0.80mm (.031”) Pitch SFP Stacked Multi-Port Connectors FEATURES AND SPECIFICATIONS 75310, 75786, 75460, 75787, 75462, 75640, 75759, 75714, 75454, 75450, 75733, 75734, 75477, 75451 Upgrade to high-speed Ethernet and Fibre Channel ports with Molex’s Stacked Multi-Port SFP Connectors Molex is rapidly expanding its Small Form-factor Pluggable (SFP) product offering to meet the demands of networking and storage industries, which require denser and faster packaging for high-speed serial interfaces. The new SFP Stacked Multi-Port Connectors are the latest additions to Molex’s extensive SFP product line. These new connectors offer high port density with complete integration of stacked 20-circuit SFP connector ports within a cage. Integrated lightpipes are available to provide port-status indication to the user. The product line encompasses connectors offered in two heights and is available in five port configurations: 2-by-1, 2-by-2, 2-by-4, 2-by-5 and 2-by-6. Molex’s SFP Stacked Multi-Port Connectors accept SFP MSA-compliant modules, allowing installers to configure and upgrade high-speed Ethernet and Fibre Channel (FC) ports. Tin/Lead press-fit connector tails are provided as the standard option. Tin-plated tails will also be available to meet lead-free requirements. Contact Molex for additional information. Features and Benefits ■ High-speed contact design meets 4.25Gbps SFP requirements and is capable of speeds up to 10Gbps ■ Connectors are available in multiple port configurations (2, 4, 8, 10 and 12) providing greater port density and reduced PCB assembly labor Multi-port connectors with lightpipes ■ Integrated lightpipe option, for use with mono or bi- ■ Connectors are available in 2 heights: medium Mechanical Insertion Force to PCB: 35.59N (8 lb) per compliant pin, max. Mating Force: 40N (8.99 lb) max. Unmating Force: 11.5N (2.59 lb) max. Durability: 100 cycles Physical Housing: High-temperature plastic, Glass-filled Contact: Tin/Brass (Sn/CuZn) Plating: Contact Area — Gold (Au) Solder Tail Area — Tin/Lead (Sn/Pb) or Tin (Sn) Underplating — Nickel (Ni) PCB Thickness: 2.36mm (0.093”) Operating Temperature: -40 to +85°C color SMT LED’s provides port status and activity feedback ■ Modules are oriented “belly-to-belly” when inserted assuring ease of module removal from the port 25.50mm (1.000”) and tall 29.30mm (1.150”); Medium-height connectors meet industry standard and are consistent with the stacked multi-port modular jack design; Tall-height connector (2-by-1 only) is designed for 1U applications SPECIFICATIONS Reference Information Packaging: Tray UL File No.: E29179 CSA File No.: LR19980 Mates With: SFP MSA-compliant modules Designed In: Millimeters Electrical Voltage: 120V Current: 0.5A max. Dielectric Withstanding Voltage: 300V Insulation Resistance: 1 Megohm 0.80mm (.031”) Pitch SFP Stacked Multi-Port Connectors APPLICATIONS ■ Networking, Storage and Telecommunication - Hubs - Routers - Servers - Switches 75310, 75786, 75460, 75787, 75462, 75640, 75759, 75714, 75454, 75450, 75733, 75734, 75477, 75451 ORDERING INFORMATION Order No. Port Configuration Height Mounting 75310-0001 75786-0001 75460-0001 75787-0001 Lightpipes Through-hole 29.30mm (1.150”) 2-by-1 Gasket with flange Press-fit Yes Through-hole Gasket with extended flange 75462-0001 No 75640-0001 Yes 75759-0001 75714-0001 75454-0001 75450-0001 75733-0001 75734-0001 75477-0001 75451-0001 Americas Headquarters Lisle, Illinois 60532 U.S.A. 1-800-78MOLEX [email protected] EMI Protection No 2-by-2 Yes 2-by-4 25.50mm (1.000”) Press-fit No Yes Spring fingers No 2-by-5 Yes No 2-by-6 Yes Far East North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 [email protected] Far East South Headquarters Jurong, Singapore 65-6-268-6868 [email protected] European Headquarters Munich, Germany 49-89-413092-0 [email protected] Corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. 630-969-4550 Fax:630-969-1352 Visit our Web site at http://www.molex.com/product/SFP_Stacked_Connectors Order No. USA-321 Printed in USA/JI/2005.08 ©2005 Molex