TMS570LS31 HDK USER GUIDE TMS570LS31 HDK User Guide Table of Contents TMS570LS31 HDK ............................................................................................................ 1 USER GUIDE ..................................................................................................................... 1 1. Introduction ................................................................................................................. 5 1.1 Scope of Document .............................................................................................. 5 1.2 TMS570LS31 HERCULES Development Kit (HDK) Features .......................... 5 1.3 HDK Board Block Diagram ................................................................................. 6 1.4 TMS570LS31 HDK Contents .............................................................................. 6 1.5 HDK Specifications.............................................................................................. 7 1.6 Basic Operation .................................................................................................... 7 1.7 Memory Map ........................................................................................................ 7 1.8 Power Supply ....................................................................................................... 7 2. Physical Description ................................................................................................... 9 2.1 Board Layout ........................................................................................................ 9 2.2 Connectors ............................................................................................................ 9 2.2.1 20Pin ARM JTAG Header .......................................................................... 10 2.2.2 Ethernet Interface ........................................................................................ 10 2.2.3 CAN Interface ............................................................................................. 11 2.2.4 J19, MIPI Connector .................................................................................. 12 2.2.5 J7, XDS100V2 USB JTAG Interface ......................................................... 13 2.2.6 P1, +5V~+12V Input .................................................................................. 14 2.2.7 SCI Interface ............................................................................................... 14 2.2.8 Daughter Card Interface .............................................................................. 14 2.3 LEDs................................................................................................................... 19 2.4 DIP Switch ......................................................................................................... 20 2.5 Jumpers............................................................................................................... 20 2.6 S4, Power-On Reset Switch ............................................................................... 21 2.7 S3, System Reset Switch .................................................................................... 21 Appendix A ....................................................................................................................... 22 Operation Notices ............................................................................................................. 22 1 Support Resources .................................................................................................... 22 Figure 1, TMS570LS31 HDK Board Block Diagram ................................................... 6 Figure 2, TMS570LS31 HDK Board, Interfaces Top Side ......................................... 9 Figure 3, J2, J3 Screw Terminal Block ....................................................................... 11 Figure 4, CAN Bus Termination ................................................................................... 12 Figure 5, J19, 60pin MIPI ETM Header ...................................................................... 12 Figure 6, +12 Volt Input Jack ....................................................................................... 14 Figure 7, DIP Switch Settings ...................................................................................... 20 Table 1, TMS570LS31 Memory Map ............................................................................ 7 2 TMS570LS31 HDK User Guide Table 2, Power Test Points............................................................................................. 8 Table 3, Connectors on HDK Board.............................................................................. 9 Table 4, 20pin ARM JTAG Header.............................................................................. 10 Table 5; J1, Ethernet Interface ..................................................................................... 11 Table 6, J19, MIPI Connector Signal Mapping .......................................................... 12 Table 7, J7, XDS100V2 USB JTAG Interface ........................................................... 13 Table 10, Expansion Connector P2 (J10, Right, TopView) ..................................... 15 Table 11, Expansion Connector P1 (J9, Left, TopView) .......................................... 16 Table 12, Expansion Connector P3 (J11, Bottom One, TopView) ......................... 17 Table 13, Demo LEDs ................................................................................................... 19 Table 14, Other LEDs as Indicator .............................................................................. 19 Table 15, S2 DIP Switch Functions ............................................................................. 20 Table 16, Jumpers ......................................................................................................... 20 3 TMS570LS31 HDK User Guide About This Manual This document describes the board level operations of the TMS570LS31 Hercules Development Kit (HDK). The HDK is based on the Texas Instruments TMS570LS3137 Microcontroller. The TMS570LS31 HDK is a table top card that allows engineers and software developers to evaluate certain characteristics of the TMS570LS3137 microcontroller to determine if the microcontroller meets the designer application requirements. Evaluators can create software to execute on board or expand the system in a variety of ways. Notational Conventions This document uses the following conventions. The TMS570LS31 HDK will sometimes be referred to as the TMS570 HDK or HDK. Program listings, program examples, and interactive displays are shown in a special italic typeface. Here is a sample program listing. equations !rd = !strobe&rw; Information About Cautions This book may contain cautions. This is an example of a caution statement. A caution statement describes a situation that could potentially damage your software, or hardware, or other equipment. The information in a caution is provided for your protection. Please read each caution carefully. Related Documents, Application Notes and User Guides Information regarding this device can be found at the following Texas Instruments website: http://www.ti.com/tms570 4 TMS570LS31 HDK User Guide 1. Introduction This development kit provides a product-ready hardware and software platform for evaluating the functionality of the Texas Instruments TMS570LS3137 microcontroller family. Schematics, list of materials, and PCB layout are available to ease hardware development and reduce time to market. 1.1 Scope of Document This user guide will list the contents of the development kit, point out the features of the major components, and provide the instructions necessary to verify your development kit is in working order. Any additional usage instructions or details fall outside the scope of this document. Additional resources will be listed at the end of this user guide. 1.2 TMS570LS31 HERCULES Development Kit (HDK) Features The HDK comes with a full complement of on board devices that suit a wide variety of application environments. Key features include: • A Texas Instruments TMS570LS3137 337-pin BGA microcontroller • Integrated USB JTAG Emulator (XDS100v2) • External JTAG Headers (ARM 20 pin and TI Compact 20 pin CTI) • 10/100 Mbps Ethernet interface • Two CAN Transceivers (SN65HVDA541Q1) and screw terminal blocks • One ambient light sensor • One ambient temperature sensor • Microcontroller’s SCI (UART) accessible through a USB Virtual COM Port • One 8MB SDRAM • Eight user programmable white LEDs around the MCU silicon. • One user programmable pushbutton • Three expansion connectors for hardware prototyping • Reset pushbuttons (nPOR and nRST) • One SD card slot (SPI mode) • Embedded trace macrocell (ETM) debug interface • Configurable pin mux options • 5V and 3.3V ADC option jumper • Current measurement capability for 3.3V IO, 1.2V Core, 1.2V PLL, 3.3V or 5V ADC, and 3.3V VCCP. • Accepts an external power supply between +5V and +12V 5 TMS570LS31 HDK User Guide 1.3 HDK Board Block Diagram Figure 1, TMS570LS31 HDK Board Block Diagram ENET RJ45 PWR USB EMU SD Slot nPOR MII / RMII CPLD PIN MUX TMS570LS3137 180MHz SPI/ADC CAN/FRAY/LIN/ GIO/HET SDRAM EXP Conn3 Pinmux DIP CAN PHY Light Sensor 3.3V/5V A/D PIN MUX EMIF/ETM/SPI2 CAN1 3.3V I/O ENET PHY JTAG EXP Conn1 1.2V Core FTDI 2332 EXP Conn2 Ext JTAG nRST SPI2 XDS100V2 ETM GIO Button Temp Sensor CAN PHY CAN2 c 1.4 TMS570LS31 HDK Contents The kit contains everything needed to develop and run applications for TMS570LS3137 microcontrollers including: Board TMS570LS31 Card Cables and Accessories 12 volt power supply with power adapters for US, or Europe Type A to mini B USB cable for using on board XDS100V2 JTAG emulator Ethernet cable Flashlight for light sensor demo CCS DVD Containing Texas Instruments’ Code Composer Studio™ IDE (CCS) Hercules DVD Containing 6 Hercules Safety Demos HALCoGen (Hardware Abstraction Layer Code Generator) Training Videos Device Documentation TMS570LS31 HDK User Guide 1.5 HDK Specifications Board supply voltage: 5V–12V Vdc Board supply current: 130mA typ (fully active, CPU at 180 MHz) Dimensions: 4.90” x 4.30” x 0.85” (LxWxH) 1.6 Basic Operation The HDK is designed to work with TI’s Code Composer Studio and other 3rd party ARM IDEs (Integrated Development Environments). The IDE communicates with the board through the embedded emulator or an external JTAG emulator. To start, follow the instructions in the Quick Start Guide to install Hercules specific software. This process will install all of the necessary development tools, documentation and drivers. 1.7 Memory Map The TMS570LS31 family of MCUs have a large byte addressable address space. The memory map table shows the address space of a TMS570LS3137 microcontroller on the left with specific details of how each region is used on the right. By default, the internal memory sits at the beginning of the address space. The SDRAM is mapped into CS0 space on the EMIF. CS2/3/4 are used for synchronous memory for example SRAM, NOR flash, NAND flash etc. To use EMIF, the MPU has to be enabled, and the CS regions have to be configured as “device mode” or “strongly ordered mode” through MPU. Table 1, TMS570LS31 Memory Map Start End Address HDK Address 0x0000 0000 0x002F FFFF Flash 0x0800 0000 0x0803 FFFF RAM 0x0840 0000 0x0843 FFFF RAM-ECC 0x6000 0000 0x63FF FFFF CS2 Async RAM 0x6400 0000 0x67FF FFFF CS3 Async RAM 0x6800 0000 0x7BFF FFFF CS4 Async RAM 0x8000 0000 0x87FF FFFF CS0 Sync SDRAM 1.8 Power Supply The HDK board operates from a single +12V external power supply connected to the main power input (P1), a 2.5 MM, barrel-type plug. Internally, the +12V input is converted into +1.2V, +3.3V and +5.0V using Texas Instruments swift voltage regulators and PTH power module. The +1.2V supply is used for the MCU core 7 TMS570LS31 HDK User Guide while the +3.3V supply is used for the MCU's I/O buffers and other components on the board. The +5.0 volt supply is used for ADC power (2nd option) and USB VBUS. There are multiple power test points on the HDK board. The three main test point pairs provide a convenient mechanism to check the HDK’s current for each supply. The table below shows the voltages for each test point and what the supply is used for. Table 2, Power Test Points Test Point Pair Voltage TP14 and TP15 1.2V TP16 and TP17 3.3V TP18 and TP19 1.2V TP20 and TP21 3.3V TP22 and TP23 3.3V or 5.0V (J8 to enable 5V) 8 Voltage Use MCU core MCU IO MCU PLL MCU Flash pump MCU MibADC, and ADREFHI TMS570LS31 HDK User Guide 2. Physical Description This chapter describes the physical layout of the TMS570LS31 HDK board and its interfaces. 2.1 Board Layout The TMS570LS31 HDK is a 4.9 x 4.3 inch (125 x 109 mm.) eight (8) layer printed circuit board which is powered by an external +5V~+12 volt only power supply. Figure 2 shows the layout of the TMS570LS31 HDK board. Figure 2, TMS570LS31 HDK Board, Interfaces Top Side 2.2 Connectors The HDK board has twenty fifteen (15) interfaces to various peripherals. These interfaces are described in the following sections. Table 3, Connectors on HDK Board Connector Size J1 RJ45 J2 3, 2,54mm 9 Function Ethernet DCAN1 TMS570LS31 HDK User Guide J3 J4 J6 J7 J9 J10 J11 3, 2.54mm 10x2, 2.54mm 19x2, mictor 4pin, Mini-B USB 33x2, 2mm 33x2, 2mm 40x2, 2mm J12 J15 J16 J17 J19 P1 19x2, mictor 4pin, Type B 4pin, Type A 30x2, MIPI 2.5mm DCAN2 ARM 20pin JTAG header RTP XDS100V2 USB Exp P1, SPI1, SPI5, ADC EXP P2, SPI2, EMIF, ECLK EXP P3, SPI3, GIO, NHET, DCAN, Flexray, LIN DMM SD card No Populated No Populated ETM MIPI Header +12V In 2.2.1 20Pin ARM JTAG Header In addition to on board XDS100V2 JTAG. One 20pin ARM JTAG header is added for using an external emulator. This is the standard interface used by JTAG emulators to interface to ARM microcontrollers. The pinout for the connector is shown in the figure. Table 4, 20pin ARM JTAG Header Signal Name Pin# Vref 1 nTRST 3 TDI 5 TMS 7 TCK 9 RTCK 11 TDO 13 nRST 15 NC 17 NC 19 Pin# 2 4 6 8 10 12 14 16 18 20 Signal Name VCC GND GND GND GND GND GND GND GND GND 2.2.2 Ethernet Interface The TMS570LS3137 integrates an MII/RMII ethernet MAC on chip. This interface is routed to the on board PHY via CBT switches. The board uses a DP83640 PHY. The interface is isolated and brought out to a RJ-45 connector with integrated magnetics, J1. The pinmux control DIP S2 is used to control the CBT FET switch for RMII, MII or other functions. 10 TMS570LS31 HDK User Guide The J1 connector is used to provide an 10/100 Mbps Ethernet interface. This is a standard RJ-45 connector. The cable end pinout for the J1 connector is shown in the table below. Table 5; J1, Ethernet Interface Pin # Signal 1 D0+ 3 D15 D27 D3+ Pin # 2 4 6 8 Signal D0D2+ D1D3- Two LEDs are embedded into the connector to report link status (green LED) and transmit/receive status of the PHY (yellow LED). 2.2.3 CAN Interface The TMS570lLS1227 has three CAN interfaces which provide a high speed serial interface. Two 3 pin screw terminal blocks, J2 and J3, are used to interface to the CAN bus. The pinouts for this connector are shown in the figure below. H means CAN High (CAN H), and L means CAN Low (CAN L). Figure 3, J2, J3 Screw Terminal Block H GND L CAN Bus termination is used to minimize signal reflection on the bus. ISO-11898 requires that the CAN bus have a nominal characteristic line impedance of 120Ω. Therefore, the typical terminating resistor value for each end of the bus is 120Ω. We use split termination method to help increase EMC performance. Split termination is a concept that is growing in popularity because emission reduction can be achieved very easily. Split termination is a modified standard termination in which the single 120Ω resistor on each end of the bus is split into two 60Ω resistors, with a bypass capacitor tied between the resistors and to ground. The two resistors should match as close as possible. 11 TMS570LS31 HDK User Guide Figure 4, CAN Bus Termination 2.2.4 J19, MIPI Connector The following figure and table show the 60 pin MIPI header. Figure 5, J19, 60pin MIPI ETM Header Table 6, J19, MIPI Connector Signal Mapping MCU Signals Pin# Pin# MCU Signals 3.3V 1 2 TMS TCK 3 4 TDO TDI 5 6 System reset RTCK 7 8 nTRST NC 9 10 NC NC 11 12 3.3V ETMTACECLKOUT 13 14 NC 12 TMS570LS31 HDK User Guide To GND thru 0 W 15 16 GND EMTTRACECTL 17 18 ETMDATA[19] ETMDATA[0] 19 20 ETMDATA[20] ETMDATA[1] 21 22 ETMDATA[21] ETMDATA[2] 23 24 ETMDATA[22] ETMDATA[3] 25 26 ETMDATA[23] ETMDATA[4] 27 28 ETMDATA[24] ETMDATA[5] 29 30 ETMDATA[25] ETMDATA[6] 31 32 ETMDATA[26] ETMDATA[7] 33 34 ETMDATA[27] ETMDATA[8] 35 36 ETMDATA[28] ETMDATA[9] 37 38 ETMDATA[29] ETMDATA[10] 39 40 ETMDATA[30] ETMDATA[11] 41 42 ETMDATA[31] ETMDATA[12] 43 44 NC ETMDATA[13] 45 46 NC ETMDATA[14] 47 48 NC ETMDATA[15] 49 50 NC ETMDATA[16] 51 52 NC ETMDATA[17] 53 54 NC ETMDATA[18] 55 56 NC GND 57 58 GND NC 59 60 NC 2.2.5 J7, XDS100V2 USB JTAG Interface The USB connector J7 is used to connect to the host development system which is running the software development IDE (CCS for example). The signals on this connector are shown in the table below. Table 7, J7, XDS100V2 USB JTAG Interface Pin # 1 2 13 Signal Name USBVDD D- TMS570LS31 HDK User Guide 3 4 5 D+ NC USBVSS Before the board is shipped, the FTDI port1 is configured as JTAG, and port2 is configured as SCI. The CPLD is also programmed to route FTDI JTAG to MCU JTAG. There is a circuitry to detect the external JTAG emulator. If a device is plugged onto the header J4 and J19, the DS1 LED will be turned on, and XDS100V2 JTAG is disabled. 2.2.6 P1, +5V~+12V Input Connector P1 is the input power connector. This connector brings in +12 volts to the HDK Board. This is a 2.5 mm jack. The figure below shows this connector as viewed from the card edge. Figure 6, +12 Volt Input Jack +12V P1 GND text text PC Board 2.2.7 SCI Interface The internal SCI on the TMS570LS3137 device is connected to the 2nd port of the FTDI chip. The FTDI USB driver makes the FT2232H 2nd channel appear as a virtual COM port (VCP). This allows the user to communicate with the USB interface via a standard PC serial emulation port. 2.2.8 Daughter Card Interface The HDK provides expansion connectors that can be used to accept plug-in daughter cards. The daughter card allows users to build on their EVM platform to extend its capabilities and provide customer and application specific I/O. The 14 TMS570LS31 HDK User Guide expansion connectors are for all major interfaces including asynchronous memory, peripherals, Flexray, and A/D expansion. There are three daughter card interfaces, J9, J10, and J11. These connectors are described in the table below. Table 8, Expansion Connector P2 (J10, Right, TopView) Signal Name Pin# No. Pin# Signal Name EXP_12V 1 2 GND EXP_12V 3 4 GND MibSPI1ENA G19 5 6 F18 MibSPI1CLK MibSPI1CS[1] F3 7 8 R2 MibSPI1CS[0] MibSPI1CS[3] J3 9 10 G3 MibSPI1CS[2] MibSPI1SIMO F19 11 12 G18 MibSPI1SOMI 13 14 GND GND MibSPI5ENA H18 15 16 H19 MibSPI5CLK MibSPI5CS[1] B6 17 18 E19 MibSPI5CS[0] MibSPI5CS[3] T12 19 20 W6 MibSPI5CS[2] MibSPI5SIMO[0] J19 21 22 MibSPI5SIMO[1] E16 23 24 E17 MibSPI5SOMI[1] MibSPI5SIMO[2] H17 25 26 H16 MibSPI5SOMI[2] MibSPI5SIMO[3] G17 27 28 G16 MibSPI5SOMI[3] 29 30 GND MibSPI5SOMI[0] GND AD1IN[1] V17 31 32 W14 AD1IN[0] AD1IN[3] T17 33 34 V18 AD1IN[2] AD1IN[5] R17 35 36 U18 AD1IN[4] AD1IN[7] V14 37 38 T19 AD1IN[6] 39 40 GND GND AD2IN[1] U13 41 42 V13 AD2IN[0] AD2IN[3] U16 43 44 U14 AD2IN[2] AD2IN[5] T15 45 46 U15 AD2IN[4] AD2IN[7] R16 47 48 R19 AD2IN[6] 49 50 AGND 15 GND TMS570LS31 HDK User Guide Signal Name Pin# Pin# Signal Name AD1IN[9] W17 51 52 P18 AD1IN[8] AD1IN[11] U19 53 54 U17 AD1IN[10] AD1IN[13] T18 55 56 T16 AD1IN[12] AD1IN[15] P19 57 58 R18 AD1IN[14] 59 60 GND No. POR_RSTn ADREFHI V15 61 62 V16 ADREFLO AD1EVT N19 63 64 V10 AD2EVT 65 66 EXP_12V GND Table 9, Expansion Connector P1 (J9, Left, TopView) Signal Name Pin# EXP_12V ECLK A12 RST No. Pin# Signal Name 1 2 GND 3 4 B14 ERRORn 5 6 M17 EMIF_CS[4] EMIF_ADDR[21] C17 7 8 C16 EMIF_ADDR[20] EMIF_ADDR[19] C15 9 10 D15 EMIF_ADDR[18] EMIF_ADDR[17] C14 11 12 D14 EMIF_ADDR[16] EMIF_ADDR[15] C13 13 14 C12 EMIF_ADDR[14] EMIF_ADDR[13] C11 15 16 C10 EMIF_ADDR[12] EMIF_ADDR[11] C9 17 18 C8 EMIF_ADDR[10] EMIF_ADDR[9] C7 19 20 C6 EMIF_ADDR[8] EMIF_ADDR[7] C5 21 22 C4 EMIF_ADDR[6] EMIF_ADDR[5] D9 23 24 D8 EMIF_ADDR[4] EMIF_ADDR[3] D7 25 26 D6 EMIF_ADDR[2] EMIF_ADDR[1] D5 27 28 D4 EMIF_ADDR[0] 29 30 GND GND EMIF_Wen D17 31 32 K17 EMIF_CS[3] EMIF_Oen D12 33 34 L17 EMIF_CS[2] EMIF_BA[1] D16 35 36 D11 EMIF_DQMn[1] EMIF_BA[0] D13 37 38 D10 EMIF_DQMn[0] 16 TMS570LS31 HDK User Guide Signal Name Pin# GND No. Pin# 39 40 Signal Name GND EMIFDATA[1] L16 41 42 K16 EMIFDATA[0] EMIFDATA[3] N16 43 44 M16 EMIFDATA[2] EMIFDATA[5] F4 45 46 E4 EMIFDATA[4] EMIFDATA[7] K4 47 48 G4 EMIFDATA[6] EMIFDATA[9] M4 49 50 L4 EMIFDATA[8] EMIFDATA[11] P4 51 52 N4 EMIFDATA[10] EMIFDATA[13] T6 53 54 T5 EMIFDATA[12] EMIFDATA[15] T8 55 56 T7 EMIFDATA[14] 57 58 GND GND SPI2_SOMI D2 59 60 P3 EMIF_nWAIT SPI2_SIMO D1 61 62 D3 SPI2_CS1 SPI2_CS0 N3 63 64 E2 SPI2_CLK 65 66 EXP_12V GND Table 10, Expansion Connector P3 (J11, Bottom One, TopView) Signal Name Pin# No. No. Pin# Signal Name EXP_12V 1 2 GND EXP_12V 3 4 GND LINRX A7 5 6 B7 LINTX CAN1RX B10 7 8 A10 CAN1TX CAN2RX H1 9 10 H2 CAN2TX CAN3RX M19 11 12 M18 CAN3TX FRAYRX1 A15 13 14 A8 FRAYRX2 FRAYTX1 B15 15 16 B8 FRAYTX2 FRAYTXEN1 B16 17 18 B9 FRAYTXEN2 GIOA[1] C2 19 20 A5 GIOA[0] GIOA[3] E1 21 22 C1 GIOA[2] GIOA[5] B5 23 24 A6 GIOA[4] GIOA[7] M1 25 26 H3 GIOA[6] 17 TMS570LS31 HDK User Guide Signal Name Pin# No. No. Pin# Signal Name GIOB[1] K2 27 28 M2 GIOB[0] GIOB[3] W10 29 30 F2 GIOB[2] GIOB[5] G2 31 32 G1 GIOB[4] GIOB[7] F1 33 34 J2 GIOB[6] 35 36 GND GND NHET1[1] V2 37 38 K18 NHET1[0] NHET1[3] U1 39 40 W5 NHET1[2] NHET1[5] V6 41 42 B12 NHET1[4] NHET1[7] T1 43 44 W3 NHET1[6] NHET1[9] V7 45 46 E18 NHET1[8] NHET1[11] E3 47 48 D19 NHET1[10] NHET1[13] N2 49 50 B4 NHET1[12] NHET1[15] N1 51 52 A11 NHET1[14] NHET1[17] A13 53 54 A4 NHET1[16] NHET1[19] B13 55 56 J1 NHET1[18] NHET1[21] H4 57 58 P2 NHET1[20] NHET1[23] J4 59 60 B3 NHET1[22] NHET1[25] M3 61 62 P1 NHET1[24] NHET1[27] A9 63 64 A14 NHET1[26] NHET1[29] A3 65 66 K19 NHET1[28] NHET1[31] J17 67 68 B11 NHET1[30] 69 70 GND GND MibSPI3CS[3] C3 71 72 B2 MibSPI3CS[2] MibSPI3SIMO W8 73 74 V8 MibSPI3SOMI MibSPI3CS[1] V5 75 76 V10 MibSPI3CS[0] MibSPI3ENA W9 77 78 V9 MibSPI3CLK 79 80 EXP_12V 18 GND TMS570LS31 HDK User Guide 2.3 LEDs The TMS570LS31 HDK board has nineteen (19) LEDs. Eight of these LEDs (Table 13, and Table 14) are under user control. Those LEDs are controlled and programmed by NHET signals. LED DS2, DS3, DS4, and DS5 indicate the presence of the power (+1.2V, +5V, 3.3V, and 12V) s on the board. The LED functions are summarized in the tables below. Table 11, Demo LEDs LED# Location Signals Color D3 Left Top NHET1[17] White D4 Top NHET1[31] White D5 Right Top NHET1[0] White D6 Right Bottom NHET1[25] White D7 Bottom NHET1[18] White D8 Left bottom NHET1[29] White LED1 Left NHET1[27] White LED2 Right NHET1[05] White Table 12, Other LEDs as Indicator Num LED Color D1 nERROR RED D10 XDS100V2 SCI RX Blue D11 XDS100V2 SCI TX Blue D12 XDS100V2 PWRENn Blue D2 JTAG TDI Blue D9 Ethernet Speed Blue DS1 ARM JTAG Plugin Blue DS2 VCC_1V2 Blue DS3 VCC_5V Blue DS4 VCC_3V3 Blue 19 DCAN2 TMS570LS31 HDK User Guide DS5 VCC_12V Blue 2.4 DIP Switch There is one 4-position DIP switch located on the left-bottom corner at reference designator S2. By default, all of the switch channel are set to the “OFF” position. Figure 7, DIP Switch Settings 1 2 1 2 3 4 3 4 The S2 DIP switch is reserved for user application general purpose. Table 2.1 describes the function of each channel on S2. S2:[3:1] are not used on this board since TMS570LS31 doesn’t support USB features. Table 13, S2 DIP Switch Functions Switch OFF Position ON Position S2:1* N/A N/A S2:2** N/A N/A S2:3** N/A N/A S2:4*** Ethernet Disabled Ethernet Enabled *Note: S2:1/2/3 are not used ***Note: To use Ethernet, S2:4 should be enabled and all other have to be disabled. 2.5 Jumpers HDK board has two (2) jumpers which are used to enable/disable SDRAM and select 5V or 3.3V ADC. Table 14, Jumpers Jumper # Off J8 5V ADC J13 SDRAM on 20 On 3.3V ADC SDRAM Off TMS570LS31 HDK User Guide 2.6 S4, Power-On Reset Switch TMS570LS3137 MCU has two resets: Warm Reset (RSTn) and Power-On Reset (PORRSTn). Switch S4 is a momentary switch that asserts power on reset to the TMS570LS3137 device. The POR condition is intended to reset all logic on the device including the test/emulation circuitry. 2.7 S3, System Reset Switch Switch S3 to assert a warm reset the TMS570LS3137 device. Warm reset does not reset any test or emulation logic. The reset signal from window watchdog will also assert a warm reset to MCU. The warm reset can be invoked by pushing nRST button, or by RESET signals from XDS100 CPLD, ARM JTAG SREST. 21 TMS570LS31 HDK User Guide Appendix A Operation Notices The user assumes all responsibility and liability for proper and safe handling of the boards. It is the user's responsibility to take any and all appropriate precautions with regard to electrostatic discharge. 1 Support Resources 1. If you have problems or need additional information regarding the embedded emulation please refer to the XDS100 USB wiki on the TI web site. The URL for this site is: http://tiexpressdsp.com/index.php?title=XDS100 2. Code Composer Studio support is available via a forum at: http://community.ti.com/forums/138.aspx 22 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated