LDS-0138.pdf

1N1184, 1N1186, 1N1188, 1N1190,
1N3766 and 1N3768 (R)
Available on
commercial
versions
High Reliability Silicon Power Rectifier
Qualified per MIL-PRF-19500/297
Qualified Levels:
JAN, JANTX, and
JANTXV
DESCRIPTION
This series of silicon power rectifier part numbers are qualified up to the JANTXV level for high
reliability applications. They are constructed with glass passivated die and feature glass to
metal seal construction. They have a 500 amp surge rating and provide a V RWM up to 1000
volts.
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
•
•
•
•
•
DO-5 (DO-203AB)
Package
High continuous current rating.
Very low forward voltage.
Low thermal resistance.
JAN, JANTX and JANTXV qualifications are available per MIL-PRF-19500/297.
RoHS compliant devices available (commercial grade only).
APPLICATIONS / BENEFITS
•
•
High frequency switching circuits.
Mechanically rugged DO-5 package.
MAXIMUM RATINGS @ T A = +25 ºC unless otherwise stated
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-Case
Working Peak Reverse Voltage
1N1184(R)
1N1186(R)
1N1188(R)
1N1190(R)
1N3766(R)
1N3768(R)
o (1)
Maximum Average DC Output Current @ TC = 150 C
Non-Repetitive Sinusoidal Surge Current @ 1/120 s,
TC = 150 ºC
Symbol
TJ and TSTG
R ӨJC
V RWM
IO
I FSM
Value
-65 to +175
0.8
100
200
400
600
800
1000
35
500
NOTE: 1. Derate linearly 1.4 A ºC between T C = 150 ºC to T C = 175 ºC.
Unit
o
C
o
C/W
V
A
A
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
1-800-446-1158
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
T4-LDS-0138, Rev. 2 (121993)
©2013 Microsemi Corporation
Page 1 of 6
1N1184, 1N1186, 1N1188, 1N1190,
1N3766 and 1N3768 (R)
MECHANICAL and PACKAGING
•
•
•
•
•
•
CASE: Hermetically sealed metal and glass case body.
TERMINALS: Hot solder dip (Sn63/Pb37) on standard commercial, JAN, JANTX, and JANTXV levels. RoHS compliant matte-tin
on nickel is available on commercial grade only.
MARKING: Polarity symbol and part number.
POLARITY: Standard polarity devices are cathode to stud. Reverse polarity devices are anode to stud.
WEIGHT: Approximately 14 grams.
See Package Dimensions on last page.
PART NOMENCLATURE
JAN
1N1184
R
e3
Reliability Level
JAN = JAN level
JANTX = JANTX level
JANTXV = JANTXV level
Blank = Commercial
RoHS Compliance
e3 = RoHS compliant (available
on commercial grade only)
Blank = non-RoHS compliant
Polarity
R = Anode to Stud
Blank = Cathode to Stud
JEDEC type number
(see Electrical
Characteristics table)
SYMBOLS & DEFINITIONS
Definition
Symbol
IF
I FSM
IO
IR
VF
V RWM
Forward Current: The forward current dc value, no alternating component.
Maximum Forward Surge Current: The forward current, surge peak or rated forward surge current.
Average Rectified Output Current: The output current averaged over a full cycle with a 50 Hz or 60 Hz sine-wave input
and a 180 degree conduction angle.
Reverse Current: The maximum reverse (leakage) current that will flow at the specified voltage and temperature.
Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current.
Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating temperature range
excluding all transient voltages (ref JESD282-B). Also sometimes known as PIV.
T4-LDS-0138, Rev. 2 (121993)
©2013 Microsemi Corporation
Page 2 of 6
1N1184, 1N1186, 1N1188, 1N1190,
1N3766 and 1N3768 (R)
ELECTRICAL CHARACTERISTICS
Parameters / Test Conditions
Forward Voltage
(1)
I F = 110 A, T C = 25 °C
Forward Voltage
(2)
I F = 500 A, T C = 150 °C
Reverse Current
V RWM = 100 V, T J = 25 °C
V RWM = 200 V, T J = 25 °C
V RWM = 400 V, T J = 25 °C
V RWM = 600 V, T J = 25 °C
V RWM = 800 V, T J = 25 °C
V RWM = 1000 V, T J = 25 °C
Reverse Current
V RWM = 100 V, T J = 150 °C
V RWM = 200 V, T J = 150 °C
V RWM = 400 V, T J = 150 °C
V RWM = 600 V, T J = 150 °C
V RWM = 800 V, T Jj = 150 °C
V RWM = 1000 V, T J = 150 °C
Symbol
Min.
Max.
Unit
VF
1.4
V
VF
2.3
V
1N1184(R)
1N1186(R)
1N1188(R)
1N1190(R)
1N3766(R)
1N3768(R)
IR
10
µA
1N1184(R)
1N1186(R)
1N1188(R)
1N1190(R)
1N3766(R)
1N3768(R)
IR
1
mA
NOTES:
1. tp < 8.3 ms, duty cycle ≤ 2 percent pulse.
2. VF1 shall be performed with either tp = 800 μs or tp = 8.3 ms.
T4-LDS-0138, Rev. 2 (121993)
©2013 Microsemi Corporation
Page 3 of 6
1N1184, 1N1186, 1N1188, 1N1190,
1N3766 and 1N3768 (R)
Instantaneous Forward Current - Amperes
GRAPHS
Typical Reverse Current - mA
Instantaneous Forward Voltage - Volts
FIGURE 1
Typical Forward Characteristics
Reverse Voltage - Volts
FIGURE 2
Typical Reverse Characteristics
T4-LDS-0138, Rev. 2 (121993)
©2013 Microsemi Corporation
Page 4 of 6
1N1184, 1N1186, 1N1188, 1N1190,
1N3766 and 1N3768 (R)
Average Forward Current – Amperes
GRAPHS (continued)
Maximum Allowable Case Temperature -°C
Junction to Case
Thernal Impedance - °C/Watts
FIGURE 3
Forward Current Derating
Time in Seconds
FIGURE 4
Transient Thermal Impedance
T4-LDS-0138, Rev. 2 (121993)
©2013 Microsemi Corporation
Page 5 of 6
1N1184, 1N1186, 1N1188, 1N1190,
1N3766 and 1N3768 (R)
PACKAGE DIMENSIONS
Ltr
OAH
Dimensions
Millimeters
Max
Min
Max
1.000
25.40
Inch
Min
-
CH
-
0.450
-
11.43
HT
0.115
0.200
2.93
5.08
SL
0.422
0.453
10.72
11.50
HT1
0.060
-
1.53
-
B
0.250
0.375
6.35
9.52
CD
-
0.667
-
16.94
HF
0.667
0.687
16.95
17.44
J
0.156
-
3.97
-
φT
C
0.140
0.175
3.56
4.44
-
0.080
-
2.03
M
0.030
-
0.77
-
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
9.
Dimensions are in inches.
Millimeters are given for general information only.
Units must not be damaged by torque of 30 inch-pounds applied to 0.250-28 UNF-28 nut assembled on thread.
Diameter of unthreaded portion 0.249 inch (6.32 mm) max and .220 inch (5.59 mm) min.
Complete threads to extend to within 2.5 threads of seating plane.
Angular orientation of this terminal is undefined.
Max pitch diameter of plated threads shall be basic pitch diameter 0.2268 inch (5.76 mm) reference
FED-STD-H28.
A chamfer or undercut on one or both ends of the hex portion is optional; minimum base diameter at seating
plane. 0.600 inch (15.24 mm).
In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology.
T4-LDS-0138, Rev. 2 (121993)
©2013 Microsemi Corporation
Page 6 of 6