AD AD5412BREZ Single channel, 12/16-bit, serial input, current source & voltage output dac Datasheet

Preliminary Technical Data
Single Channel, 12/16-Bit, Serial Input,
Current Source & Voltage Output DAC
AD5412/AD5422
FEATURES
GENERAL DESCRIPTION
12/16-Bit Resolution and Monotonicity
Current Output Ranges: 4–20mA, 0–20mA or 0–24mA
0.1% typ Total Unadjusted Error (TUE)
5ppm/°C Output Drift
Voltage Output Ranges: 0-5V, 0-10V, ±5V, ±10V,
10% over-range
0.05% Total Unadjusted Error (TUE)
3ppm/°C Output Drift
Flexible Serial Digital Interface
On-Chip Output Fault Detection
On-Chip Reference (10 ppm/°C Max)
Asynchronous CLEAR Function
Power Supply Range
AVDD : 10.8V to 40 V
AVSS : -26.4V to -3V/0V
Output Loop Compliance to AVDD – 2.5 V
Temperature Range: -40°C to +85°C
TSSOP and LFCSP Packages
The AD5412/AD5422 is a low-cost, precision, fully integrated
12/16-bit converter offering a programmable current source and
programmable voltage output designed to meet the
requirements of industrial process control applications.
The output current range is programmable to 4mA to 20 mA,
0mA to 20mA or an overrange function of 0mA to 24mA.
Voltage output is provided from a separate pin that can be
configured to provide 0V to 5V, 0V to 10V, ±5V or ±10V
output ranges, an over-range of 10% is available on all ranges.
Analog outputs are short and open circuit protected and can
drive capacitive loads of 1uF and inductive loads of 1H.
The device is specified to operate with a power supply range
from 10.8 V to 40 V. Output loop compliance is 0 V to AVDD –
2.5 V.
The flexible serial interface is SPI and MICROWIRE
compatible and can be operated in 3-wire mode to minimize the
digital isolation required in isolated applications.
The device also includes a power-on-reset function ensuring
that the device powers up in a known state and an
asynchronous CLEAR pin which sets the outputs to zero-scale /
mid-scale voltage output or the low end of the selected current
range.
The total output error is typically ±0.1% in current mode and
±0.05% in voltage mode.
APPLICATIONS
Process Control
Actuator Control
PLC
Table 1. Pin Compatible Devices
Part Number
AD5420
AD5410
Description
Single Channel, 16-Bit, Serial
Input Current Source DAC
Single Channel, 12-Bit, Serial
Input Current Source DAC
Rev. PrF
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2008 Analog Devices, Inc. All rights reserved.
AD5412/AD5422
Preliminary Technical Data
TABLE OF CONTENTS
Features .............................................................................................. 1
Features ............................................................................................ 30
Applications....................................................................................... 1
fault alert...................................................................................... 30
General Description ......................................................................... 1
voltage output short circuit protection.................................... 30
Revision History ............................................................................... 2
Voltage ouTput over-range........................................................ 30
Functional Block Diagram .............................................................. 3
voltage output force-sense......................................................... 30
Specifications..................................................................................... 4
Asynchronous Clear (CLEAR) ................................................. 30
AC Performance Characteristics ................................................ 7
Internal Reference ...................................................................... 30
Timing Characteristics ................................................................ 8
External current setting resistor............................................... 30
Absolute Maximum Ratings.......................................................... 10
Digital Power Supply.................................................................. 30
ESD Caution................................................................................ 10
External boost function............................................................. 31
Pin Configuration and Function Descriptions........................... 11
External compensation capacitor............................................. 31
Typical Performance Characteristics Voltage output............... 13
digital Slew rate control ............................................................. 31
Typical Performance Characteristics current output ............... 17
IOUT Filtering Capacitors (LFCSP Package)............................. 32
Typical Performance Characteristics general ............................ 20
Applications Information .............................................................. 33
Terminology .................................................................................... 22
driving inductive loads .............................................................. 33
Theory of Operation ...................................................................... 24
Transient voltage protection ..................................................... 33
Architecture................................................................................. 24
Single connector for IOUT AND Vout ......................................... 33
Serial Interface ............................................................................ 24
Galvanically Isolated Interface ................................................. 33
Power-on state............................................................................. 27
Microprocessor Interfacing....................................................... 33
Transfer Function ....................................................................... 27
Layout Guidelines....................................................................... 34
Data Register ............................................................................... 28
Thermal and supply considerations......................................... 35
Control Register.......................................................................... 28
Outline Dimensions ....................................................................... 36
RESET register ............................................................................ 28
Ordering Guide .......................................................................... 37
Status register .............................................................................. 29
REVISION HISTORY
PrF – Preliminary Version, April 25, 2008
Rev. PrF | Page 2 of 38
Preliminary Technical Data
AD5412/AD5422
FUNCTIONAL BLOCK DIAGRAM
DVCC
SELECT
CLEA R
SELECT
DVCC
CAP1* CAP2*
AV SS
AD5412/AD5422
R2
R3
BOOST
CLEA R
LATCH
SCLK
SDIN
SDO
AV DD
INPUT SHIFT
REGISTER
AND
CONTROL
LOGIC
16
/
12/16-Bit
DAC
IOUT
FAULT
R SET
R1
POWER
ON
RESET
VREF
+VSENSE
RANGE
SCALING
VOUT
-VSENSE
DGND*
REFOUT
AGND
REFIN
*LFCSP Package
Figure 1.
Rev. PrF | Page 3 of 38
CCOMP
AD5412/AD5422
Preliminary Technical Data
SPECIFICATIONS
AVDD = 10.8V to 40V, AVSS = -26.4V to -3V/0V, AVDD + |AVSS| < 52.8V, AGND = DGND = 0 V, REFIN= +5 V external;
DVCC = 2.7 V to 5.5 V, VOUT : RL = 1 kΩ, CL = 200 pF, IOUT : RL = 300Ω, HL = 50mH;
all specifications TMIN to TMAX, ±10 V / 0 to 24 mA range unless otherwise noted.
Table 2.
Parameter
VOLTAGE OUTPUT
Output Voltage Ranges
ACCURACY
Bipolar Output
Resolution
Value1
Unit
0 to 5
0 to 10
-5 to +5
-10 to +10
V
V
V
V
Output unloaded
16
12
0.1
Bits
Bits
% FSR max
Differential Nonlinearity (DNL)
Bipolar Zero Error
±3
±0.012
±0.024
±1
±5
ppm typ
% FSR max
% FSR max
LSB max
mV max
Bipolar Zero TC2
Zero-Scale Error
±3
±1
ppm FSR/°C max
mV max
Zero-Scale TC2
Gain Error
±3
±0.05
ppm FSR/°C max
% FSR max
Gain TC2
Full-Scale Error
±8
0.05
ppm FSR/°C max
% FSR max
±3
ppm FSR/°C max
16
12
0.1
Bits
Bits
% FSR max
Differential Nonlinearity (DNL)
Zero Scale Error
±0.012
±0.024
±1
+10
% FSR max
% FSR max
LSB max
mV max
Zero Scale TC2
Offset Error
Gain Error
±3
±10
±0.05
ppm FSR/°C max
mV max
% FSR max
Gain TC2
Full-Scale Error
±3
0.05
ppm FSR/°C max
% FSR max
±3
ppm FSR/°C max
0.8
TBD
V max
V max
Total Unadjusted Error (TUE)
TUE TC2
Relative Accuracy (INL)
Full-Scale TC2
Unipolar Output
Resolution
Total Unadjusted Error (TUE)
Relative Accuracy (INL)
Full-Scale TC2
OUTPUT CHARACTERISTICS2
Headroom
Test Conditions/Comments
Rev. PrF | Page 4 of 38
AD5422
AD5412
Over temperature, supplies, and time, typically 0.05%
FSR
AD5422
AD5412
Guaranteed monotonic
@ 25°C, error at other temperatures obtained using
bipolar zero TC
@ 25°C, error at other temperatures obtained using zero
scale TC
@ 25°C, error at other temperatures obtained using gain
TC
@ 25°C, error at other temperatures obtained using gain
TC
AVSS = 0 V
AD5422
AD5412
Over temperature, supplies, and time, typically 0.05%
FSR
AD5422
AD5412
Guaranteed monotonic (at 16 bit-resolution)
@ 25°C, error at other temperatures obtained using gain
TC
@ 25°C, error at other temperatures obtained using gain
TC
@ 25°C, error at other temperatures obtained using gain
TC
0.5V typ. Output Unloaded
TBD typ. 1KΩ Load on Output
Preliminary Technical Data
AD5412/AD5422
Value1
±3
±12
±15
20
2
Unit
ppm FSR/°C max
ppm FSR/500 hr typ
ppm FSR/1000 hr typ
mA typ
kΩ min
20
TBD
1
0.3
10
TBD
nF max
nF max
µF max
Ω typ
µs typ
µV/V
0 to 24
0 to 20
4 to 20
mA
mA
mA
Differential Nonlinearity (DNL)
Offset Error
Offset Error Drift
Gain Error
16
12
±0.3
±5
±0.012
±0.024
±1
±0.05
±5
±0.02
Bits
Bits
% FSR max
ppm/°C typ
% FSR max
% FSR max
LSB max
% FSR max
µv/°C typ
% FSR max
Gain TC2
Full-Scale Error
±8
0.05
ppm FSR/°C max
% FSR max
±8
ppm FSR/°C
AVDD - 2.5
TBD
TBD
1200
1
1
50
V max
ppm FSR/500 hr typ
ppm FSR/1000 hr typ
Ω max
H max
µA/V max
MΩ typ
5
30
4 to 5
V nom
kΩ min
V min to V max
±1% for specified performance
Typically 40 kΩ
4.998 to 5.002
±10
18
120
±40
±50
TBD
V min to V max
ppm/°C max
µV p-p typ
nV/√Hz typ
ppm/500 hr typ
ppm/1000 hr typ
nF max
@ 25°C
Parameter
Output Voltage TC
Output Voltage Drift vs. Time
Short-Circuit Current
Load
Capacitive Load Stability
RL = ∞
RL = 2 kΩ
RL = ∞
DC Output Impedance
Power-On Time
DC PSRR
CURRENT OUTPUT
Output Current Ranges
ACCURACY
Resolution
Total Unadjusted Error (TUE)
TUE TC2
Relative Accuracy (INL)
Full-Scale TC2
OUTPUT CHARACTERISTICS2
Current Loop Compliance Voltage
Output Current Drift vs. Time
Resistive Load
Inductive Load
DC PSRR
Output Impedance
REFERENCE INPUT/OUTPUT
Reference Input2
Reference Input Voltage
DC Input Impedance
Reference Range
Reference Output
Output Voltage
Reference TC
Output Noise (0.1 Hz to 10 Hz)2
Noise Spectral Density2
Output Voltage Drift vs. Time2
Capacitive Load
Rev. PrF | Page 5 of 38
Test Conditions/Comments
Vout = ¾ of Full-Scale
For specified performance
External compensation capacitor of 4nF connected.
AD5422
AD5412
Over temperature, supplies, and time, typically 0.1% FSR
AD5422
AD5412
Guaranteed monotonic
@ 25°C, error at other temperatures obtained using gain
TC
@ 25°C, error at other temperatures obtained using gain
TC
@ 10 kHz
AD5412/AD5422
Parameter
Load Current
Short Circuit Current
Line Regulation2
Load Regulation2
Thermal Hysteresis2
DIGITAL INPUTS2
VIH, Input High Voltage
VIL, Input Low Voltage
Input Current
Pin Capacitance
DIGITAL OUTPUTS 2
SDO
VOL, Output Low Voltage
VOH, Output High Voltage
High Impedance Leakage
Current
High Impedance Output
Capacitance
FAULT
VOL, Output Low Voltage
VOL, Output Low Voltage
VOH, Output High Voltage
POWER REQUIREMENTS
AVDD
AVSS
|AVSS | + AVDD
DVCC
Input Voltage
Output Voltage
Output Load Current
Short Circuit Current
AIDD
AISS
DICC
Power Dissipation
1
2
Preliminary Technical Data
Value1
5
7
10
TBD
TBD
Unit
mA typ
mA typ
ppm/V typ
ppm/mA
ppm
2
0.8
±1
10
V min
V max
µA max
pF typ
0.4
DVCC − 0.5
±1
V max
V min
µA max
5
pF typ
0.4
0.6
3.6
V max
V typ
V min
10.8 to 40
-26.4 to 0
10.8 to 52.8
V min to V max
V min to V max
V min to V max
2.7 to 5.5
4.5
5
20
TBD
TBD
1
TBD
TBD
TBD
V min to V max
V typ
mA typ
mA typ
mA
mA
mA max
mW typ
mW typ
mW typ
Test Conditions/Comments
DVCC = 2.7 V to 5.5 V, JEDEC compliant
Temperature range: -40°C to +85°C; typical at +25°C.
Guaranteed by characterization. Not production tested.
Rev. PrF | Page 6 of 38
Per pin
Per pin
sinking 200 µA
sourcing 200 µA
10kΩ pull-up resistor to DVCC
@ 2.5 mA
10kΩ pull-up resistor to DVCC
Internal supply disabled
DVCC can be overdriven up to 5.5V
Output unloaded
Output unloaded
VIH = DVCC, VIL = GND, TBD mA typ
AVDD = 40V, AVSS = 0 V, VOUT unloaded
AVDD = 40V, AVSS = -15 V, VOUT unloaded
AVDD = 15V, AVSS = -15 V, VOUT unloaded
Preliminary Technical Data
AD5412/AD5422
AC PERFORMANCE CHARACTERISTICS
AVDD = 10.8V to 40V, AVSS = -26.4V to -3V/0V, AVDD + |AVSS| < 52.8V, AGND = DGND = 0 V, REFIN= +5 V external;
DVCC = 2.7 V to 5.5 V, VOUT : RL = 1 kΩ, CL = 200 pF, IOUT : RL = 300Ω, HL = 50mH;
all specifications TMIN to TMAX, ±10 V / 0 to 24 mA range unless otherwise noted.
Table 3.
Parameter1
DYNAMIC PERFORMANCE
VOLTAGE OUTPUT
Output Voltage Settling Time
Slew Rate
Power-On Glitch Energy
Digital-to-Analog Glitch Energy
Glitch Impulse Peak Amplitude
Digital Feedthrough
Output Noise (0.1 Hz to 10 Hz Bandwidth)
Output Noise (100 kHz Bandwidth)
1/f Corner Frequency
Output Noise Spectral Density
AC PSRR
CURRENT OUTPUT
Output Current Settling Time
AC PSRR
1
Unit
Test Conditions/Comments
8
10
5
1
10
10
20
1
0.1
80
1
100
TBD
µs typ
µs max
µs max
V/µs typ
nV-sec typ
nV-sec typ
mV typ
nV-sec typ
LSB p-p typ
µV rms max
kHz typ
nV/√Hz typ
dB
Full-scale step (10 V) to ±0.03% FSR
TBD
TBD
TBD
µs typ
µs typ
dB
To 0.1% FSR , L = 1H
To 0.1% FSR , L < 1mH
200mV 50/60Hz Sinewave
superimposed on power supply voltage.
Guaranteed by characterization, not production tested.
Rev. PrF | Page 7 of 38
512 LSB step settling (16-Bit LSB)
16-Bit LSB
Measured at 10 kHz
200mV 50/60Hz Sinewave
superimposed on power supply voltage.
AD5412/AD5422
Preliminary Technical Data
TIMING CHARACTERISTICS
AVDD = 10.8V to 40V, AVSS = -26.4V to -3V/0V, AVDD + |AVSS| < 52.8V, AGND = DGND = 0 V, REFIN= +5 V external;
DVCC = 2.7 V to 5.5 V, VOUT : RL = 1 kΩ, CL = 200 pF, IOUT : RL = 300Ω, HL = 50mH;
all specifications TMIN to TMAX, ±10 V / 0 to 24 mA range unless otherwise noted.
Table 4.
Parameter1, 2, 3
Write Mode
t1
t2
t3
t4
t5
t5
t6
t7
t8
t9
t10
Readback Mode
t11
t12
t13
t14
t15
t16
t17
t18
t19
t20
Daisychain Mode
t21
t22
t23
t24
t25
t26
t27
t28
t29
Limit at TMIN, TMAX
Unit
Description
33
13
13
13
40
5
5
5
40
20
5
ns min
ns min
ns min
ns min
ns min
µs min
ns min
ns min
ns min
ns min
µs max
SCLK cycle time
SCLK low time
SCLK high time
LATCH delay time
LATCH high time
LATCH high time (After a write to the CONTROL register)
Data setup time
Data hold time
LATCH low time
CLEAR pulsewidth
CLEAR activation time
82
33
33
13
40
5
5
40
40
33
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns max
ns max
SCLK cycle time
SCLK low time
SCLK high time
LATCH delay time
LATCH high time
Data setup time
Data hold time
LATCH low time
Serial output delay time (CL SDO4 = 15pF)
LATCH rising edge to SDO tri-state
82
33
33
13
40
5
5
40
40
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns max
SCLK cycle time
SCLK low time
SCLK high time
LATCH delay time
LATCH high time
Data setup time
Data hold time
LATCH low time
Serial output delay time (CL SDO4 = 15pF)
1
Guaranteed by characterization. Not production tested.
All input signals are specified with tR = tF = 5 ns (10% to 90% of DVCC) and timed from a voltage level of 1.2 V.
3
See Figure 2, Figure 3, and Figure 4.
4
CL SDO = Capacitive load on SDO output.
2
Rev. PrF | Page 8 of 38
Preliminary Technical Data
AD5412/AD5422
t1
SCLK
1
2
24
t3
t2
t4
t5
LATCH
t7
t6
SDIN
t8
DB23
DB0
t9
CLEAR
t10
OUTPUT
Figure 2. Write Mode Timing Diagram
t11
SCLK
1
2
t12
2
1
24
t13
t14
8
9
23
22
24
t15
LATCH
t16
SDIN
t17
t18
DB23
DB0
DB23
DB0
NOP CONDITION
INPUT WORD SPECIFIES
REGISTER TO BE READ
t 20
t 19
SDO
X
UNDEFINED DATA
X
X
X
DB15
FIRST 8 BITS ARE
DON’T CARE BITS
DB0
SELECTED REGISTER
DATA CLOCKED OUT
Figure 3. Readback Mode Timing Diagram
t21
SCLK
1
2
25
24
26
48
t22
t23
t24
t25
LATCH
t26
SDIN
DB23
DB0
INPUT WORD FOR DAC N
SDO
DB23
DB23
t28
DB0
INPUT WORD FOR DAC N-1
t 29
DB0
t27
DB23
UNDEFINED
DB0
INPUT WORD FOR DAC N
Figure 4. Daisychain Mode Timing Diagram
Rev. PrF | Page 9 of 38
t 20
AD5412/AD5422
Preliminary Technical Data
ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless otherwise noted.
Transient currents of up to 100 mA do not cause SCR latch-up.
Table 5.
Parameter
AVDD to AGND, DGND
AVSS to AGND, DGND
AVDD to AVSS
DVCC to AGND, DGND
Digital Inputs to AGND, DGND
Digital Outputs to AGND, DGND
REFIN/REFOUT to AGND, DGND
VOUT to AGND, DGND
IOUT to AGND, DGND
AGND to DGND
Operating Temperature Range
(TA)
Industrial
Storage Temperature Range
Junction Temperature (TJ max)
24-Lead TSSOP Package
θJA Thermal Impedance
40-Lead LFCSP Package
θJA Thermal Impedance
Power Dissipation
Lead Temperature
Soldering
Rating
−0.3V to 48V
+0.3 V to −48 V
-0.3V to 60V
−0.3 V to +7 V
−0.3 V to DVCC + 0.3 V or 7 V
(whichever is less)
−0.3 V to DVCC + 0.3 V or 7V
(whichever is less)
−0.3 V to +7 V
AVSS to AVDD
−0.3V to AVDD
-0.3V to +0.3V
−40°C to +851°C
−65°C to +150°C
125°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
1
42°C/W
Power dissipated on chip must be de-rated to keep junction temperature
below 125°C. Assumption is max power dissipation condition is sourcing
24mA into Ground from AVDD with a 3mA on-chip current.
28°C/W
(TJ max – TA)/ θJA
JEDEC Industry Standard
J-STD-020
Rev. PrF | Page 10 of 38
Preliminary Technical Data
AD5412/AD5422
AGND 11
GND 12
15 REFIN
NC
+VSENSE
VOUT
NC
AVDD
-VSENSE
AVSS
NC
29
CAP2
GND 3
28
CAP1
AD5412/
AD5422
27
BOOST
26
IOUT
TOP VIEW
(Not to Scale)
25
NC
24
CCOMP
SDIN 8
23
DVCC SELECT
SDO 9
22
NC
NC 10
21
NC
CLEAR SELECT 4
CLEAR 5
14 REFOUT
13 RSET
Figure 5. TSSOP Pin Configuration
31
11
12
13
14
15
16
17
18
19
20
NC
SDO 10
16 DVCC SELECT
32
NC
9
33
30
SCLK 7
17 CCOMP
34
FAULT 2
LATCH 6
18 NC
35
REFIN
SDIN
8
36
REFOUT
SCLK
37
RSET
LATCH 7
38
GND
6
20 BOOST
TOP VIEW
(Not to Scale) 19 I OUT
39
AVSS
CLEAR SELECT 5
CLEAR
21 VOUT
4
40
NC 1
DGND
GND
22 +VSENSE
NC
23 -VSENSE
AD5412/
AD5422
3
NC
FAULT
NC
24 AVDD
1
AGND
AVSS
DVCC 2
DVCC
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 6. LFCSP Pin Configuration
Table 6. Pin Function Descriptions
TSSOP Pin No.
1
LFCSP Pin No.
14,37
Mnemonic
AVSS
2
3
39
2
DVCC
FAULT
4,12
18
GND
NC
5
3,15
1,10,11,19,
20,21,22,25,30,
31,35,38,40
4
6
5
CLEAR
SELECT
CLEAR
7
6
LATCH
8
7
SCLK
9
10
8
9
SDIN
SDO
11
N/A
12
13
AGND
DGND
13
16
RSET
14
15
17
18
REFOUT
REFIN
16
23
DVCC
SELECT
17
24
CCOMP
Description
Negative Analog Supply Pin. Voltage ranges from –3 V to –24 V. This pin can be
connected to 0V if output voltage range is unipolar.
Digital Supply Pin. Voltage ranges from 2.7 V to 5.5 V.
Fault alert, This pin is asserted low when an open circuit is detected in current mode or
an over temperature is detected. Open drain output, must be connected to a pull-up
resistor.
These pins must be connected to 0V.
No Connection. Do not connect to this pin.
Selects the voltage output clear value, either zero-scale or mid-scale code. See Table 21
Active High Input. Asserting this pin will set the current output to the bottom of the
selected range or will set the voltage output to the user selected value (zero-scale or
mid-scale).
Positive edge sensitive latch, a rising edge will parallel load the input shift register data
into the DAC register, also updating the output.
Serial Clock Input. Data is clocked into the shift register on the rising edge of SCLK. This
operates at clock speeds up to 30 MHz.
Serial Data Input. Data must be valid on the rising edge of SCLK.
Serial Data Output. Used to clock data from the serial register in daisy-chain or readback
mode. Data is valid on the rising edge of SCLK . See Figure 3 and Figure 4.
Ground reference pin for analog circuitry.
Ground reference pin for digital circuitry. (AGND and DGND are internally connected in
TSSOP package).
An external, precision, low drift 15kΩ current setting resistor can be connected to this
pin to improve the IOUT temperature drift performance. Refer to Features section.
Internal Reference Voltage Output. REFOUT = 5 V ± 2 mV.
External Reference Voltage Input. Reference input range is 4 V to 5 V. REFIN = 5 V for
specified performance.
This pin when connected to GND disables the internal supply and an external supply
must be connected to the DVCC pin. Leave this pin unconnected to enable the internal
supply. Refer to features section.
Optional compensation capacitor connection for the voltage output buffer. Connecting
a 4nF capacitor between this pin and the VOUT pin will allow the voltage output to drive
up to 1µF. It should be noted that the addition of this capacitor will reduce the
Rev. PrF | Page 11 of 38
AD5412/AD5422
Preliminary Technical Data
TSSOP Pin No.
LFCSP Pin No.
Mnemonic
19
20
26
27
IOUT
BOOST
N/A
N/A
21
28
29
32
CAP1
CAP2
VOUT
22
23
24
Paddle
33
34
36
Paddle
+VSENSE
-VSENSE
AVDD
AVSS
Description
bandwidth of the output amplifier increasing the settling time.
Current output pin.
Optional external transistor connection. Connecting an external transistor will reduce
the power dissipated in the AD5412/AD5422. Refer to the features section.
Connection for optional output filtering capacitor. Refer to Features section.
Connection for optional output filtering capacitor. Refer to Features section.
Buffered Analog Output Voltage. The output amplifier is capable of directly driving a 1
kΩ, 2000 pF load.
Sense connection for the positive voltage output load connection.
Sense connection for the negative voltage output load connection.
Positive Analog Supply Pin. Voltage ranges from 10.8V to 60V.
Negative Analog Supply Pin. Voltage ranges from –3 V to –24 V. This pin can be
connected to 0V if output voltage range is unipolar.
Rev. PrF | Page 12 of 38
Preliminary Technical Data
AD5412/AD5422
TYPICAL PERFORMANCE CHARACTERISTICS
VOLTAGE OUTPUT
Figure 7. Integral Non Linearity Error vs DAC Code (Four Traces)
Figure 10. Integral Non Linearity vs. Temperature (Four Traces)
Figure 8. Differential Non Linearity Error vs. DAC Code (Four Traces)
Figure 11. Differential Non Linearity vs. Temperature (Four Traces)
Figure 9. Total Unadjusted Error vs. DAC Code (Four Traces)
Figure 12. Integral Non Linearity vs. Supply Voltage (Four Traces)
Rev. PrF | Page 13 of 38
AD5412/AD5422
Preliminary Technical Data
Figure 13.Differential Non Linearity Error vs. Supply Voltage (Four Traces)
Figure 16. Total Unadjusted Error vs.Reference Voltage (Four Traces)
Figure 14. Integral Non Linearity Error vs. Reference Voltage (Four traces)
Figure 17. Total Unadjusted Error vs. Supply Voltage (Four Traces)
Figure 15. Differential Non Linearity Error vs. Reference Voltage (Four Traces)
Figure 18. Offset Error vs.Temperature
Rev. PrF | Page 14 of 38
Preliminary Technical Data
AD5412/AD5422
Figure 19. Bipolar Zero Error vs. Temperature
Figure 22. Source and Sink Capability of Output Amplifier
Zero-Scale Loaded
Figure 20. Gain Error vs. Temperature
Figure 23.Full-Scale Positive Step
Figure 21. Source and Sink Capability of Output Amplifier
Full-Scale Code Loaded
Figure 24. Full-Scale Negative Step
Rev. PrF | Page 15 of 38
AD5412/AD5422
Preliminary Technical Data
Figure 25. Digital-to-Analog Glitch Energy
Figure 28. VOUT vs. Time on Power-up
Figure 26. Peak-to-Peak Noise (0.1Hz to 10Hz Bandwidth)
Figure 29. VOUT vs, Time on Output Enabled
Figure 27. Peak-to-Peak Noise (100kHz Bandwidth)
Rev. PrF | Page 16 of 38
Preliminary Technical Data
AD5412/AD5422
TYPICAL PERFORMANCE CHARACTERISTICS
CURRENT OUTPUT
Figure 30. Integral Non Linearity vs. Code
Figure 33. Integral Non Linearity vs. Temperature
Figure 31.Differential Non Linearity vs. Code
Figure 34. Differential Non Linearity vs. Temperature
Figure 32. Total Unadjusted Error vs. Code
Figure 35. Integral Non Linearity vs. Supply
Rev. PrF | Page 17 of 38
AD5412/AD5422
Preliminary Technical Data
Figure 36. Differential Non Linearity vs. Supply Voltage
Figure 39. Total Unadjusted Error vs. Reference Voltage
Figure 37. Integral Non Linearity vs. Reference Voltage
Figure 40. Total Unadjusted Error vs. Supply Voltage
Figure 38. Differential Non Linearity vs. Reference Voltage
Figure 41. Offset Error vs. Temperature
Rev. PrF | Page 18 of 38
Preliminary Technical Data
AD5412/AD5422
Figure 42. Gain Error vs. Temperature
Figure 44. IOUT vs. Time on Power-up
Figure 43. Voltage Compliance vs. Temperature
Figure 45. IOUT vs. Time on Output Enabled
Rev. PrF | Page 19 of 38
AD5412/AD5422
Preliminary Technical Data
TYPICAL PERFORMANCE CHARACTERISTICS
GENERAL
Figure 46. DICC vs.Logic Input Voltage
Figure 49. DVCC Output Voltage vs. DICC Load Current
Figure 47. AIDD/AISS vs AVDD/AVSS
Figure 50. Refout Turn-on Transient
Figure 48. AIDD vs AVDD
Figure 51. Refout Output Noise (0.1Hz to 10Hz Bandwidth)
Rev. PrF | Page 20 of 38
Preliminary Technical Data
AD5412/AD5422
Figure 52. Refout Output Noise (100kHz Bandwidth)
Figure 55. Refout Histogram of Thermal Hysteresis
Figure 53. Refout Line Transient
Figure 56. Refout Voltage vs. Load Current
Figure 54. Refout Load Transient
Rev. PrF | Page 21 of 38
AD5412/AD5422
Preliminary Technical Data
TERMINOLOGY
Relative Accuracy or Integral Nonlinearity (INL)
For the DAC, relative accuracy, or integral nonlinearity (INL), is
a measure of the maximum deviation, in LSBs, from a straight
line passing through the endpoints of the DAC transfer
function. A typical INL vs. code plot can be seen in Figure 7.
Differential Nonlinearity (DNL)
Differential nonlinearity (DNL) is the difference between the
measured change and the ideal 1 LSB change between any two
adjacent codes. A specified differential nonlinearity of ±1 LSB
maximum ensures monotonicity. This DAC is guaranteed
monotonic by design. A typical DNL vs. code plot can be seen
in Figure 10.
Monotonicity
A DAC is monotonic if the output either increases or remains
constant for increasing digital input code. The AD5724R/
AD5734R/AD5754R are monotonic over their full operating
temperature range.
Bipolar Zero Error
Bipolar zero error is the deviation of the analog output from the
ideal half-scale output of 0 V when the DAC register is loaded
with 0x8000 (straight binary coding) or 0x0000 (twos complement
coding). A plot of bipolar zero error vs. temperature can be seen
in Figure TBD.
Bipolar Zero TC
Bipolar zero TC is a measure of the change in the bipolar zero
error with a change in temperature. It is expressed in ppm
FSR/°C.
Full-Scale Error
Full-Scale error is a measure of the output error when full-scale
code is loaded to the DAC register. Ideally, the output should be
full-scale − 1 LSB. Full-scale error is expressed in percent of
full-scale range (% FSR).
Negative Full-Scale Error/Zero-Scale Error
Negative full-scale error is the error in the DAC output voltage
when 0x0000 (straight binary coding) or 0x8000 (twos
complement coding) is loaded to the DAC register. Ideally, the
output voltage should be negative full-scale − 1 LSB. A plot of
zero-scale error vs. temperature can be seen in Figure TBD
Zero-Scale TC
This is a measure of the change in zero-scale error with a change in
temperature. Zero-scale error TC is expressed in ppm FSR/°C.
Output Voltage Settling Time
Output voltage settling time is the amount of time it takes for
the output to settle to a specified level for a full-scale input
change. A plot of settling time can be seen in Figure TBD
Slew Rate
The slew rate of a device is a limitation in the rate of change of
the output voltage. The output slewing speed of a voltageoutput D/A converter is usually limited by the slew rate of the
amplifier used at its output. Slew rate is measured from 10% to
90% of the output signal and is given in V/µs.
Gain Error
This is a measure of the span error of the DAC. It is the
deviation in slope of the DAC transfer characteristic from ideal
expressed in % FSR. A plot of gain error vs. temperature can be
seen in Figure TBD
Gain TC
This is a measure of the change in gain error with changes in
temperature. Gain Error TC is expressed in ppm FSR/°C.
Total Unadjusted Error
Total unadjusted error (TUE) is a measure of the output error
taking all the various errors into account, namely INL error,
offset error, gain error, and output drift over supplies,
temperature, and time. TUE is expressed in % FSR.
Current Loop Voltage Compliance
The maximum voltage at the IOUT pin for which the output
currnet will be equal to the programmed value.
Power-On Glitch Energy
Power-on glitch energy is the impulse injected into the analog
output when the AD5412/AD5422 is powered-on. It is specified as
the area of the glitch in nV-sec. See Figure TBD
Digital-to-Analog Glitch Impulse
Digital-to-analog glitch impulse is the impulse injected into the
analog output when the input code in the DAC register changes
state, but the output voltage remains constant. It is normally
specified as the area of the glitch in nV-sec and is measured
when the digital input code is changed by 1 LSB at the major
carry transition (0x7FFF to 0x8000). See Figure TBD
Glitch Impulse Peak Amplitude
Glitch impulse peak amplitude is the peak amplitude of the
impulse injected into the analog output when the input code in
the DAC register changes state. It is specified as the amplitude
of the glitch in mV and is measured when the digital input code
is changed by 1 LSB at the major carry transition (0x7FFF to
0x8000). See Figure TBD.
Digital Feedthrough
Digital feedthrough is a measure of the impulse injected into
the analog output of the DAC from the digital inputs of the
DAC, but is measured when the DAC output is not updated. It
is specified in nV-sec and measured with a full-scale code
change on the data bus.
Power Supply Rejection Ratio (PSRR)
PSRR indicates how the output of the DAC is affected by
changes in the power supply voltage.
Reference TC
Rev. PrF | Page 22 of 38
Preliminary Technical Data
AD5412/AD5422
Reference TC is a measure of the change in the reference output
voltage with a change in temperature. It is expressed in ppm/°C.
Line Regulation
−40°C to +85°C and back to +25°C. This is a typical value from
a sample of parts put through such a cycle. See Figure TBDfor a
histogram of thermal hysteresis.
VO _ HYS = VO (25° C) − VO _ TC
Line regulation is the change in reference output voltage due to
a specified change in supply voltage. It is expressed in ppm/V.
VO _ HYS ( ppm) =
Load Regulation
Load regulation is the change in reference output voltage due to
a specified change in load current. It is expressed in ppm/mA.
Thermal Hysteresis
VO (25° C) − VO _ TC
VO (25° C)
× 10 6
where:
VO(25°C) = VO at 25°C
VO_TC = VO at 25°C after temperature cycle
Thermal hysteresis is the change of reference output voltage
after the device is cycled through temperatures from +25°C to
Rev. PrF | Page 23 of 38
AD5412/AD5422
Preliminary Technical Data
THEORY OF OPERATION
The AD5412/AD5422 is a precision digital to current loop and
voltage output converter designed to meet the requirements of
industrial process control applications. It provides a high
precision, fully integrated, low cost single-chip solution for
generating current loop and unipolar/bipolar voltage outputs.
The current ranges available are; 0 to 20mA, 0 to 24mA and 4 to
20mA, the voltage ranges available are; 0 to 5V, ±5V, 0 to 10V
and ±10V, a 10% over-range is available on all voltage output
ranges. The current and voltage outputs are available on
separate pins and only one is active at any one time. The desired
output configuration is user selectable via the CONTROL
register.
ARCHITECTURE
The DAC core architecture of the AD5412/AD5422 consists of
two matched DAC sections. A simplified circuit diagram is
shown in Figure 57. The 4 MSBs of the 12/16-bit data word are
decoded to drive 15 switches, E1 to E15. Each of these switches
connects 1 of 15 matched resistors to either ground or the
reference buffer output. The remaining 8/12 bits of the dataword drive switches S0 to S7/S11 of a 8/12-bit voltage mode R2R ladder network.
VOUT
2R
2R
2R
2R
2R
2R
2R
S0
S1
S7/S11
E1
E2
E15
VREF
8/12-BIT R-2R LADDER
FOUR MSBs DECODED INTO
15 EQUAL SEGMENTS
Figure 57. DAC Ladder Structure
The voltage output from the DAC core is either converted to a
current (see diagram, Figure 58) which is then mirrored to the
supply rail so that the application simply sees a current source
output with respect to ground or it is buffered and scaled to
output a software selectable unipolar or bipolar voltage range
(See diagram, Figure 59). The current and voltage are output on
separate pins and cannot be output simultaneously.
AV DD
+VSENSE
12/16-BIT
DAC
RANGE
SCALING
VOUT
-VSENSE
R1
RL
VCM -1V to +3V
REFIN
Figure 59. Voltage Output
Voltage Output Amplifier
The voltage output amplifier is capable of generating both
unipolar and bipolar output voltages. It is capable of driving a
load of 1 kΩ in parallel with 1 µF (with addition of external
compensation capacitor) to AGND. The source and sink
capabilities of the output amplifier can be seen in Figure 22. The
slew rate is 1 V/µs with a full-scale settling time of 10 µs, (10V
step). Figure 59 shows the voltage output driving a load, RL on
top of a common mode voltage, (VCM) of -1V to +3V.
In output module applications where a cable could possibly
become disconnected from +VSENSE resulting in the amplifier
loop being broken and possibly resulting in large destructive
voltages on VOUT, a resistor, R1, of value 2kΩ to 5kΩ should be
included as shown to ensure the amplifier loop is kept closed. If
remote sensing of the load is not required, +VSENSE should be
connected to VOUT and -VSENSE should be connected to GND.
When changing ranges on the voltage output a glitch may
occur, for this reason it is recommended that the output is
disabled by setting the OUTEN bit of the Control register to
logic low before changing the output voltage range, this will
prevent a glitch from occuring.
Driving Large Capacitive Loads
The voltage output amplifier is capable of driving capacitive
loads of up to 1uF with the addition of a non-polarised 4nF
compensation capacitor between the CCOMP and VOUT pins.
Without the compensation capacitor, up to 20nF capacitive
loads can be driven.
Reference Buffers
R2
R3
The AD5412/AD5422 can operate with either an external or
internal reference. The reference input has an input range of 4 V
to 5 V, 5 V for specified performance. This input voltage is then
buffered before it is applied to the DAC.
T2
12/16-BIT
DAC
A2
T1
A1
IOUT
R1
SERIAL INTERFACE
The AD5412/AD5422 is controlled over a versatile 3-wire serial
interface that operates at clock rates up to 30 MHz. It is
compatible with SPI®, QSPI™, MICROWIRE™, and DSP
standards.
Figure 58. Voltage to Current conversion circuitry
Rev. PrF | Page 24 of 38
Preliminary Technical Data
AD5412/AD5422
Input Shift Register
latched on the rising edge of LATCH. Data will continue to be
clocked in irrespective of the state of LATCH, on the rising edge
of LATCH the data that is present in the input register will be
latched, in other words the last 24 bits to be clocked in before
the rising edge of LATCH is the data that is latched. The timing
diagram for this operation is shown in Figure 2.
The input shift register is 24 bits wide. Data is loaded into the
device MSB first as a 24-bit word under the control of a serial
clock input, SCLK. Data is clocked in on the rising edge of
SCLK. The input register consists of 8 address bits and 16 data
bits as shown in Table 7. The 24 bit word is unconditionally
Table 7. Input Shift Register Format
MSB
D23
D22
D21
D20 D19 D18
ADDRESS WORD
D17
D16
D15
D14
D13
D12
D11
01010101
01010110
D9 D8 D7
DATA WORD
CONTROLLER
Table 8. Control Word Functions
Address Word
00000000
00000001
00000010
D10
Function
No Operation (NOP)
DATA Register
Readback register value as per Read Address
(See Table 10)
CONTROL Register
RESET Register
DATA OUT
D6
D5
D4
D3
D2
AD5412/
AD5422*
SDIN
SERIAL CLOCK
SCLK
CONTROL OUT
LATCH
DATA IN
SDO
SDIN
Standalone Operation
The serial interface works with both a continuous and noncontinuous serial clock. A continuous SCLK source can only be
used if LATCH is taken high after the correct number of data
bits have been clocked in. In gated clock mode, a burst clock
containing the exact number of clock cycles must be used, and
LATCH must be taken high after the final clock to latch the
data. The rising edge of SCLK that clocks in the MSB of the
dataword marks the beginning ot the write cycle. Exactly 24
rising clock edges must be applied to SCLK before LATCH is
brought high. If LATCH is brought high before the 24th rising
SCLK edge, the data written will be invalid. If more than 24
rising SCLK edges are applied before LATCH is brought high,
the input data will also be invalid.
AD5412/
AD5422*
SCLK
LATCH
SDO
SDIN
AD5412/
AD5422*
SCLK
LATCH
SDO
*ADDITIONAL PINS OMITTED FOR CLARITY
Figure 60. Daisy Chaining the AD5412/AD5422
Rev. PrF | Page 25 of 38
D1
LSB
D0
AD5412/AD5422
Preliminary Technical Data
Daisy-Chain Operation
must be used, and LATCH must be taken high after the final
clock to latch the data. See Figure 4 for a timing diagram.
For systems that contain several devices, the SDO pin can be
used to daisy chain the devices together as shown in Figure 60.
This daisy-chain mode can be useful in system diagnostics and
in reducing the number of serial interface lines. Daisychain
mode is enabled by setting the DCEN bit of the CONTROL
register. The first rising edge of SCLK that clocks in the MSB of
the dataword marks the beginning of the write cycle. SCLK is
continuously applied to the input shift register. If more than 24
clock pulses are applied, the data ripples out of the shift register
and appears on the SDO line. This data is valid on the rising
edge of SCLK, having been clocked out on the previous falling
SCLK edge. By connecting the SDO of the first device to the
SDIN input of the next device in the chain, a multidevice
interface is constructed. Each device in the system requires 24
clock pulses. Therefore, the total number of clock cycles must
equal 24 × N, where N is the total number of AD5412/AD5422
devices in the chain. When the serial transfer to all devices is
complete, LATCH is taken high. This latches the input data in
each device in the daisy chain. The serial clock can be a
continuous or a gated clock.
Readback Operation
Readback mode is invoked by setting the address word and read
address as shown in Table 9 and Table 10 when writing to the
input register. The next write to the AD5412/AD5422 should be
a NOP command which will clock out the data from the
previously addressed register as shown in Figure 3.
By default the SDO pin is disabled, after having addressed the
AD5412/AD5422 for a read operation, a rising edge on LATCH
will enable the SDO pin in anticipation of data being clocked
out, after the data has been clocked out on SDO, a rising edge
on LATCH will disable (tri-state) the SDO pin once again.
To read back the data register for example, the following
sequence should be implemented:
1.
2.
Write 0x020001 to the input register. This configures the
part for read mode with the data register selected.
Follow this with a second write, a NOP condition, 0x000000
During this write, the data from the register is clocked out
on the SDO line.
A continuous SCLK source can only be used if LATCH is taken
high after the correct number of clock cycles. In gated clock
mode, a burst clock containing the exact number of clock cycles
Table 9. Input Shift Register Contents for a read operation
MSB
D23
D22
D21
D20
D19
D18
D17
D16
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
0
0
0
0
0
0
1
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Table 10. Read Address Decoding
Read Address
00
01
10
Function
Read Status Register
Read Data Register
Read Control Register
Rev. PrF | Page 26 of 38
LSB
D1
D0
Read
Address
Preliminary Technical Data
AD5412/AD5422
Table 11.
POWER-ON STATE
TRANSFER FUNCTION
Output Range
+5 V
+10 V
±5 V
±10 V
Voltage Output
Current Output
For a unipolar voltage output range, the output voltage can be
expressed as:
For the 0 to 20mA, 0 to 24mA and 4 to 20mA current output
ranges the output current is respectively expressed as:
On power-up of the AD5412/AD5422, the power-on-reset
circuit ensures that all registers are loaded with zero-code, as
such both outputs will be disabled. (VOUT and IOUT in tri-state).
D
VOUT = VREFIN × Gain ⎡⎢ N ⎤⎥
⎣2 ⎦
⎡ 20mA ⎤
I OUT = ⎢ N ⎥ × D
⎣ 2 ⎦
For a bipolar voltage output range, the output voltage can be
expressed as:
D
VOUT = VREFIN × Gain ⎡⎢ N
⎣2
⎡ 24mA ⎤
I OUT = ⎢ N ⎥ × D
⎣ 2 ⎦
⎤ − Gain × VREFIN
⎥⎦
2
⎡16mA ⎤
I OUT = ⎢ N ⎥ × D + 4mA
⎣ 2 ⎦
where:
D is the decimal equivalent of the code loaded to the DAC.
N is the bit resolution of the DAC.
VREFIN is the reference voltage applied at the REFIN pin.
Gain is an internal gain whose value depends on the output
range selected by the user as shown in Table 11.
Gain Value
1
2
2
4
where:
D is the decimal equivalent of the code loaded to the DAC.
N is the bit resolution of the DAC.
Rev. PrF | Page 27 of 38
AD5412/AD5422
Preliminary Technical Data
DATA REGISTER
The DATA register is addressed by setting the address word of the input shift register to 0x01. The data to be written to the DATA register
is entered in positions D15 to D4 for the AD5412 and D15 to D0 for the AD5422 as shown in Table 12 and Table 13.
Table 12. Programming the AD5412 Data Register
MSB
D15
D14
D13
D12
D11
D10
D9
12-BIT DATA WORD
D8
D7
D6
D5
D4
D3
X
D2
X
D1
X
LSB
D0
X
D1
LSB
D0
Table 13. Programming the AD5422 Data Register
MSB
D15
D14
D13
D12
D11
D10
D9
D8
D7
16-BIT DATA WORD
D6
D5
D4
D3
D2
CONTROL REGISTER
The CONTROL register is addressed by setting the address word of the input shift register to 0x55. The data to be written to the
CONTROL register is entered in positions D15 to D0 as shown in Table 14. The CONTROL register functions are shown in Table 15.
Table 14. Programming the CONTROL Register
MSB
D15
CLRSEL
D14
OVRRNG
D13
REXT
D12
OUTEN
D11
D10
D9
SR CLOCK
D8
D7
D6
D5
SR STEP
D4
SREN
D3
DCEN
D2
R2
D1
R1
LSB
D0
R0
Table 15. Control Register Functions
Option
CLRSEL
Description
See Table 21 for a description of the CLRSEL
operation
Setting this bit increases the voltage output
range by 10%. Further details in Features
section
Setting this bit selects the external current
setting resistor, Further details in Features
section
Output enable. This bit must be set to enable
the outputs, The range bits select which output
will be functional.
See Features Section. Digital Slew Rate Control
See Features Section. Digital Slew Rate Control
Digital Slew Rate Control enable
Daisychain enable
Output range select. See Table 16
OVRRNG
REXT
OUTEN
SR CLOCK
SR STEP
SREN
DCEN
R2,R1,R0
Table 16. Output Range Options
R2
0
0
0
0
1
1
1
R1
0
0
1
1
0
1
1
R0
0
1
0
1
1
0
1
Output Range Selected
0 to +5V Voltage Range
0 to 10V Voltage Range
±5V Voltage Range
±10V Voltage Range
4 to 20 mA Current Range
0 to 20 mA Current Range
0 to 24 mA Current Range
RESET REGISTER
The RESET register is addressed by setting the address word of the input shift register to 0x56. The data to be written to the RESET
register is entered in positions D15 to D0 as shown in Table 17. The RESET register options are shown in Table 17 and Table 18.
Table 17. Programming the RESET Register
MSB
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
Table 18. RESET register Functions
Option
RESET
Description
Setting this bit performs a reset operation, restoring the AD5412/AD5422 to its power-on state
Rev. PrF | Page 28 of 38
D3
D2
D1
LSB
D0
RESET
Preliminary Technical Data
AD5412/AD5422
STATUS REGISTER
The STATUS register is a read only register. The STATUS register functionality is shown in Table 19 and Table 20.
Table 19. Decoding the STATUS Register
MSB
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
IOUT FAULT
Table 20. STATUS Register Functions
Option
IOUT FAULT
SLEW ACTIVE
OVER TEMP
Description
This bit will be set if a fault is detected on the IOUT pin.
This bit will be set while the output value is slewing (slew rate control enabled)
This bit will be set if the AD5412/AD5422 core temperature exceeds approx. 150°C.
Rev. PrF | Page 29 of 38
D1
SLEW ACTIVE
LSB
D0
OVER TEMP
AD5412/AD5422
Preliminary Technical Data
FEATURES
FAULT ALERT
ASYNCHRONOUS CLEAR (CLEAR)
The AD5412/AD5422 is equipped with a FAULT pin, this is an
open-drain output allowing several AD5412/AD5422 devices to
be connected together to one pull-up resistor for global fault
detection. The FAULT pin is forced active by any one of the
following fault scenarios;
CLEAR is an active high clear that allows the voltage output to
be cleared to either zero-scale code or mid-scale code, userselectable via the CLEAR SELECT pin or the CLRSEL bit of the
CONTROL register as described in Table 21. (The Clear select
feature is a logical OR function of the CLEAR SELECT pin and
the CLRSEL bit). The Current output will clear to the bottom of
its programmed range. It is necessary to maintain CLEAR high
for a minimum amount of time (see Figure 2) to complete the
operation. When the CLEAR signal is returned low, the output
remains at the cleared value.The pre-clear value can be restored
by pulsing the LATCH signal low without clocking any data. A
new value cannot be programmed until the CLEAR pin is
returned low.
1)
2)
The Voltage at IOUT attempts to rise above the
compliance range, due to an open-loop circuit or
insufficient power supply voltage. The IOUT current is
controlled by a PMOS transistor and internal
amplifier as shown in Figure 58. The internal circuitry
that develops the fault output avoids using a
comparator with “window limits” since this would
require an actual output error before the FAULT
output becomes active. Instead, the signal is generated
when the internal amplifier in the output stage has less
than approxiamately one volt of remaining drive
capability (when the gate of the output PMOS
transistor nearly reaches ground). Thus the FAULT
output activates slightly before the compliance limit is
reached. Since the comparison is made within the
feedback loop of the output amplifier, the output
accuracy is maintained by its open-loop gain and an
output error does not occur before the FAULT output
becomes active.
If the core temperature of the AD5412/AD5422
exceeds approx. 150°C.
The IOUT FAULT and OVER TEMP bits of the STATUS register
are used in conjunction with the FAULT pin to inform the user
which one of the fault conditions caused the FAULT pin to be
asserted. See Table 19 and Table 20.
VOLTAGE OUTPUT SHORT CIRCUIT PROTECTION
Under normal operation the voltage output will sink/source
10mA and maintain specified operation. The maximum current
that the voltage output will deliver is approx. 20mA, this is the
short circuit current.
VOLTAGE OUTPUT OVER-RANGE
An over-range facility is provided on the voltage output. When
enabled via the CONTROL register, the selected output range
will be over-ranged by 10%.
VOLTAGE OUTPUT FORCE-SENSE
The +VSENSE and –VSENSE pins are provided to facilitate remote
sensing of the load connected to the voltage output. If the load
is connected at the end of a long or high impedance cable,
sensing the voltage at the load will allow the output amplifier to
compensate and ensure the correct voltage is applied across the
load. This function is limited only by the available power supply
headroom.
Table 21. CLEAR SELECT Options
CLRSEL
0
1
Output
Unipolar Output Range
0V
Mid-Scale
Value
Bipolar Output Range
0V
Negative Full-Scale
As well as defining the output value for a clear operation, the
CLRSEL bit and CLEAR SELECT pin also define the default
output value. On selection of a new voltage range the output
value will be as defined in Table 21. It is recommended, to avoid
glitches on the output, that before changing voltage ranges the
output be disabled by setting the OUTEN bit of the Control
register to logic low. When OUTEN is set to logic high the
output will go to the default value as defined by CLRSEL and
CLEAR SELECT.
INTERNAL REFERENCE
The AD5412/AD5422 contains an integrated +5V voltage
reference with initial accuracy of ±2mV max and a temperature
drift coefficient of ±10 ppm/°C max. The reference voltage is
buffered and externally available for use elsewhere within the
system. See Figure 56 for a load regulation graph of the
Integrated reference.
EXTERNAL CURRENT SETTING RESISTOR
Referring to Figure 58, R1 is an internal sense resistor as part of
the voltage to current conversion circuitry. The stability of the
output current over temperature is dependent on the stability of
the value of R1. As a method of improving the stability of the
output current over temperature an external precision 15kΩ low
drift resistor can be connected to the RSET pin of the
AD5412/AD5422 to be used instead of the internal resistor R1.
The external resistor is selected via the CONTROL register. See
Table 14.
DIGITAL POWER SUPPLY
By default, the DVCC pin accepts a power supply of 2.7V to 5.5V,
alternatively, via the DVCC SELECT pin an internal 4.5V power
supply may be output on the DVCC pin for use as a digital power
Rev. PrF | Page 30 of 38
Preliminary Technical Data
AD5412/AD5422
supply for other devices in the system or as a termination for
pull-up resistors. This facility offers the advantage of not having
to bring a digital supply across an isolation barrier. The internal
power supply is enabled by leaving the DVCC SELECT pin
unconnected. To disable the internal supply DVCC SELECT
should be tied to 0V. DVCC is capable of supplying up to 5mA of
current, for a load regulation graph see Figure 49.
define the rate of change of the output value.Table 22 and Table
23 outline the range of values for both the SR CLOCK and SR
STEP parameters.
Table 22. Slew Rate Step Size options
SR STEP
000
001
010
011
100
101
110
111
EXTERNAL BOOST FUNCTION
The addition of an external boost transistor as shown in Figure
61 will reduce the power dissipated in the AD5412/AD5422 by
reducing the current flowing in the on-chip output transistor
(dividing it by the current gain of the external circuit). A
discrete NPN transistor with a breakdown voltage, BVCEO,
greater than 60V can be used.The external boost capability has
been developed for those users who may wish to use the
AD5412/AD5422 at the extremes of the supply voltage, load
current and temperature range. The boost transistor can also be
used to reduce the amount of temperature induced drift in the
part. This will minimise the temperature induced drift of the
on-chip voltage reference, which improves on drift and
linearity.
SR CLOCK
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
AD5412/
AD5422
IOUT
1k
0.022 F
RLOAD
Figure 61. External Boost Configuration
EXTERNAL COMPENSATION CAPACITOR
The voltage output can ordinarily drive capacitive loads of up to
20nF, if there is a requirement to drive greater capacitive loads,
of up to 1uF, an external compensation capacitor can be
connected between the CCOMP and VOUT pins. The additon of the
capacitor will keep the output voltage stable but will also reduce
the bandwidth and increase the settling time of the voltage
output.
DIGITAL SLEW RATE CONTROL
The Slew Rate Control feature of the AD5412/AD5422 allows
the user to control the rate at which the output value changes.
This feature is available on both the current and voltage
outputs. With the slew rate control feature disabled the output
value will change at a rate limited by the output drive circuitry
and the attached load. If the user wishes to reduce the slew rate
this can be achieved by enabling the slew rate control
feature.With the feature enabled via the SREN bit of the
CONTROL register, (See Table 14) the output, instead of
slewing directly between two values, will step digitally at a rate
defined by two parameters accessible via the CONTROL
register as shown in Table 14. The parameters are SR CLOCK
and SR STEP. SR CLOCK defines the rate at which the digital
slew will be updated. SR STEP defines by how much the output
value will change at each update. Together both parameters
AD5422 Step
Size (LSBs)
1
2
4
8
16
32
64
128
Table 23. Slew Rate Update Clock Options
MJD31C
OR
PBSS8110Z
BOOST
AD5412 Step
Size (LSBs)
1/16
⅛
¼
½
1
2
4
8
Update Clock Frequency (Hz)
257732
198413
152439
131579
115741
69444
37594
25773
20161
16026
10288
8278
6897
5525
4237
3300
The time it will take for the output to slew over a given output
range can be expressed as follows;
SlewTime =
OutputChange
StepSize × UpdateClockFrequency × LSBSize
Where:
Slew Time is expressed in seconds
Output Change is expressed in Amps for IOUT or Volts for VOUT
When the slew rate control feature is enabled, all output
changes will change at the programmed slew rate, for example if
the CLEAR pin is asserted the output will slew to the clear value
at the programmed slew rate. The output can be halted at its
current value with a write to the CONTROL register. To avoid
halting the output slew, the SLEW ACTIVE bit can be read to
check that the slew has completed before writing to the
AD5412/AD5422 registers. See Table 19.The update clock
frequency for any given value will be the same for all output
ranges, the step size however will vary across output ranges for a
given value of step size as the LSB size will be different for each
output range.Table 24 shows the range of programmable slew
times for a full-scale change on any of the output ranges. The
values were obtained using the Slew Time equation above.
Rev. PrF | Page 31 of 38
AD5412/AD5422
Preliminary Technical Data
Update Clock Frequency (Hz)
Table 24. Programmable Slew Time values in seconds for a full-scale change on any output range.
257732
198413
152439
131579
115741
69444
37594
25773
20161
16026
10288
8278
6897
5525
4237
3300
1
0.25
0.33
0.43
0.50
0.57
0.9
1.7
2.5
3.3
4.1
6.4
7.9
9.5
12
15
20
2
0.13
0.17
0.21
0.25
0.28
0.47
0.87
1.3
1.6
2.0
3.2
4.0
4.8
5.9
7.7
9.9
4
0.06
0.08
0.11
0.12
0.14
0.24
0.44
0.64
0.81
1.0
1.6
2.0
2.4
3.0
3.9
5.0
8
0.03
0.04
0.05
0.06
0.07
0.12
0.22
0.32
0.41
0.51
0.80
1.0
1.2
1.5
1.9
2.5
IOUT FILTERING CAPACITORS (LFCSP PACKAGE)
Two capacitors may be placed between the pins CAP1, CAP2
and AVDD as shown in Figure 62.
Step Size (LSBs)
16
0.016
0.021
0.027
0.031
0.035
0.06
0.11
0.16
0.20
0.26
0.40
0.49
0.59
0.74
0.97
1.24
32
0.008
0.010
0.013
0.016
0.018
0.03
0.05
0.08
0.10
0.13
0.20
0.25
0.30
0.37
0.48
0.62
64
0.004
0.005
0.007
0.008
0.009
0.015
0.03
0.04
0.05
0.06
0.10
0.12
0.15
0.19
0.24
0.31
alternative to the Digital Slew Rate Control feature or in
addition to it as a means of smoothing out the steps caused by
the digital code increments.
C1
C2
AVDD
CAP1
C1
CAP2
AV DD
C2
AVDD
R3
CAP1
AD5412/
AD5422
128
0.0020
0.0026
0.0034
0.0039
0.0044
0.007
0.014
0.020
0.025
0.03
0.05
0.06
0.07
0.09
0.12
0.16
BOOST
R2
CAP2
DAC
IOUT
12.5K
40K
AGND
R1
Figure 62. IOUT Filtering Capacitors
These two pins are only available on the LFCSP package. The
capacitors form a filter on the current output circuitry as shown
in Figure 63 reducing the bandwidth and the rate of change of
the output current. These capacitors can be used as an
Rev. PrF | Page 32 of 38
Figure 63. IOUT Filter Circuitry
IOUT
Preliminary Technical Data
AD5412/AD5422
APPLICATIONS INFORMATION
DRIVING INDUCTIVE LOADS
IOUT
When driving inductive or poorly defined loads connect a
0.01µF capacitor between IOUT and GND. This will ensure
stability with loads beyond 50mH. There is no maximum
capacitance limit. The capacitive component of the load may
cause slower settling. The Digital Slew Rate Control feature may
also prove useful in this situation.
AD5412/
AD5422
+VSENSE
VOUT
-VSENSE
TRANSIENT VOLTAGE PROTECTION
The AD5412/AD5422 contains ESD protection diodes which
prevent damage from normal handling. The industrial control
environment can, however, subject I/O circuits to much higher
transients. In order to protect the AD5412/AD5422 from
excessively high voltage transients , external power diodes and a
surge current limiting resistor is required, as shown in Figure
64. The constraint on the resistor value is that during normal
operation the output level at IOUT must remain within its
voltage compliance limit of AVDD – 2.5V and the two protection
diodes and resistor must have appropriate power ratings.
Further protection can be provided with Transient Voltage
Suppressors or Transorbs, these are available as both
unidirectional (protects against positive high voltage transients)
and bidirectional (protects against both positive and negative
high voltage transients) and are available in a wide range of
standoff and breakdown voltage ratings. It is recommended that
all field connected nodes are protected.
AVDD
AVDD
AD5412/
AD5422
IOUT
RP
AGND
IOUT / VOUT
Figure 65. Connecting IOUT and VOUT to one connector
When the AD5412/AD5422 is configured for a voltage output
the IOUT pin will be in tri-state, when configured for a current
output the VOUT pin will be in tri-state, the function of the
buffer is to prevent current leakage to ground through the
+VSENSE pin when the current output is enabled, the +VSENSE pin
is internally connected to AGND through a resistance of
approx. 40kΩ.
GALVANICALLY ISOLATED INTERFACE
In many process control applications, it is necessary to provide
an isolation barrier between the controller and the unit being
controlled to protect and isolate the controlling circuitry from
any hazardous common-mode voltages that might occur. The
iCoupler® family of products from Analog Devices provides
voltage isolation in excess of 2.5 kV. The serial loading structure
of the AD5412/AD5422 make it ideal for isolated interfaces
because the number of interface lines is kept to a minimum.
Figure 66 shows a 4-channel isolated interface to the
AD5412/AD5422 using an ADuM1400. For further
information, visit http://www.analog.com/icouplers.
RLOAD
Controller
Serial Clock Out
Figure 64. Output Transient Voltage Protection
Serial Data Out
SINGLE CONNECTOR FOR IOUT AND VOUT
Typically in analog output modules that facilitate both current
and voltage outputs there is a seperate connector for each
current output and for each voltage output even though either
the voltage output or the current output can be used at any one
time, this results in a redundant connector. For instance in an 8
channel current and voltage output module there will be 16
connectors and only 8 of these will be in use at any one time
resulting in 8 redundant connectors. The AD5412/AD5422 can
be configured with the IOUT and VOUT pins connected together
and to one connector, thus removing the redundant connector
and allowing for a reduced sized connector block. Figure 65
shows that with an external buffer amplifier the
AD5412/AD5422 can be configured with a single output
connector for current and voltage output.
SYNC Out
Control out
ADuM1400 *
VIA
VIB
VIC
VID
ENCODE
ENCODE
ENCODE
ENCODE
DECODE
DECODE
DECODE
DECODE
VOA
VOB
VOC
VOD
To SCLK
To SDIN
To LATCH
To CLEAR
*ADDITIONAL PINS OMITTED FOR CLARITY
Figure 66. Isolated Interface
MICROPROCESSOR INTERFACING
Microprocessor interfacing to the AD5412/AD5422 is via a serial
bus that uses protocol compatible with microcontrollers and
DSP processors. The communications channel is a 3-wire
(minimum) interface consisting of a clock signal, a data signal,
and a latch signal. The AD5412/AD5422 require a 24-bit dataword with data valid on the rising edge of SCLK.
Rev. PrF | Page 33 of 38
AD5412/AD5422
Preliminary Technical Data
For all interfaces, the DAC output update is initiated on the
rising edge of LATCH. The contents of the registers can be read
using the readback function.
LAYOUT GUIDELINES
In any circuit where accuracy is important, careful consideration
of the power supply and ground return layout helps to ensure
the rated performance. The printed circuit board on which the
AD5412/AD5422 is mounted should be designed so that the
analog and digital sections are separated and confined to certain
areas of the board. If the AD5412/AD5422 is in a system where
multiple devices require an AGND-to-DGND connection, the
connection should be made at one point only. The star ground
point should be established as close as possible to the device.
The AD5412/AD5422 should have ample supply bypassing of
10 µF in parallel with 0.1 µF on each supply located as close to
the package as possible, ideally right up against the device. The
10 µF capacitors are the tantalum bead type. The 0.1 µF
capacitor should have low effective series resistance (ESR) and
low effective series inductance (ESI) such as the common
ceramic types, which provide a low impedance path to ground
at high frequencies to handle transient currents due to internal
logic switching.
The power supply lines of the AD5412/AD5422 should use as
large a trace as possible to provide low impedance paths and
reduce the effects of glitches on the power supply line. Fast
switching signals such as clocks should be shielded with digital
ground to avoid radiating noise to other parts of the board and
should never be run near the reference inputs. A ground line
routed between the SDIN and SCLK lines helps reduce crosstalk
between them (not required on a multilayer board that has a
separate ground plane, but separating the lines helps). It is
essential to minimize noise on the REFIN line because it
couples through to the DAC output.
Avoid crossover of digital and analog signals. Traces on
opposite sides of the board should run at right angles to each
other. This reduces the effects of feed through the board. A
microstrip technique is by far the best, but not always possible
with a double-sided board. In this technique, the component
side of the board is dedicated to ground plane, while signal
traces are placed on the solder side.
Rev. PrF | Page 34 of 38
Preliminary Technical Data
AD5412/AD5422
THERMAL AND SUPPLY CONSIDERATIONS
The AD5412/AD5422 is designed to operate at a maximum
junction temperature of 125°C. It is important that the device is
not operated under conditions that will cause the junction
temperature to exceed this value . Excessive junction
temperature can occur if the AD5412/AD5422 is operated from
the maximum AVDD and driving the maximum current (24mA)
directly to ground. In this case the ambient temperature should
be controlled or AVDD should be reduced. The conditions will
depend on the device package.
2.5
At maximum ambient temperature of 85°C the 24-lead TSSOP
package can dissipate 950mW and the 40-lead LFCSP package
can dissipate 1.42W.
To ensure the junction temperature does not exceed 125°C
while driving the maximum current of 24mA directly into
ground (also adding an on-chip current of 3mA), AVDD should
be reduced from the maximum rating to ensure the package is
not required to dissipate more power than stated above. See
Table 25, Figure 67 and Figure 68.
45
TSSOP
LFCSP
2
41
39
Supply Voltage (V)
Power Dissipation (W)
TSSOP
LFCSP
43
1.5
1
37
35
33
31
0.5
29
27
0
25
40
45
50
55
60
65
70
Ambient Temperature (°C)
75
80
85
25
35
45
55
65
75
85
Ambient Temperature (°C)
Figure 67. Maximum Power Dissipation Vs Ambient Temperature
Figure 68. Maximum Supply Voltage Vs Ambient Temperature
Table 25. Thermal and Supply considerations for each package
TSSOP
Maximum allowed power dissipation
when operating at an ambient
temperature of 85°C
Maximum allowed ambient
temperature when operating from a
supply of 40V and driving 24mA
directly to ground.
Maximum allowed supply voltage
when operating at an ambient
temperature of 85°C and driving 24mA
directly to ground.
TJ max − TA
Θ JA
LFCSP
=
125 − 85
TJ max − TA
= 950 mW
Θ JA
42
(
)
TJ max − PD × Θ JA = 125 − 40 × 0.027 × 42 = 79°C
TJ max − TA
AI DD × Θ JA
=
125 − 85
0.027 × 42
= 35V
Rev. PrF | Page 35 of 38
=
125 − 85
= 1.42W
28
(
)
TJ max− PD × Θ JA = 125 − 40 × 0.027 × 28 = 85°C
TJ max − TA
AI DD × Θ JA
=
125 − 85
0.027 × 28
= 53V
AD5412/AD5422
Preliminary Technical Data
OUTLINE DIMENSIONS
5.02
5.00
4.95
7.90
7.80
7.70
24
13
4.50
4.40
4.30
3.25
3.20
3.15
EXPOSED
PAD
(Pins Up)
6.40 BSC
1
12
BOTTOM VIEW
TOP VIEW
1.05
1.00
0.80
0.15
0.05
SEATING
PLANE
0.10 COPLANARITY
8°
0°
0.20
0.09
0.30
0.19
0.65
BSC
0.75
0.60
0.45
050806-A
1.20 MAX
COMPLIANT TO JEDEC STANDARDS MO-153-ADT
Figure 69. 24-Lead Thin Shrink Small Outline Package, Exposed Pad [TSSOP_EP]
(RE-24)
Dimensions shown in millimeters
6.00
BSC SQ
0.60 MAX
0.60 MAX
31
30
PIN 1
INDICATOR
TOP
VIEW
0.50
BSC
5.75
BCS SQ
0.50
0.40
0.30
12° MAX
40
1
4.25
4.10 SQ
3.95
EXPOSED
PAD
(BOT TOM VIEW)
21
20
10
11
0.25 MIN
4.50
REF
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
SEATING
PLANE
0.30
0.23
0.18
0.20 REF
COPLANARITY
0.08
COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2
Figure 70. 40-Lead Lead Frame Chip Scale Package
(CP-40)
Dimensions shown in millimeters
Rev. PrF | Page 36 of 38
101306-A
1.00
0.85
0.80
PIN 1
INDICATOR
Preliminary Technical Data
AD5412/AD5422
ORDERING GUIDE
Model
AD5412AREZ
AD5412BREZ
AD5412ACPZ
AD5412BCPZ
AD5422AREZ
AD5422BREZ
AD5422ACPZ
AD5422BCPZ
Resolution
12 Bits
12 Bits
12 Bits
12 Bits
16 Bits
16 Bits
16 Bits
16 Bits
Temperature Range
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
Rev. PrF | Page 37 of 38
Package Description
24 Lead TSSOP_EP
24 Lead TSSOP_EP
40 Lead LFCSP
40 Lead LFCSP
24 Lead TSSOP_EP
24 Lead TSSOP_EP
40 Lead LFCSP
40 Lead LFCSP
Package Option
RE-24
RE-24
CP-40
CP-40
RE-24
RE-24
CP-40
CP-40
AD5412/AD5422
Preliminary Technical Data
NOTES
©2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
PR06996-0-4/08(PrF)
Rev. PrF | Page 38 of 38
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