TI CD74ACT241M96 Octal vuffer line drivers 3-state Datasheet

Data sheet acquired from Harris Semiconductor
SCHS287B − Revised January 2004
The RCA CD54/74AC240, CD54/74AC241, and CD54/74AC244 and the
CD54/74ACT240, CD54/74ACT241, and CD54/74ACT244 3-state octal
buffer/line drivers use the RCA ADVANCED CMOS technology. The
CD54/74AC/ACT240 and CD54/74AC/ACT244 have active-LOW output
enables (1OE, 2OE). The CD54/74AC/ACT241 has one active-LOW (1OE)
and one active-HIGH (2OE) output enable.
The CD74AC240 and CD74ACT240 are supplied in 20-lead dual-in-line
plastic packages (E suffix) and 20-lead small-outline packages (M and
M96 suffixes). The CD74AC241 is supplied in 20-lead dual-in-line plastic
packages (E suffix) and the CD74ACT241 is supplied in 20-lead
dual-in-line plastic packages (E suffix) and 20-lead small-outline
packages (M96 suffix). The CD74AC244 and CD74ACT244 are supplied
in 20-lead dual-in-line plastic packages (E suffix), 20-lead small-outline
packages (M and M96 suffixes), and 20-lead shrink small-outline
packages (SM96 suffix). These package types are operable over the
following temperature ranges: Commerical (0 to 705C); Industrial (−40
to +855C); and Extended Industrial/Military (−55 to + 1255C).
The CD54AC240 and CD54AC244 and the CD54ACT240, CD54ACT241,
and CD54ACT244 are supplied in 20-lead hermetic dual-in-line ceramic
packages (F3A suffix) and are operable over the −55 to +1255C
temperature range.
This data sheet is applicable to the CD54/74AC240, CD54ACT240, and CD54/74ACT241. The CD54/74AC241 were not acquired from
Harris Semiconductor. See SCHS244 for information on the CD74ACT240, CD74AC244, and CD74ACT244.
Copyright  2004, Texas Instruments Incorporated
For TA = -40 to +85°C (Package Type E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 mW
For TA = -40 to +70°C (Package Type M) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mW
For TA = +70 to +85°C (Package Type M) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Derate Linearly at 6 mW/°C to 310 mW
OPERATING-TEMPERATURE RANGE (TA): CD54 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55 to +125°C
CD74 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 to +85°C
STORAGE TEMPERATURE (Tstg) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65 to +150°C
LEAD TEMPERATURE (DURING SOLDERING):
At distance 1/16 ± 1/32 in. (1.59 ± 0.79 mm) from case for 10 s maximum. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..+265°C
Unit inserted into PC board min. thickness 1/16 in. (1.59 mm) with solder contacting lead tips only. . . . . . . . . . . . . . . . . . . . . . . . . . .+300°C
* For up to 4 outputs per device: add ± 25 mA for each additional output.
LIMITS
CHARACTERISTIC
Supply-Voltage Range, VCC*:
(For TA = Full Package-Temperature Range)
AC Types
ACT Types
DC Input or Output Voltage, VI, Vo
Operating Temperature, TA
Input Rise and Fall Slew Rate, dt/dv
at 1.5 V to 3 V (AC Types)
at 3.6 v to 5.5 V (AC Types)
at 4.5 V to 5.5 V (ACT Types)
* Unless otherwise specified, all voltages are referenced to ground.
CD54
CD74
UNITS
MIN.
MAX.
1.5
4.5
5.5
5.5
V
V
0
V
-55
-40
VCC
+125
+85
0
0
0
50
20
10
°C
ns/V
ns/V
ns/V
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
CD54AC240F3A
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
CD54AC244F3A
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
CD54ACT240F3A
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
CD54ACT241F3A
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
CD54ACT244F3A
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
CD74AC240E
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74AC240EE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74AC240M
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC240M96
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC240M96E4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC240M96G4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC240ME4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC240MG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC244E
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74AC244EE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74AC244M
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC244M96
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC244M96E4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC244M96G4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC244ME4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC244MG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC244SM96
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC244SM96E4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC244SM96G4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT240E
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74ACT240EE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74ACT240M
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 1
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
CD74ACT240M96
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT240M96E4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT240M96G4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT240ME4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT240MG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT241E
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74ACT241EE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74ACT241M96
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT241M96E4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT241M96G4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT244E
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74ACT244EE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74ACT244M
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT244M96
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT244M96E4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT244M96G4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT244ME4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT244MG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT244SM96
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT244SM96E4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT244SM96G4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
CD74AC240M96
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
CD74AC244M96
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
CD74AC244SM96
SSOP
DB
20
2000
330.0
16.4
8.2
7.5
2.5
12.0
16.0
Q1
CD74ACT240M96
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
CD74ACT241M96
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
CD74ACT244M96
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
CD74ACT244SM96
SSOP
DB
20
2000
330.0
16.4
8.2
7.5
2.5
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CD74AC240M96
SOIC
DW
20
2000
367.0
367.0
45.0
CD74AC244M96
SOIC
DW
20
2000
367.0
367.0
45.0
CD74AC244SM96
SSOP
DB
20
2000
367.0
367.0
38.0
CD74ACT240M96
SOIC
DW
20
2000
367.0
367.0
45.0
CD74ACT241M96
SOIC
DW
20
2000
367.0
367.0
45.0
CD74ACT244M96
SOIC
DW
20
2000
367.0
367.0
45.0
CD74ACT244SM96
SSOP
DB
20
2000
367.0
367.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
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