VVXHGDWH Package outline SOT764-1 (DHVQFN20) 74AHCT541A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 10 of 14 74AHCT541A NXP Semiconductors Octal buffer/line driver; 3-state 13. Abbreviations Table 11. Abbreviations Acronym Description CDM Charge Device Model DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 14. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes 74AHCT541A v.5 20160613 Product data sheet - 74AHCT541A v.4 - 74AHCT541A v.3 Modifications: 74AHCT541A v.4 Modifications: 74AHCT541A v.3 Modifications: 74AHCT541A v.2 Modifications: 74AHCT541A v.1 74AHCT541A Product data sheet • Table 6: II limits corrected (errata). 20160419 • Table 6: conditions for additional supply current (ICC) corrected. 20160224 • Product data sheet - 74AHCT541A v.2 - 74AHCT541A v.1 Table 7: CPD value corrected (errata). 20160127 • Product data sheet Product data sheet Table 7: conditions CPD corrected (errata). 20151223 Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 June 2016 - © NXP Semiconductors N.V. 2016. All rights reserved. 11 of 14 74AHCT541A NXP Semiconductors Octal buffer/line driver; 3-state 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 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In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. 74AHCT541A Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 12 of 14 74AHCT541A NXP Semiconductors Octal buffer/line driver; 3-state Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74AHCT541A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 13 of 14 NXP Semiconductors 74AHCT541A Octal buffer/line driver; 3-state 17. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Contact information. . . . . . . . . . . . . . . . . . . . . 13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2016. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 13 June 2016 Document identifier: 74AHCT541A