TPS63000 TPS63001 TPS63002 (3,25 mm x 3,25 mm) www.ti.com........................................................................................................................................................... SLVS520B – MARCH 2006 – REVISED JULY 2008 HIGH EFFICIENT SINGLE INDUCTOR BUCK-BOOST CONVERTER WITH 1.8-A SWITCHES FEATURES APPLICATIONS • Up to 96% Efficiency • 1200-mA Output Current at 3.3V in Step Down Mode (VIN = 3.6V to 5.5V) • Up to 800-mA Output Current at 3.3V in Boost Mode (VIN > 2.4V) • Automatic Transition between Step Down and Boost Mode • Device Quiescent Current less than 50µA • Input Voltage Range: 1.8V to 5.5V • Fixed and Adjustable Output Voltage Options from 1.2V to 5.5V • Power Save Mode for Improved Efficiency at Low Output Power • Forced Fixed Frequency Operation and Synchronization possible • Load Disconnect During Shutdown • Over-Temperature Protection • Available in Small 3 mm × 3 mm, QFN-10 Package • 1 23 • • • • • All Two-Cell and Three-Cell Alkaline, NiCd or NiMH or Single-Cell Li Battery Powered Products Portable Audio Players PDAs Cellular Phones Personal Medical Products White LEDs DESCRIPTION The TPS6300x devices provide a power supply solution for products powered by either a two-cell or three-cell alkaline, NiCd or NiMH battery, or a one-cell Li-Ion or Li-polymer battery. Output currents can go as high as 1200 mA while using a single-cell Li-Ion or Li-Polymer Battery, and discharge it down to 2.5V or lower. The buck-boost converter is based on a fixed frequency, pulse-width-modulation (PWM) controller using synchronous rectification to obtain maximum efficiency. At low load currents, the converter enters Power Save mode to maintain high efficiency over a wide load current range. The Power Save mode can be disabled, forcing the converter to operate at a fixed switching frequency. The maximum average current in the switches is limited to a typical value of 1800 mA. The output voltage is programmable using an external resistor divider, or is fixed internally on the chip. The converter can be disabled to minimize battery drain. During shutdown, the load is disconnected from the battery. The device is packaged in a 10-pin QFN PowerPAD™ package measuring 3 mm × 3 mm (DRC). L1 2.2µH L1 VIN 1.8V to 5.5V L2 VIN C1 10µF VOUT VINA EN FB C2 10µF VOUT 3.3V up to 1200mA PS/SYNC GND PGND TPS63001 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006–2008, Texas Instruments Incorporated TPS63000 TPS63001 TPS63002 SLVS520B – MARCH 2006 – REVISED JULY 2008........................................................................................................................................................... www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. AVAILABLE OUTPUT VOLTAGE OPTIONS (1) TA OUTPUT VOLTAGE DC/DC Adjustable BPT 3.3 V BPU 5.0 V BPV –40°C to 85°C (1) (2) PACKAGE MARKING PART NUMBER (2) PACKAGE TPS63000DRC 10-Pin QFN TPS63001DRC TPS63002DRC Contact the factory to check availability of other fixed output voltage versions. The DRC package is available taped and reeled. Add R suffix to device type (e.g., TPS63000DRCR) to order quantities of 3000 devices per reel. Add T suffix to device type (e.g., TPS63000DRCT) to order quantities of 250 devices per reel. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) TPS6300x Input voltage range on VIN, VINA, L1, L2, VOUT, PS/SYNC, EN, FB –0.3 V to 7 V Operating virtual junction temperature range, TJ –40°C to 150°C Storage temperature range Tstg –65°C to 150°C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability. DISSIPATION RATINGS TABLE PACKAGE THERMAL RESISTANCE ΘJA POWER RATING TA≤ 25°C DERATING FACTOR ABOVE TA = 25°C DRC 48.7°C/W 2054 mW 21 mW/°C RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT Supply voltage at VIN, VINA 1.8 5.5 V Operating free air temperature range, TA –40 85 °C Operating virtual junction temperature range, TJ –40 125 °C 2 Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TPS63000 TPS63001 TPS63002 TPS63000 TPS63001 TPS63002 www.ti.com........................................................................................................................................................... SLVS520B – MARCH 2006 – REVISED JULY 2008 ELECTRICAL CHARACTERISTICS over recommended free-air temperature range and over recommended input voltage range (typical at an ambient temperature range of 25°C) (unless otherwise noted) DC/DC STAGE PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VI Input voltage range 1.8 5.5 V VI Input voltage range for startup 1.9 5.5 V VO TPS63000 output voltage range 1.2 VFB TPS63000 feedback voltage 495 f Oscillator frequency 1250 Frequency range for synchronization ISW 500 1250 Switch current limit VIN = VINA = 3.6 V, TA = 25°C 1600 1800 High side switch on resistance VIN = VINA = 3.6 V 100 Low side switch on resistance VIN = VINA = 3.6 V 100 Line regulation IO = 0 mA, VEN = VIN = VINA = 3.6 V, VOUT = 3.3 V VINA VOUT (adjustable output voltage) FB input impedance (fixed output voltage) IS 1500 kHz 1800 kHz 2000 mA mΩ mΩ 0.5% VIN Iq V mV 0.5% Load regulation Quiescent current 5.5 505 Shutdown current 1 1.5 µA 40 50 µA 4 6 1 VEN = 0 V, VIN = VINA = 3.6 V µA MΩ 0.1 1 µA 1.7 1.8 V 0.4 V 0.1 µA CONTROL STAGE VUVLO Under voltage lockout threshold VIL EN, PS/SYNC input low voltage VIH EN, PS/SYNC input high voltage VINA voltage decreasing 1.5 1.2 EN, PS/SYNC input current Clamped on GND or VINA V 0.01 Overtemperature protection 140 °C Overtemperature hysteresis 20 °C Copyright © 2006–2008, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TPS63000 TPS63001 TPS63002 3 TPS63000 TPS63001 TPS63002 SLVS520B – MARCH 2006 – REVISED JULY 2008........................................................................................................................................................... www.ti.com PIN ASSIGNMENTS DRC PACKAGE (TOP VIEW) VOUT L2 PGND L1 VIN FB GND VINA PS/SYNC EN Terminal Functions TERMINAL NAME NO. I/O DESCRIPTION EN 6 I Enable input. (1 enabled, 0 disabled) FB 10 I Voltage feedback of adjustable versions, must be connected to VOUT on fixed output voltage versions GND 9 PS/SYNC 7 I Enable / disable power save mode (1 disabled, 0 enabled, clock signal for synchronization) L1 4 I Connection for Inductor L2 2 I Connection for Inductor PGND 3 VIN 5 I Supply voltage for power stage VOUT 1 O Buck-boost converter output VINA 8 I Supply voltage for control stage PowerPAD™ 4 Control / logic ground Power ground Must be soldered to achieve appropriate power dissipation. Should be connected to PGND. Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TPS63000 TPS63001 TPS63002 TPS63000 TPS63001 TPS63002 www.ti.com........................................................................................................................................................... SLVS520B – MARCH 2006 – REVISED JULY 2008 FUNCTIONAL BLOCK DIAGRAM (TPS63000) L1 L2 VIN VOUT Current Sensor VBAT VOUT PGND PGND Gate Control _ VINA Modulator PS/SYNC Oscillator + + _ FB VREF + - Device Control EN Temperature Control PGND PGND GND TYPICAL CHARACTERISTICS TABLE OF GRAPHS DESCRIPTION FIGURE Maximum output current vs Input voltage 1 Efficiency vs Output current (TPS63001) 2 vs Output current (TPS63002) 3 vs Input voltage (TPS63001) 4 vs Input voltage (TPS63002) 5 vs Output current (TPS63001) 6 vs Output current (TPS63002) 7 Output voltage in continuous current mode (TPS63001, VIN > VOUT) 8 Output voltage Waveforms Output voltage in continuous current mode (TPS63001, VIN < VOUT) 9 Output voltage in continuous current mode (TPS63001, VIN = VOUT) 10 Output voltage in power save mode (TPS63001, VIN > VOUT) 11 Output voltage in power save mode (TPS63001, VIN < VOUT) 12 Load transient response (TPS63001, VIN > VOUT) 13 Load transient response (TPS63001, VIN < VOUT) 14 Line transient response (TPS63001, Iout = 300mA) 15 Line transient response (TPS63001, Iout = 600mA) 16 Startup after enable (TPS63000, VOUT = 2.5V) 17 Startup after enable (TPS63002) 18 Copyright © 2006–2008, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TPS63000 TPS63001 TPS63002 5 TPS63000 TPS63001 TPS63002 SLVS520B – MARCH 2006 – REVISED JULY 2008........................................................................................................................................................... www.ti.com MAXIMUM OUTPUT CURRENT vs INPUT VOLTAGE EFFICIENCY vs OUTPUT CURRENT (TPS63001) 100 1800 90 80 1400 1200 1000 800 TPS63001, VO = 3.3 V 600 TPS63002, VO = 5 V 40 30 200 10 4.2 3.4 VI - Input Voltage - V 0.1 1 I O - Output Current - A Figure 2. EFFICIENCY vs OUTPUT CURRENT (TPS63002) EFFICIENCY vs INPUT CURRENT (TPS63001) 100 90 95 80 90 70 IO = 500 mA 85 VI = 2.4 V VI = 4.2 V Efficiency - % Efficiency - % 0.01 Figure 1. VI = 3.6 V 50 40 30 IO = 100 mA 80 75 70 IO = 10 mA 65 20 60 TPS63002 VO = 5 V 10 0.1 0.01 IO - Output Current - A Figure 3. Submit Documentation Feedback TPS63001 VO = 3.3 V 55 0 0.001 TPS63001 VO = 3.3 V 0 0.001 5 100 60 VI = 4.2 V 50 20 2.6 VI = 3.6 V 60 400 0 1.8 6 VI = 2.4 V 70 Efficiency - % IO - maximum output current - mA 1600 TPS63000, VO = 1.8 V 1 50 1.8 2.3 2.8 3.3 3.8 4.3 4.8 5.3 VI - input voltage - V Figure 4. Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TPS63000 TPS63001 TPS63002 TPS63000 TPS63001 TPS63002 www.ti.com........................................................................................................................................................... SLVS520B – MARCH 2006 – REVISED JULY 2008 EFFICIENCY vs INPUT CURRENT (TPS63002) OUTPUT VOLTAGE vs OUTPUT CURRENT (TPS63001) 100 95 3.400 TPS63001 VO = 3.3 V IO = 500 mA 90 3.350 VO - Output Voltage - V Efficiency - % 85 80 75 70 65 IO = 100 mA IO = 10 mA 3.300 VI = 3.6 V 3.250 60 TPS63002 VO = 5 V 55 50 1.8 2.3 2.8 3.3 3.8 4.3 VI - Input Voltage - V 4.8 3.200 0.001 5.3 0.01 0.1 IO - Output Current - A Figure 5. 1 Figure 6. OUTPUT VOLTAGE vs OUTPUT CURRENT (TPS63002) 5.150 TPS63002 VO = 5 V VO - Output Voltage - V 5.100 5.050 VI = 3.6 V 5 4.950 4.900 4.850 0.001 0.01 0.1 IO - Output Current - A 1 Figure 7. Copyright © 2006–2008, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TPS63000 TPS63001 TPS63002 7 TPS63000 TPS63001 TPS63002 SLVS520B – MARCH 2006 – REVISED JULY 2008........................................................................................................................................................... www.ti.com OUTPUT VOLTAGE IN CONTINUOUS CURRENT MODE (TPS63001, VIN > VOUT) OUTPUT VOLTAGE IN CONTINUOUS CURRENT MODE (TPS63001, VIN > VOUT) Output Voltage 10 mV/div Output Voltage 10 mV/div L1 Voltage 5 V/div L1 Voltage 5 V/div L2 Voltage 5 V/div L2 Voltage 5 V/div Inductor Current 500 mA/div Inductor Current 500 mA/div TPS63001 VO = 3.3 V VI = 4.2 V, IO = 500 mA TPS63001, VO = 3.3 V Timebase 500 ns/div Figure 8. VI = 2.4 V, IO = 500 mA Timebase 500 ns/Div Figure 9. OUTPUT VOLTAGE IN CONTINUOUS CURRENT MODE (TPS63001, VIN = VOUT) OUTPUT VOLTAGE IN POWER SAVE MODE (TPS63001, VIN > VOUT) Output Voltage 10 mV/div Output Voltage 100 mV/div L1 Voltage 5 V/div L2 Voltage 5 V/div Inductor Current 500 mA/div,dc Inductor Current 500 mA/div TPS63001, VO = 3.3 V VI = 3.3 V, IO = 500 mA Timebase 500 ns/div Figure 10. 8 Submit Documentation Feedback TPS63001, VO = 3.3 V VI = 4.2 V, IO = 50 mA Timebase 5 ms/Div Figure 11. Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TPS63000 TPS63001 TPS63002 TPS63000 TPS63001 TPS63002 www.ti.com........................................................................................................................................................... SLVS520B – MARCH 2006 – REVISED JULY 2008 OUTPUT VOLTAGE IN POWER SAVE MODE (TPS63001, VIN < VOUT) LOAD TRANSIENT RESPONSE (TPS63001, VIN > VOUT) Output Voltage 100 mV/div, ac Output Voltage 100 mV/div, ac Output Current 200 mA/div, dc Inductor Current 500 mA/div, dc TPS63001, VO = 3.3 V TPS63001, VO = 3.3 V VI = 2.4 V, IO = 50 mA Timebase 5 m s/div VI = 3.6 V, IO = 200 mA to 600 mA Timebase 2 ms/div Figure 13. Figure 12. LOAD TRANSIENT RESPONSE (TPS63001, VIN < VOUT) LINE TRANSIENT RESPONSE (TPS63001, Iout = 300mA) Output Voltage 100 mV/div, ac Output Voltage 10 mV/div,ac Output Current 200 mA/div,dc Input Voltage 1 V/div,dc TPS63001, VO = 3.3 V VI = 3 V, IO = 200 mA to 600 mA Timebase 2 ms/div Figure 14. Copyright © 2006–2008, Texas Instruments Incorporated VI = 3 V to 3.6 V, IO = 300 mA TPS63001, VO = 3.3 V Timebase 2 ms/div Figure 15. Submit Documentation Feedback Product Folder Link(s): TPS63000 TPS63001 TPS63002 9 TPS63000 TPS63001 TPS63002 SLVS520B – MARCH 2006 – REVISED JULY 2008........................................................................................................................................................... www.ti.com LINE TRANSIENT RESPONSE (TPS63001, Iout = 600mA) STARTUP AFTER ENABLE (TPS63000, VOUT = 2.5V) Enable 2 V/div,dc Output Voltage 1 V/div,dc Output Voltage 20 mV/div,ac Inductor Current 200 mA/div,dc Input Voltage 1 V/div,dc TPS63001, VO = 3.3 V Voltage at L1 2 V/div, dc TPS63000, VO = 2.5 V VI = 3 V to 3.6 V, IO = 600 mA VI = 3.3 V, IO = 300 mA Timebase 2 ms/div Timebase 50 ms/div Figure 16. Figure 17. STARTUP AFTER ENABLE (TPS63002) Enable 2 V/div, dc Output Voltage 2 V/div, dc Inductor Current 500 mA/div, dc Voltage at L2 2 V/div,dc TPS63002, VO = 5 V VI = 2.4 V, IO = 300 mA Timebase 100 ms/div Figure 18. 10 Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TPS63000 TPS63001 TPS63002 TPS63000 TPS63001 TPS63002 www.ti.com........................................................................................................................................................... SLVS520B – MARCH 2006 – REVISED JULY 2008 PARAMETER MEASUREMENT INFORMATION L1 L2 L1 VIN VIN C1 VINA R3 R1 EN GND C2 FB PS/SYNC C3 VOUT VOUT R2 PGND TPS6300X List of Components REFERENCE DESCRIPTION MANUFACTURER TPS6300 0 / 1 / 2 Texas Instruments L1 VLF4012-2R2 TDK C1 10 µF 6.3V, 0603, X7R ceramic C2 2 × 10 µF 6.3V, 0603, X7R ceramic C3 0.1 µF, X7R ceramic R3 100 Ω R1, R2 Depending on the output voltage at TPS63000, not used at TPS6300 1 / 2 Copyright © 2006–2008, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TPS63000 TPS63001 TPS63002 11 TPS63000 TPS63001 TPS63002 SLVS520B – MARCH 2006 – REVISED JULY 2008........................................................................................................................................................... www.ti.com DETAILED DESCRIPTION CONTROLLER CIRCUIT The controlling circuit of the device is based on an average current mode topology. The average inductor current is regulated by a fast current regulator loop which is controlled by a voltage control loop. The controller also uses input and output voltage feedforward. Changes of input and output voltage are monitored and immediately can change the duty cycle in the modulator to achieve a fast response to those errors. The voltage error amplifier gets its feedback input from the FB pin. At adjustable output voltages a resistive voltage divider must be connected to that pin. At fixed output voltages FB must be connected to the output voltage to directly sense the voltage. Fixed output voltage versions use a trimmed internal resistive divider. The feedback voltage will be compared with the internal reference voltage to generate a stable and accurate output voltage. The controller circuit also senses the average input current as well as the peak input current. With this, maximum input power can be controlled as well as the maximum peak current to achieve a safe and stable operation under all possible conditions. To finally protect the device from overheating, an internal temperature sensor is implemented. Synchronous Operation The device uses 4 internal N-channel MOSFETs to maintain synchronous power conversion at all possible operating conditions. This enables the device to keep high efficency over a wide input voltage and output power range. To avoid ground shift problems due to the high currents in the switches, two separate ground pins GND and PGND are used. The reference for all control functions is the GND pin. The power switches are connected to PGND. Both grounds must be connected on the PCB at only one point ideally close to the GND pin. Due to the 4-switch topology, the load is always disconnected from the input during shutdown of the converter. Buck-Boost Operation To be able to regulate the output voltage properly at all possible input voltage conditions, the device automatically switches from step down operation to boost operation and back as required by the configuration. It always uses one active switch, one rectifying switch, one switch permanently on, and one switch permanently off. Therefore, it operates as a step down converter (buck) when the input voltage is higher than the output voltage, and as a boost converter when the input voltage is lower than the output voltage. There is no mode of operation in which all 4 switches are permanently switching. Controlling the switches this way allows the converter to maintain high efficiency at the most important point of operation; when input voltage is close to the output voltage. The RMS current through the switches and the inductor is kept at a minimum, to minimize switching and conduction losses. Switching losses are also kept low by using only one active and one passive switch. Regarding the remaining 2 switches, one is kept permanently on and the other is kept permanently off, thus causing no switching losses. Power Save Mode and Synchronization The PS/SYNC pin can be used to select different operation modes. To enable power save, PS/SYNC must be set low. Power save mode is used to improve efficiency at light load. If power save mode is enabled, the converter stops operating if the average inductor current gets lower than about 300 mA and the output voltage is at or above its nominal value. If the output voltage decreases below its nominal value, the device ramps up the output voltage again by starting operation using a programmed average inductor current higher than required by the current load condition. Operation can last for one or several pulses. The converter again stops operating once the conditions for stopping operation are met again. The power save mode can be disabled by programming high at the PS/SYNC. Connecting a clock signal at PS/SYNC forces the device to synchronize to the connected clock frequency. Synchronization is done by a PLL, so synchronizing to lower and higher frequencies compared to the internal clock works without any issues. The PLL can also tolerate missing clock pulses without the converter malfunctioning. The PS/SYNC input supports standard logic thresholds. 12 Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TPS63000 TPS63001 TPS63002 TPS63000 TPS63001 TPS63002 www.ti.com........................................................................................................................................................... SLVS520B – MARCH 2006 – REVISED JULY 2008 Device Enable The device is put into operation when EN is set high. It is put into a shutdown mode when EN is set to GND. In shutdown mode, the regulator stops switching, all internal control circuitry is switched off, and the load is disconnected from the input. This also means that the output voltage can drop below the input voltage during shutdown. During start-up of the converter, the duty cycle and the peak current are limited in order to avoid high peak currents flowing from the input. Softstart and Short Circuit Protection After being enabled, the device starts operating. The average current limit ramps up from an initial 400mA following the output voltage increasing. At an output voltage of about 1.2 V, the current limit is at its nominal value. If the output voltage does not increase, the current limit will not increase. There is no timer implemented. Thus the output voltage overshoot at startup, as well as the inrush current, is kept at a minimum. The device ramps up the output voltage in a controlled manner even if a very large capacitor is connected at the output. When the output voltage does not increase above 1.2 V, the device assumes a short circuit at the output and keeps the current limit low to protect itself and the application. At a short at the output during operation the current limit also will be decreased accordingly. At 0 V at the output, for example, the output current will not exceed about 400 mA. Undervoltage Lockout An undervoltage lockout function prevents device start-up if the supply voltage on VINA is lower than approximately its threshold (see electrical characteristics table). When in operation, the device automatically enters the shutdown mode if the voltage on VINA drops below the undervoltage lockout threshold. The device automatically restarts if the input voltage recovers to the minimum operating input voltage. Overtemperature Protection The device has a built-in temperature sensor which monitors the internal IC temperature. If the temperature exceeds the programmed threshold (see electrical characteristics table) the device stops operating. As soon as the IC temperature has decreased below the programmed threshold, it starts operating again. There is a built-in hysteresis to avoid unstable operation at IC temperatures at the overtemperature threshold. Copyright © 2006–2008, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TPS63000 TPS63001 TPS63002 13 TPS63000 TPS63001 TPS63002 SLVS520B – MARCH 2006 – REVISED JULY 2008........................................................................................................................................................... www.ti.com APPLICATION INFORMATION DESIGN PROCEDURE The TPS6300x dc/dc converters are intended for systems powered by one-cell Li-Ion or Li-Polymer battery with a typical voltage between 2.3 V and 4.5 V. They can also be used in systems powered by a double or triple cell Alkaline, NiCd, or NiMH battery with a typical terminal voltage between 1.8 V and 5.5 V . Additionally, any other voltage source with a typical output voltage between 1.8 V and 5.5 V can power systems where the TPS6300x is used. PROGRAMMING THE OUTPUT VOLTAGE Within the TPS6300X family there are fixed and adjustable output voltage versions available. To properly configure the fixed output voltage devices, the FB pin is used to sense the output voltage. This means that it must be connected directly to VOUT. At the adjustable output voltage versions, an external resistor divider is used to adjust the output voltage. The resistor divider must be connected between VOUT, FB and GND. When the output voltage is regulated properly, the typical value of the voltage at the FB pin is 500mV. The maximum recommended value for the output voltage is 5.5V. The current through the resistive divider should be about 100 times greater than the current into the FB pin. The typical current into the FB pin is 0.01 µA, and the voltage across the resistor between FB and GND, R2, is typically 500 mV. Based on those two values, the recommended value for R2 should be lower than 500kΩ, in order to set the divider current at 1µA or higher. It is recommended to keep the value for this resistor in the range of 200kΩ. From that, the value of the resistor connected between VOUT and FB, R1, depending on the needed output voltage (VOUT), can be calculated using Equation 1: R 1 + R2 ǒ VOUT V FB Ǔ *1 (1) If as an example, an output voltage of 3.3 V is needed, a 1.0 MΩ resistor should be chosen for R1. To improve control performance using a feedforward capacitor in parallel to R1 is recommended. The value for the feedforward capacitor can be calculated using Equation 2. 2.2 ms C ff + R1 (2) L1 L1 VIN L2 VIN R3 C1 VINA R1 EN C3 C2 FB PS/SYNC GND VOUT VOUT R2 PGND TPS6300X Figure 19. Typical Application Circuit for Adjustable Output Voltage Option INDUCTOR SELECTION To properly configure the TPS6300X devices, an inductor must be connected between pin L1 and pin L2. To estimate the inductance value Equation 3 and Equation 4 can be used. 14 Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TPS63000 TPS63001 TPS63002 TPS63000 TPS63001 TPS63002 www.ti.com........................................................................................................................................................... SLVS520B – MARCH 2006 – REVISED JULY 2008 L1 + L2 + ǒVIN1 * VOUTǓ VOUT V IN1 Vin2 f 0.3 A (3) ǒVOUT * VIN2Ǔ V OUT f 0.3 A (4) In both equations f is the minimum switching frequency. In Equation 3 the minimum inductance value, L1 for step down mode operation is calculated. VIN1 is the maximum input voltage. In Equation 4 the minimum inductance, L2, for boost mode operation is calculated. VIN2 is the minimum input voltage. The recommended minimum inductor value is either L1 or L2 whichever is higher. As an example, a suitable inductor for generating 3.3V from a Li-Ion battery with a battery voltage range from 2.5V up to 4.2V is 2.2 µH. The recommended inductor value range is between 1.5 µH and 4.7 µH. In general, this means that at high voltage conversion rates, higher inductor values offer better performance. With the chosen inductance value, the peak current for the inductor in steady state operation can be calculated. Equation 5 shows how to calculate the peak current I1 in step down mode operation and Equation 6 shows how to calculate the peak current I2 in boost mode operation. VOUTǒV IN1 * V OUTǓ I I 1 + OUT ) 0.8 2 V IN1 f L (5) ǒV OUT * V IN2Ǔ V I OUT VIN2 I 2 + OUT ) 2 0.8 V IN2 VOUT f L (6) The critical current value for selecting the right inductor is the higher value of I1 and I2. It also needs to be taken into account that load transients and error conditions may cause higher inductor currents. This also needs to be taken into account when selecting an appropriate inductor. The following inductor series from different suppliers have been used with TPS6300x converters: Table 1. List of Inductors VENDOR Coilcraft INDUCTOR SERIES LPS3015 LPS4012 Murata LQH3NP Tajo Yuden NR3015 VLF3215 TDK VLF4012 CAPACITOR SELECTION Input Capacitor At least a 4.7 µF input capacitor is recommended to improve transient behavior of the regulator and EMI behavior of the total power supply circuit. A ceramic capacitor placed as close as possible to the VIN and PGND pins of the IC is recommended. Output Capacitor For the output capacitor, it is recommended to use small ceramic capacitors placed as close as possible to the VOUT and PGND pins of the IC. If, for any reason, the application requires the use of large capacitors which can not be placed close to the IC, using a smaller ceramic capacitor in parallel to the large one is recommended. This small capacitor should be placed as close as possible to the VOUT and PGND pins of the IC. To get an estimate of the recommended minimum output capacitance, Equation 7 can be used. Copyright © 2006–2008, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TPS63000 TPS63001 TPS63002 15 TPS63000 TPS63001 TPS63002 SLVS520B – MARCH 2006 – REVISED JULY 2008........................................................................................................................................................... www.ti.com C OUT + 5 L mF mH (7) A capacitor with a value in the range of the calculated minimum should be used. This is required to maintain control loop stability. There are no additional requirements regarding minimum ESR. There is also no upper limit for the output capacitance value. Larger capacitors will cause lower output voltage ripple as well as lower output voltage drop during load transients. LAYOUT CONSIDERATIONS As for all switching power supplies, the layout is an important step in the design, especially at high peak currents and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground tracks. The input capacitor, output capacitor, and the inductor should be placed as close as possible to the IC. Use a common ground node for power ground and a different one for control ground to minimize the effects of ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC. The feedback divider should be placed as close as possible to the control ground pin of the IC. To lay out the control ground, it is recommended to use short traces as well, separated from the power ground traces. This avoids ground shift problems, which can occur due to superimposition of power ground current and control ground current. THERMAL INFORMATION Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits of a given component. Three basic approaches for enhancing thermal performance are listed below. • Improving the power dissipation capability of the PCB design • Improving the thermal coupling of the component to the PCB by soldering the PowerPAD • Introducing airflow in the system The maximum recommended junction temperature (TJ) of the TPS6300x devices is 125°C. The thermal resistance of the 10-pin QFN 3 × 3 package (DRC) is RθJA = 48.7°C/W, if the PowerPAD is soldered. Specified regulator operation is assured to a maximum ambient temperature TA of 85°C. Therefore, the maximum power dissipation is about 820mW, as calculated in Equation 8. More power can be dissipated if the maximum ambient temperature of the application is lower. T *T J(MAX) A P + + 125°C * 85°C + 820 mW D(MAX) R 48.7 °CńW qJA (8) 16 Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TPS63000 TPS63001 TPS63002 PACKAGE OPTION ADDENDUM www.ti.com 18-Feb-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPS63000DRCR ACTIVE SON DRC 10 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS63000DRCRG4 ACTIVE SON DRC 10 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS63000DRCT ACTIVE SON DRC 10 1 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS63000DRCTG4 ACTIVE SON DRC 10 1 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS63001DRCR ACTIVE SON DRC 10 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS63001DRCRG4 ACTIVE SON DRC 10 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS63001DRCT ACTIVE SON DRC 10 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS63001DRCTG4 ACTIVE SON DRC 10 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS63002DRCR ACTIVE SON DRC 10 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS63002DRCRG4 ACTIVE SON DRC 10 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS63002DRCT ACTIVE SON DRC 10 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS63002DRCTG4 ACTIVE SON DRC 10 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 18-Feb-2010 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TPS63000 : • Automotive: TPS63000-Q1 NOTE: Qualified Version Definitions: • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPS63000DRCR SON DRC 10 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS63000DRCR SON DRC 10 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS63000DRCT SON DRC 10 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS63000DRCT SON DRC 10 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS63001DRCR SON DRC 10 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS63001DRCR SON DRC 10 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS63001DRCT SON DRC 10 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS63002DRCR SON DRC 10 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS63002DRCR SON DRC 10 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS63002DRCT SON DRC 10 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS63002DRCT SON DRC 10 250 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS63000DRCR SON DRC 10 3000 367.0 367.0 35.0 TPS63000DRCR SON DRC 10 3000 367.0 367.0 35.0 TPS63000DRCT SON DRC 10 250 210.0 185.0 35.0 TPS63000DRCT SON DRC 10 250 210.0 185.0 35.0 TPS63001DRCR SON DRC 10 3000 367.0 367.0 35.0 TPS63001DRCR SON DRC 10 3000 367.0 367.0 35.0 TPS63001DRCT SON DRC 10 250 210.0 185.0 35.0 TPS63002DRCR SON DRC 10 3000 367.0 367.0 35.0 TPS63002DRCR SON DRC 10 3000 367.0 367.0 35.0 TPS63002DRCT SON DRC 10 250 210.0 185.0 35.0 TPS63002DRCT SON DRC 10 250 340.5 338.1 20.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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