PC8110xNSZ0F Series PC8110xNSZ0F Series DIP 4pin High Speed under High Load Resistance Photocoupler ■ Description ■ Agency approvals/Compliance PC8110xNSZ0F Series contains an IRED optically coupled to a phototransistor built-in schottky barrier diode. It is packaged in a 4-pin DIP, and SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0kV. CTR is 50% to 400% at input current of 5mA. 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC8110) 2. Package resin : UL flammability grade (94V-0) ■ Applications 1. Home appliances ■ Features 1. 4pin DIP package 2. Double transfer mold package (Ideal for Flow Soldering) 3. High speed response at turn-off time due to built-in schottky barrier diode (at saturation mode) 4. High isolation voltage between input and output (Viso(rms) : 5kV) 5. Lead-free and RoHS directive compliant Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A03802EN Date Jun. 30. 2005 © SHARP Corporation PC8110xNSZ0F Series ■ Internal Connection Diagram Schottky barrier diode 1 1 4 2 3 3 4 5 Anode Cathode Emitter Collector ■ Outline Dimensions (Unit : mm) 2. SMT Gullwing Lead-Form [ex. PC8110xNIZ0F] Anode mark Rank mark Factory identification mark 4.58±0.5 0.26 ±0.1 3.0±0.5 2.7±0.5 0.26±0.1 θ 3 4.58±0.5 7.62±0.3 3.5±0.5 7.62±0.3 Epoxy resin 8 1 1 0 6.5±0.5 0.5TYP. 6.5±0.5 2 2.54±0.25 3 4 1.0+0.4 −0 0.5±0.1 Epoxy resin 1.0+0.4 −0 3.5±0.5 8 1 1 0 2 Date code 1 0.35±0.25 4 1 4.58±0.5 Date code 0.6±0.2 1.2±0.3 Factory identification mark 0.6±0.2 1.2±0.3 Anode mark 4.58±0.3 Rank mark 2.54±0.25 1. Through-Hole [ex. PC8110xNSZ0F] 2.54±0.25 10.0+0 −0.5 θ θ : 0 to 13˚ Product mass : approx. 0.23g Product mass : approx. 0.22g Plating material : SnCu (Cu : TYP. 2%) Sheet No.: D2-A03802EN 2 PC8110xNSZ0F Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M ·· N · 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D Mark P R S T U V W X A B C ·· · repeats in a 20 year cycle Factory identification mark Factory identification Mark Country of origin no mark Japan Indonesia China * This factory marking is for identification purpose only. Please contact the local SHARP sales representative to see the actural status of the production. Rank mark Refer to the Model Line-up table Sheet No.: D2-A03802EN 3 PC8110xNSZ0F Series ■ Absolute Maximum Ratings Output Input Parameter Symbol Forward current IF *1 Peak forward current IFM Reverse voltage VR Power dissipation P Collector-emitter voltage VCEO Emitter-collector voltage VECO IC Collector current Collector power dissipation PC Ptot Total power dissipation *2 Isolation voltage Viso (rms) Topr Operating temperature Tstg Storage temperature *3 Soldering temperature Tsol Rating 50 1.0 6 70 70 0.1 30 150 200 5.0 −30 to +100 −55 to +125 260 (Ta=25˚C) Unit mA A V mW V V mA mW mW kV ˚C ˚C ˚C *1 Pulse width≤100µs, Duty ratio : 0.001 *2 40 to 60%RH, AC for 1 minute, f=60Hz *3 For 10s ■ Electro-optical Characteristics Output Transfer characteristics Response time Input Parameter Symbol Forward voltage VF Peak forward voltage VFM IR Reverse Current Ct Terminal capacitance ICEO Collector dark current *4 Collector-emitter breakdown voltage BVCEO Collector current IC Collector-emitter saturation voltage VCE (sat) Isolation resistance RISO Floating capacitance Cf Rise time tr Not saturated Fall time tf Turn-on time ton Saturated 1 Storage time ts Turn-off time toff Turn-on time ton Saturated 2 Storage time ts Turn-off time toff Conditions IF=20mA IFM=0.5A VR=4V V=0, f=1kHz VCE=50V, IF=0 IC=0.1mA, IF=0 IF=5mA, VCE=5V IF=20mA, IC=1mA DC500V, 40 to 60%RH V=0, f=1MHz VCE=2V, IC=2mA, RL=100Ω VCC=5V, IC=20mA, RL=10kΩ VCC=5V, IC=20mA, RL=100kΩ MIN. − − − − − 70 2.5 − 5×1010 − − − − − − − − − TYP. 1.2 − − 30 − − − 0.15 1011 0.6 3 2 2 9 23 3 10 27 MAX. 1.4 3.0 10 250 100 − 20 0.35 − 1.0 20 10 13 50 90 13 50 100 (Ta=25˚C) Unit V V µA pF nA V mA V Ω pF µs *4 The collector-emitter voltage has negative resistance characteristics since this device has built-in base-emitter resistor. Therefore, please be careful not to provide the voltage that goes beyond absolute maximum ratings. Sheet No.: D2-A03802EN 4 PC8110xNSZ0F Series ■ Model Line-up Through-Hole 100pcs/sleeve PC81100NSZ0F PC81101NSZ0F PC81102NSZ0F Model No. PC81103NSZ0F PC81105NSZ0F PC81106NSZ0F PC81108NSZ0F Lead Form Package SMT Gullwing 2000pcs/reel 100pcs/sleeve PC81100NIZ0F PC81100NIP0F PC81101NIZ0F PC81101NIP0F PC81102NIZ0F PC81102NIP0F PC81103NIZ0F PC81103NIP0F PC81105NIZ0F PC81105NIP0F PC81106NIZ0F PC81106NIP0F PC81108NIZ0F PC81108NIP0F Rank mark IC [mA] (IF=5mA, VCE=5V, Ta=25˚C) with or without A B C A or B B or C A, B or C 2.5 to 20.0 3.0 to 6.0 5.0 to 10.0 7.5 to 15.0 3.0 to 10.0 5.0 to 15.0 3.0 to 15.0 Please contact a local SHARP sales representative to inquire about production status. Sheet No.: D2-A03802EN 5 PC8110xNSZ0F Series Fig.2 Diode Power Dissipation vs. Ambient Temperature Fig.1 Forward Current vs. Ambient Temperature 100 Diode power dissipation P (mW) Forward current IF (mA) 50 40 30 20 10 0 −30 0 25 50 55 75 100 80 70 60 40 20 0 −30 125 Fig.3 Collector Power Dissipation vs. Ambient Temperature Total Power dissipation Ptot (mW) Collector power dissipation PC (mW) 50 55 75 100 125 250 200 150 100 50 0 −30 0 25 50 75 100 200 150 100 50 0 −30 125 Fig.5 Peak Forward Current vs. Duty Ratio Forward current IF (mA) 10−2 10−1 50 75 100 125 100 100 10−3 25 Fig.6 Forward Current vs. Forward Voltage Pulse width≤100µs Ta=25˚C 1 000 0 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) Peak forward current IFM (mA) 25 Fig.4 Total Power Dissipation vs. Ambient Temperature 250 10 0 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) Ta=100˚C Ta=25˚C Ta=75˚C Ta=0˚C Ta=50˚C Ta=−25˚C 10 1 1 0 Duty ratio 1 2 3 Forward voltage VF (V) Sheet No.: D2-A03802EN 6 PC8110xNSZ0F Series Fig.7 Current Transfer Ratio vs. Forward Current Fig.8 Collector Current vs. Collector-emitter Voltage 30 200 180 25 160 Collector current IC (mA) Current transfer ratio CTR (%) PC (MAX.) VCE=5V Ta=25˚C 140 120 100 80 60 40 IF=30mA 20 IF=20mA 15 IF=10mA 10 IF=5mA 5 IF=3mA 20 0 0 1 10 0 100 Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature VCE=5V IF=5mA 120 100 80 60 40 20 0 −30 −20 −10 0 10 20 30 40 50 60 70 80 90 100 6 8 10 0.2 IF=20mA IC=1mA 0.18 0.16 0.14 0.12 0.1 0.08 0.06 0.04 0.02 0 −30 −20 −10 0 10 20 30 40 50 60 70 80 90 100 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) Fig.12 Response Time vs. Load Resistance (saturation region) Fig.11 Collector Dark Current vs. Ambient Temperature 100 VCE=50V 10−6 toff 10−7 Response time (µs) Collector dark current ICEO (A) 4 Fig.10 Collector - emitter Saturation Voltage vs. Ambient Temperature Collector-emitter saturation voltage VCE (sat) (V) Relative current transfer ratio (%) 140 2 Collector-emitter voltage VCE (V) Forward current IF (mA) 10−5 Ta=25˚C 10−8 10−9 ts 10 ton 1 10−10 10−11 −30 −20 −10 0 10 20 30 40 50 60 70 80 90 100 VCC=5V IF=20mA Ta=25˚C 0.1 1 10 100 Load resistance RL (kΩ) Ambient temperature Ta (˚C) Sheet No.: D2-A03802EN 7 PC8110xNSZ0F Series Fig.14 Test Circuit for Response Time Fig.13 Response Time vs. Load Resistance (active region) 100 VCE=2V IC=2mA Ta=25˚C VCC tr RL Response time (µs) RD tf 10 Output Input Output Input 10% VCE td ts ts tf td tr 1 90% Please refer to the conditions in Fig.12 and Fig.13 0.1 0.1 1 10 Load resistance RL (kΩ) Fig.15 Frequency Response Fig.16 Collector-emitter Saturation Voltage vs. Forward Current Collector-emitter saturation voltage VCE (sat) (V) 5 Voltage gain AV (dB) 0 RL=10kΩ −5 1kΩ −10 100Ω −15 −20 −25 0.1 VCE=2V IC=2mA Ta=25˚C 1 10 100 5 IC=7mA 4 IC=3mA IC=1mA 3 IC=0.5mA 2 1 0 0 1 000 Ta=25˚C IC=5mA 5 10 15 Forward current IF (mA) Frequency response f (kHz) Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D2-A03802EN 8 PC8110xNSZ0F Series ■ Design Considerations ● Design guide While operating at IF<5.0mA, CTR variation may increase. Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. The collector-emitter voltage has negative resistance characteristics since this device has built-in base-emitter resistor. Therefore, please be careful not to provide the voltage that goes beyond absolute maximum ratings. ● Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration. ● Recommended Foot Print (reference) 1.7 2.54 8.2 2.2 (Unit : mm) ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A03802EN 9 PC8110xNSZ0F Series ■ Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ( package surface : 250˚C peak) 200 Reflow 220˚C or more, 60s or less Preheat 150 to 180˚C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400˚C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A03802EN 10 PC8110xNSZ0F Series ● Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). •Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D2-A03802EN 11 PC8110xNSZ0F Series ■ Package specification ● Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 12.0 ±2 5.8 10.8 520 6.7 (Unit : mm) Sheet No.: D2-A03802EN 12 PC8110xNSZ0F Series ● Tape and Reel package Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions D F J G I H X. MA H A B C E Dimensions List A B ±0.3 16.0 7.5±0.1 H I 10.4±0.1 0.4±0.05 5˚ K C 1.75±0.1 J 4.2±0.1 D 8.0±0.1 K 5.1±0.1 E 2.0±0.1 F 4.0±0.1 (Unit : mm) G +0.1 φ1.5−0 Reel structure and Dimensions e d c g Dimensions List a b 330 e 23±1.0 f a b 17.5±1.5 f 2.0±0.5 (Unit : mm) c d ±1.0 100 13±0.5 g 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 2 000pcs/reel] Sheet No.: D2-A03802EN 13 PC8110xNSZ0F Series ■ Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. [E202] Sheet No.: D2-A03802EN 14