Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MCF5272VM66R2 MABGA-FW 196 15SQ0.8P1.0 SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2016-01-14 5220K00119D018A1.40 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles Yes Yes Yes e1 MCF5272VM66R2 MABGA-FW 196 15SQ0.8P1.0 ALL 0.482550 g EACH 3 260 C 40 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 1 - Item(s) do not contain RoHS restricted substances per the definition above Accepted Daniel Binyon 2012/51/EU 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight SubstanceClass Substance CAS Die Encapsulant 0.2687 SubPart% ARTICLEPPM ARTICLE% Die Encapsulant Metals Aluminum, metal 7429-90-5 0.00830176 g Die Encapsulant Arsenic/Arsenic Compounds Arsenic 7440-38-2 0.00000027 g 30896 3.0896 17203 1.7203 1 0.0001 0 Die Encapsulant Cadmium/Cadmium Compounds Cadmium 7440-43-9 0.00000027 0 g 1 0.0001 0 Die Encapsulant Plastics/polymers Proprietary Material-Other Epoxy resins - 0 0.00830176 g 30896 3.0896 17203 Die Encapsulant Solvents, additives, and other materials Carbon Black 1.7203 1333-86-4 0.00083028 g 3090 0.309 1720 Die Encapsulant Lead/Lead Compounds 0.172 Lead 7439-92-1 0.00000027 g 1 0.0001 0 Die Encapsulant 0 Solvents, additives, and other materials Other organic phosphorous compounds - 0.00083028 g 3090 0.309 1720 0.172 Die Encapsulant Plastics/polymers Proprietary Material-Other phenolic resins - 0.01521971 g 56642 5.6642 31540 3.154 Die Encapsulant Glass Silica, vitreous 60676-86-0 0.2352154 g 875383 87.5383 487462 48.7462 Non-Conductive Epoxy/Adhesive Exemption SubstanceWeight UoM SubPart PPM g 0.009 g Non-Conductive Epoxy/Adhesive Solvents, additives, and other materials 4,4'-Diamino-3,3'-diethyl-diphenylmethane 19900-65-3 0.00193549 g 215054 21.5054 4010 0.401 Non-Conductive Epoxy/Adhesive Plastics/polymers Phenolic Polymer Resin, Epikote 155 9003-36-5 0.0048387 g 537634 53.7634 10027 1.0027 Non-Conductive Epoxy/Adhesive Solvents, additives, and other materials [3-(2,3-epoxypropoxy)propyl]trimethoxysilane 2530-83-8 0.00029032 g 32258 3.2258 601 0.0601 Non-Conductive Epoxy/Adhesive Glass Silica, vitreous 60676-86-0 0.00193549 g 215054 21.5054 4010 0.401 Organic Substrate, Halogen-fre 0.15785 g Organic Substrate, Halogen-fre Metals Barium sulfate 7727-43-7 0.00876825 g 55548 5.5548 18170 1.817 Organic Substrate, Halogen-fre Metals Copper, metal 7440-50-8 0.0555741 g 352069 35.2069 115167 11.5167 Organic Substrate, Halogen-fre Plastics/polymers Epikote 862 28064-14-4 0.01186274 g 75152 7.5152 24583 2.4583 Organic Substrate, Halogen-fre Metals Gold, metal 7440-57-5 0.00223831 g 14180 1.418 4638 0.4638 Organic Substrate, Halogen-fre Nickel (external applications only) Nickel 7440-02-0 0.01697977 g 107569 10.7569 35187 3.5187 Organic Substrate, Halogen-fre Solvents, additives, and other materials Diphenyl tolyl phosphate 26444-49-5 0.01983559 g 125661 12.5661 41105 4.1105 Organic Substrate, Halogen-fre Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.00031317 g 1984 0.1984 648 0.0648 Organic Substrate, Halogen-fre Solvents, additives, and other materials Other Aromatic carbonyl compounds - 0.00121339 g 7687 0.7687 2514 0.2514 Organic Substrate, Halogen-fre Glass Silica, crystalline - tridymite 15468-32-3 0.04106468 g 260150 26.015 85099 8.5099 1000000 100 3522 0.3522 Bonding Wire 0.0017 Bonding Wire Silicon Semiconductor Die g Metals Gold, metal 7440-57-5 0.0017 0.0087 g g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.000174 g 20000 2 360 0.036 Silicon Semiconductor Die Glass Silicon, doped - 0.008526 g 980000 98 17668 1.7668 Solder Balls - Lead Free 0.0366 g Solder Balls - Lead Free Antimony/Antimony Compounds Antimony (metallic) 7440-36-0 0.00000026 g 7 0.0007 0 0 Solder Balls - Lead Free Arsenic/Arsenic Compounds Arsenic 7440-38-2 0.00000026 g 7 0.0007 0 0 Solder Balls - Lead Free Bismuth/Bismuth Compounds Bismuth 7440-69-9 0.00000018 g 5 0.0005 0 0 Solder Balls - Lead Free Metals Copper, metal 7440-50-8 0.0002562 g 7000 0.7 530 0.053 Solder Balls - Lead Free Metals Iron, metal 7439-89-6 0.00000066 g 18 0.0018 1 0.0001 Solder Balls - Lead Free Lead/Lead Compounds Lead 7439-92-1 0.00000205 g 56 0.0056 4 0.0004 Solder Balls - Lead Free Metals Silver, metal 7440-22-4 0.00137616 g 37600 3.76 2851 0.2851 Solder Balls - Lead Free Metals Tin, metal 7440-31-5 0.03496423 g 955307 95.5307 72457 7.2457 LINKS MCD LINK NXP website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement NXP ENVIRONMENTAL INFORMATION Environmental Compliance website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.nxp.com http://www.nxp.com/files/corporate/doc/support_info/NXP-ROHS-DECLARATION.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/china-rohs:ENV_CHINA_ROHS_STRATEGY http://www.nxp.com/files/corporate/doc/support_info/NXP-REACH-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-ELV-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-STATEMENT-CONFLICT-MINERALS.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization:ABUENVPRFPRDX http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/eco-product-faqs:ENVIRON_FAQ http://www.nxp.com/support/sales-and-support:SUPPORTHOME http://www.NXP.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MCF5272VM66R2_IPC1752_v11.xml http://www.freescale.com/mcds/MCF5272VM66R2_IPC1752A.xml