001-79904

This document is a declaration of the substances within the manufacturer listed item. Note: if the item is an assembly
with lower level parts, the declaration encompasses all lower level materials for which the manufacturer has
© Copyright 2005. IPC, Bannockburn, Illinois. All rights reserved under engineering responsibility.
both international and Pan-American copyright conventions.
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Material Composition Declaration
1752-2
IPC Web Site for Information on IPC-1752 Standard
http://www.ipc.org/IPC-175x
1.1
Form Type *
Distribute
Declaration Class *
Class 6 - RoHS Yes/No, Homogeneous Materials and Mfg Informat
Supplier Information
Company Name *
Company Unique ID
Unique ID Authority
Response Date *
Cypress Semiconductor CorpCYPRESS
Contact Name *
Title - Contact
Phone - Contact *
2009-09-04
Email - Contact *
Richard Oshiro
QA Engrg Director
Authorized Representative * Title - Representative
408/943-2102
Phone - Representative *
[email protected]
Email - Representative *
Supplier Comments or URL for Additional Information
Glorioso Lutrinia
http://app.cypress.com/portal/server.pt?space=Community
Requester Item Number
EH & S Manager Sr.
632 8128161
[email protected]
Mfr Item Number
Mfr Item Name
Effective Date
388 - HSBGA (35 X 35 mm)
388 - HSBGA (35 X 35 mm)
2009-09-04
Alternate Recommendation
Version
Response Document ID
Duplicate
Manufacturing Site
Contact -> Authorized Representative
Weight *
UOM
ASE
6,326.06
mg
Package
QTP
No.
050703
Alternate Item Comments
Unit Type
Each
Manufacturing Process Information
Terminal Plating / Grid Array Material
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Base Alloy
CU Alloy
J-STD-020 MSL Rating
3
Peak Process Body Temperature Max Time at Peak Temperature Number of Reflow Cycles
260 C
20 seconds 3
Comments
Compliant to RoHS and Halogen Requirements
* Required Field
CAS Registry Number(R) is a Registered Trademark of the American Chemical Society
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RoHS Material Composition Declaration
Declaration Type *
Lock Supplier Fields
Detailed
RoHS Directive RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) in homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB),
2002/95/EC
Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material for Cadmium
Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2002/95/EC and implemented by the laws of the European Union member states) of the part identified on this form contains lead, mercury, cadmium, hexavalent
chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a “RoHS restricted substance”) in excess of the applicable quantity limit identified above. If a homogeneous material within the part contains a RoHS restricted substance in
excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it
gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that
Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in
completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided
certifications regarding their contributions to the part, and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part,the terms and
conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier’s liability and the Company’s remedies for issues that arise regarding information the Supplier
provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Supplier's Standard Terms and Conditions of Sale applicable to such part shall apply.
Supplier Acceptance * Accepted
RoHS Declaration * 1 - Item(s) does not contain RoHS restricted substances per the definition above
Exemptions: If the declared item does not contain RoHS restricted substances per the definition above except for defined RoHS exemptions, then select the corresponding response in the RoHS Declaration
above and choose all applicable exemptions.
Declaration Signature
Instructions: Complete all of the required fields on all pages of this form. Select the "Accepted" on the Supplier Acceptance drop-down. This will display the signature area. Digitally sign
the declaration (if required by the Requester) and click on Submit Form to have the form returned to the Requester.
Supplier Digital Signature
Glorioso Lutrinia
* Required Field
Digitally signed by Glorioso Lutrinia
DN: cn=Glorioso Lutrinia, o=Cypress Semiconductor Corporation, ou,
[email protected], c=PH
Date: 2009.09.24 15:39:41 +08'00'
CAS Registry Number(R) is a Registered Trademark of the American Chemical Society
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Homogeneous Material Composition Declaration for Electronic Products
SubItem Instructions: The presence of any JIG Level A or B substances must be declared. [1] indicate the subpart in which the substance is located, [2] provide a description of the
homogeneous material [3], enter the weight of the homogeneous material.
Substance Instructions: [A] select the Level (JIG A, JIG B, Requester or Supplier) [B] select the substance category (JIG or Requester) or enter a value (Supplier). [C] select the
substance (JIG) or enter the substance and CAS (Other). [D] select a RoHS exemption, if applicable [E] enter the weight of the substance or the PPM concentration [F] Optionally enter the
positive (+) and negative (-) tolerance in percent (Note: percent tolerance values are expected to cover a 3 sigma range of distribution unless otherwise noted).
Line Functions: +I Inserts a New Item /SubItem +M Inserts a new Material
Item/SubItem
Name
Homogeneous
Material
+I -I Substrate
+M -M Base Material
+I -I Solder Ball
Weight
Unit of
Measure
1,622.00 mg
+M -M External Plating 632.23 mg
+I -I Die Attach
+M -M Adhesive
14.71
mg
Level
+C Inserts a new Substance Category
Substance Category
+S Inserts a new Substance
Substance
CAS
- Deletes the element line
Exempt Weight
Unit of Tolerance
PPM
Measure +
+C -C Supplier
SiO2
+S -S SiO2
60676-86-0
170.15
mg
26,896
+C -C Supplier
Acrylic
+S -S Acrylic
Proprietary
149.22
mg
23,589
+C -C Supplier
Epoxy
+S -S Epoxy
29690-82-2,
99.59
mg
15,743
+C -C Supplier
Bisphenol
+S -S Bisphenol
13676-54-5
242.98
mg
38,409
+C -C Supplier
Triazol
+S -S Triazol
25722-66-1
290.61
mg
45,939
+C -C Supplier
Cu
+S -S Cu
7440-50-8
637.93
mg
100.84
+C -C Supplier
Ni
+S -S Ni
22.55
mg
3,564
+C -C Supplier
Au
+S -S Au
7440-57-5
7.95
mg
1,256
+C -C Supplier
Br
+S -S Br
Proprietary
1.02186 mg
162
+C -C Supplier
Sn
+S -S Sn
7440-31-5
603.78
mg
95,443
+C -C Supplier
Ag
+S -S Ag
7440-22-4
25.29
mg
3,998
+C -C Supplier
Cu
+S -S Cu
7440-50-8
3.16
mg
500
+C -C Supplier
Silver
+S -S Silver
7440-22-4
11.33
mg
1,790
+C -C Supplier
Epoxy Resin
+S -S Epoxy Resin
Proprietary
0.77
mg
122
+C -C Supplier
Functionalized Ester +S -S Functionalized Ester
Proprietary
0.77
mg
+C -C Supplier
Diester
+S -S Diester
Proprietary
1.84
mg
+I -I Die
+M -M Silicon Die
124.77 mg
+C -C Supplier
Silicon
+S -S Silicon
7440-21-3
124.77
mg
19,723
+I -I Goldwire
+M -M Interconnect
9.35
+C -C Supplier
Gold
+S -S Gold
7429-90-5
9.3491
mg
1,478
+C -C Supplier
Ion Impurities
+S -S Ion Impurities
Proprietary
0.0009
mg
0
+C -C Supplier
Silica (fused)
+S -S Phenol Silica (fused)
60676-86-0
1,780.8 mg
281,50
+C -C Supplier
Epoxy Resin A
+S -S Epoxy Resin A
Proprietary
95.4
mg
15,080
+C -C Supplier
Epoxy Resin B
+S -S Epoxy Resin B
Proprietary
95.4
mg
15,080
+C -C Supplier
Phenolic resin
+S -S Phenolic resin
Proprietary
95.4
mg
15,080
+I -I Mold Compound
+M -M Encapsulation
* Required Field
2,120
mg
mg
CAS Registry Number(R) is a Registered Trademark of the American Chemical Society
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+I -I Heat dissipation
+C -C Supplier
Metal Hydroxide
+S -S Metal Hydroxide
Proprietary
42.4
mg
6,702
+C -C Supplier
Carbon Black
+S -S Carbon Black
1333-86-4
10.6
mg
1,676
+M -M Heatslug
* Required Field
1,803.07 mg
+C -C Supplier
Copper
+S -S Copper
+C -C Supplier
Nickel
+S -S
+C -C Supplier
Chromium
+S -S Chromium
7440-50-8
7440-47-3
CAS Registry Number(R) is a Registered Trademark of the American Chemical Society
1,792.182mg
283,30
10.0968 mg
1,596
0.79332 mg
125
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