28L - SOIC Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 Package Weight – Site 3 SZ B1: 849.9801 mg B2: 850.0000 mg B1: 850.0000 mg B2: 749.9996 mg B3: 837.0814 mg Body Size (mil/mm) Package Weight – Site 2 300 mils 773.1200 mg Package Weight – Site 4 N/A SUMMARY The 28L- SOIC Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Cypress Manufacturing Limited (CML) Package Qualification Report # 030802, 054502 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) FormaldehydeN/A Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SZ28CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03052 Rev. *L Page 1 of 12 28L - SOIC Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) NiPdAu Using Standard Mold Compound Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Mold Compound Circuit Interconnect Encapsulation Substance Composition Cu Fe P Zn Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acylate ester Organic Peroxide Si Au Fused Silica Solid Epoxy Resin Phenol Resin Antimony Trioxide Crystalline Silica Carbon Black 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 294.5289 7.2566 0.2117 0.3628 0.1930 0.0035 0.0035 0.1680 0.0200 0.0100 0.0008 0.0008 0.0004 % weight of substance per Homogenous material 97.4100% 2.4000% 0.0700% 0.1200% 96.5200% 1.7400% 1.7400% 84.0000% 10.0000% 5.0000% 0.4000% 0.4000% 0.2000% 7440-21-3 7440-57-5 60676-86-0 Trade Secret 3.0000 1.9000 400.7745 54.2320 100.0000% 100.0000% 73.9000% 10.0000% Trade Secret 1309-64-4 59.6552 7.0502 11.0000% 1.3000% 99439-28-8 16.2696 3.0000% CAS Number Weight by mg PPM 346,513 8,537 249 427 227 4 4 198 24 12 1 1 % weight of substance per package 34.6513% 0.8537% 0.0249% 0.0427% 0.0227% 0.0004% 0.0004% 0.0198% 0.0024% 0.0012% 0.0001% 0.0001% 0.0000% 0 3,529 2,235 471,510 0.3529% 0.2235% 47.1510% 6.3804% 63,804 70,184 7.0184% 0.8295% 8,295 1333-86-4 Package Weight (mg): 4.3386 849.9801 0.8000% 1.9141% 19,141 5,104 % Total: 0.5104% 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03052 Rev. *L Page 2 of 12 28L - SOIC Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) NiPdAu Using Green Mold Compound Ma terial Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe P Zn Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acylate ester Organic Peroxide Si Au SiO2 Phenol Resin Epoxy Resin 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 292.4888 7.2064 0.2102 0.3603 3.6044 0.0649 0.0651 0.3601 0.0405 0.0225 0.0090 0.0090 0.0090 % weight of substance per Homogenous material 97.4100 2.4000 0.0700 0.1200 96.5204 1.7370 1.7427 80.0000 9.0000 5.0000 2.0000 2.0000 2.0000 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 6.3013 1.6667 478.4478 26.8791 32.2549 100.0000 100.0000 89.0000 5.0000 6.0000 CAS Number Package Weight (mg): Weight by mg 850.0000 344,104 8,478 247 424 4,240 76 77 424 48 26 11 11 11 % weight of substance per package 34.4104% 0.8478% 0.0247% 0.0424% 0.4240% 0.0076% 0.0077% 0.0424% 0.0048% 0.0026% 0.0011% 0.0011% 0.0011% 7,413 1,961 562,880 31,622 37,947 0.7413% 0.1961% 56.2880% 3.1622% 3.7947% PPM % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tube Others Material Cover tape Carrier tape Plastic Reel Plastic Tube End Plug Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 10.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 --------- PBDE PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 ----------- < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-PLTB-R CoA-EPLG-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03052 Rev. *L Page 3 of 12 28L - SOIC Pb-Free Package ASSEMBLY Site 2: Amkor Technology Philippines (P1/P2) Package Qualification Report #s 070802 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SZ28Amkor Philippines (P1/P2) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03052 Rev. *L Page 4 of 12 28L - SOIC Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Base Material Leadframe Internal Plating Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Cu Fe P Zn Ag 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-22-4 Sn Resin Ag Metal Oxide Amine Gamma Butyrolactone Si Weight by mg % weight of substance per Homogeneous PPM % Weight of Substanc e per package 197.3693 4.7571 0.0607 0.2429 1.5000 97.5000% 2.3500% 0.0300% 0.1200% 100.0000% 255,289 6,153 79 314 1,940 25.5289% 0.6153% 0.0079% 0.0314% 0.1940% 7440-31-5 Proprietary 7440-22-0 Proprietary Proprietary 96-48-0 5.1700 1.3041 4.3470 0.1863 0.1863 0.1863 100.0000% 21.0000% 70.0000% 3.0000% 3.0000% 3.0000% 6,687 1,687 5,623 241 241 241 0.6687% 0.1687% 0.5623% 0.0241% 0.0241% 0.0241% 7440-21-3 20.6100 100.0000% 26,658 2.6658% Au Multi-aromatic Resin SiO2 Filler Carbon Black 7440-57-5 Proprietary 1.1000 40.2075 100.0000% 7.5000% 1,423 52,007 0.1423% 5.2007% 60676-86-0 1333-86-4 461.0460 2.6805 86.0000% 0.5000% 596,345 3,467 59.6345% 0.3467% Epoxy Cresol Novolac Phenol Resin 29690-82-2 10.7220 2.0000% 13,868 1.3868% Proprietary 21.4440 4.0000% 27,737 2.7737% Package Weight (mg): 773.1200 % Total: 100.0000 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tube Others Material Cover tape Carrier tape Plastic Reel Plastic Tube End Plug Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 10.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 --------- PBDE PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 ----------- < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-PLTB-R CoA-EPLG-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03052 Rev. *L Page 5 of 12 28L - SOIC Pb-Free Package ASSEMBLY Site 3: Jiangsu Changjiang Electronics Technology (JCET) Package Qualification Report # 113906, 113907, 130503, 143703 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) FormaldehydeN/A Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SZ28- JCET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03052 Rev. *L Page 6 of 12 28L - SOIC Pb-Free Package B1. MATERIAL COMPOSITION USING GOLD WIRE (Note 3) Using Kyocera Mold Compound Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Mold Compound Circuit Interconnect Encapsulation Substance Composition Cu Fe P Zn Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acylate ester Organic Peroxide Si Au SiO2 Phenol Resin Epoxy Resin 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 292.4888 7.2064 0.2102 0.3603 3.6044 0.0649 0.0651 0.3601 0.0405 0.0225 0.0090 0.0090 0.0090 % weight of substance per Homogenous material 97.4100 2.4000 0.0700 0.1200 96.5204 1.7370 1.7427 80.0000 9.0000 5.0000 2.0000 2.0000 2.0000 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 6.3013 1.6667 478.4478 26.8791 32.2549 100.0000 100.0000 89.0000 5.0000 6.0000 CAS Number Package Weight (mg): Weight by mg 850.0000 344,104 8,478 247 424 4,240 76 77 424 48 26 11 11 11 % weight of substance per package 34.4104% 0.8478% 0.0247% 0.0424% 0.4240% 0.0076% 0.0077% 0.0424% 0.0048% 0.0026% 0.0011% 0.0011% 0.0011% 7,413 1,961 562,880 31,622 37,947 0.7413% 0.1961% 56.2880% 3.1622% 3.7947% PPM % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03052 Rev. *L Page 7 of 12 28L - SOIC Pb-Free Package B2. MATERIAL COMPOSITION USING GOLD WIRE (Note 3) Using Sumitomo Mold Compound Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Mold Compound Circuit Interconnect Encapsulation Substance Composition Cu Fe P Zn Ni Pd Au Ag Allyl Compound Epoxy Resin A Epoxy Resin B Diluent A Diluent B Hardener Dicyandiamide Organic Peroxide Si Au SiO2 Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black 288.6403 7.1116 0.2074 0.3556 3.5569 0.0640 0.0642 0.1453 0.0067 0.0025 0.0033 0.0025 0.0033 0.0033 0.0002 % weight of substance per Homogenous material 97.4100 2.4000 0.0700 0.1200 96.5204 1.7370 1.7427 86.8000 4.0000 1.5000 2.0000 1.5000 2.0000 2.0000 0.1000 384,854 9,482 277 474 4,743 85 86 194 9 3 4 3 4 4 1 % weight of substance per package 38.4854% 0.9482% 0.0277% 0.0474% 0.4743% 0.0085% 0.0086% 0.0194% 0.0009% 0.0003% 0.0004% 0.0003% 0.0004% 0.0004% 0.0000% Trade Secret 0.0002 0.1000 1 0.0000% 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret Trade Secret 1333-86-4 2.3434 3.3131 398.6478 11.1044 11.1044 22.2088 1.1104 100.0000 100.0000 89.7500 2.5000 2.5000 5.0000 0.2500 3,125 4,417 531,530 14,806 14,806 29,612 1,481 0.3125% 0.4417% 53.1530% 1.4806% 1.4806% 2.9612% 0.1481% CAS Number Weight by mg 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret 9003-36-5 Trade Secret Trade Secret Trade Secret Trade Secret 461-58-5 Package Weight (mg): 749.9996 PPM % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03052 Rev. *L Page 8 of 12 28L - SOIC Pb-Free Package B3. USING COPPER PALLADIUM WIRE Material Leadframe Lead Finish Die Attach Purpose of Use Base Material External Plating Adhesive Die Circuit Wire Interconnect Substance Composition Encapsulation Weight by mg 0.0220 0.0045 0.0015 7440-22-4 7440-50-8 281.8530 7440-02-0 7440-21-3 7439-95-4 Silver Copper Tin 7440-31-5 Silver Proprietary Bismaleimide Proprietary Polymer Methacrylate 7440-22-4 0.3601 Proprietary 0.0405 Proprietary Proprietary 0.0225 0.0090 Proprietary Proprietary 7440-21-3 7440-50-8 7440-05-3 Trade Secret Trade Secret Trade Secret 60676-86-0 1333-86-4 0.0090 0.0090 6.3013 1.4934 0.0266 467.4490 1.5810 Package Weight (mg): 837.0814 Acrylate Ester Organic Peroxide Silicon Copper Palladium Epoxy Resin B Phenol Resin Silica(Amorphous) Carbon Black % weight of substance per Homogeneous 6.5340 1.3365 0.4455 6.8310 Nickel Silicon Magnesium Epoxy Resin A Mold Compound CAS Number 4.8100 15.8100 15.8100 26.3500 PPM %% Weight of Substance per package 0.0230 7,806 1,597 532 8,160 0.7806% 0.1597% 0.0532% 0.8160% 0.9490 336,709 33.6709% 5,746 0.5746% 430 0.0430% 48 0.0048% 0.0200 27 11 0.0027% 0.0011% 0.0200 0.0200 1.0000 0.9825 0.0175 11 11 7,528 1,784 32 0.0011% 0.0011% 0.7528% 0.1784% 0.0032% 18,887 1.8887% 18,887 1.8887% 31,478 3.1478% 558,427 1,889 55.8427% 0.1889% % Total: 100.0000 1.0000 0.8000 0.0900 0.0500 0.0300 0.0300 0.0500 0.8870 0.0030 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03052 Rev. *L Page 9 of 12 28L - SOIC Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tube Others Material Cover tape Carrier tape Plastic Reel Plastic Tube End Plug Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 10.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 --------- PBDE PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 ----------- < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-PLTB-R CoA-EPLG-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03052 Rev. *L Page 10 of 12 28L - SOIC Pb-Free Package Document History Page Document Title: Document Number: Rev. 28L-SOIC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-03052 ECN No ** *A Orig. of Change 385598 GFJ 2264910 HLR *B 2789670 DCon MAHA *C *D *E 3040432 3236520 3402928 HLR HLR REYD *F 3805933 HLR *G 3971302 HLR *H 4032244 YUM Description of Change New document Updated Cypress Logo Added % weight of substance per Homogenous Material and % weight of substance per package on the Material Composition. Added CAS Number for Antimony Trioxide Completed the RoHS Substances namely; Lead Cadmium, Mercury, Chromium VI, PBB and PBDE on Declaration of Packaging Indirect Materials table Replaced CML with WEB in distribution list. Added the following for assembly site 1: 1. Package weight B2:850 mg 2. Package QTP 054502 3. Table B2. NiPdAu Using Green Mold compound Added Note 4 on Footer Section. Added Assembly Site 2. Added Assembly Site 3 – JCET. Expressed in 4 decimal places the Weight by mg, % weight of substance per Homogenous material, % weight of substance per package and total package weight of Assembly Site1 Material Composition B2. Expressed Package Weight – Site 1-B1 in 4 decimal places. Updated the material composition tables to reflect 4 decimal places on values for Assembly Sites 1.B1 and 2. Added CAS number for Silica Fused, Crystalline Silica and Carbon Black on Assembly Site 1.B1 material composition. Added B2 Material Composition for Assembly Site 3 in reference to QTP No. 130503 for Automotive. Added assembly site name in the Assembly heading in site 1, 2, 3 and 4. Changed the Assembly Code to Assembly Site Name in site 1, 2, 3 and 4. Removed Tray and End Pin in the Indirect Materials Section. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03052 Rev. *L Page 11 of 12 28L - SOIC Pb-Free Package Document History Page Document Title: Document Number: Rev. 28L-SOIC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-03052 ECN No *I Orig. of Change 4083873 YUM *J 4498519 REYD *K *L 4573742 5026871 HLR HLR MEL Description of Change Added “P1/P2” in the assembly heading in assembly site 2. Added B3 in Package Weight and QTP# 143703 under Site 3. Updated Material Composition Table under Assembly Site 3-B3. Sunset Due – No Change Changed the substances with “------------- and Proprietary “to “Trade Secret”. Removed “Distribution: WEB” and “Posting: NONE” from the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03052 Rev. *L Page 12 of 12