18-Bit, 2 MSPS/1 MSPS/500 kSPS, Precision, Differential SAR ADCs AD4003/AD4007/AD4011 Data Sheet FEATURES GENERAL DESCRIPTION Throughput: 2 MSPS/1 MSPS/500 kSPS options INL: ±1.0 LSB (±3.8 ppm) maximum Guaranteed 18-bit no missing codes Low power 9.5 mW at 2 MSPS, 4.9 mW at 1 MSPS, 2.4 mW at 500 kSPS (VDD only) 80 μW at 10 kSPS, 16 mW at 2 MSPS (total) SNR: 100.5 dB typical at 1 kHz, VREF = 5 V; 99 dB typical at 100 kHz THD: −123 dB typical at 1 kHz, VREF = 5 V; −100 dB typical at 100 kHz Ease of use features reduce system power and complexity Input overvoltage clamp circuit Reduced nonlinear input charge kickback High-Z mode Long acquisition phase Input span compression Fast conversion time allows low SPI clock rates SPI-programmable modes, read/write capability, status word Differential analog input range: ±VREF 0 V to VREF with VREF from 2.4 V to 5.1 V Single 1.8 V supply operation with 1.71 V to 5.5 V logic interface SAR architecture: no latency/pipeline delay, valid first conversion First conversion accurate Guaranteed operation: −40°C to +125°C SPI-/QSPI-/MICROWIRE-/DSP-compatible serial interface Ability to daisy-chain multiple ADCs and busy indicator 10-lead packages: 3 mm × 3 mm LFCSP, 3 mm × 4.90 mm MSOP The AD4003/AD4007/AD4011 are low noise, low power, high speed, 18-bit, precision successive approximation register (SAR) analog-to-digital converters (ADCs). The AD4003, AD4007, and AD4011 offer 2 MSPS, 1 MSPS, and 500 kSPS throughputs, respectively. They incorporate ease of use features that reduce signal chain power consumption, reduce signal chain complexity, and enable higher channel density. The high-Z mode, coupled with a long acquisition phase, eliminates the need for a dedicated high power, high speed ADC driver, thus broadening the range of low power precision amplifiers that can drive these ADCs directly while still achieving optimum performance. The input span compression feature enables the ADC driver amplifier and the ADC to operate off common supply rails without the need for a negative supply while preserving the full ADC code range. The low serial peripheral interface (SPI) clock rate requirement reduces the digital input/output power consumption, broadens processor options, and simplifies the task of sending data across digital isolation. Operating from a 1.8 V supply, the AD4003/AD4007/AD4011 have a ±VREF fully differential input range with VREF ranging from 2.4 V to 5.1 V. The AD4003 consumes only 16 mW at 2 MSPS with a minimum SCK rate of 75 MHz in turbo mode, the AD4007 consumes only 8 mW at 1 MSPS, and the AD4011 consumes only 4 mW at 500 kSPS. The AD4003/AD4007/AD4011 all achieve ±1.0 LSB integral nonlinearty error (INL) maximum, guaranteed no missing codes at 18 bits with 100.5 dB typical signal-to-noise ratio (SNR) for 1 kHz inputs. The reference voltage is applied externally and can be set independently of the supply voltage. The SPI-compatible versatile serial interface features seven different modes including the ability, using the SDI input, to daisy-chain several ADCs on a single 3-wire bus and provides an optional busy indicator. The AD4003/AD4007/AD4011 are compatible with 1.8 V, 2.5 V, 3 V, and 5 V logic, using the separate VIO supply. The AD4003/AD4007 are available in a 10-lead MSOP and LFCSP, and the AD4011 is available in a 10-lead LFCSP, with operation specified from −40°C to +125°C. The devices are pin compatible with the 16-bit, 2 MSPS AD4000 (see Table 8). APPLICATIONS Automatic test equipment Machine automation Medical equipment Battery-powered equipment Precision data acquisition systems FUNCTIONAL BLOCK DIAGRAM 2.5V TO 5V 10µF 1.8V VREF VREF /2 0 IN+ IN– AD4003/ AD4007/ AD4011 HIGH-Z MODE TURBO MODE 18-BIT SAR ADC CLAMP VDD SERIAL INTERFACE STATUS BITS SPAN COMPRESSION GND VIO 1.8V TO 5V SDI SCK SDO CNV 3-WIRE OR 4-WIRE SPI INTERFACE (DAISY CHAIN, CS) 14957-001 REF VREF VREF/2 0 Figure 1. Rev. B Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2016–2017 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com AD4003/AD4007/AD4011 Data Sheet TABLE OF CONTENTS Features ............................................................................................... 1 Driver Amplifier Choice ........................................................... 22 Applications ........................................................................................ 1 Ease of Drive Features ............................................................... 23 General Description ........................................................................... 1 Voltage Reference Input ............................................................ 24 Functional Block Diagram .............................................................. 1 Power Supply............................................................................... 25 Revision History ............................................................................... 3 Digital Interface .......................................................................... 25 Specifications..................................................................................... 4 Register Read/Write Functionality........................................... 26 Timing Specifications .................................................................. 7 Status Word ................................................................................. 28 Absolute Maximum Ratings............................................................ 9 CS Mode, 3-Wire Turbo Mode ................................................. 29 Thermal Resistance ...................................................................... 9 CS Mode, 3-Wire Without Busy Indicator ............................. 30 ESD Caution .................................................................................. 9 CS Mode, 3-Wire with Busy Indicator .................................... 31 Pin Configurations and Function Descriptions ......................... 10 CS Mode, 4-Wire Turbo Mode ................................................. 32 Typical Performance Characteristics ........................................... 11 CS Mode, 4-Wire Without Busy Indicator ............................. 33 Terminology .................................................................................... 16 Theory of Operation ...................................................................... 17 Circuit Information .................................................................... 17 Converter Operation .................................................................. 18 Transfer Functions...................................................................... 18 Applications Information .............................................................. 19 CS Mode, 4-Wire with Busy Indicator .................................... 34 Daisy-Chain Mode ..................................................................... 35 Layout Guidelines....................................................................... 36 Evaluating the AD4003/AD4007/AD4011 Performance ...... 36 Outline Dimensions ....................................................................... 37 Ordering Guide .......................................................................... 38 Typical Application Diagrams .................................................. 19 Analog Inputs .............................................................................. 20 Rev. B | Page 2 of 38 Data Sheet AD4003/AD4007/AD4011 REVISION HISTORY 10/2017—Rev. A to Rev. B Changes to Features and General Description .............................. 1 Moved Figure 1 .................................................................................. 1 Changes to Specifications Section and Table 1.............................. 4 Changes to Endnote 1 and Endnote 2, Table 1 .............................. 6 Changes to Timing Specifications Section, CNV or SDI Low to SDO D17 (MSB) Valid Delay (CS Mode) Parameter, Table 2 .... 7 Changes to Endnote 3, Table 2 ........................................................ 7 Changes to Analog Input Parameter, Table 5 ................................ 9 Added Endnote 2, Table 5 ................................................................ 9 Changes to Figure 4 and Table 7 ...................................................10 Changes to Typical Performance Characteristics Section .........11 Reorganized Typical Performance Characteristics Section .......11 Changes to Figure 19 and Figure 19 Caption ..............................13 Changes to Figure 25 Caption through Figure 27 Caption and Changes to Figure 28 ......................................................................14 Changes to Circuit Information Section and Table 8 .................17 Changes to Converter Operations Section and Table 9 .............18 Changes to Endnote 1 and Endnote 2, Table 9 ............................18 Changes to Applications Information Section ............................19 Moves Figure 38; Renumbered Sequentially ...............................20 Change to Analog Input Section ...................................................20 Changes to Input Overvoltage Clamp Section................................... 21 Changes to High Frequency Input Signals Section, Multiplexed Applications Section, Driver Amplifier Choice Section, RC Filter Values Section, Figure 39, and Figure 40 Caption ............................. 22 Changes to High-Z Mode Section, Figure 42, Figure 43, and Figure 43 Caption ............................................................................23 Changes to Voltage Reference Input Section, Figure 44 Caption, Figure 45, Figure 46 Caption, and Figure 47 ...............................24 Changes to Digital Interface Section, Power Supply Section, and Figure 48 Caption ............................................................................25 Changes to Read/Write Functionality Section, Table 12, and Table 14 .............................................................................................26 Changes to Figure 49 ......................................................................27 Changes to Status Word Section and Table 15 ............................28 Changes to CS Mode, 4-Wire Turbo Mode Section .......................32 Changes to CS Mode, 4-Wire Without Busy Indicator Section .....33 Changes to CS Mode, 4-Wire With Busy Indicator Section......34 Change to Daisy-Chain Mode Section .........................................35 Changes to Evaluating the AD4003/AD4007/AD4011 Performance Section .......................................................................36 Changes to Ordering Guide ...........................................................38 7/2017—Rev. 0 to Rev. A Added AD4007 and AD4011............................................ Universal Changes to Features Section and General Description................ 1 Moved Figure 1 .................................................................................. 3 Changes to Specifications Section .................................................. 4 Changes to Table 1 ............................................................................ 4 Changes to Timing Specifications Section .................................... 7 Changes to Table 2 ............................................................................ 7 Changes to Absolute Maximum Ratings Section ......................... 9 Added Endnote 2 and Endnote 3, Table 6 ..................................... 9 Changes to Typical Performance Characteristics Section ......... 11 Changes to Figure 11 and Figure 14 ............................................. 12 Changes to Figure 19 and Figure 21 ............................................. 13 Added Figure 25 and Figure 26; Renumbered Sequentially ...... 14 Moved Terminology Section ......................................................... 16 Changes to Terminology Section .................................................. 16 Changes to Circuit Information Section and Table 8 ................. 17 Moved Figure 38 .............................................................................. 22 Changes to High Frequency Input Signals Section .................... 22 Added Multiplexed Applications Section .................................... 22 Added Figure 41 .............................................................................. 23 Moved Figure 42 .............................................................................. 23 Changes to High-Z Mode Section and Figure 43 ....................... 23 Changes to Voltage Reference Input Section ............................... 24 Changes to Figure 48, Digital Interface Section, and Table 11 ....... 25 Changes to CS Mode, 3-Wire Turbo Mode Section ................... 29 Added Figure 53 .............................................................................. 29 Changes to CS Mode, 4-Wire Turbo Mode Section ................... 32 Added Figure 59 .............................................................................. 32 Change to CS Mode, 4-Wire with Busy Signal Indicator Section .............................................................................................. 34 Changes to Layout Guidelines Section and Evaluating the AD4003/AD4007/AD4011 Performance Section ....................... 36 Updated Outline Dimensions........................................................ 37 Changes to Ordering Guide ........................................................... 38 10/2016—Revision 0: Initial Version Rev. B | Page 3 of 38 AD4003/AD4007/AD4011 Data Sheet SPECIFICATIONS VDD = 1.71 V to 1.89 V; VIO = 1.71 V to 5.5 V; VREF = 5 V; all specifications TMIN to TMAX, high-Z mode disabled, span compression disabled, turbo mode enabled, and sampling frequency fS = 2 MSPS for the AD4003, fS = 1 MSPS for the AD4007, and fS = 500 kSPS for the AD4011, unless otherwise noted. Table 1. Parameter RESOLUTION ANALOG INPUT Voltage Range Operating Input Voltage Common-Mode Input Range Common-Mode Rejection Ratio (CMRR) Analog Input Current Test Conditions/Comments Min 18 IN+ voltage (VIN+) − IN− voltage (VIN−) Span compression enabled VIN+, VIN− to GND Span compression enabled THROUGHPUT Complete Cycle AD4003 AD4007 AD4011 Conversion Time Acquisition Phase1 AD4003 AD4007 AD4011 Throughput Rate2 AD4003 AD4007 AD4011 Transient Response3 DC ACCURACY No Missing Codes Integral Nonlinearity Error (INL) Differential Nonlinearity Error (DNL) Transition Noise Zero Error Zero Error Drift4 Gain Error Gain Error Drift4 Power Supply Sensitivity 1/f Noise5 Max Unit Bits −VREF +VREF V −VREF × 0.8 −0.1 0.1 × VREF VREF/2 − 0.125 +VREF × 0.8 VREF + 0.1 0.9 × VREF VREF/2 + 0.125 V V V V dB nA μA fIN = 500 kHz Acquisition phase, T = 25°C High-Z mode enabled, converting dc input at 2 MSPS 500 1000 2000 270 Typ VREF/2 68 0.3 1 290 320 290 790 1790 ns ns ns 0 0 0 2 1 500 250 18 −1.0 −3.8 −0.75 −7 −0.21 −26 −1.23 VDD = 1.8 V ± 5% Bandwidth = 0.1 Hz to 10 Hz Rev. B | Page 4 of 38 ns ns ns ns ±0.4 ±1.52 ±0.3 0.8 ±3 1.5 6 +1.0 +3.8 +0.75 +7 +0.21 +26 +1.23 MSPS MSPS kSPS ns Bits LSB ppm LSB LSB LSB ppm/°C LSB ppm/°C LSB μV p-p Data Sheet Parameter AC ACCURACY Dynamic Range Total RMS Noise fIN = 1 kHz, −0.5 dBFS, VREF = 5 V Signal-to-Noise Ratio (SNR) Spurious-Free Dynamic Range (SFDR) Total Harmonic Distortion (THD) Signal-to-Noise-and-Distortion Ratio (SINAD) Oversampled Dynamic Range fIN = 1 kHz, −0.5 dBFS, VREF = 2.5 V SNR SFDR THD SINAD fIN = 100 kHz, −0.5 dBFS, VREF = 5 V SNR THD SINAD fIN = 400 kHz, −0.5 dBFS, VREF = 5 V SNR THD SINAD −3 dB Input Bandwidth Aperture Delay Aperture Jitter REFERENCE Voltage Range, VREF Current AD4003 AD4007 AD4011 INPUT OVERVOLTAGE CLAMP IN+/IN− Current, IIN+/IIN− VIN+/VIN− at Maximum IIN+/IIN− VIN+/VIN− Clamp On/Off Threshold Deactivation Time REF Current at Maximum IIN+/IIN− DIGITAL INPUTS Logic Levels Input Low Voltage, VIL Input High Voltage, VIH AD4003/AD4007/AD4011 Test Conditions/Comments Min 99 98.5 Oversampling ratio (OSR) = 256, VREF = 5 V 93.5 93 Typ dB μV rms 100.5 122 −123 100 dB dB dB dB 122 dB 94.5 122 −119 94 dB dB dB dB 99 −100 96.5 dB dB dB 91.5 −94 90 10 1 1 dB dB dB MHz ns ps rms 5.1 1.1 0.5 0.26 VREF = 5 V VREF = 2.5 V VREF = 5 V VREF = 2.5 V VREF = 5 V VREF = 2.5 V 5.25 2.68 VIN+/VIN− > VREF VIO > 2.7 V VIO ≤ 2.7 V VIO > 2.7 V VIO ≤ 2.7 V 6 Rev. B | Page 5 of 38 V mA mA mA 50 50 mA mA V V V V ns μA +0.3 × VIO +0.2 × VIO VIO + 0.3 VIO + 0.3 +1 +1 V V V V μA μA pF 5.4 3.1 5.4 2.8 360 100 −0.3 −0.3 0.7 × VIO 0.8 × VIO −1 −1 Input Low Current, IIL Input High Current, IIH Input Pin Capacitance Unit 101 31.5 2.4 2 MSPS 1 MSPS 500 kSPS Max AD4003/AD4007/AD4011 Data Sheet Parameter DIGITAL OUTPUTS Data Format Pipeline Delay Test Conditions/Comments Min Output Low Voltage, VOL Output High Voltage, VOH POWER SUPPLIES VDD VIO Standby Current Power Dissipation ISINK = 500 μA ISOURCE = −500 μA Serial 18 bits, twos complement Conversion results available immediately after completed conversion 0.4 VIO − 0.3 VDD Only REF Only VIO Only Energy per Conversion TEMPERATURE RANGE Specified Performance 1.71 1.71 VDD = 1.8 V, VIO = 1.8 V, T = 25°C VDD = 1.8 V, VIO = 1.8 V, VREF = 5 V 10 kSPS, high-Z mode disabled 500 kSPS, high-Z mode disabled 1 MSPS, high-Z mode disabled 2 MSPS, high-Z mode disabled 500 kSPS, high-Z mode enabled 1 MSPS, high-Z mode enabled 2 MSPS, high-Z mode enabled 500 kSPS, high-Z mode disabled 1 MSPS, high-Z mode disabled 2 MSPS, high-Z mode disabled 500 kSPS, high-Z mode disabled 1 MSPS, high-Z mode disabled 2 MSPS, high-Z mode disabled 500 kSPS, high-Z mode disabled 1 MSPS, high-Z mode disabled 2 MSPS, high-Z mode disabled Typ 1.8 Max 1.89 5.5 1.6 80 4 8 16 5 10 20 2.4 4.9 9.5 1.4 2.8 5.5 0.1 0.4 1.0 4.7 9.3 18.5 6.2 12.3 24.5 8 TMIN to TMAX −40 1 Unit V V V V μA μW mW mW mW mW mW mW mW mW mW mW mW mW mW mW mW nJ/sample +125 °C The acquisition phase is the time available for the input sampling capacitors to acquire a new input with the ADC running at a throughput rate of 2 MSPS for the AD4003, 1 MSPS for the AD4007, and 500 kSPS for the AD4011. 2 A throughput rate of 2 MSPS can only be achieved with turbo mode enabled and a minimum SCK rate of 75 MHz. Refer to Table 4 for the maximum achievable throughput for different modes of operation. 3 Transient response is the time required for the ADC to acquire a full-scale input step to ±1 LSB accuracy. 4 The minimum and maximum values are guaranteed by characterization, but not production tested. 5 See the 1/f noise plot in Figure 23. Rev. B | Page 6 of 38 Data Sheet AD4003/AD4007/AD4011 TIMING SPECIFICATIONS VDD = 1.71 V to 1.89 V; VIO = 1.71 V to 5.5 V; VREF = 5 V; all specifications TMIN to TMAX, high-Z mode disabled, span compression disabled, turbo mode enabled, and sampling frequency fS = 2 MSPS for the AD4003, fS = 1 MSPS for the AD4007, and fS = 500 kSPS for the AD4011, unless otherwise noted. See Figure 2 for the timing voltage levels. Table 2. Digital Interface Timing Parameter CONVERSION TIME—CNV RISING EDGE TO DATA AVAILABLE ACQUISITION PHASE1 AD4003 AD4007 AD4011 TIME BETWEEN CONVERSIONS AD4003 AD4007 AD4011 CNV PULSE WIDTH (CS MODE)2 Symbol tCONV tACQ Min 270 Typ 290 Max 320 Unit ns 290 790 1790 ns ns ns 500 1000 2000 10 ns ns ns ns 9.8 12.3 ns ns 20 25 3 3 1.5 ns ns ns ns ns tCYC tCNVH SCK PERIOD (CS MODE)3 VIO > 2.7 V VIO > 1.7 V SCK PERIOD (DAISY-CHAIN MODE)4 VIO > 2.7 V VIO > 1.7 V SCK LOW TIME SCK HIGH TIME SCK FALLING EDGE TO DATA REMAINS VALID DELAY SCK FALLING EDGE TO DATA VALID DELAY VIO > 2.7 V VIO > 1.7 V CNV OR SDI LOW TO SDO D17 MOST SIGNIFICANT BIT (MSB) VALID DELAY (CS MODE) VIO > 2.7 V VIO > 1.7 V CNV RISING EDGE TO FIRST SCK RISING EDGE DELAY LAST SCK FALLING EDGE TO CNV RISING EDGE DELAY5 CNV OR SDI HIGH OR LAST SCK FALLING EDGE TO SDO HIGH IMPEDANCE (CS MODE) tSCK tSCK tSCKL tSCKH tHSDO tDSDO 7.5 10.5 ns ns 10 13 ns ns ns ns ns tEN tQUIET1 tQUIET2 tDIS 190 60 SDI VALID SETUP TIME FROM CNV RISING EDGE SDI VALID HOLD TIME FROM CNV RISING EDGE (CS MODE) tSSDICNV tHSDICNV 2 2 ns ns SCK VALID HOLD TIME FROM CNV RISING EDGE (DAISY-CHAIN MODE) SDI VALID SETUP TIME FROM SCK RISING EDGE (DAISY-CHAIN MODE) SDI VALID HOLD TIME FROM SCK RISING EDGE (DAISY-CHAIN MODE) tHSCKCNV tSSDISCK tHSDISCK 12 2 2 ns ns ns 1 20 The acquisition phase is the time available for the input sampling capacitors to acquire a new input with the ADC running at a throughput rate of 2 MSPS for the AD4003, 1 MSPS for the AD4007, and 500 kSPS for the AD4011. 2 For turbo mode, tCNVH must match the tQUIET1 minimum. 3 A throughput rate of 2 MSPS can only be achieved with turbo mode enabled and a minimum SCK rate of 75 MHz. Refer to Table 4 for the maximum achievable throughput for different modes of operation. 4 A 50% duty cycle is assumed for SCK. 5 See Figure 22 for SINAD vs. tQUIET2. Rev. B | Page 7 of 38 AD4003/AD4007/AD4011 Data Sheet Table 3. Register Read/Write Timing Parameter READ/WRITE OPERATION CNV Pulse Width1 SCK Period VIO > 2.7 V VIO > 1.7 V SCK Low Time SCK High Time READ OPERATION CNV Low to SDO D17 MSB Valid Delay VIO > 2.7 V VIO > 1.7 V SCK Falling Edge to Data Remains Valid SCK Falling Edge to Data Valid Delay VIO > 2.7 V VIO > 1.7 V CNV Rising Edge to SDO High Impedance WRITE OPERATION SDI Valid Setup Time from SCK Rising Edge SDI Valid Hold Time from SCK Rising Edge CNV Rising Edge to SCK Edge Hold Time CNV Falling Edge to SCK Active Edge Setup Time Min tCNVH tSCK 10 ns 9.8 12.3 3 3 ns ns ns ns tSCKL tSCKH Typ Max Unit tEN tHSDO tDSDO ns ns ns 7.5 10.5 20 ns ns ns 1.5 tDIS tSSDISCK tHSDISCK tHCNVSCK tSCNVSCK 10 13 2 2 0 6 ns ns ns ns For turbo mode, tCNVH must match the tQUIET1 minimum. Y% VIO1 X% VIO1 tDELAY tDELAY VIH2 VIL2 VIH2 VIL2 1FOR VIO ≤ 2.7V, X = 80, AND Y = 20; FOR VIO > 2.7V, X = 70, AND Y = 30. 2MINIMUM V AND MAXIMUM V USED. SEE DIGITAL INPUTS IH IL SPECIFICATIONS IN TABLE 1. 14957-002 1 Symbol Figure 2. Voltage Levels for Timing Table 4. Achievable Throughput for Different Modes of Operation Parameter THROUGHPUT, CS MODE 3-Wire and 4-Wire Turbo Mode 3-Wire and 4-Wire Turbo Mode and Six Status Bits 3-Wire and 4-Wire Mode 3-Wire and 4-Wire Mode and Six Status Bits Test Conditions/Comments fSCK = 100 MHz, VIO ≥ 2.7 V fSCK = 80 MHz, VIO < 2.7 V fSCK = 100 MHz, VIO ≥ 2.7 V fSCK = 80 MHz, VIO < 2.7 V fSCK = 100 MHz, VIO ≥ 2.7 V fSCK = 80 MHz, VIO < 2.7 V fSCK = 100 MHz, VIO ≥ 2.7 V fSCK = 80 MHz, VIO < 2.7 V Rev. B | Page 8 of 38 Min Typ Max Unit 2 2 2 1.78 1.75 1.62 1.59 1.44 MSPS MSPS MSPS MSPS MSPS MSPS MSPS MSPS Data Sheet AD4003/AD4007/AD4011 ABSOLUTE MAXIMUM RATINGS Note that the input overvoltage clamp cannot sustain the overvoltage condition for an indefinite amount of time. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. Table 5. Parameter Analog Inputs IN+, IN− to GND1 Supply Voltage REF, VIO to GND VDD to GND VDD to VIO Digital Inputs to GND Digital Outputs to GND Storage Temperature Range Junction Temperature Lead Temperature Soldering Electrostatic Discharge (ESD) Ratings Human Body Model (HBM) Machine Model Field Induced Charged Device Model 1 2 Rating Table 6. Thermal Resistance −0.3 V to VREF + 0.4 V or ± 130 mA2 −0.3 V to +6.0 V −0.3 V to +2.1 V −6 V to +2.4 V −0.3 V to VIO + 0.3 V −0.3 V to VIO + 0.3 V −65°C to +150°C 150°C 260°C reflow as per JEDEC J-STD-020 Package Type1 RM-10 CP-10-9 1 θJA2 147 114 θJC3 38 33 Unit °C/W °C/W Test Condition 1: thermal impedance simulated values are based upon use of 2S2P JEDEC PCB. See the Ordering Guide. 2 θJA is the natural convection junction to ambient thermal resistance measured in a one cubic foot sealed enclosure. 3 θJC is the junction to case thermal resistance. ESD CAUTION 4 kV 200 V 1.25 kV See the Analog Inputs section for an explanation of IN+ and IN−. Current condition tested over a 10 ms time interval. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 9 of 38 AD4003/AD4007/AD4011 Data Sheet PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS REF 1 IN+ 3 10 VIO IN+ 3 AD4003/ AD4007 IN– 4 TOP VIEW (Not to Scale) VDD 2 GND 5 9 SDI 8 SCK 7 SDO 6 CNV GND 5 TOP VIEW (Not to Scale) 9 SDI 8 SCK 7 SDO 6 CNV NOTES 1. CONNECT THE EXPOSED PAD TO GND. THIS CONNECTION IS NOT REQUIRED TO MEET THE SPECIFIED PERFORMANCE. 14957-003 REF 1 IN– 4 10 VIO AD4003/ AD4007/ AD4011 Figure 3. 10-Lead MSOP Pin Configuration 14957-004 VDD 2 Figure 4. 10-Lead LFCSP Pin Configuration Table 7. Pin Function Descriptions Pin No. 1 Mnemonic REF Type1 AI 2 VDD P 3 4 5 6 IN+ IN− GND CNV AI AI P DI 7 8 9 SDO SCK SDI DO DI DI 10 VIO P N/A2 EPAD P 1 2 Description Reference Input Voltage. The VREF range is 2.4 V to 5.1 V. This pin is referred to the GND pin and must be decoupled closely to the GND pin with a 10 μF X7R ceramic capacitor. 1.8 V Power Supply. The VDD range is 1.71 V to 1.89 V. Bypass VDD to GND with a 0.1 μF ceramic capacitor. Differential Positive Analog Input. See the Differential Input Considerations section. Differential Negative Analog Input. See the Differential Input Considerations section. Power Supply Ground. Convert Input. This input has multiple functions. On its leading edge, it initiates the conversions and selects the interface mode of the device: daisy-chain mode or CS mode. In CS mode, the SDO pin is enabled when CNV is low. In daisy-chain mode, the data is read when CNV is high. Serial Data Output. The conversion result is output on this pin. It is synchronized to SCK. Serial Data Clock Input. When the device is selected, the conversion result is shifted out by this clock. Serial Data Input. This input provides multiple features. It selects the interface mode of the ADC as follows: Daisy-chain mode is selected if SDI is low during the CNV rising edge. In this mode, SDI is used as a data input to daisy-chain the conversion results of two or more ADCs onto a single SDO line. The digital data level on SDI is output on SDO with a delay of 18 SCK cycles. CS mode is selected if SDI is high during the CNV rising edge. In this mode, either SDI or CNV can enable the serial output signals when low. If SDI or CNV is low when the conversion is complete, the busy indicator feature is enabled. With CNV low, the device can be programmed by clocking in a 16-bit word on SDI on the rising edge of SCK. Input/Output Interface Digital Power. Nominally, this pin is at the same supply as the host interface (1.8 V, 2.5 V, 3 V, or 5 V). Bypass VIO to GND with a 0.1 μF ceramic capacitor. Exposed Pad (LFCSP Only). Connect the exposed pad to GND. This connection is not required to meet the specified performance. AI is analog input, P is power, DI is digital input, and DO is digital output. N/A means not applicable. Rev. B | Page 10 of 38 Data Sheet AD4003/AD4007/AD4011 TYPICAL PERFORMANCE CHARACTERISTICS VDD = 1.8 V; VIO = 3.3 V; VREF = 5 V; T = 25°C, high-Z mode disabled, span compression disabled, turbo mode enabled, and sampling frequency fS = 2 MSPS for the AD4003, fS = 1 MSPS for the AD4007, and fS = 500 kSPS for the AD4011, unless otherwise noted. 0.4 1.0 0.8 +125°C +25°C –40°C 0.6 +125°C +25°C –40°C 0.3 0.2 0.2 DNL (LSB) INL (LSB) 0.4 0 –0.2 0.1 0 –0.1 –0.4 –0.2 –0.6 0 32768 65536 98304 131072 163840 196608 229376 262144 CODE –0.4 14957-200 –1.0 Figure 5. INL vs. Code for Various Temperatures, VREF = 5 V 0 32768 65536 98304 131072 163840 196608 229376 262144 CODE 14957-203 –0.3 –0.8 Figure 8. DNL vs. Code for Various Temperatures, VREF = 5 V 0.4 1.0 0.8 +125°C +25°C –40°C 0.6 0.3 0.2 0.2 DNL (LSB) INL (LSB) 0.4 0 –0.2 0.1 0 –0.1 –0.4 –0.2 –0.6 32768 65536 98304 131072 163840 196608 229376 262144 CODE –0.4 Figure 6. INL vs. Code for Various Temperatures, VREF = 2.5 V 0 32768 65536 98304 131072 163840 196608 229376 262144 CODE Figure 9. DNL vs. Code for Various Temperatures, VREF = 2.5 V 1.8 0.8 1.7 0.6 +125°C +25°C –40°C 1.6 TRANSITION NOISE (LSB) 0.4 0 –0.2 –0.4 1.5 1.4 1.3 1.2 1.1 1.0 –0.6 0.9 HIGH-Z ENABLED SPAN COMPRESSION ENABLED 32768 65536 98304 131072 163840 196608 229376 262144 CODE 0.8 2.5 14957-202 0 Figure 7. INL vs. Code, High-Z and Span Compression Modes Enabled, VREF = 5 V 3.0 3.5 4.0 REFERENCE VOLTAGE (V) 4.5 5.0 14957-206 INL (LSB) 0.2 –0.8 14957-204 0 14957-201 –1.0 +125°C +25°C –40°C –0.3 –0.8 Figure 10. Transition Noise vs. Reference Voltage for Various Temperatures Rev. B | Page 11 of 38 AD4003/AD4007/AD4011 Data Sheet 4.5M 3.0M 3.0M CODE 131073 131074 131075 131076 131077 VREF = 2.5V SNR = 95.01dB THD = –118.60dB SINAD = 94.99dB –20 FUNDAMENTAL AMPLITUDE (dB) –60 –80 –100 –120 –140 –40 –60 –80 –100 –120 –140 10k 100k 1M FREQUENCY (Hz) –180 100 14957-207 1k 1k 10k 100k 1M FREQUENCY (Hz) 14957-209 –160 –160 Figure 15. 1 kHz, −0.5 dBFS Input Tone FFT, Wide View, VREF = 2.5 V Figure 12. 1 kHz, −0.5 dBFS Input Tone Fast Fourier Transform (FFT), Wide View, VREF = 5 V 0 0 VREF = 5V SNR = 98.37dB THD = –98.52dB SINAD = 95.58dB FUNDAMENTAL AMPLITUDE (dB) –20 –60 –80 –100 –120 –140 –40 VREF = 5V SNR = 91.22dB THD = –91.97dB SINAD = 89.15dB –60 –80 –100 –120 –140 –160 10k 100k FREQUENCY (Hz) 1M 14957-210 –160 –180 1k 10k 100k FREQUENCY (Hz) Figure 16. 400 kHz, −0.5 dBFS Input Tone FFT, Wide View Figure 13. 100 kHz, −0.5 dBFS Input Tone FFT, Wide View Rev. B | Page 12 of 38 1M 14957-213 FUNDAMENTAL AMPLITUDE (dB) –40 –180 1k 131071 131072 0 VREF = 5V SNR = 100.33dB THD = –123.99dB SINAD = 100.31dB –20 –40 131069 131070 CODE Figure 14. Histogram of a DC Input at Code Transition, VREF = 2.5 V and VREF = 5 V 0 –20 131067 131068 14957-205 131080 131081 131078 131079 0 131075 131076 131077 0 131073 131074 0.5M 131071 131072 0.5M 131069 131070 1.0M 131067 131068 1.0M 131065 131066 1.5M 131063 131064 1.5M Figure 11. Histogram of a DC Input at Code Center, VREF = 2.5 V and VREF = 5 V FUNDAMENTAL AMPLITUDE (dB) 2.0M 131065 131066 2.0M 2.5M 131063 131064 2.5M 131062 CODE COUNT 3.5M 131062 CODE COUNT 3.5M –180 100 VREF = 2.5V VREF = 5V 4.0M 14957-208 VREF = 2.5V VREF = 5V 4.0M 131078 131079 131080 131081 4.5M Data Sheet AD4003/AD4007/AD4011 132 –118 16.2 16.0 98 97 131 –120 THD (dB) 99 ENOB (Bits) SNR, SINAD (dB) 100 –116 130 –122 129 –124 15.8 96 128 –126 15.6 ENOB SINAD SNR 94 2.4 2.7 3.0 3.3 3.6 3.9 4.2 4.5 4.8 SFDR THD –128 15.4 5.1 –130 2.4 14957-219 95 REFERENCE VOLTAGE (V) 2.7 3.9 4.2 4.5 126 5.1 4.8 118.0 THD SFDR –114.5 117.9 16.38 100.4 117.8 –115.0 16.36 16.32 100.0 16.30 THD (dB) 16.34 100.2 ENOB (Bits) SNR, SINAD (dB) 3.6 –114.0 16.40 ENOB SINAD SNR 3.3 Figure 20. THD and SFDR vs. Reference Voltage 16.42 100.6 3.0 127 REFERENCE VOLTAGE (V) Figure 17. SNR, SINAD, and Effective Number of Bits (ENOB) vs. Reference Voltage 100.8 16.28 99.8 117.7 117.6 –115.5 117.5 –116.0 117.4 117.3 –116.5 16.26 99.6 117.2 –117.0 16.24 –20 0 20 40 60 80 100 120 16.22 14957-222 99.4 –40 TEMPERATURE (°C) –20 0 20 40 60 80 100 120 117.0 TEMPERATURE (°C) Figure 21. THD and SFDR vs. Temperature, fIN = 1 kHz 101 DYNAMIC RANGE fIN = 1kHz fIN = 10kHz 130 117.1 –117.5 –40 Figure 18. SNR, SINAD, and ENOB vs. Temperature, fIN = 1 kHz 135 SFDR (dB) 16.4 133 SFDR (dB) 101 –114 14957-216 16.6 14957-225 102 100 125 99 SINAD (dB) SNR (dB) 120 115 110 98 97 105 2 4 8 16 32 64 DECIMATION RATE 128 256 512 1024 Figure 19. SNR vs. Decimation Rate for Various Input Frequencies, 2 MSPS Rev. B | Page 13 of 38 95 0 10 20 30 40 50 tQUIET2 (ns) Figure 22. SINAD vs. tQUIET2 60 70 80 14957-215 1 14957-212 95 VIO = 1.89V VIO = 3.6V VIO = 5.5V 96 100 AD4003/AD4007/AD4011 Data Sheet 60 10 57 56 1 2 3 4 5 6 7 8 9 10 TIME (Seconds) Figure 23. 1/f Noise for 0.1 Hz to 10 Hz Bandwidth, 50 kSPS, 2500 Samples Averaged per Reading 0 –2 –4 –6 –8 –10 –40 4.5 7 4.0 5 VDD HIGH-Z DISABLED VDD HIGH-Z ENABLED REF HIGH-Z DISABLED REF HIGH-Z ENABLED VIO HIGH-Z DISABLED VIO HIGH-Z ENABLED 4 3 2 1 0 20 40 60 80 100 120 100 120 3.0 2.5 2.0 VDD HIGH-Z ENABLED VDD HIGH-Z DISABLED REF HIGH-Z ENABLED REF HIGH-Z DISABLED VIO HIGH-Z ENABLED VIO HIGH-Z DISABLED 1.5 1.0 –20 0 20 40 60 80 100 120 Figure 27. Operating Current vs. Temperature, AD4007, 1 MSPS 1.2 2MSPS 1MSPS 500kSPS 1.0 REFERENCE CURRENT (mA) 2.0 1.5 VDD HIGH-Z ENABLED VDD HIGH-Z DISABLED REF HIGH-Z ENABLED REF HIGH-Z DISABLED VIO HIGH-Z ENABLED VIO HIGH-Z DISABLED 0.8 0.6 0.4 0.2 –20 0 20 40 60 80 100 120 TEMPERATURE (°C) 14957-325 OPERATING CURRENT (mA) 80 TEMPERATURE (°C) 2.5 0 –40 60 3.5 0 –40 Figure 24. Operating Current vs. Temperature, AD4003, 2 MSPS 0.5 40 14957-326 –20 TEMPERATURE (°C) 1.0 20 0.5 14957-223 0 –40 0 Figure 26. Zero Error and Gain Error vs. Temperature Positive Full Scale (PFS) and Negative Full Scale (NFS) 8 6 –20 TEMPERATURE (°C) OPERATING CURRENT (mA) OPERATING CURRENT (mA) 2 Figure 25. Operating Current vs. Temperature, AD4011, 500 kSPS 0 2.4 2.7 3.0 3.3 3.6 3.9 4.2 4.5 4.8 REFERENCE VOLTAGE (V) Figure 28. Reference Current vs. Reference Voltages Rev. B | Page 14 of 38 5.1 14957-218 0 4 14957-217 55 PFS GAIN ERROR NFS GAIN ERROR ZERO ERROR 6 14957-221 58 54 8 ZERO ERROR AND GAIN ERROR (LSB) ADC OUTPUT READING (µV) 59 Data Sheet AD4003/AD4007/AD4011 25.0 23 22.5 21 17.5 17 tDSDO (ns) 15.0 12.5 10.0 15 13 11 7.5 9 5.0 –20 0 20 40 60 80 100 TEMPERATURE (°C) 120 Figure 29. Standby Current vs. Temperature 5 0 20 40 60 80 100 120 140 160 LOAD CAPACITANCE (pF) Figure 30. tDSDO vs. Load Capacitance Rev. B | Page 15 of 38 180 200 220 14957-224 7 2.5 0 –40 VIO = 5V VIO = 3.3V VIO = 1.8V 19 14957-226 STANDBY CURRENT (µA) 20.0 AD4003/AD4007/AD4011 Data Sheet TERMINOLOGY Integral Nonlinearity Error (INL) INL is the deviation of each individual code from a line drawn from negative full scale through positive full scale. The point used as negative full scale occurs ½ LSB before the first code transition. Positive full scale is defined as a level 1½ LSB beyond the last code transition. The deviation is measured from the middle of each code to the true straight line (see Figure 32). Differential Nonlinearity Error (DNL) In an ideal ADC, code transitions are 1 LSB apart. DNL is the maximum deviation from this ideal value. It is often specified in terms of resolution for which no missing codes are guaranteed. Zero Error Zero error is the difference between the ideal midscale voltage, 0 V, and the actual voltage producing the midscale output code, 0 LSB. Gain Error The first transition (from 100 ... 00 to 100 ... 01) occurs at a level ½ LSB above nominal negative full scale (−4.999981 V for the ±5 V range). The last transition (from 011 … 10 to 011 … 11) occurs for an analog voltage 1½ LSB below the nominal full scale (+4.999943 V for the ±5 V range). The gain error is the deviation of the difference between the actual level of the last transition and the actual level of the first transition from the difference between the ideal levels. Spurious-Free Dynamic Range (SFDR) SFDR is the difference, in decibels (dB), between the rms amplitude of the input signal and the peak spurious signal. Dynamic Range Dynamic range is the ratio of the rms value of the full scale to the total rms noise measured. The value for dynamic range is expressed in decibels. It is measured with a signal at −60 dBFS so that it includes all noise sources and DNL artifacts. Signal-to-Noise Ratio (SNR) SNR is the ratio of the rms value of the actual input signal to the rms sum of all other spectral components below the Nyquist frequency, excluding harmonics and dc. The value for SNR is expressed in decibels. Signal-to-Noise-and-Distortion Ratio (SINAD) SINAD is the ratio of the rms value of the actual input signal to the rms sum of all other spectral components that are less than the Nyquist frequency, including harmonics but excluding dc. The value of SINAD is expressed in decibels. Aperture Delay Aperture delay is the measure of the acquisition performance and is the time between the rising edge of the CNV input and when the input signal is held for a conversion. Transient Response Transient response is the time required for the ADC to acquire a full-scale input step to ±1 LSB accuracy. Common-Mode Rejection Ratio (CMRR) CMRR is the ratio of the power in the ADC output at the frequency, f, to the power of a 200 mV p-p sine wave applied to the common-mode voltage of IN+ and IN− of frequency, f. CMRR (dB) = 10log(PADC_IN/PADC_OUT) Effective Number of Bits (ENOB) ENOB is a measurement of the resolution with a sine wave input. It is related to SINAD as follows: where: PADC_IN is the common-mode power at the frequency, f, applied to the IN+ and IN− inputs. PADC_OUT is the power at the frequency, f, in the ADC output. ENOB = (SINADdB − 1.76)/6.02 ENOB is expressed in bits. Total Harmonic Distortion (THD) THD is the ratio of the rms sum of the first five harmonic components to the rms value of a full-scale input signal and is expressed in decibels. Power Supply Rejection Ratio (PSRR) PSRR is the ratio of the power in the ADC output at the frequency, f, to the power of a 200 mV p-p sine wave applied to the ADC VDD supply of frequency, f. PSRR (dB) = 10 log(PVDD_IN/PADC_OUT) where: PVDD_IN is the power at the frequency, f, at the VDD pin. PADC_OUT is the power at the frequency, f, in the ADC output. Rev. B | Page 16 of 38 Data Sheet AD4003/AD4007/AD4011 THEORY OF OPERATION IN+ SWITCHES CONTROL LSB MSB REF GND 131,072C 65,536C 4C 2C C SW+ C BUSY COMP 131,072C 65,536C 4C 2C C CONTROL LOGIC C MSB OUTPUT CODE LSB SW– 14957-007 CNV IN– Figure 31. ADC Simplified Schematic CIRCUIT INFORMATION The AD4003/AD4007/AD4011 are high speed, low power, single-supply, precise, 18-bit ADCs based on a SAR architecture. frequencies as well as improved distortion over a wide frequency range up to 100 kHz. For frequencies greater than 100 kHz and multiplexing, disable high-Z mode. For single-supply applications, a span compression feature creates additional headroom and footroom for the driving amplifier to access the full range of the ADC. The AD4003 is capable of converting 2,000,000 samples per second (2 MSPS), the AD4007 is capable of converting 1,000,000 samples per second (1 MSPS), and the AD4011 is capable of converting 500,000 samples per second (500 kSPS). The power consumption of the AD4003/AD4007/AD4011 scales with throughput, because they power down in between conversions. When operating at 10 kSPS, for example, they typically consume 80 μW, making them ideal for battery-powered applications. The AD4003/ AD4007/AD4011 also have a valid first conversion after being powered down for long periods, which can further reduce power consumed in applications in which the ADC does not need to be constantly converting. The AD4003/AD4007/AD4011 can interface with any 1.8 V to 5 V digital logic family. They are available in a 10-lead MSOP or a tiny 10-lead LFCSP that allows space savings and flexible configurations. The AD4003/AD4007/AD4011 provide the user with an on-chip, track-and-hold and do not exhibit any pipeline delay or latency, making them ideal for multiplexed applications. The AD4003/AD4007/AD4011 are pin for pin compatible with some of the 14-/16-/18-/20-bit precision SAR ADCs listed in Table 8. The AD4003/AD4007/AD4011 incorporate a multitude of unique ease of use features that result in a lower system power and footprint. Table 8. MSOP, LFCSP 14-/16-/18-/20-Bit Precision SAR ADCs The AD4003/AD4007/AD4011 each have an internal voltage clamp that protects the device from overvoltage damage on the analog inputs. The analog input incorporates circuitry that reduces the nonlinear charge kickback seen from a typical switched capacitor SAR input. This reduction in kickback, combined with a longer acquisition phase, means reduced settling requirements on the driving amplifier. This combination allows the use of lower bandwidth and lower power amplifiers as drivers. It has the additional benefit of allowing a larger resistor value in the input RC filter and a corresponding smaller capacitor, which results in a smaller RC load for the amplifier, improving stability and power dissipation. High-Z mode can be enabled via the SPI interface by programming a register bit (see Table 14). When high-Z mode is enabled, the ADC input has a low input charging current at low input signal The fast conversion time of the AD4003/AD4007/AD4011, along with turbo mode, allows low clock rates to read back conversions, even when running at their respective maximum throughput rates. Note that for the AD4003, the full throughput rate of 2 MSPS can be achieved only with turbo mode enabled. 400 kSPS to 500 kSPS Bits 100 kSPS 201 181 AD7989-12 250 kSPS AD76912 AD76902, AD7989-52 161 AD7684 AD76872 163 AD7680, AD7683, AD7988-12 AD76852, AD7694 AD76882, AD76932, AD79162 AD76862, AD7988-52 AD40082 143 AD7940 AD79422 1 True differential. Pin for pin compatible. 3 Pseudo differential. 2 Rev. B | Page 17 of 38 AD79462 ≥1000 kSPS AD40202 AD40032, AD79822, AD79842, AD40072, AD40112 AD4001, AD4005, AD79152 AD40002, AD40042, AD79802, AD7983 Not applicable AD4003/AD4007/AD4011 Data Sheet During the acquisition phase, terminals of the array tied to the input of the comparator are connected to GND via the SW+ and SW− switches. All independent switches connect the other terminal of each capacitor to the analog inputs. Therefore, the capacitor arrays are used as sampling capacitors and acquire the analog signal on the IN+ and IN− inputs. When the acquisition phase is complete and the CNV input goes high, a conversion phase initiates. When the conversion phase begins, SW+ and SW− are opened first. The two capacitor arrays are then disconnected from the inputs and connected to the GND input. The differential voltage between the IN+ and IN− inputs captured at the end of the acquisition phase is applied to the comparator inputs, causing the comparator to become unbalanced. By switching each element of the capacitor array between GND and VREF, the comparator input varies by binary weighted voltage steps (VREF/2, VREF/4, …, VREF/262,144). The control logic toggles these switches, starting with the MSB, to bring the comparator back into a balanced condition. After the Because the AD4003, AD4007, and AD4011 have on-board conversion clocks, the serial clock (SCK) is not required for the conversion process. TRANSFER FUNCTIONS The ideal transfer characteristics for the AD4003/AD4007/ AD4011 are shown in Figure 32 and Table 9. 011...111 011...110 011...101 100...010 100...001 100...000 –FSR –FSR + 1 LSB –FSR + 0.5 LSB +FSR – 1 LSB +FSR – 1.5 LSB ANALOG INPUT 14957-008 The AD4003/AD4007/AD4011 are SAR-based ADCs using a charge redistribution sampling digital-to-analog converter (DAC). Figure 31 shows the simplified schematic of the ADC. The capacitive DAC consists of two identical arrays of 18 binary weighted capacitors, which are connected to the comparator inputs. completion of this process, the control logic generates the ADC output code and a busy signal indicator. ADC CODE (TWOS COMPLEMENT) CONVERTER OPERATION Figure 32. ADC Ideal Transfer Function (FSR Is Full-Scale Range) Table 9. Output Codes and Ideal Input Voltages Description FSR − 1 LSB Midscale + 1 LSB Midscale Midscale − 1 LSB −FSR + 1 LSB −FSR Analog Input, VREF = 5 V +4.999962 V +38.15 μV 0V −38.15 μV −4.999962 V −5 V VREF = 5 V with Span Compression Enabled +3.999969 V +30.5 μV 0V −30.5 μV −3.999969 V −4 V 1 Digital Output Code (Hex) 0x1FFFF1 0x00001 0x00000 0x3FFFF 0x20001 0x200002 This output code is also the code for an overranged analog input (VIN+ − VIN− above VREF with the span compression disabled and above 0.8 ×VREF with the span compression enabled). 2 This output code is also the code for an underranged analog input (VIN+ − VIN− below −VREF with the span compression disabled and above 0.8 ×VREF with the span compression enabled). Rev. B | Page 18 of 38 Data Sheet AD4003/AD4007/AD4011 APPLICATIONS INFORMATION Figure 34 shows a recommended connection diagram when using a single-supply system. This setup is preferable when only a limited number of rails are available in the system and power dissipation is of critical importance. TYPICAL APPLICATION DIAGRAMS Figure 33 shows an example of the recommended connection diagram for the AD4003/AD4007/AD4011 when multiple supplies are available. This configuration is used for best performance because the amplifier supplies can be selected to allow the maximum signal range. Figure 35 shows a recommended connection diagram when using a fully differential amplifier. V+ ≥ +6.5V REF LDO 1.8V AMP VCM = VREF /2 5V 10kΩ 0.1µF 10kΩ V+ AMP VREF REF C VDD VIO SDI IN+ V– V+ VCM = VREF/2 AD4003/ AD4007/ AD4011 IN– R AMP SCK DIGITAL HOST (MICROPROCESSOR/ FPGA) SDO CNV GND 3-WIRE/4-WIRE INTERFACE C 0V HOST SUPPLY R 0V VREF 1.8V TO 5V V– 14957-009 VCM = VREF/2 0.1µF 10µF V– ≤ –0.5V Figure 33. Typical Application Diagram with Multiple Supplies V+ = 5V REF1 LDO AMP VCM = VREF /2 4.096V 1.8V 10kΩ 10kΩ AMP 0.9 × VREF VCM = VREF /2 0.1 × VREF 0.1µF 0.1µF 100nF 100nF R REF C VDD SDI AD4003/AD4007/ AD40112 IN– AMP 0.9 × VREF VCM = VREF /2 0.1 × VREF HOST SUPPLY VIO IN+ R 1.8V TO 5V 10µF1 GND SCK SDO DIGITAL HOST (MICROPROCESSOR/ FPGA) CNV 3-WIRE/4-WIRE INTERFACE C 1 SEE THE VOLTAGE REFERENCE INPUT SECTION FOR REFERENCE SELECTION. C REF IS USUALLY A 10µF CERAMIC CAPACITOR (X7R). 2 SPAN COMPRESSION MODE ENABLED. 3 SEE TABLE 10 FOR RC FILTER AND AMPLIFIER SELECTION. Figure 34. Typical Application Diagram with a Single Supply Rev. B | Page 19 of 38 14957-010 3 AD4003/AD4007/AD4011 Data Sheet V+ = 5V REF LDO AMP VCM = VREF /2 VCM = VREF/2 R4 1kΩ R3 1kΩ VREF 10kΩ 0 4.096V 1.8V 1.8V TO 5V 0.1µF 0.1µF 10kΩ 10µF HOST SUPPLY V+ +IN VOCM –IN SCK SDO 3-WIRE/4-WIRE INTERFACE 14957-011 0 DIGITAL HOST (MICROPROCESSOR/ FPGA) CNV GND V– R1 1kΩ VREF SDI IN– R DIFFERENTIAL AMPLIFIER VIO AD4003/AD4007/ AD4011 C +OUT 0.1µF VDD IN+ C VCM = VREF/2 VCM = VREF/2 REF R –OUT R2 1kΩ Figure 35. Typical Application Diagram with a Fully Differential Amplifier V+ = 5V REF LDO AMP 0V VCM = VREF /2 R4 1kΩ R3 1kΩ +VREF 10kΩ –V REF 4.096V 10kΩ 10µF 1.8V 0.1µF 0.1µF 1.8V TO 5V HOST SUPPLY V+ +IN –OUT REF R C VREF/2 VOCM –IN C +OUT 0.1µF R DIFFERENTIAL AMPLIFIER VDD VIO SDI IN+ AD4003/AD4007/ AD4011 IN– GND SCK SDO DIGITAL HOST (MICROPROCESSOR/ FPGA) CNV 3-WIRE/4-WIRE INTERFACE V– 14957-012 R1 1kΩ R2 1kΩ Figure 36. Typical Application Diagram for Single-Ended to Differential Conversion with a Fully Differential Amplifier ANALOG INPUTS Input Overvoltage Clamp Circuit Figure 37 shows an equivalent circuit of the analog input structure, including the overvoltage clamp of the AD4003/ AD4007/AD4011. Most ADC analog inputs, IN+ and IN−, have no overvoltage protection circuitry apart from ESD protection diodes. During an overvoltage event, an ESD protection diode from an analog input pin (IN+ or IN−) pin to REF forward biases and shorts the input pin to REF, potentially overloading the reference or causing damage to the device. The AD4003/AD4007/AD4011 internal overvoltage clamp circuit with a larger external resistor (REXT = 200 Ω) eliminates the need for external protection diodes and protects the ADC inputs against dc overvoltages. REF D1 VIN REXT RIN CIN IN+/IN– CEXT CPIN D2 CLAMP GND 14957-013 0V TO 15V Figure 37. Equivalent Analog Input Circuit Rev. B | Page 20 of 38 Data Sheet AD4003/AD4007/AD4011 When the clamp is active, it sets the overvoltage (OV) clamp flag bit in the register that can be read back (see Table 14), which is a sticky bit that must be read to be cleared. The status of the clamp can also be checked in the status bits using the OV clamp flag (see Table 15). The clamp circuit does not dissipate static power in the off state. Note that the clamp cannot sustain the overvoltage condition for an indefinite amount of time. The external RC filter is usually present at the ADC input to band limit the input signal. During an overvoltage event, excessive voltage is dropped across REXT and REXT becomes part of a protection circuit. The REXT value can vary from 200 Ω to 20 kΩ for 15 V protection. The CEXT value can be as low as 100 pF for correct operation of the clamp. See Table 1 for input overvoltage clamp specifications. Differential Input Considerations The analog input structure allows the sampling of the true differential signal between IN+ and IN−. By using these differential inputs, signals common to both inputs are rejected. Figure 38 shows the common-mode rejection capability of the AD4003/AD4007/AD4011 over frequency. It is important to note that the differential input signals must be truly antiphase in nature, 180° out of phase, which is required to keep the commonmode voltage of the input signal within the specified range around VREF/2 as shown in Table 1. 71 70 69 68 67 66 100 1k 10k FREQUENCY (Hz) 100k 1M 14957-303 If the analog input exceeds the reference voltage by 0.4 V, the internal clamp circuit turns on and the current flows through the clamp into ground, preventing the input from rising further and potentially causing damage to the device. The clamp turns on before D1 (see Figure 37) and can sink up to 50 mA of current. 72 CMRR (dB) In applications where the amplifier rails are greater than VREF and less than ground, it is possible for the output to exceed the input voltage range of the device. In this case, the AD4003/ AD4007/AD4011 internal voltage clamp circuit ensures that the voltage on the input pin does not exceed VREF + 0.4 V and prevents damage to the device by clamping the input voltage in a safe operating range and by avoiding disturbance of the reference, which is particularly important for systems that share the reference among multiple ADCs. Figure 38. CMRR vs. Frequency, VDD = 1.8 V, VIO = 3.3 V, VREF = 5 V, 25°C Switched Capacitor Input During the acquisition phase, the impedance of the analog inputs (IN+ or IN−) can be modeled as a parallel combination of Capacitor CPIN and the network formed by the series connection of RIN and CIN. CPIN is primarily the pin capacitance. RIN is typically 400 Ω and is a lumped component composed of serial resistors and the on resistance of the switches. CIN is typically 40 pF and is mainly the ADC sampling capacitor. During the conversion phase, where the switches are open, the input impedance is limited to CPIN. RIN and CIN make a singlepole, low-pass filter that reduces undesirable aliasing effects and limits noise. RC Filter Values The RC filter value (represented by R and C in Figure 33 to Figure 36) and driving amplifier can be selected depending on the input signal bandwidth of interest at the full throughput. Lower input signal bandwidth means that the RC cutoff can be lower, thereby reducing noise into the converter. For optimum performance at various throughputs, use the recommended RC values (200 Ω, 180 pF) and the ADA4807-1. The RC values shown in Table 10 are chosen for ease of drive considerations and greater ADC input protection. The combination of a large R value (200 Ω) and small C value results in a reduced dynamic load for the amplifier to drive. The smaller value of C means less stability and phase margin concerns with the amplifier. The large value of R limits the current into the ADC input when the amplifier output exceeds the ADC input range. Table 10. RC Filter and Amplifier Selection for Various Input Bandwidths Input Signal Bandwidth (kHz) <10 <200 >200 Multiplexed R (Ω) C (pF) 200 200 200 180 120 120 Recommended Amplifier See the High-Z Mode section ADA4807-1 ADA4897-1 ADA4897-1 Rev. B | Page 21 of 38 Recommended Fully Differential Amplifier ADA4940-1 ADA4940-1 ADA4932-1 ADA4932-1 AD4003/AD4007/AD4011 Data Sheet DRIVER AMPLIFIER CHOICE 102 Although the AD4003/AD4007/AD4011 are easy to drive, the driver amplifier must meet the following requirements: 100 For ac applications, the driver must have a THD performance commensurate with the AD4003/AD4007/AD4011. For multichannel multiplexed applications, the driver amplifier and the analog input circuit of the AD4003/ AD4007/AD4011 must settle for a full-scale step onto the capacitor array at an 18-bit level (0.000384%, 3.84 ppm). In the data sheet of the amplifier, settling at 0.1% to 0.01% is more commonly specified. This setting may differ significantly from the settling time at an 18-bit level and must be verified prior to driver selection. Single to Differential Driver For applications using a single-ended analog signal, either bipolar or unipolar, the ADA4940-1 single-ended to differential driver allows a differential input to the device. The schematic is shown in Figure 36. High Frequency Input Signals The AD4003/AD4007/AD4011 ac performance over a wide input frequency range using a 5 V reference voltage is shown in Figure 39 and Figure 40. Unlike other traditional SAR ADCs, the AD4003/AD4007/AD4011 maintain exceptional ac performance for input frequencies up to the Nyquist frequency with minimal performance degradation. Note that the input frequency is limited to the Nyquist frequency of the sample rate in use. ENOB (Bits) SNR, SINAD (dB) 15.0 ENOB SINAD SNR 88 1k 14.5 10k 14.0 1M 100k 14957-211 90 INPUT FREQUENCY (Hz) Figure 39. SNR, SINAD, and ENOB vs. Input Frequency, VDD = 1.8 V, VIO = 3.3 V, VREF = 5 V, 25°C –90 120 –95 115 –100 110 –105 105 –110 100 95 –115 THD SFDR –120 1k 10k 90 1M 100k INPUT FREQUENCY (Hz) Figure 40. THD and SFDR vs. Input Frequency, VDD = 1.8 V, VIO = 3.3 V, VREF = 5 V, 25°C Multiplexed Applications The AD4003/AD4007/AD4011 significantly reduce system complexity and cost for multiplexed applications that require superior performance in terms of noise, power, and throughput. Figure 41 shows a simplified block diagram of a multiplexed data acquisition system including a multiplexer, an ADC driver, and the precision SAR ADC. MULTIPLEXER R ADC DRIVER C SAR ADC R C R C C Figure 41. Multiplexed Data Acquisition Signal Chain Using the AD4003/AD4007/AD4011 Switching multiplexer channels typically results in large voltage steps at the ADC inputs. To ensure an accurate conversion result, the step must be given adequate time to settle before the ADC samples its inputs (on the rising edge of CNV). The settling time is dependent on the drive circuitry (multiplexer and ADC driver), RC filter values, and the time when the multiplexer Rev. B | Page 22 of 38 14957-341 where: f−3 dB is the input bandwidth, in megahertz, of the AD4003/AD4007/AD4011 (10 MHz) or the cutoff frequency of the input filter, if one is used. N is the noise gain of the amplifier (for example, 1 in buffer configuration). eN is the equivalent input noise voltage of the op amp in nV/√Hz. 15.5 94 SFDR (dB) 96 14957-214 31.5 V 20 log π 2 2 (31.5V) 2 f 3 dB ( Ne N ) 16.0 92 THD (dB) SNR LOSS 16.5 98 The noise generated by the driver amplifier must be kept low enough to preserve the SNR and transition noise performance of the AD4003/AD4007/AD4011. The noise from the driver is filtered by the single-pole, low-pass filter of the AD4003/AD4007/AD4011 analog input circuit made by RIN and CIN or by the external filter, if one is used. Because the typical noise of the AD4003/AD4007/AD4011 is 31.5 μV rms, the SNR degradation due to the amplifier is SENSORS 17.0 Data Sheet AD4003/AD4007/AD4011 15 channels are switched. Switch the multiplexer channels immediately after tQUIET1 has elapsed from the start of the conversion to maximize settling time while preventing corruption of the conversion result. To avoid conversion corruption, do not switch the channels during the tQUIET1 time. If the analog inputs are multiplexed during the quiet conversion time (tQUIET1), the current conversion may be corrupted. 12 INPUT CURRENT (μA) 9 EASE OF DRIVE FEATURES Input Span Compression HIGH-Z HIGH-Z HIGH-Z HIGH-Z HIGH-Z HIGH-Z DISABLED, 2MSPS DISABLED, 1MSPS DISABLED, 500kSPS ENABLED, 2MSPS ENABLED, 1MSPS ENABLED, 500kSPS 6 3 0 –3 –6 –9 In single-supply applications, it is desirable to use the full range of the ADC; however, the amplifier can have some headroom and footroom requirements, which can be a problem, even if it is a rail-to-rail input and output amplifier. The AD4003/AD4007/ AD4011 include a span compression feature, which increases the headroom and footroom available to the amplifier by reducing the input range by 10% from the top and bottom of the range while still accessing all available ADC codes (see Figure 42). The SNR decreases by approximately 1.9 dB (20 × log(8/10)) for the reduced input range when span compression is enabled. Span compression is disabled by default but can be enabled by writing to the relevant register bit (see the Digital Interface section). –15 –5 10% OF VREF = 0.41V IN+/IN– DIGITAL OUTPUT +FSR ALL 2N CODES ADC ANALOG INPUT –FSR Figure 42. Span Compression High-Z Mode The AD4003/AD4007/AD4011 incorporate high-Z mode, which reduces the nonlinear charge kickback when the capacitor DAC switches back to the input at the start of acquisition. Figure 43 shows the input current of the AD4003/AD4007/AD4011 with high-Z mode enabled and disabled. The low input current makes the ADC easier to drive than the traditional SAR ADCs available in the market, even with high-Z mode disabled. The input current reduces further to submicroampere range when high-Z mode is enabled. The high-Z mode is disabled by default but can be enabled by writing to the register (see Table 14). Disable high-Z mode for input frequencies above 100 kHz or when multiplexing. –2 –1 0 1 2 3 4 5 Figure 43. Input Current vs. Input Differential Voltage, VDD = 1.8 V VIO = 3.3 V, VREF = 5 V, 25°C 14957-300 VREF = 4.096V –3 INPUT DIFFERENTIAL VOLTAGE (V) 90% OF VREF = 3.69V 5V –4 14957-343 –12 To achieve the optimum data sheet performance from high resolution precision SAR ADCs, system designers are often forced to use a dedicated high power, high speed amplifier to drive the traditional switched capacitor SAR ADC inputs for their precision applications, which is commonly encountered in designing a precision data acquisition signal chain. The benefits of high-Z mode are low input current for slow (<10 kHz) or dc type signals and improved distortion (THD) performance over a frequency range of up to 100 kHz. High-Z mode allows a choice of lower power and lower bandwidth precision amplifiers with a lower RC filter cutoff to drive the ADC, removing the need for dedicated high speed ADC drivers, which saves system power, size, and cost in precision, low bandwidth applications. High-Z mode allows the amplifier and RC filter in front of the ADC to be chosen based on the signal bandwidth of interest and not based on the settling requirements of the switched capacitor SAR ADC inputs. Additionally, the AD4003/AD4007/AD4011 can be driven with a much higher source impedance than traditional SARs, which means the resistor in the RC filter can have a value 10 times larger than previous SAR designs and, with high-Z mode enabled, can tolerate even larger impedance. Figure 44 shows the THD performance for various source impedances with high-Z mode disabled and enabled. Rev. B | Page 23 of 38 AD4003/AD4007/AD4011 Data Sheet –80 –85 –84 –90 –88 –95 –92 THD (dB) –105 –110 –115 1kΩ HIGH-Z DISABLED 1kΩ HIGH-Z ENABLED 510Ω HIGH-Z DISABLED 510Ω HIGH-Z ENABLED –96 –100 –104 –108 –112 –120 1 10 20 INPUT FREQUENCY (KHz) Figure 44. THD vs. Input Frequency for Various Source Impedance, VDD = 1.8 V, VIO = 3.3 V, VREF = 5 V, 25°C Figure 45 and Figure 46 show the AD4003/AD4007/AD4011 SNR and THD performance using the ADA4077-1 (supply current per amplifier (ISY) = 400 μA) and ADA4610-1 (ISY = 1.5 mA per amplifier) precision amplifiers when driving the AD4003/AD4007/AD4011 at full throughput for high-Z mode enabled and disabled with various RC filter values. These amplifiers achieve 96 dB to 99 dB typical SNR and better than −110 dB THD with high-Z enabled. THD is approximately 10 dB better with high-Z mode enabled, even for large R values. SNR maintains close to 99 dB even with a very low RC filter bandwidth cutoff. When high-Z mode is enabled, the ADC consumes approximately 2 mW per MSPS extra power; however, this is still significantly lower than using dedicated ADC drivers like the ADA4807-1. For any system, the front end usually limits the overall ac/dc performance of the signal chain. It is evident from the data sheets of the selected precision amplifiers, shown in Figure 45 and Figure 46, that their own noise and distortion performance dominates the SNR and THD specification at a certain input frequency. 100 ADA4077-1 HIGH-Z ADA4077-1 HIGH-Z ADA4610-1 HIGH-Z ADA4610-1 HIGH-Z 260kHz 1.3kΩ 470pF DISABLED ENABLED DISABLED ENABLED 1.3MHz 2.27MHz 498kHz 680Ω 390Ω 680Ω 180pF 180pF 470pF RC FILTER BANDWIDTH (Hz) RESISTOR (Ω), CAPACITOR (pF) 4.42MHz 200Ω 180pF Figure 46. THD vs. RC Filter Bandwidths for Various Precision ADC Drivers, fIN = 1 kHz (Turbo Mode On, High-Z Enabled/Disabled) VDD = 1.8 V, VIO = 3.3 V, VREF = 5 V, 25°C Long Acquisition Phase The AD4003/AD4007/AD4011 also feature a very fast conversion time of 290 ns, which results in a long acquisition phase. The acquisition is further extended by a key feature of the AD4003/AD4007/AD4011; the ADC returns back to the acquisition phase typically 100 ns before the end of the conversion. This feature provides an even longer time for the ADC to acquire the new input voltage. A longer acquisition phase reduces the settling requirement on the driving amplifier, and a lower power/bandwidth amplifier can be chosen. The longer acquisition phase means that a lower RC filter (represented by R and C in Figure 33 and Figure 36) cutoff can be used, which means a noisier amplifier can also be tolerated. A larger value of R can be used in the RC filter with a corresponding smaller value of C, reducing amplifier stability concerns without affecting distortion performance significantly. A larger value of R also results in reduced dynamic power dissipation in the amplifier. See Table 10 for details on setting the RC filter bandwidth and choosing a suitable amplifier. 97 SNR (dB) –120 14957-228 –125 –116 150Ω HIGH-Z DISABLED 150Ω HIGH-Z ENABLED 14957-229 THD (dB) –100 94 VOLTAGE REFERENCE INPUT 91 A 10 μF (X7R, 0805 size) ceramic chip capacitor is appropriate for the optimum performance of the reference input. 88 85 82 79 76 70 260kHz 1.3kΩ 470pF 498kHz 1.3MHz 2.27MHz 680Ω 680Ω 390Ω 470pF 180pF 180pF RC FILTER BANDWIDTH (Hz) RESISTOR (Ω), CAPACITOR (pF) 4.42MHz 200Ω 180pF 14957-227 ADA4077-1 HIGH-Z DISABLED ADA4077-1 HIGH-Z ENABLED ADA4610-1 HIGH-Z DISABLED ADA4610-1 HIGH-Z ENABLED 73 For higher performance and lower drift, use a reference such as the ADR4550. Use a low power reference such as the ADR3450 at the expense of a slight decrease in the noise performance. It is recommended to use a reference buffer, such as the ADA4807-1, between the reference and the ADC reference input. It is important to consider the optimum capacitance necessary to keep the reference buffer stable as well as to meet the minimum ADC requirement stated previously in this section (that is, a 10 μF ceramic chip capacitor, CREF). Figure 45. SNR vs. RC Filter Bandwidths for Various Precision ADC Drivers, fIN = 1 kHz (Turbo Mode On, High-Z Enabled/Disabled), VDD = 1.8 V, VIO = 3.3 V, VREF = 5 V, 25°C Rev. B | Page 24 of 38 Data Sheet AD4003/AD4007/AD4011 POWER SUPPLY The AD4003/AD4007/AD4011 use two power supply pins: a core supply (VDD) and a digital input/output interface supply (VIO). VIO allows direct interface with any logic between 1.8 V and 5.5 V. To reduce the number of supplies needed, VIO and VDD can be tied together for 1.8 V operation. The ADP7118 low noise, CMOS, low dropout (LDO) linear regulator is recommended to power the VDD and VIO pins. The AD4003/AD4007/AD4011 are independent of power supply sequencing between VIO and VDD. Additionally, the AD4003/AD4007/AD4011 are insensitive to power supply variations over a wide frequency range, as shown in Figure 47. 80 The mode in which the device operates depends on the SDI level when the CNV rising edge occurs. CS mode is selected if SDI is high, and daisy-chain mode is selected if SDI is low. The SDI hold time is such that when SDI and CNV are connected together, daisy-chain mode is always selected. PSRR (dB) 70 65 60 50 100 1k 10k 100k 1M FREQUENCY (Hz) 14957-302 55 Figure 47. PSRR vs. Frequency, VDD = 1.8 V, VIO = 3.3 V, VREF = 5 V, 25°C The AD4003/AD4007/AD4011 power down automatically at the end of each conversion phase; therefore, the power scales linearly with the sampling rate. This feature makes the device ideal for low sampling rates (even a few samples per second) and battery-powered applications. Figure 48 shows the AD4003/AD4007/AD4011 total power dissipation and individual power dissipation for each rail. VDD VIO REF TOTAL POWER 1k 100 10 1 0.1 0.01 10 POWER DISSIPATION MEASUREMENTS APPLY TO EACH PRODUCT OVER ITS SPECIFIED THROUGHPUT RANGE. 100 1k 10k 100k 1M 2M THROUGHPUT (SPS) 14957-220 POWER DISSIPATION (µW) 10k When in CS mode, the AD4003/AD4007/AD4011 are compatible with SPI, QSPI™, MICROWIRE®, digital hosts, and DSPs. In this mode, the AD4003/AD4007/AD4011 can use either a 3-wire or 4-wire interface. A 3-wire interface using the CNV, SCK, and SDO signals minimizes wiring connections, which is useful, for instance, in isolated applications. A 4-wire interface using the SDI, CNV, SCK, and SDO signals allows CNV, which initiates the conversions, to be independent of the readback timing (SDI). This interface is useful in low jitter sampling or simultaneous sampling applications. The AD4003/AD4007/AD4011 provide a daisy-chain feature using the SDI input for cascading multiple ADCs on a single data line, similar to a shift register. 75 100k modes. The AD4003/AD4007/AD4011 can also be programmed via 16-bit SPI writes to the configuration registers. Figure 48. Power Dissipation vs. Throughput, VDD = 1.8 V, VIO = 3.3 V, VREF = 5 V, 25°C DIGITAL INTERFACE Although the AD4003/AD4007/AD4011 have a reduced number of pins, they offer flexibility in their serial interface In either 3-wire or 4-wire mode, the AD4003/AD4007/AD4011 offer the option of forcing a start bit in front of the data bits. This start bit can be used as a busy signal indicator to interrupt the digital host and trigger the data reading. Otherwise, without a busy indicator, the user must time out the maximum conversion time prior to readback. The busy indicator feature is enabled in CS mode if CNV or SDI is low when the ADC conversion ends. The state of the SDO on power-up is either low or high-Z depending on the states of CNV and SDI, as shown in Table 11. Table 11. State of SDO on Power-Up CNV 0 0 1 1 SDI 0 1 0 1 SDO Low Low Low High-Z The AD4003/AD4007/AD4011 have turbo mode capability in both 3-wire and 4-wire mode. Turbo mode is enabled by writing to the configuration register and replaces the busy indicator feature when enabled. Turbo mode allows a slower SPI clock rate, making interfacing simpler. The maximum throughput of 2 MSPS for the AD4003 can be achieved only with turbo mode enabled and a minimum SCK rate of 75 MHz. The SCK rate must be sufficiently fast to ensure the conversion result is clocked out before another conversion is initiated. The minimum required SCK rate for an application can be derived based on the sample period (tCYC), the number of bits that must be read (including data and optional status bits), and the digital interface mode being used. Timing diagrams and explanations for each digital interface mode are given in the digital modes of operation sections Rev. B | Page 25 of 38 AD4003/AD4007/AD4011 Data Sheet by seven command bits. This command determines whether that operation is a write or a read. The AD4003/AD4007/ AD4011 command register is shown in Table 13. below (see the CS Mode, 3-Wire Turbo Mode section through the CS Mode, 4-Wire with Busy Indicator section). Status bits can also be clocked out at the end of the conversion data if the status bits are enabled in the configuration register. There are six status bits in total as described in Table 12. Table 13. Command Register The AD4003/AD4007/AD4011 are configured by 16-bit SPI writes to the desired configuration register. The 16-bit word can be written via the SDI line while CNV is held low. The 16-bit word consists of an 8-bit header and 8-bit register data. For isolated systems, the ADuM141D is recommended, which can support the 75 MHz SCK rate requires to run the AD4003 at its full throughput of 2 MSPS. REGISTER READ/WRITE FUNCTIONALITY The AD4003/AD4007/AD4011 register bits are programmable, and their default statuses are shown in Table 12. The register map is shown in Table 14. The OV clamp flag is a read only sticky bit, and it is cleared only if the register is read and the overvoltage condition is no longer present. The OV clamp flag gives an indication of overvoltage condition when it is set to 0. Bit 6 R/W Bit 5 0 Bit 4 1 Bit 3 0 Bit 2 1 Bit 1 0 Bit 0 0 All register read/writes must occur while CNV is low. Data on SDI is clocked in on the rising edge of SCK. Data on SDO is clocked out on the falling edge of SCK. At the end of the data transfer, SDO is put in a high impedance state on the rising edge of CNV if daisy-chain mode is not enabled. If daisy-chain mode is enabled, SDO goes low on the rising edge of CNV. Register reads are not allowed in daisy-chain mode. A register write requires three signal lines: SCK, CNV, and SDI. During a register write, to read the current conversion results on SDO, the CNV pin must be brought low after the conversion is completed; otherwise, the conversion results may be incorrect on SDO. However, the register write occurs regardless. The LSB of each configuration register is reserved because a user reading 16-bit conversion data may be limited to a 16-bit SPI frame. The state of SDI on the last bit in the SDI frame may be the state that then persists when CNV rises. Because interface mode is partly set based on the SDI state when CNV rises, in this scenario, the user may need to set the final SDI state. Table 12. Register Bits Register Bits OV Clamp Flag Span Compression High-Z Mode Turbo Mode Enable Six Status Bits Bit 7 WEN Default Status 1 bit, 1 = inactive (default) 1 bit, 0 = disabled (default) 1 bit, 0 = disabled (default) 1 bit, 0 = disabled (default) 1 bit, 0 = disabled (default) All access to the register map must start with a write to the 8-bit command register in the SPI interface block. The AD4003/ AD4007/AD4011 ignore all 1s until the first 0 is clocked in (represented by WEN in Figure 49, Figure 50, and Table 13); the value loaded into the command register is always a 0 followed The timing diagrams in Figure 49 through Figure 51 show how data is read and written when the AD4003/AD4007/AD4011 are configured in register read, write, and daisy-chain mode. Table 14. Register Map ADDR[1:0] 0x0 Bit 7 Reserved Bit 6 Reserved Bit 5 Reserved Bit 4 Enable six status bits Bit 3 Span compression Rev. B | Page 26 of 38 Bit 2 High-Z mode Bit 1 Turbo mode Bit 0 OV clamp flag (read only sticky bit) Reset 0xE1 Data Sheet AD4003/AD4007/AD4011 tCYC tCNVH tSCK CNV tSCNVSCK SCK 1 tSCKL 2 3 4 5 6 8 7 9 10 11 tHSDISCK tSSDISCK SDI 1 WEN 0 1 0 1 ADDR[1:0] 1 0 1 0 1 0 0 D16 15 16 D15 D13 D14 D12 D11 B6 B7 D10 tDIS B5 B3 B4 B2 B1 X1 B0 14957-021 D17 14 tHSDO tDSDO tEN SDO 13 tSCKH R/W 0 12 1X INDICATES A DON’T CARE BIT. Figure 49. Register Read Timing Diagram tCYC tCNVH tSCK 1 tHCNVSCK CNV tSCNVSCK SCK 1 tSCKL 2 3 4 9 5 10 11 tHSDISCK 12 13 14 15 16 17 18 tSCKH tSSDISCK 1 SDI WEN R/W 0 1 0 1 0 0 1 0 1 0 ADDR[1:0] 0 B7 B6 0 D17 D16 D15 D14 D13 D12 D11 B4 B3 B2 B1 1 B0 tHSDO tDSDO EN SDO B5 D10 D8 D9 D7 D6 D5 D4 D3 D2 D1 D0 14957-022 CONVERSION RESULT ON D17:0 1THE USER MUST WAIT t CONV TIME WHEN READING BACK THE CONVERSION RESULT AND DOING A REGISTER WRITE AT THE SAME TIME. Figure 50. Register Write Timing Diagram tCYC tCNVH tSCK CNV tSCNVSCK SCK tSCKL 1 24 tSCKH SDIA SDOA /SDIB 0 COMMAND (0x14) 0 DATA (0xAB) COMMAND (0x14) 0 DATA (0xAB) 0 0 COMMAND (0x14) Figure 51. Register Write Timing Diagram, Daisy-Chain Mode Rev. B | Page 27 of 38 0 14957-023 tDIS SDOB AD4003/AD4007/AD4011 Data Sheet The SDO line returns to high impedance after the sixth status bit is clocked out (except in daisy-chain mode). The user is not required to clock out all status bits to start the next conversion. The serial interface timing for CS mode, 3-wire without busy indicator, including status bits, is shown in Figure 52. STATUS WORD The 6-bit status word can be appended to the end of a conversion result, and the default conditions of these bits are shown in Table 15. The status bits must be enabled in the register setting. When the OV clamp flag is a 0, it indicates an overvoltage condition. The OV clamp flag status bit updates on a per conversion basis. Table 15. Status Bits (Default Conditions) Bit 5 OV clamp flag Bit 4 Span compression Bit 3 High-Z mode Bit 2 Turbo mode Bit 1 Reserved Bit 0 Reserved SDI = 1 tCYC tCNVH CN V tACQ CONVERSION ACQUISITION tSCK tCONV tQUIET2 tSCKL SCK 1 2 3 16 23 24 tSCKH tHSDO tEN SDO 22 18 17 tDSDO D17 D16 D15 tDIS D1 D0 b1 STATUS BITS B[5:0] Figure 52. CS Mode, 3-Wire Without Busy Indicator Serial Interface Timing Diagram Including Status Bits (SDI High) Rev. B | Page 28 of 38 b0 14957-024 ACQUISITION Data Sheet AD4003/AD4007/AD4011 When SDI is forced high, a rising edge on CNV initiates a conversion. The previous conversion data is available to read after the CNV rising edge. The user must wait tQUIET1 time after CNV is brought high before bringing CNV low to clock out the previous conversion result. The user must also wait tQUIET2 time after the last falling edge of SCK to when CNV is brought high. CS MODE, 3-WIRE TURBO MODE This mode is typically used when a single AD4003/AD4007/ AD4011 device is connected to an SPI-compatible digital host. It provides additional time during the end of the ADC conversion process to clock out the previous conversion result, providing a lower SCK rate. The AD4003 can achieve a throughput rate of 2 MSPS only when turbo mode is enabled and using a minimum SCK rate of 75 MHz. With turbo mode enabled, the AD4007 can also achieve its maximum throughput rate of 1 MSPS with a minimum SCK rate of 25 MHz, and the AD4011 can achieve its maximum throughput rate of 500 kSPS with a minimum SCK rate of 11 MHz. The connection diagram is shown in Figure 53, and the corresponding timing diagram is shown in Figure 54. When the conversion is complete, the AD4003/AD4007/AD4011 enter the acquisition phase and power down. When CNV goes low, the MSB is output to SDO. The remaining data bits are clocked by subsequent SCK falling edges. The data is valid on both SCK edges. Although the rising edge can capture the data, a digital host using the SCK falling edge allows a faster reading rate, provided it has an acceptable hold time. After the 18th SCK falling edge or when CNV goes high (whichever occurs first), SDO returns to high impedance. This mode replaces the 3-wire with busy indicator mode by programming the turbo mode bit, Bit 1 (see Table 14). CONVERT DIGITAL HOST CNV VIO SDI AD4003/ AD4007/ AD4011 SDO DATA IN 14957-425 SCK CLK Figure 53. CS Mode, 3-Wire Turbo Mode Connection Diagram (SDI High) SDI = 1 tCYC CNV tACQ CONVERSION ACQUISITION ACQUISITION tSCK CONV tSCKL QUIET2 tQUIET1 2 3 16 17 tSCKH tHSDO tEN SDO 18 tDSDO D17 D16 D15 tDIS D1 D0 Figure 54. CS Mode, 3-Wire Turbo Mode Serial Interface Timing Diagram (SDI High) Rev. B | Page 29 of 38 14957-029 1 SCK AD4003/AD4007/AD4011 Data Sheet When the conversion is complete, the AD4003/AD4007/ AD4011 enter the acquisition phase and power down. When CNV goes low, the MSB is output onto SDO. The remaining data bits are clocked by subsequent SCK falling edges. The data is valid on both SCK edges. Although the rising edge can capture the data, a digital host using the SCK falling edge allows a faster reading rate, provided it has an acceptable hold time. After the 18th SCK falling edge or when CNV goes high (whichever occurs first), SDO returns to high impedance. CS MODE, 3-WIRE WITHOUT BUSY INDICATOR This mode is typically used when a single AD4003/AD4007/ AD4011 device is connected to an SPI-compatible digital host. The connection diagram is shown in Figure 55, and the corresponding timing diagram is shown in Figure 56. With SDI tied to VIO, a rising edge on CNV initiates a conversion, selects the CS mode, and forces SDO to high impedance. After a conversion is initiated, it continues until completion irrespective of the state of CNV. This feature can be useful, for instance, to bring CNV low to select other SPI devices, such as analog multiplexers; however, CNV must be returned high before the minimum conversion time elapses and then held high for the maximum possible conversion time to avoid the generation of the busy signal indicator. There must not be any digital activity on SCK during the conversion. CONVERT DIGITAL HOST CNV VIO SDI AD4003/AD4007/ AD4011 SDO DATA IN 14957-025 SCK CLK Figure 55. CS Mode, 3-Wire Without Busy Indicator Connection Diagram (SDI High) SDI = 1 tCYC tCNVH CNV tACQ ACQUISITION CONVERSION tSCK tCONV tSCKL SCK 1 2 3 16 tHSDO 17 18 tSCKH tEN SDO tQUIET2 tDSDO D17 D16 D15 tDIS D1 Figure 56. CS Mode, 3-Wire Without Busy Indicator Serial Interface Timing Diagram (SDI High) Rev. B | Page 30 of 38 D0 14957-026 ACQUISITION Data Sheet AD4003/AD4007/AD4011 When the conversion is complete, SDO goes from high impedance to low impedance. With a pull-up resistor of 1 kΩ on the SDO line, this transition can be used as an interrupt signal to initiate the data reading controlled by the digital host. The AD4003/AD4007/AD4011 then enter the acquisition phase and power down. The data bits are then clocked out, MSB first, by subsequent SCK falling edges. The data is valid on both SCK edges. Although the rising edge can capture the data, a digital host using the SCK falling edge allows a faster reading rate, provided it has an acceptable hold time. After the optional 19th SCK falling edge or when CNV goes high (whichever occurs first), SDO returns to high impedance. CS MODE, 3-WIRE WITH BUSY INDICATOR This mode is typically used when a single AD4003/AD4007/ AD4011 device is connected to an SPI-compatible digital host with an interrupt input (IRQ). The connection diagram is shown in Figure 57, and the corresponding timing diagram is shown in Figure 58. With SDI tied to VIO, a rising edge on CNV initiates a conversion, selects the CS mode, and forces SDO to high impedance. SDO is maintained in high impedance until the completion of the conversion irrespective of the state of CNV. Prior to the minimum conversion time, CNV can select other SPI devices, such as analog multiplexers; however, CNV must be returned low before the minimum conversion time elapses and then held low for the maximum possible conversion time to guarantee the generation of the busy signal indicator. If multiple AD4003/AD4007/AD4011 devices are selected at the same time, the SDO output pin handles this contention without damage or induced latch-up. Meanwhile, it is recommended to keep this contention as short as possible to limit extra power dissipation. There must not be any digital activity on the SCK during the conversion. CONVERT VIO DIGITAL HOST CNV VIO 1kΩ AD4003/AD4007/ AD4011 SDO DATA IN IRQ SCK 14957-027 SDI CLK Figure 57. CS Mode, 3-Wire with Busy Indicator Connection Diagram (SDI High) SDI = 1 tCYC tCNVH CNV tACQ CONVERSION ACQUISITION tSCK tCONV tSCKL SCK 1 2 3 tQUIET2 17 tHSDO 18 19 tSCKH tDSDO SDO D17 D16 tDIS D1 Figure 58. CS Mode, 3-Wire with Busy Indicator Serial Interface Timing Diagram (SDI High) Rev. B | Page 31 of 38 D0 14957-028 ACQUISITION AD4003/AD4007/AD4011 Data Sheet With SDI high, a rising edge on CNV initiates a conversion. The previous conversion data is available to read after the CNV rising edge. The user must wait tQUIET1 time after CNV is brought high before bringing SDI low to clock out the previous conversion result. The user must also wait tQUIET2 time after the last falling edge of SCK to when CNV is brought high. CS MODE, 4-WIRE TURBO MODE This mode is typically used when a single AD4003/AD4007/ AD4011 is connected to an SPI-compatible digital host. It provides additional time during the end of the ADC conversion process to clock out the previous conversion result, giving a lower SCK rate. The AD4003 can achieve a throughput rate of 2 MSPS only when turbo mode is enabled and using a minimum SCK rate of 75 MHz. With turbo mode enabled, the AD4007 can also achieve its maximum throughput rate of 1 MSPS with a minimum SCK rate of 25 MHz, and the AD4011 can achieve its maximum throughput rate of 500 kSPS with a minimum SCK rate of 11 MHz. The connection diagram is shown in Figure 59, and the corresponding timing diagram is shown in Figure 60. When the conversion is complete, the AD4003/AD4007/AD4011 enter the acquisition phase and power down. The ADC result can be read by bringing its SDI input low, which consequently outputs the MSB onto SDO. The remaining data bits are then clocked by subsequent SCK falling edges. The data is valid on both SCK edges. Although the rising edge can capture the data, a digital host using the SCK falling edge allows a faster reading rate, provided it has an acceptable hold time. After the 18th SCK falling edge or when SDI goes high (whichever occurs first), SDO returns to high impedance. This mode replaces the 4-wire with busy indicator mode by programming the turbo mode bit, Bit 1 (see Table 14). CS1 CONVERT VIO DIGITAL HOST CNV AD4003/ AD4007/ AD4011 SDO DATA IN IRQ SCK 14957-432 SDI 1kΩ CLK Figure 59. CS Mode, 4-Wire Turbo Mode Connection Diagram CNV tCYC tSSDICNV SDI tHSDICNV ACQUISITION tACQ CONVERSION ACQUISITION tSCK tCONV tSCKL tQUIET2 tQUIET1 1 2 3 16 tHSDO 18 tSCKH tEN SDO 17 tDIS tDSDO D17 D16 D15 Figure 60. CS Mode, 4-Wire Turbo Mode Timing Diagram Rev. B | Page 32 of 38 D1 D0 14957-034 SCK Data Sheet AD4003/AD4007/AD4011 When the conversion is complete, the AD4003/AD4007/ AD4011 enter the acquisition phase and power down. Each ADC result can be read by bringing its SDI input low, which consequently outputs the MSB onto SDO. The remaining data bits are then clocked by subsequent SCK falling edges. The data is valid on both SCK edges. Although the rising edge can capture the data, a digital host using the SCK falling edge allows a faster reading rate, provided it has an acceptable hold time. After the 18th SCK falling edge or when SDI goes high (whichever occurs first), SDO returns to high impedance and another AD4003/AD4007/AD4011 can be read. CS MODE, 4-WIRE WITHOUT BUSY INDICATOR This mode is typically used when multiple AD4003/AD4007/ AD4011 devices are connected to an SPI-compatible digital host. A connection diagram example using two AD4003/AD4007/ AD4011 devices is shown in Figure 61, and the corresponding timing diagram is shown in Figure 62. With SDI high, a rising edge on CNV initiates a conversion, selects the CS mode, and forces SDO to high impedance. In this mode, CNV must be held high during the conversion phase and the subsequent data readback. If SDI and CNV are low, SDO is driven low. Prior to the minimum conversion time, SDI can select other SPI devices, such as analog multiplexers; however, SDI must be returned high before the minimum conversion time elapses and then held high for the maximum possible conversion time to avoid the generation of the busy signal indicator. CS2 CS1 CONVERT CNV CNV SDI AD4003/AD4007/ AD4011 SDO SDI AD4003/AD4007/ AD4011 DEVICE A DEVICE B SCK SCK DIGITAL HOST SDO 14957-030 DATA IN CLK Figure 61. CS Mode, 4-Wire Without Busy Indicator Connection Diagram CYC CNV tACQ ACQUISITION CONVERSION ACQUISITION tCONV tQUIET2 tSSDICNV SDI (CS1) tHSDICNV SDI (CS2) tSCK tSCKL 1 2 3 16 tHSDO 18 19 20 34 35 36 tSCKH tDSDO tEN SDO 17 D17 D16 D15 tDIS D1 D0 D17 D16 Figure 62. CS Mode, 4-Wire Without Busy Indicator Serial Interface Timing Diagram Rev. B | Page 33 of 38 D1 D0 14957-031 SCK AD4003/AD4007/AD4011 Data Sheet SDI must be returned low before the minimum conversion time elapses and then held low for the maximum possible conversion time to guarantee the generation of the busy signal indicator. CS MODE, 4-WIRE WITH BUSY INDICATOR This mode is typically used when a single AD4003/AD4007/ AD4011 device is connected to an SPI-compatible digital host with an interrupt input (IRQ), and when it is desired to keep CNV, which samples the analog input, independent of the signal used to select the data reading. This independence is particularly important in applications where low jitter on CNV is desired. When the conversion is complete, SDO goes from high impedance to low impedance. With a pull-up resistor of 1 kΩ on the SDO line, this transition can be used as an interrupt signal to initiate the data readback controlled by the digital host. The AD4003/ AD4007/AD4011 then enter the acquisition phase and power down. The data bits are then clocked out, MSB first, by subsequent SCK falling edges. The data is valid on both SCK edges. Although the rising edge can capture the data, a digital host using the SCK falling edge allows a faster reading rate, provided it has an acceptable hold time. After the optional 19th SCK falling edge or when SDI goes high (whichever occurs first), SDO returns to high impedance. The connection diagram is shown in Figure 63, and the corresponding timing diagram is shown in Figure 64. With SDI high, a rising edge on CNV initiates a conversion, selects the CS mode, and forces SDO to high impedance. In this mode, CNV must be held high during the conversion phase and the subsequent data readback. If SDI and CNV are low, SDO is driven low. Prior to the minimum conversion time, SDI can select other SPI devices, such as analog multiplexers; however, CS1 CONVERT VIO DIGITAL HOST CNV 1kΩ AD4003/AD4007/ AD4011 SDO DATA IN IRQ SCK 14957-032 SDI CLK Figure 63. CS Mode, 4-Wire with Busy Indicator Connection Diagram tCYC CNV tACQ ACQUISITION CONVERSION ACQUISITION tCONV tQUIET2 tSSDICNV SDI tSCK tHSDICNV tSCKL SCK 1 2 3 17 18 19 tSCKH tHSDO tDSDO tDIS SDO D17 D16 D1 Figure 64. CS Mode, 4-Wire with Busy Indicator Serial Interface Timing Diagram Rev. B | Page 34 of 38 D0 14957-033 tEN Data Sheet AD4003/AD4007/AD4011 rising edges. Each ADC in the daisy-chain outputs its data MSB first, and 18 × N clocks are required to read back the N ADCs. The data is valid on both SCK edges. The maximum conversion rate is reduced because of the total readback time. DAISY-CHAIN MODE Use this mode to daisy-chain multiple AD4003/AD4007/AD4011 devices on a 3-wire or 4-wire serial interface. This feature is useful for reducing component count and wiring connections, for example, in isolated multiconverter applications or for systems with a limited interfacing capacity. Data readback is analogous to clocking a shift register. It is possible to write to each ADC register in daisy-chain mode. The timing diagram is shown in Figure 51. This mode requires 4-wire operation because data is clocked in on the SDI line with CNV held low. The same command byte and register data can be shifted through the entire chain to program all ADCs in the chain with the same register contents, which requires 8 × (N + 1) clocks for N ADCs. It is possible to write different register contents to each ADC in the chain by writing to the furthest ADC in the chain, first using 8 × (N + 1) clocks, and then the second furthest ADC with 8 × N clocks, and so forth until reaching the nearest ADC in the chain, which requires 16 clocks for the command and register data. It is not possible to read register contents in daisy-chain mode; however, the six status bits can be enabled if the user wants to determine the ADC configuration. Note that enabling the status bits requires six extra clocks to clock out the ADC result and the status bits per ADC in the chain. Turbo mode cannot be used in daisy-chain mode. A connection diagram example using two AD4003/AD4007/ AD4011 devices is shown in Figure 65, and the corresponding timing diagram is shown in Figure 66. When SDI and CNV are low, SDO is driven low. With SCK low, a rising edge on CNV initiates a conversion, selects daisy-chain mode, and disables the busy indicator. In this mode, CNV is held high during the conversion phase and the subsequent data readback. When the conversion is complete, the MSB is output onto SDO and the AD4003/AD4007/AD4011 enter the acquisition phase and power down. The remaining data bits stored in the internal shift register are clocked out of SDO by subsequent SCK falling edges. For each ADC, SDI feeds the input of the internal shift register and is clocked by the SCK CONVERT SDI CNV AD4003/AD4007/ AD4011 SDO SDI DIGITAL HOST AD4003/AD4007/ AD4011 DEVICE A DEVICE B SCK SCK SDO DATA IN 14957-036 CNV CLK Figure 65. Daisy-Chain Mode Connection Diagram SDIA = 0 tCYC CNV tACQ CONVERSION ACQUISITION tCONV tSCK tSCKL tQUIET2 SCK 1 2 3 16 17 tSSDISCK tHSCKCNV tQUIET2 18 19 20 34 35 36 tSCKH tHSDISCK tEN D A17 SDOA = SDIB DA16 DA15 DA1 DA0 tHSDO tDIS tDSDO SDOB D B17 DB16 DB15 DB1 DB0 DA17 Figure 66. Daisy-Chain Mode Serial Interface Timing Diagram Rev. B | Page 35 of 38 DA16 DA1 DA0 14957-037 ACQUISITION AD4003/AD4007/AD4011 Data Sheet LAYOUT GUIDELINES The PCB that houses the AD4003/AD4007/AD4011 must be designed so that the analog and digital sections are separated and confined to certain areas of the board. The pinout of the AD4003/ AD4007/AD4011, with its analog signals on the left side and its digital signals on the right side, eases this task. At least one ground plane must be used. It can be common or split between the digital and analog sections. In the latter case, join the planes underneath the AD4003/AD4007/AD4011 devices. 14957-038 Avoid running digital lines under the device because they couple noise onto the die, unless a ground plane under the AD4003/ AD4007/AD4011 is used as a shield. Fast switching signals, such as CNV or clocks, must not run near analog signal paths. Avoid crossover of digital and analog signals. Figure 67. Example Layout of the AD4003 (Top Layer) The AD4003/AD4007/AD4011 voltage reference input (REF) has a dynamic input impedance. Decouple the REF pin with minimal parasitic inductances by placing the reference decoupling ceramic capacitor close to (ideally right up against) the REF and GND pins and connect them with wide, low impedance traces. An example of the AD4003 layout following these rules is shown in Figure 67 and Figure 68. Note that the AD4007/AD4011 layout is equivalent to the AD4003 layout. EVALUATING THE AD4003/AD4007/AD4011 PERFORMANCE Other recommended layouts for the AD4003/AD4007/AD4011 are outlined in the user guide of the evaluation board for the AD4003 (EVAL-AD4003FMCZ). The evaluation board package includes a fully assembled and tested evaluation board with the AD4003 documentation, and software for controlling the board from a PC via the EVAL-SDP-CH1Z. The EVAL-AD4003FMCZ can also be used to evaluate the AD4007/AD4011 by limiting the throughput to 1 MSPS/500 kSPS in its software (see UG-1042). Rev. B | Page 36 of 38 14957-039 Finally, decouple the VDD and VIO power supplies of the AD4003/AD4007/AD4011 with ceramic capacitors, typically 0.1 μF placed close to the AD4003/AD4007/AD4011 and connected using short, wide traces to provide low impedance paths and to reduce the effect of glitches on the power supply lines. Figure 68. Example Layout of the AD4003 (Bottom Layer) Data Sheet AD4003/AD4007/AD4011 OUTLINE DIMENSIONS 3.10 3.00 2.90 10 3.10 3.00 2.90 1 5.15 4.90 4.65 6 5 PIN 1 IDENTIFIER 0.50 BSC 0.95 0.85 0.75 15° MAX 1.10 MAX 0.30 0.15 0.70 0.55 0.40 0.23 0.13 6° 0° 091709-A 0.15 0.05 COPLANARITY 0.10 COMPLIANT TO JEDEC STANDARDS MO-187-BA Figure 69. 10-Lead Mini Small Outline Package [MSOP] (RM-10) Dimensions shown in millimeters DETAIL A (JEDEC 95) 2.48 2.38 2.23 3.10 3.00 SQ 2.90 0.50 BSC 10 6 1.74 1.64 1.49 EXPOSED PAD 0.50 0.40 0.30 1 5 BOTTOM VIE W TOP VIEW PKG-004362 0.80 0.75 0.70 SEATING PLANE SIDE VIEW 0.30 0.25 0.20 0.05 MAX 0.02 NOM COPLANARITY 0.08 PIN 1 INDIC ATOR AREA OPTIONS (SEE DETAIL A) FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 0.20 REF Figure 70. 10-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm × 3 mm Body and 0.75 mm Package Height (CP-10-9) Dimensions shown in millimeters Rev. B | Page 37 of 38 0.20 MIN 02-07-2017-C PIN 1 INDEX AREA AD4003/AD4007/AD4011 Data Sheet ORDERING GUIDE Model1,2 AD4003BRMZ AD4003BRMZ-RL7 AD4003BCPZ-RL7 AD4007BRMZ AD4007BRMZ-RL7 AD4007BCPZ-RL7 AD4011BCPZ-RL7 EVAL-AD4003FMCZ 1 2 Integral Nonlinearity (INL) ±1.0 LSB ±1.0 LSB ±1.0 LSB ±1.0 LSB ±1.0 LSB ±1.0 LSB ±1.0 LSB Temperature Range −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C Ordering Quantity Tube, 50 Reel, 1000 Reel, 1500 Tube, 50 Reel, 1000 Reel, 1500 Reel, 1500 Package Description 10-Lead MSOP 10-Lead MSOP 10-Lead LFCSP 10-Lead MSOP 10-Lead MSOP 10-Lead LFCSP 10-Lead LFCSP AD4003 Evaluation Board Compatible with EVAL-SDP-CH1Z Package Option RM-10 RM-10 CP-10-9 RM-10 RM-10 CP-10-9 CP-10-9 Branding C8C C8C C8C C8R C8R C8R C8V Z = RoHS Compliant Part. The EVAL-AD4003FMCZ can also be used to evaluate the AD4007 and AD4011 by setting the throughput to 1 MSPS and 500 kSPS in its software, respectively (see UG-1042). ©2016–2017 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D14957-0-10/17(B) Rev. B | Page 38 of 38