PACKAGE OPTION ADDENDUM www.ti.com 17-May-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) PCF8575CDB ACTIVE SSOP DB 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PF575C PCF8575CDBE4 ACTIVE SSOP DB 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PF575C PCF8575CDBG4 ACTIVE SSOP DB 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PF575C PCF8575CDBQR ACTIVE SSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 PCF8575C PCF8575CDBQRE4 ACTIVE SSOP DBQ 24 TBD Call TI Call TI -40 to 85 PCF8575CDBQRG4 ACTIVE SSOP DBQ 24 TBD Call TI Call TI -40 to 85 PCF8575CDBR ACTIVE SSOP DB 24 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PCF8575CDBRE4 ACTIVE SSOP DB 24 TBD Call TI Call TI -40 to 85 PCF8575CDBRG4 ACTIVE SSOP DB 24 TBD Call TI Call TI -40 to 85 PCF8575CDGVR ACTIVE TVSOP DGV 24 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PCF8575CDGVRE4 ACTIVE TVSOP DGV 24 TBD Call TI Call TI -40 to 85 PCF8575CDGVRG4 ACTIVE TVSOP DGV 24 TBD Call TI Call TI -40 to 85 PCF8575CDW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PCF8575C PCF8575CDWE4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PCF8575C PCF8575CDWG4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PCF8575C PCF8575CDWR ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PCF8575C PCF8575CDWRE4 ACTIVE SOIC DW 24 TBD Call TI Call TI -40 to 85 PCF8575CDWRG4 ACTIVE SOIC DW 24 TBD Call TI Call TI -40 to 85 2000 2000 Addendum-Page 1 PF575C PF575C Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 17-May-2014 Status (1) Package Type Package Pins Package Drawing Qty 60 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 TBD Call TI Call TI -40 to 85 Device Marking (4/5) PCF8575CPW ACTIVE TSSOP PW 24 PCF8575CPWE4 ACTIVE TSSOP PW 24 PCF8575CPWG4 ACTIVE TSSOP PW 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PF575C PCF8575CPWR ACTIVE TSSOP PW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PF575C PCF8575CPWRE4 ACTIVE TSSOP PW 24 TBD Call TI Call TI -40 to 85 PCF8575CPWRG4 ACTIVE TSSOP PW 24 TBD Call TI Call TI -40 to 85 PCF8575CRGER ACTIVE VQFN RGE 24 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 PCF8575CRGERG4 ACTIVE VQFN RGE 24 TBD Call TI Call TI -40 to 85 3000 PF575C PF575C (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 17-May-2014 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3