MA-COM MASW-009276

MASW-009276-000DIE
Bumped GaAs SP3T Switch for WLAN
1.0 - 4.0 GHz
Features
Rev. V2
Die Bump Pad Layout (bump side up)
• 802.11b/g and Bluetooth Applications
• Low Insertion Loss:
0.5 dB 2.4 GHz to 2.5 GHz band
• High Isolation: 32 dB Typical on RX
• Low Harmonics: <-70 dBc @ 20 dBm
• Flip-chip configuration
• RoHS* Compliant
Description
The MASW-009276-000DIE is a bumped GaAs
pHEMT MMIC SP3T switch. Typical applications are
WLAN (802.11 b/g) and Bluetooth applications.
The MASW-009276-000DIE delivers high
isolation, low insertion loss, and high linearity at
2.4 - 2.5 GHz. This device is fabricated using a
0.5 micron gate length GaAs pHEMT process.
The process features full passivation for
performance and reliability. This die features
SnAg (2.5%) solder bumps for Wafer Level Chip
Scale Package (WLCSP) applications.
Die Bump Pad Configuration
Ordering Information
Name
Description
VC1
Voltage Control 1
BT
Blue Tooth TX/RX Port
GND
Ground
RX
2.5 GHz RX Port
VC3
Voltage Control 3
Part Number
Package
TX
2.5 GHz TX Port
MASW-009276-000D3K
Die in 3000 piece reel
VC2
Voltage Control 2
MASW-009276-001SMB
Sample Board SP3T
RFC
Antenna Port
Absolute Maximum Ratings 1,2
Parameter
Absolute Maximum
Input Power @ 3 V Control
+32 dBm
Input Power @ 5 V Control
+35 dBm
Operating Voltage
+8 volts
Operating Temperature
-40°C to +85°C
Storage Temperature
-65°C to +150°C
1. Exceeding any one or combination of these limits may cause
permanent damage to this device.
2. M/A-COM Technology does not recommend sustained
operation near these survivability limits.
1
* Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-009276-000DIE
Bumped GaAs SP3T Switch for WLAN
1.0 - 4.0 GHz
Rev. V2
Electrical Specifications3: TA = 25°C, Z0 = 50 Ω, Vc = 0 V / 3 V, Pin = 0 dBm
Parameter
Test Conditions
Units
Min.
Typ.
Max.
Insertion Loss
RFC to Tx/Rx/BT, 2.4 GHz
dB
—
0.5
0.75
Isolation
RFC to Tx, 2.4 GHz
RFC to Rx, 2.4 GHz
RFC to BT, 2.4 GHz
dB
dB
dB
20
30
20
24
32
24
—
—
—
Return Loss
2.4 - 2.5 GHz
dB
—
15
—
IP3
RFC to Tx/Rx/BT, 2.4 GHz, 20 dBm Total Power, 1MHz Spacing
dBm
—
55
—
Input P1dB
RFC to Tx, 2.4 GHz
RFC to Rx, 2.4 GHz
RFC to BT, 2.4 GHz
dBm
—
—
—
32
28
32
—
—
—
Harmonics
RFC to Tx 2.4 GHz, 20 dBm
dBm
—
-75
—
Control Current
|Vc| = 3 V
µA
—
<1
10
3. External blocking capacitors on all RF ports.
Recommended PCB Configuration
Truth Table 4,5,6
VC1
VC2
VC3
RFC–BT
RFC-TX
RFC-RX
1
0
0
On
Off
Off
0
1
0
Off
On
Off
0
0
1
Off
Off
On
4. For positive voltage control, external DC blocking capacitors
are required on all RF ports.
5. Differential voltage, V(state 1) - V(state 0), must be
+2.7 V minimum and must not exceed +5 V.
6. 0 = 0 ± 0.3 V, 1 = +2.7 V to +5 V.
Handling Procedures
Please observe the following precautions to avoid
damage:
Parts List
Static Sensitivity
Part
Value
Case Style
C1 - C4
39 pF
0402
C5 - C7
1000 pF
0402
Gallium Arsenide Integrated Circuits are sensitive
to electrostatic discharge (ESD) and can be
damaged by static electricity. Proper ESD control
techniques should be used when handling these
devices.
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-009276-000DIE
Bumped GaAs SP3T Switch for WLAN
1.0 - 4.0 GHz
Rev. V2
Product Consistency Distribution Charts7 (on wafer RF test)
LS L
Process Capability
Process Capability
LS L
P rocess Data
LS L
20
Target
*
S ample M ean 24.1799
P rocess Data
LS L
30
Target
*
S ample M ean 32.0545
O v erall C apability
P pk
18
19
20
21
O v erall C apability
8.55
22
23
24
25
26
27
28
28
29
30
32
33
34
3.04
35
36
37
38
Isolation (dB)
RRX
X Isolation (dB)
TX and
BT Isolation
(dB) (dB)
Tx and
BT Isolation
Process Capability
LB
31
P pk
USL
Process Capability
LB
P rocess Data
LB
0
Target
*
USL
0.75
S ample M ean 0.513984
USL
P rocess Data
LB
0
Target
*
USL
2
S ample M ean 0.272007
O v erall C apability
P pk
O v erall C apability
2.64
P pk
-0.0
0.1
0.2
0.3
0.4
0.5
0.6
Insertion
(dB) (dB)
Insertion
Loss Loss
- All Paths
0.7
0.00
0.28
3.69
0.56
0.84 1.12
1.40 1.68
Switch Current
All
Paths
Current - All Paths(µA)
(uA)
1.96
7. Represents >5 wafers, tested per electrical specifications, probed directly on the die to the solder bump: TA = 25°C, Z0 = 50 Ω, VC = 0/3V,
PIN = 0 dBm
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-009276-000DIE
Bumped GaAs SP3T Switch for WLAN
1.0 - 4.0 GHz
Rev. V2
Typical Performance Curves (plots = chip on board assembly)
TX Isolation
TX Insertion Loss
35
0.80
+25°C
-40°C
+85°C
0.75
0.70
25
0.65
20
0.60
2.40
2.42
2.44
2.46
2.48
+25°C
-40°C
+85°C
30
2.50
15
2.40
2.42
2.44
2.46
2.48
2.50
Frequency (GHz)
Frequency (GHz)
RX Isolation
RX Insertion Loss
0.75
35
0.70
30
0.65
25
+25°C
-40°C
+85°C
0.60
20
+25°C
-40°C
+85°C
0.55
2.40
2.42
2.44
2.46
2.48
2.50
15
2.40
2.42
Frequency (GHz)
2.46
2.48
2.50
BT Isolation
BT Insertion Loss
35
0.80
+25°C
-40°C
+85°C
0.75
30
0.70
25
0.65
20
0.60
2.40
2.44
Frequency (GHz)
2.42
2.44
2.46
Frequency (GHz)
2.48
2.50
15
2.40
+25°C
-40°C
+85°C
2.42
2.44
2.46
2.48
2.50
Frequency (GHz)
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-009276-000DIE
Bumped GaAs SP3T Switch for WLAN
1.0 - 4.0 GHz
Die Dimensions (Top and Side Views)
Die Bump Pad Layout - Top View
(bump side up)
Rev. V2
PCB Top Metal / Solder Mask
Die Bump Pad Layout - Bottom View
(bump side down - as installed on board)
8. Orientation mark is only on material that is shipped in tape and
reel. The mark is not available on die shipped on grip ring.
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.