AN204942 F²MC-8L Family EMC Design Guide.pdf

AN204942
F²MC - 8L Family, EMC Design Guide
In the following description, the EMC design guide of 8-bit Cypress microcontroller will be discussed. It describes
how external power supply should be connected to the Vcc and Vss pins and offers some suggestions. An overview
of internal supply of MCU is made as well to have a better understanding of the design. The EMI measurements in
the following described tests are just example measurements. The measured emissions are no data, which are
specified in the DS of the microcontroller series.
Contents
1
2
3
4
5
6
7
1
Introduction ..................................................................1
Rules to create a good Layout .....................................2
Crystal Oscillator Circuit ..............................................3
Power supply routing ...................................................4
Noise reduction for general IO pins .............................8
Function of certain MCU pins ......................................9
2
EMI Measurement for F MC-8L family....................... 10
7.1 Measurement setup .......................................... 10
7.2 Measurement procedure ................................... 10
7.3 Measurements .................................................. 10
7.4 Blank check ...................................................... 11
7.5 Noise measurements on VCC .......................... 12
Document History............................................................ 14
Introduction
In the following description, the EMC design guide of 8-bit Cypress microcontroller will be discussed. It describes how
external power supply should be connected to the Vcc and Vss pins and offers some suggestions. An overview of
internal supply of MCU is made as well to have a better understanding of the design. The EMI measurements in the
following described tests are just example measurements. The measured emissions are no data, which are specified
in the DS of the microcontroller series.
2
During the last designs the EMI of the Cypress F MC-8L microcontroller series could be reduced step by step. The
PLL multiplier circuit allows the usage of low crystal frequency to reduce high-frequency noise from the oscillator
circuit.
The clock tree is mostly the cause of the noise. Therefore the driver capability of clock buffers is optimized and for
one big buffer are used several small clock buffers.
The integration of On-chip bypass capacitors reduces the noise ripple on the internal power supply net so that the
broadband noise on the IO pins is improved.
The following description is based on the MB89530 series, but the same situation exists for all current devices of the
2
F MC-8L family, with or without an external bus interface.
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2
Rules to create a good Layout
1.
Use max. trace-width and min. length to connect VSS and VDD µC-pins to decoupling capacitors (DeCap)
2.
Don’t use stub line to connect the DeCap to µC-pins, let flows the noise current direct through pads of DeCap
3.
Use close ground plane direct below MCU package as shield
4.
Use different ground systems for analogue, digital, power-driver and connector ground
5.
Avoid loop current in the ground system, check for ground loops.
6.
Use a star point ground below MCU for analogue and digital ground, use a second star point ground below 5V
regulator for MCU, power-driver and connector ground
7.
Don't create signal loop on the PCB, minimize trace length
8.
Partitioned system into analogue, digital and power-driver section
9.
Place series resistor or RC-block for the IO-circuit nearby MCU-pin to reduce the noise on the signal line.
10.
Use a capacitor for each connector pin to reduce the noise of external lines, place this capacitor close to
connector pin
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Crystal Oscillator Circuit
Figure 1 shows the oscillator for the 8-bit family. For best performance, the PCB layout of this circuit should cover
only a very small area. For the layout is recommended a PCB with two or more layers. Make sure to provide bypass
capacitors via shortest distance from X0, X1 pins, crystal oscillator, and ground lines. The lines of the oscillation
circuit should not cross lines of other circuits.
Figure 1. Principle of the Oscillator circuit
X0
X1
Microcontroller
Oscillator
It is necessary to avoid coupling noise into the power supply (pin 81/84) of the clock circuit.
The crystal oscillator has to be connected with short lines to X0/X1 and Vss. Note that pin X1 is the output of inverter.
Particularly this track should have a short length.
Figure 2. Layout example for oscillator circuit
Decoupling capacitor CB on
the back side of the PCB
Decoupling capacitor CB on
the back side of the PCB
CB
Vss
Via to system Vcc
CB
Vss
Vcc
X0
Connection to
ground layer
Via to ground island
and system ground
Vcc
X0
X1
C2
C1
X1
Single ground island
on the back side
Connection to
ground layer
Via to ground island
on the back side
SMD
Quartz Crystal
Quartz
Crystal
C1
Quartz Crystal package
has to be grounded
C2
Connection to
ground layer
a) Layout example for a leaded quartz crystal
worse layout design, because C1 and C2
are wrong connected to VSS
b) Layout example for a SMD quartz crystal
better layout design, because C1 and C2
are connected to Vss and than after with
the system ground
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Power supply routing
One topic our noise reduction technology is the bypass capacitors. By placing of modules inside the chip, it is
possible to connect a bypass capacitor with low impedance where power supply lines are short, effectively reducing
the noise to very low flow levels. These bypass capacitors are place into power supply of IO and logic.
Figure 3. Structure of power supply for MCU core and IO-Port
I/O-PORT
ROM
Vcc
Vss
CPU
RAM
SCI / TIMER / etc.
A/D+D/A
AVcc
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AVss
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F²MC - 8L Family, EMC Design Guide
Figure 4.The exactly use of the DeCap (decoupling capacitor)
VCC
VCC
GND
GND
GND
a) VCC and GND lead to supply
noise current flows not via
DeCap, DeCap has not effect
b) GND lead noise to system GND
noise current flows partly via
DeCap, DeCap has hardly effect
µC
VCC
µC
DeCap
DeCap
DeCap
VCC
µC
µC
VCC
µC
VCC
µC
DeCap
DeCap
DeCap
c) GND lead noise to System GND
noise current flows partly via
DeCap, DeCap has hardly effect
GND
GND
GND
GND
d) VCC and GND lead to supply
noise current flows not via
DeCap, DeCap has not effect
e) GND is not short connected to
DeCap. between GND and
DeCap flows a loop current
DeCap has hardly effect
f) DeCap correct connected to µC
and power supply.
high speed current will be
supported from DeCap
The high-speed current (di/dt) will be supported from the decoupling capacitor only.
Therefore use traces with max. width and min. length between
After DeCap use thin traces to route the trace to the power supply system.
Vss/Vcc
pin
and
DeCap.
Figure 5. The noise current flows return over the ground line
use EMC filter for
µC-supply
short length
max. width
µC
high Z
low Z
VCC
C
GND
The exactly use of decoupling capacitors for the Vcc and Vss pins is the basis to reduce the noise, but also the return
way between load and MCU ground is not neglect.
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F²MC - 8L Family, EMC Design Guide
Figure 6. The noise current flows return over the ground line
min. length
max. width
high-Z
choking coil
min. length
max. width
µC
VCC
clock
unit
&
core
C
VSS
IO-driver
I supply
HVCC
C
HVSS
I fast
I slow
low-Z
I return
I crossbar
dt/di
R
C
Load
I load
To ensure an efficient decoupling of the power supply, two capacitors should be placed close on each Vcc pin. The
values of both capacitors should have a relationship of about 1:100. Typical values are e.g. 100nF (XR7) and 1nF
(COG). The accurate value is depended on the application board, e.g. impedance of PCB or the length of supply
lines. However, all of the DeCaps on the PCB should have the same value.
Figure 7. The use of several values of DeCaps lead to undefined resonance frequencies, that’s why all DeCaps
should have the same value.
Lboard
Lboard
VDD
IC2
DeCap Cn
IC1
DeCap C2
Cboard
DeCap C1
A
ICn
f
GND
For 2-layer boards should be used a closed ground plane (located directly below the MCU). The Vcc supplies should
be taken from the bottom layer.
For 4-layer boards should be used the inside layers for GND and Vcc supplies. In this case, both layers form
additional capacitor (broadband behaviour) for the power supply.
Figure 8 shows a layout example for the connection of powers supply on the MCU.
This method of Vcc connection reduces the loop of the Vcc lines around the MCU, thus reducing noise emission. A
variation of this circuit may be needed, if separate filtered supply voltages are routed to the A/D supplies (pin
AVCC/AVSS).
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F²MC - 8L Family, EMC Design Guide
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Figure 8. F MC-8L family with main- and subclock, recommended layout for multiple layers PCB
Vcc
star point and noise
filter for
Vcc and ground
on the back side
Connection to
power supply
Decoupling capacitor CB on
the back side of the PCB
CB
LB
CB
ground plan
below package
on the top side
Via to ground island
and system ground
Decoupling capacitor CB on
the back side of the PCB
CB
AVcc
AVR
AVss
X0A
Via to ground island
and system ground
X1A
C1
32kHz
C2
Rs
C1
Single ground island
on the back side
Via to ground island
on the back side
C2
Vss
X1
X0
Quartz
Crystal
Note:
All decoupling capacitors on the Vcc pins should have the same value.
These capacitors should be placed close to the Vcc pin. The Vcc/Vss current should flows through the pad of the
capacitor.
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F²MC - 8L Family, EMC Design Guide
5
Noise reduction for general IO pins
To reduce noise, make sure to connect the Vss or Vcc with smoothed power supply, because the noise on the power
supply will also distributed via IO-pin, which is configured as static low or high output. Figure 9 shows an example to
reduce the noise on output lines.
Figure 9. Place the series resistor close to IO pin because so will be reduced the noise of output
µC
IO-Port
Noise
length of trace
µC
IO-Port
length of trace
Note: To reduce noise, make sure to connect unused input pins to Vss or Vcc (Use pull-down or pull-up resistor,
please check the DS of the microcontroller series).
Also, especially if CMOS Logic is used, floating gates could generate problems regarding high input currents and
latch up.
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Function of certain MCU pins
Pin name
Function
VDD
Main supply for IO buffer and MCU core
VSS
Main supply for IO buffer and MCU core close to crystal oscillator
AVCC
Power supply for the A/D converter
AVR
Reference voltage input for the A/D converter
AVSS
Power supply for the A/D converter
X0
Oscillator input, if not used so shall be connected with pull-up or pull-down
X0A
resistor (see please DS)
X1
Oscillator output, the crystal and bypass capacitor must be connected via
X1A
shortest distance with X1 pin, if not used so shall be open
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7.1
EMI Measurement for F2MC-8L family
Measurement setup
Figure 10. Set-up for noise measurement on power supply
7.2
7.3
Measurement procedure

RF- voltage, measured on VCC power supply by BI mode RUN

RF- voltage, measured on VCC power supply by BI mode RESET
Measurements
Sample: MB89538A, MB89538AL, MB89535A
Measurement condition: Ta = 25 deg.C
Power supply: Vcc = 5.0V / 3.0V
Crystal: 8MHz (FAR)
Frequency range: 0MHz to 120MHz, BW: 120kHz
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F²MC - 8L Family, EMC Design Guide
7.4
Blank check
Figure 11. Noise measured on VCC power supply, blank check
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F²MC - 8L Family, EMC Design Guide
7.5
Noise measurements on VCC
Figure 12. MB89538A - Noise measured on VCC power supply, BI-mode RUN
Figure 13: . MB89538AL - Noise measured on VCC power supply, BI-mode RUN
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F²MC - 8L Family, EMC Design Guide
Figure 14. MB89535A - Noise measured on VCC power supply, BI-mode RUN
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F²MC - 8L Family, EMC Design Guide
Document History
Document Title: AN204942 – F²MC - 8L Family, EMC Design Guide
Document Number: 002-04942
Revision
**
*A
ECN
-
5278888
Orig. of
Change
Submission
Date
Description of Change
NFL.
07/04/2002
V1.0, Initial draft
NFL
07/18/2002
V1.1, Description DeCap added
WOFR
05/20/2016
Migrated Spansion Application Note “MCU-AN-389024-E-V11” to Cypress
format.
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F²MC - 8L Family, EMC Design Guide
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