sgls274g_pm

PACKAGE MATERIALS INFORMATION
www.ti.com
13-Feb-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
UCC27423QDGNRQ1
Package Package Pins
Type Drawing
MSOPPower
PAD
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DGN
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
UCC27423QDRQ1
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UCC27424QDGNRQ1
MSOPPower
PAD
DGN
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
UCC27424QDRQ1
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UCC27425QDRQ1
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
13-Feb-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
UCC27423QDGNRQ1
MSOP-PowerPAD
DGN
8
2500
367.0
367.0
38.0
UCC27423QDRQ1
SOIC
D
8
2500
340.5
338.1
20.6
UCC27424QDGNRQ1
MSOP-PowerPAD
DGN
8
2500
367.0
367.0
38.0
UCC27424QDRQ1
SOIC
D
8
2500
340.5
338.1
20.6
UCC27425QDRQ1
SOIC
D
8
2500
340.5
338.1
20.6
Pack Materials-Page 2