48L - SSOP Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 Package Weight – Site 3 SP B1: 650.0000 mg B2: 610.0198 mg B3: 648.5799 mg B1: 650.0000 mg B2: 610.0198 mg B3: 606.5351 mg Body Size (mil/mm) Package Weight – Site 2 300 mil 746.9799 mg Package Weight – Site 4 B1: 634.3493 mg B2: 633.9041 mg SUMMARY The 48L-SSOP Pb-Free package is compliant to RoHS. Cypress Ordering Part Number containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the requirements of Directive 2002/95/EC (RoHS). ASSEMBLY Site 1: Cypress Manufacturing Limited (CML) Package Qualification Report #s 023606 / 022102 / 063103/125201 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SP48CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03011 Rev.*O Page 1 of 18 48L - SSOP Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) NiPdAu with Standard Molding Compound Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Mold Compound Circuit Interconnect Encapsulation Substance Composition Cu Si Mg Ni Fe Zn Ni Pd Au Ag Proprietary bismaleimide Proprietary polymer Methacrylate Acrylate ester Organic peroxide Si Au Solid Epoxy Resin Phenol Resin Antimony Trioxide Carbon Black Fused Silica Crystalline Silica CAS Number Weight by mg % weight of substance per Homogeneous PPM % Weight of Substance per package 7440-95-4 7440-21-3 7739-95-4 7440-02-0 7439-89-6 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret 110.0896 1.1693 0.7600 3.5079 0.2339 1.1693 0.1875 0.0095 0.0030 0.3500 0.0400 94.1500% 1.0000% 0.6500% 3.0000% 0.2000% 1.0000% 93.7400% 4.7500% 1.5200% 77.7800% 8.8800% 169,369 1,799 1,169 5,397 360 1,799 288 15 5 538 61 16.9369% 0.1799% 0.1169% 0.5397% 0.0360% 0.1799% 0.0288% 0.0015% 0.0005% 0.0538% 0.0061% Trade Secret 0.0300 6.6700% 46 0.0046% Trade Secret Trade Secret Trade Secret 0.0100 0.0100 0.0100 2.2200% 2.2200% 2.2200% 15 15 15 0.0015% 0.0015% 0.0015% 7440-21-3 7440-57-5 Trade Secret 6.2600 2.1700 41.9192 100.0000% 100.0000% 8.0000% 9,631 3,338 64,491 0.9631% 0.3338% 6.4491% Trade Secret 1309-64-4 41.9192 5.2399 8.0000% 1.0000% 64,491 8,061 6.4491% 0.8061% 5.2399 419.1920 10.4798 1.0000% 80.0000% 2.0000% 8,061 644,911 16,123 0.8061% 64.4911% 1.6123% % Total: 100.0000 1333-86-4 60676-86-0 14808-60-7 Package Weight (mg): 650.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03011 Rev.*O Page 2 of 18 48L - SSOP Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) NiPdAu using Green Molding Compound Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Substance Composition Cu Si Mg Ni Ni Pd Au Ag Proprietary bismaleimide Proprietary polymer Methacrylate Acrylate ester Organic peroxide Die Wire Circuit Interconnect Mold Compound Encapsulation Si Au Silica Phenol Resin Epoxy Resin CAS Number 7440-50-8 7440-21-3 7439-95-4 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret Package Weight (mg): Weight by mg % Weight of Substance per Homogeneous Material 133.2947 0.9006 0.2078 4.1568 1.3995 0.0252 0.0252 0.2000 96.2000% 0.6500% 0.1500% 3.0000% 96.5200% 1.7400% 1.7400% 80.0000% 218,509 1,476 341 6,814 2,294 41 41 328 21.8509% 0.1476% 0.0341% 0.6814% 0.2294% 0.0041% 0.0041% 0.0328% 0.0225 9.0000% 37 0.0037% 0.0125 5.0000% 20 0.0020% 0.0050 2.0000% 8 0.0008% 0.0050 2.0000% 8 0.0008% 0.0050 3.3000 2.3700 413.0401 2.0000% 100.0000% 100.0000% 89.0000% 8 5,410 3,885 677,093 0.0008% 0.5410% 0.3885% 67.7093% 23.2045 5.0000% 38,039 3.8039% 27.8454 6.0000% 45,647 4.5647% %Total: 100.0000 610.0198 % Weight of Substance per package PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03011 Rev.*O Page 3 of 18 48L - SSOP Pb-Free Package B3. MATERIAL COMPOSITION (Note 3) Using Copper Wire with NiPdAu using Kyocera Molding Compound Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Substance Composition Cu Si Mg Ni Ni Pd Au Ag Proprietary bismaleimide Proprietary polymer Methacrylate Acrylate ester Organic peroxide Die Wire Circuit Interconnect Mold Compound Encapsulation Si Cu SiO2 Phenol Resin Epoxy Resin Carbon Black CAS Number 7440-50-8 7440-21-3 7439-95-4 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 60676-86-0 Trade Secret Trade Secret 1333-86-4 Package Weight (mg): 143.8171 3.5434 0.1033 0.1772 1.4911 0.0269 0.0269 0.2131 % Weight of Substance per Homogeneo us Material 97.4100 2.4000 0.0700 0.1200 96.5200 1.7400 1.7400 80.0000 221,742 5,463 159 273 2,299 41 41 329 22.1742 0.5463 0.0159 0.0273 0.2299 0.0041 0.0041 0.0329 0.0240 9.0000 37 0.0037 0.0133 5.0000 21 0.0021 0.0053 2.0000 8 0.0008 0.0053 2.0000 8 0.0008 0.0053 3.5163 1.1052 440.1105 2.0000 100.0000 100.0000 89.0000 8 5,422 1,704 678,576 0.0008 0.5422 0.1704 67.8576 24.7253 5.0000 38,122 3.8122 28.4341 1.2363 5.7500 0.2500 43,841 1,906 4.3841 0.1906 %Total: 100.0000 Weight by mg 648.5799 % Weight of Substance per package PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03011 Rev.*O Page 4 of 18 48L - SSOP Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tube Tape and Reel Others Material Lead PPM Cadmium PPM Cr VI PPM Mercury PPM PBB PPM PBDE PPM <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-PLTB-R CoA-EPLG-R CoA-CART-R Plastic Tube End Plug Carrier Tape <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 Moisture Barrier Bag Dessicant HIC Bubble Pack Carton Label Inner Label Shielding Bag <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 CoA-MBBG-R <5.0 <5.0 <5.0 <10.0 <10.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 CoA-DESS-R CoA-HIC-R CoA-BUBB-R CoA-CRTN-R CoA-LBL-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03011 Rev.*O Page 5 of 18 48L - SSOP Pb-Free Package ASSEMBLY Site 2: Amkor Technology Philippines (P1/P2) Package Qualification Report #s 071101 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SP48Amkor Philippines (P1/P2) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03011 Rev.*O Page 6 of 18 48L - SSOP Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg % weight of substance per Homogeneous % Weight of Substance per package PPM Cu Ni Si Mg Ag 7440-95-4 7440-02-0 7440-21-3 7739-95-4 7440-22-4 224.7444 7.0027 1.5274 0.3525 1.3629 95.6400% 2.9800% 0.6500% 0.1500% 0.5800% 300,871 9,375 2,045 472 1,825 30.0871% 0.9375% 0.2045% 0.0472% 0.1825% Sn 7440-31-5 12.0300 100.0000% 16,105 1.6105% Resin Ag Metal Oxide Amine Gamma Butyrolactone Si Trade Secret 7440-22-0 Trade Secret Trade Secret 96-48-0 1.3818 4.6060 0.1974 0.1974 0.1974 21.0000% 70.0000% 3.0000% 3.0000% 3.0000% 1,850 6,166 264 264 264 0.1850% 0.6166% 0.0264% 0.0264% 0.0264% 7440-21-3 23.0600 100.0000% 30,871 3.0871% Au Multi-aromatic Resin SiO2 Filler Carbon Black 7440-57-5 Trade Secret 1.1200 35.1900 100.0000% 7.5000% 1,499 47,110 0.1499% 4.7110% 60676-86-0 1333-86-4 403.5120 2.3460 86.0000% 0.5000% 540,191 3,141 54.0191% 0.3141% Epoxy Cresol Novolac Phenol Resin 29690-82-2 9.3840 2.0000% 12,563 1.2563% 18.7680 4.0000% 25,125 2.5125% % Total: 100.0000 Trade Secret Package Weight (mg): 746.9799 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03011 Rev.*O Page 7 of 18 48L - SSOP Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tube Tape and Reel Others Material Lead PPM Cadmium PPM Cr VI PPM Mercury PPM PBB PPM PBDE PPM <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-PLTB-R CoA-EPLG-R CoA-CART-R Plastic Tube End Plug Carrier Tape <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 Moisture Barrier Bag Dessicant HIC Bubble Pack Carton Label Inner Label Shielding Bag <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 CoA-MBBG-R <5.0 <5.0 <5.0 <10.0 <10.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 CoA-DESS-R CoA-HIC-R CoA-BUBB-R CoA-CRTN-R CoA-LBL-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03011 Rev.*O Page 8 of 18 48L - SSOP Pb-Free Package ASSEMBLY Site 3: Jiangsu Changjiang Electronics Technology (JCET) Package Qualification Report #s 104810/ 104802, 143702 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SP48JCET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03011 Rev.*O Page 9 of 18 48L - SSOP Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) NiPdAu with Standard Molding Compound Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Mold Compound Circuit Interconnect Encapsulation % weight of substance per Homogeneous PPM % Weight of Substanc e per package 94.1500% 1.0000% 0.6500% 3.0000% 0.2000% 1.0000% 93.7400% 4.7500% 1.5200% 77.7800% 8.8800% 169,369 1,799 1,169 5,397 360 1,799 288 15 5 538 61 16.9369% 0.1799% 0.1169% 0.5397% 0.0360% 0.1799% 0.0288% 0.0015% 0.0005% 0.0538% 0.0061% 0.0300 6.6700% 46 0.0046% Trade Secret Trade Secret Trade Secret 0.0100 0.0100 0.0100 2.2200% 2.2200% 2.2200% 15 15 15 0.0015% 0.0015% 0.0015% 7440-21-3 7440-57-5 Trade Secret 6.2600 2.1700 41.9192 100.0000% 100.0000% 8.0000% 9,631 3,338 64,491 0.9631% 0.3338% 6.4491% Trade Secret 1309-64-4 41.9192 5.2399 8.0000% 1.0000% 64,491 8,061 6.4491% 0.8061% 5.2399 419.1920 10.4798 1.0000% 80.0000% 2.0000% 8,061 644,911 16,123 0.8061% 64.4911% 1.6123% Substance Composition CAS Number Cu Si Mg Ni Fe Zn Ni Pd Au Ag Proprietary bismaleimide Proprietary polymer Methacrylate Acrylate ester Organic peroxide Si Au Solid Epoxy Resin Phenol Resin Antimony Trioxide Carbon Black Fused Silica Crystalline Silica 7440-95-4 7440-21-3 7739-95-4 7440-02-0 7439-89-6 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret 110.0896 1.1693 0.7600 3.5079 0.2339 1.1693 0.1875 0.0095 0.0030 0.3500 0.0400 Trade Secret 1333-86-4 60676-86-0 14808-60-7 Package Weight (mg): Weight by mg 650.0000 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03011 Rev.*O Page 10 of 18 48L - SSOP Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) NiPdAu using Green Molding Compound Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Weight by mg % Weight of Substance per Homogeneous Material 7440-50-8 7440-21-3 7439-95-4 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 133.2947 0.9006 0.2078 4.1568 1.3995 0.0252 0.0252 0.2000 96.2000% 0.6500% 0.1500% 3.0000% 96.5200% 1.7400% 1.7400% 80.0000% 218,509 1,476 341 6,814 2,294 41 41 328 21.8509% 0.1476% 0.0341% 0.6814% 0.2294% 0.0041% 0.0041% 0.0328% 0.0225 9.0000% 37 0.0037% 0.0125 5.0000% 20 0.0020% 0.0050 2.0000% 8 0.0008% 0.0050 2.0000% 8 0.0008% 0.0050 3.3000 2.3700 413.0401 2.0000% 100.0000% 100.0000% 89.0000% 8 5,410 3,885 677,093 0.0008% 0.5410% 0.3885% 67.7093% 23.2045 5.0000% 38,039 3.8039% 27.8454 6.0000% 45,647 4.5647% Package Weight(mg): 610.0198 Substance Composition Cu Si Mg Ni Ni Pd Au Ag Proprietary bismaleimide Proprietary polymer Methacrylate Acrylate ester Organic peroxide Die Wire Circuit Interconnect Mold Compound Encapsulation Si Au Silica Phenol Resin Epoxy Resin CAS Number % Weight of Substance per package PPM %Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03011 Rev.*O Page 11 of 18 48L - SSOP Pb-Free Package B3. MATERIAL COMPOSITION (Note 3) Using Copper Palladium Wire Material Leadframe Lead Finish Die Attach Purpose of Use Base Material External Plating Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg Nickel Silicon Magnesium 7440-02-0 7440-21-3 7439-95-4 Silver 7440-22-4 3.0800 0.6300 0.2100 3.2200 Copper 7440-50-8 132.8600 Tin 7440-31-5 % weight of substance per Homogeneou s 0.0220 0.0045 0.0015 1.8850 0.0230 5,078 1,039 346 5,309 %% Weight of Substance per package 0.5078% 0.1039% 0.0346% 0.5309% 0.9490 219,048 21.9048% 3,108 0.3108% 330 0.0330% 37 0.0037% 21 0.0021% 1.0000 0.2000 Silver Proprietary Bismaleimide Proprietary Polymer Methacrylate 7440-22-4 Trade Secret Trade Secret 0.0050 0.0200 8 0.0008% Acrylate Ester Organic Peroxide Silicon Copper Palladium Epoxy Resin A Epoxy Resin B Phenol Resin Silica(Amorphous) Carbon Black Trade Secret 0.0050 0.0050 3.3000 1.0808 0.0193 13.8000 13.8000 23.0000 408.0200 1.3800 0.0200 0.0200 1.0000 0.9825 0.0175 0.0300 0.0300 0.0500 0.8870 0.0030 8 8 5,441 1,782 32 22,752 22,752 37,920 672,706 2,275 0.0008% 0.0008% 0.5441% 0.1782% 0.0032% 2.2752% 2.2752% 3.7920% 67.2706% 0.2275% % Total: 100.0000 Trade Secret Trade Secret 7440-21-3 7440-50-8 7440-05-3 Trade Secret Trade Secret Trade Secret 60676-86-0 1333-86-4 Package Weight (mg): 0.8000 PPM 0.0225 0.0900 0.0125 0.0500 606.5351 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tube Tape and Reel Others Material Plastic Tube End Plug Carrier Tape Moisture Barrier Bag Dessicant HIC Bubble Pack Carton Label Inner Label Shielding Bag Lead PPM <5.0 <5.0 <5.0 Cadmium PPM <5.0 <5.0 <5.0 Cr VI PPM <5.0 <5.0 <5.0 Mercury PPM <5.0 <5.0 <5.0 PBB PPM <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-PLTB-R CoA-EPLG-R CoA-CART-R <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 CoA-MBBG-R <5.0 <5.0 <5.0 <10.0 <10.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 CoA-DESS-R CoA-HIC-R CoA-BUBB-R CoA-CRTN-R CoA-LBL-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03011 Rev.*O Page 12 of 18 48L - SSOP Pb-Free Package ASSEMBLY Site 4: Orient Semiconductor Electronics Taiwan (OSET) Package Qualification Report #s 053502, 120410 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SP48OSET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03011 Rev.*O Page 13 of 18 48L - SSOP Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Gold wire material Material Leadframe Lead Finish Purpose of Use Base Material External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Cu Fe P Zn Pb Polyimide NBR Bismaleimide Phenol resin Ni Pd Au Acrylic resin Polybutadiene derivative Butadiene copolymer Epoxy resin Acrylate Peroxide Additive Silver Si Au Epoxy Resin(1) Epoxy Resin(2) Phenol Resin Carbon black Silica Others CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7439-92-1 Trade Secret 9003-18-3 79922-55-7 28453-20-5 7440-02-0 7440-05-3 7440-57-5 Trade Secret Trade Secret Weight by mg % weight of substance per Homogeneous % Weight of Substance per package PPM 124.2759 2.9717 0.1938 0.1292 0.0194 0.1209 0.0202 0.0202 97.2665% 2.3258% 0.1517% 0.1011% 0.0152% 0.0946% 0.0158% 0.0158% 195,911 4,685 306 204 31 191 32 32 19.5911% 0.4685% 0.0306% 0.0204% 0.0031% 0.0191% 0.0032% 0.0032% 0.0173 1.2920 0.1292 0.0129 0.0263 0.0135% 90.0903% 9.0088% 0.9009% 8.5000% 27 2,037 204 20 41 0.0027% 0.2037% 0.0204% 0.0020% 0.0041% 0.0170 5.5000% 27 0.0027% Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-22-4 7440-21-3 0.0062 0.0170 0.0077 0.0031 0.0062 0.2255 2.0000% 5.5000% 2.5000% 1.0000% 2.0000% 73.0000% 10 27 12 5 10 355 0.0010% 0.0027% 0.0012% 0.0005% 0.0010% 0.0355% 12.7009 7440-57-5 Trade Secret Trade Secret Trade Secret 1333-86-4 60676-86-0 Trade Secret 0.8342 12.2826 12.2826 24.5651 0.9826 431.3635 9.8261 100.0000% 100.0000% 2.5000% 2.5000% 5.0000% 0.2000% 87.8000% 2.0000% 20,022 1,315 19,362 19,362 38,725 1,549 680,010 15,490 2.0022% 0.1315% 1.9362% 1.9362% 3.8725% 0.1549% 68.0010% 1.5490% Package Weight (mg): 634.3493 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03011 Rev.*O Page 14 of 18 48L - SSOP Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Copper wire material Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Substance Composition % weight of substance per Homogeneous % Weight of Substance per package CAS Number Weight by mg Cu Fe P Zn Pb Polyimide NBR Bismaleimide Phenol resin Ni Pd Au Silver Epoxy resin A Epoxy resin B Diluent A Diluent B Phenolic Hardener Dicyandiamide Organic peroxide 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7439-92-1 Trade Secret 9003-18-3 79922-55-7 28453-20-5 7440-02-0 7440-05-3 7440-57-5 7440-22-4 9003-36-5 Trade Secret Trade Secret Trade Secret 124.2759 2.9717 0.1938 0.1292 0.0194 0.1209 0.0202 0.0202 0.0173 1.2920 0.1292 0.0129 0.2287 0.0124 0.0185 0.0124 0.0185 97.2665% 2.3258% 0.1517% 0.1011% 0.0152% 0.0946% 0.0158% 0.0158% 0.0135% 90.0903% 9.0088% 0.9009% 74.0000% 4.0000% 6.0000% 4.0000% 6.0000% 196,048 4,688 306 204 31 191 32 32 27 2,038 204 20 361 19 29 19 29 19.6048% 0.4688% 0.0306% 0.0204% 0.0031% 0.0191% 0.0032% 0.0032% 0.0027% 0.2038% 0.0204% 0.0020% 0.0361% 0.0019% 0.0029% 0.0019% 0.0029% Trade Secret 0.0155 5.0000% 24 0.0024% 461-58-5 0.0015 0.5000% 2 0.0002% Trade Secret 0.0015 0.5000% 2 0.0002% 12.7009 100.0000% 20,036 2.0036% PPM Die Circuit Si 7440-21-3 Wire Interconnect Copper Silica Fused Epoxy,Cresol Novolac Phenol resin Metal Hydroxide Carbon Black Epoxy resin A Silica Fused Silica,crystalline 7440-50-8 60676-86-0 0.3890 363.5639 100.0000% 74.0000% 614 573,531 0.0614% 57.3531% 29690-82-2 19.6521 4.0000% 31,002 3.1002% Trade Secret Trade Secret 1333-86-4 Trade Secret 7631-86-9 14808-60-7 29.4782 19.6521 29.4782 24.5651 2.4565 2.4565 6.0000% 4.0000% 6.0000% 5.0000% 0.5000% 0.5000% 46,503 31,002 46,503 38,752 3,875 3,875 4.6503% 3.1002% 4.6503% 3.8752% 0.3875% 0.3875% Mold Compound Encapsulation Package Weight (mg): 633.9041 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03011 Rev.*O Page 15 of 18 48L - SSOP Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tube Tape and Reel Others Material Lead PPM Cadmium PPM Cr VI PPM Mercury PPM PBB PPM PBDE PPM <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-PLTB-R CoA-EPLG-R CoA-CART-R Plastic Tube End Plug Carrier Tape <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 Moisture Barrier Bag Dessicant HIC Bubble Pack Carton Label Inner Label Shielding Bag <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 CoA-MBBG-R <5.0 <5.0 <5.0 <10.0 <10.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 CoA-DESS-R CoA-HIC-R CoA-BUBB-R CoA-CRTN-R CoA-LBL-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03011 Rev.*O Page 16 of 18 48L - SSOP Pb-Free Package Document History Page Document Title: Document Number: Rev. 48L-SSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-03011 ** *A ECN No. Orig. of Change 385294 EML 1521764 MRB *B 2147487 MAHA *C *D *E DCon 2702846 HLR 2771951 MAHA 2902139 MAHA *F *G *H *I 3055777 3218994 3289531 3616106 *J *K 3645909 UDR 4075211 YUM MAHA REYD MAHA HLR Description of Change New document 1. Updated Cypress Logo 2. Added on the material composition the percent weight per homogeneous material and weight of substance 3. Updated and added Lead, Cr+VI, PBB and PBDE on the Declaration of Packaging/Indirect Materials. 4. Added note 4: the package were based on Engineering calculation and performed on a package family basis. Added the following: 1. CoA-SP48-R1 2. B2: 610 mg 3. QTP Reference 063103 4. B2. NiPdAu using Green Molding Compound Changed the following in Table B1: 1. CAS number of Antimony trioxide 2. CAS number of Fused Silica 3. CAS number of Crystalline Silica 4. CAS number of Carbon black Replaced CML with WEB in distribution list. Changed the % weight of substance of NiPdAu. Added data for assembly site 2. Revised the lead frame data on Table B2 for assembly site 1. Recalculated PPM and % Weight of Substance per package data on Table B2 for assembly site 1. Added the CAS number of Sn on assembly site 2. Added Assembly Site 3 – JCET. Added Assembly Site 4. Updated the material composition of Assembly Sites 1 to 3 to reflect 4 decimal places on values. Added B2 on Site 4 with reference QTP # 120410. Added Assembly Site Name in the Assembly heading in site 1, 2, 3 and 4. Changed Assembly code to Assembly Site Name in site 1, 2, 3 and 4. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03011 Rev.*O Page 17 of 18 48L - SSOP Pb-Free Package Document History Page Document Title: Document Number: Rev. *L *M *N *O 48L-SSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-03011 ECN No. Orig. of Description of Change Change 4081278 UDR/YUM Added B3 on Package Weight – Site 1. Added QTP # 125201 on Assembly Site 1. Added B3 on Assembly Site 1 Material Composition. 4498384 REYD Added B3 in Package Weight and QTP# 143702 under Site 3. Updated Material Composition Table under Assembly Site 3-B3. 4800162 HLR Sunset Due – No Change. 5320102 HLR Changed Cypress Logo. Changed the substances with “------------- “ and Proprietary to “Trade Secret". MQJ Removed Distribution: WEB and Posting: None in the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03011 Rev.*O Page 18 of 18