APTDF450U60G-Rev2.pdf

APTDF450U60G
Single diode
Power Module
VCES = 600V
IC = 450A @ Tc = 80°C
Application

Anti-Parallel diode
- Switchmode Power Supply
- Inverters
Snubber diode
Uninterruptible Power Supply (UPS)
Induction heating
Welding equipment
High speed rectifiers
Electric vehicles






Features






Ultra fast recovery times
Soft recovery characteristics
Very low stray inductance
High blocking voltage
High current
Low leakage current
Benefits





Low losses
Low noise switching
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
RoHS Compliant
Absolute maximum ratings
Parameter
Maximum DC reverse Voltage
Maximum Peak Repetitive Reverse Voltage
IF(AV)
Maximum Average Forward
Current
IF(RMS)
IFSM
RMS Forward Current
Non-Repetitive Forward Surge Current
Duty cycle = 50%
Max ratings
Unit
600
V
Tc = 25°C
500
Tc = 80°C
450
850
5000
Tj = 25°C
A
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
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1-4
APTDF450U60G – Rev 2 October, 2012
Symbol
VR
VRRM
APTDF450U60G
All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic
VF
Diode Forward Voltage
IRM
Maximum Reverse Leakage Current
CT
Junction Capacitance
Test Conditions
IF = 500A
IF = 1000A
IF = 500A
Tj = 150°C
Tj = 25°C
VR = 600V
Tj = 150°C
Min
Typ
1.4
1.7
Max
1.8
V
1.5
2500
5000
VR = 200V
Unit
825
µA
pF
Dynamic Characteristics
Symbol Characteristic
trr1
trr2
Reverse Recovery Time
trr3
tfr1
tfr2
IRRM1
IRRM2
Qrr1
Qrr2
Vfr1
Vfr2
dIM/dt
Test Conditions
IF=1A,VR=30V
di/dt = 15A/µs
IF = 500A
VR = 350V
di/dt=1000A/µs
Forward Recovery Time
Reverse Recovery Current
Reverse Recovery Charge
IF = 500A
VR = 350V
di/dt=1000A/µs
Forward Recovery Voltage
Rate of Fall of Recovery Current
Min
Typ
Max
Tj = 25°C
60
75
Tj = 25°C
90
115
Tj = 100°C
135
255
Tj = 25°C
135
Tj = 100°C
135
Tj = 25°C
35
50
Tj = 100°C
55
70
Tj = 25°C
1575
2875
Tj = 100°C
3715
8925
Tj = 25°C
23
Tj = 100°C
23
Tj = 25°C
600
Tj = 100°C
400
Unit
ns
ns
A
nC
V
A/µs
Thermal and package characteristics
Torque
Mounting torque
Wt
Package Weight
Min
Typ
Max
0.08
4000
To heatsink
For terminals
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M5
M6
-40
-40
-40
2.5
3
Unit
°C/W
V
150
125
100
3.5
4
250
°C
N.m
g
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APTDF450U60G – Rev 2 October, 2012
Symbol Characteristic
RthJC
Junction to Case Thermal Resistance
RMS Isolation Voltage, any terminal to case
VISOL
t =1 min, 50/60Hz
TJ
Operating junction temperature range
TSTG
Storage Temperature Range
TC
Operating Case Temperature
APTDF450U60G
www.microsemi.com
3-4
APTDF450U60G – Rev 2 October, 2012
LP4 Package outline (dimensions in mm)
APTDF450U60G
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PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted,
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inducement, estoppels or otherwise. Any license under such intellectual property rights must be approved by
Microsemi in writing signed by an officer of Microsemi.
Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime
without any notice. This product has been subject to limited testing and should not be used in conjunction with lifesupport or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi
disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other
intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or
user must conduct and complete all performance and other testing of this product as well as any user or customers final
application. User or customer shall not rely on any data and performance specifications or parameters provided by
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is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp
Life Support Application
Seller's Products are not designed, intended, or authorized for use as components in systems intended for space,
aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other
application in which the failure of the Seller's Product could create a situation where personal injury, death or property
damage or loss may occur (collectively "Life Support Applications").
Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive
testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees,
subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and
expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage
or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations
that Seller was negligent regarding the design or manufacture of the goods.
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4-4
APTDF450U60G – Rev 2 October, 2012
Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with
Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the
new proposed specific part.