PL IA NT Features S CO M ■ 6 *R oH ■ ■ ■ Applications Lead free device (RoHS compliant*) Low profile High current capability UL 94V-0 classification ■ ■ ■ ■ High frequency switching power supplies Inverters Free wheeling Polarity protection CD1206-B220~B2100 – Surface Mount Schottky Rectifier Diode General Information The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. Bourns offers Schottky Rectifier Diodes for rectification applications, in compact chip package 1206 size format, which offer PCB real estate savings and are considerably smaller than most competitive parts. The Schottky Rectifier Diodes offer a forward current of 2 A with a repetitive peak reverse voltage of 20 V up to 100 V. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration minimizes roll away. Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Symbol Maximum Repetitive Peak Reverse Voltage Maximum RMS Voltage CD1206- Unit B220 B240 B260 B2100 VRRM 20 40 60 100 V VRMS 14 28 42 70 V Maximum DC Blocking Voltage VDC 20 40 60 100 V Maximum Average Forward Rectified Current1 I(AV) 2 A DC Reverse Current @ Rated DC Blocking Voltage (@TJ = 25 °C) IR 0.5 mA DC Reverse Current @ Rated DC Blocking Voltage (@TJ = 100 °C) IR 20 Maximum Instantaneous Forward Voltage @ 2 A2 VF 0.5 10 0.7 mA 0.85 V Typical Thermal Resistance3 RθJA RθJL 75 17 °C/W Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 40 A Notes: 1 See Forward Derating Curve. 2 Pulse test width PW = 300 µsec, 1 % duty cycle. 3 Mounted on P.C. board with 0.2 x 0.2 ˝ (5.0 x 5.0 mm) copper pad areas. Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Operating Temperature Range Storage Temperature Range Symbol CD1206-B220~B2100 Unit TJ -55 to +125 °C TSTG -55 to +150 °C *RoHS Directive 2002/95/EC Jan 27 2003 including Annex. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CD1206-B220~B2100 – Surface Mount Schottky Rectifier Diode Product Dimensions Recommended Pad Layout This is a lead free product, packaged with FRP substrate and is epoxy underfilled. The terminals are pure tin plated and are solderable per MIL-STD-750, Method 2026. The package weighs approximately 0.02 g. The package and dimensions are shown below. 3.00 MAX. (0.118) 1.60 MIN. (0.063) 3.20 - 3.60 (0.126 - 0.142) 1.70 - 2.10 (0.067 - 0.083) 1.40 MIN. (0.055) 0.40 R (0.016) DIMENSIONS: MM (INCHES) How To Order 0.50 - 0.90 (0.020 - 0.035) 0.50 - 0.90 (0.020 - 0.035) 0.86 - 1.16 (0.034 - 0.046) DIMENSIONS: MM (INCHES) CD 1206 - B 2 20 Common Code CD = Chip Diode Package 1206 Model Series B = Schottky Barrier Diode Forward Current I(AV) 2=2A Reverse Voltage 20 = 20 V 40 = 40 V 60 = 60 V 100 = 100 V Typical Part Marking CD1206-B220 ...................................................................... CD1206-B240 ...................................................................... CD1206-B260 ...................................................................... CD1206-B2100 .................................................................... 220 240 260 2100 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CD1206-B220~B2100 – Surface Mount Schottky Rectifier Diode Packaging Information The product will be dispensed in Tape and Reel format (see diagram below). P 0 P 1 d T E Index Hole 120 F D2 W B D1 D P A Trailer ....... ....... End C Device ....... ....... ....... ....... Leader ....... ....... W1 Start DIMENSIONS: 10 pitches (min.) 10 pitches (min.) Direction of Feed Item Symbol Carrier Width A Carrier Length B Carrier Depth C Sprocket Hole d Reel Outside Diameter D Reel Inner Diameter D1 Feed Hole Diameter D2 Sprocket Hole Position E Punch Hole Position F Punch Hole Pitch P Sprocket Hole Pitch P0 Embossment Center P1 Overall Tape Thickness T Tape Width W Reel Width W1 Quantity per Reel — 1206 1.70 ±0.10 (0.067 ±0.004) 3.40 ±0.10 (0.134 ±0.004) 1.25 ±0.10 (0.049 ±0.004) 1.55 ±0.05 (0.061 ±0.002) 178 (7.008) 60.0 Min. (2.362) 13.0 ±0.20 (0.512 ±0.008) 1.75 ±0.10 (0.069 ±0.004) 3.50 ±0.05 (0.138 ±0.002) 4.00 ±0.10 (0.157 ±0.004) 4.00 ±0.10 (0.157 ±0.004) 2.00 ±0.05 (0.079 ±0.002) 0.20 ±0.05 (0.008 ±0.002) 8.00 ±0.20 (0.315 ±0.008) 13.5 Max. (0.531) 3,000 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MM (INCHES) Devices are packed in accordance with EIA standard RS-481-A and specifications shown here. CD1206-B220~B2100 – Surface Mount Schottky Rectifier Diode Performance Graphs Maximum Non-Repetitive Surge Current Forward Current Derating Curve Peak Forward Surge Current (Amps) Average Forward Current (Amps) 2.0 CD1206-B260~B2100 CD1206-B220~B240 1.0 Resistive or Inductive Load P.C.B. Mounted on 0.2 x 0.2 ˝ (5.0 x 5.0 mm) Copper Pad Areas 0 0 50 70 90 110 130 150 170 50 40 30 20 Pulse Width 8.3 ms Single Half Sine-Wave (JEDEC Method) 10 0 1 10 Lead Temperature (°C) Typical Forward Characteristics Typical Reverse Characteristics 100.0 B220~B240 B260 Instantaneous Reverse Leakage Current (mA) 10.0 Instantaneous Forward Current (Amps) 100 Number of Cycles at 60 Hz B2100 1.0 0.1 10.0 TJ = 100 °C 1.0 0.10 0.01 TJ = 25 °C 0.001 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 0 20 40 60 80 100 Percent of Rated Peak Reverse Voltage (%) Instantaneous Forward Voltage (Volts) Typical Junction Capacitance Junction Capacitance (pF) 400 Reliable Electronic Solutions Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700 www.bourns.com 100 TJ = 25 °C f = 1.0 MHz VSIG = 50 mVP-P COPYRIGHT© 2005, BOURNS, INC. LITHO IN U.S.A., IPA0508 10/05 10 0.1 1.0 10 Reverse Voltage (Volts) 100 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.