Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MKE04Z8VTG4R TSSOP 16 4.4*5*1.0P0.65 SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2016-05-20 6117A1.0 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles Yes Yes Yes e3 MKE04Z8VTG4R TSSOP 16 4.4*5*1.0P0.65 ALL 0.062200 g EACH 3 260 C 40 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 1 - Item(s) do not contain RoHS restricted substances per the definition above Accepted Daniel Binyon 2012/51/EU 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight SubstanceClass Substance CAS Lead Frame Plating 0.0022 Lead Frame Plating Lead/Lead Compounds Lead 7439-92-1 0.00000044 g Lead Frame Plating Metals Tin, metal 7440-31-5 0.00219956 g Epoxy Die Attach Exemption SubstanceWeight UoM SubPart PPM SubPart% ARTICLEPPM ARTICLE% 200 0.02 7 0.0007 999800 99.98 35362 3.5362 g 0.0009 g Epoxy Die Attach Solvents, additives, and other materials Proprietary Material-Other acrylates - 0.00011241 g 124900 12.49 1807 0.1807 Epoxy Die Attach Plastics/polymers Proprietary Material-Other Epoxy resins - 0.00002248 g 24980 2.498 361 0.0361 Epoxy Die Attach Solvents, additives, and other materials Other organic Silicon Compounds - 0.00001079 g 11990 1.199 173 0.0173 Epoxy Die Attach Metals Silver, metal 7440-22-4 0.00070216 g 780176 78.0176 11288 1.1288 Epoxy Die Attach Plastics/polymers Proprietary Material-acrylonitrile/butadiene copolymer, carboxyl terminated - 0.00005216 g 57954 5.7954 838 0.0838 Bonding Wire, Copper Metals Copper, metal 7440-50-8 0.000388 g 970000 97 6237 0.6237 Bonding Wire, Copper Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.000012 g 30000 3 192 0.0192 Bonding Wire, Copper Copper Lead Frame 0.0004 g 0.0279 g Copper Lead Frame Metals Copper, metal 7440-50-8 0.02689434 g 963955 96.3955 432398 43.2398 Copper Lead Frame Solvents, additives, and other materials Phosphorus, elemental (not containing red allotrope) 7723-14-0 0.00002302 g 825 0.0825 370 0.037 Copper Lead Frame Metals Iron, metal 7439-89-6 0.00065565 g 23500 2.35 10540 1.054 Copper Lead Frame Lead/Lead Compounds Lead 7439-92-1 0.00000474 g 170 0.017 76 0.0076 Copper Lead Frame Metals Silver, metal 7440-22-4 0.000279 g 10000 1 4485 0.4485 Copper Lead Frame Metals Tin, metal 7440-31-5 0.00000837 g 300 0.03 134 0.0134 Copper Lead Frame Metals Zinc, metal 7440-66-6 0.00003488 g 1250 0.125 560 0.056 Silicon Semiconductor Die 0.0032 g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.000064 g 20000 2 1028 0.1028 Silicon Semiconductor Die Glass Silicon, doped - 0.003136 g 980000 98 50418 5.0418 Die Encapsulant 0.0276 g Die Encapsulant Metals Aluminum, metal 7429-90-5 0.00008294 g 3005 0.3005 1333 0.1333 Die Encapsulant Plastics/polymers Epoxy resin, EPON Resin 8091 25928-94-3 0.00024879 g 9014 0.9014 3999 0.3999 Die Encapsulant Solvents, additives, and other materials Carbon Black 1333-86-4 0.00013822 g 5008 0.5008 2222 0.2222 Die Encapsulant Metals Magnesium, metal 7439-95-4 0.00022116 g 8013 0.8013 3555 0.3555 Die Encapsulant Solvents, additives, and other materials Silicone modified epoxy resin 218163-11-2 0.00140986 g 51082 5.1082 22666 2.2666 Die Encapsulant Plastics/polymers Phenolic Resin 125133-38-2 0.00121636 g 44071 4.4071 19555 1.9555 Die Encapsulant Glass Silica, vitreous 60676-86-0 0.02428267 g 879807 87.9807 390396 39.0396 LINKS MCD LINK NXP website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement NXP ENVIRONMENTAL INFORMATION Environmental Compliance website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.nxp.com http://www.nxp.com/files/corporate/doc/support_info/NXP-ROHS-DECLARATION.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/china-rohs:ENV_CHINA_ROHS_STRATEGY http://www.nxp.com/files/corporate/doc/support_info/NXP-REACH-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-ELV-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-STATEMENT-CONFLICT-MINERALS.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization:ABUENVPRFPRDX http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/eco-product-faqs:ENVIRON_FAQ http://www.nxp.com/support/sales-and-support:SUPPORTHOME http://www.NXP.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MKE04Z8VTG4R_IPC1752_v11.xml http://www.freescale.com/mcds/MKE04Z8VTG4R_IPC1752A.xml