BOURNS CD1206-B260

PL
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Features
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6
*R
oH
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Applications
Lead free device (RoHS compliant*)
Low profile
High current capability
UL 94V-0 classification
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High frequency switching power supplies
Inverters
Free wheeling
Polarity protection
CD1206-B220~B2100 – Surface Mount Schottky Rectifier Diode
General Information
The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop
increasingly smaller electronic components. Bourns offers Schottky Rectifier Diodes for rectification applications, in compact chip package
1206 size format, which offer PCB real estate savings and are considerably smaller than most competitive parts. The Schottky Rectifier
Diodes offer a forward current of 2 A with a repetitive peak reverse voltage of 20 V up to 100 V.
Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration
minimizes roll away.
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Symbol
Maximum Repetitive
Peak Reverse Voltage
Maximum RMS Voltage
CD1206-
Unit
B220
B240
B260
B2100
VRRM
20
40
60
100
V
VRMS
14
28
42
70
V
Maximum DC Blocking Voltage
VDC
20
40
60
100
V
Maximum Average Forward
Rectified Current1
I(AV)
2
A
DC Reverse Current @ Rated DC
Blocking Voltage (@TJ = 25 °C)
IR
0.5
mA
DC Reverse Current @ Rated DC
Blocking Voltage (@TJ = 100 °C)
IR
20
Maximum Instantaneous
Forward Voltage @ 2 A2
VF
0.5
10
0.7
mA
0.85
V
Typical Thermal Resistance3
RθJA
RθJL
75
17
°C/W
Peak forward surge current 8.3 ms
single half sine-wave superimposed
on rated load (JEDEC Method)
IFSM
40
A
Notes:
1 See Forward Derating Curve.
2 Pulse test width PW = 300 µsec, 1 % duty cycle.
3 Mounted on P.C. board with 0.2 x 0.2 ˝ (5.0 x 5.0 mm) copper pad areas.
Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Operating Temperature Range
Storage Temperature Range
Symbol
CD1206-B220~B2100
Unit
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CD1206-B220~B2100 – Surface Mount Schottky Rectifier Diode
Product Dimensions
Recommended Pad Layout
This is a lead free product, packaged with FRP substrate and is
epoxy underfilled. The terminals are pure tin plated and are
solderable per MIL-STD-750, Method 2026. The package weighs
approximately 0.02 g. The package and dimensions are shown
below.
3.00
MAX.
(0.118)
1.60
MIN.
(0.063)
3.20 - 3.60
(0.126 - 0.142)
1.70 - 2.10
(0.067 - 0.083)
1.40
MIN.
(0.055)
0.40
R
(0.016)
DIMENSIONS:
MM
(INCHES)
How To Order
0.50 - 0.90
(0.020 - 0.035)
0.50 - 0.90
(0.020 - 0.035)
0.86 - 1.16
(0.034 - 0.046)
DIMENSIONS:
MM
(INCHES)
CD 1206 - B 2 20
Common Code
CD = Chip Diode
Package
1206
Model Series
B = Schottky Barrier Diode
Forward Current I(AV)
2=2A
Reverse Voltage
20 = 20 V
40 = 40 V
60 = 60 V
100 = 100 V
Typical Part Marking
CD1206-B220 ......................................................................
CD1206-B240 ......................................................................
CD1206-B260 ......................................................................
CD1206-B2100 ....................................................................
220
240
260
2100
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CD1206-B220~B2100 – Surface Mount Schottky Rectifier Diode
Packaging Information
The product will be dispensed in Tape and Reel format (see diagram below).
P
0
P
1
d
T
E
Index Hole
120
F
D2
W
B
D1 D
P
A
Trailer
.......
.......
End
C
Device
.......
.......
.......
.......
Leader
.......
.......
W1
Start
DIMENSIONS:
10 pitches (min.)
10 pitches (min.)
Direction of Feed
Item
Symbol
Carrier Width
A
Carrier Length
B
Carrier Depth
C
Sprocket Hole
d
Reel Outside Diameter
D
Reel Inner Diameter
D1
Feed Hole Diameter
D2
Sprocket Hole Position
E
Punch Hole Position
F
Punch Hole Pitch
P
Sprocket Hole Pitch
P0
Embossment Center
P1
Overall Tape Thickness
T
Tape Width
W
Reel Width
W1
Quantity per Reel
—
1206
1.70 ±0.10
(0.067 ±0.004)
3.40 ±0.10
(0.134 ±0.004)
1.25 ±0.10
(0.049 ±0.004)
1.55 ±0.05
(0.061 ±0.002)
178
(7.008)
60.0
Min.
(2.362)
13.0 ±0.20
(0.512 ±0.008)
1.75 ±0.10
(0.069 ±0.004)
3.50 ±0.05
(0.138 ±0.002)
4.00 ±0.10
(0.157 ±0.004)
4.00 ±0.10
(0.157 ±0.004)
2.00 ±0.05
(0.079 ±0.002)
0.20 ±0.05
(0.008 ±0.002)
8.00 ±0.20
(0.315 ±0.008)
13.5
Max.
(0.531)
3,000
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MM
(INCHES)
Devices are packed in accordance with EIA standard
RS-481-A and specifications shown here.
CD1206-B220~B2100 – Surface Mount Schottky Rectifier Diode
Performance Graphs
Maximum Non-Repetitive Surge Current
Forward Current Derating Curve
Peak Forward Surge Current (Amps)
Average Forward Current (Amps)
2.0
CD1206-B260~B2100
CD1206-B220~B240
1.0
Resistive or Inductive Load
P.C.B. Mounted on
0.2 x 0.2 ˝ (5.0 x 5.0 mm)
Copper Pad Areas
0
0
50
70
90
110
130
150
170
50
40
30
20
Pulse Width 8.3 ms
Single Half Sine-Wave
(JEDEC Method)
10
0
1
10
Lead Temperature (°C)
Typical Forward Characteristics
Typical Reverse Characteristics
100.0
B220~B240
B260
Instantaneous Reverse Leakage Current (mA)
10.0
Instantaneous Forward Current (Amps)
100
Number of Cycles at 60 Hz
B2100
1.0
0.1
10.0
TJ = 100 °C
1.0
0.10
0.01
TJ = 25 °C
0.001
0.01
0
0.2
0.4
0.6
0.8
1.0
1.2
0
20
40
60
80
100
Percent of Rated Peak Reverse Voltage (%)
Instantaneous Forward Voltage (Volts)
Typical Junction Capacitance
Junction Capacitance (pF)
400
Reliable Electronic Solutions
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
100
TJ = 25 °C
f = 1.0 MHz
VSIG = 50 mVP-P
COPYRIGHT© 2005, BOURNS, INC. LITHO IN U.S.A., IPA0508 10/05
10
0.1
1.0
10
Reverse Voltage (Volts)
100
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.