T PL IA N M CO *R oH S Features Applications ■ RoHS compliant* ■ IC supply line protection ■ ESD protection >25 kV ■ MOSFET gate protection ■ Surge protection ■ Control line protection ■ Low capacitance ■ Low frequency I/O line protection ChipGuard® CG0805MLA Series - ESD Protector Array General Information The ChipGuard® CG0805MLA series has been designed to provide a competitive solution for applications where capacitance of the ESD protector is less critical. General ESD applications in end products such as computers, analog modems and PDAs include IC supply lines, MOSFET gate protection, and low frequency digital and control lines. The ChipGuard® CG0805MLA quad device is designed to protect equipment to IEC61000-4-2, Level 4 (±8 kV Contact / ±15 kV Air Discharge) ESD specification. Electrical & Thermal Characteristics @ TA = 25 °C (unless otherwise noted) Parameter Symbol CG0805MLA-5.5ME CG0805MLA-18KE VRMS VDC 4 14 V 5.5 18 V IR IS 10 WMax VBR 12 28 V %_ VBR 20 10 % VC 28 58 V Typical Capacitance @ 1 VRMS 1 kHz CO1 36 17 pF Typical Capacitance @ 1 VRMS 1 MHz CO2 33 15 pF Maximum AC Working Voltage @ 10 µA Max. Maximum DC Working Voltage @ 10 µA Max. Minimum Resistance @ 3.3 VDC Maximum Peak Current @ 8/20 µS Pulse Maximum Transient Energy @ 10/1000 µS Pulse Nominal Breakdown Voltage @ 1 mA Breakdown Voltage Tolerance Maximum Clamping Voltage @ 1 A 8/20 µS Pulse Maximum Response Time RT ESD Protection: Per IEC 61000-4-2 Min. Contact Discharge (>100 Reps) Min. Air Discharge (>100 Reps) Operating Temperature Storage Temperature TOPR TSTG *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications 10 Unit Megohms 5 0.01 A Joules 1 ns ±8 ± 15 kV kV -40 to +85 ˚C -40 to +85 ˚C ChipGuard® CG0805MLA Series - ESD Protector Array Product Dimensions Recommended Pad Layout W BL X E X D P A S L B T C BW CG0805 Series Dimension L DIMENSIONS: 1.25 ± 0.20 (0.049 ± 0.008) MM (INCHES) Dimension CG0805 Series W 2.00 ± 0.20 (0.080 ± 0.008) A 0.64 (0.025) T 0.90 (0.035) MAX. B 1.27 (0.050) BW 0.20 ± 0.10 (0.008 ± 0.004) C 1.91 (0.075) BL 0.20 ± 0.10 (0.008 ± 0.004) D 0.28 (0.011) P 0.50 (0.020) E 0.51 (0.020) X 0.75 ± 0.10 (0.029 ± 0.004) S 0.25 ± 0.10 (0.009 ± 0.004) Solder Reflow Recommendations 300 Preheat Stages 1-3 Soldering Cooling A Stage 1 Preheat Temperature (°C) 250 200 150 30-70 sec. 60 s to 120 s B Stage 2 Preheat 140 °C to 160 °C Stage 3 Preheat Preheat to 200 °C 20 s to 40 s D Main Heating 200 °C 210 °C 220 °C 230 °C 240 °C 60 s to 70 s 55 s to 65 s 50 s to 60 s 40 s to 50 s 30 s to 40 s E Cooling 200 °C to 100 °C 1 °C/s to 4 °C/s 50 110 sec. (min.) 30 s to 60 s C 100 0 Ambient to Preheating Temperature 120 sec. (min.) Time (seconds) • • • • This product can be damaged by rapid heating, cooling or localized heating. Heat shocks should be avoided. Preheating and gradual cooling recommended. Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications ChipGuard® CG0805MLA Series - ESD Protector Array Packaging Dimensions 13.0 ± 1.0 (0.52 ± 0.04) 8.00 ± 0.30 (0.32 ± 0.012) 4.00 ± 0.10 (0.16 ± 0.004) C 1.50 ± 0.10 (0.06 ± 0.004) 62.0 ± 1.50 (2.48 ± 0.06) 2.0 ± 0.50 (0.08 ± 0.02) L 13.0 ± 0.50 (0.52 ± 0.02) TOP TAPE G D NOTES: TAPE MATERIAL IS PAPER. 0.60 ± 0.05 TAPE THICKNESS IS (0.024 ± 0.002) COVER TAPE ADHESION IS 40 ± 15 GRAMS. Dimension C 21.0 ± 0.80 (0.84 ± 0.032) 3.50 ± 0.05 (0.14 ± 0.002) W DIMENSIONS: CG0805 Series 180.8 ± 2.0 (7.12 ± 0.08) MM (INCHES) 9.0 ± 0.50 (0.36 ± 0.02) How to Order 1.75 ± 0.10 (0.069 ± 0.004) D 2.00 ± 0.05 (0.080 ± 0.002) L 2.40 ± 0.20 (0.094 ± 0.008) W 1.65 ± 0.20 (0.065 ± 0.008) G 4.00 ± 0.10 (0.16 ± 0.004) CG 0805 - MLA n.n x E ® ChipGuard Product Designator Package Option 0805 = 0805 Package Model Series MLA = Standard Capacitance Working Peak Voltage** 18 = 18 V 5.5 = 5.5 V Tolerance K = 10 % M = 20 % Tape & Reel Packaging E = 4,000 pcs. per reel ** Only models lower than 10 volts require decimal point. Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700 www.bourns.com REV. C 09/12 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications