SOT470-3 HLQFP100; Reel dry pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending ,518 or Y Ordering code (12NC) ending 518 Rev. 1 — 2 October 2015 Packing information 1. Packing method %DUFRGHODEHO 'U\DJHQW %DJ (6'SULQW 5HODWLYHKXPLGLW\ LQGLFDWRU 0RLVWXUHFDXWLRQ SULQW (6'HPERVVHG 7DSH 5HHODVVHPEO\ %DUFRGHODEHO *XDUGEDQG 3ULQWHGSODQRER[ &LUFXODUVSURFNHWKROHVRSSRVLWHWKH ODEHOVLGHRIUHHO &RYHUWDSH 4$VHDO &DUULHUWDSH 6SDFHIRUDGGLWLRQDO ODEHO 3UHSULQWHG(6' ZDUQLQJ %DUFRGHODEHO 'U\SDFN,'VWLFNHU 3ULQWHGSODQRER[ DDD Fig 1. Reel dry pack for SMD SOT470-3 NXP Semiconductors HLQFP100; Reel dry pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending ,518 or Y Ordering code (12NC) ending 518 Table 1. Dimensions and quantities Reel dimensions d w (mm) [1] SPQ/PQ (pcs) [2] Reels per box Outer box dimensions l w h (mm) 330 24 1000 1 342 338 49 [1] d = reel diameter; w = tape width. [2] Packing quantity dependent on specific product type. View ordering and availability details at NXP order portal, or contact your local NXP representative. 2. Product orientation 47 47 SLQ 47 47 DDD DDD Tape pocket quadrants Fig 2. Pin 1 is in quadrant Q1/T1 Product orientation in carrier tape 3. Carrier tape dimensions 4 mm W K0 A0 B0 P1 T direction of feed Fig 3. 001aao148 Carrier tape dimensions Table 2. Carrier tape dimensions In accordance with IEC 60286-3. SOT470-3_518 Packing information A0 (mm) B0 (mm) K0 (mm) T (mm) P1 (mm) W (mm) 16.40 0.1 16.40 0.1 2.30 0.1 0.30 0.03 20.00 0.1 24.00 0.3 All information provided in this document is subject to legal disclaimers. Rev. 1 — 2 October 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 2 of 5 SOT470-3 NXP Semiconductors HLQFP100; Reel dry pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending ,518 or Y Ordering code (12NC) ending 518 4. Reel dimensions A Z W2 B ØC ØD detail Z 001aao149 Fig 4. Schematic view of reel Table 3. Reel dimensions In accordance with IEC 60286-3. SOT470-3_518 Packing information A [nom] (mm) W2 [max] (mm) B [min] (mm) C [min] (mm) D [min] (mm) 330 30.4 1.5 12.8 20.2 All information provided in this document is subject to legal disclaimers. Rev. 1 — 2 October 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 3 of 5 SOT470-3 NXP Semiconductors HLQFP100; Reel dry pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending ,518 or Y Ordering code (12NC) ending 518 5. Barcode label Fixed text Country of origin i.e. "Made in....." or "Diffused in EU [+] Assembled in...... Packing unit (PQ) identification 2nd traceability lot number* 2nd (youngest) date code* 2nd Quantity* Traceability lot number Date code With linear barcode Quantity With linear barcode Type number NXP 12NC With linear barcode NXP SEMICONDUCTORS MADE IN >COUNTRY< [PRODUCT INFO] (Q) QTY Optional product information* Re-approval date code* Origin code Product Manufacturing Code MSL at the Peak Body solder temperature with tin/lead* MSL at the higher lead-free Peak Body Temperature* 2D matrix with all data (including the data identifiers) HALOGEN FREE (30P) TYPE RoHS compliant (1P) CODENO Additional info if halogen free product Additional info on RoHS (33T) PUID: B.0987654321 (30T) LOT2 (31D) REDATE (30D) DATE2 (32T) ORIG (30Q) QTY2 (31T) PMC (31P) MSL/PBT (1T) LOT MSL/PBT (9D) DATE Lead-free symbol 001aak714 Fig 5. Table 4. SOT470-3_518 Packing information Example of typical box and reel information barcode label Barcode label dimensions Box barcode label l w (mm) Reel barcode label l w (mm) 100 75 100 75 All information provided in this document is subject to legal disclaimers. Rev. 1 — 2 October 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 4 of 5 SOT470-3 NXP Semiconductors HLQFP100; Reel dry pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending ,518 or Y Ordering code (12NC) ending 518 6. Revision history Table 5. Revision history Document ID Release date Packing document status Change notice Supersedes SOT470-3_518 20151002 Packing information - - Limited warranty and liability © NXP Semiconductors N.V. 2015. Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 2 October 2015 Document identifier: SOT470-3_518 All rights reserved.