Preliminary Specification Number : SP-ZZVK-C W-LAN Module Data Sheet 802.11b/g module Product Part Number: LBWA1ZZVK7-539 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-ZZVK-C P. 1/23 Revision History Revision Code - 2011/11/29 A 2012/03/02 B 2012/03/30 Date Description First Issue Updated: 5. Operating Condition - Operating Temperature Range - Specification Temperature Range - Supply Voltage Range Update: 5. Operating Condition Remove Specification Temperature Range Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Comments Preliminary Specification Number: SP-ZZVK-C P. 2/23 Notice for Murata Wireless Modules. Please read the specification including NOTICE (Page20), PRECONDITION TO USE OUR PRODUCTS (Page23) and Disclaimer (Page24) in this datasheet before using the Murata Wireless Modules. TABLE OF CONTENTS Module Features ............................................................................................................................... 3 Scope............................................................................................................................................. 4 Part Number .................................................................................................................................. 4 Block Diagram ............................................................................................................................... 4 Dimensions and Terminal Configurations...................................................................................... 5 Rating ............................................................................................................................................ 8 Operating Condition....................................................................................................................... 8 Input/Output Terminal Characteristic............................................................................................. 8 WLAN Power Up/Down Sequence................................................................................................ 9 8.1 Power Up Sequence .............................................................................................................. 9 9. HOST Interface............................................................................................................................ 10 9.1 Host interface: SPI ............................................................................................................... 10 9.2.1 SPI Clock Switching Characteristic .............................................................................. 10 9.2.2 SPI Data Switching Characteristic.................................................................................11 10. Electrical Characteristics ......................................................................................................... 12 10.1 DC/RF Characteristics for IEEE802.11b .............................................................................. 12 10.2 DC/RF Characteristics for IEEE802.11g .............................................................................. 13 11. Land pattern ............................................................................................................................. 14 12. Reference Circuit ..................................................................................................................... 15 13. Evaluation board of LBWA1ZZVK7-TEMP .............................................................................. 16 14. Tape and Reel Packing............................................................................................................ 17 NOTICE........................................................................................................................................... 20 PRECONDITION TO USE OUR PRODUCTS................................................................................ 23 Disclaimer........................................................................................................................................ 24 1. 2. 3. 4. 5. 6. 7. 8. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Murata products and disclaimers thereto appears at the end of this specification sheet. Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-ZZVK-C P. 3/23 Module Features Murata LBWA1ZZVK7 module integrates WLAN function. WLAN: IEEE 802.11 b, g, compliant. Typical WLAN Transmit Power (typical): +19.5dBm at 11Mbps, CCK (11b) +15.0dBm at 54Mbps, OFDM (11g) Typical WLAN Sensitivity (typical): -88dBm at 8% PER, 11Mbps -74dBm at 10% PER, 54Mbps Module size: 16.5x11.5mm typical. Module height: 2.2mm max. FCC (USA) and IC (Canada) Certification will be supported with mono-pole type antenna. Murata LBWA1ZZVK7 module consists of the following components - Texas Instruments CC3000 SoC – WLAN baseband and RF converter - Clock sources – Both Fast Clock and Slow Clock are integrated. - Front End Module – A combination of PA and a switch - Band Pass Filter – Filtering out of band noise and interference - EEPROM – A non volatile memory - Power FET switch – minimizing leakage current in shutdown mode. The switching mode power source provides 3.3V supply for the CC3000 from either battery or MCU the board. - Level Shifter – Supporting 1.8V and 3.3V Host Interface. Seamless integration with several Texas Instruments MSP430 and Stellaris processors SPI host interface for WLAN RoHS: This module is compliant with the RoHS directive. Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-ZZVK-C P. 4/23 1. Scope This specification is applied to the IEEE802.11 b/g WLAN module. Host Interface - W-LAN : SPI IC/Firmware - W-LAN BB/MAC - FEM for CC3000 : CC3000 : TriQuint TQM679002A (E2.6) Reference Clock Sleep Clock Weight MSL RoHS : 26MHz Reference Clock is integrated. : 32.768kHz oscillator is integrated. : T.B.D (mg) : Level3 : This module is compliant with the RoHS directive. 2. Part Number Part Number LBWA1ZZVK7-539 3. Block Diagram X’tal Osc. (26MHz) CC3000 (RF/BB/MAC) Sleep CLK RF Front End LDO 2.4GHz Level Shifter SPI BPF LDO EEPROM DC-DC Converter FET VBAT ENABLE Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-ZZVK-C P. 5/23 4. Dimensions and Terminal Configurations <Top View> <Side View> L <Bottom View> c1 T a1 c3 a3 c2 a2 b4 b1 b2 e1 b3 Mark L a1 b1 b4 c1 e1 e4 Dimensions 16.5 +/- 0.2 0.6 +/- 0.1 0.3 +/- 0.2 0.3 +/- 0.2 1.0 +/- 0.1 1.0 +/- 0.1 1.5 +/- 0.1 Mark W a2 b2 b5 c2 e2 - Dimensions 11.5 +/- 0.2 0.6 +/- 0.1 0.45 +/- 0.200 1.95 +/- 0.20 1.0 +/- 0.1 1.6 +/- 0.1 - e2 Mark T a3 b3 b6 c3 e3 - Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. (unit: mm) Dimensions 2.20 Max 0.6 +/- 0.1 3.15 +/- 0.200 3.0 +/- 0.2 1.0 +/- 0.1 1.0 +/- 0.1 - b6 b5 e3 e4 W Preliminary Specification Number: SP-ZZVK-C P. 6/23 Terminal configuration <Top View> Connection to IC Terminal No. Terminal Name Type Power System 1 GND - - - - - 2 ENABLE I - - FET FET 3 GND - - - 4 VBAT I - - 5 6 7 8 GND GND GND GND - - - 9 WL_RS232_RX I/O 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 WL_RS232_TX WL_EN1 UART_DBG WL_EN2 GND GND GND GND SPI_CLK SPI_DI GND SPI_CS SPI_DO SPI_IRQ GND GND GND FUNC5/NC I/O I IO IO IO IO IO IO WLAN - WLAN WLAN WLAN WLAN WLAN WLAN WLAN WLAN - FET LDO Level Shift er 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 FET LDO Level Shifter RS232_Rx RS232_Tx WL_EN WL_UART_DBG BT_EN SPI_CLK SPI_DIN SPI_CS SPI_DOUT SPI_IRQ NC Description Ground Module Enable Power Supply Input Ground Power Supply Input Ground Ground Ground Ground Connect to FUNC2 pin with 2kohm resister. RS232_Tx Connect to WL_EN2 Logger Connect to WL_EN1 Ground Ground Ground Ground SPI Clock from the host SPI Data-in from the host Ground SPI Chip select SPI Data-out from the host SPI Interrupt Request Ground Ground Ground NC Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-ZZVK-C P. 7/23 I2C to EEPROM 3000 SCL Connect to SCL_EEPROM pin I2C to EEPROM 3000 SDA Connect to SDA_EEPROM pin 28 SCL - - 29 SDA - - 30 NS_URAT_DBG 31 FUNC4 IO - - 3000 NS_UARTD 32 FUNC2 IO - - 3000 FUNC2 33 34 GND GND - - - - 35 SDA_EEPROM - - - 36 SCL_EEPROM - - - 37 38 39 40 41 42 43 GND GND GND GND GND GND GND - - - Mem ory Mem ory 3000 - - - - - - 44 2.4G_ANT I/O - WLAN - - RF transmitter output and RF receiver input 45 46 47 48 49 ~ 76 GND GND GND GND - - - - - Ground Ground Ground Ground GND - - - - - Ground Networking subsystem UART Debug line Connect to WL_RS232_RX pin with 2kohm resister. Ground Ground EEPROM Connect to SDA pin EEPROM Connect to SCL pin NC (D) - NC Ground Ground Ground Ground Ground Ground Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-ZZVK-C P. 8/23 5. Rating Parameter Storage Temperature VBAT Supply Voltage ENABLE min. -40 -0.5 -0.5 max 85 4.5 4.5 unit deg.C V V 6. Operating Condition Parameter Operating Temperature Range VBAT Supply ENABLE(ON State) Voltage ENABLE (OFF State) min. -20 2.7 1.5 0 typ. +25 3.3 3.3 - max +70 3.6 VBAT 0.3 unit deg.C V V V 7. Input/Output Terminal Characteristic VIH：High-level input voltage VIL：Low-level input voltage VOH：High-level output voltage VOL：Low-level output voltage min. max unit 2.0 VBAT 0 0.8 VBAT V V V V Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-ZZVK-C P. 9/23 8. WLAN Power Up/Down Sequence 8.1 Power Up Sequence The following sequence describes device powerup from shutdown. ENABLE starts the initialization sequence, and subsequent events are automatic. Power up requirements: 1. No signals are allowed on the IO pins if no IO power supplied, because the IOs are not 'failsafe'. Exceptions are SLOWCLK, XTALP and which are failsafe and can tolerate external voltages with no VDDS and DC2DC. 2. VBAT , VIO, and SLOWCLK must be stable before releasing EN. The LBWA1ZZVK7 module should activate the power on with only one control enable line from the MCU. Below is the wake up sequence. WL_EN1/WL_EN2 8.2 Power Down Sequence WL_EN1/WL_EN2 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-ZZVK-C P. 10/23 9. HOST Interface 9.1 Host interface: SPI 9.2 SPI Interface timing 9.2.1 SPI Clock Switching Characteristic fclock DC tWL tWH tTLH tTHL tISU tIH tODLY1 tODLY2 PARAMETER Clock frequency,CLK Low/High duty cycle Pulse duration, CLK low Pulse duration, CLK high Rise time, CLK Fall time, CLK Setup time, input valid before CLK↑ Hold time, input valid after CLK↑ Delay time, CLK↓ to output valid Delay time, CLK↓ to output invalid CL CL CL CL CL CL CL CL CL CL ≦10pF ≦10pF ≦10pF ≦10pF ≦10pF ≦10pF ≦10pF ≦10pF ≦10pF ≦10pF MIN 0 40 5 5 MAX 48 60 4.3 3.5 5 5 4 5 SPI Timing Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. 15 15 UNIT MHｚ % ns ns ns ns ns ns ns ns Preliminary Specification Number: SP-ZZVK-C P. 11/23 9.2.2 SPI Data Switching Characteristic SPI Inter face read SPI Inter face write Parameter tCS Delay time,CS↓to DIN read/write command valid tCR Delay time, DIN read command invalid to DOUT/DIN card reponse valid tbusy tEC Fixed busy delay till DOUT data valid Delay time, DOUT data invalid to CS↑ tDB Data Block Size MIN MAX 0 1 1 7 0 1 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Unit 16 Clock Cycle 16 Clock Cycle 32 Clock Cycle 16 Clock Cycle 32 Clock Cycle Preliminary Specification Number: SP-ZZVK-C P. 12/23 10. Electrical Characteristics 10.1 DC/RF Characteristics for IEEE802.11b 11Mbps mode unless otherwise specified. 25deg.C, VBAT=3.6V, ENABLE=1.8V Items Contents Specification IEEE802.11b Mode DSSS / CCK Frequency 2400 - 2500MHz Data rate 1, 2, 5.5, 11Mbps - DC Characteristics min. typ. 1. DC current 1) Tx mode 292 2) Rx mode 92 - Tx Characteristics min. typ. 2. Power Levels +19.5 3. Spectrum Mask 1) 1st side lobes 2) 2nd side lobes 4. Power-on and Power-down ramp 5. RF Carrier Suppression 15 6. Modulation Accuracy (EVM) - Rx Characteristics min. typ. 7. Minimum Input Level Sensitivity 1) 11Mbps (FER < 8%) 8. Maximum Input Level (FER < 8%) -10 0 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. max. max. unit mA mA unit dBm -30 -50 2 35 max. dBr dBr μsec dB % unit -76 - dBm dBm Preliminary Specification Number: SP-ZZVK-C P. 13/23 10.2 DC/RF Characteristics for IEEE802.11g 54Mbps mode unless otherwise specified. 25deg.C, VBAT=3.6V, ENABLE =1.8V Items Contents Specification IEEE802.11g Mode OFDM Frequency 2400 - 2483.5MHz Data rate 6, 9, 12, 18, 24, 36, 48, 54Mbps - DC Characteristics min. typ. max. 1. DC current 1) Tx mode 180 2) Rx mode 92 - Tx Characteristics min. typ. max. 2. Power Levels +15 3. Spectrum Mask 1) at fc +/- 11MHz -20 1) at fc +/- 20MHz -28 1) at fc +/- 30MHz -40 4. Spurious Emissions 1) 30MHz to 1GHz -36 2) 1GHz to 12.75GHz -30 3) 1.8GHz to 1.9GHz -47 4) 5.15GHz to 5.3GHz -47 5. Constellation Error (EVM) -25 - Rx Characteristics min. typ. max. 6. Minimum Input Level Sensitivity 1) 54Mbps (PER < 10%) -65 7. Maximum Input Level (PER < 10%) -20 - Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. unit mA mA unit dBm dBr dBr dBr dBm dBm dBm dBm dB unit dBm dBm Preliminary Specification Number: SP-ZZVK-C P. 14/23 11. Land pattern 7.8 7.2 6 .8 6.2 5.8 5.2 4.8 4.2 3.8 3.2 2.8 2.2 1.8 1.2 3.8 2.8 3.2 0.2 0.8 2.2 1.2 1.8 0.2 5 4.45 2.75 1.75 5.75 1.2 5 0.8 0.2 0 .3 1.3 1 .9 2.9 3.5 4.5 5.1 6.95 8.25 (unit : mm) Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-ZZVK-C P. 15/23 12. Reference Circuit Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-ZZVK-C P. 16/23 13. Evaluation board of LBWA1ZZVK7-TEMP LBWA1ZZVK7-TEMP Evaluation Module board (EM board) enables a pre-defined interface and form factor solution for compatibility with other TI microcontroller development boards such as MSP430 Experimenter’s board and Stellaris LM3S9B96-DK. The LBWA1ZZVK7 Module and EM board will communicate over the SPI interface through the 20pin connector. Evaluation Module board (EM board ) Part Number LBWA1ZZVK7-TEMP-D Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-ZZVK-C P. 17/23 14. Tape and Reel Packing (1) Dimensions of Tape (Plastic tape) (unit : mm) (2) Dimensions of Reel Label R80 120 φ13±0.2 5 φ 80±1 R5 10 22 φ330±2 R135 φ W1 W2 Reel inside width W1: 25.5±1.0 Reel outside width W2: 29.5±1.0 Unit: mm Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-ZZVK-C P. 18/23 (3) Taping Diagrams [1] Feeding Hole : As specified in (1) [2] Hole for chip : As specified in (1) [3] Cover tape : 62μm in thickness [4] Base tape : As specified in (1) [3] [1] [2] [3] [4] Feeding Hole Feeding Direction Chip (4) Leader and Tail tape Feeding direction Tail tape (No components) 40 to 200mm Components No components Leader tape (Cover tape alone) 150mm min. 250mm min. Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-ZZVK-C P. 19/23 (5) The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. (6) The cover tape and base tape are not adhered at no components area for 250mm min. (7) Tear off strength against pulling of cover tape : 5N min. (8) Packaging unit : 500pcs./ reel (9) material : Base tape : Plastic Real : Plastic Cover tape, cavity tape and reel are made the anti-static processing. (10) Peeling of force : 0.7N max. in the direction of peeling as shown below. 0.7 N max. 165 to 180 ° Cover tape Base tape (11) Packaging (Humidity proof Packing) Label 表示ラべル Desiccant 乾燥剤 Humidity 湿度 Indicator インジケ−タ 表示ラベル Label 防湿梱包袋 Anti-humidity Plastic Bag Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity indicator. Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-ZZVK-A P.20/25 NOTICE Storage Conditions: Please use this product within 6month after receipt. - The product shall be stored without opening the packing under the ambient temperature from 5 to 35deg.C and humidity from 20 to 70%RH. (Packing materials, in particular, may be deformed at the temperature over 40deg.C.) - The product left more than 6months after reception, it needs to be confirmed the solderbility before used. - The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.). - Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping the product, shall not be applied in order not to damage the packing materials. This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020) - After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product shall be used within 168hours. - When the color of the indicator in the packing changed, the product shall be baked before soldering. Baking condition : 125 +5/-0deg.C, 24hours, 1time The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and Cover Tape) are not heat-resistant. Handling Conditions : Be careful in handling or transporting products because excessive stress or mechanical shock may break products. Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change. Do not touch products with bear hands that may result in poor solderability and destroy by static electrical charge. Standard PCB Design (Land Pattern and Dimensions) : All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions. The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand. Notice for Chip Placer : When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products. Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-ZZVK-A P.21/25 Soldering Conditions : The recommendation conditions of soldering are as in the following figure. When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Set up the highest temperature of reflow within 270 ℃. Contact Murata before use if concerning other soldering conditions. Reflow soldering standard conditions(Example) Within 3s 240 to 250 deg.C 220 deg.C Cooling down Slowly 180 deg.C 150 deg.C Pre-heating Within 120s Within 60s time(s) Please use the reflow within 2 times. Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less. Cleaning: Since this Product is Moisture Sensitive, any cleaning is not permitted. Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-ZZVK-A P.22/25 Operational Environment Conditions: Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur. - In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.). - In an atmosphere containing combustible and volatile gases. - Dusty place. - Direct sunlight place. - Water splashing place. - Humid place where water condenses. - Freezing place. If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. As it might be a cause of degradation or destruction to apply static electricity to products, do not apply static electricity or excessive voltage while assembling and measuring. Input Power Capacity: Products shall be used in the input power capacity as specified in this specifications. Inform Murata beforehand, in case that the components are used beyond such input power capacity range. Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-ZZVK-A P.23/25 PRECONDITION TO USE OUR PRODUCTS PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS. Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is mounted to your product. All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our product is used for the purpose, under the condition and in the environment specified in this specification. You are requested not to use our product deviating from the condition and the environment specified in this specification. Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this specification. WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. The product shall not be used in any application listed below which requires especially high reliability for the prevention of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if you use our products in such applications, we will not be responsible for any failure to meet such requirements. Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS, DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS. - Aircraft equipment. - Aerospace equipment - Undersea equipment. - Power plant control equipment - Medical equipment. - Transportation equipment (vehicles, trains, ships, elevator, etc.). - Traffic signal equipment. - Disaster prevention / crime prevention equipment. -Burning / explosion control equipment - Application of similar complexity and/ or reliability requirements to the applications listed in the above. We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and reproducing our product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by the regulations and laws in the world. We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright, mask work right, or our other intellectual property right relating to any combination, machine, or process in which our products or services are used. Information provided by us regarding third-party products or services does not constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from us under our patents or other intellectual property. Please do not use our products, our technical information and other data provided by us for the purpose of developing of mass-destruction weapons and the purpose of military use. Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations", etc. Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials and/or components from our suppliers. By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your company and that you understand and accept the validity of the contents herein. When you are not able to return the signed version of specification sheet or approval sheet within 30 days from receiving date of specification sheet or approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. Customer acknowledges that engineering samples may deviate from specifications and may contain defects due to their development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability for damages caused by - the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the product to be sold by you, -deviation or lapse in function of engineering sample, -improper use of engineering samples. We disclaim any liability for consequential and incidental damages. If you can’t agree the above contents, you should inquire our sales. Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-ZZVK-A P.24/25 Disclaimer Please read this notice before using the Murata Wireless Modules. Please note that the only warranty that Murata Manufacturing Co., Ltd. (“MURATA”) provides regarding our products including but not limited to hardware, software and other materials provided by MURATA (“PRODUCTS”) is its conformance to the specifications provided herein. Accordingly, MURATA shall not be responsible for any defects in the PRODUCTS or equipment incorporating the PRODUCTS, which are caused under the conditions other than those specified in this specification. MURATA HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT the PRODUCTS ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. YOU AGREE TO INDEMNIFY AND DEFEND MURATA AND ITS AFFILIATES AGAINST ALL CLAIMS, DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF THE PRODUCTS. The PRODUCTS is designed and manufactured for general consumer applications, and not for any particular application, so testing and use of the PRODUCTS shall be conducted at your own risk and responsibility. Specifically, please observe the following: i) Please conduct validation and verification of the PRODUCTS in actual condition of mounting and operating environment before commercial shipment of the equipment. ii) Please pay attention to minimize any mechanical vibration or shock, not to drop the PRODUCTS or a substrate that contains the PRODUCTS during transportation. iii) Since the application of static electricity or overvoltage may cause defect in the PRODUCTS or deterioration of its reliability, caution must be taken against exposure to any static electricity generated by electrified items such as work benches, soldering irons, tools, carrying containers, etc. iv) Caution shall be taken to avoid overstress to the PRODUCTS during and after the soldering process. v) Since the applied soldering method may deteriorate the reliability, thorough evaluation is recommended. vi) In case the PRODUCTS is to be used in equipment or electric circuit that requires high safety or reliability function or performances, sufficient reliability evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to install a protective circuit is strongly recommended at customer's design stage. Please provide and appropriate fail-safe function on your product to prevent any damages that may be caused by the abnormal function or the failure of the PRODUCTS. Notwithstanding the foregoing, the PRODUCTS shall not be used in any application listed below which requires especially high reliability for the prevention of such defect as may directly cause damage to the third party's life, body or property. - Aircraft equipment. - Aerospace equipment - Undersea equipment. - Power plant control equipment - Medical equipment. - Transportation equipment (vehicles, trains, ships, etc.). - Traffic signal equipment. - Disaster prevention / crime prevention equipment. - Data-processing equipment - Application of similar complexity and/ or reliability requirements to the applications listed in the above. Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-ZZVK-A P.25/25 MURATA’s warranty as provided in Clause 1 above that the PRODUCTS comply with descriptions expressly specified in the specifications shall be effective for a period of six (6) months from the date of delivery. MURATA shall not be liable for any defects that occur in dry packed products that are installed more than six (6) months after shipment. MURATA’s liability under this warranty shall be limited to the PRODUCTS that are returned during the warranty period to the address designated by MURATA and that are determined by MURATA not to conform to such warranty. If MURATA elects to repair or replace the PRODUCTS, MURATA shall have reasonable time to repair the PRODUCTS or provide replacements. Repaired PRODUCTS shall be warranted for the remainder of the original warranty period. Replaced PRODUCTS shall be warranted for a new full warranty period. For avoidance of doubt, MURATA shall not be liable for any defects that are caused by neglect, misuse or mistreatment by an entity other than MURATA including improper installation or testing, or for any PRODUCTS that have been altered or modified in any way by an entity other than MURATA. Moreover, MURATA shall not be liable for any defects that result from your or third party’s design, specifications or instructions for the PRODUCTS. Testing and other quality control techniques are used to the extent MURATA deems necessary. Unless mandated by government requirements, MURATA does not necessarily test all parameters of each of the PRODUCTS. EOL Please note that we may discontinue the manufacture of the PRODUCTS, due to reasons such as end of supply of materials and/or components from our suppliers. Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd.