Crystal unit SMALL CYLINDER LOW/MEDIUM-FREQUENCY CRYSTAL UNIT C-4-TYPE • Photolithography finished allows uniform and stable performance. • Small and light weight. (ø1.5 x 6mm) • Excellent shock resistance and environmental capability. • Most suitable for pagers and card products like PCMCIA. Actual size Specifications (characteristics) Item Nominal frequency Remarks Symbol Specifications f 32.000 kHz to 120.000 kHz Please refer to frequency list below 192 kHz Storage temperature Operating temperature TSTG -20˚C to +70˚C TOPR -10˚C to +60˚C Maximum drive level GL 1.0µW max. Recommended drive level (characteristics) DL 0.1µW typ. Soldering condition TSOL Under 280˚C with in 5 sec. Do not heat the package at more than 150˚C Frequency tolerance (standard) ∆f/f ±50ppm,±100ppm Ta=25˚C, DL=0.1µW Peak temperature (frequency) θT 25˚C ±5˚C Temperature coefficient (frequency) a -0.04ppm/ ˚C2 max. Load capacitance CL Temperature range 6pF to ∞ 32 kHz ≤ f < 40 kHz: 40 kHz ≤ f < 60 kHz: 60 kHz ≤ f < 70 kHz: 70 kHz ≤ f ≤ 100 kHz: 100 kHz < f ≤ 120 kHz: 192 kHz: Series resistance R1 Motional capacitance C1 3.0fF max. Shunt capacitance C0 1.5pF max. Insulation resistance IR 500 MΩ min. Aging fa ±5ppm/year max. Shock resistance External dimensions Frequency 26.6667 kHz 32.5600 kHz 36.8640 kHz 38.4000 kHz 44.7340 kHz C-2-TYPE 48.0000 kHz 75.0000 kHz 77.5030 kHz 76.8000 kHz 96.0000 kHz 153.6000 kHz 307.2000 kHz 38.4000 kHz C-4-TYPE 50.0000 kHz 76.8000 kHz 77.5030 kHz 192.0000 kHz 15 Ta=25˚C±3˚C, first year Three drops on a hard board from 75 cm or excitation test with 3000G x 0.3ms x 1/2 sine wave x 3 directions ±5ppm max. S.R. Frequency example Type Please specify 55 kΩ max. 30 kΩ max. 25 kΩ max. 22 kΩ max. 15 kΩ max. 10 kΩ max. (Unit: mm) CL Value 10.0pF, 11.0pF 7.0pF 13.5pF 10.0pF 10.0pF 15.0pF 6.5pF, 9.0pF,20.0pF 10.0pF, 20.0pF 6.0pF, 10.0pF,11.0pF 6.0pF, 8.4pF,11.0pF 11.0pF 11.0pF 11.0pF 9.0pF 11.0pF 10.0pF 11.0pF B D2 D1 L2 L1 Model L1 L2 D1 C-2-TYPE 6.0 max. 4.0 min. ø2.0 max. C-001R 8.0 max. 9.0 min. ø3.1 max. C-002RX 6.0 max. 4.0 min. ø2.0 max. C-004R 5.0 max. 4.0 min. ø1.5 max. 4.6 max. 4.0 min. ø1.2 max. C-005R ø1.5 max. C-4-TYPE 5.0 max. 4.0 min. (160 to 165kHz, 307.2 kHz: D1=ø2.2 max.) D2 ø0.2 ø0.3 ø0.2 ø0.2 ø0.15 ø0.2 B 0.7 1.1 0.7 0.5 0.3 0.5 THE CRYSTALMASTER ENERGY SAVING EPSON EPSON offers effective savings to its customers through a wide range of electronic devices, such as semiconductors, liquid crystal display (LCD) modules, and crystal devices. These savings are achieved through a sophisticated melding of three different efficiency technologies. Power saving technology provides low power consumption at low voltages. Energy Saving Space saving technology provides further reductions in product size and weight Power Saving through super-precise processing and high-density assembly technology. Space Saving Time saving technology shortens the time required for design and development Time Saving on the customer side and shortens delivery times. Our concept of Energy Saving technology conserves resources by blending the essence of these three efficiency technologies. The essence of these technologies is represented in each of the products that we provide to our customers. In the industrial sector, leading priorities include measures to counter the greenhouse effect by reducing CO2, measures to preserve the global environment, and the development of energyefficient products. Environmental problems are of global concern, and although the contribution of energyResource saving technology developed by Saving EPSON may appear insignificant, we seek to contribute to the development of energy-saving products by our customers through the utilization of our electronic devices. EPSON is committed to the conservation of energy, both for the sake of people and of the planet on which we live. SEIKO EPSON CORP. QUARTZ DEVICE DIVISION acquired ISO9001 and ISO14001 certification by B.V.Q. I. (Bureau Veritas Quality International) . ISO9001 in October, 1992. ISO14001 in November,1997. NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice. Seiko Epson does not assume any liability of any kind arising out of any inaccuracies contained in this material or due to its application or use in any product or circuit and, further, there is no representation that this material is applicable to products requiring high level reliability, such as, medical products. Moreover, no license to any intellectual property rights is granted by implication or otherwise, and there is no representation or warranty that anything made in accordance with this material will be free from any patent or copyright infringement of a third party. This material of portions there may contain technology or the subject relating to strategic products under the control of the Foreign Exchange and Foreign Trade Control Law of Japan and may require an export license from the Ministry of International Trade and Industry or other approval from another government agency.