Q1 - 2009

2009 Q1 RELIABILITY REPORT
TABLE OF CONTENTS
1.0
OVERVIEW OF CYPRESS SEMICONDUCTOR TOTAL QUALITY MANAGEMENT SYSTEM
2
2.0
DEVICE RELIABILITY
3
3.0
2.1
EARLY FAILURE RATE SUMMARY
3
2.2
LONG TERM FAILURE RATE SUMMARY
4
2.3
DATA RETENTION SUMMARY
5
PACKAGE RELIABILITY
6
3.1
PRESSURE COOKER TEST
7
3.2
HAST (HIGHLY ACCELERATED STRESS TEST)
8
3.3
TEMPERATURE CYCLE
9
3.4
HIGH TEMPERATURE STORAGE
10
APPENDIX A: FAILURE RATE CALCULATION
11
APPENDIX B: TEMPERATURE CYCLING STRESS MODELS
15
APPENDIX C: EQUIVALENCE OF STRESS TEST CONDITIONS
17
APPENDIX D: RELIABILITY DATA
18
2009 Q1 RELIABILITY REPORT
Page 1 of 61
1.0 OVERVIEW OF CYPRESS SEMICONDUCTOR, INC. TOTAL QUALITY MANAGEMENT SYSTEM
This report summarizes Cypress Semiconductor Product Reliability for the period of the 1st quarter of 2009. It
includes data from devices fabricated at both internal Cypress and external subcontractor wafer fabrication and
assembly facilities.
Cypress Semiconductor has established aggressive reliability objectives. The quality standard at Cypress is
zero defects, driven by a culture requiring continuous improvement in quality and reliability.
Product reliability is assured by a total quality management system. The quality management system is
described in detail in the Cypress Semiconductor Quality Manual (Cypress Semiconductor Document Number
90-00001). Key reliability-related programs of the total quality management system are: (1) design rule review
and approval; (2) control of raw materials and vendor quality; (3) manufacturing statistical process controls; (4)
"Maverick Lot" yield limits; (5) formal training and certification of manufacturing personnel; (6) qualification of
new products and manufacturing processes; (7) continuous reliability monitoring; (8) formal failure analysis and
corrective action; and (9) competitive benchmarking.
Product Reliability data is accumulated as a result of new product Qualification Test Plan activities (Cypress
Semiconductor Document Number 25-00040) as well as from the Reliability Monitor Program (Cypress
Semiconductor Document Number 25-00008). All reliability test samples are obtained from standard
production material. Sample selection is based on generic product families. These generic products are
designed with very similar design rules and manufactured from a core set of processes.
Reliability strategy requires that every failure that occurs during reliability testing be subjected to failure
analysis (Cypress Semiconductor Document Number 25-00039) to determine the failure mechanism.
Corrective action is then implemented to prevent future failures, resulting in continuous improvement in product
reliability.
Sabbas Daniel
Executive Vice-President, Quality
2009 Q1 RELIABILITY REPORT
Page 2 of 61
2.0 PRODUCT RELIABILITY
In product stress testing, the main emphasis is on the useful life section of the bathtub curve. The test
methodology used to predict the useful life period is a life test under a dynamic bias and at temperatures of
125°C or 150°C at the maximum specified use voltage of the product. The duration at these temperatures is
1,000 and 500 hours, respectively.
At Cypress, product reliability tests are performed as part of both the qualification processes and the standard
reliability monitoring program. Each fab site and technology family from each product line is sampled. These
reliability tests utilize the following stress factors to accelerate failure: temperature, current and /or voltage.
The product reliability tests currently employed at Cypress include Early Failure Rate (EFR) and Long Term
Failure Rate (LFR).
2.1
EARLY FAILURE RATE SUMMARY
Early Failure Rate Determination: High Temperature Operating Life testing (HTOL), for as long as 96
hours, is used to estimate device early failure rate. This stress will typically correspond to the first
2000 hours of device operation in a system environment. The remainder of the device’s lifetime is
characterized with extended LFR testing (See Section 3)
Test
:
Conditions :
Duration
:
Failure
:
High Temperature Operating Life Test (HTOL)
Dynamic Operating Conditions, VCC nominal + 15%, 150°C or 125°C.
48 hours HTOL at 150°C or 96 hours at 125°C.
(Refer to Appendix C for derating factor calculation)
A failure is any device that fails to meet data sheet electrical requirements.
Table 1. Early Failure Rate Summary
Technology
C9
Device Hours
3,218,736
L28
B53
R8
C8
R5
R95
R9
R7
S4
S8
Grand Total
94,512
15,006
1,266,442
289,011
275,328
1,007,217
785,937
269,112
727,728
441,251
7,949,029
# Failed
31
FIT Rate
30
PPM
463
0
0
2
0
0
0
1
0
0
0
34
Insufficient
Insufficient
7
19
20
5
8
20
7
12
13
0
0
93
0
0
0
37
0
0
0
174
Failure Mode
No visual defect-4,
Fab defect-27 (see Note 2)
None
None
Fab defect-2 (see Note 3)
None
None
None
Fab defect-1 (see Note 4)
None
None
None
See above
Notes: 1) Insufficient data – interpret as insufficient accumulated life-time hours to project a 60%confidence bound for a zero-fails sample.
2) CAR 200840004 – DDLI (Local Interconnect OPC) improvement
3) CAR 200838014 & 200842019 – Improve cleaning process
4) CAR 200813026 – Tungsten flakes reduction
.
2009 Q1 RELIABILITY REPORT
Page 3 of 61
2.2
LONG TERM FAILURE RATE SUMMARY
A High Temperature Operating Life test (HTOL) is used to estimate long-term reliability. By operating
the devices at accelerated temperature and voltage, hundreds of thousands of use hours can be
compressed into hundreds of test hours.
Test
:
Conditions :
Duration
:
Failure
Fit Rate
:
:
High Temperature Operating Life Test (HTOL)
Dynamic Operating Conditions, VCC nominal +15% 150°C or 125°C.
A minimum of 80 hours at 150°C or 168 hours at 125°C
Generally 500 hours at 150°C or 1000 hours at 125°C.
(Refer to Appendix C for derating factor calculation)
A failure is any device that fails to meet data sheet electrical requirements.
Derated to 55° C ambient, with 60% upper confidence bound for 0 failures,
Ea =0.7ev (Refer to Appendix A)
Table 2. Long Term Failure Rate Summary
Technology
B53
L28
C8
C9
R5
R8
R9
S4
S8
R7
R95
Grand Total
Note:
Device Hours
288,808
192,192
235,587
1,349,163
110,160
859,907
780,384
2,223,738
740,599
572,248
541,074
7,893,860
# Failed
0
0
0
0
0
0
0
0
0
0
0
0
FIT Rate
19
28
23
4
Insufficient
6
7
2
7
9
10
1
Failure Mode
None
None
None
None
None
None
None
None
None
None
None
None
Insufficient data – interpret as insufficient accumulated life-time hours to project a 60% confidence bound for a zero-fails sample.
2009 Q1 RELIABILITY REPORT
Page 4 of 61
2.3
DATA RETENTION SUMMARY
A high-temperature, non-biased bake test ensures that data retention meets established reliability
goals. The devices are baked without bias at either 165oC for plastic-packaged devices, or 250oC for
hermetically-packaged devices. DRET is performed on programmed devices to establish a failure rate
for cell charge loss. The reliability at nominal system ambient temperature is related to the failure rate
at elevated temperatures through the Arrhenius equation.
Test
:
Conditions :
Duration
:
Failure
:
Data Retention Testing (DRET)
High temperature non-biased bake
A minimum of 500 hours at 150°C or 168 hours at 165°C
Generally 1000 hours at 150°C or 500 hours at 165°C.
Devices are programmed with a worst case program pattern before being
subjected to data retention testing. The memory pattern is verified at each
readpoint and any device with altered bits is classified a failure.
Table 3. Data Retention Summary
Technology
L28
S4
S8
Grand Total
Sample Size
154
5,194
2,712
8,060
Device-Hours # Failed
77,000
0
2,054,996
0
1,095,843
0
3,227,839
0
PPM
0
0
0
0
Failure Mode
None
None
None
None
Note: Insufficient data – interpret as insufficient accumulated life-time hours to project a 60%confidence bound for a zero-fails sample.
2009 Q1 RELIABILITY REPORT
Page 5 of 61
3.0
PACKAGE RELIABILITY
Package-level reliability testing refers to the assessment of the overall reliability of the device in packaged
form. This consists of subjecting packaged samples to reliability tests that expose the various sample sets to
different stress conditions, after which the samples are tested for any degradation.
At Cypress, package reliability tests are performed as part of the qualification processes and as part of the
standard reliability monitoring program. The reliability test employed is chosen based on the failure
mechanism, as different stress tests accelerate different failure mechanisms. These reliability tests utilize one
or more of the following stress factors to accelerate failure: temperature, moisture or humidity, current, voltage,
and pressure. The package reliability tests currently employed at Cypress include Pressure Cooker Test (PCT,
Highly Accelerated Stress Test (HAST), Temperature Cycle Test (TCT), and High Temperature Storage (HTS).
Figure 1 shows the Cypress package reliability stress flow.
Surface-mount samples are preconditioned per Jedec Std JESD22-A113 prior to package reliability testing.
This is required prior to TCT, PCT and HAST testing. Preconditioning simulates the board mounting process of
the customer. It normally consists of a temperature cycle to simulate exposure to different temperatures during
shipping, a bake to drive away the moisture inside the packages of the samples, a soak to drive a controlled
amount of moisture into the package, and three cycles of convection reflow. Packages are soaked and
reflowed based on their shipping moisture sensitivity classification. The samples are tested (acoustic and
electrical) after preconditioning, failures from which are considered as preconditioning failures and not reliability
failures. Preconditioning failures should be taken seriously, since these imply that the samples are not robust
enough to withstand the board mounting process.
Cypress conducts all major classes of package reliability tests on each of its package families. The package
characteristics and assembly locations are the primary considerations when grouping packages into package
families. A package family may consist of a group of 44-lead to 144-lead TQFP packages manufactured at a
particular manufacturing location.
Initial
Electrical Testing
Time Zero
Acoustic Analysis
(serialized 15 units)
Moisture
Pre-conditioning
Post Pre-Con
Electrical Testing
Post Pre-Con
Acoustic Analysis
(same serialized units)
Temperature Cycle Test
(TCT)
(500, 1000 cycles)
Pressure Cooker Test
(PCT)
(168 hours)
Highly Accelerated
Stress Test (HAST)
(128 hours)
High Temperature
Storage (HTS)
(500, 1000 hours)
Post Stress
Electrical Testing
Figure 1. Cypress Package Reliability Stress Flow
2009 Q1 RELIABILITY REPORT
Page 6 of 61
3.1
PRESSURE COOKER TEST (PCT)
The Pressure Cooker Test is a highly accelerated packaging stress test used to ensure environmental
durability of epoxy-packaged parts. Passivation cracks, ionic contamination, and corrosion
susceptibility are all accelerated by this stress.
Conditions
Pre-Conditioning
:
:
Failure Modes
Failure Mechanism
:
:
15 PSIG, 121°C, No bias, for a minimum of 168 hours.
5 cycles Temperature Cycle –65/+150, 24 hr Bake 125°C, Moisture
loading to qualified MSL level
Parametric shifts, high leakage, and/or catastrophic
Die corrosion or contaminants such as foreign material on or within
the package materials. Poor package sealing.
Table 4. Pressure Cooker Test Failure Rate Summary
Package
FBGA (0.75-0.8, 0.3mm)
FBGA (0.75-0.8, 0.3mm, Pb-free)
FBGA (1.0-1.27)
FLIPCHIP CSP (Pb-Free)
PBGA (with Heat Spreader)
PDIP
PDIP (Pb-Free)
PLCC
PLCC (Pb-Free)
PQFP (Pb-Free)
QFN (0.4mm, Saw Type, Pb-free)
QFN (0.6mm, Punch Type, Pb-Free)
QFN (0.6mm, Saw Type, Pb-Free)
QFN (COL, 0.6mm, Saw Type, Pb-free)
QFN (Punch Type, Pb-Free)
QFN (Saw Type, Pb-free)
QSOP (Pb-Free)
RTSOP (Pb-free)
SNC (Pb-Free)
SOIC
SOIC (J-Lead)
SOIC (J-Lead, Pb-Free)
SOIC (Pb-Free)
SSOP (Pb-Free)
TQFP
TQFP (10mm X 10mm)
TQFP (Pb-Free)
TQFP (Thermal)
TQFP (Thermal, Pb-Free)
TSOP (Pb-free)
EXPOSED TSOP (Pb-free)
TSOP I (Pb-Free)
TSOP II
TSOP II (Pb-Free)
TSSOP
TSSOP (Pb-Free)
VFBGA (0.75-0.8, 0.3mm)
VFBGA (0.75-0.8, 0.3mm, Pb-Free)
Grand Total
Sample Size
80
154
255
436
240
0
160
400
80
80
157
238
861
239
478
620
239
161
291
320
228
399
2,393
1,572
160
0
1,272
240
50
636
0
239
0
984
319
554
80
1,037
15,652
# Failed Defects %
Failure Mode
0
0
None
0
0
None
0
0
None
0
0
None
18
7.50%
Cu Bridging-18 (see Note 1)
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
0
0
None
18
0.12%
See above
Notes: 1) CAR 200837011 – Enhance equipment to improve the manufacturability
2009 Q1 RELIABILITY REPORT
Page 7 of 61
3.2
HIGHLY ACCELERATED STRESS TEST (HAST)
Cypress uses HAST to accelerate temperature, humidity, bias failure mechanisms. This change was
necessary because our package reliability had improved to the point where the old 85°C/85% R.H.
temperature-humidity-bias testing would not induce failures. Failures are necessary to judge progress
and compare packaging changes. HAST testing has been shown to be at least twenty times more
accelerated then 85°C/85% R.H. temperature-humidity-bias testing.
Conditions
:
Pre-Conditioning
:
Failure Modes
:
Failure Mechanism :
Present Conditions: 130°C / 85% RH minimum power dissipation, for
a minimum of 128 hours.
5 cycles Temperature Cycle –65/+150, 24 hr Bake 125°C, Moisture
loading to qualified MSL level
Parametric shifts, high leakage, and/or catastrophic
Die corrosion or contaminants such as foreign material on or within
the package materials. Poor package sealing.
Table 5. Highly Accelerated Stress Test (HAST) Failure Rate Summary
Package
FBGA (0.75-0.8, 0.3mm)
FBGA (0.75-0.8, 0.3mm, Pb-free)
FBGA (1.0-1.27)
FLIPCHIP CSP (Pb-Free)
PBGA (with Heat Spreader)
PDIP
PDIP (Pb-Free)
PLCC
PLCC (Pb-Free)
QFN (0.4mm, Saw Type, Pb-free)
QFN (0.6mm, Punch Type, Pb-Free)
QFN (0.6mm, Saw Type, Pb-Free)
QFN (COL, 0.6mm, Saw Type, Pb-free)
QFN (Punch Type, Pb-Free)
QFN (Saw Type, Pb-free)
QSOP (Pb-Free)
RTSOP (Pb-free)
SNC (Pb-Free)
SOIC
SOIC (J-Lead)
SOIC (J-Lead, Pb-Free)
SOIC (Pb-Free)
SSOP (Pb-Free)
TQFP
TQFP (10mm X 10mm)
TQFP (Pb-Free)
TQFP (Thermal)
TQFP (Thermal, Pb-free)
TSOP (Pb-free)
TSOP I (Pb-Free)
TSOP II
TSOP II (Pb-Free)
TSSOP
TSSOP (Pb-Free)
VFBGA (0.75-0.8, 0.3mm)
Grand Total
2009 Q1 RELIABILITY REPORT
Sample Size
125
77
0
258
0
0
160
279
80
23
246
842
354
350
350
105
103
240
343
264
429
2,102
957
78
0
631
158
92
305
224
0
944
312
438
0
10,869
# Failed
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Defects %
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0.00%
Failure Mode
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
Page 8 of 61
3.3
TEMPERATURE CYCLE TEST (TC)
Differences in thermal expansion coefficients are accentuated by cycling devices through temperature
extremes. If the materials do not expand and contract equally, large stresses can develop. The
Temperature Cycle test stresses mechanical integrity by exposing a device to alternating temperature
extremes. Weakness and thermal expansion mismatches in die interconnections, die attach, and wire
bonds are often detected with this accelerated test.
Condition
:
Pre-Conditioning
:
Duration
:
Failure Mode
:
Failure Mechanism :
MIL-STD-883D, Method 1010, Condition B, -55°C to 125°C
MIL-STD-883D, Method 1010, Condition C, -65°C to 150°C
(Refer to Appendix C for derating factor calculation)
5 cycles Temperature Cycle –65/+150, 24 hr Bake 125°C, Moisture
loading to qualified MSL level
500 cycles minimum at Condition C,
1000 cycles minimum at Condition B
Parametric shifts and catastrophic failures
Wire bond, cracked or lifted die and package failure.
Table 6. Temperature Cycling Failure Rate Summary
Package
FBGA (0.75-0.8, 0.3mm)
FBGA (0.75-0.8, 0.3mm, Pb-free)
FBGA (1.0-1.27)
FBGA (1.0-1.27, Pb-free)
FLIPCHIP CSP (Pb-Free)
PBGA (with Heat Spreader)
PBGA (Cavity/Heat Sink)
PDIP
PDIP (Pb-Free)
Sample Size
160
231
962
420
2,284
478
151
0
1,710
# Failed
0
0
0
0
0
0
0
0
1
Defects %
0
0
0
0
0
0
0
0
0.06%
PLCC
PLCC (Pb-Free)
PQFP (Pb-free)
QFN (Open Cavity, Pb-free)
QFN (0.4mm, Saw Type, Pb-free)
QFN (0.6mm, Punch Type, Pb-Free)
483
394
350
230
538
5,778
0
0
0
0
0
8
0
0
0
0
0
0.14%
QFN (0.6mm, Saw Type, Pb-Free)
QFN (COL, 0.6mm, Saw Type, Pb-free)
QFN (Punch Type, Pb-Free)
QFN (Saw Type, Pb-free)
QSOP (Pb-Free)
RTSOP (Pb-free)
SNC (Pb-Free)
SOIC
SOIC (J-Lead)
SOIC (J-Lead, Pb-Free)
SOIC (Pb-Free)
SSOP (Pb-Free)
3,402
2,546
1,891
2,138
465
318
1,085
1,158
637
896
7,937
7,613
0
0
0
0
0
0
0
0
0
0
10
5
0
0
0
0
0
0
0
0
0
0
0.13%
0.07%
553
73
3,782
478
406
1,512
0
794
45
3,136
478
1,506
235
4,798
62,051
0
0
0
0
0
0
0
0
0
0
0
0
0
0
24
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0.04%
TQFP
TQFP (10mm X 10mm)
TQFP (Pb-Free)
TQFP (Thermal)
TQFP (Exposed Pad, Pb-free)
TSOP (Pb-free)
EXPOSED TSOP (Pb-free)
TSOP I (Pb-Free)
TSOP II
TSOP II (Pb-Free)
TSSOP
TSSOP (Pb-Free)
VFBGA (0.75-0.8, 0.3mm)
VFBGA (0.75-0.8, 0.3mm, Pb-Free)
Grand Total
Failure Mode
None
None
None
None
None
None
None
None
Lifted ball bond-1
(see Note 1)
None
None
None
None
None
Broken wedge-8
(see Note 2)
None
None
None
None
None
None
None
None
None
None
Cut wedge-10 (see Note 3)
Cut wedge-4 (see Note 3),
PO Metal Damage-1
None
None
None
None
None
None
None
None
None
None
None
None
None
None
See above
Notes: 1) CAR 200827014 – Improve Mold assembly process.
2) CAR 200831014 – Convert to Saw Singulation process.
3) CAR 200824016 – Increase mold compound cure time.
2009 Q1 RELIABILITY REPORT
Page 9 of 61
3.4
HIGH TEMPERATURE STORAGE (HTS)
A high-temperature, non-biased bake test is performed to determine the effect on devices of long-term
storage at elevated temperatures without any electrical stresses applied. The devices are baked
without bias at either or 150oC or 165oC for plastic-packaged devices. The reliability at nominal system
ambient temperature is related to the failure rate at elevated temperatures through the Arrhenius
equation.
Test
Conditions
Duration
Failure Mode
Failure Mechanism
:
:
:
:
:
High Temperature Storage (HTS)
High temperature non-biased bake
A minimum of 500 hours tested up to 1000 hours at 150°C
Parametric shifts and catastrophic failures
Lifted ball bonds due to gross intermetallic growth
Table 7. High Temperature Storage Failure Rate Summary
Package
FBGA (0.75-0.8, 0.3mm)
FBGA (0.75-0.8, 0.3mm, Pb-free)
FBGA (1.0-1.27)
FBGA (1.0-1.27, Pb-free)
FLIPCHIP CSP (Pb-Free)
PBGA (with Heat Spreader)
PBGA (Cavity/Heat Sink)
PDIP
PDIP (Pb-Free)
PLCC
PLCC (Pb-Free)
PQFP (Pb-free)
QFN (Open Cavity, Pb-free)
QFN (0.4mm, Saw Type, Pb-free)
QFN (0.6mm, Punch Type, Pb-Free)
QFN (0.6mm, Saw Type, Pb-Free)
QFN (COL, 0.6mm, Saw Type, Pb-free)
QFN (Punch Type, Pb-Free)
QFN (Saw Type, Pb-free)
QSOP (Pb-Free)
RTSOP (Pb-free)
SNC (Pb-Free)
SOIC
SOIC (J-Lead)
SOIC (J-Lead, Pb-Free)
SOIC (Pb-Free)
SSOP (Pb-Free)
TQFP
TQFP (10mm X 10mm)
TQFP (Pb-Free)
EXPOSED TSOP (Pb-free)
TSOP (Pb-free)
TSOP I (Pb-Free)
TSOP II
TSOP II (Pb-Free)
TSSOP
TSSOP (Pb-Free)
VFBGA (0.75-0.8, 0.3mm)
VFBGA (0.75-0.8, 0.3mm, Pb-Free)
Grand Total
2009 Q1 RELIABILITY REPORT
Sample Size
160
234
634
158
180
480
160
0
880
630
0
160
462
237
636
945
480
640
622
560
320
640
638
160
792
4,630
2,300
319
0
2,075
0
1,434
640
0
1,516
635
1,120
160
1,354
26,991
# Failed
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Defects %
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0.00%
Failure Mode
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
Page 10 of 61
APPENDIX A: FAILURE RATE CALCULATION
Thermal Acceleration Factors
Acceleration factors (AF) for thermal stresses (Early Failure Rate, Latent Failure Rate, Data Retention and
High Temperature Storage) are calculated from the Arrhenius equation)
AF = exp
Ea
k
1 - 1
Tu Tt
where :
Ea = Activation Energy of the defect mechanism
K = Boltzmann’s constant = 8.62 x 10 –5 eV/Kelvin
Tt is the junction temperature of the device under stress
Tu is the junction temperature of the device at use conditions
While there is no substitute for experimentally determining the activation energy, obtaining this information is
very difficult because few devices fail stress tests. In the absence of experimental data, the following literature
values are used.
2009 Q1 RELIABILITY REPORT
Page 11 of 61
APPENDIX A: FAILURE RATE CALCULATION (cont.)
Temperature-Humidity Acceleration Factors
Cypress estimates acceleration factors for temperature-humidity stresses (Pressure Cooker Test and Highly
Accelerated Stress Test) from a model developed by Hallberg and Peck (“Quality and Reliability Engineering
International”. Vol. 7, 1991).
-3
AF = RHt exp Ea
RHu
k
1 - 1
Tu Tt
where :
Tu = use environment junction temperature (°K)
Tt = test environment junction temperature (°K)
Ea = failure mechanism activation energy (0.9 for corrosion)
k = Boltzman’s Constant (8.62 x 10 –5 eV/oKelvin)
RHu = use environment relative humidity
RHt = test environment relative humidity
AF = acceleration factor
The Hallberg and Peck model requires the stress junction temperature and relative humidity as well as the use
temperature and relative humidity. To estimate the use relative humidity, we assume that the device room
temperature is 35 oC (95 oF) and the room relative humidity is 100%. From any Handbook of Chemistry and
Physics, the vapor pressure of water VP (water) at 35 oC is 41.175 mm Hg. If we assume that the device will
operate with a junction temperature of 70 oC (VP (water) at 70 oC is 233.7 mm Hg), the junction relative
humidity (RHj) is
RHj
= 100%
41.175
233.7
= 17.6%
The operating conditions of the devices are then 70 oC and 17.6% relative humidity.
Our Pressure Cooker Test (PCT) submits the devices to a temperature of 121 oC and 100% relative humidity.
Using the Hallberg and Peck model, the acceleration factor for the PCT stress can be calculated:
-3
AF =
2009 Q1 RELIABILITY REPORT
17.6
100
exp 0.9
k
1_ - 1_
343 394
= 9, 433
Page 12 of 61
APPENDIX A: FAILURE RATE CALCULATION (cont.)
The acceleration factor for HAST is calculated similarly, except that junction temperature heating effects must
be included when estimating the relative humidity at the die surface.
Assuming an average junction
temperature rise of 5 oC, the relative humidity at the die surface during 130 C HAST testing can be calculated.
VP (130 oC) = 2026.10 mm Hg
VP (135 oC) = 2347.26 mm Hg
RHj
= 85%
2026.10
2347.26
= 73.4%
-3
AF =
17.6
73.4
exp 0.9
k
1_ - 1_
343 408
= 9,261
Similarly, for 140 oC HAST testing,
VP (140 oC) = 2710.92 mm Hg
VP (145 oC) = 3116.76 mm Hg
RHj
= 85%
2710.92
3116.76
= 73.9%
-3
AF =
2009 Q1 RELIABILITY REPORT
17.6
73.9
exp 0.9
k
1_ - 1_
343 418
= 17,433
Page 13 of 61
APPENDIX A: FAILURE RATE CALCULATION (cont.)
Failure Rate Calculation
For all but LFR test, Cypress reports the failure rate in terms of ppm. Early life reliability is reported in terms of
ppm defective expected during the first year of use under typical use conditions. No upper confidence bound
will be used for this estimate. The ppm defective is the ratio of the number of rejects to the number of samples
and expressed in ppm.
PPM =
Total Rejects x 1,000,000
Total Samples
Intrinsic, or later life reliability, shall be reported using the exponential model, in terms of FITs, with a 60%
upper confidence bound for 0 failures or the demonstrated FIT estimate in the case there are failures.
FR (FIT) =χ2α, 2n +2 /(2 * AF * Device Hours) * 10 9
where:
χ2 α,2n +2 = Chi square factor for 2n +2 degrees of freedom at 60% confidence level.
n = number of failure.
AF = Thermal Acceleration factor and is calculated per Arrhenius equation assuming a 0.7eV activation energy.
Voltage acceleration factor is not included in failure rate calculation even though voltage acceleration may be
used during stress. Typical use conditions shall be considered to be 55°C ambient with a 15°C temperature
rise at the junction. Thus, use junction temperature is 70°C.
2009 Q1 RELIABILITY REPORT
Page 14 of 61
APPENDIX B: TEMPERATURE CYCLING STRESS MODELS
Two acceleration factor (AF) models are used to model temperature cycle failures. The model proposed by
Zelenka [1] and others uses the epoxy molding temperature (Tmold = 170 °C) and the minimum temperature
reached during temperature cycling , (Tmin).
m
AFbrittle =
Tmold - Tmin,stress
Tmold - Tmin,stress
The model constant, m, is experimentally calculated for each failure mechanism. The acceleration factor is
labeled ‘brittle’ because the derivation of this equation assumes brittle fracture mechanics. Basically, the
model assumed that cracks advance a little every time the maximum stress is reached. The maximum stress
is assumed to be proportional to the difference in temperature between the minimum and maximum stress
temperatures. For plastic-encapsulated devices, the stress is minimum during molding, (Tmold), and maximum
during the lowest temperature reached during temperature cycling, (Tmin).
The model constant, m, is a function of the failure mechanism.
Thin film cracking
Al/Au Intermetallic fractures
Chip-out (cratering) bond failures
m = 12 (Blish and Vaney [2])
m=4
m = 7 (Dunn and McPherson [3])
For ductile materials, dislocation movement dominates the fracture mechanics and a different model is used.
The second, and most widely accepted model, uses the difference between the minimum and maximum
temperatures during temperature cycle testing (Tmin and Tmax) to calculate an acceleration factor.
m
AFductile =
Tmax, stress - Tmin,stress
Tmax,use - Tmin,use
The model constant, ‘m’, is again experimentally calculated for each failure mechanism.
Coffin and Manson [4] developed this model from empirical observations of metal fatigue. In ductile materials,
if the applied stress is high enough, dislocations are produced. At the high temperature condition of the
temperature cycling stress, dislocations are forced towards one metal surface. At the low temperature, the
dislocations try to glide back to their original position, but many cannot because they became entangled with
other dislocations. After many cyles, these tangles grow until cracking, and finally failure, occurs. Both
minimum and maximum temperatures are important, because both contribute to dislocation movement and
entanglement. This model is recommended for any failures involving ductile materials. Model constants for
ductile failure follow.
Wirebond breakage
Solder Fatigue
2009 Q1 RELIABILITY REPORT
m = 5.16 (Cypress experimentation)
m = 2 (Blish and Vaney [2])
Page 15 of 61
APPENDIX B: TEMPERATURE CYCLING STRESS MODELS (cont.)
Our commercial devices are specified to operate between 0°C and 70 °C. Using this information, the
acceleration factor, AF, between use and Military Condition C stress testing (-65°C to 150°C), for the brittle,
thin film cracking failure mechanism and ductile, wire bond breakage failure mechanism can be calculated.
12
AF brittle
=
170 - (-65)
170 - 0
AF ductile
=
150 - (-65)
70 - 0
=
49
5.16
=
327
References:
[1] R.L. Zelenka, IEEE/IRPS, pp. 30-34, 1991
[2] R.C. Blish and P.R. Vaney, IEEE/IRPS, pp 22-29, 1991
[3] C.F. Dunn and J.W. McPherson, IEEE/IRPS, pp 252-258, 1990
[4] S.S. Manson, thermal Stress and Low-Cycle Fatigue, (Robert Krieger : Malabar, Florida), 1981.
2009 Q1 RELIABILITY REPORT
Page 16 of 61
APPENDIX C: EQUIVALENCE OF DIFFERENT STRESS TEST CONDITIONS
During stress testing, more than one set of test conditions were used. To account for this difference, stress
test hours or cycles at the lower stress condition were derated and then added to the total for the most severe
stress test condition.
Dynamic (HTOL)
HTOL (EFR/LFR) test is performed at 150 °C and 125 °C. Using the Arrhenius equation (Appendix A) and an
activation energy of 0.7 eV, the derating factor, DF, between 125°C and 150 °C can be calculated.
DF (between 125C and 150C) = exp
0.6 ____1 _______ - ______1______
k 150 + 15 + 273
125 + 15 + 273
= 0.326
The derating calculation assumes a 15 °C rise due to junction heating.
Temperature Cycling
Two different temperature cycling conditions were used to measure reliability, -65°C to 150°C and –55°C to
125°C. Using the brittle failure mechanism model with m = 12, the derating factor between -65°C to 150°C and
–55°C to 125°C is calculated.
12
DF
=
170 - (-55)
170 – (-65)
=
1.685
Using the ductile failure mechanism model with m = 5.16, the derating factor between -65°C to 150°C and –
55°C to 125°C is obtained.
5.16
DF
=
125 - (-55)
150 - (-65)
=
2.501
HAST
The derating factor between two HAST conditions, 140 °C / 85%RH and 130 °C / 85% RH is simply the ratio of
the acceleration factors (See Appendix A)
DF
2009 Q1 RELIABILITY REPORT
=
9,261_
17, 433
=
0.531
Page 17 of 61
APPENDIX D: RELIABILITY DATA
FROM:
TO:
3/29/2008
3/29/2009
Summary Detail -- EFR Performance Over Time
TECHNOLOGY
DIVISION
EVALNUM
TV
MID
080602
R6A
MID
080602
R6B
MID
080602
MID
MID
DEVICE
TEMP
VOLT
READOUT
DURATION
SS
REJECT
CY7C1061DV33
125
3.77
96
96
918
0
CY7C1061DV33
125
3.77
96
96
217
0
R6C
CY7C1061DV33
125
3.77
96
96
444
0
082106
R1
CY7C1021DV33
150
3.7
48
48
3910
0
082106
R2
CY7C1021DV33
150
3.7
48
48
3915
0
MID
082106
R3
CY7C1021DV33
150
3.7
48
48
3937
2
MID
082107
R1A
CY7C1041DV33-10ZSXIT
150
4.5
48
48
1393
0
MID
082107
R1B
CY7C1041DV33-10ZSXIT
150
4.5
48
48
1387
0
MID
082107
R1C
CY7C1041DV33-10ZSXIT
150
4.5
48
48
1389
0
MID
082107
R2A
CY7C1041DV33-10ZSXIT
150
4.5
48
48
1293
0
MID
082107
R2B
CY7C1041DV33-10ZSXIT
150
4.5
48
48
1292
0
MID
082107
R2C
CY7C1041DV33-10ZSXIT
150
4.5
48
48
1232
0
MID
082107
R3A
CY7C1041DV33-10ZSXIT
150
4.5
48
48
1350
0
MID
082107
R3B
CY7C1041DV33-10ZSXIT
150
4.5
48
48
1334
0
MID
082107
R3C
CY7C1041DV33-10ZSXIT
150
4.5
48
48
1375
0
FA
COMMENTS
C9
MID
MR081072
R1
CY7C1061DV33
125
3.77
96
96
473
0
MID
MR082045
R1
CY7C1021DV30-10ZSXI
150
3.77
48
48
999
0
MID
MR082045
R2
CY7C1021DV30-10ZSXI
150
3.77
48
48
999
0
MID
MR082045
R3
CY7C1021DV33-10ZSXI
150
3.77
48
48
6748
0
MID
MR082045
R3A
CY7C1021DV33-10ZSXI
150
3.77
48
48
6748
0
MID
MR082045
R4
CY7C1021DV33-10ZS
150
3.77
48
48
5390
1
MID
MR083057
R1
CY7C1041DV33-10ZSXI
150
3.77
48
48
12148
27
MID
MR091067
R1
CY7C1041DV33-10ZSXI
150
3.77
48
48
4916
1
MID
MR091067
R2
CY7C1041DV33-10ZSXI
150
3.77
48
48
3142
0
66949
31
Summary for Technology: C9
24
C9
records
C9
Sum
L28
DCD
081704
R1G
CY2309ESXI-1H
150
3.8
48
48
504
0
DCD
081704
R1H
CY2309ESXI-1H
150
3.8
48
48
504
0
DCD
081704
R1H
CY2309ESXI-1H
150
3.8
48
48
159
0
DCD
081704
R1I
CY2309ESXC-1H
150
3.8
48
48
504
0
DCD
MR082039
R1
CY2292FZX
150
3.8
48
48
298
0
L28
1969
0
Summary for Technology: L28
5
records
Sum
B53
CCD
MR083072
R1
CYRF6936-40LFXC
125
3.8
96
96
100
0
CCD
MR083072
R2
CYRF6936-40LFXC
125
3.8
96
96
197
0
B53
297
0
Summary for Technology: B53
Sum
2
records
L8
2009 Q1 RELIABILITY REPORT
Page 18 of 61
082106-3E1
No visual defect
MR082045-4E1
No visual defect
MR091067-1E1
No visual defect
Tungsten Short
Summary for Technology: L8
#REF!
records
Sum
L8
#REF!
#REF!
0
R8
CCD
073802
R1
CY62167DV30
125
2.4
96
96
4272
CCD
073802
R2
CY62167DV30
125
2.4
96
96
4515
0
CCD
073802
R3
CY62167DV30
125
2.4
96
96
4637
1
MID
082005
R1
CY62177DV30
125
2.4
96
96
1756
0
MID
082005
R2
CY62167DV30
125
2.4
96
96
1673
1
MID
083101
R1
CY62157D930A
150
2.4
96
96
3850
0
MID
MR082052
R1
CY62167DV30LL-55BVI
125
2.4
96
96
299
0
MID
MR083055
R1
CY62177DV30LL-55BAXI
125
2.4
96
96
299
0
MID
MR091063
R1
CY62157DV30LL-55ZSXI
125
2.4
96
96
299
0
R8
21600
2
Summary for Technology: R8
9
records
Sum
C8
CCD
MR081075
R1
CY7C65630-56LFXA
125
3.8
48
48
890
0
CCD
MR081075
R1
CY7C65630-56LFXA
125
3.8
72
24
3
0
CCD
MR081075
R1A
CY7C65630-56LFXA
125
3.8
48
48
1754
0
CCD
MR081075
R1A
CY7C65630-56LFXA
125
3.8
72
24
28
0
CCD
MR081075
R2
CY7C65630-56LFXA
125
3.3
48
48
1097
0
CCD
MR081075
R2
CY7C65630-56LFXA
125
3.3
72
24
55
0
CCD
MR081075
R2A
CY7C65630-56LFXA
125
3.3
48
48
1563
0
CCD
MR081075
R2A
CY7C65630-56LFXA
125
3.3
72
24
78
0
CCD
MR081075
R3
CY7C65630-56LFXA
125
3.3
48
48
2681
0
CCD
MR081075
R3
CY7C65630-56LFXA
125
3.3
72
24
29
0
CCD
MR081075
R4
CY7C65630-56LFXA
125
3.3
48
48
2728
0
CCD
MR081075
R4
CY7C65630-56LFXA
125
3.3
72
24
61
0
DCD
MR091049
R1
CYWB0124AB-BVXI
125
3.8
96
96
300
0
C8
11267
0
Summary for Technology: C8
13
records
Sum
R5
MID
080803
R1
CY2305CSXI-1H
150
3.8
24
24
3597
0
MID
080803
R4
CY2305CSXI-1H
150
3.8
24
24
1939
0
MID
080803
R4A
CY2305CSXI-1H
150
3.8
24
24
1936
0
MID
080803
R5
CY2305CSXA-1H
150
3.8
24
24
4000
0
R5
11472
0
0
Summary for Technology: R5
4
records
Sum
R95
MID
MR082051
R1
CY62128EV30LL-45ZXI
125
1.85
144
144
674
MID
MR082051
R2
CY62148ELL-45ZSXI
125
1.85
48
48
4909
0
MID
MR083068
R1
CY62157EV30LL-45ZSXI
125
1.85
96
96
8369
0
MID
MR083069
R1
CY62157EV30LL-45ZSXI
125
1.85
96
96
8100
0
R95
22052
0
Summary for Technology: R95
4
records
Sum
R9
MID
090201
R3
7C1450BC-RAZCB
150
2.7
48
48
107
0
MID
MR082051
R2
CY62148ELL-45ZSXI
125
1.85
48
48
4909
0
MID
MR082068
R1
CY7C1347G-133AXC
150
2.25
48
48
300
0
MID
090704
R4
7C15121YC-**GBBCB
150
2.7
96
96
1569
0
2009 Q1 RELIABILITY REPORT
Page 19 of 61
073802-3E1
Poor Salicidation
082005-2E1
Metal2 Damage
MID
084502
R2
CY7C1370FC
150
2.25
48
24
1432
0
MID
084502
R2
CY7C1370FC
150
2.25
24
24
1433
0
MID
084502
R1A
CY7C1370FC
150
2.25
48
24
1585
0
MID
084502
R1A
CY7C1370FC
150
2.25
24
24
1594
0
MID
084502
R1
CY7C1370D
150
2.25
48
24
7213
0
MID
084502
R1
CY7C1370D
150
2.25
24
24
7233
1
R9
27375
1
Summary for Technology: R9
10
records
Sum
R7
MID
MR083070
R1
CY7C1021CV33-10ZXC
150
2.3
24
24
299
0
MID
MR084083
R1
7A132101GC-RZWEB
150
2.3
24
24
10914
0
R7
11213
0
0
Summary for Technology: R7
2
records
Sum
S4
CCD
072502
R1A
CY8C294665-24PVXIES
125
5.5
96
96
334
CCD
072502
R1B
CY8C294665-24PVXIES
125
5.5
96
96
334
0
CCD
072502
R1C
CY8C294665AK-24PVXIE
125
5.5
96
96
334
0
CCD
072502
R2A
CY8C294665-24PVXIES
125
5.5
96
96
334
0
CCD
072502
R2B
CY8C294665-24PVXIES
125
5.5
96
96
334
0
CCD
072502
R2C
CY8C294665-24PVXIES
125
5.5
96
96
334
0
CCD
074006
R1
CY8C27443-12PVXE
150
5.5
48
48
198
0
CCD
081405
R1
CYONS1004L-LBXC
40
4.2
168
168
500
0
CCD
081405
R3
CYONS1004L-LBXC
40
4.2
168
168
500
0
CCD
081405
R4
CYONS1004L-LBXC
40
4.2
168
168
1000
0
CCD
MR082042
R1
CY8C29466-24PVXI
125
5.5
96
96
298
0
CCD
MR082043
R1A
CYONS10820-LBXC
40
4.2
192
192
308
0
CCD
MR082059
R1
CP6458BM
125
5.5
96
96
300
0
CCD
MR082067
R1
CY8C27443-24PVXI
125
5.5
96
96
300
0
CCD
MR083046
R1
CY8C24223A-24PVXI
125
5.5
96
96
302
0
CCD
MR083056
R1
CY8C244235A-24PVXIES
125
5.5
96
96
2179
0
CCD
MR083056
R1B
CY8C244235A-24PVXIES
125
5.5
96
96
681
0
CCD
MR083067
R1
CY8C21534-12PVXE
125
5.5
6
6
545
0
CCD
MR083067
R1A
CY8C21534-12PVXE
125
5.5
6
6
4229
0
CCD
MR083067
R2
CY8C21534-12PVXET
125
5.5
6
6
825
0
CCD
MR083067
R2A
CY8C21534-12PVXET
150
5
6
6
3998
0
MID
MR083075
R1
CY8C26443-24PVXI
125
5.5
96
96
299
0
CCD
MR084048
R1
CY8C24423A-24PVXI
125
5.5
96
96
296
0
CCD
MR084051
R1
CY8C26443-24PVXIT
125
5.5
96
96
300
0
CCD
MR084076
R1
CS6835AT
125
5.5
96
96
294
0
CCD
MR091047
R1
CY8C21334-24PVXI
125
5.5
96
96
300
0
CCD
MR091048
R1
CY8C24223A-24PVXI
125
5.5
96
96
299
0
DCD
MR091064
R1
CY25100KSXCF
150
3.8
48
48
1497
0
S4
21452
0
Summary for Technology: S4
28
records
Sum
S8
MID
071304
R10
7C1404B8BC-**RZWCB
150
3.3
48
48
813
0
MID
071304
R6A
CY14B104L
150
3
48
48
50
0
MID
071304
R8A
CY14B104L
150
2.7
48
48
932
0
2009 Q1 RELIABILITY REPORT
Page 20 of 61
084502-1E1
Tungsten Defect
MID
071304
R9
7C1404B6BC-**RZWCB
150
2.7
48
48
1316
0
MID
072403
R1
CYONS2001-LBXC
125
5.5
72
72
45
0
MID
072403
R1A
CYONS2001-LBXC
40
3.8
168
168
330
0
MID
072403
R2
CYONS2100-LBXC
40
3.8
168
168
330
0
MID
072403
R2A
CYONS2100-LBXC
125
3.8
72
72
665
0
MID
072403
R3
CYONS2110-LBXC
40
3.8
168
168
333
0
MID
072403
R3A
CYONS2110-LBXC
125
3.8
72
72
333
0
MID
072403
R3A1
CYONS2110-LBXC
125
3.8
72
72
367
0
CCD
083401
R1A
CY8C20466A
125
5
96
96
45
0
CCD
083401
R2
CY8C20466-24LQXI
150
5
48
48
45
0
CCD
083401
R3
CY8C20566-24PVXI
150
2.1
48
48
375
0
CCD
083401
R3
CY8C20566-24PVXI
150
2.1
48
48
375
0
CCD
083401
R3
CY8C20566-24PVXI
150
2.1
48
48
252
0
CCD
083401
R4A
CY8C20566-24PVXI
150
5.75
48
48
45
0
CCD
MR091065
R4
CY8C20466-24LQXI
150
2.1
48
48
1000
0
CCD
MR091065
R5
CY8C20466-24LQXI
150
2.1
48
48
608
0
CCD
MR091065
R5
CY8C20466-24LQXI
150
2.1
48
48
392
0
S8
8651
0
Summary for Technology: S8
Sum
2009 Q1 RELIABILITY REPORT
20
records
Page 21 of 61
Summary Detail -- LFR Performance Over Time
TECHNOLOGY
DIVISION
EVALNUM
TV
DEVICE
TEMP
VOLT
READOUT
DURATION
SS
REJECT
L8
#REF!
#REF!
L8
Summary for Technology: L8
#REF!
records
Sum
B53
CCD
MR083072
R1
CYRF6936-40LFXC
125
3.8
168
72
100
0
CCD
MR083072
R2
CYRF6936-40LFXC
125
3.8
168
72
196
0
CCD
MR084068
R1
CYRF6936-40LFXC
125
3.8
168
72
297
0
CCD
MR084068
R1
CYRF6936-40LFXC
125
3.8
1000
832
296
0
CCD
MR083072
R2
CYRF6936-40LFXC
125
3.8
1072
904
4
0
CCD
MR083072
R2
CYRF6936-40LFXC
125
3.8
1048
880
192
0
CCD
MR083072
R1
CYRF6936-40LFXC
125
3.8
1072
904
3
0
CCD
MR083072
R1
CYRF6936-40LFXC
125
3.8
1048
880
96
0
B53
1184
0
Summary for Technology: B53
8
records
Sum
L28
MID
080608
R1
CY2077EFSXC
150
5.75
80
42
118
0
MID
080608
R1
CY2077EFSXC
150
5.75
500
420
118
0
DCD
MR082039
R1
CY2292FZX
150
3.8
80
42
298
0
DCD
MR082039
R1
CY2292FZX
150
3.8
500
420
298
0
L28
832
0
0
Summary for Technology: L28
4
records
Sum
C8
DCD
072404
R3C
CYWB0124AB-BVXI
125
3.8
1000
832
59
DCD
080604
R1
CYWB0124AB-BVXI
125
2.5
1000
832
179
0
CCD
MR074065
R1
CY7C68013A-56PVXC
125
3.8
1000
832
300
0
C8
538
0
Summary for Technology: C8
3
records
Sum
C9
MID
080602
R6D
CY7C1061DV33
125
3.77
168
168
200
0
MID
080602
R6D
CY7C1061DV33
125
3.77
1000
832
200
0
MID
MR082045
R1
CY7C1021DV30-10ZSXI
150
3.77
80
80
997
0
MID
MR082045
R1
CY7C1021DV30-10ZSXI
150
3.77
500
420
995
0
MID
MR082045
R2
CY7C1021DV30-10ZSXI
150
3.77
80
80
997
0
MID
MR082045
R2
CY7C1021DV30-10ZSXI
150
3.77
500
420
997
0
MID
MR083057
R1
CY7C1041DV33-10ZSXI
150
3.77
80
80
498
0
MID
MR083057
R1
CY7C1041DV33-10ZSXI
150
3.77
500
420
495
0
C9
5379
0
Summary for Technology: C9
8
records
Sum
R5
MID
080803
R1
CY2305CSXI-1H
150
3.8
408
408
90
0
MID
080803
R2
CY2305CSXI-1H
150
3.8
408
408
90
0
MID
080803
R3
CY2305CSXI-1H
150
3.8
408
408
90
0
Summary for Technology: R5
2009 Q1 RELIABILITY REPORT
3
records
Page 22 of 61
FA
COMMENTS
R5
Sum
270
0
R8
MID
MR081061
R1
CY62167DV30LL-55BVXI
125
2.4
1000
832
299
0
MID
MR082052
R1
CY62167DV30LL-55BVI
125
2.4
168
72
299
0
MID
MR082052
R1
CY62167DV30LL-55BVI
125
2.4
1000
832
294
0
MID
MR083055
R1
CY62177DV30LL-55BAXI
125
2.4
168
72
299
0
MID
MR083055
R1
125
2.4
1000
832
299
0
125
3.8
168
72
300
0
125
3.8
1000
832
300
0
0
MID
MR084075
R1
MID
MR084075
R1
MID
MR083077
R1
CY62177DV30LL-55BAXI
CY62177DV30LL55BAXIT
CY62177DV30LL55BAXIT
7G62162DK-GBZIB
125
2.4
1024
856
1
MID
MR083077
R1
7G62162DK-GBZIB
125
2.4
1000
832
296
0
MID
082401
R1
CY62167DV30
125
2.4
1024
856
178
0
MID
082401
R2
CY62167DV
125
2.4
168
72
177
0
MID
082401
R1
CY62167DV30
125
2.4
168
72
178
0
MID
082401
R1
CY62167DV30
125
2.4
1024
856
178
0
R8
3098
0
TSMC025
#REF!
#REF!
0
Summary for Technology: R8
13
records
Sum
TSMC025
Summary for Technology: TSMC025
#REF!
records
Sum
R9
MID
MR073028
R1
CY7C1313BV18-250BZC
125
2.25
1024
856
30
MID
MR082051
R1
CY62128EV30LL-45ZXI
125
1.85
168
168
674
0
MID
MR082051
R1
CY62128EV30LL-45ZXI
125
1.85
1000
832
674
0
MID
MR082068
R1
CY7C1347G-133AXC
150
2.25
80
80
299
0
MID
MR082068
R1
CY7C1347G-133AXC
150
2.25
500
420
299
0
MID
MR083068
R1
CY62157EV30LL-45ZSXI
125
1.85
168
168
499
0
MID
MR083068
R1
CY62157EV30LL-45ZSXI
125
1.85
1000
832
499
0
R9
2974
0
Summary for Technology: R9
7
records
Sum
S4
DCD
081401
R1
CY25100KSXCF
150
3.8
80
32
116
0
DCD
081401
R1
CY25100KSXCF
150
3.8
500
420
115
0
CCD
081405
R1
CYONS1004L-LBXC
40
4.2
650
150
216
0
CCD
081405
R1
CYONS1004L-LBXC
40
4.2
500
420
223
0
CCD
081405
R3
CYONS1004L-LBXC
40
4.2
650
150
218
0
CCD
081405
R3
CYONS1004L-LBXC
40
4.2
500
420
223
0
CCD
081405
R4
CYONS1004L-LBXC
40
4.2
650
150
217
0
CCD
081405
R4
CYONS1004L-LBXC
40
4.2
500
500
221
0
CBD
082201
R1
CY8C22545-24AXI
125
5.5
168
72
120
0
CY8C22545-24AXI
125
5.5
1000
832
120
0
CY22393KFXI
150
3.8
80
32
116
0
0
CBD
082201
R1
DCD
082405
R1A
CCD
MR074066
R1
CY8C26443-24PVXI
125
5.5
1000
832
297
CCD
MR074067
R1
CY8C21534-24PVXIT
125
5.5
168
168
149
0
CCD
MR074067
R1
CY8C21534-24PVXIT
125
5.5
1000
832
148
0
CCD
MR081062
R1
CY8C21534-24PVXI
125
5.5
1048
880
366
0
CCD
MR082042
R1
CY8C29466-24PVXI
125
5.5
168
72
296
0
CCD
MR082042
R1
CY8C29466-24PVXI
125
5.5
1000
832
296
0
CCD
MR082043
R1A
CYONS10820-LBXC
40
4.2
650
570
290
0
2009 Q1 RELIABILITY REPORT
Page 23 of 61
CCD
MR082059
R1
CP6458BM
125
5.5
168
168
300
0
CCD
MR082059
R1
CP6458BM
125
5.5
1024
856
30
0
CCD
MR082059
R1
CP6458BM
125
5.5
1000
832
269
0
CCD
MR082067
R1
CY8C27443-24PVXI
125
5.5
168
72
300
0
CCD
MR082067
R1
CY8C27443-24PVXI
125
5.5
1024
856
300
0
CCD
MR083046
R1
CY8C24223A-24PVXI
125
5.5
168
72
298
0
CCD
MR083046
R1
CY8C24223A-24PVXI
125
5.5
1000
832
298
0
CCD
MR083056
R1
CY8C244235A-24PVXIES
125
5.5
168
72
1000
0
CCD
MR083056
R1
CY8C244235A-24PVXIES
125
5.5
1024
856
1
0
CCD
MR083056
R1
CY8C244235A-24PVXIES
125
5.5
1000
832
997
0
CCD
MR083067
R1
CY8C21534-12PVXE
125
5.5
1000
832
500
0
MID
MR083075
R1
CY8C26443-24PVXI
125
5.5
168
168
299
0
MID
MR083075
R1
CY8C26443-24PVXI
125
5.5
1000
832
299
0
MID
MR083076
R2
CY8C24423A-12PVXE
125
5.5
1000
552
500
0
CCD
MR084048
R1
CY8C24423A-24PVXI
125
5.5
192
96
296
0
CCD
MR084048
R1
CY8C24423A-24PVXI
125
5.5
1000
832
295
0
CCD
MR084051
R1
CY8C26443-24PVXIT
125
5.5
168
72
300
0
CCD
MR084051
R1
CY8C26443-24PVXIT
125
5.5
1000
832
300
0
CCD
MR084076
R1
CS6835AT
125
5.5
168
72
293
0
CCD
MR084076
R1
CS6835AT
125
5.5
1000
832
293
0
CCD
MR091048
R1
CY8C24223A-24PVXI
125
5.5
168
72
299
0
S4
11214
0
Summary for Technology: S4
39
records
Sum
S8
MID
071304
R10
7C1404B8BC-**RZWCB
150
3.3
80
32
119
0
MID
071304
R6A
CY14B104L
150
2.7
80
32
120
0
MID
071304
R6A
CY14B104L
150
2.7
500
420
120
0
MID
071304
R8A
CY14B104L
150
2.7
500
420
119
0
MID
071304
R9
7C1404B6BC-**RZWCB
150
2.7
500
420
120
0
MID
072403
R1A
CYONS2001-LBXC
125
3.8
180
12
225
0
MID
072403
R1A
CYONS2001-LBXC
125
3.8
300
120
224
0
MID
072403
R2A
CYONS2100-LBXC
125
3.8
180
12
448
0
MID
072403
R3A
CYONS2110-LBXC
125
3.8
180
12
225
0
MID
072403
R3A
CYONS2110-LBXC
125
3.8
300
120
225
0
CCD
083401
R1
CY8C20466A
125
2.1
168
72
180
0
CCD
083401
R2
CY8C20466-24LQXI
150
2.1
80
32
390
0
CCD
083401
R2
CY8C20466-24LQXI
150
2.1
500
420
390
0
CCD
083401
R4
CY8C20466-24LQXI
150
2.1
80
32
390
0
CCD
083401
R4
CY8C20466-24LQXI
150
2.1
500
420
390
0
CCD
083401
R5A
CY8C20466-24LQXI
150
2.1
80
32
390
0
CCD
083401
R5A
CY8C20466-24LQXI
150
2.1
500
420
390
0
CCD
084605
R2
CY8C20566-24PVXI
150
2.1
80
32
390
0
S8
4855
0
Summary for Technology: S8
18
records
Sum
R7
MID
MR083070
R1
CY7C1021CV33-10ZXC
150
2.3
512
432
298
0
MID
MR083070
R1
CY7C1021CV33-10ZXC
150
2.3
1012
844
298
0
MID
MR084083
R1
7A132101GC-**RZWEB
150
2.3
408
384
500
0
R7
1096
0
Summary for Technology: R7
Sum
2009 Q1 RELIABILITY REPORT
3
records
Page 24 of 61
R95
MID
MR082051
R1
CY62128EV30LL-45ZXI
125
1.85
168
24
674
0
MID
MR082051
R1
CY62128EV30LL-45ZXI
125
1.85
1000
832
674
0
MID
MR083068
R1
CY62157EV30LL-45ZSXI
125
1.85
168
72
499
0
MID
MR083068
R1
CY62157EV30LL-45ZSXI
125
1.85
1000
832
499
0
R95
2346
0
Summary for Technology: R95
Sum
2009 Q1 RELIABILITY REPORT
4
records
Page 25 of 61
Summary Detail -- DRET Performance Over Time
TECHNOLOGY
DIVISION
EVALNUM
TV
MID
080608
R1
MID
080608
R1
DEVICE
TEMP
VOLT
READOUT
CY2077EFSXC
150
0
500
CY2077EFSXC
150
0
1000
DURATION
SS
REJECT
500
77
0
500
77
0
L28
154
0
FA
COMMENTS
L28
Summary for Technology: L28
2
records
Sum
S4
DCD
071801
R2
CY22050FZXI
150
0
500
500
80
0
DCD
071801
R2
CY22050FZXI
150
0
1024
524
80
0
CCD
73401
R1A
CY8C21534
150
0
1024
524
30
0
CCD
073401
R1B
CY8C21534
150
0
1024
524
30
0
CCD
073401
R1C
CY8C21534
150
0
1024
524
30
0
CCD
073601
R1A
CY8C21534-24PVXI
150
0
500
500
26
0
CCD
073601
R1A
CY8C21534-24PVXI
150
0
2000
1000
26
0
CCD
073601
R1A
CY8C21534-24PVXI
150
0
1024
1024
26
0
CCD
073601
R1B
CY8C21534-24PVXI
150
0
500
500
26
0
CCD
073601
R1B
CY8C21534-24PVXI
150
0
2000
1000
25
0
CCD
073601
R1B
CY8C21534-24PVXI
150
0
1024
1024
26
0
CCD
073601
R1C
CY8C21534-24PVXI
150
0
500
500
26
0
CCD
073601
R1C
CY8C21534-24PVXI
150
0
2000
1000
26
0
CCD
073601
R1C
CY8C21534-24PVXI
150
0
1024
1024
26
0
CCD
073601
R2A
CY8C21534-24PVXI
150
0
500
500
26
0
CCD
073601
R2A
CY8C21534-24PVXI
150
0
2000
1000
26
0
CCD
073601
R2A
CY8C21534-24PVXI
150
0
1024
1024
26
0
CCD
073601
R2B
CY8C21534-24PVXI
150
0
500
500
26
0
CCD
073601
R2B
CY8C21534-24PVXI
150
0
2000
1000
26
0
CCD
073601
R2B
CY8C21534-24PVXI
150
0
1024
1024
26
0
CCD
073601
R2C
CY8C21534-24PVXI
150
0
500
500
26
0
CCD
073601
R2C
CY8C21534-24PVXI
150
0
2000
1000
26
0
CCD
073601
R2C
CY8C21534-24PVXI
150
0
1024
1024
26
0
CCD
073601
R3A
CY8C21534-24PVXI
150
0
500
500
26
0
CCD
073601
R3A
CY8C21534-24PVXI
150
0
2000
1000
26
0
CCD
073601
R3A
CY8C21534-24PVXI
150
0
1024
1024
26
0
CCD
073601
R3B
CY8C21534-24PVXI
150
0
500
500
26
0
CCD
073601
R3B
CY8C21534-24PVXI
150
0
2000
1000
26
0
CCD
073601
R3B
CY8C21534-24PVXI
150
0
1024
1024
26
0
CCD
073601
R3C
CY8C21534-24PVXI
150
0
500
500
26
0
CCD
073601
R3C
CY8C21534-24PVXI
150
0
2000
1000
26
0
CCD
073601
R3C
CY8C21534-24PVXI
150
0
1024
1024
26
0
CCD
074908
R2
CY8C21534
150
0
1024
524
77
0
CCD
080201
R1A
CY8C24494-24PVXI
150
0
500
500
33
0
CCD
080201
R1A
CY8C24494-24PVXI
150
0
1000
500
33
0
CCD
080201
R1B
CY8C24494-24PVXI
150
0
500
500
33
0
CCD
080201
R1B
CY8C24494-24PVXI
150
0
1000
500
33
0
2009 Q1 RELIABILITY REPORT
Page 26 of 61
-
CCD
080201
R1C
CY8C24494-24PVXI
150
0
500
500
33
0
CCD
080201
R1C
CY8C24494-24PVXI
150
0
1000
500
33
0
CCD
082001
R1
CY8C294665-24PVXI
150
0
500
500
80
0
CCD
082001
R1
CY8C294665-24PVXI
150
0
1000
500
80
0
CBD
082201
R1
CY8C22545-24AXI
150
0
500
500
85
0
0
CBD
082201
R1
CY8C22545-24AXI
150
0
1000
500
85
CCD
MR081032
R1
CY8C24533-24PVXI
150
0
500
500
78
0
CCD
MR081032
R1
CY8C24533-24PVXI
150
0
1000
500
78
0
CCD
MR082042
R1
CY8C29466-24PVXI
150
0
500
500
80
0
CCD
MR082042
R1
CY8C29466-24PVXI
175
0
408
120
80
0
CCD
MR082042
R1
CY8C29466-24PVXI
175
0
288
144
80
0
CCD
MR082042
R1
CY8C29466-24PVXI
175
0
144
144
80
0
CCD
MR082042
R1
CY8C29466-24PVXI
150
0
1000
500
80
0
CCD
MR082059
R1
CP6458BM
150
0
500
500
80
0
CCD
MR082059
R1
CP6458BM
175
0
408
408
79
0
CCD
MR082059
R1
CP6458BM
175
0
288
144
79
0
CCD
MR082059
R1
CP6458BM
175
0
144
144
79
0
CCD
MR082059
R1
CP6458BM
150
0
1000
500
80
0
CCD
MR082067
R1
CY8C27443-24PVXI
150
0
500
500
80
0
CCD
MR082067
R1
CY8C27443-24PVXI
175
0
288
144
78
0
CCD
MR082067
R1
CY8C27443-24PVXI
175
0
144
144
79
0
CCD
MR082067
R1
CY8C27443-24PVXI
150
0
1000
500
80
0
CCD
MR083046
R1
CY8C24223A-24PVXI
150
0
500
500
80
0
CCD
MR083046
R1
CY8C24223A-24PVXI
175
0
408
408
80
0
CCD
MR083046
R1
CY8C24223A-24PVXI
175
0
288
144
80
0
CCD
MR083046
R1
CY8C24223A-24PVXI
175
0
144
144
80
0
CCD
MR083046
R1
CY8C24223A-24PVXI
150
0
1000
500
80
0
CCD
MR083056
R1A
CY7C64215-28PVXC
150
0
500
500
80
0
CCD
MR083056
R1A
CY7C64215-28PVXC
175
0
408
120
80
0
CCD
MR083056
R1A
CY7C64215-28PVXC
175
0
288
144
80
0
CCD
MR083056
R1A
CY7C64215-28PVXC
175
0
144
144
80
0
CCD
MR083056
R1A
CY7C64215-28PVXC
150
0
1000
500
80
0
MID
MR083075
R1
CY8C26443-24PVXI
150
0
500
500
80
0
MID
MR083075
R1
CY8C26443-24PVXI
175
0
408
120
80
0
MID
MR083075
R1
CY8C26443-24PVXI
175
0
288
288
80
0
MID
MR083075
R1
CY8C26443-24PVXI
150
0
1000
500
80
0
CCD
MR084048
R1
CY8C24423A-24PVXI
150
0
500
500
76
0
CCD
MR084048
R1
CY8C24423A-24PVXI
175
0
408
200
77
0
CCD
MR084048
R1
CY8C24423A-24PVXI
175
0
288
288
77
0
CCD
MR084048
R1
CY8C24423A-24PVXI
150
0
1000
500
76
0
CCD
MR084051
R1
CY8C26443-24PVXIT
150
0
500
500
80
0
CCD
MR084051
R1
CY8C26443-24PVXIT
150
0
1000
500
80
0
CCD
MR084076
R1
CS6835AT
150
0
737
329
80
0
CCD
MR084076
R1
CS6835AT
150
0
500
500
80
0
CCD
MR084076
R1
CS6835AT
150
0
1000
500
80
0
CCD
MR091047
R1
CY8C21334-24PVXI
150
0
500
500
62
0
CCD
MR091047
R1
CY8C21334-24PVXI
175
0
408
200
80
0
CCD
MR091047
R1
CY8C21334-24PVXI
175
0
288
288
80
0
CCD
MR091048
R1
CY8C24223A-24PVXI
150
0
500
500
80
0
CCD
MR091048
R1
CY8C24223A-24PVXI
175
0
408
200
80
0
2009 Q1 RELIABILITY REPORT
Page 27 of 61
CCD
MR091048
R1
CY8C24223A-24PVXI
175
0
288
288
80
0
CCD
MR091048
R1
CY8C24223A-24PVXI
150
0
1000
500
80
0
S4
5194
0
Summary for Technology: S4
89
records
Sum
S8
MID
071304
R11A
7C1404B8BC-**RZWCB
150
0
500
500
80
0
MID
071304
R11A
7C1404B8BC-**RZWCB
150
0
1000
500
80
0
MID
071304
R12A
7C1404B8BC-**RZWC
150
0
500
500
80
0
MID
071304
R12A
7C1404B8BC-**RZWC
150
0
1000
500
80
0
MID
071304
R8
CY14B104L
150
0
500
500
77
0
MID
071304
R8
CY14B104L
150
0
1000
500
77
0
MID
072403
R1
CYONS2001-LBXC
150
0
168
168
77
0
MID
072403
R1
CYONS2001-LBXC
150
0
500
332
77
0
MID
072403
R1
CYONS2001-LBXC
150
0
1000
500
71
0
MID
072403
R2
CYONS2100-LBXC
150
0
500
500
76
0
MID
072403
R2
CYONS2100-LBXC
150
0
1000
500
64
0
MID
072403
R3
CYONS2110-LBXC
150
0
168
168
75
0
MID
072403
R3
CYONS2110-LBXC
150
0
500
332
74
0
MID
072403
R3
CYONS2110-LBXC
150
0
1000
500
61
0
CCD
083401
R1
CY8C20466A
150
0
500
500
76
0
CCD
083401
R1
CY8C20466A
150
0
1000
500
44
0
CCD
083401
R2
CY8C20466-24LQXI
150
0
500
500
77
0
CCD
083401
R2
CY8C20466-24LQXI
150
0
1000
500
77
0
CCD
083401
R4
CY8C20466-24LQXI
150
0
168
168
78
0
CCD
083401
R4
CY8C20466-24LQXI
150
0
400
232
78
0
CCD
083401
R4
CY8C20466-24LQXI
150
0
500
100
78
0
CCD
083401
R4
CY8C20466-24LQXI
150
0
1000
500
78
0
CCD
083401
R4A
CY8C20566-24PVXI
150
0
168
168
77
0
CCD
083401
R4A
CY8C20566-24PVXI
150
0
400
232
77
0
CCD
083401
R4A
CY8C20566-24PVXI
150
0
500
100
77
0
CCD
083401
R4A
CY8C20566-24PVXI
150
0
609
109
75
0
CCD
083401
R4A
CY8C20566-24PVXI
150
0
1000
500
75
0
CCD
083401
R4A
CY8C20566-24PVXI
150
0
1500
500
69
0
CCD
083401
R5
CY8C20566-24PVXI
150
0
500
500
78
0
CCD
083401
R5
CY8C20566-24PVXI
150
0
1000
500
78
0
CCD
084605
R2
CY8C20566-24PVXI
150
0
500
500
80
0
CCD
084605
R2
CY8C20566-24PVXI
150
0
1000
500
80
0
CCD
084605
R2
CY8C20566-24PVXI
150
0
1500
500
80
0
CCD
084605
R3
CY8C20566-24PVXI
150
2.1
500
500
77
0
CCD
084605
R3
CY8C20566-24PVXI
150
2.1
1000
500
77
0
CCD
084605
R3
CY8C20566-24PVXI
150
2.1
1500
500
77
0
S8
2712
0
Summary for Technology: S8
Sum
2009 Q1 RELIABILITY REPORT
36
records
Page 28 of 61
Summary Detail -- PCT Performance Over Time
BUILDKIT
ASSY SITE
EVALNUM
TV
T-OSE
MR082018
R1
FBGA (0.75-0.8, 0.3mm)
BA48CRALE
Summary for Package Family: FBGA (0.75-0.8, 0.3mm)
DEVICE
CY62137CVSL-70BAI
1
TEMP
VOLT
READOUT
SS
REJECT
121
0
168
80
0
80
0
FBGA (0.75-0.8, 0.3mm)
FBGA (0.75-0.8, 0.3mm, Pb-free)
BK48BWBLL
G-ASE
MR082010
R1
CY7C1021CV33-10BAXI
121
0
168
75
0
BK48DJALL
MR083050
R1
CY62177DV30LL-55BAXI
121
0
168
79
0
154
0
Summary for Package Family: FBGA (0.75-0.8, 0.3mm, Pb-free)
2
COMMENTS
records
Sum
G
FA
records
Sum
FBGA (0.75-0.8, 0.3mm, Pb-free)
FBGA (1.0-1.27)
BB100CAALE
G-ASE
MR081067
R1
CYP15G0101DXB-BBI
121
0
168
80
0
BB100EAALE
G-TAIWAN
MR082041
R1
CY7B994V-2BBI
121
0
168
80
0
BB144CALE
G-TAIWAN
NR072030
R2
CY7C0830AV-167BBC
121
0
168
48
0
BB144CALE
G-TAIWAN
NR072030
R3
CY7C0837AV-167BBC
121
0
168
47
0
FBGA (1.0-1.27)
255
0
Summary for Package Family : FBGA (1.0-1.27)
4
records
Sum
FLIPCHIP CSP (Pb-Free)
FN81AGAN
AU
NR081001
R3
CYWB0124ABX-FNXIT
121
0
96
89
0
FN81AGAN
AU
NR081001
R4
CYWB0124ABX-FNXIT
121
0
96
87
0
FN81AGAN
AU
NR081001
R5
CYWB0124ABX-FNXIT
121
0
96
81
0
FN81AGAN
AU
NR081001
R6
CYWB0124ABX-FDXIT
121
0
96
89
0
FN81AGAN
AU
NR081001
R7
CYWB0124ABX-FNXIT
121
0
96
90
0
436
0
Summary for Package Family: FLIPCHIP CSP (Pb-Free)
5
records
Sum
FLIPCHIP CSP (Pb-Free)
PBGA (with Heat Spreader)
BG119SALE
G-ASE
MR082021
R1
CY7C1354C-166BGC
121
0
168
80
18
BG119SALE
G-TAIWAN
MR083001
R1
CY7C1354C-166BGC
121
0
168
80
0
BG119SALE
G
MR084037
R1
CY7C1354C-166BGC
121
0
168
80
0
240
18
#REF!
#REF!
Summary for Package Family: PBGA (with Heat Spreader)
3
records
Sum
PBGA (with Heat Spreader)
PDIP
Summary for Package Family: PDIP
#REF!
records
Sum
PDIP
PDIP (Pb-Free)
PZ183DBGN
RA
MR083022
R1A
CY7C63723C-PXC
121
0
168
80
0
PZ183DBGN
RA
MR091008
R1
CY7C63723C-PXC
121
0
168
80
0
160
0
Summary for Package Family: PDIP (Pb-Free)
2
records
Sum
PDIP (Pb-Free)
PLCC
J32RBGAAGB
X-MMT
MR082017
R1
CY7B9911V-5JCT
121
0
168
80
0
J32RBGAAGB
X-MMT
MR083024
R1
CY7B991V-5JI
121
0
168
80
0
J32RBGAAGB
X-MMT
MR083024
R1
CY7B991V-5JI
121
0
336
80
0
J32RBGAAGB
X-MMT
MR083024
R1
CY7B991V-5JI
121
0
504
80
0
2009 Q1 RELIABILITY REPORT
Page 29 of 61
MR082021-1P1
Cu Bridging
J32RBGAAGB
X-MMT
MR083024
R1
Summary for Package Family: PLCC
CY7B991V-5JI
5
121
0
Sum
PLCC (Pb-Free)
JZ32RBGAN
672
80
0
400
0
80
0
80
0
168
80
0
PQFP (Pb-Free)
80
0
168
168
77
80
0
0
QFN (0.4mm, Saw Type, Pb-free)
157
0
records
PLCC
M-PHILIPPINES
MR081063
R1
Summary for Package Family: PLCC (Pb-Free)
CY7B991-5JXC
1
121
0
168
records
Sum
PLCC (Pb-Free)
PQFP (Pb-Free)
NZ52DXGAN
G-ASE
MR082061
R1
Summary for Package Family: PQFP (Pb-Free)
CY7C131-25NXC
1
121
0
records
Sum
QFN (0.4mm, Saw Type, Pb-free)
LN32AAAAAL
CA-Malaysia
82008
LN32AAAAAL
CA
MR091052
Summary for Package Family: QFN (COL, 0.6mm, Saw Type, Pbfree)
R1
R1
CY8C21434-24LCXI
CP7052BTT
2
121
121
0
0
records
Sum
QFN (0.6mm, Punch Type, Pb-Free)
LQ32DAGLL
CA
083401
R4
CY8C20466-24LQXI
121
0
168
77
0
MR082022
R1
CY8C20434-12LKXI
121
0
168
80
0
LK32AABAGL
L-KOREA
MR083006
Summary for Package Family: QFN (0.6mm, Punch Type, PbFree)
R1
CY8C20424-12LKXI
121
0
168
81
0
238
0
LK32AABAGL
L-KOREA
3
records
QFN (0.6mm, Punch Type, PbFree)
Sum
QFN (0.6mm, Saw Type, Pb-Free)
LQ32DAGLL
CA-MALAYSIA
082602
R1
CY8C23533-24LQXI
121
0
168
80
0
LQ32ACAAGL
MB
083909
R1
CY8C204345-12LQXI
121
0
168
80
0
LQ32ACAAGL
MB
083909
R2
CY8C204345-12LQXI
121
0
168
80
0
LQ24AAAAAL
RA
084602
R1
CY8C20324-12LQXI
121
0
168
77
0
LQ24AAAAAL
RA
084602
R4
CY8C20324-12LQXI
121
0
168
80
0
LQ24ADAAGL
CA
084701
R1
CY8CTST200-24LQXI
121
0
168
77
0
LQ24ADAAGL
CA
084701
R1
CY8CTST200-24LQXI
121
0
288
76
0
LQ24ADAAGL
CA
084701
R2
CY8C20366-24LQXI
121
0
168
76
0
LQ24ADAAGL
CA
084701
R3
CY8C20346-24LQXI
121
0
168
75
0
LQ24ABAAL
AT-INDNS
MR082030
R1
CY8C20334-12LQXI
121
0
168
80
0
LQ24ABAAL
AT-THAILAND
MR083053
R1
CY8C20324-12LQXI
121
0
168
80
0
QFN (0.6mm, Saw Type, Pb-Free)
861
0
Summary for Package Family: QFN (0.6mm, Saw Type, Pb-Free)
11
records
Sum
QFN (COL, 0.6mm, Saw Type, Pb-free)
LG16AAAAL
M-PHILS
MR082028
R1
CY8C20234-12LKXI
121
0
168
80
0
LG16AAAAL
MR083048
R1
CY8C20122-LDX2I
121
0
168
79
0
R1
CY8C20234-12LKXI
121
0
168
80
0
QFN (COL, 0.6mm, Saw Type, Pbfree)
239
0
M-PHILS
LG16AAAAL
M
MR084013
Summary for Package Family: QFN (COL, 0.6mm, Saw Type, Pbfree)
3
records
Sum
QFN (Punch Type, Pb-Free)
LY32BGAGL
RA
083604
R1
CY8C21434-24LFXI
121
0
168
80
0
LY32BGAGL
RA-CML
083905
R1
CY8C21434-24LFXI
121
0
168
80
0
LY56AGAGL
L-KOREA
MR082031
R1
CY7C65630-56LFXC
121
0
168
80
0
LY32AAAGR
L-KOREA
MR082048
R1
CG6672AMT
121
0
168
80
0
L
MR084009
R1
CS6656AAT
121
0
168
78
0
LY68AGABGL
2009 Q1 RELIABILITY REPORT
Page 30 of 61
LY68AGAAGL
L
MR091024
R1
Summary for Package Family: QFN (Punch Type, Pb-Free)
CY8CLED04-68LFXI
6
121
0
168
80
0
478
0
records
Sum
QFN (Punch Type, Pb-Free)
QFN (Saw Type, Pb-free)
LT32BGAGL
RA-CML
082902
R1
CY8C21434-24LTXI
121
0
168
77
0
LT40ACAAGL
AE
084006
R1
CYRF6936-40LTXC
121
0
168
74
0
LT40ACAAGL
AE
084006
R3
CYRF6936-40LTXC
121
0
168
79
0
LT40ACAAGL
AE
084006
R4
CYRF6936-40LTXC
121
0
168
80
0
LT32BAAAGL
CA-THAILAND
MR083038
R1
CG7032AA
121
0
168
80
0
LT32BAAAGL
CA-MALAYSIA
NR082002
R1
CY8C21434-24LTXI
121
0
168
76
0
LT32BAAAGL
CA-MALAYSIA
NR082002
R2
CY8C21434-24LTXI
121
0
168
77
0
LT32BAAGL
CA-MALAYSIA
NR082002
R3
CY8C21434-24LTXI
121
0
168
77
0
620
0
Summary for Package Family: QFN (Saw Type, Pb-free)
8
records
Sum
QFN (Saw Type, Pb-free)
QSOP (Pb-Free)
SQ2414AGN
R-CML
MR082036
R1
CY7C63823-QXC
121
0
168
80
0
SQ2414ABGN
R-CML
MR083023
R1
CY7C63743-QXC
121
0
168
79
0
SQ2414ABGN
R
MR091002
R1
CY7C63743C-QXC
121
0
168
80
0
239
0
Summary for Package Family: QSOP (Pb-Free)
3
records
Sum
RTSOP (Pb-free)
ZY28R2ALN
ZY28R2BLN
QSOP (Pb-Free)
R-CML
MR083030
R1
CY62256VNLL-70ZRXIT
121
0
168
81
0
R
MR091010
R1
CY62256NLL-70ZRXIT
121
0
168
80
0
161
0
Summary for Package Family: RTSOP (Pb-free)
2
records
Sum
RTSOP (Pb-free)
SNC (Pb-Free)
SY2831BBLN
R-CML
MR082037
R1
CY62256NLL-70SNXC
121
0
168
80
0
SY2831BBLN
R-CML
MR083016
R1
CY62256NLL-70SNXCT
121
0
168
79
0
SY2831BBLN
R
MR084004
R1
CG7107AM
121
0
168
52
0
SY2831BBLN
R
MR091007
R1
CY62256NLL-70SNXCT
121
0
168
80
0
291
0
Summary for Package Family: SNC (Pb-Free)
4
records
Sum
SNC (Pb-Free)
SOIC
S1615EAGB
M-PHILS
MR082014
R1
CY2309SC-1H
121
0
168
80
0
S1615EAGB
M
MR083010
R1A
CY2292SL-1V1
121
0
168
80
0
S1615KBAGN
RA
MR084023
R1
CY2292F
121
0
168
80
0
S0815PBAGN
RA
MR091017
R1
CY2305SI-1HT
121
0
168
80
0
320
0
Summary for Package Family: SOIC
4
records
Sum
SOIC
SOIC (J-Lead)
V243GAAAGN
X
090302
R1
CY7C197BN-15VC
121
0
168
77
0
V243GAAAGN
X
090302
R2
CY7C197BN-15VC
121
0
168
71
0
V243GAAGN
X
090302
R4
CY7C197BN-15VC
121
0
168
80
0
228
0
Summary for Package Family: SOIC (J-Lead)
3
records
Sum
SOIC (J-Lead)
SOIC (J-Lead, Pb-Free)
VZ3646BGLL
R-CML
MR082009
R1
CY7C1049CV33-10VXC
121
0
168
80
0
VZ28313BLN
R-CML
MR082056
R1
CY7C1399BN-12VXC
121
0
168
80
0
VZ28313BLN
R-CML
MR083003
R1
CY7C1399BN-12VXC
121
0
168
80
0
VZ444AABLL
R-CML
MR083035
R1
CY7C1021DV33-10VXI
121
0
168
79
0
2009 Q1 RELIABILITY REPORT
Page 31 of 61
VZ28313BLN
R
MR084019
R1
Summary for Package Family: SOIC (J-Lead, Pb-Free)
CY7C1399BN-12VXIT
5
121
0
168
80
0
399
0
records
Sum
SOIC (J-Lead, Pb-Free)
SOIC (Pb-Free)
SZ815CGAN
M - Manila
080803
R1
CY2305CSXI-1H
121
0
168
80
0
SZ815CGAN
M - Manila
080803
R2
CY2305CSXI-1H
121
0
96
80
0
SZ815CGAN
M - Manila
080803
R2
CY2305CSXI-1H
121
0
168
80
0
SZ815CGAN
M - Manila
080803
R3
CY2305CSXI-1H
121
0
168
80
0
SZ1615DGN
M-Amkor
081907
R1
CY2309CSXI-1H
121
0
168
79
0
SZ324513BN
R
082007
R1
CY7C53120E4-40SXIES
121
0
96
77
0
SZ1615NAGN
CA-MALAYSIA
082203
R1
CY8C20180-SX2I
121
0
168
80
0
SZ324516LL
R-CML
MR082005
R1
CY62148ELL-55SXI
121
0
168
80
0
SZ28327BGL
R-CML
MR082006
R1
CY8C27443-24SXI
121
0
168
80
0
SZ183CGAN
RA-CML
MR082012
R1
CY7C63723C-SXC
121
0
168
79
0
SZ1615KGN
RA-CML
MR082015
R1
CY2309SXC-1HT
121
0
168
80
0
SZ1615FAL
T-OSE
MR082016
R1
CY8C201A0-SX2I
121
0
168
80
0
SZ1815CGAN
M-PHILS
MR082023
R1
CY8C24123A-24SXI
121
0
168
80
0
SZ1615EGN
M-PHILS
MR082025
R1
CY2309NZSXC-1H
121
0
168
80
0
SZ24312BGN
R-CML
MR082057
R1
CY7C63743C-SXC
121
0
168
80
0
SZ1615DGN
M-PHILS
MR083009
R1
CY2292SXL-1X6T
121
0
168
80
0
SZ324516BL
R-CML
MR083017
R1
CY62148ELL-55SXIT
121
0
168
80
0
SZ28327BGL
R-CML
MR083018
R1
CY8C27443-24SXIT
121
0
168
80
0
SZ183CBGAN
RA-CML
MR083019
R1
CY7C63723C-SXC
121
0
168
80
0
SZ24315BGN
RA-CML
MR083025
R1
CY7C63823-SXC
121
0
168
80
0
SZ815PABGN
RA-CML
MR083034
R1
CY2305SXC-1H
121
0
168
81
0
SZ1615FAL
T-TAIWAN
MR083041
R1
CY23EP09SXC-1H
121
0
168
79
0
SZ815DAGN
M
MR084018
R1
CY2304SXI-2
121
0
168
79
0
SZ183CBGAN
RA
MR084026
R1
CY7C63723C-SXC
121
0
168
80
0
SZ24315BGN
RA
MR084029
R1
CY7C63743C-SXC
121
0
168
80
0
SZ2035BAL
R
MR091001
R1
CY8C27243-24SXI
121
0
168
80
0
SZ32457BLN
R
MR091004
R1
CY62128ELL-45SXIT
121
0
168
80
0
SZ1615BKGN
RA
MR091016
R1
CY2308SXC-2T
121
0
168
80
0
SZ1615EGN
M
MR091020
R1
CY2309SXI-1HT
121
0
168
79
0
SZ815PAGN
RA-CML
NR081002
R14
CY22560SXI
121
0
168
80
0
2393
0
Summary for Package Family: SOIC (Pb-Free)
30
records
Sum
SSOP (Pb-Free)
SP28215GGL
SOIC (Pb-Free)
RA-CML
081213
R1
CY8C24533-24PVXI
121
0
168
77
0
SP483AGAN
R
084703
R1
CY8C20566-24PVXI
121
0
168
77
0
SP483AGAN
R
084703
R1
CY8C20566-24PVXI
121
0
288
76
0
SP483ACGAN
R
084703
R2
CY8CTMG200-48PVXI
121
0
168
77
0
SP483ACGAN
R
084703
R2
CY8CTMG200-48PVXI
121
0
288
75
0
SP483ACGAN
R
084703
R3
CY8C20546-24PVXI
121
0
168
77
0
SP483ACGAN
R
084703
R3
CY8C20546-24PVXI
121
0
288
75
0
SP202AAAGN
RA-CML
MR082007
R1
CP6650AMT
121
0
168
80
0
SP563BBBGL
R-CML
MR082008
R1
CY7C68300C-56PVXC
121
0
168
79
0
SP28214GL
T-OSE
MR082013
R1
CY8C26443-24PVX
121
0
168
80
0
SP2822BGL
M-PHILS
MR082038
R1
CY8C24423A-12PVXE
121
0
168
80
0
SP483HAAGR
M-PHILS
MR082071
R1
CY14B101L-SP45XC
121
0
168
80
0
SP2822BGL
M-PHILS
MR083008
R1
CY8C21534-12PVXET
121
0
96
80
0
2009 Q1 RELIABILITY REPORT
Page 32 of 61
-
SP563BBBG
R-CML
MR083011
R1
CY7C68013-56PVXC
121
0
168
80
0
SP28215BGL
RA-CML
MR083021
R1
CY8C21534-24PVXI
121
0
168
80
0
SP28215BGL
RA-CML
MR083021
R1
CY8C21534-24PVXI
121
0
672
80
0
SP28214GL
T-TAIWAN
MR083036
R1
CY8C9520A-24PVXI
121
0
168
80
0
SP2824HAN
T
MR084021
R1
CY8C24533-24PVXI
121
0
168
79
0
SZ183CBGAN
RA
MR091003
R1
CY7C63723C-SXC
121
0
168
80
0
SP483EBBAL
R
MR091005
R1
CY8C27643-24PVXI
121
0
168
80
0
SP2822BGL
M
MR091006
R1
CY8C27443-12PVXE
121
0
96
80
0
SP2822BGL
M
MR091042
R1
CP6801ATT
121
0
96
80
0
A32LXGXGB
Q
MR091043
R1
CY29948ACT
121
0
168
80
0
1572
0
Summary for Package Family: SSOP (Pb-Free)
20
records
Sum
SSOP (Pb-Free)
TQFP
A32LXGXGB
Q-KOREA
MR082024
R1
CY29948AC
121
0
168
80
0
A32LXGXGB
Q-KOREA
MR083012
R1
CY29948AI
121
0
168
80
0
160
0
#REF!
#REF!
Summary for Package Family: TQFP
2
records
Sum
TQFP
TQFP (10mm X 10mm)
Summary for Package Family: TQFP (10mm X 10mm)
#REF!
records
Sum
TQFP (10mm X 10mm)
TQFP (Pb-Free)
AZ44SGGAN
R
082201
R1
CY8C22545-24AXI
121
0
168
77
0
AZ32BXGAN
Q-KOREA
MR081015
R1A
CY7C4201V-15AXC
121
0
168
80
0
AZ32GXGAN
G-TAIWAN
MR081051
R1A
CY29942AXCT
121
0
168
80
0
AZ128SABLL
R-CML
MR082004
R1
CY7C68013A-128AXC
121
0
168
80
0
AZ32GXGAN
G-ASE
MR082020
R1
CY29942AXI
121
0
168
80
0
AZ44SGGAN
R-CML
MR082040
R1
CS6567AM
121
0
168
80
0
AZ100SFA
R-CML
MR082049
R1
CY7C024-25AXC
121
0
168
80
0
AZ32BXGAN
Q-KOREA
MR082054
R1
CY7C4251V-15AXC
121
0
168
80
0
AZ44SGGAN
R-CML
MR082060
R1
CS6567AM
121
0
168
80
0
AZ44SGGAN
R-CML
MR083014
R1
CS6567AM
121
0
168
80
0
AZ32BXGAN
Q-KOREA
MR083031
R1
CY7C4251V-25AXC
121
0
168
80
0
AZ100SEAL
RA-CML
MR083032
R1
CY7B994V-5AXI
121
0
168
79
0
AZ100RBBLN
R
MR084002
R1
CY7C1370D-167AXI
121
0
168
79
0
AZ44SFGAN
R
MR084010
R1
CY37032P44-125AXC
121
0
168
80
0
AZ32LXGAN
Q
MR084017
R1
CY29948AXC
121
0
168
80
0
L-KOREA
NR083001
R1
CY0823CC
121
0
168
77
0
1272
0
AZ120DGAGR
Summary for Package Family: TQFP (Pb-Free)
17
records
Sum
TQFP (Pb-Free)
TQFP (Thermal)
AT120ABAGE
Q-KOREA
NR072029
R1
CYS25G0101DX-ATXC
121
0
168
80
0
AT120ABAGE
Q-KOREA
NR072029
R2
CYS25G0101DX-ATXC
121
0
168
80
0
AT120ABAGE
Q-KOREA
NR072029
R3
CYS25G0101DX-ATXC
121
0
168
80
0
TQFP (Thermal)
240
0
168
50
0
TQFP (Thermal, Pb-Free)
50
0
Summary for Package Family: TQFP (Thermal)
3
records
Sum
TQFP (Thermal, Pb-Free)
AG120ABAGR
Q-KOREA
NR072017
Summary for Package Family: TQFP (Thermal, Pb-Free)
Sum
R2
CYS25G0101DX-ATXC
1
121
0
records
TSOP (Pb-free)
2009 Q1 RELIABILITY REPORT
Page 33 of 61
ZT28R4AGL
R-CML
080302
R3
CY7C1399BNL-12ZXC
121
0
168
80
0
ZT32RABALL
T-OSE
MR082019
R1
CY62128EV30LL-45ZXI
121
0
168
80
0
ZT28R4BGL
R-CML
MR083028
R1
CY7C1399BN-12ZXC
121
0
168
80
0
ZT28R4BGL
R-CML
MR083028
RIA
CY7C1399BN-12ZXC
121
0
168
80
0
ZT32RAEBLN
RA
MR084006
R1
CG6708AMT
121
0
168
80
0
ZT28R2BBLN
R
MR091012
R1
CY62256NLL-55ZXIT
121
0
168
80
0
ZT32RAEBLN
RA
MR091014
R1
CY62128EV30LL-45ZXI
121
0
168
77
0
ZT32RABALL
T
MR091021
R1
CY62128EV30LL-45ZXI
121
0
168
79
0
636
0
EXPOSED TSOP (Pb-free)
#REF!
#REF!
Summary for Package Family: TSOP (Pb-free)
8
records
Sum
TSOP (Pb-free)
EXPOSED TSOP (Pb-free)
Summary for Package Family: EXPOSED TSOP (Pb-free)
#REF!
records
Sum
TSOP I (Pb-Free)
ZB32RHALN
R-CML
MR082003
R1
CY62128EV30LL-45ZAXI
121
0
168
80
0
ZB32RHALL
R-CML
MR082053
R1
CY62128DV30LL-55ZAXI
121
0
168
79
0
ZB32RHBALN
R-CML
MR083042
R1
CY62128ELL-45ZAXI
121
0
168
80
0
239
0
#REF!
#REF!
Summary for Package Family: TSOP I (Pb-Free)
3
records
Sum
TSOP I (Pb-Free)
TSOP II
Summary for Package Family: TSOP II
#REF!
records
Sum
TSOP II (Pb-Free)
ZW544AALL
TSOP II
G-ASEK
MR081002
R1
CY7C1061AV33-12ZXC
121
0
168
76
0
ZW444AMBLN
R-CML
MR082002
R1
CY62146EV30LL-45SZSX
121
0
168
80
0
ZW324CBLL
T-OSE
MR082026
R1
CY62148ELL-45ZSXI
121
0
168
80
0
ZW544AALL
G-TAIWAN
MR082034
R1
CY7C1069AV33-10ZXC
121
0
168
80
0
ZW544AALL
G-TAIWAN
MR083002
R1
CY7C1069AV33-10ZX
121
0
168
108
0
ZW444AHBLL
R-CML
MR083020
R1
CY7C1021DV33-10ZSXI
121
0
168
80
0
ZW324CBLL
T-OSE
MR083043
R1
CY62148EV30LL-45ZSXI
121
0
168
80
0
ZW444AJBLN
R-CML
MR083071
R1
CY7C1021CV33-10ZXC
121
0
96
80
0
ZW444AJBLN
R-CML
MR083071
R1
CY7C1021CV33-10ZXC
121
0
168
80
0
ZW444AHBLL
R
MR084007
R1
CG6850AM
121
0
168
80
0
ZW324CBLL
T
MR084025
R1
CG7092AM
121
0
168
80
0
ZW544AALL
G
MR084038
R1
CY7C1061AV33-10ZXC
121
0
168
80
0
984
0
Summary for Package Family: TSOP II (Pb-Free)
13
records
Sum
TSOP II (Pb-Free)
TSSOP
Z1620GAGN
RA-CML
MR082029
R1
CY2309ZC-1H
121
0
168
80
0
Z1611XAGB
M-PHILS
MR082033
R1
CY2308ZC-1H
121
0
168
80
0
Z1620GAGN
RA-CML
MR083033
R1
CY2309ZC-1H
121
0
168
79
0
RA
MR084016
R1
CY2309ZC-1HT
121
0
168
80
0
319
0
Z1620GBAGN
Summary for Package Family: TSSOP
4
records
Sum
TSSOP (Pb-Free)
ZZ1620GAN
TSSOP
CML-RA
082004
R1
CY23EP09ZXC-1HT
121
0
168
74
0
ZZ1613HAN
T-OSE
MR082011
R1
CY2308ZXI-1HT
121
0
168
80
0
ZZ1620GAN
RA-CML
MR082032
R1
CY2308ZXI-1H
121
0
168
80
0
ZZ1620GBAN
RA-CML
MR083015
R1
CY22150FZXI
121
0
168
80
0
T-TAIWAN
MR083044
R1
CY24904ZXC
121
0
168
80
0
ZZ0812BGL
2009 Q1 RELIABILITY REPORT
Page 34 of 61
ZZ1620GBAN
ZZ0812BGL
RA
MR091018
R1
CY2309ZXC-1HT
121
0
168
80
0
T
MR091019
R1
CY25100ZXC38T
121
0
168
80
0
554
0
80
0
80
0
Summary for Package Family: TSSOP (Pb-Free)
7
records
Sum
TSSOP (Pb-Free)
VFBGA (0.75-0.8, 0.3mm)
BV48AAALE
G-TAIWAN
MR083013
R1
Summary for Package Family: VFBGA (0.75-0.8, 0.3mm)
CY62157DV30LL-55BVI
1
121
0
168
records
Sum
VFBGA (0.75-0.8, 0.3mm)
VFBGA (0.75-0.8, 0.3mm, Pb-Free)
BZ48DAGLL
RA-CML
MR082001
R1
CY62137FV30LL-45BVXI
121
0
168
80
0
BZ100CGAL
RA-CML
MR082027
R1
CYWB0124AB-BVXI
121
0
168
80
0
BZ56AGAL
G-TAIWAN
MR082035
R1
CY7C68013A-56BAXC
121
0
168
80
0
BZ48CQAALL
G-TAIWAN
MR082047
R1
CY62137FV30LL-45BVXI
121
0
168
80
0
BZ56IAAAGL
AT-INDS
MR082055
R1
CY7C68053-56BAXI
121
0
168
80
0
BZ48CFAALL
G-TAIWAN
MR083004
R1
CY62157EV30-45BVXIT
121
0
168
80
0
BZ56GABGL
RA-CML
MR083005
R1
CY7C68053-56BAXIT
121
0
168
80
0
BZ100CGAL
RA-CML
MR083029
R1
CYWB0124AB-BVXI
121
0
168
80
0
BZ48ABDALL
AT-CARSEM
MR083060
R1
CY62137EV30LL-45BVXI
121
0
168
77
0
BZ100CGAL
RA
RR083024
R1
CYWB0124AB-BVXIT
121
0
96
80
0
BZ100CGAL
RA
RR083024
R2
CYWB0124AB-BVXIT
121
0
96
80
0
BZ100CGAL
RA
RR083024
R3
CYWB0124AB-BVXIT
121
0
96
80
0
BZ100CGAL
RA
RR083024
R4
CYWB0124AB-BVXIT
121
0
96
80
0
1037
0
Summary for Package Family: VFBGA (0.75-0.8, 0.3mm, Pb-Free)
Sum
2009 Q1 RELIABILITY REPORT
13
records
VFBGA (0.75-0.8, 0.3mm, PbFree)
Page 35 of 61
Summary Detail -- HAST Performance Over Time
BUILDKIT
ASSY SITE
FBGA (0.75-0.8, 0.3mm)
BA48DJALE
G-TAIWAN
BA48CRALE
OSE-T
EVALNUM
TV
DEVICE
TEMP
VOLT
READOUT
REJECT
073905
R5
CY62177DV30L
130
3.63
128
45
0
MR081020
R1
CY62137CVSL-70BAI
110
3.3
128
80
0
125
0
77
0
77
0
#REF!
#REF!
Summary for Package Family: FBGA (0.75-0.8, 0.3mm)
2
records
Sum
FBGA (0.75-0.8, 0.3mm)
FBGA (0.75-0.8, 0.3mm, Pb-free)
BK48BWBLL
G-ASE
SS
MR082010
R1
Summary for Package Family: FBGA (0.75-0.8, 0.3mm, Pb-free)
CY7C1021CV33-10BAXI
1
130
3.65
128
records
Sum
FBGA (0.75-0.8, 0.3mm, Pb-free)
FBGA (1.0-1.27)
Summary for Package Family: FBGA (1.0-1.27)
#REF!
records
Sum
FBGA (1.0-1.27)
FLIPCHIP CSP (Pb-Free)
FN81AGAN
AU
NR081001
R3
CYWB0124ABX-FNXIT
130
3.63
96
86
0
FN81AGAN
AU
NR081001
R5
CYWB0124ABX-FNXIT
130
3.63
96
84
0
FN81AGAN
AU
NR081001
R6
CYWB0124ABX-FDXIT
130
3.63
96
88
0
258
0
PBGA (with Heat Spreader)
#REF!
#REF!
PDIP
#REF!
#REF!
Summary for Package Family: FLIPCHIP CSP (Pb-Free)
3
records
Sum
FLIPCHIP CSP (Pb-Free)
PBGA (with Heat Spreader)
Summary for Package Family: PBGA (with Heat Spreader)
#REF!
records
Sum
PDIP
Summary for Package Family: PDIP
#REF!
records
Sum
PDIP (Pb-Free)
PZ183DAGN
PZ183AXGN
RA-CML
MR081069
R1
CY7C63723C-PXC
130
5.5
128
80
0
O-OMEDATA
MR083039
R1
CS6632AF
130
3.63
128
80
0
160
0
Summary for Package Family: PDIP (Pb-Free)
2
records
Sum
PDIP (Pb-Free)
PLCC
J32RBGAAGB
MMT-X
MR081030
R1
CY7C4231V-15JC
130
3.63
128
40
0
J32RBGAAGB
X-MMT
MR081030
R1A
CY7C4231V-15JC
130
3.63
128
39
0
J32RBGAAGB
X-MMT
MR082017
R1
CY7B9911V-5JCT
130
3.6
128
40
0
J32RBGAAGB
X-MMT
MR082017
R1A
CY7B9911V-5JC
130
3.6
128
40
0
J32RBGAAGB
X-MMT
MR083024
R1
CY7B991V-5JI
130
3.6
128
40
0
J32RBGAAGB
X-MMT
MR083024
R1
CY7B991V-5JI
130
3.6
128
40
0
J32RBGAAGB
X
MR083024
R1A
CY7B991V-5JIT
130
3.6
128
40
0
279
0
Summary for Package Family: PLCC
7
records
Sum
PLCC (Pb-Free)
JZ32RBGAN
JZ32RBGAN
PLCC
M-PHILIPPINES
MR081063
R1
CY7B991-5JXC
130
3.63
128
40
0
M-PHILS
MR081063
R1A
CY7B991-5JXC
130
3.63
128
40
0
80
0
Summary for Package Family: PLCC (Pb-Free)
Sum
2009 Q1 RELIABILITY REPORT
2
records
PLCC (Pb-Free)
Page 36 of 61
FA
COMMENTS
QFN (0.4mm, Saw Type, Pb-free)
LN32AAAAAL
CA
MR091052
R1
Summary for Package Family: QFN (0.4mm, Saw Type, Pb-free)
CP7052BTT
1
130
5.25
128
23
0
23
0
records
Sum
QFN (0.4mm, Saw Type, Pb-free)
QFN (0.6mm, Punch Type, Pb-Free)
LK32AABAGL
L-KOREA
MR082022
R1
CY8C20434-12LKXI
130
5.25
128
40
0
LK32AABAGL
AMKOR-L
MR082022
R1A
CY8C20434-12LKXI
130
5.25
128
40
0
LK32AABAGL
L-KOREA
MR083006
R1
CY8C20424-12LKXI
130
5.25
128
77
0
LK32AABAG
L
MR084008
R1
CY8C20434-12LKXI
130
5.25
128
25
0
LK32AABAGL
L
MR091011
R1
CY8C20434-12LKXIT
130
5.25
128
25
0
LK32AABAGL
L-KOREA
NR072004
Summary for Package Family: QFN (0.6mm, Punch Type, PbFree)
R3
CP6683AM
130
5.25
128
39
0
246
0
6
records
QFN (0.6mm, Punch Type, PbFree)
Sum
QFN (0.6mm, Saw Type, Pb-Free)
LQ32CAAAL
CA-MALAYSIA
082008
R4
CY8C21434A-24LQXI
130
5.25
128
77
0
LQ32DAGLL
CA-MALAYSIA
082602
R1
CY8C23533-24LQXI
130
3.3
128
78
0
LQ32DAGLL
CA-Malaysia
083401
R1
CY8C20466A
130
5.25
128
77
0
LQ32DAGLL
CA
083401
R2
CY8C20466-24LQXI
130
5.25
128
77
0
LQ32DAGLL
CA
083401
R4
CY8C20466-24LQXI
130
5.25
128
77
0
LQ32ACAAGL
MB
083909
R1
CY8C204345-12LQXI
130
5.35
128
77
0
LQ32ACAAGL
MB
083909
R2
CY8C204345-12LQXI
130
5.35
128
77
0
LQ24AAAAAL
RA
084602
R4
CY8C20324-12LQXI
130
5.25
128
39
0
0
LQ24AAAAAL
RA
084602
R4
CY8C20324-12LQXI
130
5.25
128
40
LQ24ABAAL
AT-INDNS
MR082030
R1
CY8C20334-12LQXI
130
5.25
128
40
0
LQ24ABAAL
AIT-INDONESIA
MR082030
R1A
CY8C20334-12LQXI
130
5.25
128
40
0
LQ24ABAAL
AT-THAILAND
MR083053
R1
CY8C20324-12LQXI
130
5.25
128
39
0
LQ24ABAAL
AT
MR084039
R1
CY8C20324-12LQXI
130
5.25
128
5
0
LQ24ABAAL
AT
MR084039
R1
CY8C20324-12LQXI
130
5.25
128
20
0
LQ24ABAAL
AIT-INDONESIA
NR074003
R2
CY8C20334-12LQXI
130
5.25
128
39
0
LQ24ABAAL
AIT-INDONESIA
NR074003
R3
CP6785AM
130
5.25
128
40
0
QFN (0.6mm, Saw Type, Pb-Free)
842
0
Summary for Package Family: QFN (0.6mm, Saw Type, Pb-Free)
16
records
Sum
QFN (COL, 0.6mm, Saw Type, Pb-free)
LG16AAAAL
M-Manila
080502
R1
CY8C20234-12LKXIT
130
5.25
128
37
0
LG16AAAAL
M-Manila
080502
R1
CY8C20234-12LKXIT
130
5.25
128
40
0
LG16AAAAL
M-PHILS
MR081027
R1A
CY8C20234-12LKXI
130
5.25
128
40
0
LG16AAAAL
M-PHILS
MR081027
R1B
CY8C20234-12LKXI
130
5.25
128
40
0
LG16AAAAL
M-PHILS
MR082028
R1
CY8C20234-12LKXI
130
5.25
128
40
0
LG16AAAAL
M-PHILS
MR082028
R1A
CY8C20234-12LKXI
130
5.25
128
39
0
LG16AAAAL
M-PHILS
MR083048
R1
CY8C20122-LDX2I
130
5.25
128
39
0
LG16AAAAL
M
MR083048
R1A
CY8C20122-LDX2I
130
5.25
128
40
0
R1
CY8C20234-12LKXI
130
5.25
128
39
0
QFN (COL, 0.6mm, Saw Type, Pbfree)
354
0
LG16AAAAL
M
MR084013
Summary for Package Family: QFN (COL, 0.6mm, Saw Type, Pbfree)
9
records
Sum
QFN (Punch Type, Pb-Free)
LY32BGAGL
RA
083604
R1
CY8C21434-24LFXI
130
5.25
128
78
0
LY32BGAGL
083905
R1
CY8C21434-24LFXI
130
5.25
128
77
0
RA-CML
2009 Q1 RELIABILITY REPORT
Page 37 of 61
LY56AGAGL
L-KOREA
MR082031
R1
CY7C65630-56LFXC
130
3.63
128
68
0
LY32AAAGR
L-KOREA
MR082048
R1
CG6672AMT
130
5.25
128
77
0
LY32AAAGR
L
MR084015
R1
CY8C21434-24LFXI
130
5.25
128
25
0
LY68AGAAGL
L
MR091024
R1
CY8CLED04-68LFXI
130
5.25
128
25
0
350
0
Summary for Package Family: QFN (Punch Type, Pb-Free)
6
records
Sum
QFN (Punch Type, Pb-Free)
QFN (Saw Type, Pb-free)
LT32BGAGL
RA-CML
082902
R1
CY8C21434-24LTXI
130
5.25
128
79
0
LT32BAAAGL
CA-THAILAND
MR083038
R1
CG7032AA
130
5.25
128
77
0
LT32BAAAGL
CA-MALAYSIA
NR082002
R1
CY8C21434-24LTXI
130
5.25
128
77
0
LT32BAAAGL
CA-MALAYSIA
NR082002
R2
CY8C21434-24LTXI
130
5.25
128
77
0
LT32BAAGL
CA-MALAYSIA
NR082002
R3
CY8C21434-24LTXI
130
5.25
128
40
0
350
0
Summary for Package Family: QFN (Saw Type, Pb-free)
5
records
Sum
QSOP (Pb-Free)
SQ2414ABGN
SQ2414ABGN
QFN (Saw Type, Pb-free)
R-CML
MR083023
R1
CY7C63743C-QXC
130
5.5
128
80
0
R
MR091002
R1
CY7C63743C-QXC
130
5.5
128
25
0
105
0
Summary for Package Family: QSOP (Pb-Free)
2
records
Sum
RTSOP (Pb-free)
ZY28R2ALN
QSOP (Pb-Free)
R-CML
MR083030
R1
CY62256VNLL-70ZRXIT
130
3.63
128
39
0
ZY28R2ALN
R
MR083030
R1A
CY62256VNLL-70ZRXIT
130
3.63
128
39
0
ZY28R2BLN
R
MR091010
R1
CY62256NLL-70ZRXIT
130
5.5
128
25
0
103
0
0
Summary for Package Family: RTSOP (Pb-free)
3
records
Sum
RTSOP (Pb-free)
SNC (Pb-Free)
SY2831BBLN
R-CML
MR082037
R1
CY62256NLL-70SNXC
130
5.5
128
40
SY2831BBLN
CML-R
MR082037
R1A
CY62256NLL-70SNXC
130
5.5
128
40
0
SY2831BBLN
R-CML
MR083016
R1
CY62256NLL-70SNXCT
130
5.5
128
40
0
SY2831BBLN
R-CML
MR083016
R1A
CY62256NLL-70SNXCT
130
5.5
128
40
0
SY2831BBLN
R
MR084004
R1
CG7107AM
130
3.63
128
40
0
SY2831BBLN
R
MR084004
R1A
CG7107AM
130
3.63
128
40
0
SY2831BBLN
R
MR091007
R1
CY62256NLL-70SNXCT
130
5.5
128
45
0
240
0
0
Summary for Package Family: SNC (Pb-Free)
6
records
Sum
SOIC
S1615EAGB
SNC (Pb-Free)
M-PHILS
MR082014
R1
CY2309SC-1H
130
3.8
128
80
O-OMEDATA
MR082062
R1
CY2304SI-1T
130
3.63
128
80
0
S1615EAGB
M
MR083010
R1A
CY2292SL-1V1
130
3.63
128
80
0
S1615KBAGN
RA
MR084023
R1
CY2292F
130
3.8
128
78
0
S0815PBAGN
RA
MR091017
R1
CY2305SI-1HT
130
3.8
128
25
0
343
0
S0815BAAGB
Summary for Package Family: SOIC
5
records
Sum
SOIC
SOIC (J-Lead)
V243GAAAGN
X
090302
R1
CY7C197BN-15VC
130
0
128
80
0
V243GAAAGN
X
090302
R2
CY7C197BN-15VC
130
0
128
80
0
V243GAAGN
X
090302
R4
CY7C197BN-15VC
130
0
128
79
0
VZ3646BGLL
R
MR084001
R1
CY7C1049CV33-10VXCT
130
3.65
128
25
0
264
0
Summary for Package Family: SOIC (J-Lead)
Sum
2009 Q1 RELIABILITY REPORT
4
records
SOIC (J-Lead)
Page 38 of 61
SOIC (J-Lead, Pb-Free)
VZ32420GLL
R-CML
MR081008
R1
CY7C109D-10VXI
130
5.5
128
40
0
VZ444WAGL
R-CML
MR081050
R1
CY7C1021B-12VXC
130
5.5
128
38
0
VZ444WAGL
R-CML
MR081050
R1A
CY7C1020B-12VXC
130
5.5
128
37
0
VZ3646BGLL
R-CML
MR082009
R1
CY7C1049CV33-10VXC
130
3.65
128
40
0
VZ3646BGLL
R-CML
MR082009
R1A
CY7C1049CV33-10VXC
130
3.65
128
37
0
VZ28313BLN
R-CML
MR083003
R1
CY7C1399BN-12VXC
130
3.3
128
77
0
VZ444AABLL
R-CML
MR083035
R1
CY7C1021DV33-10VXI
130
3.65
128
40
0
VZ444AABLL
R
MR083035
R1A
CY7C1021DV33-10VXI
130
3.65
128
40
0
VZ28313BLN
R
MR084019
R1
CY7C1399BN-12VXIT
130
3.63
128
80
0
429
0
Summary for Package Family: SOIC (J-Lead, Pb-Free)
9
records
Sum
SOIC (J-Lead, Pb-Free)
SOIC (Pb-Free)
SZ815CGAN
M - Manila
080803
R1
CY2305CSXI-1H
130
3.3
96
80
0
SZ815CGAN
M - Manila
080803
R1
CY2305CSXI-1H
130
3.3
128
80
0
SZ815CGAN
M - Manila
080803
R2
CY2305CSXI-1H
130
3.3
96
80
0
SZ815CGAN
M - Manila
080803
R2
CY2305CSXI-1H
130
3.3
128
80
0
SZ815CGAN
M - Manila
080803
R3
CY2305CSXI-1H
130
3.3
96
80
0
SZ815CGAN
M - Manila
080803
R3
CY2305CSXI-1H
130
3.3
128
80
0
SZ1615NAGN
CA-MALAYSIA
082203
R1
CY8C20180-SX2I
130
5.25
128
80
0
SZ815PAGN
RA-CML
MR081034
R1
CY2305SXC-1H
130
3.63
128
80
0
SZ324516LL
R-CML
MR082005
R1
CY62148ELL-55SXI
130
3.63
128
78
0
SZ28327BGL
R-CML
MR082006
R1
CY8C27443-24SXI
130
5.25
128
40
0
SZ183CGAN
RA-CML
MR082012
R1
CY7C63723C-SXC
130
5.5
128
40
0
SZ183CGAN
RA-CML
MR082012
R1
CY7C63723C-SXC
130
5.5
256
24
0
SZ1615KGN
RA-CML
MR082015
R1
CY2309SXC-1HT
130
3.8
128
80
0
SZ1815CGAN
M-PHILS
MR082023
R1
CY8C24123A-24SXI
130
5.25
128
80
0
SZ1615EGN
M-PHILS
MR082025
R1
CY2309NZSXC-1H
130
3.8
128
80
0
SZ1615DGN
M-PHILS
MR083009
R1
CY2292SXL-1X6T
130
3.8
128
39
0
SZ1615DGN
M-PHILS
MR083009
R1A
CY2292SXL-1X6T
130
3.8
128
39
0
SZ324516BL
R-CML
MR083017
R1
CY62148ELL-55SXIT
130
3.6
128
78
0
SZ28327BGL
R-CML
MR083018
R1
CY8C27443-24SXIT
130
5.25
128
40
0
SZ28327BGL
R-CML
MR083018
R1A
CY8C27443-24SXIT
130
5.25
128
39
0
SZ183CBGAN
RA-CML
MR083019
R1
CY7C63723C-SXC
130
5.5
128
40
0
SZ183CBGAN
RA
MR083019
R1A
CY7C63723C-SXC
130
5.5
128
40
0
SZ183CBGAN
RA
MR083019
R1A
CY7C63723C-SXC
130
5.5
256
24
0
SZ815PABGN
RA-CML
MR083034
R1
CY2305SXC-1H
130
3.63
128
80
0
SZ815DAGN
M
MR084018
R1
CY2304SXI-2
130
3.63
128
80
0
SZ1615BKGN
RA
MR084020
R1
CY2309SXC-1HT
130
3.8
128
25
0
SZ183CBGAN
RA
MR084026
R1
CY7C63723C-SXC
130
5.5
128
40
0
SZ183CBGAN
RA
MR084026
R1A
CY7C63723C-SXC
130
5.5
128
40
0
SZ24315BGN
RA
MR084029
R1
CY7C63743C-SXC
130
3.63
128
80
0
SZ24315BGN
RA
MR084029
R1
CY7C63743C-SXC
130
5.5
128
46
0
SZ24312BGN
R
MR084033
R1
CY7C63743C-SXC
130
5.5
128
40
0
SZ24312BGN
R
MR084033
R2
CY7C63743C-SXC
130
5.5
128
40
0
SZ1615FAL
T
MR084072
R1
CY2309CSXC-1T
130
3.63
128
25
0
SZ32457BLN
R
MR091004
R1
CY62128ELL-45SXIT
130
3.8
128
25
0
SZ1615BKGN
RA
MR091016
R1
CY2308SXC-2T
130
3.8
128
25
0
SZ1615EGN
M
MR091020
R1
CY2309SXI-1HT
130
3.8
128
25
0
SZ183CBGAN
RA
MR091003
R1
CY7C63723C-SXC
130
5.5
128
25
0
2009 Q1 RELIABILITY REPORT
Page 39 of 61
SZ2035BAL
R
MR091001
R1
CY8C27243-24SXI
130
5.25
128
25
0
SZ815PAGN
RA-CML
NR081002
R14
CY22560SXI
130
3.63
128
80
0
2102
0
0
Summary for Package Family: SOIC (Pb-Free)
39
records
Sum
SSOP (Pb-Free)
SP483AGAN
SOIC (Pb-Free)
R
084703
R1
CY8C20566-24PVXI
130
5.25
128
77
SP28215GGL
RA-CML
MR081016
R1A
CY8C21534-24PVXI
130
5.25
128
80
0
SP202AAAGN
RA-CML
MR082007
R1
CP6650AMT
130
5.25
128
39
0
SP202AAAGN
CML-RA
MR082007
R1A
SP563BBBGL
R-CML
MR082008
R1
CP6650AMT
130
5.25
128
38
0
CY7C68300C-56PVXC
130
3.63
128
78
0
SP28214GL
T-OSE
MR082013
R1
CY8C26443-24PVX
110
5.25
264
80
0
SP2822BGL
M-PHILS
MR082038
R1
CY8C24423A-12PVXE
130
5.25
128
39
0
SP2822BGL
M-PHILS
MR082038
R1A
CY8C24423A-12PVXE
130
5.25
128
40
0
SP2822BGL
M-PHILS
MR083008
R1
CY8C21534-12PVXET
130
5.25
96
77
0
SP563BBBG
R-CML
MR083011
R1
CY7C68013-56PVXC
130
3.63
128
38
0
SP563BBBG
R-CML
MR083011
R1A
CY7C68013A-56PVXC
130
3.63
128
39
0
SP28215BGL
RA-CML
MR083021
R1
CY8C21534-24PVXI
130
5.25
128
40
0
SP28215BGL
RA-CML
MR083021
R1
CY8C21534-24PVXI
130
5.25
256
80
0
SP28215BGL
RA-CML
MR083021
R1A
CY8C21534-24PVXI
130
5.25
128
40
0
SP2824HAN
T
MR084021
R1
CY8C24533-24PVXI
130
5.25
128
70
0
SP483HAAGR
M
MR084043
R1
CY14B101L-SP45XC
130
3.63
128
77
0
SP483EBBAL
R
MR091005
R1
CY8C27643-24PVXI
130
5.25
128
25
0
A32LXGXGB
Q
MR091043
R1
CY29948ACT
130
3.63
128
25
0
957
0
Summary for Package Family: SSOP (Pb-Free)
17
records
Sum
SSOP (Pb-Free)
TQFP
A32LXGXGB
Q-KOREA
MR082024
R1
CY29948AC
130
3.63
128
40
0
A32LXGXGB
Q
MR082024
R1A
CY29948AC
130
3.63
128
38
0
78
0
#REF!
#REF!
Summary for Package Family: TQFP
2
records
Sum
TQFP
TQFP (10mm X 10mm)
Summary for Package Family: TQFP (10mm X 10mm)
#REF!
records
Sum
TQFP (10mm X 10mm)
TQFP (Pb-Free)
AZ32BXGAN
Q-KOREA
MR081015
R1
CY7C4201V-15AXC
130
3.63
128
39
0
AZ32BXGAN
Q-KOREA
MR081015
R1A
CY7C4201V-15AXC
130
3.63
128
39
0
AZ100SFAL
R-CML
MR081017
R1
CY7C024-25AXC
130
5.5
128
40
0
AZ100SFAL
R-CML
MR081017
R1A
CY7C024-25AXC
130
5.5
128
40
0
AZ32GXGAN
G-ASE
MR082020
R1
CY29942AXI
130
3.63
128
40
0
AZ32GXGAN
0
G-TAIWAN
MR082020
R1A
CY22942AXI
130
3.63
128
40
AZ100SFA
R-CML
MR082049
R1
CY7C024-25AXC
130
5.5
128
40
0
AZ100SFA
CML-R
MR082049
R1A
CY7C024-25AXC
130
5.5
128
40
0
AZ44SGGAN
R-CML
MR082060
R1
CS6567AM
130
5.25
128
40
0
AZ44SGGAN
R-CML
MR082060
R1A
CS6567AM
130
5.25
128
40
0
AZ32BXGAN
Q-KOREA
MR083031
R1
CY7C4251V-25AXC
130
3.63
128
40
0
AZ32BXGAN
Q
MR083031
R1A
CY7C4251V-25AXC
130
3.63
128
40
0
AZ100SEAL
RA-CML
MR083032
R1
CY7B994V-5AXI
130
3.63
128
35
0
AZ100SEAL
RA
MR083032
R1A
CY7B994V-5AXI
130
3.63
128
39
0
R
MR084002
R1
CY7C1370D-167AXI
130
3.6
128
79
0
AZ100RBBLN
Summary for Package Family: TQFP (Pb-Free)
2009 Q1 RELIABILITY REPORT
14
records
Page 40 of 61
Sum
TQFP (Pb-Free)
631
0
TQFP (Thermal)
AT120ABAGE
Q-KOREA
NR072029
R1
CYS25G0101DX-ATXC
130
3.63
128
79
0
AT120ABAGE
Q-KOREA
NR072029
R2
CYS25G0101DX-ATXC
130
3.63
128
79
0
158
0
Summary for Package Family: TQFP (Thermal)
2
records
Sum
TQFP (Thermal)
TQFP (Thermal, Pb-free)
AG120ABAGR
Q-KOREA
NR072017
R1
CYS25G0101DX-ATXC
130
3.63
128
46
0
AG120ABAGR
Q-KOREA
NR072017
R2
CYS25G0101DX-ATXC
130
6.63
128
46
0
92
0
Summary for Package Family: TQFP (Thermal, Pb-Free)
2
records
Sum
TSOP (Pb-free)
ZT32RABALL
TQFP (Thermal, Pb-free)
T-OSE
MR082019
R1
CY62128EV30LL-45ZXI
130
3.6
128
37
0
ZT32RABALL
T-TAIWAN
MR082019
R1A
CY62128EV30LL-45ZXI
130
3.6
128
40
0
ZT28R4BGL
R-CML
MR083028
RIA
CY7C1399BN-12ZXC
130
3.63
128
39
0
ZT28R4BGL
R-CML
MR083028
RIA
CY7C1399BN-12ZXC
130
3.63
128
39
0
ZT32RAEBLN
RA
MR084006
R1
CG6708AMT
130
3.6
128
39
0
ZT32RAEBLN
RA
MR084006
R1A
CG6708AMT
130
3.6
128
36
0
ZT28R2BBLN
R
MR091012
R1
CY62256NLL-55ZXIT
130
5.5
128
25
0
ZT32RAEBLN
RA
MR091014
R1
CY62128EV30LL-45ZXI
130
3.6
128
25
0
ZT32RABALL
T
MR091021
R1
CY62128EV30LL-45ZXI
130
3.6
264
25
0
305
0
Summary for Package Family: TSOP (Pb-free)
9
records
Sum
TSOP (Pb-free)
TSOP I (Pb-Free)
ZB32RHALN
R-CML
MR082003
R1
CY62128EV30LL-45ZAXI
130
3.6
128
80
0
ZB32RHALL
R-CML
MR082053
R1
CY62128DV30LL-55ZAXI
130
5.5
128
40
0
ZB32RHBALN
R-CML
MR083042
R1
CY62128ELL-45ZAXI
130
5.5
128
79
0
ZB32RHBALN
R
MR091031
R1
CG7086AM
130
3.6
128
25
0
224
0
#REF!
#REF!
Summary for Package Family: TSOP I (Pb-Free)
4
records
Sum
TSOP I (Pb-Free)
TSOP II
Summary for Package Family: TSOP II
#REF!
records
Sum
TSOP II (Pb-Free)
ZW444GALL
TSOP II
R
071304
R9
7C1404B6BC-**RZWCB
130
5.5
128
80
0
G-ASEK
MR081002
R1
CY7C1061AV33-12ZXC
130
3.65
128
42
0
ZW444AMBLN
R-CML
MR081003
R1
CY62157EV30LL-45ZSXI
130
5.5
128
79
0
ZW444AMBLN
R-CML
MR082002
R1
CY62146EV30LL-45SZSX
130
3.6
128
79
0
ZW324CBLL
T-OSE
MR082026
R1
CY62148ELL-45ZSXI
130
3.6
128
80
0
ZW544AALL
G-TAIWAN
MR082034
R1
CY7C1069AV33-10ZXC
130
3.65
128
40
0
ZW544AALL
ZW544AALL
G-ASEK
MR082034
R1A
CY7C1069AV33-10ZXC
130
3.65
128
40
0
ZW544AALL
G-TAIWAN
MR083002
R1
CY7C1069AV33-10ZX
130
3.65
128
40
0
ZW444AHBLL
R-CML
MR083020
R1
CY7C1021DV33-10ZSXI
130
3.63
128
80
0
ZW324CBLL
T-OSE
MR083043
R1
CY62148EV30LL-45ZSXI
130
3.6
128
75
0
ZW444AJBLN
R-CML
MR083071
R1
CY7C1021CV33-10ZXC
130
3.65
96
76
0
ZW444AHBLL
R
MR084007
R1
CG6850AM
130
3.6
128
80
0
ZW324CBLL
T
MR084025
R1
CG7092AM
130
3.63
128
75
0
ZW544AALL
G
MR084038
R1
CY7C1061AV33-10ZXC
130
3.65
128
39
0
ZW544AALL
G
MR084038
R1A
CY7C1061AV33-10ZXC
130
3.65
128
39
0
Summary for Package Family: TSOP II (Pb-Free)
2009 Q1 RELIABILITY REPORT
15
records
Page 41 of 61
Sum
TSOP II (Pb-Free)
944
0
128
80
0
128
78
0
3.8
128
77
0
3.8
128
77
0
312
0
TSSOP
Z1620GAGN
RA-CML
MR081036
R1
CY2309ZC-1H
130
3.8
Z1620GAGN
RA-CML
MR082029
R1
CY2309ZC-1H
130
3.8
Z1611XAGB
M-PHILS
MR082033
R1
CY2308ZC-1H
130
RA
MR084016
R1
CY2309ZC-1HT
130
Z1620GBAGN
Summary for Package Family: TSSOP
3
records
Sum
TSSOP (Pb-Free)
ZZ1620GAN
ZZ1613HAN
TSSOP
RA-CML
MR081046
R1
CY22392ZXI-384
130
3.63
128
77
0
T-OSE
MR082011
R1
CY2308ZXI-1HT
130
3.63
128
78
0
ZZ1620GAN
RA-CML
MR082032
R1
CY2308ZXI-1H
130
3.8
128
78
0
ZZ1620GBAN
RA-CML
MR083015
R1
CY22150FZXI
130
3.63
128
78
0
ZZ1619GAN
RA
MR084065
R1
CY2309CZXI-1H
130
3.68
128
77
0
ZZ1620GBAN
RA
MR091018
R1
CY2309ZXC-1HT
130
3.8
128
25
0
T
MR091019
R1
CY25100ZXC38T
130
3.63
128
25
0
438
0
#REF!
#REF!
ZZ0812BGL
Summary for Package Family: TSSOP (Pb-Free)
7
records
Sum
TSSOP (Pb-Free)
VFBGA (0.75-0.8, 0.3mm)
Summary for Package Family: VFBGA (0.75-0.8, 0.3mm)
#REF!
records
Sum
VFBGA (0.75-0.8, 0.3mm)
VFBGA (0.75-0.8, 0.3mm, Pb-Free)
BZ56AGAGL
G-ASE
MR074057
R1
CY7C68013A-56BAXC
130
3.63
128
38
0
BZ56AGAGL
G-ASE
MR074057
R1A
CY7C68013A-56BAXC
130
3.63
128
26
0
BZ56FAALE
ASE-G
MR081037
R1
CY7C68053-56BAX
130
3.63
128
40
0
BZ56FAALE
G-ASE
MR081037
R1A
CY7C68053-56BAX
130
3.63
128
39
0
BZ56BGALL
RA
MR084011
R1
CY7C68013A-56BAXC
130
3.63
128
25
0
BZ48DAGLL
RA
MR084034
R1
CY62137FV30LL-45BVXIT
130
3.6
128
29
0
197
0
Summary for Package Family: VFBGA (0.75-0.8, 0.3mm, Pb-Free)
Sum
2009 Q1 RELIABILITY REPORT
6
records
VFBGA (0.75-0.8, 0.3mm, PbFree)
Page 42 of 61
Summary Detail -- TCT Performance Over Time
EVALNUM
TV
FBGA (0.75-0.8, 0.3mm)
BA48CRALE
T-OSE
BUILDKIT
ASSY SITE
MR082018
R1
BA48CRALE
MR082018
R1
T-OSE
Summary for Package Family: FBGA (0.75-0.8, 0.3mm)
DEVICE
2
TEMP
VOLT
READOUT
SS
REJECT
CY62137CVSL-70BAI
-65/150
CY62137CVSL-70BAI
-65/150
0
500
80
0
0
1000
80
0
160
0
records
Sum
FBGA (0.75-0.8, 0.3mm)
FBGA (0.75-0.8, 0.3mm, Pb-free)
BK48BWBLL
G-ASE
MR082010
R1
CY7C1021CV33-10BAXI
-65/150
0
500
76
0
BK48BWBLL
MR082010
R1
CY7C1021CV33-10BAXI
-65/150
0
1000
75
0
R1
CY62177DV30LL-55BAXI
-65/150
0
500
80
0
FBGA (0.75-0.8, 0.3mm, Pbfree)
231
0
G-ASE
BK48DJALL
G
MR083050
Summary for Package Family: FBGA (0.75-0.8, 0.3mm, Pbfree)
3
records
Sum
FBGA (1.0-1.27)
BB100CAALE
G-ASE
MR081067
R1
CYP15G0101DXB-BBI
-65/150
0
500
80
0
BB100CAALE
G-ASE
MR081067
R1
CYP15G0101DXB-BBI
-65/150
0
1000
80
0
BB100EAALE
G-TAIWAN
MR082041
R1
CY7B994V-2BBI
-65/150
0
500
80
0
BB100EAALE
G-TAIWAN
MR082041
R1
CY7B994V-2BBI
-65/150
0
1000
80
0
BB144CALE
G-TAIWAN
NR072030
R1
CY7C08313AV-167BBC
-65/150
0
500
50
0
BB144CALE
G-TAIWAN
NR072030
R1
CY7C08313AV-167BBC
-65/150
0
1000
50
0
BB144CALE
G-TAIWAN
NR072030
R2
CY7C0830AV-167BBC
-65/150
0
500
50
0
BB144CALE
G-TAIWAN
NR072030
R2
CY7C0830AV-167BBC
-65/150
0
1000
50
0
BB144CALE
G-TAIWAN
NR072030
R3
CY7C0837AV-167BBC
-65/150
0
500
48
0
BB144CALE
G-TAIWAN
NR072030
R3
CY7C0837AV-167BBC
-65/150
0
1000
48
0
BB172AAGE
G-TAIWAN
NR072027
R1
CY7C057V-15BBC
-65/150
0
500
50
0
BB172AAGE
G-TAIWAN
NR072027
R1
CY7C057V-15BBC
-65/150
0
1000
50
0
BB172AAGE
G-TAIWAN
NR072027
R2
CY7C057V-12BBC
-65/150
0
500
50
0
BB172AAGE
G-TAIWAN
NR072027
R2
CY7C057V-12BBC
-65/150
0
1000
50
0
BB172AAGE
G-TAIWAN
NR072027
R3
CY7C057V-15BBI
-65/150
0
500
50
0
BB172AAGE
G-TAIWAN
NR072027
R3
CY7C057V-15BBI
-65/150
0
1000
50
0
BB209BALE
G-TAIWAN
NR072022
R1
CY7C1474V33-167BGC
-65/150
0
1000
46
0
Summary for Package Family: FBGA (1.0-1.27)
17
records
Sum
FBGA (1.0-1.27)
962
0
FBGA (1.0-1.27, Pb-free)
BW100EAGL
G
MR084067
R1
CYP15G0101DXB-BBXC
-65/150
0
500
80
0
BW100EAGL
G
MR084067
R1
CYP15G0101DXB-BBXC
-65/150
0
1000
80
0
0
BW100EAGL
G-TAIWAN
NR072018
R3
CYP15G0101DXB-BBXC
-65/150
0
1000
80
BW100EAGLE
G-TAIWAN
NR072033
R1
CYV15G0101DXB-BBXI
-65/150
0
500
45
0
BW100EAGLE
G-TAIWAN
NR072033
R1
CYV15G0101DXB-BBXI
-65/150
0
1000
45
0
BW100EAGLE
G-TAIWAN
NR072033
R2
CYV15G0101DXB-BBXC
-65/150
0
500
45
0
BW100EAGLE
G-TAIWAN
NR072033
R2
CYV15G0101DXB-BBXC
-65/150
0
1000
45
0
FBGA (1.0-1.27, Pb-free)
420
0
7
Summary for Package Family: FBGA (1.0-1.27, Pb-free)
records
Sum
FLIPCHIP CSP (Pb-Free)
FN81BGAN
AU - Amkor Taiwan
080501
R1
CYWB0124ABX-FDXIT
-65/150
0
500
74
0
FN81BGAN
080501
R1
CYWB0124ABX-FDXIT
-65/150
0
1000
74
0
AU - Amkor Taiwan
2009 Q1 RELIABILITY REPORT
Page 43 of 61
FA
COMMENTS
FN81BGAN
AU - Amkor Taiwan
080501
R2
CYWB0124ABX-FDXIT
-65/150
0
500
82
0
FN81BGAN
AU - Amkor Taiwan
080501
R2
CYWB0124ABX-FDXIT
-65/150
0
1000
80
0
FN81BGAN
AU - Amkor Taiwan
080501
R3
CYWB0124ABX-FDXIT
-65/150
0
500
78
0
FN81BGAN
AU - Amkor Taiwan
080501
R3
CYWB0124ABX-FDXIT
-65/150
0
1000
77
0
FN81BBGAN
AU
082901
R1
CYWB0226ABSX-FDXIES
-55/125
0
500
83
0
FN81BBGAN
AU
082901
R1
CYWB0226ABSX-FDXIES
-55/125
0
1000
81
0
FN81BBGAN
AU
082901
R2
CYWB0226ABSX-FDXIES
-55/125
0
500
110
0
FN81BBGAN
AU
082901
R2
CYWB0226ABSX-FDXIES
-55/125
0
1000
106
0
FN81BBGAN
AU
082901
R3
CYWB0226ABSX-FDXIES
-55/125
0
500
112
0
FN81BBGAN
AU
082901
R3
CYWB0226ABSX-FDXIES
-55/125
0
1000
112
0
FN81AGAN
AU
NR081001
R3
CYWB0124ABX-FNXIT
-65/150
0
500
89
0
FN81AGAN
AU
NR081001
R3
CYWB0124ABX-FNXIT
-65/150
0
1000
87
0
FN81AGAN
AU
NR081001
R4
CYWB0124ABX-FNXIT
-65/150
0
500
84
0
FN81AGAN
AU
NR081001
R4
CYWB0124ABX-FNXIT
-65/150
0
1000
79
0
FN81AGAN
AU
NR081001
R5
CYWB0124ABX-FNXIT
-65/150
0
500
84
0
FN81AGAN
AU
NR081001
R5
CYWB0124ABX-FNXIT
-65/150
0
1000
81
0
FN81AGAN
AU
NR081001
R6
CYWB0124ABX-FDXIT
-65/150
0
500
90
0
FN81AGAN
AU
NR081001
R6
CYWB0124ABX-FDXIT
-65/150
0
1000
89
0
FN81AGAN
AU
NR081001
R6A
CYWB0124ABX-FDXIT
-65/150
0
500
89
0
FN81AGAN
AU
NR081001
R6A
CYWB0124ABX-FDXIT
-65/150
0
1000
88
0
FN81AGAN
AU
NR081001
R7
CYWB0124ABX-FNXIT
-65/150
0
500
88
0
FN81AGAN
AU
NR081001
R7
CYWB0124ABX-FNXIT
-65/150
0
1000
88
0
FN81AGAN
AU
NR081001
R7A
CYWB0124ABX-FDXIT
-65/150
0
500
90
0
FN81AGAN
AU
NR081001
R7A
CYWB0124ABX-FDXIT
-65/150
0
1000
89
0
2284
0
Summary for Package Family: FLIPCHIP CSP (Pb-Free)
26
records
Sum
FLIPCHIP CSP (Pb-Free)
PBGA (with Heat Spreader)
BG119SALE
G-ASE
MR082021
R1
CY7C1354C-166BGC
-65/150
0
500
80
0
BG119SALE
G-ASE
MR082021
R1
CY7C1354C-166BGC
-65/150
0
1000
80
0
BG119SALE
G-TAIWAN
MR083001
R1
CY7C1354C-166BGC
-65/150
0
500
80
0
BG119SALE
G-TAIWAN
MR083001
R1
CY7C1354C-166BGC
-65/150
0
1000
80
0
BG119SALE
G
MR084037
R1
CY7C1354C-166BGC
-65/150
0
500
80
0
BG119SALE
G
MR084037
R1
CY7C1354C-166BGC
-65/150
0
1000
78
0
478
0
Summary for Package Family: PBGA (with Heat Spreader)
6
records
Sum
PBGA (with Heat Spreader)
PBGA (Cavity/Heat Sink)
BL256L2GE
G
MR084066
R1
CYP15G0401DXB-BGI
-65/150
0
500
76
0
BL256L2GE
G
MR084066
R1
CYP15G0401DXB-BGI
-65/150
0
1000
75
0
151
0
#REF!
#REF!
Summary for Package Family: PBGA (Cavity/Heat Sink)
2
records
Sum
PBGA (Cavity/Heat Sink)
PDIP
Summary for Package Family: PDIP
#REF!
records
Sum
PDIP
PDIP (Pb-Free)
PZ183ABAGN
X-MMT
081906
R1
CS6632AF
-65/150
0
500
161
0
PZ183ABAGN
X-MMT
081906
R1
CS6632AF
-65/150
0
1000
161
0
PZ183ABAGN
X-MMT
081906
R1A
CS6632AF
-65/150
0
500
80
0
PZ183DAGN
RA-CML
MR081069
R1
CY7C63723C-PXC
-65/150
0
500
82
0
PZ183DAGN
RA-CML
MR081069
R1
CY7C63723C-PXC
-65/150
0
1000
82
0
PZ183DAGN
RA-CML
MR082065
R1
CY7C63723C-PXC
-65/150
0
500
80
1
2009 Q1 RELIABILITY REPORT
Page 44 of 61
MR082065-1T1
Lifted ball bond
PZ183DAGN
RA-CML
MR082065
R1
CY7C63723C-PXC
-65/150
0
1000
78
0
PZ183DBGN
RA-CML
MR083022
R1
CY7C63723C-PXC
-65/150
0
500
80
0
PZ183DBGN
RA-CML
MR083022
R1
CY7C63723C-PXC
-65/150
0
1000
80
0
PZ243AAAGN
X
MR084028
R1
CY7C63743C-PXC
-65/150
0
500
80
0
PZ243AAAGN
X
MR084028
R1
CY7C63743C-PXC
-65/150
0
1000
80
0
PZ183DBGN
RA
MR084050
R1
CS6632AF
-65/150
0
500
99
0
PZ183DBGN
RA
MR084050
R1
CS6632AF
-65/150
0
1000
99
0
PZ183DBGN
RA
MR091008
R1
CY7C63723C-PXC
-65/150
0
500
80
0
PZ183DBGN
RA
MR091008
R1
CY7C63723C-PXC
-65/150
0
1000
80
0
PZ183ABBGN
X-THAILAND
NR083005
R1
CY7C63231A-PXC
-65/150
0
500
77
0
PZ183ABBGN
X-THAILAND
NR083005
R1
CY7C63231A-PXC
-65/150
0
1000
77
0
PZ183ABBGN
X-THAILAND
NR083005
R3
CY7C63231A-PXC
-65/150
0
500
77
0
PZ183ABBGN
X-THAILAND
NR083005
R3
CY7C63231A-PXC
-65/150
0
1000
77
0
1710
1
Summary for Package Family: PDIP (Pb-Free)
19
records
Sum
PDIP (Pb-Free)
PLCC
J32RBGAAGB
X-MMT
MR082017
R1
CY7B9911V-5JCT
-65/150
0
500
80
0
J32RBGAAGB
X-MMT
MR082017
R1
CY7B9911V-5JCT
-65/150
0
1000
80
0
J32RBGAAGB
X-MMT
MR083024
R1
CY7B991V-5JI
-65/150
0
500
81
0
J32RBGAAGB
X-MMT
MR083024
R1
CY7B991V-5JI
-65/150
0
1000
81
0
J32RBGAAGB
X-MMT
MR083024
R1
CY7B991V-5JI
-65/150
0
2000
81
0
J32RBGAAGB
X-MMT
MR083024
R1
CY7B991V-5JI
-65/150
0
2500
80
0
Summary for Package Family: PLCC
6
records
Sum
PLCC (Pb-Free)
JZ32RBGAN
PLCC
483
0
M-PHILIPPINES
MR081063
R1
CY7B991-5JXC
-65/150
0
1000
80
0
JZ52SFGAN
M
MR084046
R1
7C136GT-**MJXCT
-65/150
0
500
80
0
JZ52SFGAN
M
MR084046
R1
7C136GT-**MJXCT
-65/150
0
1000
80
0
JZ52SFGAN
M
MR084074
R1
CY7C131-25JXCT
-65/150
0
500
77
0
JZ52SFGAN
M
MR084074
R1
CY7C131-25JXCT
-65/150
0
1000
77
0
394
0
Summary for Package Family: PLCC (Pb-Free)
5
records
Sum
PLCC (Pb-Free)
PQFP (Pb-free)
NZ52DXGAN
G-ASEK
MR081004
R1
CY7C136-55NXC
-65/150
0
500
80
0
NZ52DXGAN
G-ASEK
MR081004
R1
CY7C136-55NXC
-65/150
0
1000
80
0
NZ52DXGAN
G-ASE
MR082061
R1
CY7C131-25NXC
-65/150
0
500
80
0
NZ52DXGAN
G-ASE
MR082061
R1
CY7C131-25NXC
-65/150
0
1000
80
0
NZ52DXGAN
G-TAIWAN
NR072014
R12
CY7C136-55NXC
-65/150
0
1000
15
0
NZ52DXGAN
G-TAIWAN
NR072014
R13
CY7C136-55NXC
-65/150
0
1000
15
0
PQFP (Pb-free)
350
0
Summary for Package Family: PQFP (Pb-free)
6
records
Sum
QFN (Open Cavity, Pb-free)
LB42ABALL
R-CML
NR081004
R1
CYONS10810-LBXC
-65/150
500
77
0
LB42ABALL
R-CML
NR081004
R2
CYONS10810-LBXC
-40
500
77
0
LB42ABALL
R-CML
NR081004
R3
CYONS10810-LBXC
-40
500
76
0
QFN (Open Cavity, Pb-free)
230
0
Summary for Package Family: QFN (Open Cavity, Pb-free)
3
0
records
Sum
QFN (0.4mm, Saw Type, Pb-free)
LN32AAAAAL
CA-Malaysia
82008
R1
CY8C21434-24LCXI
-65/150
0
500
77
0
LN32AAAAAL
CA-Malaysia
82008
R1
CY8C21434-24LCXI
-65/150
0
1000
75
0
2009 Q1 RELIABILITY REPORT
Page 45 of 61
LN32AAAAAL
CA-Malaysia
82008
R2
CY821434-24LCXI
-65/150
0
500
77
0
LN32AAAAAL
CA-Malaysia
82008
R2
CY821434-24LCXI
-65/150
0
1000
77
0
LN32AAAAAL
CA-Malaysia
82008
R3
CY821434-24LCXI
-65/150
0
500
80
0
LN32AAAAAL
LN32AAAAAL
CA-Malaysia
CA
82008
MR091052
R3
R1
CY821434-24LCXI
CP7052BTT
-65/150
0
-65/150
0
1000
500
79
73
0
0
QFN (0.4mm, Saw Type, Pb-free)
538
0
Summary for Package Family : QFN (0.4mm, Saw Type, Pb-free)
7
records
Sum
QFN (0.6mm, Punch Type, Pb-Free)
LK32AABAGL
L-KOREA
MR082022
R1
CY8C20434-12LKXI
-65/150
0
500
80
0
LK32AABAGL
L-KOREA
MR082022
R1
CY8C20434-12LKXI
-65/150
0
1000
80
0
LK32AABAGL
L-KOREA
MR083006
R1
CY8C20424-12LKXI
-65/150
0
500
80
0
LK32AABAGL
L-KOREA
MR083006
R1
CY8C20424-12LKXI
-65/150
0
1000
80
0
LK32AABAGL
L
MR091011
R1
CY8C20434-12LKXIT
-65/150
0
500
80
0
LK32AABAGL
L
MR091011
R1
CY8C20434-12LKXIT
-65/150
0
1000
80
0
LK32AABAGL
L-KOREA
NR072004
R2
CY8C20424-12LKXI
-65/150
0
1000
80
0
LK32AABAGL
L-KOREA
NR072004
R3
CP6683AM
-65/150
0
1000
79
0
LK32AABAGL
L-Seoul
RR083004
R1
CY8C20434-12LKXI
-65/150
0
300
192
0
LK32AABAGL
L-Seoul
RR083004
R1
CY8C20434-12LKXI
-65/150
0
500
192
0
LK32AABAGL
L-Seoul
RR083004
R1
CY8C20434-12LKXI
-65/150
0
800
192
0
LK32AABAGL
L-Seoul
RR083004
R2
CY8C20434-12LKXI
-65/150
0
100
200
0
LK32AABAGL
L-Seoul
RR083004
R2
CY8C20434-12LKXI
-65/150
0
300
200
0
LK32AABAGL
L-Seoul
RR083004
R2
CY8C20434-12LKXI
-65/150
0
500
198
0
LK32AABAGL
L-Seoul
RR083004
R2
CY8C20434-12LKXI
-65/150
0
800
188
0
LK32AABAGL
L-Seoul
RR083004
R2
CY8C20434-12LKXI
-65/150
0
1000
167
0
LK32AABAGL
L-Seoul
RR083004
R3
CY8C20434-12LKXI
-65/150
0
100
196
0
LK32AABAGL
L-Seoul
RR083004
R3
CY8C20434-12LKXI
-65/150
0
300
196
0
LK32AABAGL
L
RR083004
R4
CY8C20434-12LKXI
-65/150
0
100
199
0
LK32AABAGL
L
RR083004
R4
CY8C20434-12LKXI
-65/150
0
300
199
0
LK32AABAGL
L-Seoul
RR083004
R6
CY8C20434-12LKXI
-65/150
0
100
200
0
LK32AABAGL
L-Seoul
RR083004
R6
CY8C20434-12LKXI
-65/150
0
300
199
1
RR083004-6T2
Broken wedge
LK32AABAGL
L-Seoul
RR083004
R6
CY8C20434-12LKXI
-65/150
0
500
194
7
RR083004-6T3
Broken wedge
LK32AABAGL
L-Seoul
RR083004
R6
CY8C20434-12LKXI
-65/150
0
800
149
0
LK32AABAGL
L-Seoul
RR083004
R6
CY8C20434-12LKXI
-65/150
0
1000
124
0
LK32AABAGL
L-SEOUL KOREA
RR083009
R1
CY8C20434-12LKXI
-65/150
0
100
398
0
LK32AABAGL
L-SEOUL KOREA
RR083009
R1
CY8C20434-12LKXI
-65/150
0
300
398
0
LK32AABAGL
L-SEOUL KOREA
RR083009
R1
CY8C20434-12LKXI
-65/150
0
500
398
0
LK32AABAGL
L-SEOUL KOREA
RR083009
R1
CY8C20434-12LKXI
-65/150
0
800
388
0
LK32AABAGL
L-SEOUL KOREA
RR083009
Summary for Package Family: QFN (0.6mm, Punch Type, PbFree)
R1
CY8C20434-12LKXI
-65/150
0
1000
372
0
5778
8
30
records
QFN (0.6mm, Punch Type, PbFree)
Sum
QFN (0.6mm, Saw Type, Pb-Free)
LQ32DAGLL
CA
082109
R1
CY8C204345-12LQXI
-65/150
0
500
80
0
LQ32DAGLL
CA
082109
R1
CY8C204345-12LQXI
-65/150
0
1000
80
0
LQ32DAGLL
CA
082109
R2
CY8C204345-12LQXI
-65/150
0
500
80
0
LQ32DAGLL
CA
082109
R2
CY8C204345-12LQXI
-65/150
0
1000
80
0
LQ32DAGLL
CA
082109
R3
CY8C204345-12LQXI
-65/150
0
500
80
0
LQ32DAGLL
CA
082109
R3
CY8C204345-12LQXI
-65/150
0
1000
80
0
LQ32DAGLL
CA-MALAYSIA
082602
R1
CY8C23533-24LQXI
-65/150
0
500
80
0
LQ32DAGLL
CA-MALAYSIA
082602
R1
CY8C23533-24LQXI
-65/150
0
1000
80
0
2009 Q1 RELIABILITY REPORT
Page 46 of 61
LQ32DAGLL
CA-MALAYSIA
082602
R2
CY8C23533-24LQXI
-65/150
0
500
80
0
LQ32DAGLL
CA-MALAYSIA
082602
R2
CY8C23533-24LQXI
-65/150
0
1000
80
0
LQ32DAGLL
CA-MALAYSIA
082602
R3
CY8C23533-24LQXI
-65/150
0
500
80
0
LQ32DAGLL
CA-MALAYSIA
082602
R3
CY8C23533-24LQXI
-65/150
0
1000
80
0
LQ32DAGLL
CA
083401
R2
CY8C20466-24LQXI
-65/150
0
500
77
0
LQ32DAGLL
CA
083401
R2
CY8C20466-24LQXI
-65/150
0
1000
77
0
LQ32DAGLL
CA
083401
R4
CY8C20466-24LQXI
-65/150
0
500
77
0
LQ32DAGLL
CA
083401
R4
CY8C20466-24LQXI
-65/150
0
1000
77
0
LQ32ACAAGL
MB
083909
R1
CY8C204345-12LQXI
150
0
500
80
0
LQ32ACAAGL
MB
083909
R1
CY8C204345-12LQXI
150
0
1000
80
0
LQ32ACAAGL
MB
083909
R2
CY8C204345-12LQXI
150
0
500
80
0
LQ32ACAAGL
MB
083909
R2
CY8C204345-12LQXI
150
0
1000
80
0
LQ32ACAAGL
MB
083909
R3
CY8C204345-12LQXI
150
0
500
80
0
LQ32ACAAGL
MB
083909
R3
CY8C204345-12LQXI
150
0
1000
80
0
LQ24AAAAAL
RA
084602
R1
CY8C20324-12LQXI
-65/150
0
500
77
0
LQ24AAAAAL
RA
084602
R1
CY8C20324-12LQXI
-65/150
0
1000
77
0
LQ24AAAAAL
RA
084602
R2
CY8C20324-12LQXI
-65/150
0
500
80
0
LQ24AAAAAL
RA
084602
R2
CY8C20324-12LQXI
-65/150
0
1000
80
0
LQ24AAAAAL
RA
084602
R3
CY8C20324-12LQXI
-65/150
0
500
80
0
LQ24AAAAAL
RA
084602
R3
CY8C20324-12LQXI
-65/150
0
1000
80
0
LQ24AAAAAL
RA
084602
R4
CY8C20324-12LQXI
-65/150
0
500
80
0
LQ24AAAAAL
RA
084602
R4
CY8C20324-12LQXI
-65/150
0
1000
80
0
LQ24AAAAAL
RA
084602
R5
CY8C20324-12LQXI
-65/150
0
500
80
0
LQ24AAAAAL
RA
084602
R5
CY8C20324-12LQXI
-65/150
0
1000
80
0
LQ24AAAAAL
RA
084602
R6
CY8C20324-12LQXI
-65/150
0
500
80
0
LQ24AAAAAL
RA
084602
R6
CY8C20324-12LQXI
-65/150
0
1000
80
0
LQ24ADAAGL
CA
084701
R1
CY8CTST200-24LQXI
125
0
500
77
0
LQ24ADAAGL
CA
084701
R1
CY8CTST200-24LQXI
125
0
1000
77
0
LQ24ADAAGL
CA
084701
R2
CY8C20366-24LQXI
-65/150
0
500
77
0
LQ24ADAAGL
CA
084701
R2
CY8C20366-24LQXI
-65/150
0
1000
77
0
LQ24ADAAGL
CA
084701
R3
CY8C20346-24LQXI
-65/150
0
500
76
0
LQ24ADAAGL
CA
084701
R3
CY8C20346-24LQXI
-65/150
0
1000
76
0
LQ24ABAAL
AT-INDNS
MR082030
R1
CY8C20334-12LQXI
-65/150
0
500
80
0
LQ24ABAAL
AT-INDNS
MR082030
R1
CY8C20334-12LQXI
-65/150
0
1000
80
0
LQ24ABAAL
AT-THAILAND
MR083053
R1
CY8C20324-12LQXI
-65/150
0
500
80
0
QFN (0.6mm, Saw Type, Pb-Free)
3402
0
Summary for Package Family: QFN (0.6mm, Saw Type, Pb-Free)
43
records
Sum
QFN (COL, 0.6mm, Saw Type, Pb-free)
LG16AAAAL
M-Manila
080502
R1
CY8C20234-12LKXIT
-65/150
0
500
75
0
LG16AAAAL
M-Manila
080502
R1
CY8C20234-12LKXIT
-65/150
0
1000
75
0
LG16AAAAL
M-Manila
080502
R2
CY8C20234-12LKXIT
-65/150
0
500
76
0
LG16AAAAL
M-Manila
080502
R2
CY8C20234-12LKXIT
-65/150
0
1000
76
0
LG16AAAAL
M-Manila
080502
R3
CY8C20234-12LKXIT
-65/150
0
500
77
0
LG16AAAAL
M-Manila
080502
R3
CY8C20234-12LKXIT
-65/150
0
1000
76
0
LG16AAAAL
M-PHILS
MR082028
R1
CY8C20234-12LKXI
-65/150
0
500
80
0
LG16AAAAL
M-PHILS
MR082028
R1
CY8C20234-12LKXI
-65/150
0
1000
80
0
LG16AAAAL
M-PHILS
MR083048
R1
CY8C20122-LDX2I
-65/150
0
500
79
0
LG16AAAAL
M-PHILS
MR083048
R1
CY8C20122-LDX2I
-65/150
0
500
79
0
LG16AAAAL
M-PHILS
MR083048
R1
CY8C20122-LDX2I
-65/150
0
1000
77
0
LG16AAAAL
M
MR084013
R1
CY8C20234-12LKXI
-65/150
0
500
80
0
2009 Q1 RELIABILITY REPORT
Page 47 of 61
LG16AAAAL
M
MR084013
R1
CY8C20234-12LKXI
-65/150
0
1000
80
0
LG16AAAAL
M-PHILIPPINES
NR082004
R1
CY8C20234-12LKXIT
-65/150
0
500
77
0
LG16AAAAL
M-PHILIPPINES
NR082004
R1
CY8C20234-12LKXIT
-65/150
0
1000
77
0
LG16AAAAL
M-PHILIPPINES
NR082004
R10
CY8C20122-LDX2IT
-65/150
0
500
77
0
LG16AAAAL
M-PHILIPPINES
NR082004
R10
CY8C20122-LDX2IT
-65/150
0
1000
76
0
LG16AAAAL
M-PHILIPPINES
NR082004
R11
CP6824ATT
-65/150
0
500
77
0
LG16AAAAL
M-PHILIPPINES
NR082004
R11
CP6824ATT
-65/150
0
1000
77
0
LG16AAAAL
M-PHILIPPINES
NR082004
R2
CY8C20234-12LKXIT
-65/150
0
500
77
0
LG16AAAAL
M-PHILIPPINES
NR082004
R2
CY8C20234-12LKXIT
-65/150
0
1000
77
0
LG16AAAAL
M-PHILIPPINES
NR082004
R3
CY8C20234-12LKXIT
-65/150
0
500
77
0
LG16AAAAL
M-PHILIPPINES
NR082004
R3
CY8C20234-12LKXIT
-65/150
0
1000
77
0
LG16AAAAL
M-PHILIPPINES
NR082004
R4
CY8C20110-LDX2I
-65/150
0
500
77
0
LG16AAAAL
M-PHILIPPINES
NR082004
R4
CY8C20110-LDX2I
-65/150
0
1000
77
0
LG16AAAAL
M-PHILIPPINES
NR082004
R6
CP6824ATT
-65/150
0
500
77
0
LG16AAAAL
M-PHILIPPINES
NR082004
R6
CP6824ATT
-65/150
0
1000
77
0
LG16AAAAL
M-PHILIPPINES
NR082004
R7
CP6824ATT
-65/150
0
500
77
0
LG16AAAAL
M-PHILIPPINES
NR082004
R7
CP6824ATT
-65/150
0
1000
77
0
LG16AAAAL
M-PHILIPPINES
NR082004
R8
CP6824ATT
-65/150
0
500
77
0
LG16AAAAL
M-PHILIPPINES
NR082004
R8
CP6824ATT
-65/150
0
1000
74
0
LG16AAAAL
M-PHILIPPINES
NR082004
R9
CP6824ATT
-65/150
0
500
77
0
R9
CP6824ATT
-65/150
0
1000
77
0
QFN (COL, 0.6mm, Saw Type, Pbfree)
2546
0
LG16AAAAL
M-PHILIPPINES
NR082004
Summary for Package Family: QFN (COL, 0.6mm, Saw Type, Pbfree)
33
records
Sum
QFN (Punch Type, Pb-Free)
LY32BGAGL
RA
083604
R1
CY8C21434-24LFXI
-65/150
0
500
80
0
LY32BGAGL
RA
083604
R1
CY8C21434-24LFXI
-65/150
0
1000
79
0
LY32BGAGL
RA
083604
R2
CY8C21434-24LFXI
-65/150
0
500
80
0
LY32BGAGL
RA
083604
R2
CY8C21434-24LFXI
-65/150
0
1000
80
0
LY32BGAGL
RA
083604
R3
CY8C21434-24LFXI
-65/150
0
500
80
0
LY32BGAGL
RA
083604
R3
CY8C21434-24LFXI
-65/150
0
1000
80
0
LY32BGAGL
RA-CML
083905
R1
CY8C21434-24LFXI
-65/150
0
500
80
0
LY32BGAGL
RA-CML
083905
R1
CY8C21434-24LFXI
-65/150
0
1000
80
0
LY32BGAGL
RA-CML
083905
R2
CY8C21434-24LFXI
-65/150
0
500
75
0
LY32BGAGL
RA-CML
083905
R2
CY8C21434-24LFXI
-65/150
0
1000
75
0
LY32BGAGL
RA-CML
083905
R3
CY8C21434-24LFXI
-65/150
0
500
80
0
LY32BGAGL
RA-CML
083905
R3
CY8C21434-24LFXI
-65/150
0
1000
80
0
LY40ABGAGL
L
084603
R1
CYRF6936A-40LFXC
-65/150
0
500
77
0
LY40ABGAGL
L
084603
R1
CYRF6936A-40LFXC
-65/150
0
1000
77
0
LY40ABGAGL
L
084603
R2
CYRF6936A-40LFXC
-65/150
0
500
77
0
LY40ABGAGL
L
084603
R2
CYRF6936A-40LFXC
-65/150
0
1000
77
0
LY40ABGAGL
L
084603
R3
CYRF6936A-40LFXC
-65/150
0
500
77
0
LY40ABGAGL
L
084603
R3
CYRF6936A-40LFXC
-65/150
0
1000
77
0
LY56AGAGL
L-KOREA
MR082031
R1
CY7C65630-56LFXC
-65/150
0
500
80
0
LY56AGAGL
L-KOREA
MR082031
R1
CY7C65630-56LFXC
-65/150
0
1000
80
0
LY32AAAGR
L-KOREA
MR082048
R1
CG6672AMT
-65/150
0
500
80
0
LY32AAAGR
L-KOREA
MR082048
R1
CG6672AMT
-65/150
0
1000
80
0
L
MR091024
R1
CY8CLED04-68LFXI
-65/150
0
500
80
0
R1
CY8CLED04-68LFXI
-65/150
0
1000
80
0
LY68AGAAGL
LY68AGAAGL
L
MR091024
Summary for Package Family: QFN (Punch Type, PbFree)
2009 Q1 RELIABILITY REPORT
18
records
Page 48 of 61
Sum
QFN (Punch Type, PbFree)
1891
0
QFN (Saw Type, Pb-free)
LT32BGAGL
RA-CML
082902
R1
CY8C21434-24LTXI
-65/150
0
500
79
0
LT32BGAGL
RA-CML
082902
R1
CY8C21434-24LTXI
-65/150
0
1000
79
0
LT32BGAGL
RA-CML
082902
R3
CY8C21434-24LTXI
-65/150
0
500
80
0
LT32BGAGL
RA-CML
082902
R3
CY8C21434-24LTXI
-65/150
0
1000
80
0
LT32BAAGGL
M
083907
R1
CY8C21434-24LTXI
-65/150
0
500
80
0
LT32BAAGGL
M
083907
R1
CY8C21434-24LTXI
-65/150
0
1000
80
0
LT32BAAGGL
M
083907
R2
CY8C21434-24LTXI
-65/150
0
500
80
0
LT32BAAGGL
M
083907
R2
CY8C21434-24LTXI
-65/150
0
1000
80
0
LT40ACAAGL
AE
084006
R1
CYRF6936-40LTXC
150
0
500
80
0
LT40ACAAGL
AE
084006
R1
CYRF6936-40LTXC
150
0
1000
80
0
LT40ACAAGL
AE
084006
R2
CYRF6936-40LTXC
150
0
500
80
0
LT40ACAAGL
AE
084006
R2
CYRF6936-40LTXC
150
0
1000
80
0
LT40ACAAGL
AE
084006
R3
CYRF6936-40LTXC
150
0
500
80
0
LT40ACAAGL
AE
084006
R3
CYRF6936-40LTXC
150
0
1000
80
0
LT40ACAAGL
AE
084006
R4
CYRF6936-40LTXC
150
0
500
80
0
LT40ACAAGL
AE
084006
R4
CYRF6936-40LTXC
150
0
1000
80
0
LT40ACAAGL
AE
084006
R5
CYRF6936-40LTXC
150
0
500
80
0
LT40ACAAGL
AE
084006
R5
CYRF6936-40LTXC
150
0
1000
80
0
LT40ACAAGL
AE
084006
R6
CYRF6936-40LTXC
150
0
1000
80
0
LT32BAAAGL
CA-THAILAND
MR083038
R1
CG7032AA
-65/150
0
500
80
0
LT32BAAAGL
CA-THAILAND
MR083038
R1
CG7032AA
-65/150
0
1000
80
0
LT32BAAAGL
CA-MALAYSIA
NR082002
R1
CY8C21434-24LTXI
-65/150
0
500
77
0
LT32BAAAGL
CA-MALAYSIA
NR082002
R1
CY8C21434-24LTXI
-65/150
0
1000
77
0
LT32BAAAGL
CA-MALAYSIA
NR082002
R2
CY8C21434-24LTXI
-65/150
0
500
77
0
LT32BAAAGL
CA-MALAYSIA
NR082002
R2
CY8C21434-24LTXI
-65/150
0
1000
77
0
LT32BAAGL
CA-MALAYSIA
NR082002
R3
CY8C21434-24LTXI
-65/150
0
500
76
0
LT32BAAGL
CA-MALAYSIA
NR082002
Summary for Package Family: QFN (Saw Type, Pbfree)
R3
CY8C21434-24LTXI
-65/150
0
1000
76
0
2138
0
27
records
QFN (Saw Type, Pbfree)
Sum
QSOP (Pb-Free)
SQ2414AGN
R-CML
MR082036
R1
CY7C63823-QXC
-65/150
0
500
73
0
SQ2414AGN
R-CML
MR082036
R1
CY7C63823-QXC
-65/150
0
1000
73
0
SQ2414ABGN
R-CML
MR083023
R1
CY7C63743C-QXC
-65/150
0
500
80
0
SQ2414ABGN
R-CML
MR083023
R1
CY7C63743C-QXC
-65/150
0
1000
79
0
SQ2414ABGN
R
MR091002
R1
CY7C63743C-QXC
-65/150
0
500
80
0
SQ2414ABGN
R
MR091002
R1
CY7C63743C-QXC
-65/150
0
1000
80
0
465
0
Summary for Package Family: QSOP (Pb-Free)
6
records
Sum
QSOP (Pb-Free)
RTSOP (Pb-free)
ZY28R2ALN
R-CML
MR083030
R1
CY62256VNLL-70ZRXIT
-65/150
0
500
79
0
ZY28R2ALN
R-CML
MR083030
R1
CY62256VNLL-70ZRXIT
-65/150
0
1000
79
0
ZY28R2BLN
R
MR091010
R1
CY62256NLL-70ZRXIT
-65/150
0
500
80
0
ZY28R2BLN
R
MR091010
R1
CY62256NLL-70ZRXIT
-65/150
0
1000
80
0
318
0
112
0
Summary for Package Family: RTSOP (Pb-free)
4
records
Sum
SNC (Pb-Free)
SY2831BBLN
RTSOP (Pb-free)
R-CML
2009 Q1 RELIABILITY REPORT
081203
R1
CY62256LL-55SNXI
-65/150
0
500
Page 49 of 61
SY2831BBLN
R-CML
081203
R1
CY62256LL-55SNXI
-65/150
0
1000
112
0
SY2831BBLN
R-CML
081203
R1A
CY62256LL-55SNXI
-65/150
0
500
112
0
SY2831BBLN
R-CML
081203
R1A
CY62256LL-55SNXI
-65/150
0
1000
112
0
SY2831BBLN
R-CML
MR082037
R1
CY62256NLL-70SNXC
-65/150
0
500
80
0
SY2831BBLN
R-CML
MR082037
R1
CY62256NLL-70SNXC
-65/150
0
1000
80
0
SY2831BBLN
R-CML
MR083016
R1
CY62256NLL-70SNXCT
-65/150
0
500
81
0
SY2831BBLN
R-CML
MR083016
R1
CY62256NLL-70SNXCT
-65/150
0
1000
81
0
SY2831BBLN
R
MR084004
R1
CG7107AM
-65/150
0
500
80
0
SY2831BBLN
R
MR084004
R1
CG7107AM
-65/150
0
1000
80
0
SY2831BBLN
R
MR091007
R1
CY62256NLL-70SNXCT
-65/150
0
500
80
0
SY2831BBLN
R
MR091007
R1
CY62256NLL-70SNXCT
-65/150
0
1000
75
0
1085
0
Summary for Package Family: SNC (Pb-Free)
12
records
Sum
SNC (Pb-Free)
SOIC
S1615EAGB
M-PHILS
MR082014
R1
CY2309SC-1H
-65/150
0
500
80
0
S1615EAGB
M-PHILS
MR082014
R1
CY2309SC-1H
-65/150
0
1000
80
0
S1615EAGB
M
MR083010
R1A
CY2292SL-1V1
-65/150
0
100
72
0
S1615EAGB
M
MR083010
R1A
CY2292SL-1V1
-65/150
0
300
70
0
S1615EAGB
M
MR083010
R1A
CY2292SL-1V1
-65/150
0
500
69
0
S1615EAGB
M
MR083010
R1A
CY2292SL-1V1
-65/150
0
800
69
0
S1615EAGB
M
MR083010
R1A
CY2292SL-1V1
-65/150
0
1000
69
0
S1615KBAGN
RA
MR084023
R1
CY2292F
-65/150
0
500
80
0
S1615KBAGN
RA
MR084023
R1
CY2292F
-65/150
0
1000
80
0
S0815PBAGN
RA
MR091017
R1
CY2305SI-1HT
-65/150
0
500
80
0
S0815PBAGN
RA
MR091017
R1
CY2305SI-1HT
-65/150
0
1000
80
0
S1615EAGB
M
RR083025
R1
CY2292SL-1V1T
-65/150
0
100
15
0
S1615EAGB
M
RR083025
R1
CY2292SL-1V1T
-65/150
0
300
15
0
S1615EAGB
M
RR083025
R1
CY2292SL-1V1T
-65/150
0
500
15
0
S1615EAGB
M
RR083025
R1
CY2292SL-1V1T
-65/150
0
800
15
0
S1615EAGB
M
RR083025
R1
CY2292SL-1V1T
-65/150
0
1000
15
0
S1615EAGB
M
RR083025
R2
CY2292SI-705T
-65/150
0
100
18
0
S1615EAGB
M
RR083025
R2
CY2292SI-705T
-65/150
0
300
19
0
S1615EAGB
M
RR083025
R2
CY2292SI-705T
-65/150
0
500
19
0
S1615EAGB
M
RR083025
R2
CY2292SI-705T
-65/150
0
800
19
0
S1615EAGB
M
RR083025
R2
CY2292SI-705T
-65/150
0
1000
19
0
S1615EAGB
M
RR083025
R3
CY2292SC-984T
-65/150
0
100
15
0
S1615EAGB
M
RR083025
R3
CY2292SC-984T
-65/150
0
300
15
0
S1615EAGB
M
RR083025
R3
CY2292SC-984T
-65/150
0
500
15
0
S1615EAGB
M
RR083025
R3
CY2292SC-984T
-65/150
0
800
15
0
S1615EAGB
M
RR083025
R3
CY2292SC-984T
-65/150
0
1000
15
0
S1615EAGB
M
RR083025
R4
CY2292SL-1J4T
-65/150
0
100
17
0
S1615EAGB
M
RR083025
R4
CY2292SL-1J4T
-65/150
0
300
17
0
S1615EAGB
M
RR083025
R4
CY2292SL-1J4T
-65/150
0
500
17
0
S1615EAGB
M
RR083025
R4
CY2292SL-1J4T
-65/150
0
800
17
0
S1615EAGB
M
RR083025
R4
CY2292SL-1J4T
-65/150
0
1000
17
0
1158
0
Summary for Package Family: SOIC
31
records
Sum
SOIC
SOIC (J-Lead)
V243GAAAGN
X
090302
R1
CY7C197BN-15VC
125
0
500
80
0
V243GAAAGN
X
090302
R1
CY7C197BN-15VC
125
0
1000
79
0
2009 Q1 RELIABILITY REPORT
Page 50 of 61
V243GAAAGN
X
090302
R2
CY7C197BN-15VC
125
0
500
80
0
V243GAAAGN
X
090302
R2
CY7C197BN-15VC
125
0
1000
80
0
V243GAAAGN
X
090302
R3
CY7C197BN-15VC
125
0
500
80
0
V243GAAAGN
X
090302
R3
CY7C197BN-15VC
125
0
1000
78
0
V243GAAGN
X
090302
R4
CY7C197BN-15VC
150
0
500
80
0
V243GAAGN
X
090302
R4
CY7C197BN-15VC
150
0
1000
80
0
SOIC (J-Lead)
637
0
Summary for Package Family: SOIC (J-Lead)
8
records
Sum
SOIC (J-Lead, Pb-Free)
VZ3646BGLL
R-CML
AR0806003
R1
CY7C1049CV33-10VXCT
-65/150
0
1000
11
0
VZ3648GBLL
R-CML
AR0814004
R1
CY7C1049DV33-10VXI
-65/150
0
500
11
0
VZ3648GBLL
R-CML
AR0814004
R1
CY7C1049DV33-10VXI
-65/150
0
1000
11
0
VZ3646BGLL
R-CML
AR0820004
R1
CY7C1049CV33-10VXC
-65/150
0
426
17
0
VZ3646BGLL
R-CML
AR0820004
R1
CY7C1049CV33-10VXC
-65/150
0
500
17
0
VZ3646BGLL
R-CML
AR0820004
R1
CY7C1049CV33-10VXC
-65/150
0
800
17
0
VZ3646BGLL
R-CML
AR0820004
R1
CY7C1049CV33-10VXC
-65/150
0
1000
17
0
VZ3646BGLL
R-CML
MR082009
R1
CY7C1049CV33-10VXC
-65/150
0
500
80
0
VZ3646BGLL
R-CML
MR082009
R1
CY7C1049CV33-10VXC
-65/150
0
1000
80
0
VZ28313BLN
R-CML
MR082056
R1
CY7C1399BN-12VXC
-65/150
0
500
80
0
VZ28313BLN
R-CML
MR082056
R1
CY7C1399BN-12VXC
-65/150
0
1000
80
0
VZ28313BLN
R-CML
MR083003
R1
CY7C1399BN-12VXC
-65/150
0
500
80
0
VZ28313BLN
R-CML
MR083003
R1
CY7C1399BN-12VXC
-65/150
0
1000
80
0
VZ444AABLL
R-CML
MR083035
R1
CY7C1021DV33-10VXI
-65/150
0
500
78
0
VZ444AABLL
R-CML
MR083035
R1
CY7C1021DV33-10VXI
-65/150
0
1000
77
0
VZ28313BLN
R
MR084019
R1
CY7C1399BN-12VXIT
-65/150
0
500
80
0
VZ28313BLN
R
MR084019
R1
CY7C1399BN-12VXIT
-65/150
0
1000
80
0
SOIC (J-Lead, Pb-Free)
896
0
Summary for Package Family: SOIC (J-Lead, Pb-Free)
Sum
2009 Q1 RELIABILITY REPORT
17
records
Page 51 of 61
Summary Detail -- HTS Performance Over Time
ASSY SITE
EVALNUM
TV
FBGA (0.75-0.8, 0.3mm)
BA48CRALE
BUILDKIT
T-OSE
MR082018
R1
BA48CRALE
T-OSE
MR082018
R1
Summary for Package Family: FBGA (0.75-0.8, 0.3mm)
DEVICE
2
TEMP
VOLT
READOUT
SS
REJECT
CY62137CVSL-70BAI
150
CY62137CVSL-70BAI
150
0
500
80
0
0
1000
80
0
160
0
records
Sum
FBGA (0.75-0.8, 0.3mm)
FBGA (0.75-0.8, 0.3mm, Pb-free)
BK48BWBLL
G-ASE
MR082010
R1
CY7C1021CV33-10BAXI
150
0
500
77
0
BK48BWBLL
G-ASE
MR082010
R1
CY7C1021CV33-10BAXI
150
0
1000
77
0
BK48DJALL
G
MR083050
R1
CY62177DV30LL-55BAXI
150
0
500
80
0
234
0
0
Summary for Package Family: FBGA (0.75-0.8, 0.3mm, Pb-free)
3
records
Sum
FBGA (0.75-0.8, 0.3mm, Pb-free)
FBGA (1.0-1.27)
BB165AVLE
CML-RA
MR074047
R1
CY7C1313BV18-250BZC
150
0
500
80
BB165
RA-CML
MR074047
R1
CY7C1313BV18-250BZC
150
0
1000
80
0
G-ASE
MR081067
R1
CYP15G0101DXB-BBI
150
0
500
80
0
BB100CAALE
BB100CAALE
G-ASE
MR081067
R1
CYP15G0101DXB-BBI
150
0
1000
80
0
BB100EAALE
G-TAIWAN
MR082041
R1
CY7B994V-2BBI
150
0
500
80
0
BB100EAALE
G-TAIWAN
MR082041
R1
CY7B994V-2BBI
150
0
1000
76
0
BB165AVLE
RA-CML
MR082070
R1
CY7C1313BV18-250BZC
150
0
500
80
0
BB165AVLE
RA-CML
MR082070
R1
CY7C1313BV18-250BZC
150
0
1000
78
0
634
0
Summary for Package Family: FBGA (1.0-1.27)
8
records
Sum
FBGA (1.0-1.27)
FBGA (1.0-1.27, Pb-free)
BW100EAGL
G
MR084067
R1
CYP15G0101DXB-BBXC
150
0
500
79
0
BW100EAGL
G
MR084067
R1
CYP15G0101DXB-BBXC
150
0
1000
79
0
158
0
Summary for Package Family: FBGA (1.0-1.27, Pb-free)
2
records
Sum
FBGA (1.0-1.27, Pb-free)
FLIPCHIP CSP (Pb-Free)
FN81BGAN
AU - Amkor Taiwan
080501
R1
CYWB0124ABX-FDXIT
150
0
500
90
0
FN81BGAN
080501
R1
CYWB0124ABX-FDXIT
150
0
1000
90
0
180
0
0
AU - Amkor Taiwan
Summary for Package Family: FLIPCHIP CSP (Pb-Free)
2
records
Sum
FLIPCHIP CSP (Pb-Free)
PBGA (with Heat Spreader)
BG119SALE
G-ASE
MR082021
R1
CY7C1354C-166BGC
150
0
500
80
BG119SALE
G-ASE
MR082021
R1
CY7C1354C-166BGC
150
0
1000
80
0
BG119SALE
G-TAIWAN
MR083001
R1
CY7C1354C-166BGC
150
0
500
80
0
BG119SALE
G-TAIWAN
MR083001
R1
CY7C1354C-166BGC
150
0
1000
80
0
BG119SALE
G
MR084037
R1
CY7C1354C-166BGC
150
0
500
80
0
BG119SALE
G
MR084037
R1
CY7C1354C-166BGC
150
0
1000
80
0
480
0
Summary for Package Family: PBGA (with Heat Spreader)
6
records
Sum
PBGA (with Heat Spreader)
PBGA (Cavity/Heat Sink)
BL256L2GE
G
MR084066
R1
CYP15G0401DXB-BGI
150
0
500
80
0
BL256L2GE
G
MR084066
R1
CYP15G0401DXB-BGI
150
0
1000
80
0
160
0
Summary for Package Family: PBGA (Cavity/Heat Sink)
Sum
2009 Q1 RELIABILITY REPORT
2
records
PBGA (Cavity/Heat Sink)
Page 52 of 61
FA
COMMENTS
PDIP
Summary for Package Family: PDIP
#REF!
records
Sum
PDIP
#REF!
#REF!
500
80
0
1000
80
0
80
0
PDIP (Pb-Free)
PZ183DAGN
RA-CML
MR081069
R1
CY7C63723C-PXC
150
0
PZ183DAGN
RA-CML
MR081069
R1
CY7C63723C-PXC
150
0
PZ183DAGN
RA-CML
MR082065
R1
CY7C63723C-PXC
150
0
500
PZ183DAGN
RA-CML
MR082065
R1
CY7C63723C-PXC
150
0
1000
80
0
PZ183DBGN
RA-CML
MR083022
R1
CY7C63723C-PXC
150
0
500
80
0
PZ183DBGN
RA-CML
MR083022
R1
CY7C63723C-PXC
150
0
1000
80
0
PZ183AXGN
O-OMEDATA
MR083039
R1
CS6632AF
150
0
500
80
0
X
MR084028
R1
CY7C63743C-PXC
150
0
500
80
0
PZ243AAAGN
PZ243AAAGN
X
MR084028
R1
CY7C63743C-PXC
150
0
1000
80
0
PZ183DBGN
RA
MR091008
R1
CY7C63723C-PXC
150
0
500
80
0
PZ183DBGN
RA
MR091008
R1
CY7C63723C-PXC
150
0
1000
80
0
880
0
0
Summary for Package Family: PDIP (Pb-Free)
11
records
Sum
PDIP (Pb-Free)
PLCC
J32RBGAAGB
X-MMT
MR082017
R1
CY7B9911V-5JCT
150
0
500
80
J32RBGAAGB
X-MMT
MR082017
R1
CY7B9911V-5JCT
150
0
1000
80
0
J32RBGAAGB
X-MMT
MR083024
R1
CY7B991V-5JI
150
0
500
80
0
J32RBGAAGB
X-MMT
MR083024
R1
CY7B991V-5JI
150
0
1000
78
0
J32RBGAAGB
X-MMT
MR083024
R1
CY7B991V-5JI
150
0
2000
78
0
J32RBGAAGB
X-MMT
MR083024
R1
CY7B991V-5JI
150
0
2000
78
0
J32RBGAAGB
X-MMT
MR083024
R1
CY7B991V-5JI
150
0
2500
78
0
J32RBGAAGB
X-MMT
MR083024
R1
CY7B991V-5JI
150
0
3000
78
0
630
0
#REF!
#REF!
Summary for Package Family: PLCC
8
records
Sum
PLCC
PLCC (Pb-Free)
Summary for Package Family: PLCC (Pb-Free)
#REF!
records
Sum
PLCC (Pb-Free)
PQFP (Pb-free)
NZ52DXGAN
G-ASE
MR082061
R1
CY7C131-25NXC
150
0
500
80
0
NZ52DXGAN
G-ASE
MR082061
R1
CY7C131-25NXC
150
0
1000
80
0
160
0
Summary for Package Family: PQFP (Pb-free)
2
records
Sum
PQFP (Pb-free)
QFN (Open Cavity, Pb-free)
LB42ABALL
R-CML
NR081004
R1
CYONS10810-LBXC
100
0
500
77
0
LB42ABALL
R-CML
NR081004
R1
CYONS10810-LBXC
100
0
1000
77
0
LB42ABALL
R-CML
NR081004
R2
CYONS10810-LBXC
100
0
500
77
0
LB42ABALL
R-CML
NR081004
R2
CYONS10810-LBXC
100
0
1000
77
0
LB42ABALL
R-CML
NR081004
R3
CYONS10810-LBXC
100
0
500
77
0
LB42ABALL
R-CML
NR081004
R3
CYONS10810-LBXC
100
0
1000
77
0
462
0
Summary for Package Family: QFN (Open Cavity, Pb-free)
6
records
Sum
QFN (Open Cavity, Pb-free)
QFN (0.4mm, Saw Type, Pb-free)
LN32AAAAAL
LN32AAAAAL
CA-Malaysia
CA
82008
MR091052
R1
R1
LN32AAAAAL
CA
MR091052
R1
Summary for Package Family: QFN (COL, 0.6mm, Saw Type, Pb-
2009 Q1 RELIABILITY REPORT
3
0
CY8C21434-24LCXI
CP7052BTT
150
150
0
500
500
77
80
0
0
CP7052BTT
150
0
1000
80
0
records
Page 53 of 61
free)
Sum
QFN (0.4mm, Saw Type, Pb-free)
237
0
0
500
80
0
0
1000
80
0
150
0
500
80
0
CY8C20424-12LKXI
150
0
1000
79
0
CY8C20434-12LKXIT
150
0
500
80
0
R1
CY8C20434-12LKXIT
150
0
1000
80
0
NR072004
R2
CY8C20424-12LKXI
150
0
1000
77
0
NR072004
R3
CP6683AM
150
0
1000
80
0
636
0
QFN (0.6mm, Punch Type, Pb-Free)
LK32AABAGL
L-KOREA
MR082022
R1
CY8C20434-12LKXI
150
LK32AABAGL
L-KOREA
MR082022
R1
CY8C20434-12LKXI
150
LK32AABAGL
L-KOREA
MR083006
R1
CY8C20424-12LKXI
LK32AABAGL
L-KOREA
MR083006
R1
LK32AABAGL
L
MR091011
R1
LK32AABAGL
L
MR091011
LK32AABAGL
L-KOREA
LK32AABAGL
L-KOREA
Summary for Package Family: QFN (0.6mm, Punch Type, Pb-Free)
8
records
QFN (0.6mm, Punch Type, PbFree)
Sum
QFN (0.6mm, Saw Type, Pb-Free)
LQ32DAGLL
CA-MALAYSIA
082602
R1
CY8C23533-24LQXI
150
0
500
80
0
LQ32DAGLL
CA-MALAYSIA
082602
R1
CY8C23533-24LQXI
150
0
1000
80
0
LT32BAABGL
RA
084602
R7
CY8C21434-24LTXIKA
150
0
500
77
0
LT32BAABGL
RA
084602
R7
CY8C21434-24LTXIKA
150
0
1000
77
0
LQ24ADAAGL
CA
084701
R1
CY8CTST200-24LQXI
150
0
500
77
0
0
LQ24ADAAGL
CA
084701
R1
CY8CTST200-24LQXI
150
0
1000
76
LQ24ABAAL
AT-INDNS
MR082030
R1
CY8C20334-12LQXI
150
0
500
80
0
LQ24ABAAL
AT-INDNS
MR082030
R1
CY8C20334-12LQXI
150
0
1000
80
0
LQ24ABAAL
AT-THAILAND
MR083053
R1
CY8C20324-12LQXI
150
0
500
79
0
LQ24ABAAL
AT-THAILAND
MR083053
R1
CY8C20324-12LQXI
150
0
1000
79
0
LQ24ABAAL
AT-INDOENESIA
NR073002
R1A
CY8C20334-12LQXI
150
0
500
80
0
LQ24ABAAL
AT-INDOENESIA
NR073002
R1A
CY8C20334-12LQXI
150
0
1000
80
0
QFN (0.6mm, Saw Type, Pb-Free)
945
0
0
Summary for Package Family: QFN (0.6mm, Saw Type, Pb-Free)
12
records
Sum
QFN (COL, 0.6mm, Saw Type, Pb-free)
LG16AAAAL
M-PHILS
MR082028
R1
CY8C20234-12LKXI
150
0
500
80
LG16AAAAL
M-PHILS
MR082028
R1
CY8C20234-12LKXI
150
0
1000
80
0
LG16AAAAL
M-PHILS
MR083048
R1
CY8C20122-LDX2I
150
0
500
80
0
LG16AAAAL
M-PHILS
MR083048
R1
CY8C20122-LDX2I
150
0
1000
80
0
LG16AAAAL
M
MR084013
R1
CY8C20234-12LKXI
150
0
500
80
0
R1
CY8C20234-12LKXI
150
0
1000
80
0
QFN (COL, 0.6mm, Saw Type, Pbfree)
480
0
LG16AAAAL
M
MR084013
Summary for Package Family: QFN (COL, 0.6mm, Saw Type, Pbfree)
6
records
Sum
QFN (Punch Type, Pb-Free)
LY56AGAGL
L-KOREA
MR082031
R1
CY7C65630-56LFXC
150
0
500
80
0
LY56AGAGL
L-KOREA
MR082031
R1
CY7C65630-56LFXC
150
0
1000
80
0
LY32AAAGR
L-KOREA
MR082048
R1
CG6672AMT
150
0
500
80
0
LY32AAAGR
L-KOREA
MR082048
R1
CG6672AMT
150
0
1000
80
0
LY68AGABGL
L
MR084009
R1
CS6656AAT
150
0
500
80
0
LY68AGABGL
L
MR084009
R1
CS6656AAT
150
0
1000
80
0
LY68AGAAGL
L
MR091024
R1
CY8CLED04-68LFXI
150
0
500
80
0
LY68AGAAGL
L
MR091024
R1
CY8CLED04-68LFXI
150
0
1000
80
0
640
0
Summary for Package Family: QFN (Punch Type, Pb-Free)
Sum
8
records
QFN (Punch Type, Pb-Free)
QFN (Saw Type, Pb-free)
2009 Q1 RELIABILITY REPORT
Page 54 of 61
LT32BAAAGL
CA-THAILAND
MR083038
R1
CG7032AA
150
0
500
80
0
LT32BAAAGL
CA-THAILAND
MR083038
R1
CG7032AA
150
0
1000
80
0
LT32BAAAGL
CA-MALAYSIA
NR082002
R1
CY8C21434-24LTXI
150
0
500
77
0
LT32BAAAGL
CA-MALAYSIA
NR082002
R1
CY8C21434-24LTXI
150
0
1000
77
0
LT32BAAAGL
CA-MALAYSIA
NR082002
R2
CY8C21434-24LTXI
150
0
500
77
0
LT32BAAAGL
CA-MALAYSIA
NR082002
R2
CY8C21434-24LTXI
150
0
1000
77
0
LT32BAAGL
CA-MALAYSIA
NR082002
R3
CY8C21434-24LTXI
150
0
500
77
0
LT32BAAGL
CA-MALAYSIA
NR082002
R3
CY8C21434-24LTXI
150
0
1000
77
0
622
0
Summary for Package Family: QFN (Saw Type, Pb-free)
8
records
Sum
QFN (Saw Type, Pb-free)
QSOP (Pb-Free)
SQ2414AGN
R-CML
MR082036
R1
CY7C63823-QXC
150
0
500
80
0
SQ2414AGN
R-CML
MR082036
R1
CY7C63823-QXC
150
0
1000
80
0
SQ2414ABGN
R-CML
MR083023
R1
CY7C63743-QXC
150
0
500
80
0
SQ2414ABGN
R-CML
MR083023
R1
CY7C63743C-QXC
150
0
500
80
0
SQ2414ABGN
R-CML
MR083023
R1
CY7C63743C-QXC
150
0
1000
80
0
SQ2414ABGN
R
MR091002
R1
CY7C63743C-QXC
150
0
500
80
0
SQ2414ABGN
R
MR091002
R1
CY7C63743C-QXC
150
0
1000
80
0
560
0
Summary for Package Family: QSOP (Pb-Free)
7
records
Sum
QSOP (Pb-Free)
RTSOP (Pb-free)
ZY28R2ALN
R-CML
MR083030
R1
CY62256VNLL-70ZRXIT
150
0
500
80
0
ZY28R2ALN
R-CML
MR083030
R1
CY62256VNLL-70ZRXIT
150
0
1000
80
0
ZY28R2BLN
R
MR091010
R1
CY62256NLL-70ZRXIT
150
0
500
80
0
ZY28R2BLN
R
MR091010
R1
CY62256NLL-70ZRXIT
150
0
1000
80
0
320
0
Summary for Package Family: RTSOP (Pb-free)
4
records
Sum
RTSOP (Pb-free)
SNC (Pb-Free)
SY2831BBLN
R-CML
MR082037
R1
CY62256NLL-70SNXC
150
0
500
80
0
SY2831BBLN
R-CML
MR082037
R1
CY62256NLL-70SNXC
150
0
1000
80
0
SY2831BBLN
R-CML
MR083016
R1
CY62256NLL-70SNXCT
150
0
500
80
0
SY2831BBLN
R-CML
MR083016
R1
CY62256NLL-70SNXCT
150
0
1000
80
0
SY2831BBLN
R
MR084004
R1
CG7107AM
150
0
500
80
0
SY2831BBLN
R
MR084004
R1
CG7107AM
150
0
1000
80
0
SY2831BBLN
R
MR091007
R1
CY62256NLL-70SNXCT
150
0
500
80
0
SY2831BBLN
R
MR091007
R1
CY62256NLL-70SNXCT
150
0
1000
80
0
640
0
0
Summary for Package Family: SNC (Pb-Free)
8
records
Sum
SNC (Pb-Free)
SOIC
S1615EAGB
M-PHILS
MR082014
R1
CY2309SC-1H
150
0
500
80
S1615EAGB
M-PHILS
MR082014
R1
CY2309SC-1H
150
0
1000
78
0
S1615EGB
M-PHILS
MR083010
R1
CY2308SC-1T
150
0
500
80
0
S1615EGB
M-PHILS
MR083010
R1
CY2308SC-1T
150
0
1000
80
0
RA
MR084023
R1
CY2292F
150
0
500
80
0
S1615KBAGN
S1615KBAGN
RA
MR084023
R1
CY2292F
150
0
1000
80
0
S0815PBAGN
RA
MR091017
R1
CY2305SI-1HT
150
0
500
80
0
S0815PBAGN
RA
MR091017
R1
CY2305SI-1HT
150
0
1000
80
0
638
0
Summary for Package Family: SOIC
Sum
8
records
SOIC
SOIC (J-Lead)
2009 Q1 RELIABILITY REPORT
Page 55 of 61
V243GAAAGN
X
090302
R1
CY7C197BN-15VC
150
0
500
80
0
V243GAAAGN
X
090302
R1
CY7C197BN-15VC
150
0
1000
80
0
160
0
0
Summary for Package Family: SOIC (J-Lead)
#REF!
records
Sum
SOIC (J-Lead)
SOIC (J-Lead, Pb-Free)
VZ3646BGLL
R-CML
MR082009
R1
CY7C1049CV33-10VXC
150
0
500
80
VZ3646BGLL
R-CML
MR082009
R1
CY7C1049CV33-10VXC
150
0
1000
80
0
VZ28313BLN
R-CML
MR082056
R1
CY7C1399BN-12VXC
150
0
500
80
0
VZ28313BLN
R-CML
MR082056
R1
CY7C1399BN-12VXC
150
0
1000
80
0
VZ28313BLN
R-CML
MR083003
R1
CY7C1399BN-12VXC
150
0
500
80
0
VZ28313BLN
R-CML
MR083003
R1
CY7C1399BN-12VXC
150
0
1000
80
0
VZ444AABLL
R-CML
MR083035
R1
CY7C1021DV33-10VXI
150
0
500
78
0
VZ444AABLL
R-CML
MR083035
R1
CY7C1021DV33-10VXI
150
0
1000
76
0
VZ28313BLN
R
MR084019
R1
CY7C1399BN-12VXIT
150
0
500
79
0
VZ28313BLN
R
MR084019
R1
CY7C1399BN-12VXIT
150
0
1000
79
0
SOIC (J-Lead, PbFree)
792
0
Summary for Package Family: SOIC (J-Lead, Pb-Free)
10
records
Sum
SOIC (Pb-Free)
SZ815CGAN
M - Manila
080803
R1
CY2305CSXI-1H
150
0
1000
80
0
SZ1615DGN
M-Amkor
081907
R1
CY2309CSXI-1H
150
0
500
80
0
SZ1615DGN
M-Amkor
081907
R1
CY2309CSXI-1H
150
0
1000
80
0
SZ1615NAGN
CA-MALAYSIA
082203
R1
CY8C20180-SX2I
150
0
500
77
0
SZ1615NAGN
CA-MALAYSIA
082203
R1
CY8C20180-SX2I
150
0
1000
77
0
SZ324516LL
R-CML
MR082005
R1
CY62148ELL-55SXI
150
0
500
80
0
SZ324516LL
R-CML
MR082005
R1
CY62148ELL-55SXI
150
0
1000
80
0
SZ28327BGL
R-CML
MR082006
R1
CY8C27443-24SXI
150
0
500
80
0
SZ28327BGL
R-CML
MR082006
R1
CY8C27443-24SXI
150
0
1000
80
0
SZ183CGAN
RA-CML
MR082012
R1
CY7C63723C-SXC
150
0
500
80
0
SZ183CGAN
RA-CML
MR082012
R1
CY7C63723C-SXC
150
0
1000
80
0
SZ1615KGN
RA-CML
MR082015
R1
CY2309SXC-1HT
150
0
500
80
0
SZ1615KGN
RA-CML
MR082015
R1
CY2309SXC-1HT
150
0
1000
80
0
SZ1615FAL
T-OSE
MR082016
R1
CY8C201A0-SX2I
150
0
500
80
0
SZ1615FAL
SZ1815CGAN
T-OSE
MR082016
R1
CY8C201A0-SX2I
150
0
1000
80
0
M-PHILS
MR082023
R1
CY8C24123A-24SXI
150
0
500
80
0
SZ1815CGAN
M-PHILS
MR082023
R1
CY8C24123A-24SXI
150
0
1000
80
0
SZ1615EGN
M-PHILS
MR082025
R1
CY2309NZSXC-1H
150
0
500
80
0
SZ1615EGN
M-PHILS
MR082025
R1
CY2309NZSXC-1H
150
0
1000
80
0
SZ24312BGN
R-CML
MR082057
R1
CY7C63743C-SXC
150
0
500
80
0
SZ24312BGN
R-CML
MR082057
R1
CY7C63743C-SXC
150
0
1000
80
0
SZ1615DGN
M-PHILS
MR083009
R1
CY2292SXL-1X6T
150
0
500
80
0
SZ1615DGN
M-PHILS
MR083009
R1
CY2292SXL-1X6T
150
0
1000
80
0
SZ324516BL
R-CML
MR083017
R1
CY62148ELL-55SXIT
150
0
500
80
0
SZ324516BL
R-CML
MR083017
R1
CY62148ELL-55SXIT
150
0
1000
80
0
SZ28327BGL
R-CML
MR083018
R1
CY8C27443-24SXIT
150
0
500
80
0
SZ28327BGL
R-CML
MR083018
R1
CY8C27443-24SXIT
150
0
1000
80
0
SZ183CBGAN
RA-CML
MR083019
R1
CY7C63723C-SXC
150
0
500
80
0
SZ183CBGAN
RA-CML
MR083019
R1
CY7C63723C-SXC
150
0
1000
80
0
SZ183CBGAN
RA-CML
MR083019
R1
CY7C63723C-SXC
150
0
1500
80
0
SZ183CBGAN
RA-CML
MR083019
R1
CY7C63723C-SXC
150
0
2000
80
0
2009 Q1 RELIABILITY REPORT
Page 56 of 61
SZ183CBGAN
RA-CML
MR083019
R1
CY7C63723C-SXC
150
0
2500
80
0
SZ24315BGN
RA-CML
MR083025
R1
CY7C63823-SXC
150
0
500
80
0
SZ24315BGN
RA-CML
MR083025
R1
CY7C63823-SXC
150
0
1000
80
0
SZ815PABGN
RA-CML
MR083034
R1
CY2305SXC-1H
150
0
500
78
0
SZ815PABGN
RA-CML
MR083034
R1
CY2305SXC-1H
150
0
1000
78
0
SZ1615FAL
T-TAIWAN
MR083041
R1
CY23EP09SXC-1H
150
0
500
80
0
SZ1615FAL
T-TAIWAN
MR083041
R1
CY23EP09SXC-1H
150
0
1000
80
0
SZ815DAGN
M
MR084018
R1
CY2304SXI-2
150
0
500
80
0
SZ815DAGN
M
MR084018
R1
CY2304SXI-2
150
0
1000
80
0
SZ183CBGAN
RA
MR084026
R1
CY7C63723C-SXC
150
0
500
80
0
SZ183CBGAN
RA
MR084026
R1
CY7C63723C-SXC
150
0
1000
80
0
SZ24315BGN
RA
MR084029
R1
CY7C63743C-SXC
150
0
500
80
0
SZ24315BGN
RA
MR084029
R1
CY7C63743C-SXC
150
0
1000
80
0
SZ1615FAL
T
MR084072
R1
CY2309CSXC-1T
150
0
500
80
0
SZ1615FAL
T
MR084072
R1
CY2309CSXC-1T
150
0
1000
80
0
SZ32457BLN
R
MR091004
R1
CY62128ELL-45SXIT
150
0
500
80
0
SZ32457BLN
R
MR091004
R1
CY62128ELL-45SXIT
150
0
1000
80
0
SZ1615BKGN
RA
MR091016
R1
CY2308SXC-2T
150
0
500
80
0
SZ1615BKGN
RA
MR091016
R1
CY2308SXC-2T
150
0
1000
80
0
SZ1615EGN
M
MR091020
R1
CY2309SXI-1HT
150
0
500
80
0
SZ1615EGN
M
MR091020
R1
CY2309SXI-1HT
150
0
1000
80
0
SZ2035BAL
R
MR091001
R1
CY8C27243-24SXI
150
0
1000
80
0
SZ2035BAL
R
MR091001
R1
CY8C27243-24SXI
150
0
500
80
0
RA
MR091003
R1
CY7C63723C-SXC
150
0
500
80
0
SZ815PAGN
RA-CML
NR081002
R14
CY22560SXI
150
0
500
80
0
SZ815PAGN
RA-CML
NR081002
R14
CY22560SXI
150
0
1000
80
0
SZ815PAGN
RA-CML
NR081002
R2
CY25560SXC
150
0
1000
80
0
4630
0
SZ183CBGAN
Summary for Package Family: SOIC (Pb-Free)
58
records
Sum
SOIC (Pb-Free)
SSOP (Pb-Free)
A32LXGXGB
Q
MR091043
R1
CY29948ACT
150
0
500
80
0
A32LXGXGB
Q
MR091043
R1
CY29948ACT
150
0
1000
80
0
SP202AAAGN
RA-CML
MR082007
R1
CP6650AMT
150
0
500
80
0
SP202AAAGN
RA-CML
MR082007
R1
CP6650AMT
150
0
1000
80
0
SP28214GL
T-OSE
MR082013
R1
CY8C26443-24PVX
150
0
500
80
0
SP28214GL
T-OSE
MR082013
R1
CY8C26443-24PVX
150
0
1000
80
0
SP28214GL
T-TAIWAN
MR083036
R1
CY8C9520A-24PVXI
150
0
500
80
0
SP28214GL
T-TAIWAN
MR083036
R1
CY8C9520A-24PVXI
150
0
1000
80
0
SP28215BGL
RA-CML
MR083021
R1
CY8C21534-24PVXI
150
0
500
80
0
SP28215BGL
RA-CML
MR083021
R1
CY8C21534-24PVXI
150
0
1000
80
0
SP28215BGL
RA-CML
MR083021
R1
CY8C21534-24PVXI
150
0
1500
80
0
SP28215BGL
RA-CML
MR083021
R1
CY8C21534-24PVXI
150
0
2000
80
0
SP28215BGL
RA-CML
MR083021
R1
CY8C21534-24PVXI
150
0
2500
80
0
SP28215GGL
RA-CML
MR081016
R1A
CY8C21534-24PVXI
150
0
1000
80
0
SP2822BGL
M-PHILS
MR082038
R1
CY8C24423A-12PVXE
150
0
500
80
0
SP2822BGL
M-PHILS
MR082038
R1
CY8C24423A-12PVXE
150
0
1000
80
0
SP2822BGL
M-PHILS
MR083008
R1
CY8C21534-12PVXET
150
0
500
80
0
SP2822BGL
M-PHILS
MR083008
R1
CY8C21534-12PVXET
150
0
1000
80
0
SP2822BGL
M
MR091006
R1
CY8C27443-12PVXE
150
0
1000
80
0
SP2822BGL
M
MR091042
R1
CP6801ATT
150
0
1000
80
0
2009 Q1 RELIABILITY REPORT
Page 57 of 61
SP2824HAN
T
MR084021
R1
CY8C24533-24PVXI
150
0
500
80
0
SP2824HAN
T
MR084021
R1
CY8C24533-24PVXI
150
0
1000
80
0
SP483AGAN
R
084703
R1
CY8C20566-24PVXI
150
0
1000
75
0
SP483AGAN
R
084703
R1
CY8C20566-24PVXI
150
0
1500
74
0
SP483EBBAL
R
MR091005
R1
CY8C27643-24PVXI
150
0
500
80
0
SP483EBBAL
R
MR091005
R1
CY8C27643-24PVXI
150
0
1000
80
0
SP483HAAGR
M-PHILS
MR082071
R1
CY14B101L-SP45XC
150
0
500
80
0
SP483HAAGR
M-PHILS
MR082071
R1
CY14B101L-SP45XC
150
0
1000
79
0
SP483HAAGR
M-PHILS
MR082071
R1
CY14B101L-SP45XC
150
0
1500
72
0
R-CML
MR083011
R1
CY7C68013-56PVXC
150
0
500
80
0
SP563BBBG
SP563BBBG
R-CML
MR083011
R1
CY7C68013-56PVXC
150
0
1000
79
0
SP563BBBGL
R-CML
MR082008
R1
CY7C68300C-56PVXC
150
0
500
80
0
SP563BBBGL
R-CML
MR082008
R1
CY7C68300C-56PVXC
150
0
1000
80
0
2300
0
Summary for Package Family: SSOP (Pb-Free)
29
records
Sum
SSOP (Pb-Free)
TQFP
A32LXGXGB
Q-KOREA
MR082024
R1
CY29948AC
150
0
500
80
0
A32LXGXGB
Q-KOREA
MR082024
R1
CY29948AC
150
0
1000
79
0
A32LXGXGB
Q-KOREA
MR083012
R1
CY29948AI
150
0
500
80
0
A32LXGXGB
Q-KOREA
MR083012
R1
CY29948AI
150
0
1000
80
0
319
0
TQFP (10mm X 10mm)
#REF!
#REF!
Summary for Package Family: TQFP
4
records
Sum
TQFP
TQFP (10mm X 10mm)
Summary for Package Family: TQFP (10mm X 10mm)
#REF!
records
Sum
TQFP (Pb-Free)
AZ128SABLL
R-CML
MR082004
R1
CY7C68013A-128AXC
150
0
500
80
0
AZ128SABLL
R-CML
MR082004
R1
CY7C68013A-128AXC
150
0
1000
80
0
AZ32GXGAN
G-ASE
MR082020
R1
CY29942AXI
150
0
500
80
0
AZ32GXGAN
G-ASE
MR082020
R1
CY29942AXI
150
0
1000
80
0
AZ32GXGAN
G-TAIWAN
MR082020
R1A
CY22942AXI
150
0
500
78
0
AZ32GXGAN
G-TAIWAN
MR082020
R1A
CY22942AXI
150
0
1000
78
0
AZ44SGGAN
R-CML
MR082040
R1
CS6567AM
150
0
500
80
0
AZ44SGGAN
R-CML
MR082040
R1
CS6567AM
150
0
1000
80
0
AZ100SFA
R-CML
MR082049
R1
CY7C024-25AXC
150
0
500
80
0
AZ100SFA
R-CML
MR082049
R1
CY7C024-25AXC
150
0
1000
79
0
AZ32BXGAN
Q-KOREA
MR082054
R1
CY7C4251V-15AXC
150
0
500
80
0
AZ32BXGAN
Q-KOREA
MR082054
R1
CY7C4251V-15AXC
150
0
1000
80
0
AZ44SGGAN
R-CML
MR082060
R1
CS6567AM
150
0
500
80
0
AZ44SGGAN
R-CML
MR082060
R1
CS6567AM
150
0
1000
80
0
AZ44SGGAN
R-CML
MR083014
R1
CS6567AM
150
0
500
80
0
AZ44SGGAN
R-CML
MR083014
R1
CS6567AM
150
0
1000
80
0
AZ32BXGAN
Q-KOREA
MR083031
R1
CY7C4251V-25AXC
150
0
500
80
0
AZ32BXGAN
Q-KOREA
MR083031
R1
CY7C4251V-25AXC
150
0
1000
80
0
AZ100SEAL
RA-CML
MR083032
R1
CY7B994V-5AXI
150
0
500
80
0
AZ100SEAL
RA-CML
MR083032
R1
CY7B994V-5AXI
150
0
1000
80
0
AZ100RBBLN
R
MR084002
R1
CY7C1370D-167AXI
150
0
500
80
0
AZ100RBBLN
R
MR084002
R1
CY7C1370D-167AXI
150
0
1000
80
0
AZ44SFGAN
R
MR084010
R1
CY37032P44-125AXC
150
0
500
80
0
AZ44SFGAN
R
MR084010
R1
CY37032P44-125AXC
150
0
1000
80
0
2009 Q1 RELIABILITY REPORT
Page 58 of 61
AZ32LXGAN
Q
MR084017
R1
CY29948AXC
150
0
500
80
0
AZ32LXGAN
Q
MR084017
R1
CY29948AXC
150
0
1000
80
0
2075
0
EXPOSED TSOP (Pbfree)
#REF!
#REF!
Summary for Package Family: TQFP (Pb-Free)
26
records
Sum
TQFP (Pb-Free)
EXPOSED TSOP (Pb-free)
Summary for Package Family : EXPOSED TSOP (Pbfree)
#REF!
records
Sum
TSOP (Pb-free)
ZT32RABALL
T-OSE
MR082019
R1
CY62128EV30LL-45ZXI
150
0
500
80
0
ZT32RABALL
T-OSE
MR082019
R1
CY62128EV30LL-45ZXI
150
0
1000
80
0
ZT28R4BGL
R-CML
MR083028
RIA
CY7C1399BN-12ZXC
150
0
500
80
0
ZT28R4BGL
R-CML
MR083028
RIA
CY7C1399BN-12ZXC
150
0
500
78
0
ZT28R4BGL
R-CML
MR083028
RIA
CY7C1399BN-12ZXC
150
0
1000
80
0
ZT28R4BGL
R-CML
MR083028
RIA
CY7C1399BN-12ZXC
150
0
1000
76
0
ZT32RABALL
T-OSE
MR083051
R1
CY62128BLL-70ZXC
150
0
500
80
0
ZT32RABALL
T-OSE
MR083051
R1
CY62128BLL-70ZXC
150
0
1000
80
0
ZT32RAEBLN
RA
MR084006
R1
CG6708AMT
150
0
500
80
0
ZT32RAEBLN
RA
MR084006
R1
CG6708AMT
150
0
1000
80
0
ZT28R2BBLN
R
MR084060
R1
CY62256VNLL-70ZXC
150
0
500
80
0
ZT28R2BBLN
R
MR084060
R1
CY62256VNLL-70ZXC
150
0
1000
80
0
ZT28R2BBLN
R
MR091012
R1
CY62256NLL-55ZXIT
150
0
500
80
0
ZT28R2BBLN
R
MR091012
R1
CY62256NLL-55ZXIT
150
0
1000
80
0
ZT32RAEBLN
RA
MR091014
R1
CY62128EV30LL-45ZXI
150
0
500
80
0
ZT32RAEBLN
RA
MR091014
R1
CY62128EV30LL-45ZXI
150
0
1000
80
0
ZT32RABALL
T
MR091021
R1
CY62128EV30LL-45ZXI
150
0
500
80
0
ZT32RABALL
T
MR091021
R1
CY62128EV30LL-45ZXI
150
0
1000
80
0
1434
0
Summary for Package Family: TSOP (Pb-free)
18
records
Sum
TSOP (Pb-free)
TSOP I (Pb-Free)
ZB32RHALN
R-CML
MR082003
R1
CY62128EV30LL-45ZAXI
150
0
500
80
0
ZB32RHALN
R-CML
MR082003
R1
CY62128EV30LL-45ZAXI
150
0
1000
80
0
ZB32RHALL
R-CML
MR082053
R1
CY62128DV30LL-55ZAXI
150
0
500
80
0
ZB32RHALL
R-CML
MR082053
R1
CY62128DV30LL-55ZAXI
150
0
1000
80
0
ZB32RHBALN
R-CML
MR083042
R1
CY62128ELL-45ZAXI
150
0
500
80
0
ZB32RHBALN
R-CML
MR083042
R1
CY62128ELL-45ZAXI
150
0
1000
80
0
ZB32RHBALN
R
MR091031
R1
CG7086AM
150
0
500
80
0
ZB32RHBALN
R
MR091031
R1
CG7086AM
150
0
1000
80
0
640
0
#REF!
#REF!
Summary for Package Family: TSOP I (Pb-Free)
8
records
Sum
TSOP I (Pb-Free)
TSOP II
Summary for Package Family: TSOP II
#REF!
records
Sum
TSOP II
TSOP II (Pb-Free)
ZW444AMBLN
R-CML
MR082002
R1
CY62146EV30LL-45SZSX
150
0
500
80
0
ZW444AMBLN
R-CML
MR082002
R1
CY62146EV30LL-45SZSX
150
0
1000
80
0
ZW324CBLL
T-OSE
MR082026
R1
CY62148ELL-45ZSXI
150
0
500
80
0
ZW324CBLL
T-OSE
MR082026
R1
CY62148ELL-45ZSXI
150
0
1000
80
0
ZW544AALL
G-ASEK
MR082034
R1A
CY7C1069AV33-10ZXC
150
0
500
79
0
ZW544AALL
G-ASEK
MR082034
R1A
CY7C1069AV33-10ZXC
150
0
1000
78
0
2009 Q1 RELIABILITY REPORT
Page 59 of 61
ZW544AALL
G-TAIWAN
MR083002
R1
CY7C1069AV33-10ZX
150
0
500
80
0
ZW544AALL
G-TAIWAN
MR083002
R1
CY7C1069AV33-10ZX
150
0
1000
80
0
ZW444AHBLL
R-CML
MR083020
R1
CY7C1021DV33-10ZSXI
150
0
500
80
0
ZW444AHBLL
R-CML
MR083020
R1
CY7C1021DV33-10ZSXI
150
0
1000
80
0
ZW324CBLL
T-OSE
MR083043
R1
CY62148EV30LL-45ZSXI
150
0
500
80
0
ZW324CBLL
T-OSE
MR083043
R1
CY62148EV30LL-45ZSXI
150
0
1000
80
0
ZW444AJBLN
R-CML
MR083071
R1
CY7C1021CV33-10ZXC
150
0
1000
80
0
ZW444AHBLL
R
MR084007
R1
CG6850AM
150
0
500
80
0
ZW444AHBLL
R
MR084007
R1
CG6850AM
150
0
1000
80
0
ZW324CBLL
T
MR084025
R1
CG7092AM
150
0
500
80
0
ZW324CBLL
T
MR084025
R1
CG7092AM
150
0
1000
79
0
ZW544AALL
G
MR084038
R1
CY7C1061AV33-10ZXC
150
0
500
80
0
ZW544AALL
G
MR084038
R1
CY7C1061AV33-10ZXC
150
0
1000
80
0
1516
0
Summary for Package Family: TSOP II (Pb-Free)
19
records
Sum
TSOP II (Pb-Free)
TSSOP
Z1620GAGN
RA-CML
MR082029
R1
CY2309ZC-1H
150
0
500
79
0
Z1620GAGN
RA-CML
MR082029
R1
CY2309ZC-1H
150
0
1000
79
0
Z1611XAGB
M-PHILS
MR082033
R1
CY2308ZC-1H
150
0
500
80
0
Z1611XAGB
M-PHILS
MR082033
R1
CY2308ZC-1H
150
0
1000
80
0
Z1620GAGN
RA-CML
MR083033
R1
CY2309ZC-1H
150
0
500
80
0
Z1620GAGN
RA-CML
MR083033
R1
CY2309ZC-1H
150
0
1000
80
0
Z1620GBAGN
RA
MR084016
R1
CY2309ZC-1HT
150
0
500
79
0
Z1620GBAGN
RA
MR084016
R1
CY2309ZC-1HT
150
0
1000
78
0
Summary for Package Family: TSSOP
8
records
Sum
TSSOP
635
0
500
80
0
1000
80
0
500
80
0
0
1000
80
0
0
500
80
0
0
1000
80
0
TSSOP (Pb-Free)
ZZ1613HAN
T-OSE
MR082011
R1
CY2308ZXI-1HT
150
0
ZZ1613HAN
T-OSE
MR082011
R1
CY2308ZXI-1HT
150
0
ZZ1620GAN
RA-CML
MR082032
R1
CY2308ZXI-1H
150
0
ZZ1620GAN
RA-CML
MR082032
R1
CY2308ZXI-1H
150
ZZ1620GBAN
RA-CML
MR083015
R1
CY22150FZXI
150
ZZ1620GBAN
RA-CML
MR083015
R1
CY22150FZXI
150
ZZ0812BGL
T-TAIWAN
MR083044
R1
CY24904ZXC
150
0
500
80
0
ZZ0812BGL
T-TAIWAN
MR083044
R1
CY24904ZXC
150
0
1000
80
0
ZZ1619GAN
RA
MR084065
R1
CY2309CZXI-1H
150
0
500
80
0
ZZ1619GAN
RA
MR084065
R1
CY2309CZXI-1H
150
0
1000
80
0
ZZ1620GBAN
RA
MR091018
R1
CY2309ZXC-1HT
150
0
500
80
0
ZZ1620GBAN
RA
MR091018
R1
CY2309ZXC-1HT
150
0
1000
80
0
ZZ0812BGL
T
MR091019
R1
CY25100ZXC38T
150
0
500
80
0
ZZ0812BGL
T
MR091019
R1
CY25100ZXC38T
150
0
1000
80
0
1120
0
Summary for Package Family: TSSOP (Pb-Free)
14
records
Sum
TSSOP (Pb-Free)
VFBGA (0.75-0.8, 0.3mm)
BV48AAALE
G-TAIWAN
MR083013
R1
CY62157DV30LL-55BVI
150
0
500
80
0
BV48AAALE
MR083013
R1
CY62157DV30LL-55BVI
150
0
1000
80
0
160
0
79
0
G-TAIWAN
Summary for Package Family: VFBGA (0.75-0.8, 0.3mm)
2
records
Sum
VFBGA (0.75-0.8, 0.3mm, Pb-Free)
BZ48DAGLL
RA-CML
2009 Q1 RELIABILITY REPORT
VFBGA (0.75-0.8, 0.3mm)
MR082001
R1
CY62137FV30LL-45BVXI
150
0
500
Page 60 of 61
BZ48DAGLL
RA-CML
MR082001
R1
CY62137FV30LL-45BVXI
150
0
1000
79
0
BZ100CGAL
RA-CML
MR082027
R1
CYWB0124AB-BVXI
150
0
500
80
0
BZ100CGAL
RA-CML
MR082027
R1
CYWB0124AB-BVXI
150
0
1000
79
0
BZ56AGAL
G-TAIWAN
MR082035
R1
CY7C68013A-56BAXC
150
0
500
80
0
BZ56AGAL
G-TAIWAN
MR082035
R1
CY7C68013A-56BAXC
150
0
1000
80
0
BZ48CQAALL
G-TAIWAN
MR082047
R1
CY62137FV30LL-45BVXI
150
0
500
80
0
BZ48CQAALL
G-TAIWAN
MR082047
R1
CY62137FV30LL-45BVXI
150
0
1000
79
0
BZ56IAAAGL
AT-INDS
MR082055
R1
CY7C68053-56BAXI
150
0
500
80
0
BZ56IAAAGL
AT-INDS
MR082055
R1
CY7C68053-56BAXI
150
0
1000
79
0
BZ48CFAALL
G-TAIWAN
MR083004
R1
CY62157EV30-45BVXIT
150
0
500
80
0
BZ48CFAALL
G-TAIWAN
MR083004
R1
CY62157EV30-45BVXIT
150
0
1000
79
0
BZ56GABGL
RA-CML
MR083005
R1
CY7C68053-56BAXIT
150
0
500
80
0
BZ56GABGL
RA-CML
MR083005
R1
CY7C68053-56BAXIT
150
0
1000
80
0
BZ100CGAL
RA-CML
MR083029
R1
CYWB0124AB-BVXI
150
0
500
80
0
BZ100CGAL
RA-CML
MR083029
R1
CYWB0124AB-BVXI
150
0
1000
80
0
R1
CY62137EV30LL-45BVXI
150
0
500
80
0
VFBGA (0.75-0.8, 0.3mm, PbFree)
1354
0
BZ48ABDALL
AT-CARSEM
MR083060
Summary for Package Family: VFBGA (0.75-0.8, 0.3mm, PbFree)
Sum
2009 Q1 RELIABILITY REPORT
17
records
Page 61 of 61