PL IA NT Features Lead free device (RoHS compliant*) Glass passivated chip ■ Low reverse leakage current ■ Low forward voltage drop ■ High current capability S CO M ■ *R oH ■ CD214C-F350~F3600 Fast Response Rectifiers General Information The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. Bourns offers Glass Passivated Rectifiers for rectification applications, in compact chip DO-214AB (SMC) size format, which offers PCB real estate savings and are considerably smaller than competitive parts. The Glass Passivated Rectifier Diodes offer a forward current of 3.0 A with a choice of repetitive peak reverse voltage of 50 V up to 600 V. Bourns Chip Diodes® conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration minimizes roll away. Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Symbol Maximum Repetitive Peak Reverse Voltage Maximum RMS Voltage CD214C- Unit F350 F3100 F3200 F3400 F3600 VRRM 50 100 200 400 600 V VRMS 35 70 140 280 420 V Maximum DC Blocking Voltage VDC 50 100 200 400 600 V Maximum Average Forward Rectified Current (@ TL = 100 °C)1 I(AV) 3.0 A DC Reverse Current @ Rated DC Blocking Voltage (@TJ = 25 °C) IR 10.0 µA DC Reverse Current @ Rated DC Blocking Voltage (@TJ = 125 °C) IR 500.0 µA Typical Junction Capacitance2 CJ 45 pF Maximum Instantaneous Forward Voltage @ 3 A VF 0.92 1.25 1.30 V Typical Thermal Resistance3 RθJA 15 °C/W Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 100 A Trr 25 ns Maximum Reverse Recovery Time Notes: 1 See Forward Derating Curve. 2 Measured at 1 MHz and an applied reverse voltage of 4.0 V. 3 Thermal resistance from junction to lead. Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Operating Temperature Range Storage Temperature Range Symbol CD214C-F350~F3600 Unit TJ -55 to +150 °C TSTG -55 to +150 °C *RoHS Directive 2002/95/EC Jan 27 2003 including Annex. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CD214C-F350~F3600 Fast Response Rectifiers Product Dimensions Recommended Pad Layout This is a lead free product using 100 % Sn termination. It is a molded plastic package. A cathode band indicates the polarity. The package weighs approximately 0.21 g. The package and dimensions are shown below. 2.69 MAX. (0.106) 6.60 - 7.11 (0.260 - 0.280) 2.10 MIN. (0.083) 2.92 - 3.18 (0.115 - 0.125) 5.59 - 6.22 (0.220 - 0.240) 1.27 MIN. (0.050) DIMENSIONS: MM (INCHES) How To Order CD 214C - F 3 50 2.01 - 2.62 (0.080 - 0.103) 0.05 - 0.20 (0.002 - 0.008) 0.76 - 1.52 (0.03 - 0.06) 7.75 - 8.13 (0.305 - 0.320) DIMENSIONS: MM (INCHES) 0.15 - 0.31 (0.006 - 0.012) Common Code CD = Chip Diode Package 214C = SMC/DO-214AB Model Series F = Fast Rectifier Forward Current I(AV) 3=3A Reverse Voltage 50 = 50 V 100 = 100 V 200 = 200 V 400 = 400 V 600 = 600 V Typical Part Marking CD214C-F350 ............................................................................ CD214C-F3100 .......................................................................... CD214C-F3200 .......................................................................... CD214C-F3400 .......................................................................... CD214C-F3600 .......................................................................... F3A F3B F3D F3G F3J Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CD214C-F350~F3600 Fast Response Rectifiers Packaging Information The product will be dispensed in Tape and Reel format (see diagram below). P 0 P 1 d T E Index Hole 120 F D2 W B D1 D P A Trailer ....... ....... End C Device ....... ....... ....... ....... Leader ....... ....... W1 Start DIMENSIONS: 10 pitches (min.) 10 pitches (min.) Direction of Feed Item Symbol Carrier Width A Carrier Length B Carrier Depth C Sprocket Hole d Reel Outside Diameter D Reel Inner Diameter D1 Feed Hole Diameter D2 Sprocket Hole Position E Punch Hole Position F Punch Hole Pitch P Sprocket Hole Pitch P0 Embossment Center P1 Overall Tape Thickness T Tape Width W Reel Width W1 Quantity per Reel — SMC (DO-214AB) 7.22 ±0.10 (0.284 ±0.004) 8.11 ±0.10 (0.319 ±0.004) 2.36 ±0.10 (0.093 ±0.004) 1.55 ±0.05 (0.061 ±0.002) 330 (12.992) 50.0 Min. (1.969) 13.0 ±0.20 (0.512 ±0.008) 1.75 ±0.10 (0.069 ±0.004) 7.50 ±0.10 (0.295 ±0.004) 4.00 ±0.10 (0.157 ±0.004) 4.00 ±0.10 (0.157 ±0.004) 2.00 ±0.10 (0.079 ±0.004) 0.30 ±0.10 (0.012 ±0.004) 16.00 ±0.20 (0.630 ±0.008) 22.4 Max. (0.882) 3,000 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MM (INCHES) Devices are packed in accordance with EIA standard RS-481-A and specifications shown here. CD214C-F350~F3600 Fast Response Rectifiers Performance Graphs Maximum Non-Repetitive Surge Current Forward Current Derating Curve Peak Forward Surge Current (Amps) Average Forward Current (Amps) 3.0 2.5 2.0 1.5 1.0 Single Phase Half Wave 60 Hz Resistive or Inductive Load 0.5 0 25 50 75 100 125 150 175 100 80 60 40 Pulse Width 8.3 ms Single Half Sine-Wave (JEDEC Method) 20 0 1 2 Lead Temperature (°C) 5 10 20 50 100 Number of Cycles at 60 Hz Typical Forward Characteristics Typical Reverse Characteristics 1000 10.0 F3400 Instantaneous Reverse Leakage Current (mA) Instantaneous Forward Current (Amps) F350-F3200 F3600 1.0 0.1 Pulsewidth: 300 µs TJ = 25 °C 100 TJ = 125 °C 10 TJ = 25 °C 1.0 0.1 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 Instantaneous Forward Voltage (Volts) 1.6 1.8 0 20 40 60 80 100 120 140 Percent of Rated Peak Reverse Voltage (%) Reliable Electronic Solutions Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700 www.bourns.com COPYRIGHT© 2005, BOURNS, INC. LITHO IN U.S.A., IPA0508 10/05 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.