FM33256B 256-Kbit (32 K × 8) Integrated Processor Companion with F-RAM 256-Kbit (32 K × 8) Serial (SPI) F-RAM Features Functional Overview ■ 256-Kbit ferroelectric random access memory (F-RAM) ❐ Logically organized as 32 K × 8 14 ❐ High-endurance 100 trillion (10 ) read/writes ❐ 151-year data retention (See the Data Retention and Endurance table) ❐ NoDelay™ writes ❐ Advanced high-reliability ferroelectric process The FM33256B device integrates F-RAM memory with the most commonly needed functions for processor-based systems. Major features include nonvolatile memory, real time clock, low-VDD reset, watchdog timer, nonvolatile event counter, lockable 64-bit serial number area, and general purpose comparator that can be used for a power-fail (NMI) interrupt or any other purpose. ■ High Integration Device Replaces Multiple Parts ❐ Serial nonvolatile memory ❐ Real time clock (RTC) with alarm ❐ Low VDD detection drives reset ❐ Watchdog window timer ❐ Early power-fail warning / NMI ❐ 16-bit nonvolatile event counter ❐ Serial number with write-lock for security The FM33256B is a 256-Kbit nonvolatile memory employing an advanced ferroelectric process. A ferroelectric random access memory or F-RAM is nonvolatile and performs reads and writes similar to a RAM. It provides reliable data retention for 151 years while eliminating the complexities, overhead, and system-level reliability problems caused by other nonvolatile memories. The FM33256B is capable of supporting 1014 read/write cycles, or 100 million times more write cycles than EEPROM. ■ Real-time Clock/Calendar ❐ Backup current at 2 V: 1.15 μA at +25 °C ❐ Seconds through centuries in BCD format ❐ Tracks leap years through 2099 ❐ Uses standard 32.768 kHz crystal (6 pF/12.5 pF) ❐ Software calibration ❐ Supports battery or capacitor backup The real time clock (RTC) provides time and date information in BCD format. It can be permanently powered from an external backup voltage source, either a battery or a capacitor. The timekeeper uses a common external 32.768 kHz crystal and provides a calibration mode that allows software adjustment of timekeeping accuracy. The processor companion includes commonly needed CPU support functions. Supervisory functions include a reset output signal controlled by either a low VDD condition or a watchdog timeout. RST goes active when VDD drops below a programmable threshold and remains active for 100 ms (max.) after VDD rises above the trip point. A programmable watchdog timer runs from 60 ms to 1.8 seconds. The timer may also be programmed for a delayed start, which functions as a window timer. The watchdog timer is optional, but if enabled it will assert the reset signal for 100 ms if not restarted by the host within the time window. A flag-bit indicates the source of the reset. ■ Processor Companion ❐ Active-low reset output for VDD and watchdog ❐ Programmable low-VDD reset thresholds ❐ Manual reset filtered and debounced ❐ Programmable watchdog window timer ❐ Nonvolatile event counter tracks system intrusions or other events ❐ Comparator for power-fail interrupt or other use ❐ 64-bit programmable serial number with lock ■ Fast serial peripheral interface (SPI) ❐ Up to 16-MHz frequency ❐ RTC, Supervisor controlled via SPI interface ❐ Supports SPI mode 0 (0, 0) and mode 3 (1, 1) ■ Low power consumption ❐ 1.1 mA active current at 1 MHz ❐ 150 μA standby current ■ Operating voltage: VDD = 2.7 V to 3.6 V ■ Industrial temperature: –40 °C to +85 °C A comparator on PFI compares an external input pin to the onboard 1.5 V reference. This is useful for generating a power-fail interrupt (NMI) but can be used for any purpose. The family also includes a programmable 64-bit serial number that can be locked making it unalterable. Additionally it offers an event counter that tracks the number of rising or falling edges detected on a dedicated input pin. The counter can be programmed to be nonvolatile under VDD power or battery-backed using only VBAK. If VBAK is connected to a battery or capacitor, then events will be counted even in the absence of VDD. ■ 14-pin small outline integrated circuit (SOIC) package For a complete list of related documentation, click here. ■ Restriction of hazardous substances (RoHS) compliant ■ Underwriters laboratory (UL) recognized Cypress Semiconductor Corporation Document Number: 001-86213 Rev. *C • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised August 5, 2015 FM33256B Logic Block Diagram Document Number: 001-86213 Rev. *C Page 2 of 39 FM33256B Contents Pinout ................................................................................ 4 Pin Definitions .................................................................. 4 Overview ............................................................................ 5 Memory Architecture ................................................... 5 Processor Companion ..................................................... 5 Processor Supervisor .................................................. 5 Manual Reset .............................................................. 6 Reset Flags ................................................................. 6 Power Fail Comparator ............................................... 6 Event Counter ............................................................. 7 Serial Number ............................................................. 7 Alarm ........................................................................... 8 Real-time Clock Operation ............................................... 8 Backup Power ............................................................. 9 Trickle Charger .......................................................... 10 Calibration ................................................................. 10 Crystal Type .............................................................. 10 Layout Recommendations ............................................. 10 Register Map ................................................................... 13 Serial Peripheral Interface – SPI Bus ............................ 23 SPI Overview ............................................................. 23 SPI Modes ................................................................. 24 Power Up to First Access .......................................... 25 Command Structure .................................................. 25 WREN - Set Write Enable Latch ............................... 25 WRDI - Reset Write Enable Latch ............................. 25 Status Register and Write Protection ........................... 26 RDSR - Read Status Register ................................... 26 Document Number: 001-86213 Rev. *C WRSR - Write Status Register .................................. 26 RDPC - Read Processor Companion ........................ 27 WRPC - Write Processor Companion ....................... 27 Memory Operation .......................................................... 28 Write Operation ......................................................... 28 Read Operation ......................................................... 28 Maximum Ratings ........................................................... 30 Operating Range ............................................................. 30 DC Electrical Characteristics ........................................ 30 Data Retention and Endurance ..................................... 32 Capacitance .................................................................... 32 Thermal Resistance ........................................................ 32 AC Test Conditions ........................................................ 32 Supervisor Timing .......................................................... 33 AC Switching Characteristics ....................................... 34 Ordering Information ...................................................... 35 Ordering Code Definitions ......................................... 35 Package Diagram ............................................................ 36 Acronyms ........................................................................ 37 Document Conventions ................................................. 37 Units of Measure ....................................................... 37 Document History Page ................................................. 38 Sales, Solutions, and Legal Information ...................... 39 Worldwide Sales and Design Support ....................... 39 Products .................................................................... 39 PSoC® Solutions ...................................................... 39 Cypress Developer Community ................................. 39 Technical Support ..................................................... 39 Page 3 of 39 FM33256B Pinout Figure 1. 14-pin SOIC pinout CS 1 14 VDD SO 2 13 ACS CNT 3 12 SCK VBAK 4 11 SI X2 5 10 PFO X1 6 9 RST VSS 7 8 PFI Pin Definitions Pin Name I/O Type Description CS Input Chip Select. This active LOW input activates the device. When HIGH, the device enters low-power standby mode, ignores SCK and SI inputs, and the SO output is tristated. When LOW, the device internally activates the SCK signal. A falling edge on CS must occur before every opcode. SCK Input Serial Clock. SI and SO activity is synchronized to the serial clock. Inputs are latched on the rising edge and outputs occur on the falling edge. Because the device is synchronous, the clock frequency may be any value between 0 and 16 MHz and may be interrupted at any time. SI [1] Input Serial Input. Data is input to the device on this pin. The pin is sampled on the rising edge of SCK and is ignored at other times. It should always be driven to a valid logic level to meet IDD specifications. SO [1] Output Serial Output. This is the data output pin. It is driven during a read and remains tristated at all other times. Data transitions are driven on the falling edge of the serial clock. CNT Input Event Counter Input. This input increments the counter when an edge is detected on this pin. The polarity is programmable and the counter value is nonvolatile or battery-backed, depending on the mode. This pin should be tied to ground if unused. ACS Output Alarm/Calibration/SquareWave. This is an open-drain output that requires an external pull-up resistor. In normal operation, this pin acts as the active-low alarm output. In Calibration mode, a 512 Hz square-wave is driven out. In SquareWave mode, the user may select a frequency of 1, 512, 4096, or 32768 Hz to be used as a continuous output. The SquareWave mode is entered by clearing the AL/SW and CAL bits in the register 18h. X1, X2 RST Input/Output 32.768 kHz crystal connection. These pins should be left unconnected if RTC is not used. Input/Output Reset. This active-low output is open drain with weak pull-up. It is also an input when used as a manual reset. This pin should be left floating if unused. PFI Input Early Power-fail Input. Typically connected to an unregulated power supply to detect an early power failure. This pin must be tied to ground if unused. PFO Output Early Power-fail Output. This pin is the early power-fail output and is typically used to drive a microcontroller NMI pin. PFO drives LOW when the PFI voltage is < 1.5 V. VBAK Power supply Backup supply voltage. Connected to a 3 V battery or a large value capacitor. If no backup supply is used, this pin should be tied to VSS and the VBC bit should be cleared in the RTC register 18h. The trickle charger is UL recognized and ensures no excessive current when using a lithium battery. VSS Power supply Ground for the device. Must be connected to the ground of the system. VDD Power supply Power supply input to the device. Note 1. SI may be connected to SO for a single pin data interface. Document Number: 001-86213 Rev. *C Page 4 of 39 FM33256B Overview The FM33256B device combines a serial nonvolatile RAM with a real time clock (RTC) and a processor companion. The companion is a highly integrated peripheral including a processor supervisor, analog comparator, a nonvolatile counter, and a serial number. The FM33256B integrates these complementary but distinct functions under a common interface in a single package. The product is organized as two logical devices. The first is a memory and the second is the companion which includes all the remaining functions. From the system perspective they appear to be two separate devices with unique opcodes on the serial bus. The memory is organized as a standalone nonvolatile SPI memory using standard opcodes. The real time clock and supervisor functions are accessed under their own opcodes. The clock and supervisor functions are controlled by 30 special function registers. The RTC alarm and some control registers are maintained by the power source on the VBAK pin, allowing them to operate from battery or backup capacitor power when VDD drops below a set threshold. Each functional block is described below. faults, power-up, and software lockups. It is an open drain output with a weak internal pull-up to VDD. This allows other reset sources to be wire-OR'd to the RST pin. When VDD is above the programmed trip point, RST output is pulled weakly to VDD. If VDD drops below the reset trip point voltage level (VTP), the RST pin will be driven LOW. It will remain LOW until VDD falls too low for circuit operation which is the VRST level. When VDD rises again above VTP, RST continues to drive LOW for at least 30 ms (tRPU) to ensure a robust system reset at a reliable VDD level. After tRPU has been met, the RST pin will return to the weak HIGH state. While RST is asserted, serial bus activity is locked out even if a transaction occurred as VDD dropped below VTP. A memory operation started while VDD is above VTP will be completed internally. Table 1 below shows how bits VTP(1:0) control the trip point of the low-VDD reset. They are located in register 18h, bits 1 and 0. The reset pin will drive LOW when VDD is below the selected VTP voltage, and the SPI interface and F-RAM array will be locked out. Figure 2 illustrates the reset operation in response to a low VDD. Table 1. VTP setting VTP Setting Memory Architecture The FM33256B is available with 256-Kbit of memory. The device uses two-byte addressing for the memory portion of the chip. This makes the device software compatible with its standalone memory counterparts, such as the FM25W256. The memory array is logically organized as 32,768 × 8 bits and is accessed using an industry-standard serial peripheral interface (SPI) bus. The memory is based on F-RAM technology. Therefore it can be treated as RAM and is read or written at the speed of the SPI bus with no delays for write operations. It also offers effectively unlimited write endurance unlike other nonvolatile memory technologies. The SPI protocol is described on page 23. The memory array can be write-protected by software. Two bits (BP1, BP0) in the Status Register control the protection setting. Based on the setting, the protected addresses cannot be written. The Status Register & Write Protection is described in more detail on page 26. Processor Companion In addition to nonvolatile RAM, the FM33256B incorporates a real time clock with alarm and highly integrated processor companion. The companion includes a low-VDD reset, a programmable watchdog timer, a 16-bit nonvolatile event counter, a comparator for early power-fail detection or other purposes, and a 64-bit serial number. Processor Supervisor Supervisors provide a host processor two basic functions: Detection of power supply fault conditions and a watchdog timer to escape a software lockup condition. The FM33256B has a reset pin (RST) to drive a processor reset input during power Document Number: 001-86213 Rev. *C VTP1 VTP0 2.6 V 0 0 2.75 V 0 1 2.9 V 1 0 3.0 V 1 1 Figure 2. Low VDD Reset VDD t RPU VTP RST A watchdog timer can also be used to drive an active reset signal. The watchdog is a free-running programmable timer. The timeout period can be software programmed from 60 ms to 1.8 seconds in 60 ms increments via a 5-bit nonvolatile setting (register 0Ch). Figure 3. Watchdog Timer 100 ms clock Timebase WR(3:0) = 1010b to restart Down Counter Watchdog Timer Settings RST WDE Page 5 of 39 FM33256B The watchdog also incorporates a window timer feature that allows a delayed start. The starting time and ending time defines the window and each may be set independently. The starting time has 25 ms resolution and 0 ms to 775 ms range. Figure 4. Window Timer Watchdog Restart Start Time End Time Window The restart command in step 3 must be issued before tDOG2, which was programmed in step 2. The window timer starts counting when the restart command is issued. Manual Reset The RST is a bi-directional signal allowing the FM33256B to filter and de-bounce a manual reset switch. The RST input detects an external low condition and responds by driving the RST signal LOW for 100 ms (max). This effectively filters and de-bounces a reset switch. After this timeout (tRPU), the user may continue pulling down on the RST pin, but SPI commands will not be locked out. Figure 5. Manual Reset RST 100 ms (max) The watchdog EndTime value is located in register 0Ch, bits 4:0, the watchdog enable is bit 7. The watchdog is restarted by writing the pattern 1010b to the lower nibble of register 0Ah. Writing the correct pattern will also cause the timer to load new timeout values. Writing other patterns to this address will not affect its operation. Note the watchdog timer is free-running. Prior to enabling it, users should restart the timer as described above. This assures that the full timeout is provided immediately after enabling. The watchdog is disabled when VDD drops below VTP. Note setting the EndTime timeout setting to all zeroes (00000b) disables the timer to save power. The listing below summarizes the watchdog bits. Watchdog Start Time Watchdog EndTime Watchdog Enable Watchdog Restart Watchdog Flags WDST(4:0) WDET(4:0) WDE WR(3:0) EWDF LWDF 0Bh, bits 4:0 0Ch, bits 4:0 0Ch, bit 7 0Ah, bits 3:0 09h, bit 7 09h, bit 6 The programmed StartTime value is a guaranteed maximum time while the EndTime value is a guaranteed minimum time, and both vary with temperature and VDD voltage. The watchdog has two additional controls associated with its operation. The nonvolatile enable bit WDE allows the RST to go active if the watchdog reaches the timeout without being restarted. If a reset occurs, the timer will restart on the rising edge of the reset pulse. If WDE is not enabled, the watchdog timer still runs but has no effect on RST. The second control is a nibble that restarts the timer, thus preventing a reset. The timer should be restarted after changing the timeout value. This procedure must be followed to properly load the watchdog registers: Address 1. Write the StartTime value 0Bh 2. Write the EndTime value and WDE = ‘1’ 0Ch 3. Issue a Restart command 0Ah Document Number: 001-86213 Rev. *C RST MCU FM33256B Reset Switch RST FM33256B drives 100 ms (max.) Note The internal weak pull-up eliminates the need for additional external components. Reset Flags In case of a reset condition, a flag bit will be set to indicate the source of the reset. A low-VDD reset is indicated by the POR flag, register 09h bit 5. There are two watchdog reset flags - one for an early fault (EWDF) and the other for a late fault (LWDF), located in register 09h bits 7 and 6. A manual reset will result in no flag being set, so the absence of a flag is a manual reset. Note that the bits are set in response to reset sources but they must be cleared by the user. It is possible to read the register and have both sources indicated if both have occurred since the user cleared them. Power Fail Comparator An analog comparator compares the PFI input pin to an onboard 1.5 V reference. When the PFI input voltage drops below this threshold, the comparator will drive the PFO pin to a LOW state. The comparator has 100 mV of hysteresis (rising voltage only) to reduce noise sensitivity. The most common application of this comparator is to create an early warning power fail interrupt (NMI). This can be accomplished by connecting the PFI pin to an upstream power supply via a resistor divider. An application circuit is shown below. The comparator is a general purpose device and its application is not limited to the NMI function. Page 6 of 39 FM33256B Figure 6. Comparator as a Power-Fail Warning Regulator V DD FM33256B To MCU CAL/PFO NMI input PFI + - 1.5 V ref If the power-fail comparator is not used, the PFI pin should be tied to either VDD or VSS. Note that the PFO output will drive to VDD or VSS as well. Event Counter The FM33256B offers the user a nonvolatile 16-bit event counter. The input pin CNT has a programmable edge detector. The CNT pin clocks the counter. The counter is located in registers 0E-0Fh. When the programmed edge polarity occurs, the counter will increment its count value. The register value is read by setting the RC bit (register 0Dh, bit 3) to ‘1’. This takes a snapshot of the counter byte allowing a stable value even if a count occurs during the read. The register value can be written by first setting the WC bit (register 0Dh, bit 2) to ‘1’. The user then may clear or preset the counter by writing to registers 0E-0Fh. Counts are blocked when the WC bit is set, so the user must clear the bit to allow counts. mode to battery-backed allows counter operation under VBAK (as well as VDD) power. The lowest operating voltage for battery-backed mode is 2.0 V. When set to "nonvolatile" mode, the counter operates only when VDD is applied and is above the VTP voltage. The event counter may be programmed to detect a tamper event, such as the system's case or access door being opened. A normally closed switch is tied to the CNT pin and the other contact to the case chassis, usually ground. The typical solution uses a pull-up resistor on the CNT pin and will continuously draw battery current. The FM33256B chip allows the user to invoke a polled mode, which occasionally samples the pin in order to minimize battery drain. It internally tries to pull the CNT pin up and if open circuit will be pulled up to a VIH level, which will trip the edge detector and increment the event counter value. Setting the POLL bit (register 0Dh, bit 1) places the CNT pin into this mode. This mode allows the event counter to detect a rising edge tamper event but the user is restricted to operating in battery-backed mode (NVC = ‘0’) and using rising edge detection (CP = ‘1’). The CNT pin is polled once every 125 ms. The additional average IBAK current is less than 20 nA. The polling timer circuit operates from the RTC, so the oscillator must be enabled for this to function properly. Figure 8. Polled Mode on CNT pin Detects Tamper V BAK FM33256B < 100 pF CNT 125 ms The counter polarity control bit is CP (register 0Dh, bit 0). When CP is ‘0’, the counter increments on a falling edge of CNT, and when CP is set to ‘1’, the counter increments on a rising edge of CNT. The polarity bit CP is nonvolatile. In the polled mode, the internal pull-up circuit can source a limited amount of current. The maximum capacitance (switch open circuit) allowed on the CNT pin is 100 pF. Figure 7. Event Counter Serial Number The counter does not wrap back to zero when it reaches the limit of 65,535 (FFFFh). Care must be taken prior to the rollover, and a subsequent counter reset operation must occur to continue counting. A memory location to write a 64-bit serial number is provided. It is a writeable nonvolatile memory block that can be locked by the user once the serial number is set. The 8 bytes of data and the lock bit are all accessed via unique opcodes for the RTC and Processor Companion registers. Therefore the serial number area is separate and distinct from the memory array. The serial number registers can be written an unlimited number of times, so these locations are general purpose memory. However once the lock bit is set, the values cannot be altered and the lock cannot be removed. Once locked the serial number registers can still be read by the system. There is also a control bit that allows the user to define the counter as nonvolatile or battery-backed. The counter is nonvolatile when the NVC bit (register 0Dh, bit 7) is logic 1 and battery-backed when the NVC bit is logic 0. Setting the counter The serial number is located in registers 10h to 17h. The lock bit is SNL (register 18h, bit 7). Setting the SNL bit to a ‘1’ disables writes to the serial number registers, and the SNL bit cannot be cleared. CP CNT Document Number: 001-86213 Rev. *C 16-bit Counter Page 7 of 39 FM33256B Alarm The alarm function compares user-programmed values to the corresponding time/date values and operates under VDD or VBAK power. When a match occurs, an alarm event occurs. The alarm drives an internal flag AF (register 00h, bit 6) and may drive the ACS pin, if desired, by setting the AL/SW bit (register 18h, bit 6) in the Companion Control register. The alarm condition is cleared by writing a '0' to the AF bit. There are five alarm match fields. They are Month, Date, Hours, Minutes, and Seconds. Each of these fields also has a Match bit that is used to determine if the field is used in the alarm match logic. Setting the Match bit to '0' indicates that the corresponding field will be used in the match process. Depending on the Match bits, the alarm can occur as specifically as one particular second on one day of the month, or as frequently as once per second continuously. The MSB of each Alarm register is a Match bit. Examples of the Match bit settings are shown in Table 3. Selecting none of the match bits (all '1's) indicates that no match is required. The alarm occurs every second. Setting the match select bit for seconds to '0' causes the logic to match the seconds alarm value to the current time of day. Since a match will occur for only one value per minute, the alarm occurs once per minute. Likewise setting the seconds and minutes match select bits causes an exact match of these values. Thus, an alarm will occur once per hour. Setting seconds, minutes, and hours causes a match once per day. Lastly, selecting all match-values causes an exact time and date match. Selecting other bit combinations will not produce meaningful results, however the alarm circuit will follow the functions described. There are two ways a user can detect an alarm event, by reading the AF flag or monitoring the ACS pin. The interrupt pin on the host processor may be used to detect an alarm event. The AF flag in register 00h (bit 6) will indicate that a time/date match has occurred. The AF flag will be set to '1' when a match occurs. The AEN bit must be set to enable the AF flag on alarm matches. The flag and ACS pin will remain in this state until the AF bit is cleared by writing it to a '0'. Clearing the AEN bit will prevent further matches from setting AF but will not automatically clear the AF flag. The RTC alarm is integrated into the special function registers and shares its output pin with the 512 Hz calibration and square wave outputs. When the RTC calibration mode is invoked by setting the CAL bit (register 00h, bit 2), the ACS output pin will be driven with a 512 Hz square wave and the alarm will continue to operate. Since most users only invoke the calibration mode during production this should have no impact on the otherwise normal operation of the alarm. The ACS output may also be used to drive the system with a frequency other than 512 Hz. The AL/SW bit (register 18h, bit 6) must be '0'. A user-selectable frequency is provided by F0 and F1 (register 18h, bits 4 and 5). The other frequencies are 1, 4096, and 32768 Hz. If a continuous frequency output is enabled with CAL mode, the alarm function will not be available. Following is a summary table that shows the relationship between register control settings and the state of the ACS pin. Table 2. State of Register Bit State of Register Bit Function of ACS pin CAL AEN AL/SW 0 1 1 Alarm 0 X 0 Square Wave out 1 X X 512 Hz out 0 0 1 HI-Z Table 3. Alarm Match Bit Examples Seconds Minutes Hours Date Months 1 1 1 1 1 No match required = alarm 1/second Alarm condition 0 1 1 1 1 Alarm when seconds match = alarm 1/minute 0 0 1 1 1 Alarm when seconds, minutes match = alarm 1/hour 0 0 0 1 1 Alarm when seconds, minutes, hours match = alarm 1/date 0 0 0 0 1 Alarm when seconds, minutes, hours, date match = alarm 1/month Real-time Clock Operation The real-time clock (RTC) is a timekeeping device that can be capacitor- or battery-backed for permanently-powered operation. It offers a software calibration feature that allows high accuracy. The RTC consists of an oscillator, clock divider, and a register system for user access. It divides down the 32.768 kHz time-base and provides a minimum resolution of seconds (1 Hz). Document Number: 001-86213 Rev. *C Static registers provide the user with read/write access to the time values. It includes registers for seconds, minutes, hours, day-of-the-week, date, months, and years. A block diagram shown in Figure 9 illustrates the RTC function. The user registers are synchronized with the timekeeper core using R and W bits in register 00h. The R bit is used to read the time. Changing the R bit from ‘0’ to ‘1’ transfers timekeeping information from the core into the user registers 02-08h that can be read by the user. If a timekeeper update is pending when R Page 8 of 39 FM33256B is set, then the core will be updated prior to loading the user registers. The user registers are frozen and will not be updated again until the R bit is cleared to a '0'. 8th clock of the write to register 00h (W = ‘0’), the RTC starts counting with a timebase that has been reset to zero milliseconds. The W bit is used to write new time/date values. Setting the W bit to a '1' stops the RTC and allows the timekeeping core to be written with new data. Clearing it to '0' causes the RTC to start running based on the new values loaded in the timekeeper core. The RTC may be synchronized to another clock source. On the Note: Users should be certain not to load invalid values, such as FFh, to the timekeeping registers. Updates to the timekeeping core occur continuously except when locked. Figure 9. Real-time Clock Core Block Diagram 512 Hz or Square Wave OSCEN 32.768 kHz crystal CF Years 8 bits Months 5 bits Clock Oscillator Date 6 bits Days 3 bits Divider 1 Hz W Update Logic Hours MInutes Seconds 6 bits 7 bits 7 bits R User Interface Registers Backup Power The real-time clock/calendar is intended to be permanently powered. When the primary system power fails, the voltage on the VDD pin will drop. When VDD is less than 2.5 V, the RTC (and event counters) will switch to the backup power supply on VBAK. The clock operates at extremely low current in order to maximize battery or capacitor life. However, an advantage of combining a clock function with FRAM memory is that data is not lost regardless of the backup power source. The minimum VBAK voltage varies linearly with temperature. The user can expect the minimum VBAK voltage to be 1.23 V at +85 °C and 1.90 V at -40 °C. The tested limit is 1.55 V at +25 °C. Note The minimum VBAK voltage has been characterized at -40 °C and +85 °C but is not 100% tested. Figure 11. VBAK (min.) vs Temperature IBAK (μA) VBAKmin. (V) Figure 10. IBAK vs. VBAK Voltage The IBAK current varies with temperature and voltage (see DC Electrical Characteristics table). Figure 10 shows IBAK as a function of VBAK. These curves are useful for calculating backup time when a capacitor is used as the VBAK source. VBAK (V) Document Number: 001-86213 Rev. *C Temperature (°C) Page 9 of 39 FM33256B Trickle Charger To facilitate capacitor backup, the VBAK pin can optionally provide a trickle charge current. When the VBC bit (register 18h, bit 3) is set to a '1', the VBAK pin will source approximately 80 µA until VBAK reaches VDD. This charges the capacitor to VDD without an external diode and resistor charger. There is also a Fast Charge mode which is enabled by the FC bit (register 18h, bit 2). In this mode the trickle charger current is set to approximately 1 mA, allowing a large backup capacitor to charge more quickly. In the case where no backup supply is used, the VBAK pin should be tied to VSS and VBC bit cleared. Note Systems using lithium batteries should clear the VBC bit to ‘0’ to prevent battery charging. The VBAK circuitry includes an internal 1 KΩ series resistor as a safety element. The trickle charger is UL Recognized. Calibration When the CAL bit in register 00h is set to a '1', the clock enters calibration mode. The FM33256B employs a digital method for calibrating the crystal oscillator frequency. The digital calibration scheme applies a digital correction to the RTC counters based on the calibration settings, CALS and CAL(4:0). In calibration mode (CAL = ‘1’), the ACS pin is driven with a 512 Hz (nominal) square wave and the alarm is temporarily unavailable. Any measured deviation from 512 Hz translates into a timekeeping error. The user measures the frequency and writes the appropriate correction value to the calibration register. The correction codes are listed in the table below. For convenience, the table also shows the frequency error in ppm. Positive ppm errors require a negative adjustment that removes pulses. Negative ppm errors require a positive correction that adds pulses. Positive ppm adjustments have the CALS (sign) bit set to ‘1’, whereas negative ppm adjustments have CALS = ‘0’. After calibration, the clock will have a maximum error of ±2.17 ppm or ±0.09 minutes per month at the calibrated temperature. The user will not be able to see the effect of the calibration setting on the 512 Hz output. The addition or subtraction of digital pulses occurs after the 512 Hz output. The calibration setting is stored in F-RAM so it is not lost should the backup source fail. It is accessed with bits CAL(4:0) in register 01h. These bits can be written when the CAL bit is set to a ‘1’. To exit the calibration mode, the user must clear the CAL bit to a logic ‘0’. When the CAL bit is ‘0’, the ACS pin will revert to the function according to Table 2. Crystal Type The crystal oscillator is designed to use a 6 pF/12.5 pF crystal without the need for external components, such as loading capacitors. The FM33256B device has built-in loading capacitors that are optimized for use with 6 pF crystals, but which work well with 12.5 pF crystals. For either crystal, no additional external loading capacitors are required nor suggested. If a 32.768 kHz crystal is not used, an external oscillator may be connected to the FM33256B. Layout Recommendations The X1 and X2 crystal pins employ very high impedance circuits and the oscillator connected to these pins can be upset by noise or extra loading. To reduce RTC clock errors from signal switching noise, a guard ring should be placed around these pads and the guard ring grounded. High speed SPI traces should be routed away from the X1/X2 pads. The X1 and X2 trace lengths should be less than 5 mm. The use of a ground plane on the backside or inner board layer is preferred. See layout example. Red is the top layer, green is the bottom layer. Figure 12. Layout Recommendations CS CS SO SO CNT CNT VBA K VBA K X2 X2 X1 X1 VSS VSS Layout for Surface Mount Crystal Layout for Through Hole Crystal (red = top layer, green = bottom layer) (red = top layer, green = bottom layer) Document Number: 001-86213 Rev. *C Page 10 of 39 FM33256B Table 4. Digital Calibration Adjustments Positive Calibration for slow clocks: Calibration will achieve ± 2.17 PPM after calibration Measured Frequency Range Error Range (PPM) Min Max Min Max Program Calibration Register to: 0 512.0000 511.9989 0 2.17 000000 1 511.9989 511.9967 2.18 6.51 100001 2 511.9967 511.9944 6.52 10.85 100010 3 511.9944 511.9922 10.86 15.19 100011 4 511.9922 511.9900 15.20 19.53 100100 5 511.9900 511.9878 19.54 23.87 100101 6 511.9878 511.9856 23.88 28.21 100110 7 511.9856 511.9833 28.22 32.55 100111 8 511.9833 511.9811 32.56 36.89 101000 9 511.9811 511.9789 36.90 41.23 101001 10 511.9789 511.9767 41.24 45.57 101010 11 511.9767 511.9744 45.58 49.91 101011 12 511.9744 511.9722 49.92 54.25 101100 13 511.9722 511.9700 54.26 58.59 101101 14 511.9700 511.9678 58.60 62.93 101110 15 511.9678 511.9656 62.94 67.27 101111 16 511.9656 511.9633 67.28 71.61 110000 17 511.9633 511.9611 71.62 75.95 110001 18 511.9611 511.9589 75.96 80.29 110010 19 511.9589 511.9567 80.30 84.63 110011 20 511.9567 511.9544 84.64 88.97 110100 21 511.9544 511.9522 88.98 93.31 110101 22 511.9522 511.9500 93.32 97.65 110110 23 511.9500 511.9478 97.66 101.99 110111 24 511.9478 511.9456 102.00 106.33 111000 25 511.9456 511.9433 106.34 110.67 111001 26 511.9433 511.9411 110.68 115.01 111010 27 511.9411 511.9389 115.02 119.35 111011 28 511.9389 511.9367 119.36 123.69 111100 29 511.9367 511.9344 123.70 128.03 111101 30 511.9344 511.9322 128.04 132.37 111110 31 511.9322 511.9300 132.38 136.71 111111 Document Number: 001-86213 Rev. *C Page 11 of 39 FM33256B Table 4. Digital Calibration Adjustments (continued) Negative Calibration for fast clocks: Calibration will achieve ± 2.17 PPM after calibration Measured Frequency Range Error Range (PPM) Min Max Min Max Program Calibration Register to: 0 512.0000 512.0011 0 2.17 000000 1 512.0011 512.0033 2.18 6.51 000001 2 512.0033 512.0056 6.52 10.85 000010 3 512.0056 512.0078 10.86 15.19 000011 4 512.0078 512.0100 15.20 19.53 000100 5 512.0100 512.0122 19.54 23.87 000101 6 512.0122 512.0144 23.88 28.21 000110 7 512.0144 512.0167 28.22 32.55 000111 8 512.0167 512.0189 32.56 36.89 001000 9 512.0189 512.0211 36.90 41.23 001001 10 512.0211 512.0233 41.24 45.57 001010 11 512.0233 512.0256 45.58 49.91 001011 12 512.0256 512.0278 49.92 54.25 001100 13 512.0278 512.0300 54.26 58.59 001101 14 512.0300 512.0322 58.60 62.93 001110 15 512.0322 512.0344 62.94 67.27 001111 16 512.0344 512.0367 67.28 71.61 010000 17 512.0367 512.0389 71.62 75.95 010001 18 512.0389 512.0411 75.96 80.29 010010 19 512.0411 512.0433 80.30 84.63 010011 20 512.0433 512.0456 84.64 88.97 010100 21 512.0456 512.0478 88.98 93.31 010101 22 512.0478 512.0500 93.32 97.65 010110 23 512.0500 512.0522 97.66 101.99 010111 24 512.0522 512.0544 102.00 106.33 011000 25 512.0544 512.0567 106.34 110.67 011001 26 512.0567 512.0589 110.68 115.01 011010 27 512.0589 512.0611 115.02 119.35 011011 28 512.0611 512.0633 119.36 123.69 011100 29 512.0633 512.0656 123.70 128.03 011101 30 512.0656 512.0678 128.04 132.37 011110 31 512.0678 512.0700 132.38 136.71 011111 Document Number: 001-86213 Rev. *C Page 12 of 39 FM33256B Register Map The RTC and processor companion functions are accessed via 30 special function registers, which are mapped to unique opcodes. The interface protocol is described on page 23. The registers contain timekeeping data, alarm settings, control bits, and information flags. A description of each register follows the summary table. Table 5. Register Map Summary Table Battery-backed = Address Nonvolatile = BB/NV User Programmable = Data D7 D6 D5 D4 1Dh M 0 0 Alarm 10 months 1Ch M 0 Alarm 10 date 1Bh M 0 1Ah M 19h M 18h SNL D3 D1 Alarm date Alarm 10 hours Alarm hours Alarm minutes Alarm 10 seconds Alarm seconds F1 F0 VBC FC VTP1 Function D0 Alarm months Alarm 10 minutes AL/SW D2 VTP0 Range Alarm Month 01-12 Alarm Date 01-31 Alarm Hours 00-23 Alarm Minutes 00-59 Alarm Seconds 00-59 Companion Control 17h Serial Number Byte 7 Serial Number 7 FFh 16h Serial Number Byte 6 Serial Number 6 FFh 15h Serial Number Byte 5 Serial Number 5 FFh 14h Serial Number Byte 4 Serial Number 4 FFh 13h Serial Number Byte 3 Serial Number 3 FFh 12h Serial Number Byte 2 Serial Number 2 FFh 11h Serial Number Byte 1 Serial Number 1 FFh 10h Serial Number Byte 0 Serial Number 0 FFh 0Fh Event Counter Byte 1 Event Counter 1 FFh 0Eh Event Counter Byte 0 Event Counter 0 FFh 0Dh NVC 0Ch WDE 0Bh - - - - RC WC POLL CP - - WDET4 WDET3 WDET2 WDET1 WDET0 Watchdog Control - - WDST4 WDST3 WDST2 WDST1 WDST0 Watchdog Control Watchdog Restart 0Ah - - - - WR3 WR2 WR1 WR0 09h EWDF LWDF POR LB - - - - 0 0 08h 07h 10 years 06h 0 0 05h 0 0 0 10 months 0 years Years 00-99 Month 01-12 Date 01-31 Day 01-07 date 0 0 day 10 hours hours 04h 0 03h 0 02h 0 01h - - CALS CAL4 CAL3 CAL2 CAL1 CAL0 00h OSCEN AF CF AEN reserved CAL W R 10 minutes minutes 10 seconds Watchdog Flags months 10 date 0 Event Counter Control seconds Hours 00-23 Minutes 00-59 Seconds 00-59 CAL/Control RTC/Alarm Control Note When the device is first powered up and programmed, all timekeeping registers must be written because the battery-backed register values cannot be guaranteed. The table below shows the default values of the non-volatile registers and some of the battery-backed bits. All other register values should be treated as unknown. Document Number: 001-86213 Rev. *C Page 13 of 39 FM33256B Table 6. Default Register Values Address Hex Value 1Dh 0x81 1Ch 0x81 1Bh 0x80 1Ah 0x80 19h 0x80 18h 0x40 17h 0x00 16h 0x00 15h 0x00 14h 0x00 13h 0x00 Address 12h 11h 10h 0Fh 0Eh 0Dh 0Ch 0Bh 08h 07h 06h Document Number: 001-86213 Rev. *C Hex Value 0x00 0x00 0x00 0x00 0x00 0x01 0x00 0x00 0x00 0x00 0x00 Address 05h 04h 03h 02h 01h 00h Hex Value 0x00 0x00 0x00 0x00 0x00 0x80 Page 14 of 39 FM33256B Table 7. Register Description Address Description 1Dh Alarm – Month D7 D6 D5 D4 D3 D2 D1 D0 M 0 0 10 Month Month.3 Month.2 Month.1 Month.0 Contains the alarm value for the month and the mask bit to select or deselect the Month value. M Match. Setting this bit to ‘0’ causes the Month value to be used in the alarm match logic. Setting this bit to ‘1’ causes the match circuit to ignore the Month value. Battery-backed, read/write. 1Ch Alarm – Date D7 D6 D5 D4 D3 D2 D1 D0 M 0 10 date.1 10 date.0 Date.3 Date.2 Date.1 Date.0 Contains the alarm value for the date and the mask bit to select or deselect the Date value. M Match: Setting this bit to ‘0’ causes the Date value to be used in the alarm match logic. Setting this bit to ‘1’ causes the match circuit to ignore the Date value. Battery-backed, read/write. 1Bh Alarm – Hours D7 D6 D5 D4 D3 D2 D1 D0 M 0 10 hours.1 10 hours.0 Hours.3 Hours.2 Hours.1 Hours.0 Contains the alarm value for the hours and the mask bit to select or deselect the Hours value. M Match: Setting this bit to ‘0’ causes the Hours value to be used in the alarm match logic. Setting this bit to ‘1’ causes the match circuit to ignore the Hours value. Battery-backed, read/write. 1Ah Alarm – Minutes D7 D6 D5 D4 D3 D2 D1 D0 M 10 min.2 10 min.1 10 min.0 Min.3 Min.2 Min.1 Min.0 Contains the alarm value for the minutes and the mask bit to select or deselect the Minutes value M Match: Setting this bit to ‘0’ causes the Minutes value to be used in the alarm match logic. Setting this bit to ‘1’ causes the match circuit to ignore the Minutes value. Battery-backed, read/write. 19h Alarm – Seconds D7 D6 D5 D4 D3 D2 D1 D0 M 10 sec.2 10 sec.1 10 sec.0 Seconds.3 Seconds.2 Seconds.1 Seconds.0 Contains the alarm value for the seconds and the mask bit to select or deselect the Seconds value. M Match: Setting this bit to ‘0’ causes the Seconds value to be used in the alarm match logic. Setting this bit to ‘1’ causes the match circuit to ignore the Seconds value. Battery-backed, read/write. 18h Companion Control D7 D6 D5 D4 D3 D2 D1 D0 SNL AL/SW F1 F0 VBC FC VTP1 VTP0 SNL Serial Number Lock: Setting to a ‘1’ makes registers 10h to 17h and SNL read-only. SNL cannot be cleared once set to ‘1’. Nonvolatile, read/write. AL/SW Alarm/Square Wave Select: When set to ‘1’, the alarm match drives the ACS pin as well as the AF flag. When set to ‘0’, the selected Square Wave Freq will be driven on the ACS pin, and an alarm match only sets the AF flag. Nonvolatile, read/write. Document Number: 001-86213 Rev. *C Page 15 of 39 FM33256B Table 7. Register Description (continued) Address F(1:0) VBC FC Description Square Wave Frequency Select: These bits select the frequency on the ACS pin when the CAL and AL/SW bits are both ‘0’. Nonvolatile. Setting F(1:0) 1 Hz 00 (default) 512 Hz 01 4096 Hz 10 32768 Hz 11 VBAK Charger Control: Setting VBC to ‘1’ (and FC = ‘0’) causes a 80 µA (1 mA if FC = ‘1’) trickle charge current to be supplied on VBAK. Clearing VBC to ‘0’ disables the charge current. Battery-backed, read/write. VBC FC Trickle charge current 0 X Disabled 1 0 80 µA 1 1 1 mA Fast Charge: Setting FC to ‘1’ (and VBC = ‘1’) causes a ~1 mA trickle charge current to be supplied on VBAK. Clearing VBC to ‘0’ disables the charge current. Battery-backed, read/write. VTP(1:0) VTP Select. These bits control the reset trip point for the low VDD reset function. Nonvolatile, read/write. VTP VTP1 VTP0 2.60 V 0 0 (factory default) 2.75 V 0 1 2.90 V 1 0 3.00 V 1 1 17h Serial Number Byte 7 D7 D6 D5 D4 D3 D2 D1 D0 SN.63 SN.62 SN.61 SN.60 SN.59 SN.58 SN.57 SN.56 16h Serial Number Byte 6 D7 D6 D5 D4 D3 D2 D1 D0 SN.55 SN.54 SN.53 SN.52 SN.51 SN.50 SN.49 SN.48 15h Serial Number Byte 5 D7 D6 D5 D4 D3 D2 D1 D0 SN.47 SN.46 SN.45 SN.44 SN.43 SN.42 SN.41 SN.40 14h Serial Number Byte 4 D7 D6 D5 D4 D3 D2 D1 D0 SN.39 SN.38 SN.37 SN.36 SN.35 SN.34 SN.33 SN.32 13h Serial Number Byte 3 D7 D6 D5 D4 D3 D2 D1 D0 SN.31 SN.30 SN.29 SN.28 SN.27 SN.26 SN.25 SN.24 Document Number: 001-86213 Rev. *C Page 16 of 39 FM33256B Table 7. Register Description (continued) Address Description 12h Serial Number Byte 2 D7 D6 D5 D4 D3 D2 D1 D0 SN.23 SN.22 SN.21 SN.20 SN.19 SN.18 SN.17 SN.16 11h Serial Number Byte 1 D7 D6 D5 D4 D3 D2 D1 D0 SN.15 SN.14 SN.13 SN.12 SN.11 SN.10 SN.9 SN.8 10h Serial Number Byte 0 D7 D6 D5 D4 D3 D2 D1 D0 SN.7 SN.6 SN.5 SN.4 SN.3 SN.2 SN.1 SN.0 All serial number bytes are read/write when SNL = ‘0’, read-only when SNL = ‘1’. Nonvolatile. 0Fh Event Counter Byte 1 D7 D6 D5 D4 D3 D2 D1 D0 EC.15 EC.14 EC.13 EC.12 EC.11 EC.10 EC.9 EC.8 Event Counter Byte 1. Increments on programmed edge event on CNT input. Nonvolatile when NVC = ‘1’, Battery-backed when NVC = ‘0’, read/write. 0Eh Event Counter Byte 0 D7 D6 D5 D4 D3 D2 D1 D0 EC.7 EC.6 EC.5 EC.4 EC.3 EC.2 EC.1 EC.0 Event Counter Byte 0. Increments on programmed edge event on CNT input. Nonvolatile when NVC = ‘1’, Battery-backed when NVC = ‘0’, read/write. 0Dh NVC Event Counter Control D7 D6 D5 D4 D3 D2 D1 D0 NVC - - - RC WC POLL CP Nonvolatile/Volatile Counter: Setting this bit to ‘1’ makes the counter nonvolatile and counter operates only when VDD is greater than VTP. Setting this bit to ‘0’ makes the counter volatile, which allows counter operation under VBAK or VDD power. If the NVC bit is changed, the counter value is not valid. Nonvolatile, read/write. RC Read Counter. Setting this bit to ‘1’ takes a snapshot of the two counter bytes allowing the system to read the values without missing count events. The RC bit will be automatically cleared. WC Write Counter. Setting this bit to a ‘1’ allows the user to write the counter bytes. While WC = ‘1’, the counter is blocked from count events on the CNT pin. The WC bit must be cleared by the user to activate the counter. POLL Polled Mode: When POLL = ‘1’, the CNT pin is sampled for 30 µs every 125 ms. If POLL is set, the NVC bit is internally cleared and the CP bit is set to detect a rising edge. The RTC oscillator must be enabled (OSCEN = ‘0’) to operate in polled mode. When POLL = ‘0’, CNT pin is continuously active. Nonvolatile, read/write. CP The CNT pin detects falling edges when CP = ‘0’, rising edges when CP = ‘1’. Nonvolatile, read/write. Document Number: 001-86213 Rev. *C Page 17 of 39 FM33256B Table 7. Register Description (continued) Address Description 0Ch Watchdog Control D7 D6 D5 D4 D3 D2 D1 D0 WDE - - WDET4 WDET3 WDET2 WDET1 WDET0 WDE Watchdog Enable: When WDE = ‘1’, a watchdog timer fault will cause the RST signal to go active. When WDE = ‘0’ the timer runs but has no effect on the RST pin. Nonvolatile, read/write. WDET(4:0) Watchdog EndTime: Sets the ending time for the watchdog window timer with 60 ms (min.) resolution. The window timer allows independent leading and trailing edges (start and end of window) to be set. New watchdog timeouts are loaded when the timer is restarted by writing the 1010b pattern to WR(3:0). To save power (disable timer circuit), the EndTime may be set to all zeroes. Nonvolatile, read/write. Watchdog EndTime WDET4 WDET3 WDET2 WDET1 WDET0 Disables Timer 0 0 0 0 0 (min.) (max.) 60 ms 200 ms 0 0 0 0 1 120 ms 400 ms 0 0 0 1 0 180 ms 600 ms 0 0 0 1 1 . . . . 1200 ms 4000 ms 1 0 1 0 0 1260 ms 4200 ms 1 0 1 0 1 1320 ms 4400 ms 1 0 1 1 0 . . . . 1740 ms 5800 ms 1 1 1 0 1 1800 ms 6000 ms 1 1 1 1 0 1860 ms 6200 ms 1 1 1 1 1 Document Number: 001-86213 Rev. *C Page 18 of 39 FM33256B Table 7. Register Description (continued) Address Description 0Bh Watchdog Control WDST(4:0) D7 D6 D5 D4 D3 D2 D1 D0 - - - WDST4 WDST3 WDST2 WDST1 WDST0 Watchdog StartTime. Sets the starting time for the watchdog window timer with 25 ms (max.) resolution. The window timer allow independent leading and trailing edges (start and end of window) to be set. New watchdog timer settings are loaded when the timer is restarted by writing the 1010b pattern to WR(3:0). Nonvolatile, read/write. Watchdog StartTime WDST4 WDST3 WDST2 WDST1 WDST0 0 ms (default) 0 0 0 0 0 (min.) (max.) 7.5 ms 25 ms 0 0 0 0 1 15 ms 50 ms 0 0 0 1 0 22.5 ms 75 ms 0 0 0 1 1 . . . . 150 ms 500 ms 1 0 1 0 0 157.5 ms 525 ms 1 0 1 0 1 165 ms 550 ms 1 0 1 1 0 . . . . 217.5 ms 725 ms 1 1 1 0 1 225 ms 750 ms 1 1 1 1 0 232.5 ms 775 ms 1 1 1 1 1 0Ah Watchdog Restart D7 D5 D4 D3 D2 D1 D0 - - - WR3 WR2 WR1 WR0 WR(3:0) Watchdog Restart. Writing a pattern 1010b to WR(3:0) restarts the watchdog timer. The upper nibble contents do not affect this operation. Writing any pattern other than 1010b to WR(3:0) has no effect on the watchdog. Write-only. 09h Watchdog Flags D7 D6 D5 D4 D3 D2 D1 D0 EWDF - POR LB - - - - EWDF Early Watchdog Timer Fault Flag: When a watchdog restart occurs too early (before the programmed watchdog StartTime), the RST pin is driven LOW and this flag is set. It must be cleared by the user. Note that both EWDF and POR could be set if both reset sources have occurred since the flags were cleared by the user. Battery-backed, read/write. LWDF Late Watchdog Timer Fault Flag: When either a watchdog restart occurs too late (after the programmed watchdog EndTime) or no restart occurs, the RST pin is driven LOW and this flag is set. It must be cleared by the user. Note that both LWDF and POR could be set if both reset sources have occurred since the flags were cleared by the user. Battery-backed, read/write. Document Number: 001-86213 Rev. *C Page 19 of 39 FM33256B Table 7. Register Description (continued) Address POR Description Power-On Reset: When the RST signal is activated by VDD < VTP, the POR bit will be set to ‘1’. A manual reset will not set this flag. Note that one or both of the watchdog flags and the POR flag could be set if both reset sources have occurred since the flags were cleared by the user. Battery-backed, read/write. (internally set, user must clear bit). LB Low Backup: If the VBAK source drops to a voltage level insufficient to operate the RTC/alarm when VDD < VBAK, this bit will be set to ‘1’. All registers need to be re-initialized since the battery-backed register values should be treated as unknown. The user should clear it to ‘0’ when initializing the system. Battery-backed. Read/Write (internally set, user must clear bit). 08h Timekeeping – Years D7 D6 D5 D4 D3 D2 D1 D0 10 year.3 10 year.2 10 year.1 10 year.0 Year.3 Year.2 Year.1 Year.0 Contains the lower two BCD digits of the year. Lower nibble contains the value for years; upper nibble contains the value for 10s of years. Each nibble operates from 0 to 9. The range for the register is 0-99. Battery-backed, read/write. 07h Timekeeping – Months D7 D6 D5 D4 D3 D2 D1 D0 0 0 0 10 Month Month.3 Month.2 Month.1 Month.0 Contains the BCD digits for the month. Lower nibble contains the lower digit and operates from 0 to 9; upper nibble (one bit) contains the upper digit and operates from 0 to 1. The range for the register is 1-12. Battery-backed, read/write. 06h Timekeeping – Date of the month D7 D6 D5 D4 D3 D2 D1 D0 0 0 10 date.1 10 date.0 Date.3 Date.2 Date.1 Date.0 Contains the BCD digits for the date of the month. Lower nibble contains the lower digit and operates from 0 to 9; upper nibble contains the upper digit and operates from 0 to 3. The range for the register is 1-31. Battery-backed, read/write. 05h Timekeeping – Day of the week D7 D6 D5 D4 D3 D2 D1 D0 0 0 0 0 0 Day.2 Day.1 Day.0 Lower nibble contains a value that correlates to day of the week. Day of the week is a ring counter that counts from 1 to 7 then returns to 1. The user must assign meaning to the day value, as the day is not integrated with the date. Battery-backed, read/write. 04h Timekeeping – Hours D7 D6 D5 D4 D3 D2 D1 D0 0 0 10 hours.1 10 hours.0 Hours.3 Hours.2 Hours.1 Hours.0 Contains the BCD value of hours in 24-hour format. Lower nibble contains the lower digit and operates from 0 to 9; upper nibble (two bits) contains the upper digit and operates from 0 to 2. The range for the register is 0-23. Battery-backed, read/write. Document Number: 001-86213 Rev. *C Page 20 of 39 FM33256B Table 7. Register Description (continued) Address Description 03h Timekeeping – Minutes D7 D6 D5 D4 D3 D2 D1 D0 0 10 min.2 10 min.1 10 min.0 Min.3 Min.2 Min.1 Min.0 Contains the BCD value of minutes. Lower nibble contains the lower digit and operates from 0 to 9; upper nibble contains the upper minutes digit and operates from 0 to 5. The range for the register is 0-59. Battery-backed, read/write. 02h Timekeeping - Seconds D7 D6 D5 D4 D3 D2 D1 D0 0 10 sec.2 10 sec.1 10 sec.0 Seconds.3 Seconds.2 Seconds.1 Seconds.0 Contains the BCD value of seconds. Lower nibble contains the lower digit and operates from 0 to 9; upper nibble contains the upper digit and operates from 0 to 5. The range for the register is 0-59. Battery-backed, read/write. 01h CAL/Control D7 D6 D5 D4 D3 D2 D1 D0 - - CALS CAL.4 CAL.3 CAL.2 CAL.1 CAL.0 CALS Calibration Sign: Determines if the calibration adjustment is applied as an addition to or as a subtraction from the time-base. This bit can be written only when CAL = ‘1’. Nonvolatile, read/write. CAL(4:0) Calibration Code: These five bits control the calibration of the clock. These bits can be written only when CAL = ‘1’. Nonvolatile, read/write. 00h RTC/Alarm Control OSCEN D7 D6 D5 D4 D3 D2 D1 D0 OSCEN AF CF AEN Reserved CAL W R Oscillator Enable. When set to '1', the oscillator is halted. When set to '0', the oscillator runs. Disabling the oscillator can save battery power during storage. On a power-up without a VBAK source or on a power-up after a VBAK source has been applied, this bit is internally set to '1', which turns off the oscillator. Battery-backed, read/write. AF Alarm Flag: This bit is set to ‘1’ when the time and date match the values stored in the alarm registers with the Match bit(s) = ‘0’. The user must clear it to '0'. Battery-backed. (internally set, user must clear bit) CF Century Overflow Flag: This bit is set to a ‘1’ when the values in the years register overflows from 99 to 00. This indicates a new century, such as going from 1999 to 2000 or 2099 to 2100. The user should record the new century information as needed. The user must clear the CF bit to '0'. Battery-backed. (internally set, user must clear bit) AEN Alarm Enable: This bit enables the alarm function. When AEN is set (and CAL cleared), the ACS pin operates as an active-low alarm. The state of the ACS pin is detailed in Table 2. When AEN is cleared, no new alarm events that set the AF bit will be generated. Clearing the AEN bit does not automatically clear AF. Battery-backed. CAL Calibration Setting: When CAL is set to ‘1’, the clock enters calibration mode. When CAL is set to ‘0’, the clock operates normally, and the ACS pin is controlled by the RTC alarm. Battery-backed, read/write. W Write Time. Setting the W bit to ‘1’ freezes updates of the user timekeeping registers. The user can then write them with updated values. Setting the W bit to ‘0’ causes the contents of the time registers to be transferred to the timekeeping counters. Battery-backed, read/write. Document Number: 001-86213 Rev. *C Page 21 of 39 FM33256B Table 7. Register Description (continued) Address Description R Read Time. Setting the R bit to '1' copies a static image of the timekeeping core and places it into the user registers. The user can then read them without concerns over changing values causing system errors. The R bit going from ‘0’ to ‘1’ causes the timekeeping capture, so the bit must be returned to ‘0’ prior to reading again. Battery-backed, read/write. Reserved Reserved bits. Do not use. Should remain set to ‘0’. Document Number: 001-86213 Rev. *C Page 22 of 39 FM33256B Serial Peripheral Interface – SPI Bus The FM33256B employs a serial peripheral interface (SPI) bus. It is specified to operate at speeds up to 16 MHz. This high-speed serial bus provides high-performance serial communication to an SPI master. Many common microcontrollers have hardware SPI ports allowing a direct interface. It is quite simple to emulate the port using ordinary port pins for microcontrollers that do not. The FM33256B operates in SPI Mode 0 and 3. SPI Overview The SPI is a four-pin interface with Chip Select (CS), Serial Input (SI), Serial Output (SO), and Serial Clock (SCK) pins. The SPI is a synchronous serial interface, which uses clock and data pins for memory access and supports multiple devices on the data bus. A device on the SPI bus is activated using the CS pin. The relationship between chip select, clock, and data is dictated by the SPI mode. This device supports SPI modes 0 and 3. In both of these modes, data is clocked into the F-RAM on the rising edge of SCK starting from the first rising edge after CS goes active. The SPI protocol is controlled by opcodes. These opcodes specify the commands from the bus master to the slave device. After CS is activated, the first byte transferred from the bus master is the opcode. Following the opcode, any addresses and data are then transferred. The CS must go inactive after an operation is complete and before a new opcode can be issued. The commonly used terms in the SPI protocol are as follows: SPI Master The SPI master device controls the operations on an SPI bus. An SPI bus may have only one master with one or more slave devices. All the slaves share the same SPI bus lines and the master may select any of the slave devices using the CS pin. All of the operations must be initiated by the master activating a slave device by pulling the CS pin of the slave LOW. The master also generates the SCK and all the data transmission on SI and SO lines are synchronized with this clock. SPI Slave The SPI slave device is activated by the master through the Chip Select line. A slave device gets the SCK as an input from the SPI master and all the communication is synchronized with this clock. An SPI slave never initiates a communication on the SPI bus and acts only on the instruction from the master. The FM33256B operates as an SPI slave and may share the SPI bus with other SPI slave devices. Chip Select (CS) To select any slave device, the master needs to pull down the corresponding CS pin. Any instruction can be issued to a slave device only while the CS pin is LOW. When the device is not Document Number: 001-86213 Rev. *C selected, data through the SI pin is ignored and the serial output pin (SO) remains in a high-impedance state. Note A new instruction must begin with the falling edge of CS. Therefore, only one opcode can be issued for each active Chip Select cycle. Serial Clock (SCK) The Serial Clock is generated by the SPI master and the communication is synchronized with this clock after CS goes LOW. The FM33256B enables SPI modes 0 and 3 for data communication. In both of these modes, the inputs are latched by the slave device on the rising edge of SCK and outputs are issued on the falling edge. Therefore, the first rising edge of SCK signifies the arrival of the first bit (MSB) of an SPI instruction on the SI pin. Further, all data inputs and outputs are synchronized with SCK. Data Transmission (SI/SO) The SPI data bus consists of two lines, SI and SO, for serial data communication. SI is also referred to as Master Out Slave In (MOSI) and SO is referred to as Master In Slave Out (MISO). The master issues instructions to the slave through the SI pin, while the slave responds through the SO pin. Multiple slave devices may share the SI and SO lines as described earlier. The FM33256B has two separate pins for SI and SO, which can be connected with the master as shown in Figure 13. For a microcontroller that has no dedicated SPI bus, a general-purpose port may be used. To reduce hardware resources on the controller, it is possible to connect the two data pins (SI, SO) together. Figure 14 shows such a configuration, which uses only three pins. Most Significant Bit (MSB) The SPI protocol requires that the first bit to be transmitted is the Most Significant Bit (MSB). This is valid for both address and data transmission. The 256-Kbit serial F-RAM requires a 2-byte address for any read or write operation. Because the address is only 15 bits, the upper bit which is fed in is ignored by the device. Although this bit is ‘don’t care’, Cypress recommends that this bit be set to ‘0’ to enable seamless transition to higher memory densities. Serial Opcode After the slave device is selected with CS going LOW, the first byte received is treated as the opcode for the intended operation. FM33256B uses the standard opcodes for memory accesses. Invalid Opcode If an invalid opcode is received, the opcode is ignored and the device ignores any additional serial data on the SI pin until the next falling edge of CS, and the SO pin remains tristated. Page 23 of 39 FM33256B Status Register The FM33256B has an 8-bit Status Register. The bits in the Status Register are used to configure the device. These bits are described in Table 10 on page 26. Figure 13. System Configuration with SPI Port SCK MOSI MISO SCK SPI Microcontroller SI SCK SO FM33256B SI SO FM33256B CS CS CS1 CS2 Figure 14. System Configuration without SPI Port P1.0 P1.1 SCK SI SO Microcontroller FM33256B CS P1.2 SPI Modes The FM33256B may be driven by a microcontroller with its SPI peripheral running in either of the following two modes: ■ SPI Mode 0 (CPOL = 0, CPHA = 0) ■ SPI Mode 3 (CPOL = 1, CPHA = 1) For both these modes, the input data is latched in on the rising edge of SCK starting from the first rising edge after CS goes active. If the clock starts from a HIGH state (in mode 3), the first rising edge after the clock toggles is considered. The output data is available on the falling edge of SCK. The two SPI modes are shown in Figure 15 on page 24 and Figure 16 on page 24. The status of the clock when the bus master is not transferring data is: ■ SCK remains at 0 for Mode 0 ■ SCK remains at 1 for Mode 3 The device detects the SPI mode from the status of the SCK pin when the device is selected by bringing the CS pin LOW. If the SCK pin is LOW when the device is selected, SPI Mode 0 is assumed and if the SCK pin is HIGH, it works in SPI Mode 3. Figure 15. SPI Mode 0 CS 0 1 3 5 4 6 7 SCK SI 7 6 5 4 3 2 1 0 MSB LSB Figure 16. SPI Mode 3 CS 0 1 2 3 4 5 6 7 SCK SI 7 MSB Document Number: 001-86213 Rev. *C 2 6 5 4 3 2 1 0 LSB Page 24 of 39 FM33256B Power Up to First Access The FM33256B is not accessible for a tPU time after power-up. Users must comply with the timing parameter, tPU, which is the minimum time from VDD (min) to the first CS LOW. Command Structure There are eight commands, called opcodes, that can be issued by the bus master to the FM33256B. They are listed in Table 1. These opcodes control the functions performed by the memory and processor companion. Table 8. Opcode Commands Name Description Opcode WREN Set write enable latch 0000 0110b WRDI Reset write enable latch 0000 0100b RDSR Read Status Register 0000 0101b WRSR Write Status Register 0000 0001b READ Read memory data 0000 0011b WRITE Write memory data 0000 0010b RDPC Read Processor Companion 0001 0011b WRPC Write Processor Companion 0001 0010b WREN - Set Write Enable Latch The FM33256B will power up with writes disabled. The WREN command must be issued before any write operation. Sending the WREN opcode allows the user to issue subsequent opcodes for write operations. These include writing the Status Register (WRSR) and writing the memory (WRITE). Sending the WREN opcode causes the internal Write Enable Latch to be set. A flag bit in the Status Register, called WEL, indicates the state of the latch. WEL = ’1’ indicates that writes are permitted. Attempting to write the WEL bit in the Status Register has no effect on the state of this bit – only the WREN opcode can Document Number: 001-86213 Rev. *C set this bit. The WEL bit will be automatically cleared on the rising edge of CS following a WRDI, a WRSR, a WRPC or a WRITE operation. This prevents further writes to the Status Register or the F-RAM array without another WREN command. Figure 17 illustrates the WREN command bus configuration. Figure 17. WREN Bus Configuration CS 0 1 2 3 4 5 6 7 SCK SI 0 0 0 0 0 1 1 0 HI-Z SO WRDI - Reset Write Enable Latch The WRDI command disables all write activity by clearing the Write Enable Latch. The user can verify that writes are disabled by reading the WEL bit in the Status Register and verifying that WEL is equal to ‘0’. Figure 18 illustrates the WRDI command bus configuration. Figure 18. WRDI Bus Configuration CS 0 1 2 3 4 5 6 7 SCK SI SO 0 0 0 0 0 1 0 0 HI-Z Page 25 of 39 FM33256B Status Register and Write Protection The write protection features of the FM33256B are multi-tiered and are enabled through the status register. The Status Register is organized as follows. (The default value shipped from the factory for bits 0-4, bit 6 is ‘0’ and bit 5 is ‘1’ in the Status Register). Table 9. Status Register Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 X (0) X (1) X (0) X (0) BP1 (0) BP0 (0) WEL (0) X (0) Table 10. Status Register Bit Definition Bit Definition Description Bit 0 Don’t care This bit is non-writable and always returns ‘0’ upon read. Bit 1 (WEL) Write Enable WEL indicates if the device is write enabled. This bit defaults to ‘0’ (disabled) on power-up. WEL = '1' --> Write enabled WEL = '0' --> Write disabled Bit 2 (BP0) Block Protect bit ‘0’ Used for block protection. For details, see Table 11 on page 26. Bit 3 (BP1) Block Protect bit ‘1’ Used for block protection. For details, see Table 11 on page 26. Bit 4-5 Don’t care These bits are non-writable and always return ‘0’ upon read. Bit 6 Don’t care This bit is non-writable and always returns ‘1’ upon read. Bit 7 Don’t care This bit is non-writable and always returns ‘0’ upon read. Bit 0, bits 4-5 bit, bit 7 are fixed at ‘0’ and bit 6 is fixed at ‘1’; none of these bits can be modified. Note that bit 0 (“Ready or Write in progress” bit in serial flash and EEPROM) is unnecessary, as the F-RAM writes in real-time and is never busy, so it reads out as a ‘0’. BP1 and BP0 control the software write-protection features and are nonvolatile bits. The WEL flag indicates the state of the Write Enable Latch. Attempting to directly write the WEL bit in the Status Register has no effect on its state. This bit is internally set and cleared via the WREN and WRDI commands, respectively. BP1 and BP0 are memory block write protection bits. They specify portions of memory that are write-protected as shown in Table 4. Table 11. Block Memory Write Protection BP1 BP0 Protected Address Range 0 0 None 0 1 6000h to 7FFFh (upper 1/4) 1 0 4000h to 7FFFh (upper 1/2) 1 1 0000h to 7FFFh (all) Document Number: 001-86213 Rev. *C The BP1 and BP0 bits and the Write Enable Latch are the only mechanisms that protect the memory from writes. The remaining write protection features protect inadvertent changes to the block protect bits. RDSR - Read Status Register The RDSR command allows the bus master to verify the contents of the Status Register. Reading the status register provides information about the current state of the write-protection features. Following the RDSR opcode, the FM33256B will return one byte with the contents of the Status Register. WRSR - Write Status Register The WRSR command allows the SPI bus master to write into the Status Register and change the write protect configuration by setting the BP0 and BP1 bits as required. Before sending the WRSR command, the user must send a WREN command to enable writes. Executing a WRSR command is a write operation and therefore, clears the Write Enable Latch. Page 26 of 39 FM33256B Figure 19. RDSR Bus Configuration CS 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 SCK Opcode 0 SI 0 0 0 0 1 0 1 0 Data HI-Z SO D7 D6 D5 D4 D3 D2 D1 D0 MSB LSB Figure 20. WRSR Bus Configuration (WREN not shown) CS 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 SCK Data Opcode SI 0 0 0 0 0 0 1 D7 X MSB 0 X X D3 D2 X X LSB HI-Z SO RDPC - Read Processor Companion WRPC - Write Processor Companion The RDPC command allows the bus master to verify the contents of the Processor Companion registers. Following the RDPC opcode, a single-byte register address is sent. The FM33256B will then return one or more bytes with the contents of the companion registers. When reading multiple data bytes, the internal register address will wrap around to 00h after 1Dh is reached. The WRPC command is used to set companion control settings. A WREN command is required prior to sending the WRPC command. Following the WRPC opcode, a single-byte register address is sent. The controller then drives one or more bytes to program the companion registers. When writing multiple data bytes, the internal register address will wrap around to 00h after 1Dh is reached. The rising edge of CS terminates a WRPC operation. See Figure 22. Figure 21. Processor Companion Read CS 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 SCK Opcode SI 0 0 0 1 0 0 1 1 A7 A6 A5 A4 A3 A2 A1 A0 MSB SO LSB HI-Z Data D7 D6 D5 D4 D3 D2 D1 D0 MSB Document Number: 001-86213 Rev. *C LSB Page 27 of 39 FM33256B Figure 22. Processor Companion Write (WREN not shown) CS 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 0 7 1 2 3 4 5 6 7 SCK Opcode 0 SI 0 0 1 Data 1 0 A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 0 0 MSB LSB MSB LSB HI-Z SO Memory Operation operations. F-RAM memories do not have page buffers because each byte is written to the F-RAM array immediately after it is clocked in (after the eighth clock). This allows any number of bytes to be written without page buffer delays. The SPI interface, which is capable of a high clock frequency, highlights the fast write capability of the F-RAM technology. Unlike serial flash and EEPROMs, the FM33256B can perform sequential writes at bus speed. No page register is needed and any number of sequential writes may be performed. Note If the power is lost in the middle of the write operation, only the last completed byte will be written. Read Operation Write Operation After the falling edge of CS, the bus master can issue a READ opcode. Following the READ command is a two-byte address containing the 15-bit address (A14-A0) of the first byte of the read operation. The upper bit of the address is ignored. After the opcode and address are issued, the device drives out the read data on the next eight clocks. The SI input is ignored during read data bytes. Subsequent bytes are data bytes, which are read out sequentially. Addresses are incremented internally as long as the bus master continues to issue clocks and CS is LOW. If the last address of 7FFFh is reached, the counter will roll over to 0000h. Data is read MSB first. The rising edge of CS terminates a read operation and tristates the SO pin. A read operation is shown in Figure 24. All writes to the memory begin with a WREN opcode with CS being asserted and deasserted. The next opcode is WRITE. The WRITE opcode is followed by a two-byte address containing the 15-bit address (A14-A0) of the first data byte to be written into the memory. The upper bit of the two-byte address is ignored. Subsequent bytes are data bytes, which are written sequentially. Addresses are incremented internally as long as the bus master continues to issue clocks and keeps CS LOW. If the last address of 7FFFh is reached, the counter will roll over to 0000h. Data is written MSB first. The rising edge of CS terminates a write operation. A write operation is shown in Figure 23. Note When a burst write reaches a protected block address, the automatic address increment stops and all the subsequent data bytes received for write will be ignored by the device. EEPROMs use page buffers to increase their write throughput. This compensates for the technology's inherently slow write Figure 23. Memory Write (WREN not shown) Operation CS 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 Opcode SI 0 0 0 0 0 ~ ~ ~ ~ 0 SCK 12 13 14 15 0 1 0 X A14 A13 A12 A11 A10 A9 A8 MSB SO Document Number: 001-86213 Rev. *C 2 3 4 5 6 7 Data 15-bit Address 0 1 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 LSB MSB LSB HI-Z Page 28 of 39 FM33256B Figure 24. Memory Read Operation CS 1 2 3 4 5 6 7 0 1 2 Opcode SI 0 0 0 0 0 3 4 5 6 7 ~ ~ ~ ~ 0 SCK 12 13 14 15 0 1 2 3 4 5 6 7 15-bit Address 0 1 1 X A14 A13 A12 A11 A10 A9 A8 MSB SO HI-Z A3 A2 A1 A0 LSB Data D7 D6 D5 D4 D3 D2 D1 D0 MSB Document Number: 001-86213 Rev. *C LSB Page 29 of 39 FM33256B Maximum Ratings Surface mount lead soldering temperature (3 seconds) ......................................... +260 °C Exceeding maximum ratings may shorten the useful life of the device. These user guidelines are not tested. Storage temperature ................................ –55 °C to +125 °C Maximum accumulated storage time At 125 °C ambient temperature ................................. 1000 h At 85 °C ambient temperature ................................ 10 Years DC output current (1 output at a time, 1s duration) .................................. 15 mA Electrostatic Discharge Voltage Human Body Model (JEDEC Std JESD22-A114-E) ........... 4.5 kV Charged Device Model (JEDEC Std JESD22-C101-C) ..... 1.25 kV Machine Model (JEDEC Std JESD22-A115-A) .........................200 Ambient temperature with power applied .................................. –55 °C to +125 °C Latch-up current .................................................. > ±100 mA Supply voltage on VDD relative to VSS .........–1.0 V to +5.0 V Operating Range Input voltage ........... –1.0 V to +5.0 V and VIN < VDD + 1.0 V Range Industrial Backup supply voltage..................................–1.0 V to +4.5 V Ambient Temperature (TA) –40 °C to +85 °C VDD 2.7 V to 3.6 V DC voltage applied to outputs in High-Z state .................................... –0.5 V to VDD + 0.5 V Transient voltage (< 20 ns) on any pin to ground potential ................. –2.0 V to VDD + 2.0 V Package power dissipation capability (TA = 25 °C) ................................................. 1.0 W DC Electrical Characteristics Over the Operating Range Parameter VDD [3] Description Test Conditions Min Typ [2] Max Unit 2.7 – 3.6 V Power supply VDD supply current (VBC = ‘0’) fSCK = 1 MHz SCK toggling between VDD – 0.3 fSCK = 16 MHz V and VSS, other inputs VSS or VDD – 0.3 V. SO = Open – – 1.1 mA – – 16.0 mA ISB VDD standby current Trickle Charger Off (VBC = ‘0’) CS = VDD. All other inputs VSS or VDD. – – 150 μA VBAK[4] RTC backup voltage TA = +25 °C to +85 °C 1.55 – 3.75 V TA = –40 °C to +25 °C 1.90 – 3.75 V VDD < VSW, oscil- TA = +25 °C, VBAK = 3.0 V lator running, CNT TA = +85 °C, VBAK = 3.0 V at VBAK. TA = +25 °C, VBAK = 2.0 V – – 1.4 μA – – 2.0 μA – – 1.15 μA TA = +85 °C, VBAK = 2.0 V – – 1.65 μA Fast Charge Off (FC = ‘0’) 50 – 200 μA Fast Charge On (FC = ‘1’) 200 – 2500 μA IDD IBAK IBAKTC RTC backup current [5] Trickle Charge Current with VBAK = 0 V Notes 2. Typical values are at 25 °C, VDD = VDD(typ). Not 100% tested. 3. Full complete operation. Supervisory circuits, RTC, etc operate to lower voltages as specified. 4. The VBAK trickle charger automatically regulates the maximum voltage on this pin for capacitor backup applications. 5. VBAK will source current when trickle charge is enabled (VBC bit = ‘1’), VDD > VBAK, and VBAK < VBAK(max). Document Number: 001-86213 Rev. *C Page 30 of 39 FM33256B DC Electrical Characteristics (continued) Over the Operating Range Parameter Description Test Conditions Min Typ [2] Max Unit IQTC[6] VDD Quiescent Current (VBC = ‘1’) – – 70 μA IQWD[7] VDD Quiescent Current (WDE = ‘1’) – – 30 μA VTP0 VDD Trip Point Voltage, VTP(1:0) = 00b RST is asserted active when VDD < VTP. 2.53 2.6 2.72 V VTP1 VDD Trip Point Voltage, VTP(1:0) = 01b RST is asserted active when VDD < VTP. 2.68 2.75 2.87 V VTP2 VDD Trip Point Voltage, VTP(1:0) = 10b RST is asserted active when VDD < VTP. 2.78 2.9 2.99 V VTP3 VDD Trip Point Voltage, VTP(1:0) = 11b RST is asserted active when VDD < VTP. 2.91 3.0 3.15 V VRST[8] VDD for valid RST IOL = 80 μA at VOL VBAK > VBAK min 0 – – V 1.6 – – V 2.0 – 2.7 V VBAK < VBAK min VSW Battery Switchover voltage CS = VDD. All other inputs VSS or VDD. ILI Input leakage current VSS < VIN < VDD. Does not apply to PFI, RST, X1, or X2 – – ±1 μA ILO Output leakage current VSS < VOUT < VDD. Does not apply to RST, X1, or X2 – – ±1 μA VIL[9] Input LOW voltage All inputs except as listed below – 0.3 – 0.3 × VDD V CNT battery-backed (VDD < VSW) – 0.3 – 0.5 V CNT (VDD > VSW) – 0.3 – 0.8 V All inputs except as listed below 0.7 × VDD – VDD + 0.3 V CNT battery-backed (VDD < VSW) VBAK – 0.5 – VBAK + 0.3 V 0.7 × VDD – VDD + 0.3 V – – VDD + 0.3 V VIH Input HIGH voltage CNT (VDD > VSW) PFI Notes 6. This is the VDD supply current contributed by enabling the trickle charger circuit, and does not account for IBAKTC. 7. This is the VDD supply current contributed by enabling the watchdog circuit, WDE = ‘1’ and WDET set to a non-zero value. 8. The minimum VDD to guarantee the level of RST remains a valid VOL level. 9. Includes RST input detection of external reset condition to trigger driving of RST signal by FM33256B. Document Number: 001-86213 Rev. *C Page 31 of 39 FM33256B DC Electrical Characteristics (continued) Over the Operating Range Parameter Description Test Conditions Min Typ [2] Max Unit VDD – 0.8 – – V – – 0.4 V VOH Output HIGH voltage (SO, PFO) IOH = –2 mA VOL Output LOW voltage IOL = 3 mA RRST Pull-up resistance for RST inactive 50 – 400 kΩ VPFI Power Fail Input Reference Voltage 1.475 1.50 1.525 V VHYS Power Fail Input (PFI) Hysteresis (Rising) – – 100 mV Data Retention and Endurance Parameter TDR NVC Description Data retention Endurance Test condition Min Max Unit TA = 85 °C 10 – Years TA = 75 °C 38 – TA = 65 °C 151 – Over operating temperature 1014 – Cycles Capacitance Parameter [10] Description Test Conditions TA = 25 °C, f = 1 MHz, VDD = VDD(typ) Typ Max Unit CIO Input/Output pin capacitance – 8 pF CXTL X1, X2 Crystal pin Capacitance 12 – pF CCNT[11] Max. Allowable Capacitance on CNT (polled mode) – 100 pF Thermal Resistance Description Parameter ΘJA ΘJC Thermal resistance (junction to ambient) Thermal resistance (junction to case) Test Conditions 14-pin SOIC Unit Test conditions follow standard test methods and procedures for measuring thermal impedance, per EIA / JESD51. 81 °C/W 31 °C/W AC Test Conditions Input pulse levels .................................10% and 90% of VDD Input rise and fall times ...................................................5 ns Input and output timing reference levels ................0.5 × VDD Output load capacitance .............................................. 30 pF Notes 10. This parameter is characterized and not 100% tested. 11. The crystal attached to the X1/X2 pins must be rated as 6 pF/12.5 pF. Document Number: 001-86213 Rev. *C Page 32 of 39 FM33256B Supervisor Timing Over the Operating Range Description Parameter Min Max Units tRPU[12] RST active (LOW) after VDD > VTP 30 100 ms tRNR[13] RST response time to VDD < VTP (noise filter) 7 25 μs tVR[13, 14] VDD power-up ramp rate 50 100,000 μs/V tVF[13, 14] VDD power-down ramp rate 100 - μs/V tWDST[15] Watchdog StartTime 0.3 × tDOG1 tDOG1 ms tWDET[15] Watchdog EndTime tDOG2 3.3 × tDOG2 ms fCNT Frequency of event counter 0 1 kHz Figure 25. RST Timing t VF V DD V TP V RST t VR tRNR tRPU RST Notes 12. The RST pin will drive LOW for this length of time after the internal reset circuit is activated due to a watchdog, low voltage, or manual reset event. 13. This parameter is characterized and not 100% tested. 14. Slope measured at any point on VDD waveform. 15. tDOG1 is the programmed StartTime and tDOG2 is the programmed EndTime in registers 0Bh and 0Ch, VDD > VTP, and tRPU satisfied. The StartTime has a resolution of 25 ms. The EndTime has a resolution of 60 ms. Document Number: 001-86213 Rev. *C Page 33 of 39 FM33256B AC Switching Characteristics Over the Operating Range Parameters [16] Cypress Parameter Description Alt. Parameter Min Max Unit fSCK – SCK clock frequency 0 16 MHz tCH – Clock HIGH time 28 – ns tCL – Clock LOW time 28 – ns tCSU tCSS Chip select setup 10 – ns tCSH tCSH Chip select hold 10 – ns tHZCS Output disable time – 20 ns tODV tCO Output data valid time – 24 ns tOH – Output hold time 0 – ns tD tOD [17, 18] – Deselect time 90 – ns [19] – Data in rise time – 50 ns tF[19] – Data in fall time – 50 ns tSU tSD Data setup time 6 – ns tH tHD Data hold time 6 – ns tR Figure 26. Synchronous Data Timing (Mode 0) tD CS tCSU tCH tCL tCSH SCK tSU SI tH VALID IN VALID IN VALID IN tODV SO HI-Z tOH tOD HI-Z Notes 16. Test conditions assume a signal transition time of 5 ns or less, timing reference levels of 0.5 × VDD, input pulse levels of 10% to 90% of VDD, and output loading of the specified IOL/IOH and 30 pF load capacitance shown in AC Test Conditions on page 32. 17. tOD is specified with a load capacitance of 5 pF. Transition is measured when the outputs enter a high impedance state 18. This parameter is characterized and not 100% tested. 19. Rise and fall times measured between 10% and 90% of waveform. Document Number: 001-86213 Rev. *C Page 34 of 39 FM33256B Ordering Information Package Diagram Ordering Code Package Type FM33256B-G 51-85067 14-pin SOIC FM33256B-GTR 51-85067 14-pin SOIC Operating Range Industrial All these parts are Pb-free. Contact your local Cypress sales representative for availability of these parts. Ordering Code Definitions FM 33 256 B - G TR Option: blank = Standard; TR = Tape and Reel Package Type: G = 14-pin SOIC; Die Revision: B Density: 256 = 256-Kbit SPI Processor Companion Cypress Document Number: 001-86213 Rev. *C Page 35 of 39 FM33256B Package Diagram Figure 27. 14-pin SOIC (150 Mils) Package Outline, 51-85067 51-85067 *E Document Number: 001-86213 Rev. *C Page 36 of 39 FM33256B Acronyms Acronym Document Conventions Description Units of Measure CPHA Clock Phase CPOL Clock Polarity °C degree Celsius EEPROM Electrically Erasable Programmable Read-Only Memory Hz hertz kHz kilohertz EIA Electronic Industries Alliance kΩ kiloohm F-RAM Ferroelectric Random Access Memory Mbit megabit I/O Input/Output MHz megahertz JEDEC Joint Electron Devices Engineering Council μA microampere JESD JEDEC Standards μF microfarad LSB Least Significant Bit μs microsecond mA milliampere ms millisecond ns nanosecond Ω ohm % percent pF picofarad V volt W watt MSB Most Significant Bit NMI Non Maskable interrupt RoHS Restriction of Hazardous Substances SPI Serial Peripheral Interface SOIC Small Outline Integrated Circuit Document Number: 001-86213 Rev. *C Symbol Unit of Measure Page 37 of 39 FM33256B Document History Page Document Title: FM33256B, 256-Kbit (32 K × 8) Integrated Processor Companion with F-RAM Document Number: 001-86213 Rev. ECN No. Orig. of Change Submission Date ** 3912947 GVCH 02/25/2013 New spec *A 4333078 GVCH 05/05/2014 Converted to Cypress standard format Crystal Type: Added use of 6 pF crystal Updated Maximum Ratings table - Removed Moisture Sensitivity Level (MSL) - Added junction temperature and latch up current Updated Data Retention and Endurance table Changed CXTL parameter typ value from 25 pF to 12 pF. Added Thermal Resistance table Removed Package Marking Scheme (top mark) Removed Ramtron revision history *B 4563141 GVCH 11/06/2014 Added related documentation hyperlink in page 1. *C 4872944 ZSK / PSR 08/05/2015 Updated Maximum Ratings: Removed “Maximum junction temperature”. Added “Maximum accumulated storage time”. Added “Ambient temperature with power applied”. Updated Package Diagram: spec 51-85067 – Changed revision from *D to *E. Updated to new template. Document Number: 001-86213 Rev. *C Description of Change Page 38 of 39 FM33256B Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. PSoC® Solutions Products Automotive Clocks & Buffers Interface Lighting & Power Control Memory PSoC Touch Sensing USB Controllers Wireless/RF cypress.com/go/automotive cypress.com/go/clocks cypress.com/go/interface cypress.com/go/powerpsoc psoc.cypress.com/solutions PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP Cypress Developer Community Community | Forums | Blogs | Video | Training cypress.com/go/memory cypress.com/go/psoc cypress.com/go/touch Technical Support cypress.com/go/support cypress.com/go/USB cypress.com/go/wireless © Cypress Semiconductor Corporation, 2013-2015. The information contained herein is subject to change without notice. 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Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document Number: 001-86213 Rev. *C Revised August 5, 2015 All products and company names mentioned in this document may be the trademarks of their respective holders. Page 39 of 39