Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MCF54452VR266 360 23*23*2.23 P1 SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2010-10-22 5067K50008S207A1.8 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles Yes Yes Yes e2 MCF54452VR266 360 23*23*2.23 P1 ALL 1.733300 g EACH 3 260 C 40 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 1 - Item(s) do not contain RoHS restricted substances per the definition above Accepted Daniel Binyon Exemptions in this part List of Freescale Accepted Exemptions 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION SubPart Weight Bonding Wire 0.0082 Bonding Wire Epoxy Die Attach SubstanceClass Substance CAS Metals Gold, metal and alloys 7440-57-5 Exemption SubstanceWeight UoM SubPart PPM SubPart% REACHPPM REACH% 1000000 100 4730 0.473 g 0.0082 0.0031 g g Epoxy Die Attach Plastics/polymers Other Epoxy resins - 0.000042 g 13670 1.367 24 0.0024 Epoxy Die Attach Plastics/polymers Proprietary Material-Other Epoxy resins - 0.000114 g 36803 3.6803 65 0.0065 Epoxy Die Attach Metals Silver, metal and alloys 7440-22-4 0.002853 g 920084 92.0084 1645 0.1645 Epoxy Die Attach Solvents, additives, and other materials Other miscellaneous substances (less than 5%) - 0.000034 g 11041 1.1041 19 0.0019 Epoxy Die Attach Solvents, additives, and other materials Proprietary Material-Other miscellaneous substances - 0.000057 g 18402 1.8402 32 0.0032 Die Encapsulant, Halogen-free 0.6191 g Die Encapsulant, Halogen-free Plastics/polymers Proprietary Material-Other Epoxy resins - 0.030955 g 50000 5 17858 1.7858 Die Encapsulant, Halogen-free Plastics/polymers Proprietary Material-Other phenolic resins - 0.030955 g 50000 5 17858 1.7858 Die Encapsulant, Halogen-free Glass Silica, crystalline - quartz (SiO2) 14808-60-7 0.012382 g 20000 2 7143 0.7143 Die Encapsulant, Halogen-free Glass Silica, vitreous 60676-86-0 0.544808 g 880000 88 314325 31.4325 Organic Substrate, Halogen-fre 0.7886 g Organic Substrate, Halogen-fre Metals Barium sulfate 7727-43-7 0.078173 g 99129 9.9129 45100 4.51 Organic Substrate, Halogen-fre Metals Copper, metal and alloys 7440-50-8 0.404609 g 513072 51.3072 233435 23.3435 Organic Substrate, Halogen-fre Plastics/polymers Phenolic Polymer Resin, Epikote 155 9003-36-5 0.149473 g 189542 18.9542 86237 8.6237 Organic Substrate, Halogen-fre Metals Gold, metal and alloys 7440-57-5 0.005154 g 6536 0.6536 2973 0.2973 Organic Substrate, Halogen-fre Metals Nickel, metal and alloys 7440-02-0 0.021906 g 27778 2.7778 12638 1.2638 Organic Substrate, Halogen-fre Glass Fibrous-glass-wool 65997-17-3 0.129285 g 163943 16.3943 74588 7.4588 Solder Balls - Pb Free, Sn/Ag 0.2992 g Solder Balls - Pb Free, Sn/Ag Metals Lead, metallic lead and lead alloys 7439-92-1 0.000037 g 125 0.0125 21 0.0021 Solder Balls - Pb Free, Sn/Ag Metals Silver, metal and alloys 7440-22-4 0.010472 g 35000 3.5 6041 0.6041 Solder Balls - Pb Free, Sn/Ag Metals Tin, metal and alloys 7440-31-5 0.288691 g 964875 96.4875 166557 16.6557 Silicon Semiconductor Die 0.0151 g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%) - 0.000302 g 20000 2 174 0.0174 Silicon Semiconductor Die Glass Silicon, doped - 0.014798 g 980000 98 8537 0.8537 LINKS MCD LINK Freescale website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement FREESCALE ENVIRONMENTAL INFORMATION EPP website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v0.9 Form Blank IPC1752 v1.1 Form http://www.freescale.com http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ROHS_Freescale_Response.pdf http://www.freescale.com/chinarohs http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_REACH_Freescale_Response.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ELV_Freescale_Reponse.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_CONFLICT_METAL_Freescale_Response.pdf http://www.freescale.com/epp http://www.freescale.com/webapp/sps/site/overview.jsp?code=ENVIRON_FAQ https://www.freescale.com/webapp/servicerequest.create_SR.framework?defaultCategory=Hardware Product Support&defaultTopic=Environmentally Preferred Prod http://www.freescale.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v0.9_MCD_Template.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MCF54452VR266_IPC1752_v09.xml http://www.freescale.com/mcds/MCF54452VR266_IPC1752_v11.xml http://www.freescale.com/mcds/MCF54452VR266_IPC1752A.xml