Microchip DSPIC30F2015AT-30I/PF High-performance, 16-bit digital signal controller Datasheet

dsPIC30F6010A/6015
Data Sheet
High-Performance, 16-bit
Digital Signal Controllers
© 2008 Microchip Technology Inc.
DS70150D
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•
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•
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Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PRO MATE, rfPIC and SmartShunt are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
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SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, In-Circuit Serial
Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,
PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo,
PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total
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SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
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© 2008, Microchip Technology Incorporated, Printed in the
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Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS70150D-page ii
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
High-Performance, 16-bit Digital Signal Controllers
Note:
This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
“dsPIC30F Family Reference Manual”
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmers
Reference Manual” (DS70157).
High-Performance Modified RISC CPU:
• Modified Harvard architecture
• C compiler optimized instruction set architecture
with flexible Addressing modes
• 83 base instructions
• 24-bit wide instructions, 16-bit wide data path
• 144 Kbytes on-chip Flash program space
(Instruction words)
• 8 Kbytes of on-chip data RAM
• 4 Kbytes of nonvolatile data EEPROM
• Up to 30 MIPS operation:
- DC to 40 MHz external clock input
- 4 MHz-10 MHz oscillator input with
PLL active (4x, 8x, 16x)
- 7.37 MHz internal RC with PLL active
(4x, 8x, 16x)
• 44 interrupt sources:
- 5 external interrupt sources
- 8 user selectable priority levels for each
interrupt source
- 4 processor trap sources
• 16 x 16-bit working register array
DSP Engine Features:
•
•
•
•
Dual data fetch
Accumulator write-back for DSP operations
Modulo and Bit-Reversed Addressing modes
Two, 40-bit wide accumulators with optional
saturation logic
• 17-bit x 17-bit single-cycle hardware fractional/
integer multiplier
• All DSP instructions single cycle
• ±16-bit single-cycle shift
© 2008 Microchip Technology Inc.
Peripheral Features:
• High-current sink/source I/O pins: 25 mA/25 mA
• Timer module with programmable prescaler:
- Five 16-bit timers/counters; optionally pair
16-bit timers into 32-bit timer modules
• 16-bit Capture input functions
• 16-bit Compare/PWM output functions
• 3-wire SPI modules (supports 4 Frame modes)
• I2CTM module supports Multi-Master/Slave mode
and 7-bit/10-bit addressing
• 2 UART modules with FIFO Buffers
• 2 CAN modules, 2.0B compliant (dsPIC306010A)
• 1 CAN module, 2.0B compliant (dsPIC306015)
Motor Control PWM Module Features:
• 8 PWM output channels:
- Complementary or Independent Output
modes
- Edge and Center-Aligned modes
• 4 duty cycle generators
• Dedicated time base
• Programmable output polarity
• Dead-Time control for Complementary mode
• Manual output control
• Trigger for A/D conversions
Quadrature Encoder Interface Module
Features:
•
•
•
•
•
•
•
Phase A, Phase B and Index Pulse input
16-bit up/down position counter
Count direction status
Position Measurement (x2 and x4) mode
Programmable digital noise filters on inputs
Alternate 16-bit Timer/Counter mode
Interrupt on position counter rollover/underflow
Analog Features:
• 10-bit Analog-to-Digital Converter (ADC) with
4 S/H Inputs:
- 1 Msps conversion rate
- 16 input channels
- Conversion available during Sleep and Idle
• Programmable Brown-out Reset
DS70150D-page 3
dsPIC30F6010A/6015
Special Microcontroller Features:
CMOS Technology:
• Enhanced Flash program memory:
- 10,000 erase/write cycle (min.) for
industrial temperature range, 100K (typical)
• Data EEPROM memory:
- 100,000 erase/write cycle (min.) for
industrial temperature range, 1M (typical)
• Self-reprogrammable under software control
• Power-on Reset (POR), Power-up Timer (PWRT)
and Oscillator Start-up Timer (OST)
• Flexible Watchdog Timer (WDT) with on-chip,
low-power RC oscillator for reliable operation
• Fail-Safe Clock Monitor operation detects clock
failure and switches to on-chip, low-power RC
oscillator
• Programmable code protection
• In-Circuit Serial Programming™ (ICSP™)
• Selectable Power Management modes
- Sleep, Idle and Alternate Clock modes
•
•
•
•
Low-power, high-speed Flash technology
Wide operating voltage range (2.5V to 5.5V)
Industrial and Extended temperature ranges
Low-power consumption
dsPIC30F Motor Control and Power Conversion Family
UART
SPI
I2C™
CAN
Motor
Output
Program
A/D 10-bit Quad
SRAM EEPROM Timer Input
Comp/Std Control
Pins Mem. Bytes/
1 Msps
Enc
Bytes
Bytes
16-bit Cap
PWM
PWM
Instructions
dsPIC30F6010A
80
144K/48K
8192
4096
5
8
8
8 ch
16 ch
Yes
2
2
1
2
dsPIC30F6015
64
144K/48K
8192
4096
5
8
8
8 ch
16 ch
Yes
2
2
1
1
Device
DS70150D-page 4
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
Pin Diagram
IC5/RD12
OC4/RD3
OC3/RD2
EMUD2/OC2/RD1
OC7/CN15/RD6
OC6/CN14/RD5
OC5/CN13/RD4
IC6/CN19/RD13
67
66
65
64
63
62
61
70
69
68
C2RX/RG0
C2TX/RG1
C1TX/RF1
C1RX/RF0
VDD
VSS
OC8/UPDN/CN16/RD7
PWM2L/RE2
PWM1H/RE1
PWM1L/RE0
PWM2H/RE3
80
79
78
77
76
75
74
73
72
71
PWM3L/RE4
80-Pin TQFP
60
EMUC1/SOSCO/T1CK/CN0/RC14
59
EMUD1/SOSCI/CN1/RC13
58
EMUC2/OC1/RD0
57
56
IC4/RD11
IC3/RD10
6
55
IC2/RD9
SDI2/CN9/RG7
7
54
IC1/RD8
SDO2/CN10/RG8
MCLR
8
53
INT4/RA15
9
52
SS2/CN11/RG9
VSS
10
51
INT3/RA14
VSS
11
50
VDD
12
49
OSC2/CLKO/RC15
OSC1/CLKI
13
48
VDD
SCL/RG2
PWM3H/RE5
1
PWM4L/RE6
2
PWM4H/RE7
3
T2CK/RC1
T4CK/RC3
SCK2/CN8/RG6
4
FLTA/INT1/RE8
5
dsPIC30F6010A
FLTB/INT2/RE9
14
47
AN5/QEB/CN7/RB5
15
46
SDA/RG3
AN4/QEA/CN6/RB4
AN3/INDX/CN5/RB3
16
45
EMUC3/SCK1/INT0/RF6
SDI1/RF7
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
AVSS
AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
VSS
VDD
AN12/RB12
AN13/RB13
AN14/RB14
AN15/OCFB/CN12/RB15
IC7/CN20/RD14
IC8/CN21/RD15
U2RX/CN17/RF4
U2TX/CN18/RF5
U1TX/RF3
AVDD
41
24
20
VREF+/RA10
U1RX/RF2
PGD/EMUD/AN0/CN2/RB0
22
42
23
19
VREF-/RA9
EMUD3/SDO1/RF8
PGC/EMUC/AN1/CN3/RB1
21
18
43
AN7/RB7
AN2/SS1/CN4/RB2
AN6/OCFA/RB6
17
44
Note: Pinout subject to change.
© 2008 Microchip Technology Inc.
DS70150D-page 5
dsPIC30F6010A/6015
Pin Diagram
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
PWM3L/RE4
PWM2H/RE3
PWM2L/RE2
PWM1H/RE1
PWM1L/RE0
C1TX/RF1
C1RX/RF0
VDD
VSS
OC8/UPDN/CN16/RD7
OC7/CN15/RD6
OC6/IC6/CN14/RD5
OC5/IC5/CN13/RD4
OC4/RD3
OC3/RD2
EMUD2/OC2/RD1
64-Pin TQFP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
dsPIC30F6015
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
EMUC1/SOSCO/T1CK/CN0/RC14
EMUD1/SOSCI/T4CK/CN1/RC13
EMUC2/OC1/RD0
IC4/INT4/RD11
IC3/INT3/RD10
IC2/FLTB/INT2/RD9
IC1/FLTA/INT1/RD8
VSS
OSC2/CLKO/RC15
OSC1/CLKI
VDD
SCL/RG2
SDA/RG3
EMUC3/SCK1/INT0/RF6
U1RX/SDI1/RF2
EMUD3/U1TX/SDO1/RF3
PGC/EMUC/AN6/OCFA/RB6
PGD/EMUD/AN7/RB7
AVDD
AVSS
AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
VSS
VDD
AN12/RB12
AN13/RB13
AN14/RB14
AN15/OCFB/CN12/RB15
U2RX/CN17/RF4
U2TX/CN18/RF5
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
PWM3H/RE5
PWM4L/RE6
PWM4H/RE7
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
MCLR
SS2/CN11/RG9
VSS
VDD
AN5/QEB/IC8/CN7/RB5
AN4/QEA/IC7/CN6/RB4
AN3/INDX/CN5/RB3
AN2/SS1/CN4/RB2
AN1/VREF-/CN3/RB1
AN0/VREF+/CN2/RB0
Note: Pinout subject to change.
DS70150D-page 6
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 9
2.0 CPU Architecture Overview........................................................................................................................................................ 15
3.0 Memory Organization ................................................................................................................................................................. 23
4.0 Address Generator Units............................................................................................................................................................ 35
5.0 Interrupts .................................................................................................................................................................................... 41
6.0 Flash Program Memory.............................................................................................................................................................. 49
7.0 Data EEPROM Memory ............................................................................................................................................................. 55
8.0 I/O Ports ..................................................................................................................................................................................... 59
9.0 Timer1 Module ........................................................................................................................................................................... 65
10.0 Timer2/3 Module ........................................................................................................................................................................ 69
11.0 Timer4/5 Module ....................................................................................................................................................................... 77
12.0 Input Capture Module ................................................................................................................................................................ 81
13.0 Output Compare Module ............................................................................................................................................................ 85
14.0 Quadrature Encoder Interface (QEI) Module ............................................................................................................................. 89
15.0 Motor Control PWM Module ....................................................................................................................................................... 95
16.0 SPI Module............................................................................................................................................................................... 105
17.0 I2C™ Module ........................................................................................................................................................................... 109
18.0 Universal Asynchronous Receiver Transmitter (UART) Module .............................................................................................. 117
19.0 CAN Module ............................................................................................................................................................................. 125
20.0 10-bit High-Speed Analog-to-Digital Converter (ADC) Module ................................................................................................ 137
21.0 System Integration ................................................................................................................................................................... 149
22.0 Instruction Set Summary .......................................................................................................................................................... 165
23.0 Development Support............................................................................................................................................................... 173
24.0 Electrical Characteristics .......................................................................................................................................................... 177
25.0 Packaging Information.............................................................................................................................................................. 217
Appendix A: ....................................................................................................................................................................................... 221
Index ................................................................................................................................................................................................. 223
The Microchip Web Site ..................................................................................................................................................................... 229
Customer Change Notification Service .............................................................................................................................................. 229
Customer Support .............................................................................................................................................................................. 229
Reader Response .............................................................................................................................................................................. 230
Product Identification System ............................................................................................................................................................ 231
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An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for
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To determine if an errata sheet exists for a particular device, please check with one of the following:
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© 2008 Microchip Technology Inc.
DS70150D-page 7
dsPIC30F6010A/6015
NOTES:
DS70150D-page 8
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
1.0
Note:
DEVICE OVERVIEW
This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
“dsPIC30F Family Reference Manual”
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmers
Reference Manual” (DS70157).
This document contains device-specific information for
the dsPIC30F6010A and dsPIC30F6015 devices. The
dsPIC30F devices contain extensive Digital Signal
Processor
(DSP)
functionality
within
a
high-performance 16-bit microcontroller (MCU)
architecture. Figure 1-1 shows a device block diagram
for the dsPIC30F6010A device. Figure 1-2 shows a
device block diagram for the dsPIC30F6015 device.
© 2008 Microchip Technology Inc.
DS70150D-page 9
dsPIC30F6010A/6015
FIGURE 1-1:
dsPIC30F6010A BLOCK DIAGRAM
Y Data Bus
X Data Bus
16
Interrupt
Controller
PSV & Table
Data Access
24 Control Block
8
16
16
Data Latch
Y Data
RAM
(4 Kbytes)
Address
Latch
16
24
Y AGU
PCU PCH PCL
Program Counter
Loop
Stack
Control
Control
Logic
Logic
Address Latch
Program Memory
(144 Kbytes)
Data EEPROM
(4 Kbytes)
Data Latch
X Data
RAM
(4 Kbytes)
Address
Latch
16
VREF-/RA9
VREF+/RA10
INT3/RA14
INT4/RA15
PORTA
16
16
X RAGU
X WAGU
16
24
16
Effective Address
16
Data Latch
ROM Latch
16
24
PORTB
T2CK/RC1
T4CK/RC3
EMUD1/SOSCI/CN1/RC13
EMUC1/SOSCO/T1CK/CN0/RC14
OSC2/CLKO/RC15
IR
16
16
16 x 16
W Reg Array
Decode
PORTC
Instruction
Decode &
Control
16 16
Control Signals
to Various Blocks
OSC1/CLKI
DSP
Engine
Power-up
Timer
ALU<16>
POR/BOR
Reset
MCLR
VDD, VSS
AVDD, AVSS
CAN1,
CAN2
SPI1,
SPI2
Divide
Unit
Oscillator
Start-up Timer
Timing
Generation
Watchdog
Timer
Low-Voltage
Detect
16
16
PORTD
10-bit ADC
Input
Capture
Module
Output
Compare
Module
I2C™
Timers
QEI
Motor Control
PWM
UART1,
UART2
EMUC2/OC1/RD0
EMUD2/OC2/RD1
OC3/RD2
OC4/RD3
OC5/CN13/RD4
OC6/CN14/RD5
OC7/CN15/RD6
OC8/UPDN/CN16/RD7
IC1/RD8
IC2/RD9
IC3/RD10
IC4/RD11
IC5/RD12
IC6/CN19/RD13
IC7/CN20/RD14
IC8/CN21/RD15
PWM1L/RE0
PWM1H/RE1
PWM2L/RE2
PWM2H/RE3
PWM3L/RE4
PWM3H/RE5
PWM4L/RE6
PWM4H/RE7
FLTA/INT1/RE8
FLTB/INT2/RE9
PORTE
C1RX/RF0
C1TX/RF1
U1RX/RF2
U1TX/RF3
U2RX/CN17/RF4
U2TX/CN18/RF5
EMUC3/SCK1/INT0/RF6
SDI1/RF7
EMUD3/SDO1/RF8
C2RX/RG0
C2TX/RG1
SCL/RG2
SDA/RG3
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
SS2/CN11/RG9
PORTG
DS70150D-page 10
PGD/EMUD/AN0/CN2/RB0
PGC/EMUC/AN1/CN3/RB1
AN2/SS1/CN4/RB2
AN3/INDX/CN5/RB3
AN4/QEA/CN6/RB4
AN5/QEB/CN7/RB5
AN6/OCFA/RB6
AN7/RB7
AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
AN12/RB12
AN13/RB13
AN14/RB14
AN15/OCFB/CN12/RB15
PORTF
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 1-2:
dsPIC30F6015 BLOCK DIAGRAM
Y Data Bus
X Data Bus
Interrupt
Controller
PSV & Table
Data Access
24 Control Block
8
16
16
16
Data Latch
Y Data
RAM
(4 Kbytes)
Address
Latch
16
24
Y AGU
PCU PCH PCL
Program Counter
Loop
Stack
Control
Control
Logic
Logic
Address Latch
Program Memory
(144 Kbytes)
Data EEPROM
(4 Kbytes)
16
Data Latch
X Data
RAM
(4 Kbytes)
Address
Latch
16
16
X RAGU
X WAGU
16
24
16
Effective Address
16
Data Latch
ROM Latch
16
24
PORTB
IR
16 x 16
W Reg Array
Decode
PORTC
Instruction
Decode &
Control
16 16
Control Signals
to Various Blocks
OSC1/CLKI
EMUD1/SOSCI/T4CK/CN1/RC13
EMUC1/SOSCO/T1CK/CN0/RC14
OSC2/CLKO/RC15
16
16
AN0/VREF+/CN2/RB0
AN1/VREF-/CN3/RB1
AN2/SS1/CN4/RB2
AN3/INDX/CN5/RB3
AN4/QEA/IC7/CN6/RB4
AN5/QEB/IC8/CN7/RB5
PGC/EMUC/AN6/OCFA/RB6
PGD/EMUD/AN7/RB7
AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
AN12/RB12
AN13/RB13
AN14/RB14
AN15/OCFB/CN12/RB15
DSP
Engine
Power-up
Timer
EMUC2/OC1/RD0
EMUD2/OC2/RD1
OC3/RD2
OC4/RD3
OC5/IC5/CN13/RD4
OC6/IC6/CN14/RD5
OC7/CN15/RD6
OC8/UPDN/CN16/RD7
IC1/FLTA/INT1/RD8
IC2/FLTB/INT2/RD9
IC3/INT3/RD10
IC4/INT4/RD11
Divide
Unit
Oscillator
Start-up Timer
Timing
Generation
ALU<16>
POR/BOR
Reset
MCLR
VDD, VSS
AVDD, AVSS
Watchdog
Timer
Low-Voltage
Detect
16
16
PORTD
CAN1
10-bit ADC
Input
Capture
Module
Output
Compare
Module
I2C™
SPI1,
SPI2
Timers
QEI
Motor Control
PWM
UART1,
UART2
PWM1L/RE0
PWM1H/RE1
PWM2L/RE2
PWM2H/RE3
PWM3L/RE4
PWM3H/RE5
PWM4L/RE6
PWM4H/RE7
PORTE
SCL/RG2
SDA/RG3
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
SS2/CN11/RG9
C1RX/RF0
C1TX/RF1
U1RX/SDI1/RF2
EMUD3/U1TX/SDO1/RF3
U2RX/CN17/RF4
U2TX/CN18/RF5
EMUC3/SCK1/INT0/RF6
PORTG
© 2008 Microchip Technology Inc.
PORTF
DS70150D-page 11
dsPIC30F6010A/6015
Table 1-1 provides a brief description of the device I/O
pinout and the functions that are multiplexed to a port
pin. Multiple functions may exist on one port pin. When
multiplexing occurs, the peripheral module’s functional
requirements may force an override of the data
direction of the port pin.
TABLE 1-1:
dsPIC30F6010A/6015 I/O PIN DESCRIPTIONS
Pin
Type
Buffer
Type
AN0-AN15
I
Analog
Analog input channels. AN0 and AN1 are also used for device programming
data and clock inputs, respectively.
Pin Name
Description
AVDD
P
P
Positive supply for analog module. This pin must be connected at all times.
AVSS
P
P
Ground reference for analog module.
CLKI
CLKO
I
O
CN0-CN23
I
ST
Input change notification inputs. Can be software programmed for internal weak
pull-ups on all inputs.
C1RX
C1TX
C2RX
C2TX
I
O
I
O
ST
—
ST
—
CAN1 bus receive pin.
CAN1 bus transmit pin.
CAN2 bus receive pin.
CAN2 bus transmit pin.
EMUD
EMUC
EMUD1
EMUC1
EMUD2
EMUC2
EMUD3
EMUC3
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
ST
ST
ST
ST
ST
ST
ST
ST
ICD Primary Communication Channel data input/output pin.
ICD Primary Communication Channel clock input/output pin.
ICD Secondary Communication Channel data input/output pin.
ICD Secondary Communication Channel clock input/output pin.
ICD Tertiary Communication Channel data input/output pin.
ICD Tertiary Communication Channel clock input/output pin.
ICD Quaternary Communication Channel data input/output pin.
ICD Quaternary Communication Channel clock input/output pin.
IC1-IC8
I
ST
Capture inputs 1 through 8.
INDX
QEA
I
I
ST
ST
QEB
I
ST
UPDN
O
CMOS
Quadrature Encoder Index Pulse input.
Quadrature Encoder Phase A input in QEI mode.
Auxiliary Timer External Clock/Gate input in Timer mode.
Quadrature Encoder Phase A input in QEI mode.
Auxiliary Timer External Clock/Gate input in Timer mode.
Position Up/Down Counter Direction State.
INT0
INT1
INT2
INT3
INT4
I
I
I
I
I
ST
ST
ST
ST
ST
Legend: CMOS =
ST
=
I
=
DS70150D-page 12
ST/CMOS External clock source input. Always associated with OSC1 pin function.
—
Oscillator crystal output. Connects to crystal or resonator in Crystal
Oscillator mode. Optionally functions as CLKO in RC and EC modes. Always
associated with OSC2 pin function.
External interrupt 0.
External interrupt 1.
External interrupt 2.
External interrupt 3.
External interrupt 4.
CMOS compatible input or output
Schmitt Trigger input with CMOS levels
Input
Analog =
O
=
P
=
Analog input
Output
Power
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 1-1:
dsPIC30F6010A/6015 I/O PIN DESCRIPTIONS (CONTINUED)
Pin
Type
Buffer
Type
FLTA
FLTB
PWM1L
PWM1H
PWM2L
PWM2H
PWM3L
PWM3H
PWM4L
PWM4H
I
I
O
O
O
O
O
O
O
O
ST
ST
—
—
—
—
—
—
—
—
PWM Fault A input.
PWM Fault B input.
PWM 1 Low output.
PWM 1 High output.
PWM 2 Low output.
PWM 2 High output.
PWM 3 Low output.
PWM 3 High output.
PWM 4 Low output.
PWM 4 High output.
MCLR
I/P
ST
Master Clear (Reset) input or programming voltage input. This pin is an
active-low Reset to the device.
OCFA
OCFB
OC1-OC8
I
I
O
ST
ST
—
Compare Fault A input (for Compare channels 1, 2, 3 and 4).
Compare Fault B input (for Compare channels 5, 6, 7 and 8).
Compare outputs 1 through 8.
OSC1
I
OSC2
I/O
PGD
PGC
I/O
I
ST
ST
In-Circuit Serial Programming™ data input/output pin.
In-Circuit Serial Programming clock input pin.
RA9-RA10
RA14-RA15
I/O
I/O
ST
ST
PORTA is a bidirectional I/O port.
RB0-RB15
I/O
ST
PORTB is a bidirectional I/O port.
RC1
RC3
RC13-RC15
I/O
I/O
I/O
ST
ST
ST
PORTC is a bidirectional I/O port.
RD0-RD15
I/O
ST
PORTD is a bidirectional I/O port.
Pin Name
Description
ST/CMOS Oscillator crystal input. ST buffer when configured in RC mode; CMOS
otherwise.
—
Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator
mode. Optionally functions as CLKO in RC and EC modes.
RE0-RE9
I/O
ST
PORTE is a bidirectional I/O port.
RF0-RF8
I/O
ST
PORTF is a bidirectional I/O port.
RG0-RG3
RG6-RG9
I/O
I/O
ST
ST
PORTG is a bidirectional I/O port.
SCK1
SDI1
SDO1
SS1
SCK2
SDI2
SDO2
SS2
I/O
I
O
I
I/O
I
O
I
ST
ST
—
ST
ST
ST
—
ST
Synchronous serial clock input/output for SPI #1.
SPI #1 Data In.
SPI #1 Data Out.
SPI #1 Slave Synchronization.
Synchronous serial clock input/output for SPI #2.
SPI #2 Data In.
SPI #2 Data Out.
SPI #2 Slave Synchronization.
SCL
SDA
I/O
I/O
ST
ST
Synchronous serial clock input/output for I2C™.
Synchronous serial data input/output for I2C.
SOSCO
SOSCI
O
I
T1CK
T2CK
T4CK
I
I
I
Legend: CMOS =
ST
=
I
=
—
32 kHz low-power oscillator crystal output.
ST/CMOS 32 kHz low-power oscillator crystal input. ST buffer when configured in RC
mode; CMOS otherwise.
ST
ST
ST
Timer1 external clock input.
Timer2 external clock input.
Timer4 external clock input.
CMOS compatible input or output
Schmitt Trigger input with CMOS levels
Input
© 2008 Microchip Technology Inc.
Analog =
O
=
P
=
Analog input
Output
Power
DS70150D-page 13
dsPIC30F6010A/6015
TABLE 1-1:
dsPIC30F6010A/6015 I/O PIN DESCRIPTIONS (CONTINUED)
Pin
Type
Buffer
Type
U1RX
U1TX
U1ARX
U1ATX
U2RX
U2TX
I
O
I
O
I
O
ST
—
ST
—
ST
—
UART1 Receive.
UART1 Transmit.
UART1 Alternate Receive.
UART1 Alternate Transmit.
UART2 Receive.
UART2 Transmit.
VDD
P
—
Positive supply for logic and I/O pins.
VSS
P
—
Ground reference for logic and I/O pins.
VREF+
I
Analog
Analog Voltage Reference (High) input.
VREF-
I
Analog
Analog Voltage Reference (Low) input.
Pin Name
Legend: CMOS =
ST
=
I
=
DS70150D-page 14
Description
CMOS compatible input or output
Schmitt Trigger input with CMOS levels
Input
Analog =
O
=
P
=
Analog input
Output
Power
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
2.0
Note:
CPU ARCHITECTURE
OVERVIEW
This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the
peripherals, register descriptions and
general device functionality, refer to the
“dsPIC30F Family Reference Manual”
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmers
Reference Manual” (DS70157).
This chapter summarizes the CPU and peripheral
functions of the dsPIC30F6010A/6015.
2.1
Core Overview
The core has a 24-bit instruction word. The Program
Counter (PC) is 23 bits wide with the Least Significant
bit (LSb) always clear (see Section 3.1 “Program
Address Space”), and the Most Significant bit (MSb)
is ignored during normal program execution, except for
certain specialized instructions. Thus, the PC can
address up to 4M instruction words of user program
space. An instruction prefetch mechanism is used to
help maintain throughput. Program loop constructs,
free from loop count management overhead, are
supported using the DO and REPEAT instructions, both
of which are interruptible at any point.
The working register array consists of 16x16-bit
registers, each of which can act as data, address or
offset registers. One working register (W15) operates
as a Software Stack Pointer for interrupts and calls.
The data space is 64 Kbytes (32K words) and is split into
two blocks, referred to as X and Y data memory. Each
block has its own independent Address Generation Unit
(AGU). Most instructions operate solely through the X
memory AGU, which provides the appearance of a
single unified data space. The Multiply-Accumulate
(MAC) class of dual source DSP instructions operate
through both the X and Y AGUs, splitting the data
address space into two parts (see Section 3.2 “Data
Address Space”). The X and Y data space boundary is
device-specific and cannot be altered by the user. Each
data word consists of 2 bytes, and most instructions can
address data either as words or bytes.
There are two methods of accessing data stored in
program memory:
• The upper 32 Kbytes of data space memory can be
mapped into the lower half (user space) of program
space at any 16K program word boundary, defined by
the 8-bit Program Space Visibility Page (PSVPAG)
register. This lets any instruction access program
space as if it were data space, with a limitation that the
access requires an additional cycle. Moreover, only
the lower 16 bits of each instruction word can be
accessed using this method.
© 2008 Microchip Technology Inc.
• Linear indirect access of 32K word pages within
program space is also possible using any working
register, via table read and write instructions. Table
read and write instructions can be used to access
all 24 bits of an instruction word.
Overhead-free circular buffers (Modulo Addressing) are
supported in both X and Y address spaces. This is
primarily intended to remove the loop overhead for DSP
algorithms.
The X AGU also supports Bit-Reversed Addressing on
destination Effective Addresses, to greatly simplify input
or output data reordering for radix-2 FFT algorithms.
Refer to Section 4.0 “Address Generator Units” for
details on Modulo and Bit-Reversed Addressing.
The core supports Inherent (no operand), Relative,
Literal, Memory Direct, Register Direct, Register
Indirect, Register Offset and Literal Offset Addressing
modes. Instructions are associated with predefined
addressing modes, depending upon their functional
requirements.
For most instructions, the core is capable of executing
a data (or program data) memory read, a working register (data) read, a data memory write and a program
(instruction) memory read per instruction cycle. As a
result, 3-operand instructions are supported, allowing
C = A + B operations to be executed in a single cycle.
A DSP engine has been included to significantly
enhance the core arithmetic capability and throughput.
It features a high-speed 17-bit by 17-bit multiplier, a
40-bit ALU, two 40-bit saturating accumulators and a
40-bit bidirectional barrel shifter. Data in the accumulator
or any working register can be shifted up to 16 bits right
or 16 bits left in a single cycle. The DSP instructions
operate seamlessly with all other instructions and have
been designed for optimal real-time performance. The
MAC class of instructions can concurrently fetch two data
operands from memory, while multiplying two W
registers. To enable this concurrent fetching of data
operands, the data space has been split for these
instructions and linear for all others. This has been
achieved in a transparent and flexible manner, by
dedicating certain working registers to each address
space for the MAC class of instructions.
The core does not support a multi-stage instruction
pipeline. However, a single stage instruction prefetch
mechanism is used, which accesses and partially
decodes instructions a cycle ahead of execution, in order
to maximize available execution time. Most instructions
execute in a single cycle, with certain exceptions.
The core features a vectored exception processing
structure for traps and interrupts, with 62 independent
vectors. The exceptions consist of up to 8 traps (of which
4 are reserved) and 54 interrupts. Each interrupt is
prioritized based on a user-assigned priority between 1
and 7 (1 being the lowest priority and 7 being the highest)
in conjunction with a predetermined ‘natural order’.
Traps have fixed priorities, ranging from 8 to 15.
DS70150D-page 15
dsPIC30F6010A/6015
2.2
Programmer’s Model
The programmer’s model is shown in Figure 2-1 and
consists of 16x16-bit working registers (W0 through
W15), 2x40-bit accumulators (AccA and AccB),
STATUS register (SR), Data Table Page register
(TBLPAG), Program Space Visibility Page register
(PSVPAG), DO and REPEAT registers (DOSTART,
DOEND, DCOUNT and RCOUNT), and Program
Counter (PC). The working registers can act as data,
address or offset registers. All registers are memory
mapped. W0 acts as the W register for file register
addressing.
2.2.1
SOFTWARE STACK POINTER/
FRAME POINTER
The dsPIC® DSC devices contain a software stack.
W15 is the dedicated Software Stack Pointer (SP), and
will be automatically modified by exception processing
and subroutine calls and returns. However, W15 can be
referenced by any instruction in the same manner as all
other W registers. This simplifies the reading, writing
and manipulation of the Stack Pointer (e.g., creating
stack frames).
Note:
In order to protect against misaligned
stack accesses, W15<0> is always clear.
Some of these registers have a shadow register
associated with each of them, as shown in Figure 2-1.
The shadow register is used as a temporary holding
register and can transfer its contents to or from its host
register upon the occurrence of an event. None of the
shadow registers are accessible directly. The following
rules apply for transfer of registers into and out of
shadows.
W15 is initialized to 0x0800 during a Reset. The user
may reprogram the SP during initialization to any
location within data space.
• PUSH.S and POP.S
W0, W1, W2, W3, SR (DC, N, OV, Z and C bits
only) are transferred.
• DO instruction
DOSTART, DOEND, DCOUNT shadows are
pushed on loop start and popped on loop end.
2.2.2
When a byte operation is performed on a working
register, only the Least Significant Byte of the target
register is affected. However, a benefit of memory
mapped working registers is that both the Least and
Most Significant Bytes can be manipulated through
byte-wide data memory space accesses.
W14 has been dedicated as a Stack Frame Pointer as
defined by the LNK and ULNK instructions. However,
W14 can be referenced by any instruction in the same
manner as all other W registers.
STATUS REGISTER
The dsPIC DSC core has a 16-bit STATUS register
(SR), the LSB of which is referred to as the SR Low
Byte (SRL) and the MSB as the SR High Byte (SRH).
See Figure 2-1 for SR layout.
SRL contains all the MCU ALU operation status flags
(including the Z bit), as well as the CPU Interrupt
Priority Level Status bits, IPL<2:0>, and the Repeat
Active Status bit, RA. During exception processing,
SRL is concatenated with the MSB of the PC to form a
complete word value which is then stacked.
The upper byte of the SR register contains the DSP
adder/subtractor Status bits, the DO Loop Active bit
(DA) and the Digit Carry (DC) Status bit.
2.2.3
PROGRAM COUNTER
The Program Counter is 23 bits wide. Bit 0 is always
clear. Therefore, the PC can address up to 4M
instruction words.
DS70150D-page 16
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 2-1:
dsPIC30F6010A/6015 PROGRAMMER’S MODEL
D15
D0
W0/WREG
PUSH.S Shadow
W1
DO Shadow
W2
W3
Legend
W4
DSP Operand
Registers
W5
W6
W7
Working Registers
W8
W9
DSP Address
Registers
W10
W11
W12/DSP Offset
W13/DSP Write-Back
W14/Frame Pointer
W15/Stack Pointer
Stack Pointer Limit Register
SPLIM
AD39
AD15
AD31
AD0
AccA
DSP
Accumulators
AccB
PC22
PC0
Program Counter
0
0
7
TABPAG
TBLPAG
7
Data Table Page Address
0
PSVPAG
Program Space Visibility Page Address
15
0
RCOUNT
REPEAT Loop Counter
15
0
DCOUNT
DO Loop Counter
22
0
DOSTART
DO Loop Start Address
DOEND
DO Loop End Address
22
15
0
Core Configuration Register
CORCON
OA
OB
SA
SB OAB SAB DA
SRH
© 2008 Microchip Technology Inc.
DC IPL2 IPL1 IPL0 RA
N
OV
Z
C
STATUS Register
SRL
DS70150D-page 17
dsPIC30F6010A/6015
2.3
Divide Support
The dsPIC DSC devices feature a 16/16-bit signed
fractional divide operation, as well as 32/16-bit and
16/16-bit signed and unsigned integer divide
operations, in the form of single instruction iterative
divides. The following instructions and data sizes are
supported:
•
•
•
•
•
DIVF – 16/16 signed fractional divide
DIV.sd – 32/16 signed divide
DIV.ud – 32/16 unsigned divide
DIV.s – 16/16 signed divide
DIV.u – 16/16 unsigned divide
TABLE 2-1:
The divide instructions must be executed within a
REPEAT loop. Any other form of execution (e.g., a
series of discrete divide instructions) will not function
correctly because the instruction flow depends on
RCOUNT. The divide instruction does not automatically
set up the RCOUNT value, and it must, therefore, be
explicitly and correctly specified in the REPEAT
instruction, as shown in Table 2-1 (REPEAT will execute
the target instruction {operand value + 1} times). The
REPEAT loop count must be set up for 18 iterations of
the DIV/DIVF instruction. Thus, a complete divide
operation requires 19 cycles.
Note:
The divide flow is interruptible. However,
the user needs to save the context as
appropriate.
DIVIDE INSTRUCTIONS
Instruction
Function
DIVF
Signed fractional divide: Wm/Wn → W0; Rem → W1
DIV.sd
Signed divide: (Wm+1:Wm)/Wn → W0; Rem → W1
DIV.s
Signed divide: Wm/Wn → W0; Rem → W1
DIV.ud
Unsigned divide: (Wm+1:Wm)/Wn → W0; Rem → W1
DIV.u
Unsigned divide: Wm/Wn → W0; Rem → W1
2.4
DSP Engine
The DSP engine consists of a high-speed 17-bit x
17-bit multiplier, a barrel shifter, and a 40-bit
adder/subtractor (with two target accumulators, round
and saturation logic).
The dsPIC30F devices have a single instruction flow
which can execute either DSP or MCU instructions.
Many of the hardware resources are shared between
the DSP and MCU instructions. For example, the
instruction set has both DSP and MCU multiply
instructions which use the same hardware multiplier.
The DSP engine also has the capability to perform
inherent accumulator-to-accumulator operations, which
require no additional data. These instructions are ADD,
SUB and NEG.
A block diagram of the DSP engine is shown in
Figure 2-2.
TABLE 2-2:
Instruction
DSP INSTRUCTION
SUMMARY
Algebraic Operation
CLR
A=0
ED
A = (x – y)2
EDAC
MAC
MOVSAC
MPY
MPY.N
MSC
A = A + (x – y)2
A = A + (x * y)
No change in A
A=x*y
A=–x*y
A=A–x*y
The DSP engine has various options selected through
various bits in the CPU Core Configuration register
(CORCON), as listed below:
•
•
•
•
•
•
Fractional or Integer DSP Multiply (IF).
Signed or Unsigned DSP Multiply (US).
Conventional or Convergent Rounding (RND).
Automatic Saturation On/Off for AccA (SATA).
Automatic Saturation On/Off for AccB (SATB).
Automatic Saturation On/Off for Writes to Data
Memory (SATDW).
• Accumulator Saturation mode Selection
(ACCSAT).
Note:
For CORCON layout, see Table 3-3.
DS70150D-page 18
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 2-2:
DSP ENGINE BLOCK DIAGRAM
40
S
a
40 Round t 16
u
Logic r
a
t
e
40-bit Accumulator A
40-bit Accumulator B
Carry/Borrow Out
Carry/Borrow In
Saturate
Adder
Negate
40
40
40
16
X Data Bus
Barrel
Shifter
40
Y Data Bus
Sign-Extend
32
Zero Backfill
16
32
33
17-bit
Multiplier/Scaler
16
16
To/From W Array
© 2008 Microchip Technology Inc.
DS70150D-page 19
dsPIC30F6010A/6015
2.4.1
MULTIPLIER
The 17x17-bit multiplier is capable of signed or
unsigned operations and can multiplex its output using
a scaler to support either 1.31 fractional (Q31) or 32-bit
integer results. Unsigned operands are zero-extended
into the 17th bit of the multiplier input value. Signed
operands are sign-extended into the 17th bit of the
multiplier input value. The output of the 17x17-bit
multiplier/scaler is a 33-bit value, which is
sign-extended to 40 bits. Integer data is inherently
represented as a signed two’s complement value,
where the MSB is defined as a sign bit. Generally
speaking, the range of an N-bit two’s complement
integer is -2N-1 to 2N-1 – 1. For a 16-bit integer, the data
range is -32768 (0x8000) to 32767 (0x7FFF), including
0. For a 32-bit integer, the data range is -2,147,483,648
(0x8000 0000) to 2,147,483,645 (0x7FFF FFFF).
When the multiplier is configured for fractional
multiplication, the data is represented as a two’s
complement fraction, where the MSB is defined as a
sign bit and the radix point is implied to lie just after the
sign bit (QX format). The range of an N-bit two’s
complement fraction with this implied radix point is -1.0
to (1-21-N). For a 16-bit fraction, the Q15 data range is
-1.0 (0x8000) to 0.999969482 (0x7FFF), including 0
and has a precision of 3.01518x10-5. In Fractional
mode, a 16x16 multiply operation generates a 1.31
product, which has a precision of 4.65661x10-10.
The same multiplier is used to support the MCU
multiply instructions, which include integer 16-bit
signed, unsigned and mixed sign multiplies.
2.4.2.1
The adder/subtractor is a 40-bit adder with an optional
zero input into one side and either true or complement
data into the other input. In the case of addition, the
carry/borrow input is active-high and the other input is
true data (not complemented), whereas in the case of
subtraction, the carry/borrow input is active-low and the
other input is complemented. The adder/subtractor
generates Overflow Status bits, SA/SB and OA/OB,
which are latched and reflected in the STATUS register.
• Overflow from bit 39: this is a catastrophic
overflow in which the sign of the accumulator is
destroyed.
• Overflow into guard bits 32 through 39: this is a
recoverable overflow. This bit is set whenever all
the guard bits are not identical to each other.
The adder has an additional saturation block which
controls accumulator data saturation, if selected. It
uses the result of the adder, the Overflow Status bits
described above, and the SATA/B (CORCON<7:6>)
and ACCSAT (CORCON<4>) mode control bits to
determine when and to what value to saturate.
Six STATUS register bits have been provided to
support saturation and overflow. They are:
1.
2.
3.
The MUL instruction may be directed to use byte or
word-sized operands. Byte operands will direct a 16-bit
result, and word operands will direct a 32-bit result to
the specified register(s) in the W array.
2.4.2
DATA ACCUMULATORS AND
ADDER/SUBTRACTOR
The data accumulator consists of a 40-bit
adder/subtractor with automatic sign extension logic. It
can select one of two accumulators (A or B) as its
pre-accumulation source and post-accumulation
destination. For the ADD and LAC instructions, the data
to be accumulated or loaded can be optionally scaled
via the barrel shifter, prior to accumulation.
DS70150D-page 20
Adder/Subtractor, Overflow and
Saturation
4.
5.
6.
OA:
AccA overflowed into guard bits
OB:
AccB overflowed into guard bits
SA:
AccA saturated (bit 31 overflow and saturation)
or
AccA overflowed into guard bits and saturated
(bit 39 overflow and saturation)
SB:
AccB saturated (bit 31 overflow and saturation)
or
AccB overflowed into guard bits and saturated
(bit 39 overflow and saturation)
OAB:
Logical OR of OA and OB
SAB:
Logical OR of SA and SB
The OA and OB bits are modified each time data passes
through the adder/subtractor. When set, they indicate
that the most recent operation has overflowed into the
accumulator guard bits (bits 32 through 39). The OA and
OB bits can also optionally generate an arithmetic
warning trap when set and the corresponding overflow
trap flag enable bit (OVATE, OVBTE) in the INTCON1
register (refer to Section 5.0 “Interrupts”) is set. This
allows the user to take immediate action, for example, to
correct system gain.
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
The SA and SB bits are modified each time data passes
through the adder/subtractor, but can only be cleared by
the user. When set, they indicate that the accumulator
has overflowed its maximum range (bit 31 for 32-bit
saturation, or bit 39 for 40-bit saturation) and will be
saturated if saturation is enabled. When saturation is not
enabled, SA and SB default to bit 39 overflow and thus
indicate that a catastrophic overflow has occurred. If the
COVTE bit in the INTCON1 register is set, SA and SB
bits will generate an arithmetic warning trap when
saturation is disabled.
The Overflow and Saturation Status bits can optionally
be viewed in the STATUS register (SR) as the logical
OR of OA and OB (in bit OAB) and the logical OR of SA
and SB (in bit SAB). This allows programmers to check
one bit in the STATUS register to determine if either
accumulator has overflowed, or one bit to determine if
either accumulator has saturated. This would be useful
for complex number arithmetic which typically uses
both the accumulators.
The device supports three Saturation and Overflow
modes.
1.
2.
3.
Bit 39 Overflow and Saturation:
When bit 39 overflow and saturation occurs, the
saturation logic loads the maximally positive 9.31
(0x7FFFFFFFFF) or maximally negative 9.31
value (0x8000000000) into the target
accumulator. The SA or SB bit is set and
remains set until cleared by the user. This is
referred to as ‘super saturation’ and provides
protection against erroneous data or unexpected
algorithm problems (e.g., gain calculations).
Bit 31 Overflow and Saturation:
When bit 31 overflow and saturation occurs, the
saturation logic then loads the maximally
positive 1.31 value (0x007FFFFFFF) or
maximally negative 1.31 value (0x0080000000)
into the target accumulator. The SA or SB bit is
set and remains set until cleared by the user.
When this Saturation mode is in effect, the guard
bits are not used so the OA, OB or OAB bits are
never set.
Bit 39 Catastrophic Overflow
The bit 39 Overflow Status bit from the adder is
used to set the SA or SB bit, which remain set
until cleared by the user. No saturation operation
is performed and the accumulator is allowed to
overflow (destroying its sign). If the COVTE bit in
the INTCON1 register is set, a catastrophic
overflow can initiate a trap exception.
© 2008 Microchip Technology Inc.
2.4.2.2
Accumulator ‘Write-Back’
The MAC class of instructions (with the exception of
MPY, MPY.N, ED and EDAC) can optionally write a
rounded version of the high word (bits 31 through 16)
of the accumulator that is not targeted by the instruction
into data space memory. The write is performed across
the X bus into combined X and Y address space. The
following addressing modes are supported:
1.
2.
W13, Register Direct:
The rounded contents of the non-target
accumulator are written into W13 as a 1.15
fraction.
[W13]+ = 2, Register Indirect with Post-Increment:
The rounded contents of the non-target
accumulator are written into the address pointed
to by W13 as a 1.15 fraction. W13 is then
incremented by 2 (for a word write).
2.4.2.3
Round Logic
The round logic is a combinational block, which
performs a conventional (biased) or convergent
(unbiased) round function during an accumulator write
(store). The Round mode is determined by the state of
the RND bit in the CORCON register. It generates a
16-bit, 1.15 data value which is passed to the data
space write saturation logic. If rounding is not indicated
by the instruction, a truncated 1.15 data value is stored
and the least significant word is simply discarded.
Conventional rounding takes bit 15 of the accumulator,
zero-extends it and adds it to the ACCxH word (bits 16
through 31 of the accumulator). If the ACCxL word (bits
0 through 15 of the accumulator) is between 0x8000
and 0xFFFF (0x8000 included), ACCxH is
incremented. If ACCxL is between 0x0000 and 0x7FFF,
ACCxH is left unchanged. A consequence of this
algorithm is that over a succession of random rounding
operations, the value will tend to be biased slightly
positive.
Convergent (or unbiased) rounding operates in the
same manner as conventional rounding, except when
ACCxL equals 0x8000. If this is the case, the LSb
(bit 16 of the accumulator) of ACCxH is examined. If it
is ‘1’, ACCxH is incremented. If it is ‘0’, ACCxH is not
modified. Assuming that bit 16 is effectively random in
nature, this scheme will remove any rounding bias that
may accumulate.
The SAC and SAC.R instructions store either a
truncated (SAC) or rounded (SAC.R) version of the
contents of the target accumulator to data memory, via
the X bus (subject to data saturation, see
Section 2.4.2.4 “Data Space Write Saturation”).
Note that for the MAC class of instructions, the
accumulator write-back operation will function in the
same manner, addressing combined MCU (X and Y)
data space though the X bus. For this class of
instructions, the data is always subject to rounding.
DS70150D-page 21
dsPIC30F6010A/6015
2.4.2.4
Data Space Write Saturation
2.4.3
BARREL SHIFTER
In addition to adder/subtractor saturation, writes to data
space may also be saturated, but without affecting the
contents of the source accumulator. The data space
write saturation logic block accepts a 16-bit, 1.15
fractional value from the round logic block as its input,
together with overflow status from the original source
(accumulator) and the 16-bit round adder. These are
combined and used to select the appropriate 1.15
fractional value as output to write to data space
memory.
The barrel shifter is capable of performing up to 16-bit
arithmetic or logic right shifts, or up to 16-bit left shifts
in a single cycle. The source can be either of the two
DSP accumulators or the X bus (to support multi-bit
shifts of register or memory data).
If the SATDW bit in the CORCON register is set, data
(after rounding or truncation) is tested for overflow and
adjusted accordingly. For input data greater than
0x007FFF, data written to memory is forced to the
maximum positive 1.15 value, 0x7FFF. For input data
less than 0xFF8000, data written to memory is forced
to the maximum negative 1.15 value, 0x8000. The MSb
of the source (bit 39) is used to determine the sign of
the operand being tested.
The barrel shifter is 40 bits wide, thereby obtaining a
40-bit result for DSP shift operations and a 16-bit result
for MCU shift operations. Data from the X bus is
presented to the barrel shifter between bit positions 16
to 31 for right shifts, and bit positions 0 to 15 for left
shifts.
The shifter requires a signed binary value to determine
both the magnitude (number of bits) and direction of the
shift operation. A positive value will shift the operand
right. A negative value will shift the operand left. A
value of ‘0’ will not modify the operand.
If the SATDW bit in the CORCON register is not set, the
input data is always passed through unmodified under
all conditions.
DS70150D-page 22
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
Note:
3.1
MEMORY ORGANIZATION
FIGURE 3-1:
This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
“dsPIC30F Family Reference Manual”
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmers
Reference Manual” (DS70157).
PROGRAM SPACE
MEMORY MAP FOR
dsPIC30F6010A/6015
Reset – GOTO Instruction
Reset – Target Address
Vector Tables
Program Address Space
The program address space is 4M instruction words. It
is addressable by the 23-bit PC, table instruction
Effective Address (EA), or data space EA, when
program space is mapped into data space, as defined
by Table 3-1. Note that the program space address is
incremented by two between successive program
words, in order to provide compatibility with data space
addressing.
000000
000002
000004
Interrupt Vector Table
User Memory
Space
3.0
Reserved
Alternate Vector Table
User Flash
Program Memory
(48K instructions)
Reserved
(Read ‘0’s)
User program space access is restricted to the lower
4M instruction word address range (0x000000 to
0x7FFFFE), for all accesses other than TBLRD/TBLWT,
which use TBLPAG<7> to determine user or
configuration space access. In Table 3-1, read/write
instructions, bit 23 allows access to the device ID, the
user ID and the Configuration bits. Otherwise, bit 23 is
always clear.
Data EEPROM
(4 Kbytes)
00007E
000080
000084
0000FE
000100
017FFE
018000
7FEFFE
7FF000
7FFFFE
800000
Configuration Memory
Space
Reserved
UNITID (32 instr.)
8005BE
8005C0
8005FE
800600
Reserved
Device Configuration
Registers
F7FFFE
F80000
F8000E
F80010
Reserved
DEVID (2)
© 2008 Microchip Technology Inc.
FEFFFE
FF0000
FFFFFE
DS70150D-page 23
dsPIC30F6010A/6015
TABLE 3-1:
PROGRAM SPACE ADDRESS CONSTRUCTION
Access
Space
Access Type
Instruction Access
TBLRD/TBLWT
TBLRD/TBLWT
Program Space Visibility
FIGURE 3-2:
User
User
(TBLPAG<7> = 0)
Configuration
(TBLPAG<7> = 1)
User
Program Space Address
<23>
<22:16>
<15>
<14:1>
0
PC<22:1>
TBLPAG<7:0>
Data EA <15:0>
TBLPAG<7:0>
0
<0>
0
Data EA <15:0>
PSVPAG<7:0>
Data EA <14:0>
DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION
23 bits
Using
Program
Counter
Program Counter
0
Select
Using
Program
Space
Visibility
0
1
0
EA
PSVPAG Reg
8 bits
15 bits
EA
Using
Table
Instruction
1/0
TBLPAG Reg
8 bits
User/
Configuration
Space
Select
16 bits
24-bit EA
Byte
Select
Note: Program Space Visibility cannot be used to access bits <23:16> of a word in program memory.
DS70150D-page 24
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
3.1.1
DATA ACCESS FROM PROGRAM
MEMORY USING TABLE
INSTRUCTIONS
A set of table instructions are provided to move byte or
word-sized data to and from program space.
1.
This architecture fetches 24-bit wide program memory.
Consequently, instructions are always aligned.
However, as the architecture is modified Harvard, data
can also be present in program space.
There are two methods by which program space can
be accessed; via special table instructions, or through
the remapping of a 16K word program space page into
the upper half of data space (see Section 3.1.2 “Data
Access From Program Memory Using Program
Space Visibility”). The TBLRDL and TBLWTL
instructions offer a direct method of reading or writing
the least significant word of any address within
program space, without going through data space. The
TBLRDH and TBLWTH instructions are the only method
whereby the upper 8 bits of a program space word can
be accessed as data.
2.
3.
The PC is incremented by two for each successive
24-bit program word. This allows program memory
addresses to directly map to data space addresses.
Program memory can thus be regarded as two 16-bit
word-wide address spaces, residing side by side, each
with the same address range. TBLRDL and TBLWTL
access the space which contains the lsw, and TBLRDH
and TBLWTH access the space which contains the
MSB.
4.
Figure 3-2 shows how the EA is created for table
operations and data space accesses (PSV = 1). Here,
P<23:0> refers to a program space word, whereas
D<15:0> refers to a data space word.
FIGURE 3-3:
TBLRDL: Table Read Low
Word: Read the least significant word of the
program address;
P<15:0> maps to D<15:0>.
Byte: Read one of the Least Significant Bytes of
the program address;
P<7:0> maps to the destination byte when byte
select = 0;
P<15:8> maps to the destination byte when byte
select = 1.
TBLWTL: Table Write Low (refer to Section 6.0
“Flash Program Memory” for details on Flash
Programming).
TBLRDH: Table Read High
Word: Read the most significant word of the
program address;
P<23:16> maps to D<7:0>; D<15:8> always
be = 0.
Byte: Read one of the Most Significant Bytes of
the program address;
P<23:16> maps to the destination byte when
byte select = 0;
The destination byte will always be = 0 when
byte select = 1.
TBLWTH: Table Write High (refer to Section 6.0
“Flash Program Memory” for details on Flash
Programming).
PROGRAM DATA TABLE ACCESS (LEAST SIGNIFICANT WORD)
PC Address
0x000000
0x000002
0x000004
0x000006
Program Memory
‘Phantom’ Byte
(Read as ‘0’).
© 2008 Microchip Technology Inc.
23
16
8
0
00000000
00000000
00000000
00000000
TBLRDL.W
TBLRDL.B (Wn<0> = 0)
TBLRDL.B (Wn<0> = 1)
DS70150D-page 25
dsPIC30F6010A/6015
FIGURE 3-4:
PROGRAM DATA TABLE ACCESS (MOST SIGNIFICANT BYTE)
TBLRDH.W
PC Address
0x000000
0x000002
0x000004
0x000006
23
16
8
0
00000000
00000000
00000000
00000000
TBLRDH.B (Wn<0> = 0)
Program Memory
‘Phantom’ Byte
(Read as ‘0’)
3.1.2
TBLRDH.B (Wn<0> = 1)
DATA ACCESS FROM PROGRAM
MEMORY USING PROGRAM SPACE
VISIBILITY
The upper 32 Kbytes of data space may optionally be
mapped into any 16K word program space page. This
provides transparent access of stored constant data
from X data space, without the need to use special
instructions (i.e., TBLRDL/H, TBLWTL/H instructions).
Program space access through the data space occurs
if the MSb of the data space EA is set and program
space visibility is enabled, by setting the PSV bit in the
Core Control register (CORCON). The functions of
CORCON are discussed in Section 2.4 “DSP
Engine”.
Data accesses to this area add an additional cycle to
the instruction being executed, since two program
memory fetches are required.
Note that the upper half of addressable data space is
always part of the X data space. Therefore, when a
DSP operation uses program space mapping to access
this memory region, Y data space should typically
contain state (variable) data for DSP operations,
whereas X data space should typically contain
coefficient (constant) data.
Although each data space address, 0x8000 and higher,
maps directly into a corresponding program memory
address (see Figure 3-5), only the lower 16 bits of the
24-bit program word are used to contain the data. The
upper 8 bits should be programmed to force an illegal
instruction to maintain machine robustness. Refer
to the “dsPIC30F/33F Programmers Reference
Manual” (DS70157) for details on instruction encoding.
DS70150D-page 26
Note that by incrementing the PC by 2 for each
program memory word, the Least Significant 15 bits of
data space addresses directly map to the Least
Significant 15 bits in the corresponding program space
addresses. The remaining bits are provided by the
Program Space Visibility Page register, PSVPAG<7:0>,
as shown in Figure 3-5.
Note:
PSV access is temporarily disabled during
table reads/writes.
For instructions that use PSV which are executed
outside a REPEAT loop:
• The following instructions will require one
instruction cycle in addition to the specified
execution time:
- MAC class of instructions with data operand
prefetch
- MOV instructions
- MOV.D instructions
• All other instructions will require two instruction
cycles in addition to the specified execution time
of the instruction.
For instructions that use PSV which are executed
inside a REPEAT loop:
• The following instances will require two instruction
cycles in addition to the specified execution time
of the instruction:
- Execution in the first iteration
- Execution in the last iteration
- Execution prior to exiting the loop due to an
interrupt
- Execution upon re-entering the loop after an
interrupt is serviced
• Any other iteration of the REPEAT loop will allow
the instruction, accessing data using PSV, to
execute in a single cycle.
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 3-5:
DATA SPACE WINDOW INTO PROGRAM SPACE OPERATION
Data Space
Program Space
0x000100
0x0000
EA<15> = 0
Data
Space
EA
PSVPAG(1)
0x00
8
15
16
15
EA<15> = 1
0x8000
Address
15 Concatenation 23
23
15
0
0x001200
Upper half of Data
Space is mapped
into Program Space
0x017FFE
0xFFFF
BSET
MOV
MOV
MOV
CORCON,#2
#0x00, W0
W0, PSVPAG
0x9200, W0
; PSV bit set
; Set PSVPAG register
; Access program memory location
; using a data space access
Data Read
Note: PSVPAG is an 8-bit register, containing bits <22:15> of the program space address
(i.e., it defines the page in program space to which the upper half of data space is being mapped).
3.2
Data Address Space
The core has two data spaces. The data spaces can be
considered either separate (for some DSP
instructions), or as one unified linear address range (for
MCU instructions). The data spaces are accessed
using two Address Generation Units (AGUs) and
separate data paths.
3.2.1
DATA SPACE MEMORY MAP
The data space memory is split into two blocks, X and
Y data space. A key element of this architecture is that
Y space is a subset of X space, and is fully contained
within X space. In order to provide an apparent Linear
Addressing space, X and Y spaces have contiguous
addresses.
© 2008 Microchip Technology Inc.
When executing any instruction other than one of the
MAC class of instructions, the X block consists of the
64 Kbyte data address space (including all Y
addresses). When executing one of the MAC class of
instructions, the X block consists of the 64 Kbyte data
address space excluding the Y address block (for data
reads only). In other words, all other instructions regard
the entire data memory as one composite address
space. The MAC class instructions extract the Y
address space from data space and address it using
EAs sourced from W10 and W11. The remaining X data
space is addressed using W8 and W9. Both address
spaces are concurrently accessed only with the MAC
class instructions.
A data space memory map is shown in Figure 3-6.
Figure 3-7 shows a graphical summary of how X and Y
data spaces are accessed for MCU and DSP
instructions.
DS70150D-page 27
dsPIC30F6010A/6015
FIGURE 3-6:
dsPIC30F6010A/6015 DATA SPACE MEMORY MAP
Most Significant Byte
Address
MSB
2 Kbyte
SFR Space
0x0001
Least Significant Byte
Address
16 bits
LSB
SFR Space
0x0000
0x07FE
0x0800
0x07FF
0x0801
8 Kbyte
Near
Data
Space
X Data RAM (X)
8 Kbyte
SRAM Space
0x17FF
0x1801
0x17FE
0x1800
0x1FFF
0x1FFE
Y Data RAM (Y)
0x27FF
0x27FE
0x2801
0x2800
0x8001
0x8000
X Data
Unimplemented (X)
Optionally
Mapped
into Program
Memory
0xFFFF
DS70150D-page 28
0xFFFE
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
DATA SPACE FOR MCU AND DSP (MAC CLASS) INSTRUCTIONS EXAMPLE
SFR SPACE
SFR SPACE
X SPACE
FIGURE 3-7:
Y SPACE
UNUSED
X SPACE
(Y SPACE)
X SPACE
UNUSED
UNUSED
Non-MAC Class Ops (Read/Write)
MAC Class Ops (Write)
MAC Class Ops Read-Only
Indirect EA using any W
Indirect EA using W10, W11 Indirect EA using W8, W9
© 2008 Microchip Technology Inc.
DS70150D-page 29
dsPIC30F6010A/6015
3.2.2
DATA SPACES
3.2.3
The X data space is used by all instructions and
supports all addressing modes. There are separate
read and write data buses. The X read data bus is the
return data path for all instructions that view data space
as combined X and Y address space. It is also the X
address space data path for the dual operand read
instructions (MAC class). The X write data bus is the
only write path to data space for all instructions.
The X data space also supports Modulo Addressing for
all instructions, subject to addressing mode
restrictions. Bit-Reversed Addressing is only supported
for writes to X data space.
The Y data space is used in concert with the X data
space by the MAC class of instructions (CLR, ED,
EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to
provide two concurrent data read paths. No writes
occur across the Y bus. This class of instructions
dedicates two W register pointers, W10 and W11, to
always address Y data space, independent of X data
space, whereas W8 and W9 always address X data
space. Note that during accumulator write-back, the
data address space is considered a combination of X
and Y data spaces, so the write occurs across the X
bus. Consequently, the write can be to any address in
the entire data space.
The Y data space can only be used for the data
prefetch operation associated with the MAC class of
instructions. It also supports Modulo Addressing for
automated circular buffers. Of course, all other
instructions can access the Y data address space
through the X data path, as part of the composite linear
space.
The boundary between the X and Y data spaces is
defined as shown in Figure 3-6 and is not user
programmable. Should an EA point to data outside its
own assigned address space, or to a location outside
physical memory, an all-zero word/byte will be
returned. For example, although Y address space is
visible by all non-MAC instructions using any
addressing mode, an attempt by a MAC instruction to
fetch data from that space, using W8 or W9 (X space
pointers), will return 0x0000.
TABLE 3-2:
DATA SPACE WIDTH
The core data width is 16 bits. All internal registers are
organized as 16-bit wide words. Data space memory is
organized in byte addressable, 16-bit wide blocks.
3.2.4
DATA ALIGNMENT
To help maintain backward compatibility with
PIC® MCU devices and improve data space memory
usage efficiency, the dsPIC30F instruction set supports
both word and byte operations. Data is aligned in data
memory and registers as words, but all data space EAs
resolve to bytes. Data byte reads will read the complete
word, which contains the byte, using the LSb of any EA
to determine which byte to select. The selected byte is
placed onto the LSB of the X data path (no byte
accesses are possible from the Y data path as the MAC
class of instruction can only fetch words). That is, data
memory and registers are organized as two parallel
byte wide entities with shared (word) address decode,
but separate write lines. Data byte writes only write to
the corresponding side of the array or register which
matches the byte address.
As a consequence of this byte accessibility, all Effective
Address calculations (including those generated by the
DSP operations, which are restricted to word-sized
data) are internally scaled to step through word-aligned
memory. For example, the core would recognize that
Post-Modified Register Indirect Addressing mode,
[Ws++], will result in a value of Ws + 1 for byte
operations and Ws + 2 for word operations.
All word accesses must be aligned to an even address.
Misaligned word data fetches are not supported, so
care must be taken when mixing byte and word
operations, or translating from 8-bit MCU code. Should
a misaligned read or write be attempted, an address
error trap will be generated. If the error occurred on a
read, the instruction underway is completed, whereas if
it occurred on a write, the instruction will be executed
but the write will not occur. In either case, a trap will
then be executed, allowing the system and/or user to
examine the machine state prior to execution of the
address Fault.
FIGURE 3-8:
EFFECT OF INVALID
MEMORY ACCESSES
15
DATA ALIGNMENT
MSB
87
LSB
0
Data Returned
0001
Byte 1
Byte 0
0000
EA = an unimplemented address
0x0000
0003
Byte 3
Byte 2
0002
W8 or W9 used to access Y data
space in a MAC instruction
0x0000
Byte 5
Byte 4
0004
W10 or W11 used to access X
data space in a MAC instruction
0x0000
Attempted Operation
0005
All Effective Addresses are 16 bits wide and point to
bytes within the data space. Therefore, the data space
address range is 64 Kbytes or 32K words.
DS70150D-page 30
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
A sign-extend (SE) instruction is provided to allow
users to translate 8-bit signed data to 16-bit signed
values. Alternatively, for 16-bit unsigned data, users
can clear the MSB of any W register by executing a
zero-extend (ZE) instruction on the appropriate
address.
Although most instructions are capable of operating on
word or byte data sizes, it should be noted that some
instructions, including the DSP instructions, operate
only on words.
3.2.5
NEAR DATA SPACE
An 8 Kbyte ‘near’ data space is reserved in X address
memory space between 0x0000 and 0x1FFF, which is
directly addressable via a 13-bit absolute address field
within all memory direct instructions. The remaining X
address space and all of the Y address space is
addressable indirectly. Additionally, the whole of X data
space is addressable using MOV instructions, which
support memory direct addressing with a 16-bit
address field.
3.2.6
SOFTWARE STACK
The dsPIC DSC device contains a software stack. W15
is used as the Stack Pointer.
The Stack Pointer always points to the first available
free word and grows from lower addresses towards
higher addresses. It pre-decrements for stack pops and
post-increments for stack pushes, as shown in
Figure 3-9. Note that for a PC push during any CALL
instruction, the MSB of the PC is zero-extended before
the push, ensuring that the MSB is always clear.
Note:
A PC push during exception processing
will concatenate the SRL register to the
MSB of the PC prior to the push.
Similarly, a Stack Pointer underflow (stack error) trap is
generated when the Stack Pointer address is found to
be less than 0x0800, thus preventing the stack from
interfering with the Special Function Register (SFR)
space.
A write to the SPLIM register should not be immediately
followed by an indirect read operation using W15.
FIGURE 3-9:
CALL STACK FRAME
0x0000 15
Stack Grows Towards
Higher Address
All byte loads into any W register are loaded into the
LSB. The MSB is not modified.
0
PC<15:0>
000000000 PC<22:16>
<Free Word>
W15 (before CALL)
W15 (after CALL)
POP: [--W15]
PUSH: [W15++]
3.2.7
DATA RAM PROTECTION FEATURE
The dsPIC30F6010A/6015 devices support Data RAM
protection features which enable segments of RAM to
be protected when used in conjunction with Boot and
Secure Code Segment Security. BSRAM (Secure RAM
segment for BS) is accessible only from the Boot
Segment Flash code when enabled. SSRAM (Secure
RAM segment for RAM) is accessible only from the
Secure Segment Flash code when enabled.
See Table 3-3 for an overview of the BSRAM and
SSRAM SFRs.
There is a Stack Pointer Limit register (SPLIM)
associated with the Stack Pointer. SPLIM is
uninitialized at Reset. As is the case for the Stack
Pointer, SPLIM<0> is forced to ‘0’, because all stack
operations must be word-aligned. Whenever an
Effective Address (EA) is generated using W15 as a
source or destination pointer, the address thus
generated is compared with the value in SPLIM. If the
contents of the Stack Pointer (W15) and the SPLIM register are equal and a push operation is performed, a
stack error trap will not occur. The stack error trap will
occur on a subsequent push operation. Thus, for
example, if it is desirable to cause a stack error trap
when the stack grows beyond address 0x2000 in RAM,
initialize the SPLIM with the value, 0x1FFE.
© 2008 Microchip Technology Inc.
DS70150D-page 31
SFR Name
CORE REGISTER MAP(1)
Address
(Home)
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
© 2008 Microchip Technology Inc.
W0
0000
W0 / WREG
0000 0000 0000 0000
W1
0002
W1
0000 0000 0000 0000
W2
0004
W2
0000 0000 0000 0000
W3
0006
W3
0000 0000 0000 0000
W4
0008
W4
0000 0000 0000 0000
W5
000A
W5
0000 0000 0000 0000
W6
000C
W6
0000 0000 0000 0000
W7
000E
W7
0000 0000 0000 0000
W8
0010
W8
0000 0000 0000 0000
W9
0012
W9
0000 0000 0000 0000
W10
0014
W10
0000 0000 0000 0000
W11
0016
W11
0000 0000 0000 0000
W12
0018
W12
0000 0000 0000 0000
W13
001A
W13
0000 0000 0000 0000
W14
001C
W14
0000 0000 0000 0000
W15
001E
W15
0000 1000 0000 0000
SPLIM
0020
SPLIM
0000 0000 0000 0000
ACCAL
0022
ACCAL
0000 0000 0000 0000
ACCAH
0024
ACCAH
ACCAU
0026
ACCBL
0028
ACCBL
ACCBH
002A
ACCBH
ACCBU
002C
PCL
002E
PCH
0030
—
—
—
—
—
—
—
—
TBLPAG
0032
—
—
—
—
—
—
—
—
TBLPAG
0000 0000 0000 0000
PSVPAG
0034
—
—
—
—
—
—
—
—
PSVPAG
0000 0000 0000 0000
RCOUNT
0036
RCOUNT
DCOUNT
0038
DCOUNT
DOSTARTL
003A
DOSTARTH
003C
DOENDL
003E
DOENDH
0040
Legend:
Note 1:
0000 0000 0000 0000
Sign Extension (ACCA<39>)
ACCAU
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
Sign Extension (ACCB<39>)
ACCBU
0000 0000 0000 0000
PCL
0000 0000 0000 0000
—
PCH
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
DOSTARTL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
u = uninitialized bit; — = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
—
0
uuuu uuuu uuuu uuu0
0
uuuu uuuu uuuu uuu0
DOSTARTH
DOENDL
—
0000 0000 0000 0000
DOENDH
0000 0000 0uuu uuuu
0000 0000 0uuu uuuu
dsPIC30F6010A/6015
DS70150D-page 32
TABLE 3-3:
© 2008 Microchip Technology Inc.
TABLE 3-3:
SFR Name
SR
CORE REGISTER MAP(1) (CONTINUED)
Address
(Home)
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
0042
OA
OB
SA
SB
OAB
SAB
DA
DC
IPL2
IPL1
IPL0
RA
N
OV
Z
C
0000 0000 0000 0000
—
—
—
US
EDT
DL2
DL1
DL0
SATA
SATB
IPL3
PSV
RND
IF
—
—
CORCON
0044
MODCON
0046
XMODEN YMODEN
BWM<3:0>
SATDW ACCSAT
YWM<3:0>
XWM<3:0>
0000 0000 0010 0000
0000 0000 0000 0000
XMODSRT
0048
XS<15:1>
0
uuuu uuuu uuuu uuu0
XMODEND
004A
XE<15:1>
1
uuuu uuuu uuuu uuu1
YMODSRT
004C
YS<15:1>
0
uuuu uuuu uuuu uuu0
YMODEND
004E
YE<15:1>
1
uuuu uuuu uuuu uuu1
XBREV
0050
BREN
DISICNT
0052
—
—
BSRAM
0750
—
—
—
—
—
—
—
—
—
—
—
—
—
IW_BSR IR_BSR RL_BSR 0000 0000 0000 0000
0752
—
—
—
—
—
—
—
—
—
—
—
—
—
IW_SSR IR_SSR RL_SSR 0000 0000 0000 0000
SSRAM
Legend:
Note 1:
XB<14:0>
uuuu uuuu uuuu uuuu
DISICNT<13:0>
0000 0000 0000 0000
u = uninitialized bit; — = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F6010A/6015
DS70150D-page 33
dsPIC30F6010A/6015
NOTES:
DS70150D-page 34
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
4.0
Note:
ADDRESS GENERATOR UNITS
This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
“dsPIC30F Family Reference Manual”
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmers
Reference Manual” (DS70157).
The dsPIC DSC core contains two independent
Address Generator Units (AGU): the X AGU and Y
AGU. The Y AGU supports word-sized data reads for
the DSP MAC class of instructions only. The dsPIC DSC
AGUs support three types of data addressing:
• Linear Addressing
• Modulo (Circular) Addressing
• Bit-Reversed Addressing
Linear and Modulo Data Addressing modes can be
applied to data space or program space. Bit-Reversed
Addressing mode is only applicable to data space
addresses.
4.1
Instruction Addressing Modes
The addressing modes in Table 4-1 form the basis of
the addressing modes optimized to support the specific
features of individual instructions. The addressing
modes provided in the MAC class of instructions are
somewhat different from those in the other instruction
types.
TABLE 4-1:
4.1.1
FILE REGISTER INSTRUCTIONS
Most file register instructions use a 13-bit address field
(f) to directly address data present in the first
8192 bytes of data memory (near data space). Most file
register instructions employ a working register W0,
which is denoted as WREG in these instructions. The
destination is typically either the same file register, or
WREG (with the exception of the MUL instruction),
which writes the result to a register or register pair. The
MOV instruction allows additional flexibility and can
access the entire data space during file register
operation.
4.1.2
MCU INSTRUCTIONS
The three-operand MCU instructions are of the form:
Operand 3 = Operand 1 <function> Operand 2
where Operand 1 is always a working register (i.e., the
addressing mode can only be Register Direct), which is
referred to as Wb. Operand 2 can be a W register,
fetched from data memory, or a 5-bit literal. The result
location can be either a W register or an address
location. The following addressing modes are
supported by MCU instructions:
•
•
•
•
•
Register Direct
Register Indirect
Register Indirect Post-Modified
Register Indirect Pre-Modified
5-bit or 10-bit Literal
Note:
Not all instructions support all the
addressing modes given above. Individual
instructions may support different subsets
of these addressing modes.
FUNDAMENTAL ADDRESSING MODES SUPPORTED
Addressing Mode
File Register Direct
Description
The address of the file register is specified explicitly.
Register Direct
The contents of a register are accessed directly.
Register Indirect
The contents of Wn forms the EA.
Register Indirect Post-Modified
The contents of Wn forms the EA. Wn is post-modified (incremented or
decremented) by a constant value.
Register Indirect Pre-Modified
Wn is pre-modified (incremented or decremented) by a signed constant value
to form the EA.
Register Indirect with Register Offset The sum of Wn and Wb forms the EA.
Register Indirect with Literal Offset
© 2008 Microchip Technology Inc.
The sum of Wn and a literal forms the EA.
DS70150D-page 35
dsPIC30F6010A/6015
4.1.3
MOVE AND ACCUMULATOR
INSTRUCTIONS
Move instructions and the DSP Accumulator class of
instructions provide a greater degree of addressing
flexibility than other instructions. In addition to the
addressing modes supported by most MCU
instructions, Move and Accumulator instructions also
support Register Indirect with Register Offset Addressing mode, also referred to as Register Indexed mode.
Note:
For the MOV instructions, the addressing
mode specified in the instruction can differ
for the source and destination EA.
However, the 4-bit Wb (Register Offset)
field is shared between both source and
destination (but typically only used by
one).
In summary, the following addressing modes are
supported by Move and Accumulator instructions:
•
•
•
•
•
•
•
•
Register Direct
Register Indirect
Register Indirect Post-Modified
Register Indirect Pre-Modified
Register Indirect with Register Offset (Indexed)
Register Indirect with Literal Offset
8-bit Literal
16-bit Literal
Note:
4.1.4
Not all instructions support all the addressing modes given above. Individual
instructions may support different subsets
of these addressing modes.
MAC INSTRUCTIONS
The dual source operand DSP instructions (CLR, ED,
EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also
referred to as MAC instructions, utilize a simplified set of
addressing modes to allow the user to effectively
manipulate the data pointers through Register Indirect
tables.
The two source operand prefetch registers must be a
member of the set {W8, W9, W10, W11}. For data reads,
W8 and W9 will always be directed to the X RAGU and
W10 and W11 will always be directed to the Y AGU. The
Effective Addresses generated (before and after
modification) must, therefore, be valid addresses within
X data space for W8 and W9 and Y data space for W10
and W11.
Note:
In summary, the following addressing modes are
supported by the MAC class of instructions:
•
•
•
•
•
Register Indirect
Register Indirect Post-Modified by 2
Register Indirect Post-Modified by 4
Register Indirect Post-Modified by 6
Register Indirect with Register Offset (Indexed)
4.1.5
OTHER INSTRUCTIONS
Besides the various addressing modes outlined above,
some instructions use literal constants of various sizes.
For example, BRA (branch) instructions use 16-bit
signed literals to specify the branch destination directly,
whereas the DISI instruction uses a 14-bit unsigned
literal field. In some instructions, such as ADD Acc, the
source of an operand or result is implied by the opcode
itself. Certain operations, such as NOP, do not have any
operands.
4.2
Modulo Addressing
Modulo Addressing is a method of providing an
automated means to support circular data buffers using
hardware. The objective is to remove the need for
software to perform data address boundary checks
when executing tightly looped code, as is typical in
many DSP algorithms.
Modulo Addressing can operate in either data or
program space (since the data pointer mechanism is
essentially the same for both). One circular buffer can be
supported in each of the X (which also provides the
pointers into program space) and Y data spaces. Modulo
Addressing can operate on any W register pointer.
However, it is not advisable to use W14 or W15 for
Modulo Addressing, since these two registers are used
as the Stack Frame Pointer and Stack Pointer,
respectively.
In general, any particular circular buffer can only be
configured to operate in one direction, as there are
certain restrictions on the buffer start address (for
incrementing buffers) or end address (for decrementing
buffers) based upon the direction of the buffer.
The only exception to the usage restrictions is for
buffers which have a power-of-2 length. As these
buffers satisfy the start and end address criteria, they
may operate in a Bidirectional mode, (i.e., address
boundary checks will be performed on both the lower
and upper address boundaries).
Register Indirect with Register Offset
Addressing is only available for W9 (in X
space) and W11 (in Y space).
DS70150D-page 36
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
4.2.1
START AND END ADDRESS
4.2.2
The Modulo Addressing scheme requires that a
starting and an ending address be specified and loaded
into the 16-bit Modulo Buffer Address registers:
XMODSRT, XMODEND, YMODSRT and YMODEND
(see Table 3-3).
Note:
Y space Modulo Addressing EA
calculations assume word-sized data (LSb
of every EA is always clear).
The length of a circular buffer is not directly specified. It
is determined by the difference between the
corresponding start and end addresses. The maximum
possible length of the circular buffer is 32K words
(64 Kbytes).
W ADDRESS REGISTER
SELECTION
The Modulo and Bit-Reversed Addressing Control
register, MODCON<15:0>, contains enable flags, as
well as a W register field to specify the W Address
registers. The XWM and YWM fields select which
registers will operate with Modulo Addressing. If
XWM = 15, X RAGU and X WAGU Modulo Addressing
are disabled. Similarly, if YWM = 15, Y AGU Modulo
Addressing is disabled.
The X Address Space Pointer W register (XWM) to
which Modulo Addressing is to be applied, is stored in
MODCON<3:0> (see Table 3-3). Modulo Addressing is
enabled for X data space when XWM is set to any value
other than 15 and the XMODEN bit is set at
MODCON<15>.
The Y Address Space Pointer W register (YWM) to
which Modulo Addressing is to be applied, is stored in
MODCON<7:4>. Modulo Addressing is enabled for Y
data space when YWM is set to any value other than 15
and the YMODEN bit is set at MODCON<14>.
FIGURE 4-1:
MODULO ADDRESSING OPERATION EXAMPLE
Byte
Address
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
DO
MOV
AGAIN:
0x1100
#0x1100,W0
W0, XMODSRT
#0x1163,W0
W0,MODEND
#0x8001,W0
W0,MODCON
#0x0000,W0
#0x1110,W1
AGAIN,#0x31
W0, [W1++]
INC
W0,W0
;set modulo start address
;set modulo end address
;enable W1, X AGU for modulo
;W0 holds buffer fill value
;point W1 to buffer
;fill the 50 buffer locations
;fill the next location
;increment the fill value
0x1163
Start Addr = 0x1100
End Addr = 0x1163
Length = 0x0032 words
© 2008 Microchip Technology Inc.
DS70150D-page 37
dsPIC30F6010A/6015
4.2.3
MODULO ADDRESSING
APPLICABILITY
Modulo Addressing can be applied to the Effective
Address (EA) calculation associated with any W
register. It is important to realize that the address
boundaries check for addresses less than or greater
than the upper (for incrementing buffers) and lower (for
decrementing buffers) boundary addresses (not just
equal to). Address changes may, therefore, jump
beyond boundaries and still be adjusted correctly.
Note:
4.3
The modulo corrected Effective Address is
written back to the register only when
Pre-Modify or Post-Modify Addressing
mode is used to compute the Effective
Address. When an address offset
(e.g., [W7+W2]) is used, Modulo Address
correction is performed, but the contents
of the register remains unchanged.
Bit-Reversed Addressing
Bit-Reversed Addressing is intended to simplify data
re-ordering for radix-2 FFT algorithms. It is supported
by the X AGU for data writes only.
The modifier, which may be a constant value or register
contents, is regarded as having its bit order reversed.
The address source and destination are kept in normal
order. Thus, the only operand requiring reversal is the
modifier.
4.3.1
2.
3.
XB<14:0> is the Bit-Reversed Address modifier or
‘pivot point’ which is typically a constant. In the case of
an FFT computation, its value is equal to half of the FFT
data buffer size.
Note:
BWM (W register selection) in the MODCON
register is any value other than 15 (the stack can
not be accessed using Bit-Reversed Addressing)
and
the BREN bit is set in the XBREV register and
the addressing mode used is Register Indirect
with Pre-Increment or Post-Increment.
FIGURE 4-2:
All Bit-Reversed EA calculations assume
word-sized data (LSb of every EA is
always clear). The XB value is scaled
accordingly to generate compatible (byte)
addresses.
When enabled, Bit-Reversed Addressing will only be
executed for Register Indirect with Pre-Increment or
Post-Increment Addressing and word-sized data writes.
It will not function for any other addressing mode or for
byte-sized data, and normal addresses will be generated
instead. When Bit-Reversed Addressing is active, the W
Address Pointer will always be added to the address
modifier (XB) and the offset associated with the Register
Indirect Addressing mode will be ignored. In addition, as
word-sized data is a requirement, the LSb of the EA is
ignored (and always clear).
Note:
BIT-REVERSED ADDRESSING
IMPLEMENTATION
Bit-Reversed Addressing is enabled when:
1.
If the length of a Bit-Reversed buffer is M = 2N bytes,
then the last ‘N’ bits of the data buffer start address
must be zeros.
Modulo Addressing and Bit-Reversed
Addressing should not be enabled
together. In the event that the user
attempts to do this, Bit-Reversed
Addressing will assume priority when
active for the X WAGU, and X WAGU
Modulo Addressing will be disabled.
However, Modulo Addressing will continue
to function in the X RAGU.
If Bit-Reversed Addressing has already been enabled
by setting the BREN (XBREV<15>) bit, then a write to
the XBREV register should not be immediately followed
by an indirect read operation using the W register that
has been designated as the Bit-Reversed Pointer.
BIT-REVERSED ADDRESS EXAMPLE
Sequential Address
b15 b14 b13 b12 b11 b10 b9 b8
b7 b6 b5 b4
b3 b2 b1
0
Bit Locations Swapped Left-to-Right
Around Center of Binary Value
b15 b14 b13 b12 b11 b10 b9 b8
b7 b6 b5 b1
b2 b3 b4
0
Bit-Reversed Address
Pivot Point
XB = 0x0008 for a 16-word Bit-Reversed Buffer
DS70150D-page 38
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 4-2:
BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY)
Normal Address
Bit-Reversed Address
A3
A2
A1
A0
Decimal
A3
A2
A1
A0
Decimal
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
0
0
0
8
0
0
1
0
2
0
1
0
0
4
0
0
1
1
3
1
1
0
0
12
0
1
0
0
4
0
0
1
0
2
0
1
0
1
5
1
0
1
0
10
0
1
1
0
6
0
1
1
0
6
0
1
1
1
7
1
1
1
0
14
1
0
0
0
8
0
0
0
1
1
1
0
0
1
9
1
0
0
1
9
1
0
1
0
10
0
1
0
1
5
1
0
1
1
11
1
1
0
1
13
1
1
0
0
12
0
0
1
1
3
1
1
0
1
13
1
0
1
1
11
1
1
1
0
14
0
1
1
1
7
1
1
1
1
15
1
1
1
1
15
TABLE 4-3:
BIT-REVERSED ADDRESS MODIFIER VALUES FOR XBREV REGISTER
Buffer Size (Words)
XB<14:0> Bit-Reversed Address Modifier Value
4096
0x0800
2048
0x0400
1024
0x0200
512
0x0100
256
0x0080
128
0x0040
64
0x0020
32
0x0010
16
0x0008
8
0x0004
4
0x0002
2
0x0001
© 2008 Microchip Technology Inc.
DS70150D-page 39
dsPIC30F6010A/6015
NOTES:
DS70150D-page 40
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
5.0
Note:
INTERRUPTS
This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
“dsPIC30F Family Reference Manual”
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmers
Reference Manual” (DS70157).
The dsPIC30F6010A/6015 has 44 interrupt sources
and four processor exceptions (traps), which must be
arbitrated based on a priority scheme.
The CPU is responsible for reading the Interrupt
Vector Table (IVT) and transferring the address
contained in the interrupt vector to the program
counter. The interrupt vector is transferred from the
program data bus into the program counter, via a
24-bit wide multiplexer on the input of the program
counter.
The Interrupt Vector Table (IVT) and Alternate
Interrupt Vector Table (AIVT) are placed near the
beginning of program memory (0x000004). The IVT
and AIVT are shown in Figure 5-1.
The interrupt controller
is
responsible
for
pre-processing the interrupts and processor
exceptions, prior to their being presented to the
processor core. The peripheral interrupts and traps are
enabled, prioritized and controlled using centralized
Special Function Registers:
• IFS0<15:0>, IFS1<15:0>, IFS2<15:0>
All Interrupt Request Flags are maintained in
these three registers. The flags are set by their
respective peripherals or external signals, and
they are cleared via software.
• IEC0<15:0>, IEC1<15:0>, IEC2<15:0>
All Interrupt Enable Control bits are maintained in
these three registers. These control bits are used
to individually enable interrupts from the
peripherals or external signals.
• IPC0<15:0>... IPC11<7:0>
The user assignable priority level associated with
each of these 44 interrupts is held centrally in
these twelve registers.
• IPL<3:0>
The current CPU priority level is explicitly stored
in the IPL bits. IPL<3> is present in the CORCON
register, whereas IPL<2:0> are present in the
STATUS register (SR) in the processor core.
• INTCON1<15:0>, INTCON2<15:0>
Global interrupt control functions are derived from
these two registers. INTCON1 contains the
control and status flags for the processor
exceptions. The INTCON2 register controls the
external interrupt request signal behavior and the
© 2008 Microchip Technology Inc.
use of the alternate vector table.
• INTTREG<15:0>
The associated interrupt vector number and the
new CPU interrupt priority level are latched into
Vector number (VECNUM<5:0>) and Interrupt
level ILR<3:0> bit fields in the INTTREG register.
The new interrupt priority level is the priority of the
pending interrupt.
Note:
Interrupt flag bits get set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit. User
software should ensure the appropriate
interrupt flag bits are clear prior to
enabling an interrupt.
All interrupt sources can be user assigned to one of
seven priority levels, 1 through 7, via the IPCx
registers. Each interrupt source is associated with an
interrupt vector, as shown in Table 5-1. Levels 7 and 1
represent the highest and lowest maskable priorities,
respectively.
Note:
Assigning a priority level of 0 to an
interrupt source is equivalent to disabling
that interrupt.
If the NSTDIS bit (INTCON1<15>) is set, nesting of
interrupts is prevented. Thus, if an interrupt is currently
being serviced, processing of a new interrupt is
prevented, even if the new interrupt is of higher priority
than the one currently being serviced.
Note:
The IPL bits become read-only whenever
the NSTDIS bit has been set to ‘1’.
Certain interrupts have specialized control bits for
features like edge or level triggered interrupts,
interrupt-on-change, etc. Control of these features
remains within the peripheral module which generates
the interrupt.
The DISI instruction can be used to disable the
processing of interrupts of priorities 6 and lower for a
certain number of instructions, during which the DISI bit
(INTCON2<14>) remains set.
When an interrupt is serviced, the PC is loaded with the
address stored in the vector location in program
memory that corresponds to the interrupt. There are 63
different vectors within the IVT (refer to Figure 5-2).
These vectors are contained in locations 0x000004
through 0x0000FE of program memory (refer to
Figure 5-2). These locations contain 24-bit addresses,
and in order to preserve robustness, an address error
trap will take place should the PC attempt to fetch any
of these words during normal execution. This prevents
execution of random data as a result of accidentally
decrementing a PC into vector space, accidentally
mapping a data space address into vector space, or the
PC rolling over to 0x000000 after reaching the end of
implemented program memory space. Execution of a
GOTO instruction to this vector space will also generate
an address error trap.
DS70150D-page 41
dsPIC30F6010A/6015
5.1
Interrupt Priority
The user-assignable Interrupt Priority (IP<2:0>) bits
for each individual interrupt source are located in the
Least Significant 3 bits of each nibble within the IPCx
register(s). Bit 3 of each nibble is not used and is read
as a ‘0’. These bits define the priority level assigned
to a particular interrupt by the user.
Note:
The user-assignable priority levels start at
0, as the lowest priority and level 7, as the
highest priority.
Since more than one interrupt request source may be
assigned to a specific user-assigned priority level, a
means is provided to assign priority within a given level.
This method is called “Natural Order Priority”.
Natural Order Priority is determined by the position of
an interrupt in the vector table, and only affects
interrupt operation when multiple interrupts with the
same user-assigned priority become pending at the
same time.
Table 5-1 lists the interrupt numbers and interrupt
sources for the dsPIC DSC devices and their associated
vector numbers.
Note 1: The Natural Order Priority scheme has 0
as the highest priority and 53 as the
lowest priority.
2: The Natural Order Priority number is the
same as the INT number.
The ability for the user to assign every interrupt to one
of seven priority levels means that the user can assign
a very high overall priority level to an interrupt with a
low natural order priority.
DS70150D-page 42
TABLE 5-1:
INTERRUPT VECTOR TABLE
INT
Vector
Number Number
Interrupt Source
Highest Natural Order Priority
0
8
INT0 – External Interrupt 0
1
9
IC1 – Input Capture 1
2
10
OC1 – Output Compare 1
3
11
T1 – Timer1
4
12
IC2 – Input Capture 2
5
13
OC2 – Output Compare 2
6
14
T2 – Timer2
7
15
T3 – Timer3
8
16
SPI1
9
17
U1RX – UART1 Receiver
10
18
U1TX – UART1 Transmitter
11
19
ADC – ADC Convert Done
12
20
NVM - NVM Write Complete
13
21
SI2C – I2C™ Slave Interrupt
14
22
MI2C – I2C Master Interrupt
15
23
Input Change Interrupt
16
24
INT1 – External Interrupt 1
17
25
IC7 – Input Capture 7
18
26
IC8 – Input Capture 8
19
27
OC3 – Output Compare 3
20
28
OC4 – Output Compare 4
21
29
T4 – Timer4
22
30
T5 – Timer5
23
31
INT2 – External Interrupt 2
24
32
U2RX – UART2 Receiver
25
33
U2TX – UART2 Transmitter
26
34
SPI2
27
35
C1 – Combined IRQ for CAN1
28
36
IC3 – Input Capture 3
29
37
IC4 – Input Capture 4
30
38
IC5 – Input Capture 5
31
39
IC6 – Input Capture 6
32
40
OC5 – Output Compare 5
33
41
OC6 – Output Compare 6
34
42
OC7 – Output Compare 7
35
43
OC8 – Output Compare 8
36
44
INT3 – External Interrupt 3
37
45
INT4 - External Interrupt 4
38
46
C2 – Combined IRQ for CAN2
39
47
PWM – PWM Period Match
40
48
QEI – QEI Interrupt
41
49
Reserved
42
50
Reserved
43
51
FLTA – PWM Fault A
44
52
FLTB – PWM Fault B
45-53
53-61 Reserved
Lowest Natural Order Priority
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
5.2
Reset Sequence
A Reset is not a true exception because the interrupt
controller is not involved in the Reset process. The
processor initializes its registers in response to a Reset
which forces the PC to zero. The processor then begins
program execution at location 0x000000. A GOTO
instruction is stored in the first program memory
location, immediately followed by the address target for
the GOTO instruction. The processor executes the GOTO
to the specified address and then begins operation at
the specified target (start) address.
5.2.1
5.3
Traps can be considered as non-maskable interrupts
indicating a software or hardware error, which adhere
to a predefined priority, as shown in Figure 5-1. They
are intended to provide the user a means to correct
erroneous operation during debug and when operating
within the application.
Note:
RESET SOURCES
There are six sources of error which will cause a device
Reset.
• Watchdog Time-out:
The watchdog has timed out, indicating that the
processor is no longer executing the correct flow
of code.
• Uninitialized W Register Trap:
An attempt to use an uninitialized W register as
an Address Pointer will cause a Reset.
• Illegal Instruction Trap:
Attempted execution of any unused opcodes will
result in an illegal instruction trap. Note that a
fetch of an illegal instruction does not result in an
illegal instruction trap if that instruction is flushed
prior to execution due to a flow change.
• Brown-out Reset (BOR):
A momentary dip in the power supply to the
device has been detected which may result in
malfunction.
• Trap Lockout:
Occurrence of multiple trap conditions
simultaneously will cause a Reset.
Traps
If the user does not intend to take
corrective action in the event of a trap
error condition, these vectors must be
loaded with the address of a default
handler that simply contains the RESET
instruction. If, on the other hand, one of
the vectors containing an invalid address
is called, an address error trap is
generated.
Note that many of these trap conditions can only be
detected when they occur. Consequently, the
questionable instruction is allowed to complete prior to
trap exception processing. If the user chooses to
recover from the error, the result of the erroneous
action that caused the trap may have to be corrected.
There are 8 fixed priority levels for traps: Level 8
through Level 15, which means that IPL3 is always set
during processing of a trap.
If the user is not currently executing a trap, and he sets
the IPL<3:0> bits to a value of ‘0111’ (Level 7), then all
interrupts are disabled, but traps can still be processed.
5.3.1
TRAP SOURCES
The following traps are provided with increasing priority. However, since all traps can be nested, priority has
little effect.
Math Error Trap:
The math error trap executes under the following four
circumstances:
• Should an attempt be made to divide by zero, the
divide operation will be aborted on a cycle boundary and the trap taken.
• If enabled, a math error trap will be taken when an
arithmetic operation on either Accumulator A or B
causes an overflow from bit 31 and the Accumulator Guard bits are not utilized.
• If enabled, a math error trap will be taken when an
arithmetic operation on either Accumulator A or B
causes a catastrophic overflow from bit 39 and all
saturation is disabled.
• If the shift amount specified in a shift instruction is
greater than the maximum allowed shift amount, a
trap will occur.
© 2008 Microchip Technology Inc.
DS70150D-page 43
dsPIC30F6010A/6015
Address Error Trap:
5.3.2
This trap is initiated when any of the following
circumstances occurs:
It is possible that multiple traps can become active
within the same cycle (e.g., a misaligned word stack
write to an overflowed address). In such a case, the
fixed priority shown in Figure 5-2 is implemented,
which may require the user to check if other traps are
pending in order to completely correct the Fault.
• A misaligned data word access is attempted.
• A data fetch from our unimplemented data
memory location is attempted.
• A data access of an unimplemented program
memory location is attempted.
• An instruction fetch from vector space is
attempted.
Note:
4.
5.
In the MAC class of instructions, wherein
the data space is split into X and Y data
space, unimplemented X space includes
all of Y space, and unimplemented Y
space includes all of X space.
Execution of a “BRA #literal” instruction or a
“GOTO #literal” instruction, where literal
is an unimplemented program memory address.
Executing instructions after modifying the PC to
point to unimplemented program memory
addresses. The PC may be modified by loading
a value into the stack and executing a RETURN
instruction.
Stack Error Trap:
HARD AND SOFT TRAPS
‘Soft’ traps include exceptions of priority level 8 through
level 11, inclusive. The arithmetic error trap (level 11)
falls into this category of traps.
‘Hard’ traps include exceptions of priority level 12
through level 15, inclusive. The address error (level
12), stack error (level 13) and oscillator error (level 14)
traps fall into this category.
Each hard trap that occurs must be Acknowledged
before code execution of any type may continue. If a
lower priority hard trap occurs while a higher priority
trap is pending, Acknowledged, or is being processed,
a hard trap conflict will occur.
The device is automatically reset in a hard trap conflict
condition. The TRAPR Status bit (RCON<15>) is set
when the Reset occurs, so that the condition may be
detected in software.
FIGURE 5-1:
1.
2.
The Stack Pointer is loaded with a value which
is greater than the (user programmable) limit
value written into the SPLIM register (stack
overflow).
The Stack Pointer is loaded with a value which
is less than 0x0800 (simple stack underflow).
Decreasing
Priority
This trap is initiated under the following conditions:
IVT
Oscillator Fail Trap:
This trap is initiated if the external oscillator fails and
operation becomes reliant on an internal RC backup.
AIVT
TRAP VECTORS
Reset – GOTO Instruction
Reset – GOTO Address
Reserved
Oscillator Fail Trap Vector
Address Error Trap Vector
Stack Error Trap Vector
Math Error Trap Vector
Reserved Vector
Reserved Vector
Reserved Vector
Interrupt 0 Vector
Interrupt 1 Vector
Interrupt 52 Vector
Interrupt 53 Vector
Reserved
Reserved
Reserved
Oscillator Fail Trap Vector
Stack Error Trap Vector
Address Error Trap Vector
Math Error Trap Vector
Reserved Vector
Reserved Vector
Reserved Vector
Interrupt 0 Vector
Interrupt 1 Vector
Interrupt 52 Vector
Interrupt 53 Vector
DS70150D-page 44
0x000000
0x000002
0x000004
0x000014
0x00007E
0x000080
0x000082
0x000084
0x000094
0x0000FE
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
5.4
Interrupt Sequence
5.5
All interrupt event flags are sampled in the beginning of
each instruction cycle by the IFSx registers. A pending
Interrupt Request (IRQ) is indicated by the flag bit
being equal to a ‘1’ in an IFSx register. The IRQ will
cause an interrupt to occur if the corresponding bit in
the Interrupt Enable (IECx) register is set. For the
remainder of the instruction cycle, the priorities of all
pending interrupt requests are evaluated.
If there is a pending IRQ with a priority level greater
than the current processor priority level in the IPL bits,
the processor will be interrupted.
The processor then stacks the current program counter
and the low byte of the processor STATUS register
(SRL), as shown in Figure 5-2. The low byte of the
STATUS register contains the processor priority level at
the time prior to the beginning of the interrupt cycle.
The processor then loads the priority level for this interrupt into the STATUS register. This action will disable
all lower priority interrupts until the completion of the
Interrupt Service Routine.
FIGURE 5-2:
INTERRUPT STACK
FRAME
Stack Grows Towards
Higher Address
0x0000 15
0
PC<15:0>
SRL IPL3 PC<22:16>
W15 (before CALL)
<Free Word>
W15 (after CALL)
POP : [--W15]
PUSH : [W15++]
Note 1: The user can always lower the priority level
by writing a new value into SR. The Interrupt
Service Routine must clear the interrupt flag
bits in the IFSx register before lowering the
processor interrupt priority in order to avoid
recursive interrupts.
2: The IPL3 bit (CORCON<3>) is always clear
when interrupts are being processed. It is
set only during execution of traps.
The RETFIE (Return from Interrupt) instruction will
unstack the program counter and STATUS registers to
return the processor to its state prior to the interrupt
sequence.
Alternate Vector Table
In program memory, the Interrupt Vector Table (IVT) is
followed by the Alternate Interrupt Vector Table (AIVT),
as shown in Figure 5-1. Access to the Alternate Vector
Table is provided by the ALTIVT bit in the INTCON2
register. If the ALTIVT bit is set, all interrupt and exception processes will use the alternate vectors instead of
the default vectors. The alternate vectors are organized
in the same manner as the default vectors. The AIVT
supports emulation and debugging efforts by providing
a means to switch between an application and a
support environment, without requiring the interrupt
vectors to be reprogrammed. This feature also enables
switching between applications for evaluation of
different software algorithms at run time.
If the AIVT is not required, the program memory
allocated to the AIVT may be used for other purposes.
AIVT is not a protected section and may be freely
programmed by the user.
5.6
Fast Context Saving
A context saving option is available using shadow
registers. Shadow registers are provided for the DC, N,
OV, Z and C bits in SR, and the registers W0 through
W3. The shadows are only one level deep. The shadow
registers are accessible using the PUSH.S and POP.S
instructions only.
When the processor vectors to an interrupt, the
PUSH.S instruction can be used to store the current
value of the aforementioned registers into their
respective shadow registers.
If an ISR of a certain priority uses the PUSH.S and
POP.S instructions for fast context saving, then a
higher priority ISR should not include the same
instructions. Users must save the key registers in
software during a lower priority interrupt, if the higher
priority ISR uses fast context saving.
5.7
External Interrupt Requests
The interrupt controller supports five external interrupt
request signals, INT0-INT4. These inputs are edge
sensitive; they require a low-to-high or a high-to-low
transition to generate an interrupt request. The
INTCON2 register has five bits, INT0EP-INT4EP, that
select the polarity of the edge detection circuitry.
5.8
Wake-up from Sleep and Idle
The interrupt controller may be used to wake-up the
processor from either Sleep or Idle modes, if Sleep or
Idle mode is active when the interrupt is generated.
If an enabled interrupt request of sufficient priority is
received by the interrupt controller, then the standard
interrupt request is presented to the processor. At the
same time, the processor will wake-up from Sleep or
Idle and begin execution of the Interrupt Service
Routine (ISR) needed to process the interrupt request.
© 2008 Microchip Technology Inc.
DS70150D-page 45
SFR
Name
ADR
INTERRUPT CONTROLLER REGISTER MAP FOR dsPIC30F6010A(1)
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
INTCON1 0080
NSTDIS
—
—
—
—
OVATE
OVBTE
COVTE
—
—
—
MATHERR
INTCON2 0082
ALTIVT
DISI
—
—
—
—
—
—
—
—
—
INT4EP
Bit 3
Bit 2
Bit 1
ADDRERR STKERR OSCFAIL
INT3EP
INT2EP
INT1EP
Bit 0
Reset State
—
0000 0000 0000 0000
INT0EP 0000 0000 0000 0000
IFS0
0084
CNIF
MI2CIF
SI2CIF
NVMIF
ADIF
U1TXIF U1RXIF
SPI1IF
T3IF
T2IF
OC2IF
IC2IF
T1IF
OC1IF
IC1IF
INT0IF
0000 0000 0000 0000
IFS1
0086
IC6IF
IC5IF
IC4IF
IC3IF
C1IF
SPI2IF
U2TXIF
U2RXIF
INT2IF
T5IF
T4IF
OC4IF
OC3IF
IC8IF
IC7IF
INT1IF
0000 0000 0000 0000
IFS2
0088
—
—
—
FLTBIF
FLTAIF
—
—
QEIIF
PWMIF
C2IF
INT4IF
INT3IF
OC8IF
OC7IF
OC6IF
OC5IF
0000 0000 0000 0000
IEC0
008C
CNIE
MI2CIE
SI2CIE
NVMIE
ADIE
U1TXIE U1RXIE
SPI1IE
T3IE
T2IE
OC2IE
IC2IE
T1IE
OC1IE
IC1IE
INT0IE
0000 0000 0000 0000
IEC1
008E
IC6IE
IC5IE
IC4IE
IC3IE
C1IE
SPI2IE
U2TXIE
U2RXIE
INT2IE
T5IE
T4IE
OC4IE
OC3IE
IC8IE
IC7IE
INT1IE
0000 0000 0000 0000
IEC2
0090
—
—
—
—
—
QEIIE
PWMIE
C2IE
INT4IE
INT3IE
OC8IE
OC7IE
OC6IE
OC5IE
0000 0000 0000 0000
FLTBIE FLTAIE
IPC0
0094
—
T1IP<2:0>
—
OC1IP<2:0>
—
IC1IP<2:0>
—
INT0IP<2:0>
0100 0100 0100 0100
IPC1
0096
—
T31P<2:0>
—
T2IP<2:0>
—
OC2IP<2:0>
—
IC2IP<2:0>
0100 0100 0100 0100
IPC2
0098
—
ADIP<2:0>
—
U1TXIP<2:0>
—
U1RXIP<2:0>
—
SPI1IP<2:0>
0100 0100 0100 0100
IPC3
009A
—
CNIP<2:0>
—
MI2CIP<2:0>
—
SI2CIP<2:0>
—
NVMIP<2:0>
0100 0100 0100 0100
IPC4
009C
—
OC3IP<2:0>
—
IC8IP<2:0>
—
IC7IP<2:0>
—
INT1IP<2:0>
0100 0100 0100 0100
IPC5
009E
—
INT2IP<2:0>
—
T5IP<2:0>
—
T4IP<2:0>
—
OC4IP<2:0>
0100 0100 0100 0100
IPC6
00A0
—
C1IP<2:0>
—
SPI2IP<2:0>
—
U2TXIP<2:0>
—
U2RXIP<2:0>
0100 0100 0100 0100
IPC7
00A2
—
IC6IP<2:0>
—
IC5IP<2:0>
—
IC4IP<2:0>
—
IC3IP<2:0>
0100 0100 0100 0100
IPC8
00A4
—
OC8IP<2:0>
—
OC7IP<2:0>
—
OC6IP<2:0>
—
OC5IP<2:0>
0100 0100 0100 0100
IPC9
00A6
—
PWMIP<2:0>
—
C2IP<2:0>
—
INT41IP<2:0>
—
INT3IP<2:0>
0100 0100 0100 0100
IPC10
00A8
—
FLTAIP<2:0>
—
—
—
—
—
—
—
—
—
QEIIP<2:0>
0100 0000 0000 0000
IPC11
00AA
—
—
—
—
—
—
—
—
—
—
FLTBIP<2:0>
0000 0000 0000 0100
—
—
—
INTTREG 00B0
—
—
—
—
ILR<3:0>
—
Legend:
— = unimplemented bit, read as ‘0’
Note 1:
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
—
VECNUM<5:0>
0000 0000 0000 0000
dsPIC30F6010A/6015
DS70150D-page 46
TABLE 5-2:
© 2008 Microchip Technology Inc.
© 2008 Microchip Technology Inc.
TABLE 5-3:
INTERRUPT CONTROLLER REGISTER MAP FOR dsPIC30F6015(1)
ADR
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
INTCON1
0080
NSTDIS
—
—
—
—
OVATE
OVBTE
COVTE
—
—
—
MATHERR
INTCON2
0082
ALTIVT
DISI
—
—
—
—
—
—
—
—
—
INT4EP
INT3EP
INT2EP
INT1EP
INT0EP 0000 0000 0000 0000
IFS0
0084
CNIF
MI2CIF
SI2CIF
NVMIF
ADIF
U1TXIF U1RXIF
SPI1IF
T3IF
T2IF
OC2IF
IC2IF
T1IF
OC1IF
IC1IF
INT0IF 0000 0000 0000 0000
IFS1
0086
IC6IF
IC5IF
IC4IF
IC3IF
C1IF
SPI2IF
U2TXIF
U2RXIF
INT2IF
T5IF
T4IF
OC4IF
OC3IF
IC8IF
IC7IF
INT1IF 0000 0000 0000 0000
IFS2
0088
—
—
—
FLTBIF
FLTAIF
—
—
QEIIF
PWMIF
—
INT4IF
INT3IF
OC8IF
OC7IF
OC6IF
OC5IF 0000 0000 0000 0000
IEC0
008C
CNIE
MI2CIE
SI2CIE
NVMIE
ADIE
U1TXIE U1RXIE
SPI1IE
T3IE
T2IE
OC2IE
IC2IE
T1IE
OC1IE
IC1IE
INT0IE 0000 0000 0000 0000
IEC1
008E
IC6IE
IC5IE
IC4IE
IC3IE
C1IE
SPI2IE
U2TXIE
U2RXIE
INT2IE
T5IE
T4IE
OC4IE
OC3IE
IC8IE
IC7IE
INT1IE 0000 0000 0000 0000
IEC2
0090
—
—
—
—
—
QEIIE
PWMIE
—
INT4IE
INT3IE
OC8IE
OC7IE
OC6IE
OC5IE 0000 0000 0000 0000
IPC0
0094
—
T1IP<2:0>
—
OC1IP<2:0>
—
IC1IP<2:0>
—
INT0IP<2:0>
0100 0100 0100 0100
IPC1
0096
—
T31P<2:0>
—
T2IP<2:0>
—
OC2IP<2:0>
—
IC2IP<2:0>
0100 0100 0100 0100
IPC2
0098
—
ADIP<2:0>
—
U1TXIP<2:0>
—
U1RXIP<2:0>
—
SPI1IP<2:0>
0100 0100 0100 0100
IPC3
009A
—
CNIP<2:0>
—
MI2CIP<2:0>
—
SI2CIP<2:0>
—
NVMIP<2:0>
0100 0100 0100 0100
IPC4
009C
—
OC3IP<2:0>
—
IC8IP<2:0>
—
IC7IP<2:0>
—
INT1IP<2:0>
0100 0100 0100 0100
IPC5
009E
—
INT2IP<2:0>
—
T5IP<2:0>
—
T4IP<2:0>
—
OC4IP<2:0>
0100 0100 0100 0100
IPC6
00A0
—
C1IP<2:0>
—
SPI2IP<2:0>
—
U2TXIP<2:0>
—
U2RXIP<2:0>
0100 0100 0100 0100
IPC7
00A2
—
IC6IP<2:0>
—
IC5IP<2:0>
—
IC4IP<2:0>
—
IC3IP<2:0>
0100 0100 0100 0100
IPC8
00A4
—
OC8IP<2:0>
—
OC7IP<2:0>
—
OC6IP<2:0>
—
OC5IP<2:0>
0100 0100 0100 0100
IPC9
00A6
—
PWMIP<2:0>
—
—
—
—
—
INT41IP<2:0>
—
INT3IP<2:0>
0100 0000 0100 0100
IPC10
00A8
—
FLTAIP<2:0>
—
—
—
—
—
—
—
—
—
QEIIP<2:0>
0100 0000 0000 0000
IPC11
00AA
—
—
—
—
—
—
—
—
—
—
FLTBIP<2:0>
0000 0000 0000 0100
—
—
FLTBIE FLTAIE
—
INTTREG 00B0
—
—
—
—
ILR<3:0>
—
Legend:
— = unimplemented bit, read as ‘0’
Note 1:
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
—
Bit 3
Bit 2
Bit 1
ADDRERR STKERR OSCFAIL
VECNUM<5:0>
Bit 0
Reset State
—
0000 0000 0000 0000
0000 0000 0000 0000
DS70150D-page 47
dsPIC30F6010A/6015
SFR
Name
dsPIC30F6010A/6015
NOTES:
DS70150D-page 48
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
6.0
FLASH PROGRAM MEMORY
Note:
6.2
This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
“dsPIC30F Family Reference Manual”
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmers
Reference Manual” (DS70157).
RTSP is accomplished using TBLRD (table read) and
TBLWT (table write) instructions.
With RTSP, the user may erase program memory,
32 instructions (96 bytes) at a time and can write
program memory data, 32 instructions (96 bytes) at a
time.
6.3
6.1
The TBLRDH and TBLWTH instructions are used to read
or write to bits<23:16> of program memory. TBLRDH
and TBLWTH can access program memory in Word or
Byte mode.
In-Circuit Serial Programming™ (ICSP™)
Run-Time Self-Programming (RTSP)
A 24-bit program memory address is formed using
bits<7:0> of the TBLPAG register and the Effective
Address (EA) from a W register specified in the table
instruction, as shown in Figure 6-1.
In-Circuit Serial Programming
(ICSP)
dsPIC30F devices can be serially programmed while in
the end application circuit. This is simply done with two
lines for Programming Clock and Programming Data
(which are named PGC and PGD, respectively), and
three other lines for Power (VDD), Ground (VSS) and
Master Clear (MCLR). This allows customers to
manufacture boards with unprogrammed devices and
then program the microcontroller just before shipping
the product. This also allows the most recent firmware
or a custom firmware to be programmed.
FIGURE 6-1:
Table Instruction Operation Summary
The TBLRDL and the TBLWTL instructions are used to
read or write to bits<15:0> of program memory.
TBLRDL and TBLWTL can access program memory in
Word or Byte mode.
The dsPIC30F family of devices contains internal
program Flash memory for executing user code. There
are two methods by which the user can program this
memory:
1.
2.
Run-Time Self-Programming
(RTSP)
ADDRESSING FOR TABLE AND NVM REGISTERS
24 bits
Using
Program
Counter
Program Counter
0
0
NVMADR Reg EA
Using
NVMADR
Addressing
1/0
NVMADRU Reg
8 bits
16 bits
Working Reg EA
Using
Table
Instruction
User/Configuration
Space Select
© 2008 Microchip Technology Inc.
1/0
TBLPAG Reg
8 bits
16 bits
24-bit EA
Byte
Select
DS70150D-page 49
dsPIC30F6010A/6015
6.4
RTSP Operation
The dsPIC30F Flash program memory is organized
into rows and panels. Each row consists of 32 instructions, or 96 bytes. Each panel consists of 128 rows, or
4K x 24 instructions. RTSP allows the user to erase one
row (32 instructions) at a time and to program
32 instructions at one time.
Each panel of program memory contains write latches
that hold 32 instructions of programming data. Prior to
the actual programming operation, the write data must
be loaded into the panel write latches. The data to be
programmed into the panel is loaded in sequential
order into the write latches; instruction 0, instruction 1,
etc. The addresses loaded must always be from a 32
address boundary.
The basic sequence for RTSP programming is to set up
a Table Pointer, then do a series of TBLWT instructions
to load the write latches. Programming is performed by
setting the special bits in the NVMCON register. 32
TBLWTL and 32 TBLWTH instructions are required to
load the 32 instructions.
6.5
RTSP Control Registers
The four SFRs used to read and write the program
Flash memory are:
•
•
•
•
NVMCON
NVMADR
NVMADRU
NVMKEY
6.5.1
NVMCON REGISTER
The NVMCON register controls which blocks are to be
erased, which memory type is to be programmed and
start of the programming cycle.
6.5.2
NVMADR REGISTER
The NVMADR register is used to hold the lower two
bytes of the Effective Address. The NVMADR register
captures the EA<15:0> of the last table instruction that
has been executed and selects the row to write.
6.5.3
NVMADRU REGISTER
All of the table write operations are single-word writes
(2 instruction cycles), because only the table latches
are written.
The NVMADRU register is used to hold the upper byte
of the Effective Address. The NVMADRU register
captures the EA<23:16> of the last table instruction
that has been executed.
After the latches are written, a programming operation
needs to be initiated to program the data.
6.5.4
The Flash program memory is readable, writable and
erasable during normal operation over the entire VDD
range.
NVMKEY is a write-only register that is used for write
protection. To start a programming or an erase
sequence, the user must consecutively write 0x55 and
0xAA to the NVMKEY register. Refer to Section 6.6
“Programming Operations” for further details.
Note:
DS70150D-page 50
NVMKEY REGISTER
The user can also directly write to the
NVMADR and NVMADRU registers to
specify a program memory address for
erasing or programming.
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
6.6
Programming Operations
A complete programming sequence is necessary for
programming or erasing the internal Flash in RTSP
mode. A programming operation is nominally 2 msec in
duration and the processor stalls (waits) until the
operation is finished. Setting the WR bit
(NVMCON<15>) starts the operation, and the WR bit is
automatically cleared when the operation is finished.
6.6.1
4.
5.
PROGRAMMING ALGORITHM FOR
PROGRAM FLASH
The user can erase or program one row of program
Flash memory at a time. The general process is:
1.
2.
3.
Read one row of program Flash (32 instruction
words) and store into data RAM as a data
“image”.
Update the data image with the desired new
data.
Erase program Flash row.
a) Set up NVMCON register for multi-word,
program Flash, erase, and set WREN bit.
b) Write address of row to be erased into
NVMADRU/NVMDR.
c) Write ‘0x55’ to NVMKEY.
d) Write ‘0xAA’ to NVMKEY.
e) Set the WR bit. This will begin erase cycle.
f) CPU will stall for the duration of the erase
cycle.
g) The WR bit is cleared when erase cycle
ends.
EXAMPLE 6-1:
6.
Write 32 instruction words of data from data
RAM “image” into the program Flash write
latches.
Program 32 instruction words into program
Flash.
a) Set up NVMCON register for multi-word,
program Flash, program, and set WREN
bit.
b) Write ‘0x55’ to NVMKEY.
c) Write ‘0xAA’ to NVMKEY.
d) Set the WR bit. This will begin program
cycle.
e) CPU will stall for duration of the program
cycle.
f) The WR bit is cleared by the hardware
when program cycle ends.
Repeat steps 1 through 5 as needed to program
desired amount of program Flash memory.
6.6.2
ERASING A ROW OF PROGRAM
MEMORY
Example 6-1 shows a code sequence that can be used
to erase a row (32 instructions) of program memory.
ERASING A ROW OF PROGRAM MEMORY
; Setup NVMCON for erase operation, multi word
; program memory selected, and writes enabled
MOV
#0x4041,W0
;
MOV
W0,NVMCON
;
; Init pointer to row to be ERASED
MOV
#tblpage(PROG_ADDR),W0
;
MOV
W0,NVMADRU
;
MOV
#tbloffset(PROG_ADDR),W0
;
MOV
W0, NVMADR
;
DISI
#5
;
;
MOV
#0x55,W0
MOV
W0,NVMKEY
;
MOV
#0xAA,W1
;
MOV
W1,NVMKEY
;
BSET
NVMCON,#WR
;
NOP
;
NOP
;
© 2008 Microchip Technology Inc.
write
Init NVMCON SFR
Initialize PM Page Boundary SFR
Intialize in-page EA[15:0] pointer
Intialize NVMADR SFR
Block all interrupts with priority <7
for next 5 instructions
Write the 0x55 key
Write the 0xAA key
Start the erase sequence
Insert two NOPs after the erase
command is asserted
DS70150D-page 51
dsPIC30F6010A/6015
6.6.3
LOADING WRITE LATCHES
Example 6-2 shows a sequence of instructions that
can be used to load the 96 bytes of write latches.
32 TBLWTL and 32 TBLWTH instructions are needed to
load the write latches selected by the Table Pointer.
EXAMPLE 6-2:
LOADING WRITE LATCHES
; Set up a pointer to the first program memory location to be written
; program memory selected, and writes enabled
MOV
#0x0000,W0
;
MOV
W0,TBLPAG
; Initialize PM Page Boundary SFR
MOV
#0x6000,W0
; An example program memory address
; Perform the TBLWT instructions to write the latches
; 0th_program_word
MOV
#LOW_WORD_0,W2
;
MOV
#HIGH_BYTE_0,W3
;
TBLWTL W2,[W0]
; Write PM low word into program latch
TBLWTH W3,[W0++]
; Write PM high byte into program latch
; 1st_program_word
MOV
#LOW_WORD_1,W2
;
MOV
#HIGH_BYTE_1,W3
;
TBLWTL W2,[W0]
; Write PM low word into program latch
TBLWTH W3,[W0++]
; Write PM high byte into program latch
; 2nd_program_word
MOV
#LOW_WORD_2,W2
;
MOV
#HIGH_BYTE_2,W3
;
TBLWTL W2, [W0]
; Write PM low word into program latch
TBLWTH W3, [W0++]
; Write PM high byte into program latch
•
•
•
; 31st_program_word
MOV
#LOW_WORD_31,W2
;
MOV
#HIGH_BYTE_31,W3
;
TBLWTL W2, [W0]
; Write PM low word into program latch
TBLWTH W3, [W0++]
; Write PM high byte into program latch
Note: In Example 6-2, the contents of the upper byte of W3 has no effect.
6.6.4
INITIATING THE PROGRAMMING
SEQUENCE
For protection, the write initiate sequence for NVMKEY
must be used to allow any erase or program operation
to proceed. After the programming command has been
executed, the user must wait for the programming time
until programming is complete. The two instructions
following the start of the programming sequence
should be NOPs.
EXAMPLE 6-3:
INITIATING A PROGRAMMING SEQUENCE
DISI
#5
MOV
MOV
MOV
MOV
BSET
NOP
NOP
#0x55,W0
W0,NVMKEY
#0xAA,W1
W1,NVMKEY
NVMCON,#WR
DS70150D-page 52
; Block all interrupts with priority <7
; for next 5 instructions
;
;
;
;
;
;
Write the 0x55 key
Write the 0xAA key
Start the erase sequence
Insert two NOPs after the erase
command is asserted
© 2008 Microchip Technology Inc.
© 2008 Microchip Technology Inc.
NVM REGISTER MAP(1)
TABLE 6-1:
Addr.
Bit 15
Bit 14
Bit 13
NVMCON
File Name
0760
WR
WREN
WRERR
NVMADR
0762
NVMADRU
0764
NVMKEY
Legend:
Note 1:
Bit 12 Bit 11 Bit 10
—
—
—
Bit 9
—
Bit 8
Bit 7
TWRI
—
Bit 6
Bit 5
Bit 4
Bit 3
—
—
—
—
—
—
—
—
Bit 1
Bit 0
All Resets
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
NVMADR<15:0>
0766
—
—
—
—
—
—
—
—
u = uninitialized bit; — = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
Bit 2
PROGOP<6:0>
NVMADR<23:16>
0000 0000 uuuu uuuu
KEY<7:0>
0000 0000 0000 0000
dsPIC30F6010A/6015
DS70150D-page 53
dsPIC30F6010A/6015
NOTES:
DS70150D-page 54
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
7.0
Note:
DATA EEPROM MEMORY
This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
“dsPIC30F Family Reference Manual”
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmers
Reference Manual” (DS70157).
The data EEPROM memory is readable and writable
during normal operation over the entire VDD range. The
data EEPROM memory is directly mapped in the
program memory address space.
The four SFRs used to read and write the program
Flash memory are used to access data EEPROM
memory, as well. As described in Section 4.0
“Address Generator Units”, these registers are:
•
•
•
•
NVMCON
NVMADR
NVMADRU
NVMKEY
The EEPROM data memory allows read and write of
single words and 16-word blocks. When interfacing to
data memory, NVMADR, in conjunction with the
NVMADRU register, is used to address the EEPROM
location being accessed. TBLRDL and TBLWTL
instructions are used to read and write data EEPROM.
The dsPIC30F6010 device has 8 Kbytes (4K words) of
data EEPROM, with an address range from 0x7FF000
to 0x7FFFFE.
A word write operation should be preceded by an erase
of the corresponding memory location(s). The write
typically requires 2 ms to complete, but the write time
will vary with voltage and temperature.
© 2008 Microchip Technology Inc.
A program or erase operation on the data EEPROM
does not stop the instruction flow. The user is
responsible for waiting for the appropriate duration of
time before initiating another data EEPROM write/
erase operation. Attempting to read the data EEPROM
while a programming or erase operation is in progress
results in unspecified data.
Control bit WR initiates write operations, similar to
program Flash writes. This bit cannot be cleared, only
set, in software. This bit is cleared in hardware at the
completion of the write operation. The inability to clear
the WR bit in software prevents the accidental or
premature termination of a write operation.
The WREN bit, when set, will allow a write operation.
On power-up, the WREN bit is clear. The WRERR bit is
set when a write operation is interrupted by a MCLR
Reset, or a WDT Time-out Reset, during normal
operation. In these situations, following Reset, the user
can check the WRERR bit and rewrite the location. The
address register NVMADR remains unchanged.
Note:
7.1
Interrupt flag bit NVMIF in the IFS0
register is set when write is complete. It
must be cleared in software.
Reading the Data EEPROM
A TBLRD instruction reads a word at the current
program word address. This example uses W0 as a
pointer to data EEPROM. The result is placed in
register W4, as shown in Example 7-1.
EXAMPLE 7-1:
MOV
MOV
MOV
TBLRDL
DATA EEPROM READ
#LOW_ADDR_WORD,W0 ; Init Pointer
#HIGH_ADDR_WORD,W1
W1,TBLPAG
[ W0 ], W4
; read data EEPROM
DS70150D-page 55
dsPIC30F6010A/6015
7.2
7.2.1
Erasing Data EEPROM
ERASING A BLOCK OF DATA
EEPROM
In order to erase a block of data EEPROM, the
NVMADRU and NVMADR registers must initially
point to the block of memory to be erased. Configure
NVMCON for erasing a block of data EEPROM and
set the WR and WREN bits in the NVMCON register.
Setting the WR bit initiates the erase, as shown in
Example 7-2.
EXAMPLE 7-2:
DATA EEPROM BLOCK ERASE
; Select data EEPROM block, WR, WREN bits
MOV
#4045,W0
MOV
W0,NVMCON
; Initialize NVMCON SFR
; Start erase cycle by setting WR after writing key sequence
DISI
#5
; Block all interrupts with priority <7
; for next 5 instructions
MOV
#0x55,W0
;
MOV
W0,NVMKEY
; Write the 0x55 key
MOV
#0xAA,W1
;
MOV
W1,NVMKEY
; Write the 0xAA key
BSET
NVMCON,#WR
; Initiate erase sequence
NOP
NOP
; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle
; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete
7.2.2
ERASING A WORD OF DATA
EEPROM
The NVMADRU and NVMADR registers must point to
the block. Select a block of data Flash and set the WR
and WREN bits in the NVMCON register. Setting the
WR bit initiates the erase, as shown in Example 7-3.
EXAMPLE 7-3:
DATA EEPROM WORD ERASE
; Select data EEPROM word, WR, WREN bits
MOV
#4044,W0
MOV
W0,NVMCON
; Start erase cycle by setting WR after writing key sequence
DISI
#5
; Block all interrupts with priority <7
; for next 5 instructions
MOV
#0x55,W0
;
MOV
W0,NVMKEY
; Write the 0x55 key
MOV
#0xAA,W1
;
MOV
W1,NVMKEY
; Write the 0xAA key
BSET
NVMCON,#WR
; Initiate erase sequence
NOP
NOP
; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle
; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete
DS70150D-page 56
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
7.3
Writing to the Data EEPROM
To write an EEPROM data location, the following
sequence must be followed:
1.
2.
3.
Erase data EEPROM word.
a) Select word, data EEPROM, erase and set
WREN bit in NVMCON register.
b) Write address of word to be erased into
NVMADRU/NVMADR.
c) Enable NVM interrupt (optional).
d) Write ‘0x55’ to NVMKEY.
e) Write ‘0xAA’ to NVMKEY.
f) Set the WR bit. This will begin erase cycle.
g) Either poll NVMIF bit or wait for NVMIF
interrupt.
h) The WR bit is cleared when the erase cycle
ends.
Write data word into data EEPROM write
latches.
Program 1 data word into data EEPROM.
a) Select word, data EEPROM, program and
set WREN bit in NVMCON register.
b) Enable NVM write done interrupt (optional).
c) Write ‘0x55’ to NVMKEY.
d) Write ‘0xAA’ to NVMKEY.
e) Set the WR bit. This will begin program
cycle.
f) Either poll NVMIF bit or wait for NVM
interrupt.
g) The WR bit is cleared when the write cycle
ends.
EXAMPLE 7-4:
The write will not initiate if the above sequence is not
exactly followed (write 0x55 to NVMKEY, write 0xAA to
NVMCON, then set WR bit) for each word. It is strongly
recommended that interrupts be disabled during this
code segment.
Additionally, the WREN bit in NVMCON must be set to
enable writes. This mechanism prevents accidental
writes to data EEPROM, due to unexpected code
execution. The WREN bit should be kept clear at all
times, except when updating the EEPROM. The
WREN bit is not cleared by hardware.
After a write sequence has been initiated, clearing the
WREN bit will not affect the current write cycle. The WR
bit will be inhibited from being set unless the WREN bit
is set. The WREN bit must be set on a previous
instruction. Both WR and WREN cannot be set with the
same instruction.
At the completion of the write cycle, the WR bit is
cleared in hardware and the Nonvolatile Memory Write
Complete Interrupt Flag bit (NVMIF) is set. The user
may either enable this interrupt, or poll this bit. NVMIF
must be cleared by software.
7.3.1
WRITING A WORD OF DATA
EEPROM
Once the user has erased the word to be programmed,
then a table write instruction is used to write one write
latch, as shown in Example 7-4.
DATA EEPROM WORD WRITE
; Point to data memory
MOV
#LOW_ADDR_WORD,W0
MOV
#HIGH_ADDR_WORD,W1
MOV
W1,TBLPAG
MOV
#LOW(WORD),W2
TBLWTL
W2,[ W0]
; The NVMADR captures last table access address
; Select data EEPROM for 1 word op
MOV
#0x4004,W0
MOV
W0,NVMCON
; Operate key to allow write operation
DISI
#5
MOV
MOV
MOV
MOV
BSET
NOP
NOP
; Write cycle will
; User can poll WR
#0x55,W0
W0,NVMKEY
#0xAA,W1
W1,NVMKEY
NVMCON,#WR
; Init pointer
; Get data
; Write data
; Block all interrupts with priority <7
; for next 5 instructions
; Write the 0x55 key
; Write the 0xAA key
; Initiate program sequence
complete in 2mS. CPU is not stalled for the Data Write Cycle
bit, use NVMIF or Timer IRQ to determine write complete
© 2008 Microchip Technology Inc.
DS70150D-page 57
dsPIC30F6010A/6015
7.3.2
WRITING A BLOCK OF DATA
EEPROM
To write a block of data EEPROM, write to all sixteen
latches first, then set the NVMCON register and
program the block.
EXAMPLE 7-5:
7.4
DATA EEPROM BLOCK WRITE
MOV
MOV
MOV
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
MOV
DISI
#LOW_ADDR_WORD,W0
#HIGH_ADDR_WORD,W1
W1,TBLPAG
#data1,W2
W2,[ W0]++
#data2,W2
W2,[ W0]++
#data3,W2
W2,[ W0]++
#data4,W2
W2,[ W0]++
#data5,W2
W2,[ W0]++
#data6,W2
W2,[ W0]++
#data7,W2
W2,[ W0]++
#data8,W2
W2,[ W0]++
#data9,W2
W2,[ W0]++
#data10,W2
W2,[ W0]++
#data11,W2
W2,[ W0]++
#data12,W2
W2,[ W0]++
#data13,W2
W2,[ W0]++
#data14,W2
W2,[ W0]++
#data15,W2
W2,[ W0]++
#data16,W2
W2,[ W0]++
#0x400A,W0
W0,NVMCON
#5
MOV
MOV
MOV
MOV
BSET
NOP
NOP
#0x55,W0
W0,NVMKEY
#0xAA,W1
W1,NVMKEY
NVMCON,#WR
; Init pointer
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
Get 1st data
write data
Get 2nd data
write data
Get 3rd data
write data
Get 4th data
write data
Get 5th data
write data
Get 6th data
write data
Get 7th data
write data
Get 8th data
write data
Get 9th data
write data
Get 10th data
write data
Get 11th data
write data
Get 12th data
write data
Get 13th data
write data
Get 14th data
write data
Get 15th data
write data
Get 16th data
write data. The NVMADR captures last table access address.
Select data EEPROM for multi word op
Operate Key to allow program operation
Block all interrupts with priority <7
for next 5 instructions
; Write the 0x55 key
; Write the 0xAA key
; Start write cycle
Write Verify
Depending on the application, good programming
practice may dictate that the value written to the
memory should be verified against the original value.
This should be used in applications where excessive
writes can stress bits near the specification limit.
7.5
Protection Against Spurious Write
There are conditions when the device may not want to
write to the data EEPROM memory. To protect against
spurious EEPROM writes, various mechanisms have
been built-in. On power-up, the WREN bit is cleared;
also, the Power-up Timer prevents EEPROM write.
The write initiate sequence and the WREN bit together,
help prevent an accidental write during brown-out,
power glitch or software malfunction.
DS70150D-page 58
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
8.0
Note:
I/O PORTS
Writes to the latch, write the latch (LATx). Reads from
the port (PORTx), read the port pins and writes to the
port pins, write the latch (LATx).
This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
dsPIC30F Family Reference Manual
(DS70046).
Any bit and its associated data and control registers
that are not valid for a particular device will be
disabled. That means the corresponding LATx and
TRISx registers and the port pin will read as zeros.
All of the device pins (except VDD, VSS, MCLR and
OSC1/CLKI) are shared between the peripherals and
the parallel I/O ports.
When a pin is shared with another peripheral or
function that is defined as an input only, it is
nevertheless regarded as a dedicated port because
there is no other competing source of outputs. An
example is the INT4 pin. Figure 8-1 shows the
structure for a dedicated port.
All I/O input ports feature Schmitt Trigger inputs for
improved noise immunity.
The format of the registers for PORTA are shown in
Table 8-1.
8.1
The TRISA (Data Direction Control) register controls
the direction of the RA<7:0> pins, as well as the INTx
pins and the VREF pins. The LATA register supplies
data to the outputs and is readable/writable. Reading
the PORTA register yields the state of the input pins,
while writing the PORTA register modifies the contents
of the LATA register.
Parallel I/O (PIO) Ports
When a peripheral is enabled and the peripheral is
actively driving an associated pin, the use of the pin as
a general purpose output pin is disabled. The I/O pin
may be read, but the output driver for the parallel port
bit will be disabled. If a peripheral is enabled, but the
peripheral is not actively driving a pin, that pin may be
driven by a port.
A parallel I/O (PIO) port that shares a pin with a
peripheral is, in general, subservient to the peripheral.
The peripheral’s output buffer data and control signals
are provided to a pair of multiplexers. The multiplexers
select whether the peripheral or the associated port
has ownership of the output data and control signals of
the I/O pad cell. Figure 8-2 shows how ports are shared
with other peripherals, and the associated I/O cell (pad)
to which they are connected. Table 8-1 shows the
formats of the registers for the shared ports, PORTB
through PORTG.
All port pins have three registers directly associated
with the operation of the port pin. The data direction
register (TRISx) determines whether the pin is an input
or an output. If the data direction bit is a ‘1’, then the pin
is an input. All port pins are defined as inputs after a
Reset. Reads from the latch (LATx), read the latch.
FIGURE 8-1:
BLOCK DIAGRAM OF A DEDICATED PORT STRUCTURE
Dedicated Port Module
Read TRIS
I/O Cell
TRIS Latch
Data Bus
D
WR TRIS
CK
Q
Data Latch
D
WR LAT+
WR Port
Q
I/O Pad
CK
Read LAT
Read Port
© 2008 Microchip Technology Inc.
DS70150D-page 59
dsPIC30F6010A/6015
FIGURE 8-2:
BLOCK DIAGRAM OF A SHARED PORT STRUCTURE
Output Multiplexers
Peripheral Module
Peripheral Input Data
Peripheral Module Enable
I/O Cell
Peripheral Output Enable
1
Peripheral Output Data
0
PIO Module
1
Output Enable
Output Data
0
Read TRIS
I/O Pad
Data Bus
D
WR TRIS
Q
CK
TRIS Latch
D
WR LAT +
WR Port
Q
CK
Data Latch
Read LAT
Input Data
Read Port
8.2
Configuring Analog Port Pins
The use of the ADPCFG and TRIS registers control the
operation of the A/D port pins. The port pins that are
desired as analog inputs must have their corresponding TRIS bit set (input). If the TRIS bit is cleared
(output), the digital output level (VOH or VOL) will be
converted.
When reading the PORT register, all pins configured as
analog input channels will read as cleared (a low level).
Pins configured as digital inputs will not convert an analog input. Analog levels on any pin that is defined as a
digital input (including the ANx pins) may cause the
input buffer to consume current that exceeds the
device specifications.
DS70150D-page 60
8.2.1
I/O PORT WRITE/READ TIMING
One instruction cycle is required between a port
direction change or port write operation and a read
operation of the same port. Typically this instruction
would be a NOP.
EXAMPLE 8-1:
MOV 0xFF00, W0
MOV W0, TRISBB
NOP
BTSS PORTB, #13
PORT WRITE/READ
EXAMPLE
;
;
;
;
;
Configure PORTB<15:8>
as inputs
and PORTB<7:0> as outputs
Delay 1 cycle
Next Instruction
© 2008 Microchip Technology Inc.
© 2008 Microchip Technology Inc.
TABLE 8-1:
SFR
Name
Addr.
dsPIC30F6010A PORT REGISTER MAP(1)
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
TRISA
02C0 TRISA15 TRISA14
—
—
—
—
—
—
—
—
—
—
—
—
1100 0110 0000 0000
PORTA
02C2
RA15
RA14
—
—
—
RA10
RA9
—
—
—
—
—
—
—
—
—
0000 0000 0000 0000
LATA
02C4
LATA15
LATA14
—
—
—
LATA10
LATA9
—
—
—
—
—
—
—
—
—
0000 0000 0000 0000
TRISB
02C6 TRISB15 TRISB14 TRISB13 TRISB12 TRISB11 TRISB10 TRISB9 TRISB8 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0
1111 1111 1111 1111
PORTB
02C8
RB15
RB14
RB13
RB12
RB11
RB10
RB9
RB8
RB7
RB6
RB5
RB4
RB3
RB2
RB1
RB0
0000 0000 0000 0000
LATB
02CB
LATB15
LATB14
LATB13
LATB12
LATB11
LATB10
LATB9
LATB8
LATB7
LATB6
LATB5
LATB4
LATB3
LATB2
LATB1
LATB0
0000 0000 0000 0000
TRISC
02CC TRISC15 TRISC14 TRISC13
—
—
—
—
—
—
—
—
—
TRISC3
—
TRISC1
—
1110 0000 0000 1010
PORTC
02CE
RC15
RC14
RC13
—
—
—
—
—
—
—
—
—
RC3
—
RC1
—
0000 0000 0000 0000
LATC
02D0
LATC15
LATC14
LATC13
—
—
—
—
—
—
—
—
—
LATC3
—
LATC1
—
TRISA10 TRISA9
0000 0000 0000 0000
TRISD
02D2 TRISD15 TRISD14 TRISD13 TRISD12 TRISD11 TRISD10 TRISD9 TRISD8 TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0
1111 1111 1111 1111
PORTD
02D4
RD15
RD14
RD13
RD12
RD11
RD10
RD9
RD8
RD7
RD6
RD5
RD4
RD3
RD2
RD1
RD0
0000 0000 0000 0000
LATD
02D6
LATD15
LATD14
LATD13
LATD12
LATD11
LATD10
LATD9
LATD8
LATD7
LATD6
LATD5
LATD4
LATD3
LATD2
LATD1
LATD0
0000 0000 0000 0000
TRISE
02D8
—
—
—
—
—
—
TRISE9 TRISE8 TRISE7 TRISE6 TRISE5 TRISE4 TRISE3 TRISE2 TRISE1 TRISE0
0000 0011 1111 1111
PORTE
02DA
—
—
—
—
—
—
RE9
RE8
RE7
RE6
RE5
RE4
RE3
RE2
RE1
RE0
LATE
02DC
—
—
—
—
—
—
LATE9
LATE8
LATE7
LATE6
LATE5
LATE4
LATE3
LATE2
LATE1
LATE0
0000 0000 0000 0000
TRISF
02EE
—
—
—
—
—
—
—
TRISF8 TRISF7 TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 TRISF0
0000 0001 1111 1111
PORTF
02E0
—
—
—
—
—
—
—
RF8
RF7
RF6
RF5
RF4
RF3
RF2
RF1
RF0
LATF
02E2
—
—
—
—
—
—
—
LATF8
LATF7
LATF6
LATF5
LATF4
LATF3
LATF2
LATF1
LATF0
TRISG
02E4
—
—
—
—
—
—
—
—
PORTG
02E6
—
—
—
—
—
—
RG9
RG8
RG7
RG6
—
—
RG3
RG2
RG1
RG0
0000 0000 0000 0000
LATG
02E8
—
—
—
—
—
—
LATG9
LATG8
LATG7
LATG6
—
—
LATG3
LATG2
LATG1
LATG0
0000 0000 0000 0000
u = uninitialized bit; — = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
TRISG3 TRISG2 TRISG1 TRISG0
0000 0000 0000 0000
0000 0000 0000 0000
0000 0011 1100 1111
DS70150D-page 61
dsPIC30F6010A/6015
Legend:
Note 1:
TRISG9 TRISG8 TRISG7 TRISG6
0000 0000 0000 0000
SFR
Name
dsPIC30F6015 PORT REGISTER MAP(1)
Addr.
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
TRISA
02C0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0000 0000 0000 0000
PORTA
02C2
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0000 0000 0000 0000
LATA
02C4
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0000 0000 0000 0000
TRISB
02C6 TRISB15 TRISB14 TRISB13 TRISB12 TRISB11 TRISB10 TRISB9 TRISB8 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0
1111 1111 1111 1111
PORTB
02C8
RB15
RB14
RB13
RB12
RB11
RB10
RB9
RB8
RB7
RB6
RB5
RB4
RB3
RB2
RB1
RB0
0000 0000 0000 0000
LATB
02CB
LATB15
LATB14
LATB13
LATB12
LATB11
LATB10
LATB9
LATB8
LATB7
LATB6
LATB5
LATB4
LATB3
LATB2
LATB1
LATB0
0000 0000 0000 0000
TRISC
02CC TRISC15 TRISC14 TRISC13
—
—
—
—
—
—
—
—
—
—
—
—
—
1110 0000 0000 0000
PORTC
02CE
RC15
RC14
RC13
—
—
—
—
—
—
—
—
—
—
—
—
—
0000 0000 0000 0000
LATC
02D0
LATC15
LATC14
LATC13
—
—
—
—
—
—
—
—
—
—
—
—
—
TRISD
02D2
—
—
—
—
PORTD
02D4
—
—
—
—
RD11
RD10
RD9
RD8
RD7
RD6
RD5
RD4
RD3
RD2
RD1
RD0
LATD
02D6
—
—
—
—
LATD11
LATD10
LATD9
LATD8
LATD7
LATD6
LATD5
LATD4
LATD3
LATD2
LATD1
LATD0
0000 0000 0000 0000
TRISE
02D8
—
—
—
—
—
—
—
—
TRISE7 TRISE6 TRISE5 TRISE4 TRISE3 TRISE2 TRISE1 TRISE0
0000 0000 1111 1111
PORTE
02DA
—
—
—
—
—
—
—
—
RE7
LATE
02DC
—
—
—
—
—
—
—
—
LATE7
TRISF
02EE
—
—
—
—
—
—
—
—
—
PORTF
02E0
—
—
—
—
—
—
—
—
—
RF6
RF5
RF4
LATF
02E2
—
—
—
—
—
—
—
—
—
LATF6
LATF5
LATF4
TRISG
02E4
—
—
—
—
—
—
—
—
PORTG
02E6
—
—
—
—
—
—
RG9
RG8
RG7
RG6
—
—
RG3
RG2
LATG
02E8
—
—
—
—
—
—
LATG9
LATG8
LATG7
LATG6
—
—
LATG3
LATG2
Legend:
Note 1:
TRISD11 TRISD10 TRISD9 TRISD8 TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0
0000 0000 0000 0000
RE6
RE5
RE4
RE3
RE2
RE1
RE0
0000 0000 0000 0000
LATE6
LATE5
LATE4
LATE3
LATE2
LATE1
LATE0
0000 0000 0000 0000
TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 TRISF0
TRISG9 TRISG8 TRISG7 TRISG6
u = uninitialized bit; — = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
0000 0000 0000 0000
0000 1111 1111 1111
0000 0000 0111 1111
RF3
RF2
RF1
RF0
0000 0000 0000 0000
LATF3
LATF2
LATF1
LATF0
0000 0000 0000 0000
—
—
0000 0011 1100 1100
—
—
0000 0000 0000 0000
—
—
0000 0000 0000 0000
TRISG3 TRISG2
dsPIC30F6010A/6015
DS70150D-page 62
TABLE 8-2:
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
8.3
Input Change Notification Module
The input change notification module provides the
dsPIC30F devices the ability to generate interrupt
requests to the processor in response to a
change-of-state on selected input pins. This module is
capable of detecting input change-of-states, even in
Sleep mode when the clocks are disabled. There are 22
external
signals
(CN0
through
CN21)
for
dsPIC30F6010A and 19 external signals (CN0 through
CN19) for dsPIC30F6015 that may be selected (enabled)
for generating an interrupt request on a change-of-state.
Please refer to the Pin Diagrams for CN pin locations.
TABLE 8-3:
INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 15-8)(1)
SFR
Name
Addr.
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Reset State
CNEN1
00C0
CN15IE
CN14IE
CN13IE
CN12IE
CN11IE
CN10IE
CN9IE
CN8IE
0000 0000 0000 0000
CNEN2
00C2
—
—
—
—
—
—
—
—
0000 0000 0000 0000
CNPU1
00C4
CN9PUE
CN8PUE
0000 0000 0000 0000
CNPU2
00C6
—
—
0000 0000 0000 0000
Legend:
Note 1:
— = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
TABLE 8-4:
CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE
—
—
—
—
—
—
INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 7-0) FOR dsPIC30F6010A(1)
SFR
Name
Addr.
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
CNEN1
00C0
CN7IE
CN6IE
CN5IE
CN4IE
CN3IE
CN2IE
CN1IE
CN0IE
0000 0000 0000 0000
CNEN2
00C2
—
—
CN21IE
CN20IE
CN19IE
CN18IE
CN17IE
CN16IE
0000 0000 0000 0000
CNPU1
00C4
CN7PUE
CN6PUE
CN5PUE
CN4PUE
CN3PUE
CN2PUE
CN1PUE
CN0PUE
0000 0000 0000 0000
CNPU2
00C6
—
—
CN21PUE CN20PUE CN19PUE CN18PUE CN17PUE
CN16PUE
0000 0000 0000 0000
Legend:
Note 1:
— = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
TABLE 8-5:
INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 7-0) FOR dsPIC30F6015(1)
SFR
Name
Addr.
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
CNEN1
00C0
CN7IE
CN6IE
CN5IE
CN4IE
CN3IE
CN2IE
CNEN2
00C2
—
—
—
—
—
CN18IE
CNPU1
00C4
CN7PUE
CN6PUE
CN5PUE
CN4PUE
CN3PUE
CN2PUE
CNPU2
00C6
—
—
—
—
—
Legend:
Note 1:
— = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
© 2008 Microchip Technology Inc.
Bit 2
Bit 1
Bit 0
Reset State
CN1IE
CN0IE
0000 0000 0000 0000
CN17IE
CN16IE
0000 0000 0000 0000
CN1PUE
CN0PUE
0000 0000 0000 0000
CN18PUE CN17PUE
CN16PUE
0000 0000 0000 0000
DS70150D-page 63
dsPIC30F6010A/6015
NOTES:
DS70150D-page 64
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
9.0
Note:
TIMER1 MODULE
This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
“dsPIC30F Family Reference Manual”
(DS70046).
This section describes the 16-bit General Purpose
(GP) Timer1 module and associated operational
modes.
Note:
Timer1 is a Type A timer. Please refer to the
specifications for a Type A timer in
Section 24.0 "Electrical Characteristics"
of this document.
The following sections provide a detailed description,
including setup and control registers along with
associated block diagrams for the operational modes of
the timers.
The Timer1 module is a 16-bit timer which can serve as
the time counter for the Real-Time Clock, or operate as
a free running interval timer/counter. The 16-bit timer
has the following modes:
• 16-bit Timer
• 16-bit Synchronous Counter
• 16-bit Asynchronous Counter
Further, the following operational characteristics are
supported:
• Timer gate operation
• Selectable prescaler settings
• Timer operation during CPU Idle and Sleep
modes
• Interrupt on 16-bit Period register match or falling
edge of external gate signal
© 2008 Microchip Technology Inc.
These operating modes are determined by setting the
appropriate bit(s) in the 16-bit SFR, T1CON. Figure 9-1
presents a block diagram of the 16-bit timer module.
16-bit Timer Mode: In the 16-bit Timer mode, the timer
increments on every instruction cycle up to a match
value, preloaded into the period register, PR1, then
resets to ‘0’ and continues to count.
When the CPU goes into the Idle mode, the timer will
stop incrementing, unless the TSIDL (T1CON<13>)
bit = 0. If TSIDL = 1, the timer module logic will resume
the incrementing sequence upon termination of the
CPU Idle mode.
16-bit Synchronous Counter Mode: In the 16-bit
Synchronous Counter mode, the timer increments on
the rising edge of the applied external clock signal,
which is synchronized with the internal phase clocks.
The timer counts up to a match value preloaded in PR1,
then resets to 0 and continues.
When the CPU goes into the Idle mode, the timer will
stop incrementing, unless the respective TSIDL bit = 0.
If TSIDL = 1, the timer module logic will resume the
incrementing sequence upon termination of the CPU
Idle mode.
16-bit Asynchronous Counter Mode: In the 16-bit
Asynchronous Counter mode, the timer increments on
every rising edge of the applied external clock signal.
The timer counts up to a match value preloaded in PR1,
then resets to ‘0’ and continues.
When the timer is configured for the Asynchronous mode
of operation and the CPU goes into the Idle mode, the
timer will stop incrementing if TSIDL = 1.
DS70150D-page 65
dsPIC30F6010A/6015
FIGURE 9-1:
16-BIT TIMER1 MODULE BLOCK DIAGRAM (TYPE A TIMER)
PR1
Equal
Comparator x 16
Reset
TSYNC
(3)
TMR1
1
Sync
0
0
1
Q
D
Q
CK
TGATE
TCS
TGATE
2
1X
LPOSCEN
SOSCI
Timer Gate Operation
The 16-bit timer can be placed in the Gated Time
Accumulation mode. This mode allows the internal TCY
to increment the respective timer when the gate input
signal (T1CK pin) is asserted high. Control bit TGATE
(T1CON<6>) must be set to enable this mode. The
timer must be enabled (TON = 1) and the timer clock
source set to internal (TCS = 0).
When the CPU goes into the Idle mode, the timer will
stop incrementing, unless TSIDL = 0. If TSIDL = 1, the
timer will resume the incrementing sequence upon
termination of the CPU Idle mode.
9.2
TCKPS<1:0>
TON
SOSCO/
T1CK
9.1
TGATE
T1IF
Event Flag
Timer Prescaler
The input clock (FOSC/4 or external clock) to the 16-bit
Timer has a prescale option of 1:1, 1:8, 1:64 and 1:256
selected by control bits, TCKPS<1:0> (T1CON<5:4>).
The prescaler counter is cleared when any of the
following occurs:
Gate
Sync
01
TCY
Prescaler
1, 8, 64, 256
00
9.3
Timer Operation During Sleep
Mode
During CPU Sleep mode, the timer will operate if:
• The timer module is enabled (TON = 1) and
• The timer clock source is selected as external
(TCS = 1) and
• The TSYNC bit (T1CON<2>) is asserted to a logic
‘0’, which defines the external clock source as
asynchronous
When all three conditions are true, the timer will
continue to count up to the period register and be reset
to 0x0000.
When a match between the timer and the period
register occurs, an interrupt can be generated, if the
respective timer interrupt enable bit is asserted.
• a write to the TMR1 register
• clearing of the TON bit (T1CON<15>)
• device Reset such as POR and BOR
However, if the timer is disabled (TON = 0), then the
timer prescaler cannot be reset since the prescaler
clock is halted.
TMR1 is not cleared when T1CON is written. It is
cleared by writing to the TMR1 register.
DS70150D-page 66
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
9.4
Timer Interrupt
9.5.1
The 16-bit timer has the ability to generate an interrupt
on period match. When the timer count matches the
period register, the T1IF bit is asserted and an interrupt
will be generated, if enabled. The T1IF bit must be
cleared in software. The Timer Interrupt Flag, T1IF, is
located in the IFS0 Control register in the interrupt
controller.
When the Gated Time Accumulation mode is enabled,
an interrupt will also be generated on the falling edge of
the gate signal (at the end of the accumulation cycle).
RTC OSCILLATOR OPERATION
When the TON = 1, TCS = 1 and TGATE = 0, the timer
increments on the rising edge of the 32 kHz LP
oscillator output signal, up to the value specified in the
period register, and is then reset to ‘0’.
The TSYNC bit must be asserted to a logic ‘0’
(Asynchronous mode) for correct operation.
Enabling LPOSCEN (OSCCON<1>) will disable the
normal Timer and Counter modes and enable a timer
carry-out wake-up event.
Enabling an interrupt is accomplished via the
respective Timer Interrupt Enable bit, T1IE. The Timer
Interrupt Enable bit is located in the IEC0 Control
register in the interrupt controller.
When the CPU enters Sleep mode, the RTC will
continue to operate, provided the 32 kHz external
crystal oscillator is active and the control bits have not
been changed. The TSIDL bit should be cleared to ‘0’
in order for RTC to continue operation in Idle mode.
9.5
9.5.2
Real-Time Clock
Timer1, when operating in Real-Time Clock (RTC)
mode, provides time-of-day and event time-stamping
capabilities. Key operational features of the RTC are:
•
•
•
•
Operation from 32 kHz LP oscillator
8-bit prescaler
Low power
Real-Time Clock interrupts
These operating modes are determined by setting the
appropriate bit(s) in the T1CON Control register.
FIGURE 9-2:
RTC INTERRUPTS
When an interrupt event occurs, the respective
interrupt flag, T1IF, is asserted and an interrupt will be
generated, if enabled. The T1IF bit must be cleared in
software. The respective Timer Interrupt Flag, T1IF, is
located in the IFS0 STATUS register in the interrupt
controller.
Enabling an interrupt is accomplished via the
respective Timer Interrupt Enable bit, T1IE. The Timer
Interrupt Enable bit is located in the IEC0 Control
register in the interrupt controller.
RECOMMENDED
COMPONENTS FOR
TIMER1 LP OSCILLATOR
RTC
C1
SOSCI
32.768 kHz
XTAL
dsPIC30FXXXX
SOSCO
C2
R
C1 = C2 = 18 pF; R = 100K
© 2008 Microchip Technology Inc.
DS70150D-page 67
SFR Name
Addr.
TIMER1 REGISTER MAP(1)
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
TMR1
0100
Timer1 Register
PR1
0102
Period Register 1
T1CON
0104
Legend:
Note 1:
TON
—
TSIDL
—
—
—
—
—
—
u = uninitialized bit; — = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
TGATE
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
uuuu uuuu uuuu uuuu
1111 1111 1111 1111
TCKPS1 TCKPS0
—
TSYNC
TCS
—
0000 0000 0000 0000
dsPIC30F6010A/6015
DS70150D-page 68
TABLE 9-1:
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
10.0
Note:
TIMER2/3 MODULE
This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and general device functionality, refer to the
“dsPIC30F Family Reference Manual”
(DS70046).
This section describes the 32-bit General Purpose
(GP) Timer module (Timer2/3) and associated operational modes. Figure 10-1 depicts the simplified block
diagram of the 32-bit Timer2/3 module. Figure 10-3
and Figure 10-5 show Timer2/3 configured as two
independent 16-bit timers; Timer2 and Timer3,
respectively.
Note:
Timer2 is a Type B timer and Timer3 is a
Type C timer. Please refer to the appropriate timer type in Section 24.0 "Electrical
Characteristics" of this document.
The Timer2/3 module is a 32-bit timer, which can be
configured as two 16-bit timers, with selectable operating modes. These timers are utilized by other
peripheral modules such as:
• Input Capture
• Output Compare/Simple PWM
The following sections provide a detailed description,
including setup and control registers, along with associated block diagrams for the operational modes of the
timers.
The 32-bit timer has the following modes:
• Two independent 16-bit timers (Timer2 and
Timer3) with all 16-bit operating modes (except
Asynchronous Counter mode)
• Single 32-bit Timer operation
• Single 32-bit Synchronous Counter
Further, the following operational characteristics are
supported:
•
•
•
•
•
ADC Event Trigger
Timer Gate Operation
Selectable Prescaler Settings
Timer Operation during Idle and Sleep modes
Interrupt on a 32-bit Period Register Match
These operating modes are determined by setting the
appropriate bit(s) in the 16-bit T2CON and T3CON
SFRs.
© 2008 Microchip Technology Inc.
For 32-bit timer/counter operation, Timer2 is the least
significant word and Timer3 is the most significant word
of the 32-bit timer.
Note:
For 32-bit timer operation, T3CON control
bits are ignored. Only T2CON control bits
are used for setup and control. Timer2
clock and gate inputs are utilized for the
32-bit timer module, but an interrupt is
generated with the Timer3 Interrupt Flag
(T3IF) and the interrupt is enabled with the
Timer3 Interrupt Enable bit (T3IE).
16-bit Mode: In the 16-bit mode, Timer2 and Timer3
can be configured as two independent 16-bit timers.
Each timer can be set up in either 16-bit Timer mode or
16-bit Synchronous Counter mode. See Section 9.0
“Timer1 Module”, Timer1 Module, for details on these
two operating modes.
The only functional difference between Timer2 and
Timer3 is that Timer2 provides synchronization of the
clock prescaler output. This is useful for high frequency
external clock inputs.
32-bit Timer Mode: In the 32-bit Timer mode, the timer
increments on every instruction cycle up to a match
value, preloaded into the combined 32-bit period
register, PR3/PR2, then resets to ‘0’ and continues to
count.
For synchronous 32-bit reads of the Timer2/Timer3
pair, reading the lsw (TMR2 register) will cause the
msw to be read and latched into a 16-bit holding
register, termed TMR3HLD.
For synchronous 32-bit writes, the holding register
(TMR3HLD) must first be written to. When followed by
a write to the TMR2 register, the contents of TMR3HLD
will be transferred and latched into the MSB of the
32-bit timer (TMR3).
32-bit Synchronous Counter Mode: In the 32-bit
Synchronous Counter mode, the timer increments on
the rising edge of the applied external clock signal,
which is synchronized with the internal phase clocks.
The timer counts up to a match value preloaded in the
combined 32-bit period register, PR3/PR2, then resets
to ‘0’ and continues.
When the timer is configured for the Synchronous
Counter mode of operation and the CPU goes into the
Idle mode, the timer will stop incrementing, unless the
TSIDL (T2CON<13>) bit = 0. If TSIDL = 1, the timer
module logic will resume the incrementing sequence
upon termination of the CPU Idle mode.
DS70150D-page 69
dsPIC30F6010A/6015
FIGURE 10-1:
32-BIT TIMER2/3 BLOCK DIAGRAM FOR dsPIC30F6010A
Data Bus<15:0>
TMR3HLD
16
Write TMR2
16
Read TMR2
16
Reset
TMR3
TMR2
MSB
LSB
Sync
ADC Event Trigger
Equal
Comparator x 32
PR3
T3IF
Event Flag
PR2
0
1
D
Q
CK
TGATE (T2CON<6>)
TCS
TGATE
TGATE
(T2CON<6>)
Q
T2CK
1x
Gate
Sync
TCY
Note:
01
TON
TCKPS<1:0>
2
Prescaler
1, 8, 64, 256
00
Timer Configuration bit T32, T2CON(<3>) must be set to ‘1’ for a 32-bit timer/counter operation. All control
bits are respective to the T2CON register.
DS70150D-page 70
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 10-2:
32-BIT TIMER2/3 BLOCK DIAGRAM FOR dsPIC30F6015
Data Bus<15:0>
TMR3HLD
16
Write TMR2
16
Read TMR2
16
Reset
TMR3
TMR2
MSB
LSB
Sync
ADC Event Trigger
Equal
Comparator x 32
PR3
T3IF
Event Flag
PR2
0
1
D
Q
CK
TGATE(T2CON<6>)
TCS
TGATE
TGATE
(T2CON<6>)
Q
1x
Gate
Sync
TCY
Note:
01
TON
TCKPS<1:0>
2
Prescaler
1, 8, 64, 256
00
Timer Configuration bit T32, T2CON(<3>) must be set to ‘1’ for a 32-bit timer/counter operation. All control
bits are respective to the T2CON register.
© 2008 Microchip Technology Inc.
DS70150D-page 71
dsPIC30F6010A/6015
FIGURE 10-3:
16-BIT TIMER2 BLOCK DIAGRAM (TYPE B TIMER) FOR dsPIC30F6010A
PR2
Equal
Reset
T2IF
Event Flag
Comparator x 16
TMR2
Sync
0
1
Q
D
Q
CK
TGATE
TCS
TGATE
TGATE
T2CK
1x
Gate
Sync
TCKPS<1:0>
2
Prescaler
1, 8, 64, 256
01
TCY
FIGURE 10-4:
TON
00
16-BIT TIMER2 BLOCK DIAGRAM (TYPE B TIMER) FOR dsPIC30F6015
PR2
Equal
Reset
T2IF
Event Flag
Comparator x 16
TMR2
Sync
0
1
Q
D
Q
CK
TCS
TGATE
TGATE
TGATE
1x
Gate
Sync
TCY
01
TON
TCKPS<1:0>
2
Prescaler
1, 8, 64, 256
00
Note: The dsPIC30F6015 does not have an external pin input to TIMER2. The following modes should not be used:
1. TCS = 1
2. TCS = 0 and TGATE = 1 (gated time accumulation)
DS70150D-page 72
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 10-5:
16-BIT TIMER3 BLOCK DIAGRAM (TYPE C TIMER)
PR3
ADC Event Trigger
Equal
Reset
T3IF
Event Flag
Comparator x 16
TMR3
0
1
Q
D
Q
CK
TCS
TGATE
TGATE
TGATE
Sync
1x
01
TCY
TON
TCKPS<1:0>
2
Prescaler
1, 8, 64, 256
00
Note: The dsPIC30F6010A/6015 devices do not have an external pin input to Timer3. These modes should not be used:
1. TCS = 1
2. TCS = 0 and TGATE = 1 (gated time accumulation)
© 2008 Microchip Technology Inc.
DS70150D-page 73
dsPIC30F6010A/6015
10.1
Timer Gate Operation
The 32-bit timer can be placed in the Gated Time
Accumulation mode. This mode allows the internal TCY
to increment the respective timer when the gate input
signal (T2CK pin) is asserted high. Control bit TGATE
(T2CON<6>) must be set to enable this mode. When in
this mode, Timer2 is the originating clock source. The
TGATE setting is ignored for Timer3. The timer must be
enabled (TON = 1) and the timer clock source set to
internal (TCS = 0).
The falling edge of the external signal terminates the
count operation, but does not reset the timer. The user
must reset the timer in order to start counting from zero.
10.2
ADC Event Trigger
When a match occurs between the 32-bit timer
(TMR3/TMR2) and the 32-bit combined period register
(PR3/PR2), a special ADC trigger event signal is
generated by Timer3.
10.3
10.4
Timer Operation During Sleep
Mode
During CPU Sleep mode, the timer will not operate,
because the internal clocks are disabled.
10.5
Timer Interrupt
The 32-bit timer module can generate an interrupt on
period match, or on the falling edge of the external gate
signal. When the 32-bit timer count matches the
respective 32-bit period register, or the falling edge of
the external “gate” signal is detected, the T3IF bit
(IFS0<7>) is asserted and an interrupt will be
generated if enabled. In this mode, the T3IF interrupt
flag is used as the source of the interrupt. The T3IF bit
must be cleared in software.
Enabling an interrupt is accomplished via the
respective Timer Interrupt Enable bit, T3IE (IEC0<7>).
Timer Prescaler
The input clock (FOSC/4 or external clock) to the timer
has a prescale option of 1:1, 1:8, 1:64, and 1:256
selected by control bits TCKPS<1:0> (T2CON<5:4>
and T3CON<5:4>). For the 32-bit timer operation, the
originating clock source is Timer2. The prescaler
operation for Timer3 is not applicable in this mode. The
prescaler counter is cleared when any of the following
occurs:
• a write to the TMR2/TMR3 register
• clearing either of the TON (T2CON<15> or
T3CON<15>) bits to ‘0’
• device Reset such as POR and BOR
However, if the timer is disabled (TON = 0), then the
Timer2 prescaler cannot be reset, since the prescaler
clock is halted.
TMR2/TMR3 is not cleared when T2CON/T3CON is
written.
DS70150D-page 74
© 2008 Microchip Technology Inc.
© 2008 Microchip Technology Inc.
TABLE 10-1:
SFR Name Addr.
TIMER2/3 REGISTER MAP(1)
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
TMR2
0106
Timer2 Register
uuuu uuuu uuuu uuuu
TMR3HLD
0108
Timer3 Holding Register (For 32-bit timer operations only)
uuuu uuuu uuuu uuuu
TMR3
010A
Timer3 Register
uuuu uuuu uuuu uuuu
1111 1111 1111 1111
PR2
010C
Period Register 2
PR3
010E
Period Register 3
T2CON
0110
TGATE
TCKPS1 TCKPS0
T32
—
TCS
—
0000 0000 0000 0000
T3CON
Legend:
Note 1:
—
TSIDL
—
—
—
—
—
—
TGATE
0112
TON
u = uninitialized bit; — = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
TCKPS1 TCKPS0
—
—
TCS
—
0000 0000 0000 0000
TON
—
TSIDL
—
—
—
—
—
—
1111 1111 1111 1111
dsPIC30F6010A/6015
DS70150D-page 75
dsPIC30F6010A/6015
NOTES:
DS70150D-page 76
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
11.0
TIMER4/5 MODULE
Note:
Figure 11-2 and Figure 11-3 show Timer4/5 configured
as two independent 16-bit timers, Timer4 and Timer5,
respectively.
This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
“dsPIC30F Family Reference Manual”
(DS70046).
Note:
The Timer4/5 module is similar in operation to the
Timer2/3 module. However, there are some
differences, which are listed below:
This section describes the second 32-bit General
Purpose (GP) Timer module (Timer4/5) and associated
operational modes. Figure 11-1 depicts the simplified
block diagram of the 32-bit Timer4/5 Module.
FIGURE 11-1:
Timer4 is a Type B timer and Timer5 is a
Type C timer. Please refer to the
appropriate timer type in Section 24.0
"Electrical Characteristics" of this
document.
• The Timer4/5 module does not support the ADC
Event Trigger feature
32-BIT TIMER4/5 BLOCK DIAGRAM
Data Bus<15:0>
TMR5HLD
16
16
Write TMR4
Read TMR4
16
Reset
Equal
TMR5
TMR4
MSB
LSB
Comparator x 32
PR5
PR4
0
TGATE
(T4CON<6>)
Q
D
Q
CK
TGATE(T4CON<6>)
TCS
1
T4CK
1x
Gate
Sync
TCY
Note:
TGATE
T5IF
Event Flag
Sync
0 1
TCKPS<1:0>
TON
2
Prescaler
1, 8, 64, 256
00
Timer Configuration bit T45, T4CON(<3>) must be set to ‘1’ for a 32-bit timer/counter operation. All
control bits are respective to the T4CON register.
© 2008 Microchip Technology Inc.
DS70150D-page 77
dsPIC30F6010A/6015
FIGURE 11-2:
16-BIT TIMER4 BLOCK DIAGRAM (TYPE B TIMER)
PR4
Equal
Comparator x 16
TMR4
Reset
Sync
0
1
Q
D
Q
CK
TGATE
TCS
TGATE
TGATE
T4IF
Event Flag
TCKPS<1:0>
2
TON
T4CK
1x
Gate
Sync
TCY
FIGURE 11-3:
Prescaler
1, 8, 64, 256
01
00
16-BIT TIMER5 BLOCK DIAGRAM (TYPE C TIMER)
PR5
Equal
ADC Event Trigger
Reset
TMR5
0
1
Q
D
Q
CK
TGATE
TCS
TGATE
Sync
TGATE
T5IF
Event Flag
Comparator x 16
2
1x
01
TCY
TCKPS<1:0>
TON
Prescaler
1, 8, 64, 256
00
Note: The dsPIC30F6010A/6015 devices do not have an external pin input to Timer5. These modes should not be used:
1. TCS = 1
2. TCS = 0 and TGATE = 1 (gated time accumulation)
DS70150D-page 78
© 2008 Microchip Technology Inc.
© 2008 Microchip Technology Inc.
TABLE 11-1:
SFR Name
Addr.
TIMER4/5 REGISTER MAP(1)
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
TMR4
0114
Timer4 Register
uuuu uuuu uuuu uuuu
TMR5HLD
0116
Timer5 Holding Register (For 32-bit operations only)
uuuu uuuu uuuu uuuu
TMR5
0118
Timer5 Register
uuuu uuuu uuuu uuuu
PR4
011A
Period Register 4
1111 1111 1111 1111
PR5
011C
Period Register 5
T4CON
011E
T5CON
Legend:
Note 1:
1111 1111 1111 1111
TGATE
TCKPS1
TCKPS0
T45
—
TCS
—
0000 0000 0000 0000
—
TSIDL
—
—
—
—
—
—
TGATE
0120
TON
u = uninitialized bit; — = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
TCKPS1
TCKPS0
—
—
TCS
—
0000 0000 0000 0000
TON
—
TSIDL
—
—
—
—
—
—
dsPIC30F6010A/6015
DS70150D-page 79
dsPIC30F6010A/6015
NOTES:
DS70150D-page 80
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
12.0
INPUT CAPTURE MODULE
Note:
12.1
Simple Capture Event Mode
The simple capture events in the dsPIC30F product
family are:
This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
“dsPIC30F Family Reference Manual”
(DS70046).
•
•
•
•
•
Capture every falling edge
Capture every rising edge
Capture every 4th rising edge
Capture every 16th rising edge
Capture every rising and falling edge
These simple Input Capture modes are configured by
setting the appropriate bits ICM<2:0> (ICxCON<2:0>).
This section describes the input capture module and
associated operational modes. The features provided by
this module are useful in applications requiring
frequency (period) and pulse measurement. Figure 12-1
depicts a block diagram of the input capture module.
Input capture is useful for such modes as:
12.1.1
CAPTURE PRESCALER
There are four input capture prescaler settings,
specified by bits ICM<2:0> (ICxCON<2:0>). Whenever
the capture channel is turned off, the prescaler counter
will be cleared. In addition, any Reset will clear the
prescaler counter.
• Frequency/Period/Pulse Measurements
• Additional sources of External Interrupts
The key operational features of the input capture
module are:
• Simple Capture Event mode
• Timer2 and Timer3 mode selection
• Interrupt on input capture event
These operating modes are determined by setting the
appropriate bits in the ICxCON register (where
x = 1,2,...,N). The dsPIC30F6010A and dsPIC30F6015
devices have eight capture channels.
FIGURE 12-1:
INPUT CAPTURE MODE BLOCK DIAGRAM
From GP Timer Module
T3_CNT
T2_CNT
16
ICx
Pin
Prescaler
1, 4, 16
3
1
Edge
Detection
Logic
Clock
Synchronizer
16
0
ICTMR
FIFO
R/W
Logic
ICM<2:0>
Mode Select
ICxBUF
ICBNE, ICOV
ICI<1:0>
ICxCON
Data Bus
Note:
Interrupt
Logic
Set Flag
ICxIF
Where ‘x’ is shown, reference is made to the registers or bits associated to the respective input
capture channels 1 through N.
© 2008 Microchip Technology Inc.
DS70150D-page 81
dsPIC30F6010A/6015
12.1.2
CAPTURE BUFFER OPERATION
Each capture channel has an associated FIFO buffer,
which is four 16-bit words deep. There are two status
flags, which provide status on the FIFO buffer:
• ICBNE – Input Capture Buffer Not Empty
• ICOV – Input Capture Overflow
The ICBFNE will be set on the first input capture event
and remain set until all capture events have been read
from the FIFO. As each word is read from the FIFO, the
remaining words are advanced by one position within
the buffer.
In the event that the FIFO is full with four capture
events and a fifth capture event occurs prior to a read
of the FIFO, an overflow condition will occur and the
ICOV bit will be set to a logic ‘1’. The fifth capture event
is lost and is not stored in the FIFO. No additional
events will be captured till all four events have been
read from the buffer.
If a FIFO read is performed after the last read and no
new capture event has been received, the read will
yield indeterminate results.
12.1.3
TIMER2 AND TIMER3 SELECTION
MODE
Each capture channel can select between one of two
timers for the time base, Timer2 or Timer3.
Selection of the timer resource is accomplished
through SFR bit ICTMR (ICxCON<7>). Timer3 is the
default timer resource available for the input capture
module.
12.1.4
HALL SENSOR MODE
When the input capture module is set for capture on
every edge, rising and falling, ICM<2:0> = 001, the
following operations are performed by the input
capture logic:
• The input capture interrupt flag is set on every
edge, rising and falling.
• The interrupt on Capture mode setting bits,
ICI<1:0>, is ignored, since every capture
generates an interrupt.
• A capture overflow condition is not generated in
this mode.
12.2
Input Capture Operation During
Sleep and Idle Modes
An input capture event will generate a device wake-up
or interrupt, if enabled, if the device is in CPU Idle or
Sleep mode.
Independent of the timer being enabled, the input
capture module will wake-up from the CPU Sleep or Idle
mode when a capture event occurs, if ICM<2:0> = 111
and the interrupt enable bit is asserted. The same wakeup can generate an interrupt, if the conditions for processing the interrupt have been satisfied. The wake-up
feature is useful as a method of adding extra external pin
interrupts.
12.2.1
INPUT CAPTURE IN CPU SLEEP
MODE
CPU Sleep mode allows input capture module
operation with reduced functionality. In the CPU Sleep
mode, the ICI<1:0> bits are not applicable, and the
input capture module can only function as an external
interrupt source.
The capture module must be configured for interrupt
only on the rising edge (ICM<2:0> = 111), in order for
the input capture module to be used while the device
is in Sleep mode. The prescale settings of 4:1 or 16:1
are not applicable in this mode.
12.2.2
INPUT CAPTURE IN CPU IDLE
MODE
CPU Idle mode allows input capture module operation
with full functionality. In the CPU Idle mode, the Interrupt
mode selected by the ICI<1:0> bits is applicable, as well
as the 4:1 and 16:1 capture prescale settings, which are
defined by control bits ICM<2:0>. This mode requires
the selected timer to be enabled. Moreover, the ICSIDL
bit must be asserted to a logic ‘0’.
If the input capture module is defined as
ICM<2:0> = 111 in CPU Idle mode, the input capture
pin will serve only as an external interrupt pin.
12.3
Input Capture Interrupts
The input capture channels have the ability to generate
an interrupt, based upon the selected number of
capture events. The selection number is set by control
bits ICI<1:0> (ICxCON<6:5>).
Each channel provides an interrupt flag (ICxIF) bit. The
respective Capture Channel Interrupt Flag is located in
the corresponding IFSx STATUS register.
Enabling an interrupt is accomplished via the
respective Capture Channel Interrupt Enable (ICxIE)
bit. The Capture Interrupt Enable bit is located in the
corresponding IEC Control register.
DS70150D-page 82
© 2008 Microchip Technology Inc.
© 2008 Microchip Technology Inc.
TABLE 12-1:
SFR Name Addr.
IC1BUF
0140
IC1CON
0142
IC2BUF
0144
IC2CON
0146
IC3BUF
0148
IC3CON
014A
IC4BUF
014C
IC4CON
014E
IC5BUF
0150
IC5CON
0152
IC6BUF
0154
IC6CON
0156
IC7BUF
0158
IC7CON
015A
IC8BUF
015C
IC8CON
015E
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
—
—
ICSIDL
—
—
—
—
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
ICOV
ICBNE
Bit 2
Bit 1
Input 1 Capture Register
—
ICTMR
—
ICSIDL
—
—
—
—
—
—
ICSIDL
—
—
—
—
—
ICTMR
ICM<2:0>
ICTMR
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
—
ICSIDL
—
—
—
—
—
—
ICSIDL
—
—
—
—
—
ICTMR
ICTMR
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
—
ICSIDL
—
—
—
—
—
ICTMR
—
ICSIDL
—
—
—
—
—
ICTMR
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
—
—
ICSIDL
—
—
—
—
—
ICTMR
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
Input 8 Capture Register
u = uninitialized bit; — = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
Input 7 Capture Register
—
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
Input 6 Capture Register
—
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
Input 5 Capture Register
—
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
Input 4 Capture Register
—
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
Input 3 Capture Register
—
Reset State
uuuu uuuu uuuu uuuu
ICI<1:0>
Input 2 Capture Register
—
Bit 0
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
0000 0000 0000 0000
DS70150D-page 83
dsPIC30F6010A/6015
Legend:
Note 1:
INPUT CAPTURE REGISTER MAP(1)
dsPIC30F6010A/6015
NOTES:
DS70150D-page 84
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
13.0
OUTPUT COMPARE MODULE
Note:
The key operational features of the output compare
module include:
This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
“dsPIC30F Family Reference Manual”
(DS70046).
•
•
•
•
•
•
This section describes the output compare module and
associated operational modes. The features provided
by this module are useful in applications requiring
operational modes such as:
• Generation of Variable Width Output Pulses
• Power Factor Correction
Figure 13-1 depicts a block diagram of the output
compare module.
FIGURE 13-1:
Timer2 and Timer3 Selection mode
Simple Output Compare Match mode
Dual Output Compare Match mode
Simple PWM mode
Output Compare during Sleep and Idle modes
Interrupt on Output Compare/PWM Event
These operating modes are determined by setting the
appropriate bits in the 16-bit OCxCON SFR (where
x = 1,2,3,...,N).
The
dsPIC30F6010A
and
dsPIC30F6015 devices have eight compare channels.
OCxRS and OCxR in Figure 13-1 represent the Dual
Compare registers. In the Dual Compare mode, the
OCxR register is used for the first compare and OCxRS
is used for the second compare.
OUTPUT COMPARE MODE BLOCK DIAGRAM
Set Flag bit
OCxIF
OCxRS
Output
Logic
OCxR
3
OCM<2:0>
Mode Select
Comparator
S Q
R
OCx
Output Enable
OCFA
(for x = 1, 2, 3 or 4)
0
1
OCTSEL
0
1
or OCFB
(for x = 5, 6, 7 or 8)
From GP Timer Module
TMR2<15:0
Note:
TMR3<15:0> T2P2_MATCH
T3P3_MATCH
Where ‘x’ is shown, reference is made to the registers associated with the respective output compare
channels 1 through N.
© 2008 Microchip Technology Inc.
DS70150D-page 85
dsPIC30F6010A/6015
13.1
Timer2 and Timer3 Selection Mode
Each output compare channel can select between one
of two 16-bit timers; Timer2 or Timer3.
The selection of the timers is controlled by the OCTSEL
bit (OCxCON<3>). Timer2 is the default timer resource
for the Output Compare module.
13.2
Simple Output Compare Match
Mode
When control bits OCM<2:0> (OCxCON<2:0>) = 001,
010 or 011, the selected output compare channel is
configured for one of three simple output compare
match modes:
• Compare forces I/O pin low
• Compare forces I/O pin high
• Compare toggles I/O pin
The OCxR register is used in these modes. The OCxR
register is loaded with a value and is compared to the
selected incrementing timer count. When a compare
occurs, one of these compare match modes occurs. If
the counter resets to zero before reaching the value in
OCxR, the state of the OCx pin remains unchanged.
13.3
Dual Output Compare Match Mode
When control bits OCM<2:0> (OCxCON<2:0>) = 100
or 101, the selected output compare channel is
configured for one of two Dual Output Compare modes,
which are:
• Single Output Pulse mode
• Continuous Output Pulse mode
13.3.1
SINGLE PULSE MODE
For the user to configure the module for the generation
of a single output pulse, the following steps are
required (assuming timer is off):
• Determine instruction cycle time TCY.
• Calculate desired pulse-width value based on
TCY.
• Calculate time to start pulse from timer start value
of 0x0000.
• Write pulse-width start and stop times into OCxR
and OCxRS Compare registers (x denotes
channel 1, 2, ...,N).
• Set Timer Period register to value equal to, or
greater than, value in OCxRS Compare register.
• Set OCM<2:0> = 100.
• Enable timer, TON (TxCON<15>) = 1.
To initiate another single pulse, issue another write to
set OCM<2:0> = 100.
DS70150D-page 86
13.3.2
CONTINUOUS PULSE MODE
For the user to configure the module for the generation
of a continuous stream of output pulses, the following
steps are required:
• Determine instruction cycle time TCY.
• Calculate desired pulse value based on TCY.
• Calculate timer to start pulse width from timer start
value of 0x0000.
• Write pulse-width start and stop times into OCxR
and OCxRS (x denotes channel 1, 2, ...,N)
Compare registers, respectively.
• Set Timer Period register to value equal to, or
greater than, value in OCxRS Compare register.
• Set OCM<2:0> = 101.
• Enable timer, TON (TxCON<15>) = 1.
13.4
Simple PWM Mode
When control bits OCM<2:0> (OCxCON<2:0>) = 110
or 111, the selected output compare channel is
configured for the PWM mode of operation. When
configured for the PWM mode of operation, OCxR is
the main latch (read-only) and OCxRS is the secondary
latch. This enables glitchless PWM transitions.
The user must perform the following steps in order to
configure the output compare module for PWM
operation:
1.
2.
3.
4.
Set the PWM period by writing to the appropriate
period register.
Set the PWM duty cycle by writing to the OCxRS
register.
Configure the output compare module for PWM
operation.
Set the TMRx prescale value and enable the
Timer, TON (TxCON<15>) = 1.
13.4.1
INPUT PIN FAULT PROTECTION
FOR PWM
When control bits OCM<2:0> (OCxCON<2:0>) = 111,
the selected output compare channel is again
configured for the PWM mode of operation, with the
additional feature of input Fault protection. While in this
mode, if a logic ‘0’ is detected on the OCFA/B pin, the
respective PWM output pin is placed in the
high-impedance input state. The OCFLT bit
(OCxCON<4>) indicates whether a Fault condition has
occurred. This state will be maintained until both of the
following events have occurred:
• The external Fault condition has been removed.
• The PWM mode has been re-enabled by writing
to the appropriate control bits.
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
13.4.2
PWM PERIOD
The PWM period is specified by writing to the PRx
register. The PWM period can be calculated using
Equation 13-1.
EQUATION 13-1:
PWM PERIOD
PWM Period = [(PRx) + 1] • 4 • TOSC •
(TMRx Prescale Value)
PWM frequency is defined as 1/[PWM period].
When the selected TMRx is equal to its respective
period register, PRx, the following four events occur on
the next increment cycle:
• TMRx is cleared.
• The OCx pin is set.
- Exception 1: If PWM duty cycle is 0x0000,
the OCx pin will remain low.
- Exception 2: If duty cycle is greater than PRx,
the pin will remain high.
• The PWM duty cycle is latched from OCxRS into
OCxR.
• The corresponding timer interrupt flag is set.
See Figure 13-2 for key PWM period comparisons.
Timer3 is referred to in the figure for clarity.
FIGURE 13-2:
PWM OUTPUT TIMING
Period
Duty Cycle
TMR3 = PR3
T3IF = 1
(Interrupt Flag)
OCxR = OCxRS
13.5
TMR3 = PR3
T3IF = 1
(Interrupt Flag)
OCxR = OCxRS
TMR3 = Duty Cycle (OCxR)
TMR3 = Duty Cycle (OCxR)
Output Compare Operation During
CPU Sleep Mode
When the CPU enters the Sleep mode, all internal
clocks are stopped. Therefore, when the CPU enters
the Sleep state, the output compare channel will drive
the pin to the active state that was observed prior to
entering the CPU Sleep state.
For example, if the pin was high when the CPU
entered the Sleep state, the pin will remain high.
Likewise, if the pin was low when the CPU entered the
Sleep state, the pin will remain low. In either case, the
output compare module will resume operation when
the device wakes up.
13.6
Output Compare Operation During
CPU Idle Mode
When the CPU enters the Idle mode, the output
compare module can operate with full functionality.
The output compare channel will operate during the
CPU Idle mode if the OCSIDL bit (OCxCON<13>) is at
logic 0 and the selected time base (Timer2 or Timer3)
is enabled and the TSIDL bit of the selected timer is
set to logic 0.
© 2008 Microchip Technology Inc.
13.7
Output Compare Interrupts
The output compare channels have the ability to
generate an interrupt on a compare match, for
whichever match mode has been selected.
For all modes except the PWM mode, when a compare
event occurs, the respective interrupt flag (OCxIF) is
asserted and an interrupt will be generated, if enabled.
The OCxIF bit is located in the corresponding IFS
STATUS register and must be cleared in software. The
interrupt is enabled via the respective Compare
Interrupt Enable (OCxIE) bit, located in the
corresponding IEC Control register.
For the PWM mode, when an event occurs, the
respective Timer Interrupt Flag (T2IF or T3IF) is
asserted and an interrupt will be generated, if enabled.
The IF bit is located in the IFS0 STATUS register, and
must be cleared in software. The interrupt is enabled
via the respective Timer Interrupt Enable bit (T2IE or
T3IE), located in the IEC0 Control register. The output
compare interrupt flag is never set during the PWM
mode of operation.
DS70150D-page 87
OUTPUT COMPARE REGISTER MAP(1)
SFR Name
Addr.
Bit 15
OC1RS
0180
Output Compare 1 Secondary Register
OC1R
0182
Output Compare 1 Main Register
OC1CON
0184
OC2RS
0186
—
Bit 14
—
Bit 13
OCSIDL
Bit 12
—
Bit 11
—
Bit 10
—
Bit 9
—
Bit 8
—
Bit 7
—
Bit 6
Bit 5
—
Bit 4
Bit 3
Bit 2
Bit 1
0188
OC2CON
018A
0000 0000 0000 0000
—
OCFLT
OCTSEL
OCM<2:0>
OC3RS
018C
Output Compare 3 Secondary Register
OC3R
018E
Output Compare 3 Main Register
OC3CON
0190
OC4RS
0192
Output Compare 4 Secondary Register
OC4R
0194
Output Compare 4 Main Register
OC4CON
0196
OC5RS
0198
Output Compare 5 Secondary Register
OC5R
019A
Output Compare 5 Main Register
OC5CON
019C
OC6RS
019E
Output Compare 6 Secondary Register
OC6R
01A0
Output Compare 6 Main Register
OC6CON
01A2
OC7RS
01A4
Output Compare 7 Secondary Register
OC7R
01A6
Output Compare 7 Main Register
OC7CON
01A8
OC8RS
01AA
Output Compare 8 Secondary Register
OC8R
01AC
Output Compare 8 Main Register
OC8CON
Legend:
Note 1:
01AE
—
—
OCSIDL
—
—
—
—
—
—
— = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
—
—
—
—
—
—
—
—
—
—
—
OCSIDL
OCSIDL
OCSIDL
OCSIDL
OCSIDL
OCSIDL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
Output Compare 2 Main Register
—
Reset State
0000 0000 0000 0000
Output Compare 2 Secondary Register
OC2R
Bit 0
—
OCFLT
OCTSE
OCM<2:0>
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
—
OCFLT
OCTSEL
OCM<2:0>
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
—
OCFLT
OCTSEL
OCM<2:0>
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
—
OCFLT
OCTSEL
OCM<2:0>
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
—
OCFLT
OCTSEL
OCM<2:0>
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
—
OCFLT
OCTSEL
OCM<2:0>
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
—
OCFLT
OCTSEL
OCM<2:0>
0000 0000 0000 0000
dsPIC30F6010A/6015
DS70150D-page 88
TABLE 13-1:
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
14.0
QUADRATURE ENCODER
INTERFACE (QEI) MODULE
Note:
The operational features of the QEI include:
• Three input channels for two phase signals and
index pulse
• 16-bit up/down position counter
• Count direction status
• Position Measurement (x2 and x4) mode
• Programmable digital noise filters on inputs
• Alternate 16-bit Timer/Counter mode
• Quadrature Encoder Interface interrupts
This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
“dsPIC30F Family Reference Manual”
(DS70046).
These operating modes are determined by setting the
appropriate bits, QEIM<2:0> (QEICON<10:8>).
Figure 14-1 depicts the Quadrature Encoder Interface
block diagram.
This section describes the Quadrature Encoder Interface
(QEI) module and associated operational modes. The
QEI module provides the interface to incremental
encoders for obtaining mechanical position data.
FIGURE 14-1:
QUADRATURE ENCODER INTERFACE BLOCK DIAGRAM
TQCKPS<1:0>
Sleep Input
TQCS
TCY
Synchronize
0
Det
1
2
Prescaler
1, 8, 64, 256
1
QEIM<2:0>
0
TQGATE
QEA
Programmable
Digital Filter
UPDN_SRC
0
QEICON<11>
2
Quadrature
Encoder
Interface Logic
QEB
Programmable
Digital Filter
INDX
Programmable
Digital Filter
Q
CK
Q
QEIIF
Event
Flag
16-bit Up/Down Counter
(POSCNT)
Reset
Comparator/
Zero Detect
3
QEIM<2:0>
Mode Select
1
D
Equal
Max Count Register
(MAXCNT)
3
PCDOUT
Existing Pin Logic
0
UPDN
1
© 2008 Microchip Technology Inc.
Up/Down
DS70150D-page 89
dsPIC30F6010A/6015
14.1
Quadrature Encoder Interface
Logic
A typical incremental (a.k.a. optical) encoder has three
outputs: Phase A, Phase B, and an index pulse. These
signals are useful and often required in position and
speed control of ACIM and SR motors.
The two channels, Phase A (QEA) and Phase B (QEB),
have a unique relationship. If Phase A leads Phase B,
then the direction (of the motor) is deemed positive or
forward. If Phase A lags Phase B, then the direction
(of the motor) is deemed negative or reverse.
A third channel, termed index pulse, occurs once per
revolution and is used as a reference to establish an
absolute position. The index pulse coincides with
Phase A and Phase B, both low.
14.2
16-bit Up/Down Position Counter
Mode
The 16-bit up/down counter counts up or down on
every count pulse, which is generated by the difference
of the Phase A and Phase B input signals. The counter
acts as an integrator, whose count value is proportional
to position. The direction of the count is determined by
the UPDN signal, which is generated by the
Quadrature Encoder Interface logic.
14.2.1
POSITION COUNTER ERROR
CHECKING
Position count error checking in the QEI is provided for
and indicated by the CNTERR bit (QEICON<15>). The
error checking only applies when the position counter
is configured for Reset on the Index Pulse modes
(QEIM<2:0> = ‘110’ or ‘100’). In these modes, the
contents of the POSCNT register are compared with
the values (0xFFFF or MAXCNT + 1, depending on
direction). If these values are detected, an error condition is generated by setting the CNTERR bit and a QEI
count error interrupt is generated. The QEI count error
interrupt can be disabled by setting the CEID bit
(DFLTCON<8>). The position counter continues to
count encoder edges after an error has been detected.
The POSCNT register continues to count up/down until
a natural rollover/underflow. No interrupt is generated
for the natural rollover/underflow event. The CNTERR
bit is a read/write bit and reset in software by the user.
14.2.2
POSITION COUNTER RESET
The Position Counter Reset Enable bit, POSRES
(QEI<2>), controls whether the position counter is reset
when the index pulse is detected. This bit is only
applicable when QEIM<2:0> = 100 or 110.
DS70150D-page 90
If the POSRES bit is set to ‘1’, then the position counter
is reset when the index pulse is detected. If the
POSRES bit is set to ‘0’, then the position counter is not
reset when the index pulse is detected. The position
counter will continue counting up or down, and will be
reset on the rollover or underflow condition.
The interrupt is still generated on the detection of the
index pulse and not on the position counter overflow/underflow.
14.2.3
COUNT DIRECTION STATUS
As mentioned in the previous section, the QEI logic
generates an UPDN signal, based upon the
relationship between Phase A and Phase B. In addition
to the output pin, the state of this internal UPDN signal
is supplied to a SFR bit, UPDN (QEICON<11>) as a
read-only bit. To place the state of this signal on an I/O
pin, the SFR bit, PCDOUT (QEICON<6>), must be 1.
14.3
Position Measurement Mode
There are two measurement modes which are
supported and are termed x2 and x4. These modes are
selected by the QEIM<2:0> mode select bits located in
SFR QEICON<10:8>.
When control bits QEIM<2:0> = 100 or 101, the x2
Measurement mode is selected and the QEI logic only
looks at the Phase A input for the position counter
increment rate. Every rising and falling edge of the
Phase A signal causes the position counter to be incremented or decremented. The Phase B signal is still
utilized for the determination of the counter direction,
just as in the x4 mode.
Within the x2 Measurement mode, there are two
variations of how the position counter is reset:
1.
2.
Position counter reset by detection of index
pulse, QEIM<2:0> = 100.
Position counter reset by match with MAXCNT,
QEIM<2:0> = 101.
When control bits QEIM<2:0> = 110 or 111, the x4
Measurement mode is selected and the QEI logic looks
at both edges of the Phase A and Phase B input signals. Every edge of both signals causes the position
counter to increment or decrement.
Within the x4 Measurement mode, there are two
variations of how the position counter is reset:
1.
2.
Position counter reset by detection of index
pulse, QEIM<2:0> = 110.
Position counter reset by match with MAXCNT,
QEIM<2:0> = 111.
The x4 Measurement mode provides for finer
resolution data (more position counts) for determining
motor position.
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
14.4
Programmable Digital Noise
Filters
The digital noise filter section is responsible for
rejecting noise on the incoming quadrature signals.
Schmitt Trigger inputs and a three-clock cycle delay
filter combine to reject low level noise and large, short
duration noise spikes that typically occur in noise prone
applications, such as a motor system.
The filter ensures that the filtered output signal is not
permitted to change until a stable value has been
registered for three consecutive clock cycles.
For the QEA, QEB and INDX pins, the clock divide
frequency for the digital filter is programmed by bits
QECK<2:0> (DFLTCON<6:4>) and are derived from
the base instruction cycle TCY.
In addition, control bit, UDSRC (QEICON<0>),
determines whether the timer count direction state is
based on the logic state, written into the UPDN
control/Status bit (QEICON<11>), or the QEB pin state.
When UDSRC = 1, the timer count direction is
controlled from the QEB pin. Likewise, when
UDSRC = 0, the timer count direction is controlled by
the UPDN bit.
Note:
14.6
This Timer does not support the External
Asynchronous Counter mode of operation.
If using an external clock source, the clock
will automatically be synchronized to the
internal instruction cycle.
QEI Module Operation During CPU
Sleep Mode
To enable the filter output for channels QEA, QEB and
INDX, the QEOUT bit must be ‘1’. The filter network for
all channels is disabled on POR and BOR.
14.6.1
14.5
The QEI module will be halted during the CPU Sleep
mode.
Alternate 16-bit Timer/Counter
When the QEI module is not configured for the QEI
mode QEIM<2:0> = 001, the module can be configured
as a simple 16-bit timer/counter. The setup and control
of the auxiliary timer is accomplished through the
QEICON SFR register. This timer functions identically
to Timer1. The QEA pin is used as the timer clock input.
14.6.2
When configured as a timer, the POSCNT register
serves as the Timer Count register and the MAXCNT
register serves as the Period register. When a
Timer/Period register match occur, the QEI interrupt
flag will be asserted.
14.7
The only exception between the general purpose
timers and this timer is the added feature of external
up/down input select. When the UPDN pin is asserted
high, the timer will increment up. When the UPDN pin
is asserted low, the timer will be decremented.
Note:
Changing the operational mode (i.e., from
QEI to Timer or vice versa), will not affect
the Timer/Position Count register contents.
The UPDN control/Status bit (QEICON<11>) can be
used to select the count direction state of the Timer
register. When UPDN = 1, the timer will count up. When
UPDN = 0, the timer will count down.
© 2008 Microchip Technology Inc.
QEI OPERATION DURING CPU
SLEEP MODE
TIMER OPERATION DURING CPU
SLEEP MODE
During CPU Sleep mode, the timer will not operate,
because the internal clocks are disabled.
QEI Module Operation During CPU
Idle Mode
Since the QEI module can function as a Quadrature
Encoder Interface, or as a 16-bit timer, the following
section describes operation of the module in both
modes.
14.7.1
QEI OPERATION DURING CPU IDLE
MODE
When the CPU is placed in the Idle mode, the QEI
module
will
operate
if
the
QEISIDL
bit
(QEICON<13>) = 0. This bit defaults to a logic ‘0’ upon
executing POR and BOR. For halting the QEI module
during the CPU Idle mode, QEISIDL should be set to
‘1’.
DS70150D-page 91
dsPIC30F6010A/6015
14.7.2
TIMER OPERATION DURING CPU
IDLE MODE
When the CPU is placed in the Idle mode and the QEI
module is configured in the 16-bit Timer mode, the
16-bit timer will operate if the QEISIDL bit
(QEICON<13>) = 0. This bit defaults to a logic ‘0’ upon
executing POR and BOR. For halting the timer module
during the CPU Idle mode, QEISIDL should be set
to ‘1’.
If the QEISIDL bit is cleared, the timer will function
normally, as if the CPU Idle mode had not been
entered.
14.8
Quadrature Encoder Interface
Interrupts
The Quadrature Encoder Interface has the ability to
generate an interrupt on occurrence of the following
events:
• Interrupt on 16-bit up/down position counter
rollover/underflow
• Detection of qualified index pulse, or if CNTERR
bit is set
• Timer period match event (overflow/underflow)
• Gate accumulation event
The QEI Interrupt Flag bit, QEIIF, is asserted upon
occurrence of any of the above events. The QEIIF bit
must be cleared in software. QEIIF is located in the
IFS2 STATUS register.
Enabling an interrupt is accomplished via the
respective enable bit, QEIIE. The QEIIE bit is located in
the IEC2 Control register.
DS70150D-page 92
© 2008 Microchip Technology Inc.
© 2008 Microchip Technology Inc.
TABLE 14-1:
SFR
Name
Addr.
QEI REGISTER MAP(1)
Bit 15
QEICON
0122 CNTERR
—
Bit 14
Bit 13
Bit 12 Bit 11
—
QEISIDL
INDX UPDN
—
—
—
—
Bit 10
Bit 9
Bit 8
QEIM<2:0>
IMV<1:0>
Bit 7
Bit 6
Bit 5
SWPAB PCDOUT TQGATE
CEID
QEOUT
DFLTCON
0124
POSCNT
0126
MAXCNT
Legend:
Note 1:
0128
Maximun Count<15:0>
— = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
QECK<2:0>
Position Counter<15:0>
Bit 4
Bit 3
TQCKPS<1:0>
—
Bit 2
Bit 1
POSRES TQCS
—
—
Bit 0
Reset State
UDSRC
0000 0000 0000 0000
—
0000 0000 0000 0000
0000 0000 0000 0000
1111 1111 1111 1111
dsPIC30F6010A/6015
DS70150D-page 93
dsPIC30F6010A/6015
NOTES:
DS70150D-page 94
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
15.0
Note:
MOTOR CONTROL PWM
MODULE
This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
“dsPIC30F Family Reference Manual”
(DS70046).
The PWM module has the following features:
•
•
•
•
•
•
•
This module simplifies the task of generating multiple,
synchronized Pulse-Width Modulated (PWM) outputs.
In particular, the following power and motion control
applications are supported by the PWM module:
•
•
•
•
•
•
Three Phase AC Induction Motor
Switched Reluctance (SR) Motor
Brushless DC (BLDC) Motor
Uninterruptible Power Supply (UPS)
•
8 PWM I/O pins with 4 duty cycle generators
Up to 16-bit resolution
‘On-the-Fly’ PWM frequency changes
Edge and Center-Aligned Output modes
Single Pulse Generation mode
Interrupt support for asymmetrical updates in
Center-Aligned mode
Output override control for Electrically
Commutative Motor (ECM) operation
‘Special Event’ comparator for scheduling other
peripheral events
Fault pins to optionally drive each of the PWM
output pins to a defined state
Duty cycle updates are configurable to be
immediate or synchronized to the PWM time base
This module contains 4 duty cycle generators,
numbered 1 through 4. The module has 8 PWM output
pins,
numbered
PWM1H/PWM1L
through
PWM4H/PWM4L. The eight I/O pins are grouped into
high/low numbered pairs, denoted by the suffix H or L,
respectively. For complementary loads, the low PWM
pins are always the complement of the corresponding
high I/O pin.
The PWM module allows several modes of operation
which are beneficial for specific power control
applications.
© 2008 Microchip Technology Inc.
DS70150D-page 95
dsPIC30F6010A/6015
FIGURE 15-1:
PWM MODULE BLOCK DIAGRAM
PWMCON1
PWM Enable and Mode SFRs
PWMCON2
DTCON1
Dead-Time Control SFRs
DTCON2
FLTACON
Fault Pin Control SFRs
FLTBCON
OVDCON
PWM Manual
Control SFR
PWM Generator #4
16-bit Data Bus
PDC4 Buffer
PDC4
Comparator
PWM Generator
#3
PTMR
Channel 3 Dead-Time
Generator and
Override Logic
Comparator
PWM Generator
#2
PTPER
PWM Generator
#1
PTPER Buffer
PWM4H
Channel 4 Dead-Time
Generator and
Override Logic
PWM4L
Output
Driver
Block
Channel 2 Dead-Time
Generator and
Override Logic
Channel 1 Dead-Time
Generator and
Override Logic
PWM3H
PWM3L
PWM2H
PWM2L
PWM1H
PWM1L
FLTA
PTCON
FLTB
Comparator
SEVTDIR
SEVTCMP
Special Event
Postscaler
Special Event Trigger
PTDIR
PWM Time Base
Note:
Details of PWM Generator #1, #2 and #3 not shown for clarity.
DS70150D-page 96
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
15.1
PWM Time Base
The PWM time base is provided by a 15-bit timer with
a prescaler and postscaler. The time base is accessible
via the PTMR SFR. PTMR<15> is a read-only Status
bit, PTDIR, that indicates the present count direction of
the PWM time base. If PTDIR is cleared, PTMR is
counting upwards. If PTDIR is set, PTMR is counting
downwards. The PWM time base is configured via the
PTCON SFR. The time base is enabled/disabled by
setting/clearing the PTEN bit in the PTCON SFR.
PTMR is not cleared when the PTEN bit is cleared in
software.
The PTPER SFR sets the counting period for PTMR.
The user must write a 15-bit value to PTPER<14:0>.
When the value in PTMR<14:0> matches the value in
PTPER<14:0>, the time base will either reset to ‘0’, or
reverse the count direction on the next occurring clock
cycle. The action taken depends on the operating
mode of the time base.
Note:
If the Period register is set to 0x0000, the
timer will stop counting, and the interrupt
and the special event trigger will not be
generated, even if the special event value
is also 0x0000. The module will not update
the Period register, if it is already at
0x0000; therefore, the user must disable
the module in order to update the Period
register.
The PWM time base can be configured for four different
modes of operation:
•
•
•
•
Free-Running mode
Single-Shot mode
Continuous Up/Down Count mode
Continuous Up/Down Count mode with interrupts
for double updates
These four modes are selected by the PTMOD<1:0>
bits in the PTCON SFR. The Up/Down Counting modes
support center-aligned PWM generation. The
Single-Shot mode allows the PWM module to support
pulse control of certain Electronically Commutative
Motors (ECMs).
The interrupt signals generated by the PWM time base
depend on the mode selection bits (PTMOD<1:0>) and
the postscaler bits (PTOPS<3:0>) in the PTCON SFR.
© 2008 Microchip Technology Inc.
15.1.1
FREE-RUNNING MODE
In the Free-Running mode, the PWM time base counts
upwards until the value in the Time Base Period
register (PTPER) is matched. The PTMR register is
reset on the following input clock edge and the time
base will continue to count upwards as long as the
PTEN bit remains set.
When the PWM time base is in the Free-Running mode
(PTMOD<1:0> = 00), an interrupt event is generated
each time a match with the PTPER register occurs and
the PTMR register is reset to zero. The postscaler
selection bits may be used in this mode of the timer to
reduce the frequency of the interrupt events.
15.1.2
SINGLE-SHOT MODE
In the Single-Shot Counting mode, the PWM time base
begins counting upwards when the PTEN bit is set.
When the value in the PTMR register matches the
PTPER register, the PTMR register will be reset on the
following input clock edge and the PTEN bit will be
cleared by the hardware to halt the time base.
When the PWM time base is in the Single-Shot mode
(PTMOD<1:0> = 01), an interrupt event is generated
when a match with the PTPER register occurs, the
PTMR register is reset to zero on the following input
clock edge, and the PTEN bit is cleared. The postscaler
selection bits have no effect in this mode of the timer.
15.1.3
CONTINUOUS UP/DOWN
COUNTING MODES
In the Continuous Up/Down Counting modes, the PWM
time base counts upwards until the value in the PTPER
register is matched. The timer will begin counting
downwards on the following input clock edge. The
PTDIR bit in the PTMR SFR is read-only and indicates
the counting direction The PTDIR bit is set when the
timer counts downwards.
In the Up/Down Counting mode (PTMOD<1:0> = 10),
an interrupt event is generated each time the value of
the PTMR register becomes zero and the PWM time
base begins to count upwards. The postscaler selection bits may be used in this mode of the timer to reduce
the frequency of the interrupt events.
DS70150D-page 97
dsPIC30F6010A/6015
15.1.4
DOUBLE UPDATE MODE
EQUATION 15-1:
In the Double Update mode (PTMOD<1:0> = 11), an
interrupt event is generated each time the PTMR
register is equal to zero, as well as each time a period
match occurs. The postscaler selection bits have no
effect in this mode of the timer.
The Double Update mode provides two additional
functions to the user. First, the control loop bandwidth
is doubled because the PWM duty cycles can be
updated, twice per period. Second, asymmetrical
center-aligned PWM waveforms can be generated,
which are useful for minimizing output waveform
distortion in certain motor control applications.
Note:
15.1.5
Programming a value of 0x0001 in the
Period register could generate a
continuous interrupt pulse, and hence,
must be avoided.
PWM TIME BASE PRESCALER
The input clock to PTMR (FOSC/4), has prescaler
options of 1:1, 1:4, 1:16, or 1:64, selected by control
bits, PTCKPS<1:0>, in the PTCON SFR. The prescaler
counter is cleared when any of the following occurs:
• a write to the PTMR register
• a write to the PTCON register
• any device Reset
15.1.6
PWM TIME BASE POSTSCALER
The match output of PTMR can optionally be
post-scaled through a 4-bit postscaler (which gives a
1:1 to 1:16 scaling).
The postscaler counter is cleared when any of the
following occurs:
• a write to the PTMR register
• a write to the PTCON register
• any device Reset
PWM Period
PTPER is a 15-bit, double-buffered register that sets the
counting period for the PWM time base. The PTPER
buffer is loaded into the PTPER register at these instants:
• Free-Running and Single-Shot modes: When the
PTMR register is reset to zero after a match with
the PTPER register.
• Up/Down Counting modes: When the PTMR
register is zero.
The value held in the PTPER buffer is automatically
loaded into the PTPER register when the PWM time
base is disabled (PTEN = 0).
The PWM period
Equation 15-1:
DS70150D-page 98
can
be
determined
(PTMR Prescale Value)
If the PWM time base is configured for one of the
Up/Down Count modes, the PWM period will be given
by Equation 15-2.
EQUATION 15-2:
TPWM =
PWM PERIOD FOR
UP/DOWN COUNT
TCY •
2 • (PTPER + 0.75)
(PTMR Prescale Value)
The maximum resolution (in bits) for a given device
oscillator and PWM frequency can be determined using
Equation 15-3:
EQUATION 15-3:
PWM RESOLUTION
log (2 • TPWM/TCY)
Resolution =
log (2)
Edge-Aligned PWM
Edge-aligned PWM signals are produced by the module
when the PWM time base is in the Free-Running or
Single-Shot mode. For edge-aligned PWM outputs, the
output has a period specified by the value in PTPER
and a duty cycle specified by the appropriate Duty Cycle
register (see Figure 15-2). The PWM output is driven
active at the beginning of the period (PTMR = 0) and is
driven inactive when the value in the Duty Cycle register
matches PTMR.
If the value in a particular Duty Cycle register is zero,
then the output on the corresponding PWM pin will be
inactive for the entire PWM period. In addition, the
output on the PWM pin will be active for the entire
PWM period if the value in the Duty Cycle register is
greater than the value held in the PTPER register.
PTMR is not cleared when PTCON is written.
15.2
TCY • (PTPER + 1)
TPWM =
15.3
PTMR is not cleared when PTCON is written.
PWM PERIOD
using
FIGURE 15-2:
EDGE-ALIGNED PWM
New Duty Cycle Latched
PTPER
PTMR
Value
0
Duty Cycle
Period
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
15.4
Center-Aligned PWM
15.5.1
Center-aligned PWM signals are produced by the
module when the PWM time base is configured in an
Up/Down Counting mode (see Figure 15-3).
The PWM compare output is driven to the active state
when the value of the Duty Cycle register matches the
value of PTMR and the PWM time base is counting
downwards (PTDIR = 1). The PWM compare output is
driven to the inactive state when the PWM time base is
counting upwards (PTDIR = 0) and the value in the
PTMR register matches the duty cycle value.
If the value in a particular Duty Cycle register is zero,
then the output on the corresponding PWM pin will be
inactive for the entire PWM period. In addition, the
output on the PWM pin will be active for the entire PWM
period if the value in the Duty Cycle register is equal to
the value held in the PTPER register.
FIGURE 15-3:
CENTER-ALIGNED PWM
Period/2
PTPER
PTMR
Value
Duty
Cycle
0
The four PWM Duty Cycle registers are
double-buffered to allow glitchless updates of the PWM
outputs. For each duty cycle, there is a Duty Cycle
register that is accessible by the user and a second
Duty Cycle register that holds the actual compare value
used in the present PWM period.
For edge-aligned PWM output, a new duty cycle value
will be updated whenever a match with the PTPER
register occurs and PTMR is reset. The contents of the
duty cycle buffers are automatically loaded into the
Duty Cycle registers when the PWM time base is disabled (PTEN = 0) and the UDIS bit is cleared in
PWMCON2.
When the PWM time base is in the Up/Down Counting
mode, new duty cycle values are updated when the
value of the PTMR register is zero and the PWM time
base begins to count upwards. The contents of the duty
cycle buffers are automatically loaded into the Duty
Cycle registers when the PWM time base is disabled
(PTEN = 0).
When the PWM time base is in the Up/Down Counting
mode with double updates, new duty cycle values are
updated when the value of the PTMR register is zero,
and when the value of the PTMR register matches the
value in the PTPER register. The contents of the duty
cycle buffers are automatically loaded into the Duty
Cycle registers when the PWM time base is disabled
(PTEN = 0).
15.5.2
Period
15.5
PWM Duty Cycle Comparison
Units
There are four 16-bit Special Function Registers
(PDC1, PDC2, PDC3 and PDC4) used to specify duty
cycle values for the PWM module.
The value in each Duty Cycle register determines the
amount of time that the PWM output is in the active
state. The Duty Cycle registers are 16-bits wide. The
LSb of a Duty Cycle register determines whether the
PWM edge occurs in the beginning. Thus, the PWM
resolution is effectively doubled.
DUTY CYCLE REGISTER BUFFERS
DUTY CYCLE IMMEDIATE
UPDATES
When the Immediate Update Enable bit is set (IUE = 1),
any write to the Duty Cycle registers will update the
new duty cycle value immediately. This feature gives
the option to the user to allow immediate updates of the
active PWM Duty Cycle registers instead of waiting for
the end of the current time base period. System
stability is improved in closed loop servo applications
by reducing the delay between system observation and
the issuance of system corrective commands when
immediate updates are enabled (IUE = 1).
If the PWM output is active at the time the new duty
cycle is written and the new duty cycle is less than the
current time base value, the PWM pulse width will be
shortened. If the PWM output is active at the time the
new duty cycle is written and the new duty cycle is
greater than the current time base value, the PWM
pulse width will be lengthened.
If the PWM output is inactive at the time the new duty
cycle is written and the new duty cycle is greater than
the current time base value, the PWM output will
become active immediately and will remain active for
the new written duty cycle value.
© 2008 Microchip Technology Inc.
DS70150D-page 99
dsPIC30F6010A/6015
15.6
Complementary PWM Operation
In the Complementary mode of operation, each pair of
PWM outputs is obtained by a complementary PWM
signal. A dead time may be optionally inserted during
device switching, when both outputs are inactive for a
short period (Refer to Section 15.7 “Dead-Time
Generators”).
In Complementary mode, the duty cycle comparison
units are assigned to the PWM outputs as follows:
•
•
•
•
PDC1 register controls PWM1H/PWM1L outputs
PDC2 register controls PWM2H/PWM2L outputs
PDC3 register controls PWM3H/PWM3L outputs
PDC4 register controls PWM4H/PWM4L outputs
The Complementary mode is selected for each PWM
I/O pin pair by clearing the appropriate PMODx bit in the
PWMCON1 SFR. The PWM I/O pins are set to
Complementary mode by default upon a device Reset.
15.7
Dead-Time Generators
Dead-time generation may be provided when any of
the PWM I/O pin pairs are operating in the
Complementary Output mode. The PWM outputs use
Push-Pull drive circuits. Due to the inability of the
power output devices to switch instantaneously, some
amount of time must be provided between the turn off
event of one PWM output in a complementary pair and
the turn on event of the other transistor.
The PWM module allows two different dead times to be
programmed. These two dead times may be used in
one of two methods described below to increase user
flexibility:
• The PWM output signals can be optimized for
different turn off times in the high side and low
side transistors in a complementary pair of
transistors. The first dead time is inserted
between the turn off event of the lower transistor
of the complementary pair and the turn on event
of the upper transistor. The second dead time is
inserted between the turn off event of the upper
transistor and the turn on event of the lower
transistor.
• The two dead times can be assigned to individual
PWM I/O pin pairs. This Operating mode allows
the PWM module to drive different transistor/load
combinations with each complementary PWM I/O
pin pair.
15.7.1
DEAD-TIME GENERATORS
Each complementary output pair for the PWM module
has a 6-bit down counter that is used to produce the
dead-time insertion. As shown in Figure 15-4, each
dead-time unit has a rising and falling edge detector
connected to the duty cycle comparison output.
DS70150D-page 100
15.7.2
DEAD-TIME ASSIGNMENT
The DTCON2 SFR contains control bits that allow the
dead times to be assigned to each of the
complementary outputs. Table 15-1 summarizes the
function of each dead-time selection control bit.
TABLE 15-1:
DEAD-TIME SELECTION BITS
Bit
Function
DTS1A
Selects PWM1L/PWM1H active edge dead time.
DTS1I
Selects PWM1L/PWM1H inactive edge
dead time.
DTS2A
Selects PWM2L/PWM2H active edge dead time.
DTS2I
Selects PWM2L/PWM2H inactive edge
dead time.
DTS3A
Selects PWM3L/PWM3H active edge dead time.
DTS3I
Selects PWM3L/PWM3H inactive edge
dead time.
DTS4A
Selects PWM4L/PWM4H active edge dead time.
DTS4I
Selects PWM4L/PWM4H inactive edge
dead time.
15.7.3
DEAD-TIME RANGES
The amount of dead time provided by each dead-time
unit is selected by specifying the input clock prescaler
value and a 6-bit unsigned value. The amount of dead
time provided by each unit may be set independently.
Four input clock prescaler selections have been
provided to allow a suitable range of dead times, based
on the device operating frequency. The clock prescaler
option may be selected independently for each of the
two dead-time values. The dead-time clock prescaler
values are selected using the DTAPS<1:0> and
DTBPS<1:0> control bits in the DTCON1 SFR. One of
four clock prescaler options (TCY, 2 TCY, 4 TCY or 8 TCY)
may be selected for each of the dead-time values.
After the prescaler values are selected, the dead time
for each unit is adjusted by loading two 6-bit unsigned
values into the DTCON1 SFR.
The dead-time unit prescalers are cleared on the
following events:
• On a load of the down timer due to a duty cycle
comparison edge event.
• On a write to the DTCON1 or DTCON2 registers.
• On any device Reset.
Note:
The user should not modify the DTCON1
or DTCON2 values while the PWM
module is operating (PTEN = 1).
Unexpected results may occur.
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 15-4:
DEAD-TIME TIMING DIAGRAM
Duty Cycle Generator
PWMxH
PWMxL
Time selected by DTSxA bit (A or B)
15.8
Independent PWM Output
An independent PWM Output mode is required for
driving certain types of loads. A particular PWM output
pair is in the Independent Output mode when the
corresponding PMOD bit in the PWMCON1 register is
set. No dead-time control is implemented between
adjacent PWM I/O pins when the module is operating
in the Independent mode and both I/O pins are allowed
to be active simultaneously.
In the Independent mode, each duty cycle generator is
connected to both of the PWM I/O pins in an output
pair. By using the associated Duty Cycle register and
the appropriate bits in the OVDCON register, the user
may select the following signal output options for each
PWM I/O pin operating in the Independent mode:
• I/O pin outputs PWM signal
• I/O pin inactive
• I/O pin active
15.9
Single-Pulse PWM Operation
The PWM module produces single pulse outputs when
the PTCON control bits PTMOD<1:0> = 10. Only
edge-aligned outputs may be produced in the
Single-Pulse mode. In Single-Pulse mode, the PWM
I/O pin(s) are driven to the active state when the PTEN
bit is set. When a match with a Duty Cycle register
occurs, the PWM I/O pin is driven to the inactive state.
When a match with the PTPER register occurs, the
PTMR register is cleared, all active PWM I/O pins are
driven to the inactive state, the PTEN bit is cleared, and
an interrupt is generated.
© 2008 Microchip Technology Inc.
Time selected by DTSxI bit (A or B)
15.10 PWM Output Override
The PWM output override bits allow the user to
manually drive the PWM I/O pins to specified logic
states, independent of the duty cycle comparison units.
All control bits associated with the PWM output
override function are contained in the OVDCON
register. The upper half of the OVDCON register
contains eight bits, POVDxH<4:1> and POVDxL<4:1>,
that determine which PWM I/O pins will be overridden.
The lower half of the OVDCON register contains eight
bits, POUTxH<4:1> and POUTxL<4:1>, that determine
the state of the PWM I/O pins when a particular output
is overridden via the POVD bits.
15.10.1
COMPLEMENTARY OUTPUT MODE
When a PWMxL pin is driven active via the OVDCON
register, the output signal is forced to be the
complement of the corresponding PWMxH pin in the
pair. Dead-time insertion is still performed when PWM
channels are overridden manually.
15.10.2
OVERRIDE SYNCHRONIZATION
If the OSYNC bit in the PWMCON2 register is set, all
output overrides performed via the OVDCON register
are synchronized to the PWM time base. Synchronous
output overrides occur at the following times:
• Edge-Aligned mode, when PTMR is zero.
• Center-Aligned modes, when PTMR is zero and
when the value of PTMR matches PTPER.
DS70150D-page 101
dsPIC30F6010A/6015
15.11 PWM Output and Polarity Control
15.12.2
There are three device Configuration bits associated
with the PWM module that provide PWM output pin
control:
The FLTACON and FLTBCON Special Function
Registers have eight bits each that determine the state
of each PWM I/O pin when it is overridden by a Fault
input. When these bits are cleared, the PWM I/O pin is
driven to the inactive state. If the bit is set, the PWM I/O
pin will be driven to the active state. The active and
inactive states are referenced to the polarity defined for
each PWM I/O pin (HPOL and LPOL polarity control
bits).
• HPOL Configuration bit
• LPOL Configuration bit
• PWMPIN Configuration bit
These three bits in the FBORPOR Configuration
register (see Section 21.6 “Device Configuration
Registers”) work in conjunction with the four PWM
Enable bits (PENxH and PENxL) located in the
PWMCON1 SFR. The Configuration bits and PWM
Enable bits ensure that the PWM pins are in the correct
states after a device Reset occurs. The PWMPIN
configuration fuse allows the PWM module outputs to
be optionally enabled on a device Reset. If
PWMPIN = 0, the PWM outputs will be driven to their
inactive states at Reset. If PWMPIN = 1 (default), the
PWM outputs will be tri-stated. The HPOL bit specifies
the polarity for the PWMxH outputs, whereas the LPOL
bit specifies the polarity for the PWMxL outputs.
15.11.1
OUTPUT PIN CONTROL
The PENxH and PENxL control bits in the PWMCON1
SFR enable each high PWM output pin and each low
PWM output pin, respectively. If a particular PWM
output pin is not enabled, it is treated as a general
purpose I/O pin.
15.12 PWM Fault Pins
There are two Fault pins (FLTA and FLTB) associated
with the PWM module. When asserted, these pins can
optionally drive each of the PWM I/O pins to a defined
state.
15.12.1
FAULT PIN ENABLE BITS
The FLTACON and FLTBCON SFRs each have 4
control bits that determine whether a particular pair of
PWM I/O pins is to be controlled by the Fault input pin.
To enable a specific PWM I/O pin pair for Fault
overrides, the corresponding bit should be set in the
FLTACON or FLTBCON register.
If all enable bits are cleared in the FLTACON or
FLTBCON registers, then the corresponding Fault input
pin has no effect on the PWM module and the pin may
be used as a general purpose interrupt or I/O pin.
Note:
The Fault pin logic can operate
independent of the PWM logic. If all the
enable bits in the FLTACON/FLTBCON
register are cleared, then the Fault pin(s)
could be used as general purpose
interrupt pin(s). Each Fault pin has an
interrupt vector, Interrupt Flag bit and
Interrupt Priority bits associated with it.
DS70150D-page 102
FAULT STATES
A special case exists when a PWM module I/O pair is
in the Complementary mode and both pins are
programmed to be active on a Fault condition. The
PWMxH pin always has priority in the Complementary
mode, so that both I/O pins cannot be driven active
simultaneously.
15.12.3
FAULT PIN PRIORITY
If both Fault input pins have been assigned to control a
particular PWM I/O pin, the Fault state programmed for
the Fault A input pin will take priority over the Fault B
input pin.
15.12.4
FAULT INPUT MODES
Each of the Fault input pins has two modes of
operation:
• Latched Mode: When the Fault pin is driven low,
the PWM outputs will go to the states defined in
the FLTACON/FLTBCON register. The PWM
outputs will remain in this state until the Fault pin
is driven high and the corresponding interrupt flag
has been cleared in software. When both of these
actions have occurred, the PWM outputs will
return to normal operation at the beginning of the
next PWM cycle or half-cycle boundary. If the
interrupt flag is cleared before the Fault condition
ends, the PWM module will wait until the Fault pin
is no longer asserted, to restore the outputs.
• Cycle-by-Cycle Mode: When the Fault input pin
is driven low, the PWM outputs remain in the
defined Fault states for as long as the Fault pin is
held low. After the Fault pin is driven high, the
PWM outputs return to normal operation at the
beginning of the following PWM cycle or
half-cycle boundary.
The Operating mode for each Fault input pin is selected
using the FLTAM and FLTBM control bits in the
FLTACON and FLTBCON Special Function Registers.
Each of the Fault pins can be controlled manually in
software.
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
15.13 PWM Update Lockout
15.14.1
For a complex PWM application, the user may need to
write up to four Duty Cycle registers and the Time Base
Period register, PTPER, at a given time. In some
applications, it is important that all buffer registers be
written before the new duty cycle and period values are
loaded for use by the module.
The PWM special event trigger has a postscaler that
allows a 1:1 to 1:16 postscale ratio. The postscaler is
configured by writing the SEVOPS<3:0> control bits in
the PWMCON2 SFR.
The PWM update lockout feature is enabled by setting
the UDIS control bit in the PWMCON2 SFR. The UDIS
bit affects all Duty Cycle Buffer registers and the PWM
time base period buffer, PTPER. No duty cycle
changes or period value changes will have effect while
UDIS = 1.
If the IUE bit is set, any change to the Duty Cycle
registers will be immediately updated regardless of the
UDIS bit state. The PWM Period register updates
(PTPER) are not affected by the IUE control bit.
15.14 PWM Special Event Trigger
The PWM module has a special event trigger that
allows A/D conversions to be synchronized to the PWM
time base. The A/D sampling and conversion time may
be programmed to occur at any point within the PWM
period. The special event trigger allows the user to
minimize the delay between the time when A/D
conversion results are acquired and the time when the
duty cycle value is updated.
SPECIAL EVENT TRIGGER
POSTSCALER
The special event output postscaler is cleared on the
following events:
• Any write to the SEVTCMP register
• Any device Reset
15.15 PWM Operation During CPU Sleep
Mode
The Fault A and Fault B input pins have the ability to
wake the CPU from Sleep mode. The PWM module
generates an interrupt if either of the Fault pins is
driven low while in Sleep.
15.16 PWM Operation During CPU Idle
Mode
The PTCON SFR contains a PTSIDL control bit. This
bit determines if the PWM module will continue to
operate or stop when the device enters Idle mode. If
PTSIDL = 0, the module will continue to operate. If
PTSIDL = 1, the module will stop operation as long as
the CPU remains in Idle mode.
The PWM special event trigger has an SFR named
SEVTCMP, and five control bits to control its operation.
The PTMR value for which a special event trigger
should occur is loaded into the SEVTCMP register.
When the PWM time base is in an Up/Down Counting
mode, an additional control bit is required to specify the
counting phase for the special event trigger. The count
phase is selected using the SEVTDIR control bit in the
SEVTCMP SFR. If the SEVTDIR bit is cleared, the
special event trigger will occur on the upward counting
cycle of the PWM time base. If the SEVTDIR bit is set,
the special event trigger will occur on the downward
count cycle of the PWM time base. The SEVTDIR
control bit has no effect unless the PWM time base is
configured for an Up/Down Counting mode.
© 2008 Microchip Technology Inc.
DS70150D-page 103
SFR Name Addr
8-OUTPUT PWM REGISTER MAP(1)
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
—
PTSIDL
—
—
—
—
Bit 8
Bit 7
Bit 6
—
Bit 5
Bit 4
PTOPS<3:0>
Bit 3
Bit 2
PTCKPS<1:0>
Bit 1
Bit 0
PTMOD<1:0>
Reset State
PTCON
01C0
PTEN
PTMR
01C2
PTDIR
PWM Timer Count Value
0000 0000 0000 0000
PTPER
01C4
—
PWM Time Base Period Register
0111 1111 1111 1111
SEVTCMP 01C6 SEVTDIR
PWMCON1 01C8
PWM Special Event Compare Register
—
—
—
—
—
—
—
PWMCON2 01CA
—
DTCON1
01CC
DTBPS<1:0>
DTCON2
01CE
—
FLTACON
—
PTMOD4 PTMOD3 PTMOD2 PTMOD1
SEVOPS<3:0>
Dead-Time B Value
—
—
—
—
0000 0000 0000 0000
PEN4H
PEN3H
PEN2H
PEN1H
—
—
—
—
DTAPS<1:0>
—
—
0000 0000 0000 0000
PEN4L
PEN3L
PEN2L
PEN1L 0000 0000 1111 1111
—
IUE
OSYNC
UDIS
Dead-Time A Value
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
DTS4A
DTS4I
DTS3A
DTS3I
DTS2A
DTS2I
DTS1A
DTS1I
01D0 FAOV4H FAOV4L FAOV3H FAOV3L FAOV2H FAOV2L FAOV1H FAOV1L
FLTAM
—
—
—
FAEN4
FAEN3
FAEN2
FAEN1 0000 0000 0000 0000
FLTBCON
01D2 FBOV4H FBOV4L FBOV3H FBOV3L FBOV2H FBOV2L FBOV1H FBOV1L
FLTBM
—
—
—
FBEN4
FBEN3
FBEN2
FBEN1 0000 0000 0000 0000
OVDCON
01D4 POVD4H POVD4L POVD3H POVD3L POVD2H POVD2L POVD1H POVD1L POUT4H POUT4L POUT3H POUT3L POUT2H POUT2L POUT1H POUT1L 1111 1111 0000 0000
PDC1
01D6
PWM Duty Cycle 1 Register
0000 0000 0000 0000
PDC2
01D8
PWM Duty Cycle 2 Register
0000 0000 0000 0000
PDC3
01DA
PWM Duty Cycle 3 Register
0000 0000 0000 0000
PDC4
Legend:
Note 1:
01DC
PWM Duty Cycle 4 Register
u = uninitialized bit; — = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
0000 0000 0000 0000
dsPIC30F6010A/6015
DS70150D-page 104
TABLE 15-2:
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
16.0
Note:
SPI MODULE
This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
“dsPIC30F Family Reference Manual”
(DS70046).
The Serial Peripheral Interface (SPI) module is a
synchronous serial interface. It is useful for
communicating with other peripheral devices such as
EEPROMs, shift registers, display drivers and A/D
converters, or other microcontrollers. It is compatible
with Motorola’s SPI and SIOP interfaces.
16.1
Operating Function Description
Each SPI module consists of a 16-bit shift register,
SPIxSR (where x = 1 or 2), used for shifting data in
and out, and a buffer register, SPIxBUF. A control
register,
SPIxCON,
configures
the
module.
Additionally, a STATUS register, SPIxSTAT, indicates
various status conditions.
The serial interface consists of 4 pins: SDIx (Serial
Data Input), SDOx (Serial Data Output), SCKx (Shift
Clock Input or Output) and SSx (active-low Slave
Select).
In Master mode operation, SCK is a clock output, but
in Slave mode, it is a clock input.
Transmit writes are also double-buffered. The user
writes to SPIxBUF. When the master or slave transfer
is completed, the contents of the shift register
(SPIxSR) is moved to the receive buffer. If any
transmit data has been written to the buffer register,
the contents of the transmit buffer are moved to
SPIxSR. The received data is thus placed in SPIxBUF
and the transmit data in SPIxSR is ready for the next
transfer.
Note:
Both the transmit buffer (SPIxTXB) and
the receive buffer (SPIxRXB) are mapped
to the same register address, SPIxBUF.
In Master mode, the clock is generated by prescaling
the system clock. Data is transmitted as soon as a
value is written to SPIxBUF. The interrupt is generated
at the middle of the transfer of the last bit.
In Slave mode, data is transmitted and received as
external clock pulses appear on SCK. Again, the
interrupt is generated when the last bit is latched. If
SSx control is enabled, then transmission and
reception are enabled only when SSx = low. The
SDOx output will be disabled in SSx mode with SSx
high.
The clock provided to the module is (FOSC/4). This
clock is then prescaled by the primary (PPRE<1:0>)
and the secondary (SPRE<2:0>) prescale factors. The
CKE bit determines whether transmit occurs on
transition from active clock state to Idle clock state, or
vice versa. The CKP bit selects the Idle state (high or
low) for the clock.
A series of eight (8) or sixteen (16) clock pulses shifts
out bits from the SPIxSR to SDOx pin and
simultaneously shifts in data from SDIx pin. An
interrupt is generated when the transfer is complete
and the corresponding interrupt flag bit (SPI1IF or
SPI2IF) is set. This interrupt can be disabled through
an interrupt enable bit (SPI1IE or SPI2IE).
16.1.1
The receive operation is double-buffered. When a
complete byte is received, it is transferred from
SPIxSR to SPIxBUF.
The user software must disable the module prior to
changing the MODE16 bit. The SPI module is reset
when the MODE16 bit is changed by the user.
If the receive buffer is full when new data is being
transferred from SPIxSR to SPIxBUF, the module will
set the SPIROV bit, indicating an overflow condition.
The transfer of the data from SPIxSR to SPIxBUF will
not be completed and the new data will be lost. The
module will not respond to SCL transitions while
SPIROV is ‘1’, effectively disabling the module until
SPIxBUF is read by user software.
A basic difference between 8-bit and 16-bit operation is
that the data is transmitted out of bit 7 of the SPIxSR for
8-bit operation, and data is transmitted out of bit 15 of
the SPIxSR for 16-bit operation. In both modes, data is
shifted into bit 0 of the SPIxSR.
Note:
The user must perform reads of SPIxBUF
if the module is used in a transmit only
configuration to avoid a receive overflow
condition. (SPIROV = 1)
© 2008 Microchip Technology Inc.
WORD AND BYTE
COMMUNICATION
A control bit, MODE16 (SPIxCON<10>), allows the
module to communicate in either 16-bit or 8-bit mode.
16-bit operation is identical to 8-bit operation, except
that the number of bits transmitted is 16 instead of 8.
16.1.2
SDOx DISABLE
A control bit, DISSDO, is provided to the SPIxCON
register to allow the SDOx output to be disabled. This
will allow the SPI module to be connected in an input
only configuration. SDO can also be used for general
purpose I/O.
DS70150D-page 105
dsPIC30F6010A/6015
FIGURE 16-1:
SPI BLOCK DIAGRAM
Internal
Data Bus
Read
Write
SPIxBUF
SPIxBUF
Transmit
Receive
SPIxSR
SDIx
bit 0
SDOx
Shift
clock
Clock
Control
SS & FSYNC
Control
SSx
Edge
Select
Secondary
Prescaler
1:1-1:8
SCKx
Primary
Prescaler
1, 4, 16, 64
FCY
Enable Master Clock
Note: x = 1 or 2.
FIGURE 16-2:
SPI MASTER/SLAVE CONNECTION
SPI Master
SPI Slave
SDOx
SDIy
Serial Input Buffer
(SPIxBUF)
SDIx
Shift Register
(SPIxSR)
MSb
Serial Input Buffer
(SPIyBUF)
LSb
Shift Register
(SPIySR)
MSb
SCKx
PROCESSOR 1
SDOy
Serial Clock
LSb
SCKy
PROCESSOR 2
Note: x = 1 or 2, y = 1 or 2.
DS70150D-page 106
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
16.2
Framed SPI Support
The module supports a basic framed SPI protocol in
Master or Slave mode. The control bit, FRMEN,
enables framed SPI support and causes the SSx pin to
perform the Frame Synchronization pulse (FSYNC)
function. The control bit SPIFSD determines whether
the SSx pin is an input or an output (i.e., whether the
module receives or generates the Frame
Synchronization pulse). The frame pulse is an
active-high pulse for a single SPI clock cycle. When
Frame Synchronization is enabled, the data transmission starts only on the subsequent transmit edge of the
SPI clock.
16.3
Slave Select Synchronization
The SSx pin allows a Synchronous Slave mode. The
SPI must be configured in SPI Slave mode, with SSx
pin control enabled (SSEN = 1). When the SSx pin is
low, transmission and reception are enabled, and the
SDOx pin is driven. When SSx pin goes high, the SDOx
pin is no longer driven. Also, the SPI module is
re-synchronized, and all counters/control circuitry are
reset. Therefore, when the SSx pin is asserted low
again, transmission/reception will begin at the MSb,
even if SSx had been de-asserted in the middle of a
transmit/receive.
© 2008 Microchip Technology Inc.
16.4
SPI Operation During CPU Sleep
Mode
During Sleep mode, the SPI module is shut down. If
the CPU enters Sleep mode while an SPI transaction
is in progress, then the transmission and reception is
aborted.
The transmitter and receiver will stop in Sleep mode.
However, register contents are not affected by
entering or exiting Sleep mode.
16.5
SPI Operation During CPU Idle
Mode
When the device enters Idle mode, all clock sources
remain functional. The SPISIDL bit (SPIxSTAT<13>)
selects if the SPI module will stop or continue on Idle.
If SPISIDL = 0, the module will continue to operate
when the CPU enters Idle mode. If SPISIDL = 1, the
module will stop when the CPU enters Idle mode.
DS70150D-page 107
SPI1 REGISTER MAP(1)
SFR
Name
Addr.
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
—
—
Bit 9
Bit 8
Bit 7
Bit 6
SPI1STAT
0220
SPIEN
—
SPISIDL
—
SPI1CON
0222
—
FRMEN
SPIFSD
—
SPI1BUF
Legend:
Note 1:
0224
Transmit and Receive Buffer
— = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
TABLE 16-2:
SFR Name
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
—
—
—
SPIROV
—
—
—
—
SPITBF
SPIRBF 0000 0000 0000 0000
SMP
CKE
SSEN
CKP
MSTEN
SPRE2
SPRE1
SPRE0
PPRE1
PPRE0
0000 0000 0000 0000
0000 0000 0000 0000
SPI2 REGISTER MAP(1)
Addr.
Bit 15
SPI2STAT
0226
SPI2CON
0228
SPI2BUF
Legend:
Note 1:
DISSDO MODE16
Bit 5
Bit 14
Bit 13
Bit 12
SPIEN
—
SPISIDL
—
—
FRMEN
SPIFSD
—
Bit 11
Bit 10
—
—
DISSDO MODE16
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
—
—
—
SPIROV
—
—
—
—
SPITBF
SPIRBF
0000 0000 0000 0000
SMP
CKE
SSEN
CKP
MSTEN
SPRE2
SPRE1
SPRE0
PPRE1
PPRE0
0000 0000 0000 0000
022A
Transmit and Receive Buffer
— = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
0000 0000 0000 0000
dsPIC30F6010A/6015
DS70150D-page 108
TABLE 16-1:
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
17.0
Note:
I2C™ MODULE
17.1.1
This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
“dsPIC30F Family Reference Manual”
(DS70046).
2
The Inter-Integrated Circuit™ (I C™) module provides
complete hardware support for both Slave and
Multi-Master modes of the I2C serial communication
standard, with a 16-bit interface.
This module offers the following key features:
• I2C interface supporting both Master and Slave
operation.
• I2C Slave mode supports 7 and 10-bit address.
• I2C Master mode supports 7 and 10-bit address.
• I2C port allows bidirectional transfers between
master and slaves.
• Serial clock synchronization for I2C port can be
used as a handshake mechanism to suspend and
resume serial transfer (SCLREL control).
• I2C supports multi-master operation; detects bus
collision and will arbitrate accordingly.
17.1
Operating Function Description
The hardware fully implements all the master and
slave functions of the I2C Standard and Fast mode
specifications, as well as 7 and 10-bit addressing.
Thus, the I2C module can operate either as a slave or
a master on an I2C bus.
FIGURE 17-1:
VARIOUS I2C MODES
The following types of I2C operation are supported:
•
•
•
I2C Slave operation with 7-bit address
I2C Slave operation with 10-bit address
I2C Master operation with 7 or 10-bit address
See the I2C programmer’s model in Figure 17-1.
17.1.2
PIN CONFIGURATION IN I2C MODE
I2C has a 2-pin interface; pin SCL is clock and pin SDA
is data.
17.1.3
I2C REGISTERS
I2CCON and I2CSTAT are control and STATUS
registers, respectively. The I2CCON register is
readable and writable. The lower 6 bits of I2CSTAT are
read-only. The remaining bits of the I2CSTAT are
read/write.
I2CRSR is the shift register used for shifting data,
whereas I2CRCV is the buffer register to which data
bytes are written, or from which data bytes are read.
I2CRCV is the receive buffer, as shown in Figure 16-1.
I2CTRN is the transmit register to which bytes are written
during a transmit operation, as shown in Figure 16-2.
The I2CADD register holds the slave address. A Status
bit, ADD10, indicates 10-bit Address mode. The
I2CBRG acts as the Baud Rate Generator reload
value.
In receive operations, I2CRSR and I2CRCV together
form a double-buffered receiver. When I2CRSR receives
a complete byte, it is transferred to I2CRCV and an
interrupt pulse is generated. During transmission, the
I2CTRN is not double-buffered.
Note:
Following a Restart condition in 10-bit
mode, the user only needs to match the
first 7-bit address.
PROGRAMMER’S MODEL
I2CRCV (8 bits)
bit 7
bit 0
bit 7
bit 0
I2CTRN (8 bits)
I2CBRG (9 bits)
bit 8
bit 0
I2CCON (16 bits)
bit 15
bit 0
bit 15
bit 0
I2CSTAT (16 bits)
I2CADD (10 bits)
bit 9
© 2008 Microchip Technology Inc.
bit 0
DS70150D-page 109
dsPIC30F6010A/6015
FIGURE 17-2:
I2C™ BLOCK DIAGRAM
Internal
Data Bus
I2CRCV
SCL
Read
Shift
Clock
I2CRSR
LSB
SDA
Addr_Match
Match Detect
Write
I2CADD
Read
Start and
Stop bit Detect
I2CSTAT
Write
Control Logic
Start, Restart,
Stop bit Generate
Write
I2CCON
Collision
Detect
Acknowledge
Generation
Clock
Stretching
Read
Read
Write
I2CTRN
LSB
Shift
Clock
Read
Reload
Control
BRG Down
Counter
DS70150D-page 110
Write
I2CBRG
FCY
Read
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
17.2
I2C Module Addresses
The I2CADD register contains the Slave mode
addresses. The register is a 10-bit register.
If the A10M bit (I2CCON<10>) is ‘0’, the address is
interpreted by the module as a 7-bit address. When an
address is received, it is compared to the 7 Least
Significant bits of the I2CADD register.
If the A10M bit is ‘1’, the address is assumed to be a
10-bit address. When an address is received, it will be
compared with the binary value ‘1 1 1 1 0 A9 A8’
(where A9, A8 are two Most Significant bits of
I2CADD). If that value matches, the next address will
be compared with the Least Significant 8 bits of
I2CADD, as specified in the 10-bit addressing protocol.
TABLE 17-1:
17.3.2
SLAVE RECEPTION
If the R_W bit received is a ‘0’ during an address
match, then Receive mode is initiated. Incoming bits
are sampled on the rising edge of SCL. After 8 bits are
received, if I2CRCV is not full or I2COV is not set,
I2CRSR is transferred to I2CRCV. ACK is sent on the
ninth clock.
If the RBF flag is set, indicating that I2CRCV is still
holding data from a previous operation (RBF = 1), then
ACK is not sent; however, the interrupt pulse is
generated. In the case of an overflow, the contents of
the I2CRSR are not loaded into the I2CRCV.
Note:
7-BIT I2C™ SLAVE
ADDRESSES SUPPORTED BY
dsPIC30F
The I2CRCV will be loaded if the I2COV
bit = 1 and the RBF flag = 0. In this case,
a read of the I2CRCV was performed, but
the user did not clear the state of the
I2COV bit before the next receive
occurred. The Acknowledgement is not
sent (ACK = 1) and the I2CRCV is
updated.
0x00
General call address or start byte
0x01-0x03
Reserved
0x04-0x07
HS-mode Master codes
17.4
0x04-0x77
Valid 7-bit addresses
0x78-0x7b
Valid 10-bit addresses (lower 7
bits)
In 10-bit mode, the basic receive and transmit
operations are the same as in the 7-bit mode. However,
the criteria for address match is more complex.
0x7c-0x7f
Reserved
17.3
I2C 7-bit Slave Mode Operation
Once enabled (I2CEN = 1), the slave module will wait
for a Start bit to occur (i.e., the I2C module is ‘Idle’).
Following the detection of a Start bit, 8 bits are shifted
into I2CRSR and the address is compared against
I2CADD. In 7-bit mode (A10M = 0), bits I2CADD<6:0>
are compared against I2CRSR<7:1> and I2CRSR<0>
is the R_W bit. All incoming bits are sampled on the
rising edge of SCL.
If an address match occurs, an Acknowledgement will
be sent, and the Slave Event Interrupt Flag (SI2CIF) is
set on the falling edge of the ninth (ACK) bit. The
address match does not affect the contents of the
I2CRCV buffer or the RBF bit.
17.3.1
SLAVE TRANSMISSION
If the R_W bit received is a ‘1’, then the serial port will
go into Transmit mode. It will send ACK on the ninth bit
and then hold SCL to ‘0’ until the CPU responds by
writing to I2CTRN. SCL is released by setting the
SCLREL bit, and 8 bits of data are shifted out. Data bits
are shifted out on the falling edge of SCL, such that
SDA is valid during SCL high (see timing diagram). The
interrupt pulse is sent on the falling edge of the ninth
clock pulse, regardless of the status of the ACK
received from the master.
© 2008 Microchip Technology Inc.
I2C 10-bit Slave Mode Operation
The I2C specification dictates that a slave must be
addressed for a write operation, with two address bytes
following a Start bit.
The A10M bit is a control bit that signifies that the
address in I2CADD is a 10-bit address rather than a
7-bit address. The address detection protocol for the
first byte of a message address is identical for 7-bit
and 10-bit messages, but the bits being compared are
different.
I2CADD holds the entire 10-bit address. Upon receiving an address following a Start bit, I2CRSR <7:3> is
compared against a literal ‘11110’ (the default 10-bit
address) and I2CRSR<2:1> are compared against
I2CADD<9:8>. If a match occurs and if R_W = 0, the
interrupt pulse is sent. The ADD10 bit will be cleared to
indicate a partial address match. If a match fails or
R_W = 1, the ADD10 bit is cleared and the module
returns to the Idle state.
The low byte of the address is then received and
compared with I2CADD<7:0>. If an address match
occurs, the interrupt pulse is generated and the ADD10
bit is set, indicating a complete 10-bit address match. If
an address match did not occur, the ADD10 bit is
cleared and the module returns to the Idle state.
DS70150D-page 111
dsPIC30F6010A/6015
17.4.1
10-BIT MODE SLAVE
TRANSMISSION
Once a slave is addressed in this fashion, with the full
10-bit address (this state is referred as
“PRIOR_ADDR_MATCH”), the master can begin
sending data bytes for a slave reception operation.
17.4.2
10-BIT MODE SLAVE RECEPTION
Once addressed, the master can generate a Repeated
Start, reset the high byte of the address and set the
R_W bit without generating a Stop bit, thus initiating a
slave transmit operation.
17.5
Automatic Clock Stretch
In the slave modes, the module can synchronize buffer
reads and write to the master device by clock
stretching.
17.5.1
TRANSMIT CLOCK STRETCHING
Both 10-bit and 7-bit Transmit modes implement clock
stretching by asserting the SCLREL bit after the falling
edge of the ninth clock if the TBF bit is cleared,
indicating the buffer is empty.
17.5.3
When the STREN bit is set in Slave Receive mode,
the SCL line is held low when the buffer register is full.
The method for stretching the SCL output is the same
for both 7 and 10-bit addressing modes.
Clock stretching takes place following the ninth clock of
the receive sequence. On the falling edge of the ninth
clock at the end of the ACK sequence, if the RBF bit is
set, the SCLREL bit is automatically cleared, forcing the
SCL output to be held low. The user’s ISR must set the
SCLREL bit before reception is allowed to continue. By
holding the SCL line low, the user has time to service
the ISR and read the contents of the I2CRCV before the
master device can initiate another receive sequence.
This will prevent buffer overruns from occurring.
Note 1: If the user reads the contents of the
I2CRCV, clearing the RBF bit before the
falling edge of the ninth clock, the
SCLREL bit will not be cleared and clock
stretching will not occur.
2: The SCLREL bit can be set in software,
regardless of the state of the RBF bit. The
user should be careful to clear the RBF bit
in the ISR before the next receive
sequence in order to prevent an overflow
condition.
In Slave Transmit modes, clock stretching is always
performed, irrespective of the STREN bit.
Clock synchronization takes place following the ninth
clock of the transmit sequence. If the device samples
an ACK on the falling edge of the ninth clock, and if the
TBF bit is still clear, then the SCLREL bit is
automatically cleared. The SCLREL being cleared to
‘0’ will assert the SCL line low. The user’s ISR must
set the SCLREL bit before transmission is allowed to
continue. By holding the SCL line low, the user has
time to service the ISR and load the contents of the
I2CTRN before the master device can initiate another
transmit sequence.
Note 1: If the user loads the contents of I2CTRN,
setting the TBF bit before the falling edge
of the ninth clock, the SCLREL bit will not
be cleared and clock stretching will not
occur.
2: The SCLREL bit can be set in software,
regardless of the state of the TBF bit.
17.5.2
RECEIVE CLOCK STRETCHING
The STREN bit in the I2CCON register can be used to
enable clock stretching in Slave Receive mode. When
the STREN bit is set, the SCL pin will be held low at
the end of each data receive sequence.
CLOCK STRETCHING DURING
7-BIT ADDRESSING (STREN = 1)
17.5.4
CLOCK STRETCHING DURING
10-BIT ADDRESSING (STREN = 1)
Clock stretching takes place automatically during the
addressing sequence. Because this module has a
register for the entire address, it is not necessary for
the protocol to wait for the address to be updated.
After the address phase is complete, clock stretching
will occur on each data receive or transmit sequence
as was described earlier.
17.6
Software Controlled Clock
Stretching (STREN = 1)
When the STREN bit is ‘1’, the SCLREL bit may be
cleared by software to allow software to control the
clock stretching. The logic will synchronize writes to
the SCLREL bit with the SCL clock. Clearing the
SCLREL bit will not assert the SCL output until the
module detects a falling edge on the SCL output and
SCL is sampled low. If the SCLREL bit is cleared by
the user while the SCL line has been sampled low, the
SCL output will be asserted (held low). The SCL output will remain low until the SCLREL bit is set, and all
other devices on the I2C bus have de-asserted SCL.
This ensures that a write to the SCLREL bit will not
violate the minimum high time requirement for SCL.
If the STREN bit is ‘0’, a software write to the SCLREL
bit will be disregarded and have no effect on the
SCLREL bit.
DS70150D-page 112
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
17.7
Interrupts
The I2C module generates two interrupt flags, MI2CIF
(I2C Master Interrupt Flag) and SI2CIF (I2C Slave
Interrupt Flag). The MI2CIF interrupt flag is activated
on completion of a master message event. The SI2CIF
interrupt flag is activated on detection of a message
directed to the slave.
17.8
Slope Control
The I2C standard requires slope control on the SDA
and SCL signals for Fast Mode (400 kHz). The control
bit, DISSLW, enables the user to disable slew rate
control, if desired. It is necessary to disable the slew
rate control for 1 MHz mode.
17.9
IPMI Support
The control bit, IPMIEN, enables the module to support
Intelligent Peripheral Management Interface (IPMI).
When this bit is set, the module accepts and acts upon
all addresses.
17.10 General Call Address Support
The general call address can address all devices. When
this address is used, all devices should, in theory,
respond with an acknowledgement.
The general call address is one of eight addresses
reserved for specific purposes by the I2C protocol. It
consists of all ‘0’s with R_W = 0.
The general call address is recognized when the
General Call Enable (GCEN) bit is set
(I2CCON<7> = 1). Following a Start bit detection, 8 bits
are shifted into I2CRSR and the address is compared
with I2CADD, and is also compared with the general
call address which is fixed in hardware.
If a general call address match occurs, the I2CRSR is
transferred to the I2CRCV after the eighth clock, the
RBF flag is set, and on the falling edge of the ninth bit
(ACK bit), the Master Event Interrupt Flag (MI2CIF) is
set.
When the interrupt is serviced, the source for the
interrupt can be checked by reading the contents of the
I2CRCV to determine if the address was
device-specific, or a general call address.
17.11 I2C Master Support
As a Master device, six operations are supported.
• Assert a Start condition on SDA and SCL.
• Assert a Restart condition on SDA and SCL.
• Write to the I2CTRN register initiating
transmission of data/address.
• Generate a Stop condition on SDA and SCL.
• Configure the I2C port to receive data.
• Generate an ACK condition at the end of a
received byte of data.
© 2008 Microchip Technology Inc.
17.12 I2C Master Operation
The master device generates all of the serial clock
pulses and the Start and Stop conditions. A transfer is
ended with a Stop condition or with a Repeated Start
condition. Since the Repeated Start condition is also
the beginning of the next serial transfer, the I2C bus will
not be released.
In Master Transmitter mode, serial data is output
through SDA, while SCL outputs the serial clock. The
first byte transmitted contains the slave address of the
receiving device (7 bits) and the data direction bit. In
this case, the data direction bit (R_W) is logic ‘0’. Serial
data is transmitted 8 bits at a time. After each byte is
transmitted, an ACK bit is received. Start and Stop
conditions are output to indicate the beginning and the
end of a serial transfer.
In Master Receive mode, the first byte transmitted
contains the slave address of the transmitting device
(7 bits) and the data direction bit. In this case, the data
direction bit (R_W) is logic ‘1’. Thus, the first byte
transmitted is a 7-bit slave address, followed by a ‘1’ to
indicate receive bit. Serial data is received via SDA,
while SCL outputs the serial clock. Serial data is
received 8 bits at a time. After each byte is received, an
ACK bit is transmitted. Start and Stop conditions
indicate the beginning and end of transmission.
17.12.1
I2C MASTER TRANSMISSION
Transmission of a data byte, a 7-bit address, or the second half of a 10-bit address is accomplished by simply
writing a value to I2CTRN register. The user should
only write to I2CTRN when the module is in a WAIT
state. This action will set the buffer full flag (TBF) and
allow the Baud Rate Generator to begin counting and
start the next transmission. Each bit of address/data
will be shifted out onto the SDA pin after the falling
edge of SCL is asserted. The Transmit Status Flag,
TRSTAT (I2CSTAT<14>), indicates that a master
transmit is in progress.
17.12.2
I2C MASTER RECEPTION
Master mode reception is enabled by programming the
Receive Enable (RCEN) bit (I2CCON<3>). The I2C
module must be idle before the RCEN bit is set, otherwise the RCEN bit will be disregarded. The Baud Rate
Generator begins counting, and on each rollover, the
state of the SCL pin toggles, and data is shifted in to the
I2CRSR on the rising edge of each clock.
17.12.3
BAUD RATE GENERATOR
I2C
In
Master mode, the reload value for the BRG is
located in the I2CBRG register. When the BRG is
loaded with this value, the BRG counts down to ‘0’ and
stops until another reload has taken place. If clock
arbitration is taking place, for instance, the BRG is
reloaded when the SCL pin is sampled high.
DS70150D-page 113
dsPIC30F6010A/6015
As per the I2C standard, FSCL may be 100 kHz or
400 kHz. However, the user can specify any baud rate
up to 1 MHz. I2CBRG values of ‘0’ or ‘1’ are illegal.
The Master will continue to monitor the SDA and SCL
pins, and if a Stop condition occurs, the MI2CIF bit will
be set.
EQUATION 17-1:
A write to the I2CTRN will start the transmission of data
at the first data bit, regardless of where the transmitter
left off when bus collision occurred.
SERIAL CLOCK RATE
F CY
F CY
I2CBRG = ⎛ ------------- – ---------------------------⎞ – 1
⎝ F SCL 1, 111, 111⎠
17.12.4
CLOCK ARBITRATION
Clock arbitration occurs when the master de-asserts
the SCL pin (SCL allowed to float high) during any
receive, transmit, or Restart/Stop condition. When the
SCL pin is allowed to float high, the Baud Rate
Generator (BRG) is suspended from counting until the
SCL pin is actually sampled high. When the SCL pin is
sampled high, the Baud Rate Generator is reloaded
with the contents of I2CBRG and begins counting. This
ensures that the SCL high time will always be at least
one BRG rollover count in the event that the clock is
held low by an external device.
17.12.5
MULTI-MASTER COMMUNICATION,
BUS COLLISION AND BUS
ARBITRATION
Multi-Master operation support is achieved by bus
arbitration. When the master outputs address/data bits
onto the SDA pin, arbitration takes place when the
master outputs a ‘1’ on SDA, by letting SDA float high
while another master asserts a ‘0’. When the SCL pin
floats high, data should be stable. If the expected data
on SDA is a ‘1’ and the data sampled on the SDA
pin = 0, then a bus collision has taken place. The
master will set the MI2CIF pulse and reset the master
portion of the I2C port to its Idle state.
In a Multi-Master environment, the interrupt generation
on the detection of Start and Stop conditions allows the
determination of when the bus is free. Control of the I2C
bus can be taken when the P bit is set in the I2CSTAT
register, or the bus is Idle and the S and P bits are
cleared.
17.13 I2C Module Operation During CPU
Sleep and Idle Modes
17.13.1
I2C OPERATION DURING CPU
SLEEP MODE
When the device enters Sleep mode, all clock sources
to the module are shutdown and stay at logic ‘0’. If
Sleep occurs in the middle of a transmission, and the
state machine is partially into a transmission as the
clocks stop, then the transmission is aborted. Similarly,
if Sleep occurs in the middle of a reception, then the
reception is aborted.
17.13.2
I2C OPERATION DURING CPU IDLE
MODE
For the I2C, the I2CSIDL bit selects if the module will
stop on Idle or continue on Idle. If I2CSIDL = 0, the
module will continue operation on assertion of the Idle
mode. If I2CSIDL = 1, the module will stop on Idle.
If a transmit was in progress when the bus collision
occurred, the transmission is halted, the TBF flag is
cleared, the SDA and SCL lines are de-asserted, and a
value can now be written to I2CTRN. When the user
services the I2C master event Interrupt Service
Routine, if the I2C bus is free (i.e., the P bit is set), the
user can resume communication by asserting a Start
condition.
If a Start, Restart, Stop or Acknowledge condition was
in progress when the bus collision occurred, the
condition is aborted, the SDA and SCL lines are
de-asserted, and the respective control bits in the
I2CCON register are cleared to 0. When the user
services the bus collision Interrupt Service Routine,
and if the I2C bus is free, the user can resume
communication by asserting a Start condition.
DS70150D-page 114
© 2008 Microchip Technology Inc.
© 2008 Microchip Technology Inc.
TABLE 17-2:
SFR Name Addr.
I2C™ REGISTER MAP(1)
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
—
—
—
—
—
—
—
Receive Register
0000 0000 0000 0000
—
Transmit Register
0000 0000 1111 1111
I2CRCV
0200
—
I2CTRN
0202
—
—
—
—
—
—
—
0204
—
—
—
—
—
—
—
I2CBRG
Bit 7
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Baud Rate Generator
I2CCON
0206
I2CEN
—
I2CSTAT
0208
I2CADD
Legend:
Note 1:
ACKSTAT
—
TRSTAT
—
—
—
—
020A
— = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
I2CSIDL SCLREL IPMIEN
—
—
—
Bit 6
Reset State
0000 0000 0000 0000
A10M
DISSLW
SMEN
GCEN
STREN
ACKDT
ACKEN
RCEN
PEN
RSEN
SEN
0001 0000 0000 0000
BCL
—
GCSTAT
ADD10
IWCOL
I2COV
D_A
P
S
R_W
RBF
TBF
0000 0000 0000 0000
Address Register
0000 0000 0000 0000
dsPIC30F6010A/6015
DS70150D-page 115
dsPIC30F6010A/6015
NOTES:
DS70150D-page 116
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
18.0
UNIVERSAL ASYNCHRONOUS
RECEIVER TRANSMITTER
(UART) MODULE
Note:
18.1
The key features of the UART module are:
•
•
•
•
This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
“dsPIC30F Family Reference Manual”
(DS70046).
•
•
•
•
•
This section describes the Universal Asynchronous
Receiver/Transmitter Communications module.
•
•
FIGURE 18-1:
UART Module Overview
Full-duplex, 8 or 9-bit data communication
Even, Odd or No Parity options (for 8-bit data)
One or two Stop bits
Fully integrated Baud Rate Generator with 16-bit
prescaler
Baud rates range from 38 bps to 1.875 Mbps at a
30 MHz instruction rate
4-word deep transmit data buffer
4-word deep receive data buffer
Parity, Framing and Buffer Overrun error detection
Support for Interrupt only on Address Detect
(9th bit = 1)
Separate Transmit and Receive Interrupts
Loopback mode for diagnostic support
UART TRANSMITTER BLOCK DIAGRAM
Internal Data Bus
Control and Status bits
Write
UTX8
Write
UxTXREG Low Byte
Transmit Control
– Control TSR
– Control Buffer
– Generate Flags
– Generate Interrupt
Load TSR
UxTXIF
UTXBRK
Data
UxTX
Transmit Shift Register (UxTSR)
‘0’ (Start)
‘1’ (Stop)
Parity
Parity
Generator
16 Divider
16X Baud Clock
from Baud Rate
Generator
Control
Signals
Note: x = 1 or 2.
© 2008 Microchip Technology Inc.
DS70150D-page 117
dsPIC30F6010A/6015
FIGURE 18-2:
UART RECEIVER BLOCK DIAGRAM
Internal Data Bus
16
Write
Read
Read Read
UxMODE
URX8
Write
UxSTA
UxRXREG Low Byte
Receive Buffer Control
– Generate Flags
– Generate Interrupt
– Shift Data Characters
0
· Start bit Detect
· Parity Check
· Stop bit Detect
· Shift Clock Generation
· Wake Logic
Control
Signals
FERR
Load RSR
to Buffer
Receive Shift Register
(UxRSR)
1
UxRX
8-9
PERR
LPBACK
From UxTX
16 Divider
16X Baud Clock from
Baud Rate Generator
UxRXIF
DS70150D-page 118
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
18.2
18.2.1
Enabling and Setting Up UART
ENABLING THE UART
The UART module is enabled by setting the UARTEN
bit in the UxMODE register (where x = 1 or 2). Once
enabled, the UxTX and UxRX pins are configured as an
output and an input respectively, overriding the TRIS
and LAT register bit settings for the corresponding I/O
port pins. The UxTX pin is at logic ‘1’ when no
transmission is taking place.
18.2.2
18.3
18.3.1
1.
2.
3.
Disabling the UART module resets the buffers to
empty states. Any data characters in the buffers are
lost, and the baud rate counter is reset.
All error and status flags associated with the UART
module are reset when the module is disabled. The
URXDA, OERR, FERR, PERR, UTXEN, UTXBRK and
UTXBF bits are cleared, whereas RIDLE and TRMT
are set. Other control bits, including ADDEN,
URXISEL<1:0>, UTXISEL, as well as the UxMODE
and UxBRG registers, are not affected.
Clearing the UARTEN bit while the UART is active will
abort all pending transmissions and receptions and
reset the module as defined above. Re-enabling the
UART will restart the UART in the same configuration.
18.2.3
SETTING UP DATA, PARITY AND
STOP BIT SELECTIONS
Control bits PDSEL<1:0> in the UxMODE register are
used to select the data length and parity used in the
transmission. The data length may either be 8-bits with
even, odd or no parity, or 9-bits with no parity.
The STSEL bit determines whether one or two Stop bits
will be used during data transmission.
The default (power-on) setting of the UART is 8 bits, no
parity, 1 Stop bit (typically represented as 8, N, 1).
TRANSMITTING IN 8-BIT DATA
MODE
The following steps must be performed in order to
transmit 8-bit data:
DISABLING THE UART
The UART module is disabled by clearing the
UARTEN bit in the UxMODE register. This is the
default state after any Reset. If the UART is disabled,
all I/O pins operate as port pins under the control of
the LAT and TRIS bits of the corresponding port pins.
Transmitting Data
Set up the UART:
First, the data length, parity and number of Stop
bits must be selected. Then, the Transmit and
Receive Interrupt Enable and Priority bits are
setup in the UxMODE and UxSTA registers.
Also, the appropriate baud rate value must be
written to the UxBRG register.
Enable the UART by setting the UARTEN bit
(UxMODE<15>).
Set the UTXEN bit (UxSTA<10>), thereby
enabling a transmission.
Note:
4.
5.
The UTXEN bit must be set after the
UARTEN bit is set to enable UART
transmissions.
Write the byte to be transmitted to the lower byte
of UxTXREG. The value will be transferred to the
Transmit Shift Register (UxTSR) immediately
and the serial bit stream will start shifting out
during the next rising edge of the baud clock.
Alternatively, the data byte may be written while
UTXEN = 0, following which, the user may set
UTXEN. This will cause the serial bit stream to
begin immediately because the baud clock will
start from a cleared state.
A transmit interrupt will be generated depending
on the value of the interrupt control bit UTXISEL
(UxSTA<15>).
18.3.2
TRANSMITTING IN 9-BIT DATA
MODE
The sequence of steps involved in the transmission of
9-bit data is similar to 8-bit transmission, except that a
16-bit data word (of which the upper 7 bits are always
clear) must be written to the UxTXREG register.
18.3.3
TRANSMIT BUFFER (UXTXB)
The transmit buffer is 9-bits wide and 4 characters
deep. Including the Transmit Shift Register (UxTSR),
the user effectively has a 5-deep FIFO (First-In, FirstOut) buffer. The UTXBF Status bit (UxSTA<9>)
indicates whether the transmit buffer is full.
If a user attempts to write to a full buffer, the new data
will not be accepted into the FIFO, and no data shift
will occur within the buffer. This enables recovery from
a buffer overrun condition.
The FIFO is reset during any device Reset, but is not
affected when the device enters or wakes up from a
Power-Saving mode.
© 2008 Microchip Technology Inc.
DS70150D-page 119
dsPIC30F6010A/6015
18.3.4
TRANSMIT INTERRUPT
The Transmit Interrupt Flag (U1TXIF or U2TXIF) is
located in the corresponding interrupt flag register.
The transmitter generates an edge to set the UxTXIF
bit. The condition for generating the interrupt depends
on UTXISEL control bit:
a)
b)
If UTXISEL = 0, an interrupt is generated when
a word is transferred from the transmit buffer to
the Transmit Shift Register (UxTSR). This
means that the transmit buffer has at least one
empty word.
If UTXISEL = 1, an interrupt is generated when
a word is transferred from the transmit buffer to
the Transmit Shift Register (UxTSR) and the
transmit buffer is empty.
Switching between the two interrupt modes during
operation is possible and sometimes offers more
flexibility.
18.3.5
TRANSMIT BREAK
18.4.2
RECEIVE BUFFER (UXRXB)
The receive buffer is 4 words deep. Including the
Receive Shift Register (UxRSR), the user effectively
has a 5-word deep FIFO buffer.
URXDA (UxSTA<0>) = 1 indicates that the receive
buffer has data available. URXDA = 0 means that the
buffer is empty. If a user attempts to read an empty
buffer, the old values in the buffer will be read and no
data shift will occur within the FIFO.
The FIFO is reset during any device Reset. It is not
affected when the device enters or wakes up from a
Power-Saving mode.
18.4.3
RECEIVE INTERRUPT
The Receive Interrupt Flag (U1RXIF or U2RXIF) can
be read from the corresponding interrupt flag register.
The interrupt flag is set by an edge generated by the
receiver. The condition for setting the receive interrupt
flag depends on the settings specified by the
URXISEL<1:0> (UxSTA<7:6>) control bits.
Setting the UTXBRK bit (UxSTA<11>) will cause the
UxTX line to be driven to logic ‘0’. The UTXBRK bit
overrides all transmission activity. Therefore, the user
should generally wait for the transmitter to be Idle
before setting UTXBRK.
a)
To send a Break character, the UTXBRK bit must be
set by software and must remain set for a minimum of
13 baud clock cycles. The UTXBRK bit is then cleared
by software to generate Stop bits. The user must wait
for a duration of at least one or two baud clock cycles
in order to ensure a valid Stop bit(s) before reloading
the UxTXB or starting other transmitter activity.
Transmission of a Break character does not generate
a transmit interrupt.
b)
18.4
Switching between the interrupt modes during
operation is possible, though generally not advisable
during normal operation.
18.4.1
Receiving Data
RECEIVING IN 8-BIT OR 9-BIT DATA
MODE
The following steps must be performed while receiving
8-bit or 9-bit data:
1.
2.
3.
4.
Set up and enable the UART (see Section 18.3
"Transmitting Data").
A receive interrupt will be generated when one
or more data words have been received,
depending on the receive interrupt settings
specified by the URXISEL bits (UxSTA<7:6>).
Read the OERR bit to determine if an overrun
error has occurred. The OERR bit must be reset
in software.
Read the received data from UxRXREG. The act
of reading UxRXREG will move the next word to
the top of the receive FIFO, and the PERR and
FERR values will be updated.
DS70150D-page 120
c)
If URXISEL<1:0> = 00 or 01, an interrupt is
generated every time a data word is transferred
from the Receive Shift Register (UxRSR) to the
receive buffer. There may be one or more
characters in the receive buffer.
If URXISEL<1:0> = 10, an interrupt is generated
when a word is transferred from the Receive
Shift Register (UxRSR) to the receive buffer,
which, as a result of the transfer, contains
3 characters.
If URXISEL<1:0> = 11, an interrupt is set when
a word is transferred from the Receive Shift
Register (UxRSR) to the receive buffer, which,
as a result of the transfer, contains 4 characters
(i.e., becomes full).
18.5
18.5.1
Reception Error Handling
RECEIVE BUFFER OVERRUN
ERROR (OERR BIT)
The OERR bit (UxSTA<1>) is set if all of the following
conditions occur:
a)
b)
c)
The receive buffer is full.
The Receive Shift Register is full, but unable to
transfer the character to the receive buffer.
The Stop bit of the character in the UxRSR is
detected, indicating that the UxRSR needs to
transfer the character to the buffer.
Once OERR is set, no further data is shifted in UxRSR
(until the OERR bit is cleared in software or a Reset
occurs). The data held in UxRSR and UxRXREG
remains valid.
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
18.5.2
FRAMING ERROR (FERR)
The FERR bit (UxSTA<2>) is set if a ‘0’ is detected
instead of a Stop bit. If two Stop bits are selected, both
Stop bits must be ‘1’, otherwise FERR will be set. The
read-only FERR bit is buffered along with the received
data. It is cleared on any Reset.
18.5.3
PARITY ERROR (PERR)
The PERR bit (UxSTA<3>) is set if the parity of the
received word is incorrect. This error bit is applicable
only if a Parity mode (odd or even) is selected. The
read-only PERR bit is buffered along with the received
data bytes. It is cleared on any Reset.
18.5.4
IDLE STATUS
When the receiver is active (i.e., between the initial
detection of the Start bit and the completion of the Stop
bit), the RIDLE bit (UxSTA<4>) is ‘0’. Between the
completion of the Stop bit and detection of the next
Start bit, the RIDLE bit is ‘1’, indicating that the UART
is Idle.
18.5.5
RECEIVE BREAK
The receiver will count and expect a certain number of
bit times based on the values programmed in the
PDSEL (UxMODE<2:1>) and STSEL (UxMODE<0>)
bits.
If the break is longer than 13 bit times, the reception is
considered complete after the number of bit times
specified by PDSEL and STSEL. The URXDA bit is
set, FERR is set, zeros are loaded into the receive
FIFO, interrupts are generated, if appropriate, and the
RIDLE bit is set.
When the module receives a long break signal and the
receiver has detected the Start bit, the data bits and
the invalid Stop bit (which sets the FERR), the receiver
must wait for a valid Stop bit before looking for the next
Start bit. It cannot assume that the break condition on
the line is the next Start bit.
Break is regarded as a character containing all ‘0’s,
with the FERR bit set. The Break character is loaded
into the buffer. No further reception can occur until a
Stop bit is received. Note that RIDLE goes high when
the Stop bit has not been received yet.
18.6
Address Detect Mode
Setting the ADDEN bit (UxSTA<5>) enables this
special mode, in which a 9th bit (URX8) value of ‘1’
identifies the received word as an address rather than
data. This mode is only applicable for 9-bit data communication. The URXISEL control bit does not have
any impact on interrupt generation in this mode, since
an interrupt (if enabled) will be generated every time
the received word has the 9th bit set.
18.7
Loopback Mode
Setting the LPBACK bit enables this special mode in
which the UxTX pin is internally connected to the UxRX
pin. When configured for the Loopback mode, the
UxRX pin is disconnected from the internal UART
receive logic. However, the UxTX pin still functions as
in a normal operation.
To select this mode:
a)
b)
c)
Configure UART for desired mode of operation.
Set LPBACK = 1 to enable Loopback mode.
Enable transmission as defined in Section 18.3
“Transmitting Data”.
18.8
Baud Rate Generator (BRG)
The UART has a 16-bit Baud Rate Generator to allow
maximum flexibility in baud rate generation. The Baud
Rate Generator register (UxBRG) is readable and
writable. The baud rate is computed as follows:
BRG = 16-bit value held in UxBRG register
(0 through 65535)
FCY = Instruction Clock Rate (1/TCY)
The baud rate is given by Equation 18-1.
EQUATION 18-1:
BAUD RATE
Baud Rate = FCY/(16 * (BRG + 1))
Therefore, maximum baud rate possible is
FCY/16 (if BRG = 0),
and the minimum baud rate possible is
FCY/(16 * 65536).
With a full 16-bit Baud Rate Generator, at 30 MIPS
operation, the minimum baud rate achievable is
28.5 bps.
© 2008 Microchip Technology Inc.
DS70150D-page 121
dsPIC30F6010A/6015
18.9
Auto-Baud Support
To allow the system to determine baud rates of
received characters, the input can be optionally linked
to a selected capture input. To enable this mode, the
user must program the input capture module to detect
the falling and rising edges of the Start bit.
18.10.2
UART OPERATION DURING CPU
IDLE MODE
For the UART, the USIDL bit selects if the module will
stop operation when the device enters Idle mode, or
whether the module will continue on Idle. If USIDL = 0,
the module will continue operation during Idle mode. If
USIDL = 1, the module will stop on Idle.
18.10 UART Operation During CPU
Sleep and Idle Modes
18.10.1
UART OPERATION DURING CPU
SLEEP MODE
When the device enters Sleep mode, all clock sources
to the module are shut down and stay at logic ‘0’. If
entry into Sleep mode occurs while a transmission is
in progress, then the transmission is aborted. The
UxTX pin is driven to logic ‘1’. Similarly, if entry into
Sleep mode occurs while a reception is in progress,
then the reception is aborted. The UxSTA, UxMODE,
Transmit and Receive registers and buffers, and the
UxBRG register are not affected by Sleep mode.
If the Wake bit (UxMODE<7>) is set before the device
enters Sleep mode, then a falling edge on the UxRX
pin will generate a receive interrupt. The Receive
Interrupt Select Mode bit (URXISEL) has no effect for
this function. If the receive interrupt is enabled, then
this will wake-up the device from Sleep. The UARTEN
bit must be set in order to generate a wake-up
interrupt.
DS70150D-page 122
© 2008 Microchip Technology Inc.
© 2008 Microchip Technology Inc.
TABLE 18-1:
UART1 REGISTER MAP(1)
SFR Name Addr.
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 8
Bit 7
020C
UARTEN
—
USIDL
—
020E
UTXISEL
—
—
—
U1TXREG
0210
—
—
—
—
—
U1RXREG
0212
—
—
—
—
—
U1BRG
Legend:
Note 1:
0214
Baud Rate Generator Prescaler
u = uninitialized bit; — = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
Addr.
LPBACK
Bit 5
Bit 4
ABAUD
Bit 3
—
—
PERR
Bit 1
Bit 0
Reset State
PDSEL1 PDSEL0 STSEL 0000 0000 0000 0000
—
—
TRMT
—
—
UTX8
Transmit Register
0000 000u uuuu uuuu
—
—
URX8
Receive Register
0000 0000 0000 0000
URXISEL1 URXISEL0 ADDEN
RIDLE
Bit 2
UTXBF
UTXBRK UTXEN
WAKE
Bit 6
U1STA
SFR
Name
—
Bit 9
U1MODE
TABLE 18-2:
—
Bit 10
FERR
OERR
URXDA 0000 0001 0001 0000
0000 0000 0000 0000
UART2 REGISTER MAP(1)
Bit 15
Bit 14
Bit 13
Bit 12
U2MODE
0216
UARTEN
—
USIDL
—
U2STA
0218
UTXISEL
—
—
—
Bit 11
Bit 10
—
—
UTXBRK UTXEN
Bit 9
Bit 8
—
—
UTXBF
TRMT
Bit 7
Bit 6
Bit 5
Bit 4
WAKE
LPBACK
ABAUD
URXISEL1 URXISEL0 ADDEN
Bit 3
—
—
RIDLE
PERR
Bit 2
Bit 1
PDSEL1 PDSEL0
FERR
OERR
Bit 0
Reset State
STSEL 0000 0000 0000 0000
URXDA 0000 0001 0001 0000
U2TXREG
021A
—
—
—
—
—
—
—
UTX8
Transmit Register
0000 000u uuuu uuuu
U2RXREG
021C
—
—
—
—
—
—
—
URX8
Receive Register
0000 0000 0000 0000
U2BRG
Legend:
Note 1:
021E
Baud Rate Generator Prescaler
u = uninitialized bit; — = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
0000 0000 0000 0000
dsPIC30F6010A/6015
DS70150D-page 123
dsPIC30F6010A/6015
NOTES:
DS70150D-page 124
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
19.0
Note:
19.1
CAN MODULE
This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
“dsPIC30F Family Reference Manual”
(DS70046).
Overview
The Controller Area Network (CAN) module is a serial
interface, useful for communicating with other CAN
modules
or
microcontroller
devices.
This
interface/protocol was designed to allow communications within noisy environments. The dsPIC30F6010A
has two CAN modules. The dsPIC30F6015 has only
one.
The CAN module is a communication controller
implementing the CAN 2.0 A/B protocol, as defined in
the BOSCH specification. The module will support
CAN 1.2, CAN 2.0A, CAN2.0B Passive and CAN 2.0B
Active versions of the protocol. The module
implementation is a full CAN system. The CAN
specification is not covered within this data sheet. The
reader may refer to the BOSCH CAN specification for
further details.
• Low-Power Sleep and Idle mode
The CAN bus module consists of a protocol engine,
and message buffering/control. The CAN protocol
engine handles all functions for receiving and
transmitting messages on the CAN bus. Messages are
transmitted by first loading the appropriate data
registers. Status and errors can be checked by reading
the appropriate registers. Any message detected on
the CAN bus is checked for errors and then matched
against filters to see if it should be received and stored
in one of the receive registers.
19.2
Frame Types
The CAN module transmits various types of frames,
which include data messages or remote transmission
requests initiated by the user as other frames that are
automatically generated for control purposes. The
following frame types are supported:
• Standard Data Frame
A Standard Data Frame is generated by a node when
the node wishes to transmit data. It includes a 11-bit
Standard Identifier (SID), but not an 18-bit Extended
Identifier (EID).
• Extended Data Frame
An Extended Data Frame is similar to a Standard Data
Frame, but includes an Extended Identifier as well.
The module features are as follows:
• Remote Frame
• Implementation of the CAN protocol CAN 1.2,
CAN 2.0A and CAN 2.0B
• Standard and extended data frames
• 0-8 bytes data length
• Programmable bit rate up to 1 Mbit/sec
• Support for remote frames
• Double-buffered receiver with two prioritized
received message storage buffers (each buffer
may contain up to 8 bytes of data)
• 6 full (standard/extended identifier) acceptance
filters, 2 associated with the high priority receive
buffer, and 4 associated with the low priority
receive buffer
• 2 full acceptance filter masks, one each associated with the high and low priority receive buffers
• Three transmit buffers with application specified
prioritization and abort capability (each buffer may
contain up to 8 bytes of data)
• Programmable wake-up functionality with
integrated low-pass filter
• Programmable Loopback mode supports self-test
operation
• Signaling via interrupt capabilities for all CAN
receiver and transmitter error states
• Programmable clock source
• Programmable link to timer module for
time-stamping and network synchronization
It is possible for a destination node to request the data
from the source. For this purpose, the destination node
sends a Remote Frame with an identifier that matches
the identifier of the required Data Frame. The
appropriate data source node will then send a Data
Frame as a response to this remote request.
© 2008 Microchip Technology Inc.
• Error Frame
An Error Frame is generated by any node that detects
a bus error. An error frame consists of 2 fields: an Error
Flag field and an Error Delimiter field.
• Overload Frame
An Overload Frame can be generated by a node as a
result of 2 conditions. First, the node detects a
dominant bit during lnterframe Space, which is an
illegal condition. Second, due to internal conditions, the
node is not yet able to start reception of the next
message. A node may generate a maximum of 2
sequential Overload Frames to delay the start of the
next message.
• Interframe Space
Interframe Space separates a proceeding frame (of
whatever type) from a following Data or Remote
Frame.
DS70150D-page 125
dsPIC30F6010A/6015
FIGURE 19-1:
CAN BUFFERS AND PROTOCOL ENGINE BLOCK DIAGRAM
Acceptance Mask
RXM1
BUFFERS
Acceptance Filter
RXF2
MESSAGE
MSGREQ
TXABT
TXLARB
TXERR
MTXBUFF
TXB2
MESSAGE
MSGREQ
TXABT
TXLARB
TXERR
MTXBUFF
TXB1
MESSAGE
MSGREQ
TXABT
TXLARB
TXERR
MTXBUFF
TXB0
A
c
c
e
p
t
Acceptance Mask
RXM0
Acceptance Filter
RXF3
Acceptance Filter
RXF0
Acceptance Filter
RXF4
Acceptance Filter
RXF1
Acceptance Filter
RXF5
R
X
B
0
Message
Queue
Control
Identifier
M
A
B
Data Field
Transmit Byte Sequencer
Data Field
PROTOCOL
ENGINE
Note 1.
RERRCNT
TERRCNT
Transmit
Error
Counter
CRC Generator
R
X
B
1
Identifier
Receive
Error
Counter
Transmit Shift
A
c
c
e
p
t
ErrPas
BusOff
Receive Shift
Protocol
Finite
State
Machine
CRC Check
Transmit
Logic
Bit
Timing
Logic
CiTX(1)
CiRX(1)
Bit Timing
Generator
i = 1 or 2 refers to a particular CAN module (CAN1 or CAN2).
The dsPIC30F6015 has only one CAN module.
DS70150D-page 126
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
19.3
Modes of Operation
The CAN module can operate in one of several operation
modes selected by the user. These modes include:
•
•
•
•
•
•
Initialization mode
Disable mode
Normal Operation mode
Listen-Only mode
Loopback mode
Error Recognition mode
The module can be programmed to apply a low-pass
filter function to the CiRX input line while the module or
the CPU is in Sleep mode. The WAKFIL bit
(CiCFG2<14>) enables or disables the filter.
Note:
Modes are requested by setting the REQOP<2:0>
bits (CiCTRL<10:8>). Entry into a mode is
acknowledged by monitoring the OPMODE<2:0> bits
(CiCTRL<7:5>). The module will not change the mode
and the OPMODE bits until a change in mode is
acceptable, generally during bus idle time which is
defined as at least 11 consecutive recessive bits.
19.3.1
INITIALIZATION MODE
In the Initialization mode, the module will not transmit or
receive. The error counters are cleared and the
interrupt flags remain unchanged. The programmer will
have access to Configuration registers that are access
restricted in other modes. The module will protect the
user from accidentally violating the CAN protocol
through programming errors. All registers which control
the configuration of the module can not be modified
while the module is on-line. The CAN module will not
be allowed to enter the Configuration mode while a
transmission is taking place. The Configuration mode
serves as a lock to protect the following registers:
•
•
•
•
•
All Module Control Registers
Baud Rate and Interrupt Configuration Registers
Bus Timing Registers
Identifier Acceptance Filter Registers
Identifier Acceptance Mask Registers
19.3.2
DISABLE MODE
In Disable mode, the module will not transmit or
receive. The module has the ability to set the WAKIF bit
due to bus activity, however any pending interrupts will
remain and the error counters will retain their value.
If the REQOP<2:0> bits (CiCTRL<10:8>) = 001, the
module will enter the Module Disable mode. If the
module is active, the module will wait for 11 recessive
bits on the CAN bus, detect that condition as an idle
bus, then accept the module disable command. When
the OPMODE<2:0> bits (CiCTRL<7:5>) = 001, that
indicates whether the module successfully went into
Module Disable mode. The I/O pins will revert to normal
I/O function when the module is in the Module Disable
mode.
© 2008 Microchip Technology Inc.
19.3.3
Typically, if the CAN module is allowed to
transmit in a particular mode of operation
and a transmission is requested
immediately after the CAN module has
been placed in that mode of operation, the
module waits for 11 consecutive recessive
bits on the bus before starting
transmission. If the user switches to
Disable mode within this 11-bit period, then
this transmission is aborted and the
corresponding TXABT bit is set and
TXREQ bit is cleared.
NORMAL OPERATION MODE
Normal Operating mode is selected when
REQOP<2:0> = 000. In this mode, the module is
activated, the I/O pins will assume the CAN bus
functions. The module will transmit and receive CAN
bus messages via the CiTX and CiRX pins.
19.3.4
LISTEN-ONLY MODE
If the Listen-Only mode is activated, the module on the
CAN bus is passive. The transmitter buffers revert to
the Port I/O function. The receive pins remain inputs.
For the receiver, no error flags or acknowledge signals
are sent. The error counters are deactivated in this
state. The Listen-Only mode can be used for detecting
the baud rate on the CAN bus. To use this, it is
necessary that there are at least two further nodes that
communicate with each other.
19.3.5
ERROR RECOGNITION MODE
The module can be set to ignore all errors and receive
any message. The Error Recognition mode is activated
by setting the RXM<1:0> bits (CiRXnCON<6:5>) to
‘11’. In this mode, the data which is in the message
assembly buffer until the time an error occurred, is
copied in the receive buffer and can be read via the
CPU interface.
19.3.6
LOOPBACK MODE
If the Loopback mode is activated, the module will
connect the internal transmit signal to the internal
receive signal at the module boundary. The transmit
and receive pins revert to their Port I/O function.
DS70150D-page 127
dsPIC30F6010A/6015
19.4
19.4.1
Message Reception
RECEIVE BUFFERS
The CAN bus module has 3 receive buffers. However,
one of the receive buffers is always committed to
monitoring the bus for incoming messages. This buffer
is called the Message Assembly Buffer (MAB). So
there are 2 receive buffers visible, RXB0 and RXB1,
that can essentially instantaneously receive a complete
message from the protocol engine.
All messages are assembled by the MAB, and are transferred to the RXBn buffers only if the acceptance filter
criterion is met. When a message is received, the RXnIF
flag (CiINTF<0> or CiINTF<1>) will be set. This bit can
only be set by the module when a message is received.
The bit is cleared by the CPU when it has completed
processing the message in the buffer. If the RXnIE bit
(CiINTE<0> or CiINTE<1>) is set, an interrupt will be
generated when a message is received.
RXF0 and RXF1 filters with RXM0 mask are associated
with RXB0. The filters RXF2, RXF3, RXF4, and RXF5
and the mask RXM1 are associated with RXB1.
19.4.2
MESSAGE ACCEPTANCE FILTERS
The message acceptance filters and masks are used to
determine if a message in the message assembly
buffer should be loaded into either of the receive
buffers. Once a valid message has been received into
the message assembly buffer, the identifier fields of the
message are compared to the filter values. If there is a
match, that message will be loaded into the appropriate
receive buffer.
The acceptance filter looks at incoming messages for
the RXIDE bit (CiRXnSID<0>) to determine how to
compare the identifiers. If the RXIDE bit is clear, the
message is a standard frame, and only filters with the
EXIDE bit (CiRXFnSID<0>) clear are compared. If the
RXIDE bit is set, the message is an extended frame,
and only filters with the EXIDE bit set are compared.
Configuring the RXM<1:0> bits to ‘01’ or ‘10’ can
override the EXIDE bit.
19.4.3
MESSAGE ACCEPTANCE FILTER
MASKS
The mask bits essentially determine which bits to apply
the filter to. If any mask bit is set to a zero, then that bit
will automatically be accepted regardless of the filter
bit. There are 2 programmable acceptance filter masks
associated with the receive buffers, one for each buffer.
19.4.4
RECEIVE OVERRUN
An overrun condition occurs when the message
assembly buffer has assembled a valid received
message and the message is accepted through the
acceptance filters, but the receive buffer associated
with the filter still contains unread data.
The overrun error flag, RXnOVR (CiINTF<15> or
CiINTF<14>) and the ERRIF bit (CiINTF<5>) will be set
and the message in the MAB will be discarded.
If the DBEN bit is clear, RXB1 and RXB0 operate independently. When this is the case, a message intended
for RXB0 will not be diverted into RXB1 if RXB0
contains an unread message and the RX0OVR bit will
be set.
If the DBEN bit is set, the overrun for RXB0 is handled
differently. If a valid message is received for RXB0 and
RXFUL = 1 indicates that RXB0 is full and RXFUL = 0
indicates that RXB1 is empty, the message for RXB0
will be loaded into RXB1. An overrun error will not be
generated for RXB0. If a valid message is received for
RXB0 and RXFUL = 1, and RXFUL = 1 indicating that
both RXB0 and RXB1 are full, the message will be lost
and an overrun will be indicated for RXB1.
19.4.5
RECEIVE ERRORS
The CAN module will detect the following receive
errors:
• Cyclic Redundancy Check (CRC) error
• Bit Stuffing error
• Invalid message receive error
The receive error counter is incremented by one in
case one of these errors occur. The RXWAR bit
(CiINTF<9>) indicates that the Receive Error Counter
has reached the CPU warning limit of 96 and an
interrupt is generated.
19.4.6
RECEIVE INTERRUPTS
Receive interrupts can be divided into 3 major groups,
each including various conditions that generate
interrupts:
• Receive Interrupt
A message has been successfully received and loaded
into one of the receive buffers. This interrupt is
activated immediately after receiving the End-of-Frame
(EOF) field. Reading the RXnIF flag will indicate which
receive buffer caused the interrupt.
• Wake-up Interrupt
The CAN module has woken up from Disable mode or
the device has woken up from Sleep mode.
DS70150D-page 128
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
• Receive Error Interrupts
A receive error interrupt will be indicated by the ERRIF
bit. This bit shows that an error condition occurred. The
source of the error can be determined by checking the
bits in the CAN Interrupt STATUS register, CiINTF.
• Invalid message received
If any type of error occurred during reception of the last
message, an error will be indicated by the IVRIF bit.
• Receiver overrun
The RXnOVR bit indicates that an overrun condition
occurred.
• Receiver warning
The RXWAR bit indicates that the Receive Error
Counter (RERRCNT<7:0>) has reached the Warning
limit of 96.
• Receiver error passive
The RXEP bit indicates that the Receive Error Counter
has exceeded the Error Passive limit of 127 and the
module has gone into Error Passive state.
19.5
19.5.1
Message Transmission
TRANSMIT BUFFERS
The CAN module has three transmit buffers. Each of
the three buffers occupies 14 bytes of data. Eight of the
bytes are the maximum 8 bytes of the transmitted
message. Five bytes hold the standard and extended
identifiers and other message arbitration information.
19.5.2
TRANSMIT MESSAGE PRIORITY
Transmit priority is a prioritization within each node of the
pending transmittable messages. There are 4 levels of
transmit priority. If TXPRI<1:0> (CiTXnCON<1:0>, where
n = 0, 1 or 2 represents a particular transmit buffer) for a
particular message buffer is set to ‘11’, that buffer has the
highest priority. If TXPRI<1:0> for a particular message
buffer is set to ‘10’ or ‘01’, that buffer has an intermediate
priority. If TXPRI<1:0> for a particular message buffer is
‘00’, that buffer has the lowest priority.
19.5.3
TRANSMISSION SEQUENCE
To initiate transmission of the message, the TXREQ bit
(CiTXnCON<3>) must be set. The CAN bus module
resolves any timing conflicts between setting of the
TXREQ bit and the Start-of-Frame (SOF), ensuring
that if the priority was changed, it is resolved correctly
before the SOF occurs. When TXREQ is set, the
TXABT (CiTXnCON<6>), TXLARB (CiTXnCON<5>)
and TXERR (CiTXnCON<4>) flag bits are
automatically cleared.
© 2008 Microchip Technology Inc.
Setting TXREQ bit simply flags a message buffer as
enqueued for transmission. When the module detects
an available bus, it begins transmitting the message
which has been determined to have the highest priority.
If the transmission completes successfully on the first
attempt, the TXREQ bit is cleared automatically and an
interrupt is generated if TXIE was set.
If the message transmission fails, one of the error
condition flags will be set and the TXREQ bit will
remain set indicating that the message is still pending
for transmission. If the message encountered an error
condition during the transmission attempt, the TXERR
bit will be set and the error condition may cause an
interrupt. If the message loses arbitration during the
transmission attempt, the TXLARB bit is set. No
interrupt is generated to signal the loss of arbitration.
19.5.4
ABORTING MESSAGE
TRANSMISSION
The system can also abort a message by clearing the
TXREQ bit associated with each message buffer.
Setting the ABAT bit (CiCTRL<12>) will request an
abort of all pending messages. If the message has not
yet started transmission, or if the message started but
is interrupted by loss of arbitration or an error, the abort
will be processed. The abort is indicated when the
module sets the TXABT bit, and the TXnIF flag is not
automatically set.
19.5.5
TRANSMISSION ERRORS
The CAN module will detect the following transmission
errors:
• Acknowledge error
• Form error
• Bit error
These transmission errors will not necessarily generate
an interrupt, but are indicated by the transmission error
counter. However, each of these errors will cause the
transmission error counter to be incremented by one.
Once the value of the error counter exceeds the value
of 96, the ERRIF (CiINTF<5>) and the TXWAR bit
(CiINTF<10>) are set. Once the value of the error
counter exceeds the value of 96, an interrupt is
generated and the TXWAR bit in the Error Flag register
is set.
DS70150D-page 129
dsPIC30F6010A/6015
19.5.6
19.6
TRANSMIT INTERRUPTS
Baud Rate Setting
Transmit interrupts can be divided into 2 major groups,
each including various conditions that generate
interrupts:
All nodes on any particular CAN bus must have the
same nominal bit rate. In order to set the baud rate, the
following parameters have to be initialized:
• Transmit Interrupt
•
•
•
•
•
•
At least one of the three transmit buffers is empty (not
scheduled) and can be loaded to schedule a message
for transmission. Reading the TXnIF flags will indicate
which transmit buffer is available and caused the
interrupt.
• Transmit Error Interrupts
A transmission error interrupt will be indicated by the
ERRIF flag. This flag shows that an error condition
occurred. The source of the error can be determined by
checking the error flags in the CAN Interrupt STATUS
register, CiINTF. The flags in this register are related to
receive and transmit errors.
• Transmitter Warning Interrupt
The TXWAR bit indicates that the Transmit Error
Counter has reached the CPU warning limit of 96.
• Transmitter Error Passive
The TXEP bit (CiINTF<12>) indicates that the Transmit
Error Counter has exceeded the Error Passive limit of
127 and the module has gone to Error Passive state.
• Bus Off
The TXBO bit (CiINTF<13>) indicates that the Transmit
Error Counter has exceeded 255 and the module has
gone to Bus Off state.
FIGURE 19-2:
Synchronization jump width
Baud rate prescaler
Phase segments
Length determination of Phase2 Seg
Sample point
Propagation segment bits
19.6.1
BIT TIMING
All controllers on the CAN bus must have the same baud
rate and bit length. However, different controllers are not
required to have the same master oscillator clock. At
different clock frequencies of the individual controllers,
the baud rate has to be adjusted by adjusting the
number of time quanta in each segment.
The Nominal Bit Time can be thought of as being
divided into separate non-overlapping time segments.
These segments are shown in Figure 19-2.
•
•
•
•
Synchronization segment (Sync Seg)
Propagation time segment (Prop Seg)
Phase segment 1 (Phase1 Seg)
Phase segment 2 (Phase2 Seg)
The time segments and also the nominal bit time are
made up of integer units of time called time quanta or
TQ. By definition, the nominal bit time has a minimum
of 8 TQ and a maximum of 25 TQ. Also, by definition,
the minimum nominal bit time is 1 μsec, corresponding
to a maximum bit rate of 1 MHz.
CAN BIT TIMING
Input Signal
Sync
Prop
Segment
Phase
Segment 1
Phase
Segment 2
Sync
Sample Point
TQ
DS70150D-page 130
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
19.6.2
PRESCALER SETTING
There is a programmable prescaler, with integral
values ranging from 1 to 64, in addition to a fixed
divide-by-2 for clock generation. The Time Quantum
(TQ) is a fixed unit of time derived from the oscillator
period, and is given by Equation 19-1, where FCAN is
FCY (if the CANCKS bit is set or 4 FCY (if CANCKS is
cleared).
Note:
FCAN must not exceed 30 MHz. If
CANCKS = 0, then FCY must not exceed
7.5 MHz.
EQUATION 19-1:
TIME QUANTUM FOR
CLOCK GENERATION
TQ = 2 ( BRP<5:0> + 1 )/FCAN
19.6.3
PROPAGATION SEGMENT
This part of the bit time is used to compensate physical
delay times within the network. These delay times
consist of the signal propagation time on the bus line
and the internal delay time of the nodes. The
Propagation Segment can be programmed from 1 TQ
to 8 TQ by setting the PRSEG<2:0> bits
(CiCFG2<2:0>).
19.6.4
PHASE SEGMENTS
The phase segments are used to optimally locate the
sampling of the received bit within the transmitted bit
time. The sampling point is between Phase1 Seg and
Phase2 Seg. These segments are lengthened or shortened by re-synchronization. The end of the Phase1
Seg determines the sampling point within a bit period.
The segment is programmable from 1 TQ to 8 TQ.
Phase2 Seg provides delay to the next transmitted data
transition. The segment is programmable from 1 TQ to
8 TQ, or it may be defined to be equal to the greater of
Phase1 Seg or the Information Processing Time
(2 TQ). The Phase1 Seg is initialized by setting bits
SEG1PH<2:0> (CiCFG2<5:3>), and Phase2 Seg is
initialized by setting SEG2PH<2:0> (CiCFG2<10:8>).
The following requirement must be fulfilled while setting
the lengths of the Phase Segments:
• Propagation Segment + Phase1 Seg > = Phase2 Seg
19.6.5
SAMPLE POINT
The sample point is the point of time at which the bus
level is read and interpreted as the value of that
respective bit. The location is at the end of Phase1
Seg. If the bit timing is slow and contains many TQ, it is
possible to specify multiple sampling of the bus line at
the sample point. The level determined by the CAN bus
then corresponds to the result from the majority decision of three values. The majority samples are taken at
the sample point and twice before with a distance of
TQ/2. The CAN module allows the user to chose
between sampling three times at the same point or
once at the same point, by setting or clearing the SAM
bit (CiCFG2<6>).
Typically, the sampling of the bit should take place at
about 60-70% through the bit time, depending on the
system parameters.
19.6.6
SYNCHRONIZATION
To compensate for phase shifts between the oscillator
frequencies of the different bus stations, each CAN
controller must be able to synchronize to the relevant
signal edge of the incoming signal. When an edge in
the transmitted data is detected, the logic will compare
the location of the edge to the expected time
(Synchronous Segment). The circuit will then adjust the
values of Phase1 Seg and Phase2 Seg. There are 2
mechanisms used to synchronize.
19.6.6.1
Hard Synchronization
Hard synchronization is only done whenever there is a
recessive to dominant edge during bus Idle, indicating
the start of a message. After hard synchronization, the
bit time counters are restarted with the Synchronous
Segment. Hard synchronization forces the edge which
has caused the hard synchronization to lie within the
synchronization segment of the restarted bit time. If a
hard synchronization is done, there will not be a
resynchronization within that bit time.
19.6.6.2
Re-synchronization
As a result of re-synchronization, Phase1 Seg may be
lengthened or Phase2 Seg may be shortened. The
amount of lengthening or shortening of the phase
buffer segment has an upper bound known as the
synchronization jump width, and is specified by the
SJW<1:0> bits (CiCFG1<7:6>). The value of the
synchronization jump width will be added to Phase1
Seg or subtracted from Phase2 Seg. The
re-synchronization jump width is programmable
between 1 TQ and 4 TQ.
The following requirement must be fulfilled while setting
the SJW<1:0> bits:
• Phase2 Seg > Synchronization Jump Width
© 2008 Microchip Technology Inc.
DS70150D-page 131
SFR Name
CAN1 REGISTER MAP FOR dsPIC30F6010A AND 6015 DEVICES(1)
Addr.
Bit 15
Bit 14
Bit 13
—
—
—
—
C1RXF0SID
0300
—
C1RXF0EIDH
0302
—
C1RXF0EIDL
0304
C1RXF1SID
0308
—
—
—
C1RXF1EIDH 030A
—
—
—
C1RXF1EIDL
030C
0310
—
—
—
0312
—
—
—
C1RXF2EIDL
0314
C1RXF3SID
0318
—
—
—
C1RXF3EIDH 031A
—
—
—
0320
—
—
—
0322
—
—
—
C1RXF4EIDL
0324
C1RXF5SID
0328
—
—
—
C1RXF5EIDH 032A
—
—
—
032C
C1RXM0SID
0330
—
—
—
C1RXM0EIDH 0332
—
—
—
—
—
—
—
—
—
C1TX2SID
0340
C1TX2EID
0342
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 0
—
—
—
—
—
—
—
—
—
—
—
0000 uuuu uuuu uuuu
—
—
—
—
—
—
EXIDE 000u uuuu uuuu uu0u
—
—
—
—
—
—
—
—
0000 uuuu uuuu uuuu
—
Receive Acceptance Filter 3 Standard Identifier <10:0>
—
—
—
—
—
—
—
—
—
—
0000 uuuu uuuu uuuu
—
Receive Acceptance Filter 4 Standard Identifier<10:0>
—
—
—
—
—
—
—
—
—
—
0000 uuuu uuuu uuuu
—
Receive Acceptance Filter 5 Standard Identifier<10:0>
—
—
—
—
—
—
—
—
—
—
0000 uuuu uuuu uuuu
—
Receive Acceptance Mask 0 Standard Identifier<10:0>
—
—
—
uuuu uu00 0000 0000
—
MIDE
000u uuuu uuuu uu0u
—
—
uuuu uu00 0000 0000
—
MIDE
000u uuuu uuuu uu0u
—
—
uuuu uu00 0000 0000
Receive Acceptance Mask 0 Extended Identifier<17:6>
—
—
—
—
—
—
—
0000 uuuu uuuu uuuu
—
Receive Acceptance Mask 1 Standard Identifier<10:0>
—
Receive Acceptance Mask 1 Extended Identifier<17:6>
—
—
—
—
—
—
—
—
Receive Acceptance Mask 1 Extended Identifier<5:0>
Transmit Buffer 2 Standard Identifier<10:6>
—
—
—
—
—
0000 uuuu uuuu uuuu
—
Transmit Buffer 2 Standard Identifier<5:0>
SRR
TXIDE uuuu u000 uuuu uuuu
Transmit Buffer 2 Extended Identifier<13:6>
—
—
© 2008 Microchip Technology Inc.
0344
Transmit Buffer 2 Extended Identifier<5:0>
0346
Transmit Buffer 2 Byte 1
Transmit Buffer 2 Byte 0
uuuu uuuu uuuu uuuu
C1TX2B2
0348
Transmit Buffer 2 Byte 3
Transmit Buffer 2 Byte 2
uuuu uuuu uuuu uuuu
C1TX2B3
034A
Transmit Buffer 2 Byte 5
Transmit Buffer 2 Byte 4
uuuu uuuu uuuu uuuu
C1TX2B4
034C
Transmit Buffer 2 Byte 7
Transmit Buffer 2 Byte 6
C1TX2CON
034E
C1TX1SID
0350
C1TX1EID
0352
—
—
—
Transmit Buffer 1 Standard Identifier<10:6>
Transmit Buffer 1 Extended
Identifier<17:14>
—
C1TX1DLC
0354
Transmit Buffer 1 Extended Identifier<5:0>
C1TX1B1
0356
Transmit Buffer 1 Byte 1
Legend:
Note 1:
—
—
—
—
—
—
—
—
—
TXRTR TXRB1
u = uninitialized bit; — = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
—
DLC<3:0>
—
C1TX2DLC
—
TXRB0
uuuu 0000 uuuu uuuu
C1TX2B1
—
TXRTR TXRB1
—
uuuu uu00 0000 0000
EXIDE 000u uuuu uuuu uu0u
Receive Acceptance Filter 5 Extended Identifier<17:6>
—
uuuu uu00 0000 0000
EXIDE 000u uuuu uuuu uu0u
Receive Acceptance Filter 4 Extended Identifier<17:6>
—
uuuu uu00 0000 0000
EXIDE 000u uuuu uuuu uu0u
Receive Acceptance Filter 3 Extended Identifier<17:6>
—
uuuu uu00 0000 0000
EXIDE 000u uuuu uuuu uu0u
Receive Acceptance Filter 2 Extended Identifier<17:6>
—
uuuu uu00 0000 0000
0000 uuuu uuuu uuuu
—
Receive Acceptance Filter 2 Standard Identifier <10:0>
—
Reset State
EXIDE 000u uuuu uuuu uu0u
Receive Acceptance Filter 1 Extended Identifier<17:6>
—
Transmit Buffer 2 Extended
Identifier<17:14>
Bit 1
—
Receive Acceptance Filter 1 Standard Identifier<10:0>
—
Receive Acceptance Mask 0 Extended Identifier<5:0>
0338
C1RXM1EIDL 033C
—
Receive Acceptance Filter 5 Extended Identifier<5:0>
C1RXM1EIDH 033A
Bit 8
Receive Acceptance Filter 0 Extended Identifier<17:6>
Receive Acceptance Filter 4 Extended Identifier<5:0>
C1RXF5EIDL
C1RXM1SID
—
Receive Acceptance Filter 3 Extended Identifier<5:0>
C1RXF4SID
Bit 9
Receive Acceptance Filter 0 Standard Identifier<10:0>
Receive Acceptance Filter 2 Extended Identifier<5:0>
C1RXF4EIDH
C1RXM0EIDL 0334
Bit 10
Receive Acceptance Filter 1 Extended Identifier<5:0>
C1RXF2SID
031C
Bit 11
Receive Acceptance Filter 0 Extended Identifier<5:0>
C1RXF2EIDH
C1RXF3EIDL
Bit 12
TXABT TXLARB TXERR
TXREQ
uuuu uuuu uuuu uuuu
—
Transmit Buffer 1 Standard Identifier<5:0>
TXPRI<1:0>
SRR
DLC<3:0>
Transmit Buffer 1 Byte 0
—
0000 0000 0000 0000
TXIDE uuuu u000 uuuu uuuu
Transmit Buffer 1 Extended Identifier<13:6>
TXRB0
uuuu uuuu uuuu u000
uuuu 0000 uuuu uuuu
—
—
uuuu uuuu uuuu u000
uuuu uuuu uuuu uuuu
dsPIC30F6010A/6015
DS70150D-page 132
TABLE 19-1:
© 2008 Microchip Technology Inc.
TABLE 19-1:
SFR Name
C1TX1B2
Addr.
CAN1 REGISTER MAP FOR dsPIC30F6010A AND 6015 DEVICES(1) (CONTINUED)
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
0358
Transmit Buffer 1 Byte 3
Transmit Buffer 1 Byte 2
uuuu uuuu uuuu uuuu
C1TX1B3
035A
Transmit Buffer 1 Byte 5
Transmit Buffer 1 Byte 4
uuuu uuuu uuuu uuuu
C1TX1B4
035C
Transmit Buffer 1 Byte 7
Transmit Buffer 1 Byte 6
C1TX1CON
035E
C1TX0SID
0360
C1TX0EID
0362
—
—
—
—
—
Transmit Buffer 0 Standard Identifier<10:6>
—
Transmit Buffer 0 Extended
Identifier<17:14>
—
—
—
—
—
—
—
—
—
—
TXABT TXLARB TXERR
uuuu uuuu uuuu uuuu
TXREQ
—
TXPRI<1:0>
Transmit Buffer 0 Standard Identifier<5:0>
SRR
Transmit Buffer 0 Extended Identifier<13:6>
—
—
0364
Transmit Buffer 0 Extended Identifier<5:0>
0366
Transmit Buffer 0 Byte 1
Transmit Buffer 0 Byte 0
uuuu uuuu uuuu uuuu
C1TX0B2
0368
Transmit Buffer 0 Byte 3
Transmit Buffer 0 Byte 2
uuuu uuuu uuuu uuuu
C1TX0B3
036A
Transmit Buffer 0 Byte 5
Transmit Buffer 0 Byte 4
uuuu uuuu uuuu uuuu
C1TX0B4
036C
Transmit Buffer 0 Byte 7
Transmit Buffer 0 Byte 6
C1TX0CON
036E
—
—
—
C1RX1SID
0370
—
—
—
C1RX1EID
0372
—
—
—
C1RX1DLC
0374
Receive Buffer 1 Extended Identifier<5:0>
C1RX1B1
0376
Receive Buffer 1 Byte 1
Receive Buffer 1 Byte 0
uuuu uuuu uuuu uuuu
C1RX1B2
0378
Receive Buffer 1 Byte 3
Receive Buffer 1 Byte 2
uuuu uuuu uuuu uuuu
C1RX1B3
037A
Receive Buffer 1 Byte 5
Receive Buffer 1 Byte 4
uuuu uuuu uuuu uuuu
C1RX1B4
037C
Receive Buffer 1 Byte 7
Receive Buffer 1 Byte 6
C1RX1CON
037E
—
—
—
C1RX0SID
0380
—
—
—
C1RX0EID
0382
—
—
—
C1RX0DLC
0384
Receive Buffer 0 Extended Identifier<5:0>
C1RX0B1
0386
Receive Buffer 0 Byte 1
Receive Buffer 0 Byte 0
uuuu uuuu uuuu uuuu
C1RX0B2
0388
Receive Buffer 0 Byte 3
Receive Buffer 0 Byte 2
uuuu uuuu uuuu uuuu
C1RX0B3
038A
Receive Buffer 0 Byte 5
Receive Buffer 0 Byte 4
uuuu uuuu uuuu uuuu
C1RX0B4
038C
Receive Buffer 0 Byte 7
Receive Buffer 0 Byte 6
uuuu uuuu uuuu uuuu
C1RX0CON
038E
—
—
—
TXABT TXLARB TXERR
uuuu uuuu uuuu uuuu
TXREQ
—
TXPRI<1:0>
Receive Buffer 1 Standard Identifier<10:0>
—
—
SRR
—
—
—
—
—
—
RXFUL
—
—
—
0000 uuuu uuuu uuuu
RXRB0
—
DLC<3:0>
uuuu uuuu 000u uuuu
uuuu uuuu uuuu uuuu
RXRTRRO
FILHIT<2:0>
Receive Buffer 0 Standard Identifier<10:0>
—
SRR
0000 0000 0000 0000
RXIDE 000u uuuu uuuu uuuu
Receive Buffer 0 Extended Identifier<17:6>
—
—
—
—
—
RXRTR RXRB1
—
—
—
—
RXFUL
—
—
—
DLC<3:0>
uuuu uuuu 000u uuuu
RXRTRRO DBEN JTOFF FILHIT0 0000 0000 0000 0000
DS70150D-page 133
0390 CANCAP
—
CSIDLE
ABAT
CANCKS
C1CFG1
0392
—
—
—
—
—
C1CFG2
0394
—
WAKFIL
—
—
—
SEG2PH<2:0>
SEG2PHTS
SAM
C1INTF
0396
TXBO
TXEP
RXEP
TXWAR RXWAR EWARN
IVRIF
WAKIF
ERRIF
TX2IF
TX1IF
TX0IF RX1IF RX0IF
0000 0000 0000 0000
C1INTE
0398
—
—
—
IVRIE
WAKIE
ERRIE
TX2IE
TX1IE
TX0IE RX1E
0000 0000 0000 0000
C1EC
Legend:
Note 1:
039A
—
—
—
—
—
—
OPMODE<2:0>
0000 uuuu uuuu uuuu
RXRB0
C1CTRL
RX0OVR RX1OVR
REQOP<2:0>
—
0000 0000 0000 0000
RXIDE 000u uuuu uuuu uuuu
Receive Buffer 1 Extended Identifier<17:6>
RXRTR RXRB1
uuuu uuuu uuuu u000
—
—
SJW<1:0>
—
Transmit Error Count Register
u = uninitialized bit; — = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
ICODE<2:0>
—
BRP<5:0>
SEG1PH<2:0>
Receive Error Count Register
0000 0100 1000 0000
0000 0000 0000 0000
PRSEG<2:0>
RX0IE
0u00 0uuu uuuu uuuu
0000 0000 0000 0000
dsPIC30F6010A/6015
—
—
DLC<3:0>
—
C1TX0DLC
—
TXRB0
uuuu 0000 uuuu uuuu
C1TX0B1
—
TXRTR TXRB1
0000 0000 0000 0000
TXIDE uuuu u000 uuuu uuuu
SFR Name
CAN2 REGISTER MAP FOR dsPIC30F6010A(1)
Addr.
Bit 15
Bit 14
Bit 13
03C0
—
—
—
C2RXF0EIDH 03C2
—
—
—
C2RXF0SID
C2RXF0EIDL 03C4
03C8
—
—
—
—
—
—
C2RXF1EIDL 03CC
03D0
—
—
—
—
—
—
C2RXF2EIDL 03D4
03D8
—
—
—
—
—
—
C2RXF3EIDL 03DC
03E0
—
—
—
—
—
—
C2RXF4SID
C2RXF4EIDL
03E4
C2RXF5SID
03E8
—
—
—
C2RXF5EIDH 03EA
—
—
—
C2RXF5EIDL 03EC
—
—
—
—
—
—
C2RXM0EIDL 03F4
03F8
—
—
—
—
—
—
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
—
—
—
—
—
—
Bit 0
EXIDE 000u uuuu uuuu uu0u
—
—
—
—
—
—
—
—
—
0000 uuuu uuuu uuuu
—
—
Receive Acceptance Filter 2 Standard Identifier<10:0>
—
—
—
—
—
—
—
—
—
0000 uuuu uuuu uuuu
—
—
Receive Acceptance Filter 3 Standard Identifier<10:0>
—
—
—
—
—
—
—
—
—
0000 uuuu uuuu uuuu
—
—
Receive Acceptance Filter 4 Standard Identifier<10:0>
—
—
—
—
—
—
—
—
—
0000 uuuu uuuu uuuu
—
—
Receive Acceptance Filter 5 Standard Identifier <10:0>
—
—
—
—
—
—
—
—
—
0000 uuuu uuuu uuuu
—
—
Receive Acceptance Mask 0 Standard Identifier<10:0>
—
—
—
—
—
—
—
—
—
0000 uuuu uuuu uuuu
—
—
Receive Acceptance Mask 1 Standard Identifier<10:0>
—
—
—
—
© 2008 Microchip Technology Inc.
Receive Acceptance Mask 1 Extended Identifier<5:0>
—
—
C2TX2SID
0400
Transmit Buffer 2 Standard Identifier<10:6>
—
—
—
C2TX2EID
0402 Transmit Buffer 2 Extended Identifier<17:14>
—
—
—
C2TX2DLC
0404
TXRTR
TXRB1
C2TX2B1
0406
Transmit Buffer 2 Byte 1
Transmit Buffer 2 Byte 0
uuuu uuuu uuuu uuuu
C2TX2B2
0408
Transmit Buffer 2 Byte 3
Transmit Buffer 2 Byte 2
uuuu uuuu uuuu uuuu
C2TX2B3
040A
Transmit Buffer 2 Byte 5
Transmit Buffer 2 Byte 4
uuuu uuuu uuuu uuuu
C2TX2B4
040C
Transmit Buffer 2 Byte 7
Transmit Buffer 2 Byte 6
C2TX2CON
040E
C2TX1SID
0410
C2TX1EID
0412 Transmit Buffer 1 Extended Identifier<17:14>
C2TX1DLC
0414
Legend:
Note 1:
Transmit Buffer 2 Extended Identifier<5:0>
—
—
—
—
—
Transmit Buffer 1 Standard Identifier<10:6>
—
Transmit Buffer 1 Extended Identifier<5:0>
—
—
—
—
—
—
—
—
—
TXRTR
TXRB1
u = uninitialized bit; — = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
—
—
0000 uuuu uuuu uuuu
C2RXM1EIDL 03FC
—
—
uuuu uu00 0000 0000
MIDE 000u uuuu uuuu uu0u
Receive Acceptance Mask 1 Extended Identifier<17:6>
—
uuuu uu00 0000 0000
MIDE 000u uuuu uuuu uu0u
Receive Acceptance Mask 0 Extended Identifier<17:6>
—
uuuu uu00 0000 0000
EXIDE 000u uuuu uuuu uu0u
Receive Acceptance Filter 5 Extended Identifier<17:6>
—
uuuu uu00 0000 0000
EXIDE 000u uuuu uuuu uu0u
Receive Acceptance Filter 4 Extended Identifier<17:6>
—
uuuu uu00 0000 0000
EXIDE 000u uuuu uuuu uu0u
Receive Acceptance Filter 3 Extended Identifier<17:6>
—
uuuu uu00 0000 0000
EXIDE 000u uuuu uuuu uu0u
Receive Acceptance Filter 2 Extended Identifier<17:6>
—
uuuu uu00 0000 0000
EXIDE 000u uuuu uuuu uu0u
Receive Acceptance Filter 1 Extended Identifier<17:6>
—
Reset State
0000 uuuu uuuu uuuu
—
Receive Acceptance Filter 1 Standard Identifier<10:0>
—
Receive Acceptance Mask 0 Extended Identifier<5:0>
C2RXM1EIDH 03FA
C2RXM1SID
—
Receive Acceptance Filter 5 Extended Identifier<5:0>
03F0
Bit 8
Receive Acceptance Filter 0 Extended Identifier<17:6>
Receive Acceptance Filter 4 Extended Identifier<5:0>
C2RXM0EIDH 03F2
C2RXM0SID
—
Receive Acceptance Filter 3 Extended Identifier<5:0>
C2RXF4EIDH 03E2
Bit 9
Receive Acceptance Filter 0 Standard Identifier<10:0>
Receive Acceptance Filter 2 Extended Identifier<5:0>
C2RXF3EIDH 03DA
C2RXF3SID
Bit 10
Receive Acceptance Filter 1 Extended Identifier<5:0>
C2RXF2EIDH 03D2
C2RXF2SID
Bit 11
Receive Acceptance Filter 0 Extended Identifier<5:0>
C2RXF1EIDH 03CA
C2RXF1SID
Bit 12
—
—
Transmit Buffer 2 Standard Identifier<5:0>
—
SRR
—
TXIDE uuuu u000 uuuu uuuu
Transmit Buffer 2 Extended Identifier<13:6>
TXRB0
—
—
DLC<3:0>
TXABT TXLARB TXERR
TXREQ
uuuu 0000 uuuu uuuu
—
—
TXPRI<1:0>
SRR
—
0000 0000 0000 0000
TXIDE uuuu u000 uuuu uuuu
Transmit Buffer 1 Extended Identifier<13:6>
DLC<3:0>
uuuu uuuu uuuu u000
uuuu uuuu uuuu uuuu
—
Transmit Buffer 1 Standard Identifier<5:0>
TXRB0
uuuu uu00 0000 0000
uuuu 0000 uuuu uuuu
—
—
uuuu uuuu uuuu u000
dsPIC30F6010A/6015
DS70150D-page 134
TABLE 19-2:
© 2008 Microchip Technology Inc.
TABLE 19-2:
SFR Name
C2TX1B1
Addr.
CAN2 REGISTER MAP FOR dsPIC30F6010A(1) (CONTINUED)
Bit 15
Bit 14
0416
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
Transmit Buffer 1 Byte 1
Transmit Buffer 1 Byte 0
uuuu uuuu uuuu uuuu
C2TX1B2
0418
Transmit Buffer 1 Byte 3
Transmit Buffer 1 Byte 2
uuuu uuuu uuuu uuuu
C2TX1B3
041A
Transmit Buffer 1 Byte 5
Transmit Buffer 1 Byte 4
uuuu uuuu uuuu uuuu
C2TX1B4
041C
Transmit Buffer 1 Byte 7
Transmit Buffer 1 Byte 6
C2TX1CON
041E
—
—
—
—
—
Transmit Buffer 0 Standard Identifier<10:6>
—
—
—
—
—
—
—
—
—
—
TXRTR
TXRB1
TXABT TXLARB TXERR
uuuu uuuu uuuu uuuu
TXREQ
—
TXPRI<1:0>
Transmit Buffer 0 Standard Identifier<5:0>
SRR
0000 0000 0000 0000
TXIDE uuuu u000 uuuu uuuu
C2TX0SID
0420
C2TX0EID
0422 Transmit Buffer 0 Extended Identifier<17:14>
C2TX0DLC
0424
C2TX0B1
0426
Transmit Buffer 0 Byte 1
Transmit Buffer 0 Byte 0
uuuu uuuu uuuu uuuu
C2TX0B2
0428
Transmit Buffer 0 Byte 3
Transmit Buffer 0 Byte 2
uuuu uuuu uuuu uuuu
C2TX0B3
042A
Transmit Buffer 0 Byte 5
Transmit Buffer 0 Byte 4
uuuu uuuu uuuu uuuu
C2TX0B4
042C
Transmit Buffer 0 Byte 7
Transmit Buffer 0 Byte 6
C2TX0CON
042E
—
—
—
C2RX1SID
0430
—
—
—
—
—
—
—
Transmit Buffer 0 Extended Identifier<5:0>
—
—
—
—
Transmit Buffer 0 Extended Identifier<13:6>
TXRB0
—
—
DLC<3:0>
TXABT TXLARB TXERR
—
—
uuuu uuuu uuuu u000
uuuu uuuu uuuu uuuu
TXREQ
—
TXPRI<1:0>
Receive Buffer 1 Standard Identifier<10:0>
—
uuuu 0000 uuuu uuuu
—
SRR
0000 0000 0000 0000
RXIDE 000u uuuu uuuu uuuu
Receive Buffer 1 Extended Identifier <17:6>
C2RX1EID
0432
C2RX1DLC
0434
C2RX1B1
0436
Receive Buffer 1 Byte 1
Receive Buffer 1 Byte 0
uuuu uuuu uuuu uuuu
C2RX1B2
0438
Receive Buffer 1 Byte 3
Receive Buffer 1 Byte 2
uuuu uuuu uuuu uuuu
C2RX1B3
043A
Receive Buffer 1 Byte 5
Receive Buffer 1 Byte 4
uuuu uuuu uuuu uuuu
C2RX1B4
043C
Receive Buffer 1 Byte 7
Receive Buffer 1 Byte 6
C2RX1CON
043E
—
—
—
C2RX0SID
0440
—
—
—
C2RX0EID
0442
—
—
—
C2RX0DLC
0444
C2RX0B1
0446
Receive Buffer 0 Byte 1
Receive Buffer 0 Byte 0
uuuu uuuu uuuu uuuu
C2RX0B2
0448
Receive Buffer 0 Byte 3
Receive Buffer 0 Byte 2
uuuu uuuu uuuu uuuu
C2RX0B3
044A
Receive Buffer 0 Byte 5
Receive Buffer 0 Byte 4
uuuu uuuu uuuu uuuu
C2RX0B4
044C
Receive Buffer 0 Byte 7
Receive Buffer 0 Byte 6
uuuu uuuu uuuu uuuu
C2RX0CON
044E
—
—
—
—
—
Receive Buffer 1 Extended Identifier<5:0>
—
—
—
—
—
RXFUL
—
—
0000 uuuu uuuu uuuu
RXRB0
—
—
DLC<3:0>
uuuu uuuu 000u uuuu
uuuu uuuu uuuu uuuu
RXRTRRO
FILHIT<2:0>
Receive Buffer 0 Standard Identifier<10:0>
—
SRR
0000 0000 0000 0000
RXIDE 000u uuuu uuuu uuuu
Receive Buffer 0 Extended Identifier<17:6>
Receive Buffer 0 Extended Identifier<5:0>
RXRTR
—
—
—
C2CTRL
0450
CANCAP
—
CSIDLE
ABAT
CANCKS
0452
—
—
—
—
—
C2CFG2
0454
WAKFIL
—
—
—
SEG2PH<2:0>
TXWAR RXWAR EWARN
DS70150D-page 135
C2INTF
0456
RX0OVR
RX1OVR
TXBO
TXEP
RXEP
C2INTE
0458
—
—
—
—
—
C2EC
045A
—
RXRB1
C2CFG1
Legend:
Note 1:
—
RXRB1
RXFUL
REQOP<2:0>
—
—
—
—
—
—
—
—
—
OPMODE<2:0>
—
—
Transmit Error Count Register
u = uninitialized bit; — = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
SAM
DLC<3:0>
uuuu uuuu 000u uuuu
RXRTRRO DBEN JTOFF FILHIT0 0000 0000 0000 0000
—
SJW<1:0>
SEG2PHTS
0000 uuuu uuuu uuuu
RXRB0
ICODE<2:0>
—
BRP<5:0>
SEG1PH<2:0>
0000 0100 1000 0000
0000 0000 0000 0000
PRSEG<2:0>
0u00 0uuu uuuu uuuu
IVRIF
WAKIF
ERRIF
TX2IF
TX1IF
TX0IF RX1IF RX0IF 0000 0000 0000 0000
IVRIE
WAKIE
ERRIE
TX2IE
TX1IE
TX0IE RX1E
Receive Error Count Register
RX0IE 0000 0000 0000 0000
0000 0000 0000 0000
dsPIC30F6010A/6015
—
RXRTR
dsPIC30F6010A/6015
NOTES:
DS70150D-page 136
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
20.0
Note:
10-BIT HIGH-SPEED
ANALOG-TO-DIGITAL
CONVERTER (ADC) MODULE
This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
“dsPIC30F Family Reference Manual”
(DS70046).
The10-bit high-speed Analog-to-Digital Converter
(ADC) allows conversion of an analog input signal to a
10-bit digital number. This module is based on a
Successive
Approximation
Register
(SAR)
architecture, and provides a maximum sampling rate of
1 Msps. The A/D module has 16 analog inputs which
are multiplexed into four sample and hold amplifiers.
The output of the sample and hold is the input into the
converter, which generates the result. The analog
reference voltages are software selectable to either the
device supply voltage (AVDD/AVSS) or the voltage level
on the (VREF+/VREF-) pin. The A/D converter has a
unique feature of being able to operate while the device
is in Sleep mode.
© 2008 Microchip Technology Inc.
The A/D module has six 16-bit registers:
•
•
•
•
•
•
A/D Control Register 1 (ADCON1)
A/D Control Register 2 (ADCON2)
A/D Control Register 3 (ADCON3)
A/D Input Select Register (ADCHS)
A/D Port Configuration Register (ADPCFG)
A/D Input Scan Selection Register (ADCSSL)
The ADCON1, ADCON2 and ADCON3 registers
control the operation of the A/D module. The ADCHS
register selects the input channels to be converted. The
ADPCFG register configures the port pins as analog
inputs or as digital I/O. The ADCSSL register selects
inputs for scanning.
Note:
The SSRC<2:0>, ASAM, SIMSAM,
SMPI<3:0>, BUFM and ALTS bits, as well
as the ADCON3 and ADCSSL registers,
must not be written to while ADON = 1.
This would lead to indeterminate results.
The block diagram of the A/D module is shown in
Figure 20-1.
DS70150D-page 137
dsPIC30F6010A/6015
FIGURE 20-1:
10-BIT HIGH-SPEED A/D FUNCTIONAL BLOCK DIAGRAM
AVDD
VREF+(1)
AVSS
VREF-(2)
AN2
+
AN6
AN9
-
AN1
AN4
+
AN7
AN10
-
AN2
AN5
+
AN8
AN11
-
S/H
CH1
ADC
10-bit Result
S/H
CH2
16-word, 10-bit
Dual Port
Buffer
S/H
CH3
CH1,CH2,
CH3,CH0
sample
AN3
AN0
AN1
AN2
AN3
AN4
AN4
AN5
AN5
AN6
AN6
AN7
AN7
AN8
AN8
AN9
AN9
AN10
AN10
AN11
AN11
AN12
AN12
AN13
AN13
AN14
AN14
AN15
AN15
+
AN1
-
Note
input
switches
S/H
Sample/Sequence
Control
Input MUX
Control
CH0
1:
VREF+ is multiplexed with AN0 in the dsPIC30F6015 variant.
2:
VREF- is multiplexed with AN1 in the dsPIC30F6015 variant.
DS70150D-page 138
Conversion Logic
Bus Interface
AN1
AN0
AN3
Data
Format
AN0
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
20.1
A/D Result Buffer
The module contains a 16-word dual port, read-only
buffer, called ADCBUF0...ADCBUFF, to buffer the A/D
results. The RAM is 10-bits wide, but is read into different
format 16-bit words. The contents of the sixteen A/D
Conversion Result Buffer registers, ADCBUF0 through
ADCBUFF, cannot be written by user software.
20.2
Conversion Operation
After the A/D module has been configured, the sample
acquisition is started by setting the SAMP bit. Various
sources, such as a programmable bit, timer time-outs and
external events, will terminate acquisition and start a
conversion. When the A/D conversion is complete, the
result is loaded into ADCBUF0...ADCBUFF, and the A/D
Interrupt Flag ADIF and the DONE bit are set after the
number of samples specified by the SMPI bit.
The following steps should be followed for doing an
A/D conversion:
1.
2.
3.
4.
5.
6.
7.
Configure the A/D module:
-Configure analog pins, voltage reference
and digital I/O
-Select A/D input channels
-Select A/D conversion clock
-Select A/D conversion trigger
-Turn on A/D module
Configure A/D interrupt (if required):
-Clear ADIF bit
-Select A/D interrupt priority
Start sampling.
Wait the required acquisition time.
Trigger acquisition end, start conversion
Wait for A/D conversion to complete, by either:
-Waiting for the A/D interrupt
Read A/D result buffer, clear ADIF if required.
20.3
Selecting the Conversion
Sequence
Several groups of control bits select the sequence in
which the A/D connects inputs to the sample/hold
channels, converts channels, writes the buffer memory,
and generates interrupts. The sequence is controlled
by the sampling clocks.
The SIMSAM bit controls the acquire/convert
sequence for multiple channels. If the SIMSAM bit is
‘0’, the two or four selected channels are acquired and
converted sequentially, with two or four sample clocks.
If the SIMSAM bit is ‘1’, two or four selected channels
are acquired simultaneously, with one sample clock.
The channels are then converted sequentially.
Obviously, if there is only 1 channel selected, the
SIMSAM bit is not applicable.
© 2008 Microchip Technology Inc.
The CHPS bits selects how many channels are
sampled. This can vary from 1, 2 or 4 channels. If
CHPS selects 1 channel, the CH0 channel will be
sampled at the sample clock and converted. The result
is stored in the buffer. If CHPS selects 2 channels, the
CH0 and CH1 channels will be sampled and converted.
If CHPS selects 4 channels, the CH0, CH1, CH2 and
CH3 channels will be sampled and converted.
The
SMPI
bits
select
the
number
of
acquisition/conversion sequences that would be
performed before an interrupt occurs. This can vary
from 1 sample per interrupt to 16 samples per interrupt.
The user cannot program a combination of CHPS and
SMPI bits that specifies more than 16 conversions per
interrupt, or 8 conversions per interrupt, depending on
the BUFM bit. The BUFM bit, when set, will split the
16-word results buffer (ADCBUF0...ADCBUFF) into
two 8-word groups. Writing to the 8-word buffers will be
alternated on each interrupt event. Use of the BUFM bit
will depend on how much time is available for moving
data out of the buffers after the interrupt, as determined
by the application.
If the processor can quickly unload a full buffer within
the time it takes to acquire and convert one channel,
the BUFM bit can be ‘0’ and up to 16 conversions may
be done per interrupt. The processor will have one
sample and conversion time to move the sixteen
conversions.
If the processor cannot unload the buffer within the
acquisition and conversion time, the BUFM bit should be
‘1’. For example, if SMPI<3:0> (ADCON2<5:2> = 0111),
then eight conversions will be loaded into 1/2 of the
buffer, following which an interrupt occurs. The next eight
conversions will be loaded into the other 1/2 of the buffer.
The processor will have the entire time between
interrupts to move the eight conversions.
The ALTS bit can be used to alternate the inputs
selected during the sampling sequence. The input
multiplexer has two sets of sample inputs: MUX A and
MUX B. If the ALTS bit is ‘0’, only the MUX A inputs are
selected for sampling. If the ALTS bit is ‘1’ and
SMPI<3:0> = 0000, on the first sample/convert
sequence, the MUX A inputs are selected, and on the
next acquire/convert sequence, the MUX B inputs are
selected.
The CSCNA bit (ADCON2<10>) will allow the CH0
channel inputs to be alternately scanned across a
selected number of analog inputs for the MUX A group.
The inputs are selected by the ADCSSL register. If a
particular bit in the ADCSSL register is ‘1’, the
corresponding input is selected. The inputs are always
scanned from lower to higher numbered inputs, starting
after each interrupt. If the number of inputs selected is
greater than the number of samples taken per interrupt,
the higher numbered inputs are unused.
DS70150D-page 139
dsPIC30F6010A/6015
20.4
Programming the Start of
Conversion Trigger
The conversion trigger will terminate acquisition and
start the requested conversions.
The SSRC<2:0> bits select the source of the
conversion trigger.
The SSRC bits provide for up to five alternate sources
of conversion trigger.
When SSRC<2:0> = 000, the conversion trigger is
under software control. Clearing the SAMP bit will
cause the conversion trigger.
When SSRC<2:0> = 111 (Auto-Start mode), the conversion trigger is under A/D clock control. The SAMC
bits select the number of A/D clocks between the start
of acquisition and the start of conversion. This provides
the fastest conversion rates on multiple channels.
SAMC must always be at least one clock cycle.
Other trigger sources can come from timer modules,
motor control PWM module, or external interrupts.
Note:
To operate the A/D at the maximum
specified
conversion
speed,
the
Auto-Convert Trigger option should be
selected
(SSRC = 111)
and
the
Auto-Sample Time bits should be set to 1
TAD (SAMC = 00001). This configuration
will give a total conversion period (sample +
convert) of 13 TAD.
The use of any other conversion trigger
will result in additional TAD cycles to
synchronize the external event to the A/D.
20.5
Aborting a Conversion
Clearing the ADON bit during a conversion will abort
the current conversion and stop the sampling
sequencing. The ADCBUF will not be updated with the
partially completed A/D conversion sample. That is, the
ADCBUF will continue to contain the value of the last
completed conversion (or the last value written to the
ADCBUF register).
If the clearing of the ADON bit coincides with an
auto-start, the clearing has a higher priority.
20.6
Selecting the A/D Conversion
Clock
The A/D conversion requires 12 TAD. The source of the
A/D conversion clock is software selected using a 6-bit
counter. There are 64 possible options for TAD.
EQUATION 20-1:
A/D CONVERSION CLOCK
TAD = TCY * (0.5 * (ADCS<5:0> + 1))
TAD
ADCS<5:0> = 2
–1
TCY
The internal RC oscillator is selected by setting the
ADRC bit.
For correct A/D conversions, the A/D conversion clock
(TAD) must be selected to ensure a minimum TAD time
of 83.33 nsec (for VDD = 5V). Refer to Section 24.0
"Electrical Characteristics" for minimum TAD under
other operating conditions.
Example 20-1 shows a sample calculation for the
ADCS<5:0> bits, assuming a device operating speed
of 30 MIPS.
EXAMPLE 20-1:
A/D CONVERSION CLOCK
CALCULATION
TAD = 84 nsec
TCY = 33 nsec (30 MIPS)
TAD
–1
TCY
84 nsec
=2•
33 nsec
= 4.09
ADCS<5:0> = 2
–1
Therefore,
Set ADCS<5:0> = 9
TCY
(ADCS<5:0> + 1)
2
33 nsec
=
(9 + 1)
2
Actual TAD =
= 99 nsec
After the A/D conversion is aborted, a 2 TAD wait is
required before the next sampling may be started by
setting the SAMP bit.
If sequential sampling is specified, the A/D will continue
at the next sample pulse which corresponds with the
next channel converted. If simultaneous sampling is
specified, the A/D will continue with the next
multichannel group conversion sequence.
DS70150D-page 140
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
20.7
A/D Conversion Speeds
The dsPIC30F 10-bit A/D converter specifications
permit a maximum 1 Msps sampling rate. Table 20-1
summarizes the conversion speeds for the dsPIC30F
10-bit A/D converter and the required operating
conditions.
TABLE 20-1:
10-BIT A/D CONVERSION RATE PARAMETERS
dsPIC30F 10-bit A/D Converter Conversion Rates
A/D Speed
Up to
1 Msps(1)
TAD
Sampling
RS Max
Minimum Time Min
83.33 ns
12 TAD
500Ω
VDD
Temperature
4.5V to 5.5V
-40°C to +85°C
A/D Channels Configuration
VREF- VREF+
ANx
CH1, CH2 or CH3
S/H
ADC
CH0
S/H
Up to
750 ksps(1)
95.24 ns
2 TAD
500Ω
4.5V to 5.5V
-40°C to +85°C
VREF- VREF+
ANx
Up to
600 ksps(1)
138.89 ns
12 TAD
500Ω
3.0V to 5.5V
CHX
S/H
ADC
-40°C to +125°C
VREF- VREF+
ANx
CH1, CH2 or CH3
S/H
CH0
ADC
S/H
Up to
500 ksps
153.85 ns
1 TAD
5.0 kΩ
4.5V to 5.5V
-40°C to +125°C
VREF- VREF+
or
or
AVSS AVDD
CHX
ANx
S/H
ADC
ANx or VREF-
Up to
300 ksps
256.41 ns
1 TAD
5.0 kΩ
3.0V to 5.5V
-40°C to +125°C
VREF- VREF+
or
or
AVSS AVDD
CHX
ANx
S/H
ADC
ANx or VREF-
Note 1: External VREF- and VREF+ pins must be used for correct operation. See Figure 20-2 for recommended
circuit.
© 2008 Microchip Technology Inc.
DS70150D-page 141
dsPIC30F6010A/6015
The configuration guidelines give the required setup
values for the conversion speeds above 500 ksps,
since they require external VREF pins usage and there
are some differences in the configuration procedure.
Configuration details that are not critical to the
conversion speed have been omitted.
FIGURE 20-2:
The following figure depicts the recommended circuit
for the conversion rates above 500 ksps.
A/D CONVERTER VOLTAGE REFERENCE SCHEMATIC
VDD
VSS
VDD
VDD
C8
1 μF
VDD
dsPIC30F6010A
VSS
VDD
C2
0.1 μF
20.7.1
VDD
C4
0.1 μF
VDD
C3
0.01 μF
VDD
VDD
1 Msps CONFIGURATION
GUIDELINE
Single Analog Input
For conversions at 1 Msps for a single analog input, at
least two sample and hold channels must be enabled.
The analog input multiplexer must be configured so
that the same input pin is connected to both sample
and hold channels. The A/D converts the value held on
one S/H channel, while the second S/H channel
acquires a new input sample.
DS70150D-page 142
VDD
VSS
VDD
VREF+
VREF
AVDD
AVSS
R1
10
The configuration for 1 Msps operation is dependent on
whether a single input pin is to be sampled or whether
multiple pins will be sampled.
20.7.1.1
C6
0.01 μF
VDD
VDD
C5
1 μF
C1
0.01 μF
C7
0.1 μF
VDD
VSS
VDD
R2
10
VDD
20.7.1.2
Multiple Analog Inputs
The A/D converter can also be used to sample multiple
analog inputs using multiple sample and hold channels.
In this case, the total 1 Msps conversion rate is divided
among the different input signals. For example, four
inputs can be sampled at a rate of 250 ksps for each
signal or two inputs could be sampled at a rate of
500 ksps for each signal. Sequential sampling must be
used in this configuration to allow adequate sampling
time on each input.
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
20.7.1.3
1 Msps Configuration Items
The following configuration items are required to
achieve a 1 Msps conversion rate.
• Comply with conditions provided in Table 20-2
• Connect external VREF+ and VREF- pins following
the recommended circuit shown in Figure 20-2
• Set SSRC<2:0> = 111 in the ADCON1 register to
enable the auto-convert option
• Enable automatic sampling by setting the ASAM
control bit in the ADCON1 register
• Enable sequential sampling by clearing the
SIMSAM bit in the ADCON1 register
• Enable at least two sample and hold channels by
writing the CHPS<1:0> control bits in the
ADCON2 register
• Write the SMPI<3:0> control bits in the ADCON2
register for the desired number of conversions
between interrupts. At a minimum, set
SMPI<3:0> = 0001 since at least two sample and
hold channels should be enabled
• Configure the A/D clock period to be:
1
12 x 1,000,000
= 83.33 ns
by writing to the ADCS<5:0> control bits in the
ADCON3 register
• Configure the sampling time to be 2 TAD by
writing: SAMC<4:0> = 00010
• Select at least two channels per analog input pin
by writing to the ADCHS register
20.7.2
750 ksps CONFIGURATION
GUIDELINE
The following configuration items are required to
achieve a 750 ksps conversion rate. This configuration
assumes that a single analog input is to be sampled.
• Comply with conditions provided in Table 20-2
• Connect external VREF+ and VREF- pins following
the recommended circuit shown in Figure 20-2
• Set SSRC<2:0> = 111 in the ADCON1 register to
enable the auto-convert option
• Enable automatic sampling by setting the ASAM
control bit in the ADCON1 register
• Enable one sample and hold channel by setting
CHPS<1:0> = 00 in the ADCON2 register
• Write the SMPI<3:0> control bits in the ADCON2
register for the desired number of conversions
between interrupts
• Configure the A/D clock period to be:
1
(12 + 2) X 750,000
= 95.24 ns
by writing to the ADCS<5:0> control bits in the
ADCON3 register
• Configure the sampling time to be 2 TAD by
writing: SAMC<4:0> = 00010
© 2008 Microchip Technology Inc.
20.7.3
600 ksps CONFIGURATION
GUIDELINE
The configuration for 600 ksps operation is dependent
on whether a single input pin is to be sampled or
whether multiple pins will be sampled.
20.7.3.1
Single Analog Input
When performing conversions at 600 ksps for a single
analog input, at least two sample and hold channels
must be enabled. The analog input multiplexer must be
configured so that the same input pin is connected to
both sample and hold channels. The A/D converts the
value held on one S/H channel, while the second S/H
channel acquires a new input sample.
20.7.3.2
Multiple Analog Input
The A/D converter can also be used to sample multiple
analog inputs using multiple sample and hold channels.
In this case, the total 600 ksps conversion rate is
divided among the different input signals. For example,
four inputs can be sampled at a rate of 150 ksps for
each signal or two inputs can be sampled at a rate of
300 ksps for each signal. Sequential sampling must be
used in this configuration to allow adequate sampling
time on each input.
20.7.3.3
600 ksps Configuration Items
The following configuration items are required to
achieve a 600 ksps conversion rate.
• Comply with conditions provided in Table 20-2
• Connect external VREF+ and VREF- pins following
the recommended circuit shown in Figure 20-2
• Set SSRC<2:0> = 111 in the ADCON1 register to
enable the auto-convert option
• Enable automatic sampling by setting the ASAM
control bit in the ADCON1 register
• Enable sequential sampling by clearing the
SIMSAM bit in the ADCON1 register
• Enable at least two sample and hold channels by
writing the CHPS<1:0> control bits in the
ADCON2 register
• Write the SMPI<3:0> control bits in the ADCON2
register for the desired number of conversions
between interrupts. At a minimum, set
SMPI<3:0> = 0001 since at least two sample and
hold channels should be enabled
• Configure the A/D clock period to be:
1
12 x 600,000
= 138.89 ns
by writing to the ADCS<5:0> control bits in the
ADCON3 register
• Configure the sampling time to be 2 TAD by
writing: SAMC<4:0> = 00010
• Select at least two channels per analog input pin
by writing to the ADCHS register
DS70150D-page 143
dsPIC30F6010A/6015
20.8
A/D Acquisition Requirements
The analog input model of the 10-bit A/D converter is
shown in Figure 20-3. The total sampling time for the
A/D is a function of the internal amplifier settling time,
device VDD and the holding capacitor charge time.
For the A/D converter to meet its specified accuracy, the
charge holding capacitor (CHOLD) must be allowed to
fully charge to the voltage level on the analog input pin.
The analog output source impedance (RS), the
interconnect impedance (RIC), and the internal sampling
switch (RSS) impedance combine to directly affect the
time required to charge the capacitor CHOLD. The
combined impedance must therefore be small enough
to fully charge the holding capacitor within the chosen
sample time. To minimize the effects of pin leakage
currents on the accuracy of the A/D converter, the
maximum recommended source impedance, RS, is 5 kΩ
for conversion rates up to 500 ksps and a maximum of
500Ω for conversion rates up to 1 Msps. After the analog
input channel is selected (changed), this sampling
function must be completed prior to starting the
conversion. The internal holding capacitor will be in a
discharged state prior to each sample operation.
FIGURE 20-3:
The user must allow at least 1 TAD period of sampling
time, TSAMP, between conversions to allow each
sample to be acquired. This sample time may be
controlled manually in software by setting/clearing the
SAMP bit, or it may be automatically controlled by the
A/D converter. In an automatic configuration, the user
must allow enough time between conversion triggers
so that the minimum sample time can be satisfied.
Refer to Section 24.0 “Electrical Characteristics” for
TAD and sample time requirements.
A/D CONVERTER ANALOG INPUT MODEL
VDD
Rs
VA
ANx
CPIN
RIC ≤ 250Ω
VT = 0.6V
VT = 0.6V
Sampling
Switch
RSS ≤ 3 kΩ
RSS
I leakage
± 500 nA
CHOLD
= DAC capacitance
= 4.4 pF
VSS
Legend: CPIN
= input capacitance
= threshold voltage
VT
I leakage = leakage current at the pin due to
various junctions
= interconnect resistance
RIC
= sampling switch resistance
RSS
= sample/hold capacitance (from DAC)
CHOLD
Note: CPIN value depends on device package and is not tested. Effect of CPIN negligible if Rs ≤ 5 kΩ.
DS70150D-page 144
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
20.9
Module Power-Down Modes
If the A/D interrupt is enabled, the device will wake-up
from Sleep. If the A/D interrupt is not enabled, the A/D
module will then be turned off, although the ADON bit
will remain set.
The module has 3 internal power modes. When the
ADON bit is ‘1’, the module is in Active mode; it is fully
powered and functional. When ADON is ‘0’, the module
is in Off mode. The digital and analog portions of the
circuit are disabled for maximum current savings. In
order to return to the Active mode from Off mode, the
user must wait for the ADC circuitry to stabilize.
20.10.2
The ADSIDL bit selects if the module will stop on Idle or
continue on Idle. If ADSIDL = 0, the module will continue
operation on assertion of Idle mode. If ADSIDL = 1, the
module will stop on Idle.
20.10 A/D Operation During CPU Sleep
and Idle Modes
20.10.1
20.11 Effects of a Reset
A/D OPERATION DURING CPU
SLEEP MODE
A device Reset forces all registers to their Reset state.
This forces the A/D module to be turned off, and any
conversion and acquisition sequence is aborted. The
values that are in the ADCBUF registers are not
modified. The A/D Result register will contain unknown
data after a Power-on Reset.
When the device enters Sleep mode, all clock sources
to the module are shutdown and stay at logic ‘0’.
If Sleep occurs in the middle of a conversion, the
conversion is aborted. The converter will not continue
with a partially completed conversion on exit from
Sleep mode.
20.12 Output Formats
Register contents are not affected by the device
entering or leaving Sleep mode.
The A/D result is 10 bits wide. The data buffer RAM is
also 10 bits wide. The 10-bit data can be read in one of
four different formats. The FORM<1:0> bits select the
format. Each of the output formats translates to a 16-bit
result on the data bus.
The A/D module can operate during Sleep mode if the
A/D clock source is set to RC (ADRC = 1). When the
RC clock source is selected, the A/D module waits one
instruction cycle before starting the conversion. This
allows the SLEEP instruction to be executed, which
eliminates all digital switching noise from the
conversion. When the conversion is complete, the
DONE bit will be set and the result loaded into the
ADCBUF register.
FIGURE 20-4:
A/D OPERATION DURING CPU IDLE
MODE
Write data will always be in right justified (integer)
format.
A/D OUTPUT DATA FORMATS
RAM Contents:
d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
Read to Bus:
Signed Fractional (1.15)
d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
0
0
0
0
0
0
Fractional (1.15)
d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
0
0
0
0
0
0
Signed Integer
Integer
© 2008 Microchip Technology Inc.
d09 d09 d09 d09 d09 d09 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
0
0
0
0
0
0
d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
DS70150D-page 145
dsPIC30F6010A/6015
20.13 Configuring Analog Port Pins
20.14 Connection Considerations
The use of the ADPCFG and TRIS registers control the
operation of the A/D port pins. The port pins that are
desired as analog inputs must have their
corresponding TRIS bit set (input). If the TRIS bit is
cleared (output), the digital output level (VOH or VOL)
will be converted.
The analog inputs have diodes to VDD and VSS as ESD
protection. This requires that the analog input be
between VDD and VSS. If the input voltage exceeds this
range by greater than 0.3V (either direction), one of the
diodes becomes forward biased and it may damage the
device if the input current specification is exceeded.
The A/D operation is independent of the state of the
CH0SA<3:0>/CH0SB<3:0> bits and the TRIS bits.
An external RC filter is sometimes added for
anti-aliasing of the input signal. The R component
should be selected to ensure that the sampling time
requirements are satisfied. Any external components
connected (via high-impedance) to an analog input pin
(capacitor, Zener diode, etc.) should have very little
leakage current at the pin.
When reading the PORT register, all pins configured as
analog input channels will read as cleared.
Pins configured as digital inputs will not convert an
analog input. Analog levels on any pin that is defined as
a digital input (including the ANx pins) may cause the
input buffer to consume current that exceeds the
device specifications.
DS70150D-page 146
© 2008 Microchip Technology Inc.
© 2008 Microchip Technology Inc.
TABLE 20-2:
SFR Name Addr.
ADC REGISTER MAP(1)
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
ADCBUF0
0280
—
—
—
—
—
—
ADC Data Buffer 0
0000 00uu uuuu uuuu
ADCBUF1
0282
—
—
—
—
—
—
ADC Data Buffer 1
0000 00uu uuuu uuuu
ADCBUF2
0284
—
—
—
—
—
—
ADC Data Buffer 2
0000 00uu uuuu uuuu
ADCBUF3
0286
—
—
—
—
—
—
ADC Data Buffer 3
0000 00uu uuuu uuuu
ADCBUF4
0288
—
—
—
—
—
—
ADC Data Buffer 4
0000 00uu uuuu uuuu
ADCBUF5
028A
—
—
—
—
—
—
ADC Data Buffer 5
0000 00uu uuuu uuuu
ADCBUF6
028C
—
—
—
—
—
—
ADC Data Buffer 6
0000 00uu uuuu uuuu
ADCBUF7
028E
—
—
—
—
—
—
ADC Data Buffer 7
0000 00uu uuuu uuuu
ADCBUF8
0290
—
—
—
—
—
—
ADC Data Buffer 8
0000 00uu uuuu uuuu
ADCBUF9
0292
—
—
—
—
—
—
ADC Data Buffer 9
0000 00uu uuuu uuuu
ADCBUFA
0294
—
—
—
—
—
—
ADC Data Buffer 10
0000 00uu uuuu uuuu
ADCBUFB
0296
—
—
—
—
—
—
ADC Data Buffer 11
0000 00uu uuuu uuuu
ADCBUFC
0298
—
—
—
—
—
—
ADC Data Buffer 12
0000 00uu uuuu uuuu
ADCBUFD
029A
—
—
—
—
—
—
ADC Data Buffer 13
0000 00uu uuuu uuuu
ADCBUFE
029C
—
—
—
—
—
—
ADC Data Buffer 14
0000 00uu uuuu uuuu
ADCBUFF
029E
—
—
—
—
—
—
ADC Data Buffer 15
ADCON1
02A0
ADON
—
ADSIDL
—
—
—
FORM<1:0>
ADCON2
02A2
—
—
CSCNA
CHPS<1:0>
ADCON3
02A4
ADCHS
02A6
ADPCFG
02A8 PCFG15 PCFG14
ADCSSL
Legend:
Note 1:
02AA CSSL15 CSSL14 CSSL13 CSSL12 CSSL11 CSSL10 CSSL9 CSSL8 CSSL7
u = uninitialized bit; — = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
VCFG<2:0>
—
—
SAMC<4:0>
CH0SB<3:0>
BUFS
—
ADRC
—
CH123SB
CH0NB
CH123NA<1:0>
PCFG13
PCFG12 PCFG11 PCFG10 PCFG9 PCFG8 PCFG7 PCFG6
CSSL6
—
0000 00uu uuuu uuuu
SIMSAM
ASAM
SMPI<3:0>
SAMP
DONE
0000 0000 0000 0000
BUFM
ALTS
0000 0000 0000 0000
ADCS<5:0>
CH123SA CH0NA
CH0SA<3:0>
0000 0000 0000 0000
0000 0000 0000 0000
PCFG5
PCFG4
PCFG3
PCFG2 PCFG1 PCFG0 0000 0000 0000 0000
CSSL5
CSSL4
CSSL3
CSSL2 CSSL1 CSSL0
0000 0000 0000 0000
DS70150D-page 147
dsPIC30F6010A/6015
—
CH123NB<1:0>
SSRC<2:0>
dsPIC30F6010A/6015
NOTES:
DS70150D-page 148
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
21.0
Note:
SYSTEM INTEGRATION
This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
“dsPIC30F Family Reference Manual”
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmers
Reference Manual” (DS70157).
There are several features intended to maximize
system reliability, minimize cost through elimination of
external components, provide power-saving operating
modes and offer code protection:
• Oscillator Selection
• Reset
- Power-on Reset (POR)
- Power-up Timer (PWRT)
- Oscillator Start-up Timer (OST)
- Programmable Brown-out Reset (BOR)
• Watchdog Timer (WDT)
• Power-Saving modes (Sleep and Idle)
• Code Protection
• Unit ID Locations
• In-Circuit Serial Programming (ICSP)
21.1
Oscillator System Overview
The dsPIC30F oscillator system has the following
modules and features:
• Various external and internal oscillator options as
clock sources
• An on-chip PLL to boost internal operating
frequency
• A clock switching mechanism between various
clock sources
• Programmable clock postscaler for system power
savings
• A Fail-Safe Clock Monitor (FSCM) that detects
clock failure and takes fail-safe measures
• Clock Control register (OSCCON)
• Configuration bits for main oscillator selection
Configuration bits determine the clock source upon
Power-on Reset (POR) and Brown-out Reset (BOR).
Thereafter, the clock source can be changed between
permissible clock sources. The OSCCON register
controls the clock switching and reflects system clock
related Status bits.
Table 21-1 provides a summary of the dsPIC30F
oscillator operating modes. A simplified diagram of the
oscillator system is shown in Figure 21-1.
dsPIC30F devices have a Watchdog Timer, which is
permanently enabled via the Configuration bits or can
be software controlled. It runs off its own RC oscillator
for added reliability. There are two timers that offer
necessary delays on power-up. One is the Oscillator
Start-up Timer (OST), intended to keep the chip in
Reset until the crystal oscillator is stable. The other is
the Power-up Timer (PWRT), which provides a delay
on power-up only, designed to keep the part in Reset
while the power supply stabilizes. With these two
timers on-chip, most applications need no external
Reset circuitry.
Sleep mode is designed to offer a very low-current
Power-Down mode. The user can wake-up from Sleep
through external Reset, Watchdog Timer Wake-up or
through an interrupt. Several oscillator options are also
made available to allow the part to fit a wide variety of
applications. In the Idle mode, the clock sources are
still active, but the CPU is shut-off. The RC oscillator
option saves system cost, while the LP crystal option
saves power.
© 2008 Microchip Technology Inc.
DS70150D-page 149
dsPIC30F6010A/6015
TABLE 21-1:
OSCILLATOR OPERATING MODES
Oscillator Mode
Description
XTL
200 kHz-4 MHz crystal on OSC1:OSC2
XT
4 MHz-10 MHz crystal on OSC1:OSC2
XT w/PLL 4x
4 MHz-10 MHz crystal on OSC1:OSC2, 4x PLL enabled
XT w/PLL 8x
4 MHz-10 MHz crystal on OSC1:OSC2, 8x PLL enabled
XT w/PLL 16x
4 MHz-7.5 MHz crystal on OSC1:OSC2, 16x PLL enabled(1)
LP
32 kHz crystal on SOSCO:SOSCI(2)
HS
10 MHz-25 MHz crystal.
HS/2 w/PLL 4x
10 MHz-20 MHz crystal, divide by 2, 4x PLL enabled(3)
HS/2 w/PLL 8x
10 MHz-20 MHz crystal, divide by 2, 8x PLL enabled(3)
HS/2 w/PLL 16x
10 MHz-15 MHz crystal, divide by 2, 16x PLL enabled(1)
HS/3 w/PLL 4x
12 MHz-25 MHz crystal, divide by 3, 4x PLL enabled(4)
HS/3 w/PLL 8x
12 MHz-25 MHz crystal, divide by 3, 8x PLL enabled(4)
HS/3 w/PLL 16x
12 MHz-22.5 MHz crystal, divide by 3, 16x PLL enabled(1)(4)
EC
External clock input (0-40 MHz)
ECIO
External clock input (0-40 MHz), OSC2 pin is I/O
EC w/PLL 4x
External clock input (4-10 MHz), OSC2 pin is I/O, 4x PLL enabled
EC w/PLL 8x
External clock input (4-10 MHz), OSC2 pin is I/O, 8x PLL enabled
EC w/PLL 16x
External clock input (4-7.5 MHz), OSC2 pin is I/O, 16x PLL enabled(1)
ERC
External RC oscillator, OSC2 pin is FOSC/4 output(5)
ERCIO
External RC oscillator, OSC2 pin is I/O(5)
FRC
7.37 MHz internal RC oscillator
FRC w/PLL 4x
7.37 MHz internal RC oscillator, 4x PLL enabled
FRC w/PLL 8x
7.37 MHz internal RC oscillator, 8x PLL enabled
FRC w/PLL 16x
7.37 MHz internal RC oscillator, 16x PLL enabled
LPRC
512 kHz internal RC oscillator
Note 1:
2:
3:
4:
5:
Any higher will violate device operating frequency range.
LP oscillator can be conveniently shared as system clock, as well as Real-Time Clock for Timer1.
Any higher will violate PLL input range.
Any lower will violate PLL input range.
Requires external R and C. Frequency operation up to 4 MHz.
DS70150D-page 150
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 21-1:
OSCILLATOR SYSTEM BLOCK DIAGRAM
Oscillator Configuration bits
PWRSAV Instruction
Wake-up Request
FPLL
OSC1
OSC2
Primary
Oscillator
PLL
x4, x8, x16
PLL
Lock
COSC<2:0>
Primary Osc
TUN<5:0>
6
NOSC<2:0>
Primary
Oscillator
Stability Detector
OSWEN
Internal Fast RC
Oscillator (FRC)
POR Done
Oscillator
Start-up
Timer
Clock
Secondary Osc
Switching
and Control
Block
SOSCO
SOSCI
32 kHz LP
Oscillator
Secondary
Oscillator
Stability Detector
Internal LowPower RC
Oscillator (LPRC)
FCKSM<1:0>
2
Programmable
Clock Divider System
Clock
2
POST<1:0>
LPRC
Fail-Safe Clock
Monitor (FSCM)
CF
Oscillator Trap
to Timer1
© 2008 Microchip Technology Inc.
DS70150D-page 151
dsPIC30F6010A/6015
21.2
Oscillator Configurations
21.2.1
INITIAL CLOCK SOURCE
SELECTION
While coming out of Power-on Reset or Brown-out
Reset, the device selects its clock source based on:
a)
b)
FOS<2:0> Configuration bits that select one of
four oscillator groups,
and FPR<4:0> Configuration bits that select one
of 16 oscillator choices within the primary group.
The selection is as shown in Table 21-2.
TABLE 21-2:
.CONFIGURATION BIT VALUES FOR CLOCK SELECTION
Oscillator Mode
Oscillator
Source
FOS<2:0>
FPR<4:0>
OSC2 Function
ECIO w/PLL 4x
PLL
1
1
1
0
1
1
0
1
I/O
ECIO w/PLL 8x
PLL
1
1
1
0
1
1
1
0
I/O
ECIO w/PLL 16x
PLL
1
1
1
0
1
1
1
1
I/O
FRC w/PLL 4x
PLL
1
1
1
0
0
0
0
1
I/O
FRC w/PLL 8x
PLL
1
1
1
0
1
0
1
0
I/O
FRC w/PLL 16x
PLL
1
1
1
0
0
0
1
1
I/O
XT w/PLL 4x
PLL
1
1
1
0
0
1
0
1
OSC2
XT w/PLL 8x
PLL
1
1
1
0
0
1
1
0
OSC2
XT w/PLL 16x
PLL
1
1
1
0
0
1
1
1
OSC2
HS/2 w/PLL 4x
PLL
1
1
1
1
0
0
0
1
OSC2
HS/2 w/PLL 8x
PLL
1
1
1
1
0
0
1
0
OSC2
HS/2 w/PLL 16x
PLL
1
1
1
1
0
0
1
1
OSC2
OSC2
HS/3 w/PLL 4x
PLL
1
1
1
1
0
1
0
1
HS/3 w/PLL 8x
PLL
1
1
1
1
0
1
1
0
OSC2
HS/3 w/PLL 16x
PLL
1
1
1
1
0
1
1
1
OSC2
ECIO
External
0
1
1
0
1
1
0
0
I/O
XT
External
0
1
1
0
0
1
0
0
OSC2
HS
External
0
1
1
0
0
0
1
0
OSC2
EC
External
0
1
1
0
1
0
1
1
CLKO
ERC
External
0
1
1
0
1
0
0
1
CLKO
ERCIO
External
0
1
1
0
1
0
0
0
I/O
XTL
External
0
1
1
0
0
0
0
0
OSC2
LP
Secondary
0
0
0
x
x
x
x
x
(Note 1, 2)
FRC
Internal FRC
0
0
1
x
x
x
x
x
(Note 1, 2)
Internal LPRC
0
1
0
x
x
x
x
x
(Note 1, 2)
LPRC
Note 1:
2:
The OC2 pin is usable as general-purpose I/O pin functionality only, depending on the Primary Oscillator
mode selection (FPR<4:0>).
OSC1 pin cannot be used as an I/O pin even if the secondary oscillator or an internal clock source is
selected at all times.
DS70150D-page 152
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
21.2.2
OSCILLATOR START-UP TIMER
(OST)
In order to ensure that a crystal oscillator (or ceramic
resonator) has started and stabilized, an Oscillator
Start-up Timer is included. It is a simple 10-bit counter
that counts 1024 TOSC cycles before releasing the
oscillator clock to the rest of the system. The time-out
period is designated as TOST. The TOST time is involved
every time the oscillator has to restart (i.e., on POR,
BOR and wake-up from Sleep). The Oscillator Start-up
Timer is applied to the LP, XT, XTL and HS Oscillator
modes (upon wake-up from Sleep, POR and BOR) for
the primary oscillator.
21.2.3
LP OSCILLATOR CONTROL
Enabling the LP oscillator is controlled with two
elements:
• The current oscillator group bits COSC<2:0>
• The LPOSCEN bit (OSCCON register)
The LP oscillator is ON (even during Sleep mode) if
LPOSCEN = 1. The LP oscillator is the device clock if:
• COSC<2:0> = 000 (LP selected as main oscillator)
and
• LPOSCEN = 1
Keeping the LP oscillator ON at all times allows for a
fast switch to the 32 kHz system clock for lower power
operation. Returning to the faster main oscillator will
still require a start-up time.
21.2.4
PHASE LOCKED LOOP (PLL)
The PLL multiplies the clock which is generated by the
primary oscillator. The PLL is selectable to have either
gains of x4, x8 and x16. Input and output frequency
ranges are summarized in Table 21-3.
TABLE 21-3:
Fin
4 MHz-10 MHz
4 MHz-10 MHz
4 MHz-7.5 MHz
PLL FREQUENCY RANGE
PLL
Multiplier
x4
x8
x16
Fout
16 MHz-40 MHz
32 MHz-80 MHz
64 MHz-120 MHz
The PLL features a lock output, which is asserted when
the PLL enters a phase locked state. Should the loop
fall out of lock (e.g., due to noise), the lock signal will be
rescinded. The state of this signal is reflected in the
read-only LOCK bit in the OSCCON register.
© 2008 Microchip Technology Inc.
21.2.5
FAST RC OSCILLATOR (FRC)
The FRC oscillator is a fast (7.37 MHz nominal) internal
RC oscillator. This oscillator is intended to provide
reasonable device operating speeds without the use of
an external crystal, ceramic resonator or RC network.
The FRC oscillator can be used with the PLL to obtain
higher clock frequencies.
The dsPIC30F operates from the FRC oscillator
whenever the current oscillator selection control bits in
the OSCCON register (OSCCON<14:12>) are set to
‘001’.
The 6-bit field specified by TUN<5:0> (OSCTUN<5:0>)
allows the user to tune the internal fast RC oscillator
(nominal 7.37 MHz). The user can tune the FRC
oscillator within a range of +12.6% (930 kHz) and -13%
(960 kHz) in steps of 0.4% around the
factory-calibrated setting, see Table 20-4.
If OSCCON<14:12> are set to ‘111’ and FPR<4:0> are
set to ‘00101’, ‘00110’ or ‘00111’, then a PLL
multiplier of 4, 8 or 16 (respectively) is applied.
Note:
When a 16x PLL is used, the FRC
oscillator must not be tuned to a frequency
greater than 7.5 MHz.
TABLE 21-4:
TUN<5:0>
Bits
01 1111
01 1110
01 1101
...
00 0100
00 0011
00 0010
00 0001
00 0000
11
11
11
11
1111
1110
1101
1100
...
10 0011
10 0010
10 0001
10 0000
FRC TUNING
FRC Frequency
+12.6%
+12.2%
+11.8%
...
+1.6%
+1.2%
+0.8%
+0.4%
Center Frequency (oscillator is
running at calibrated frequency)
-0.4%
-0.8%
-1.2%
-1.6%
...
-11.8%
-12.2%
-12.6%
-13.0%
DS70150D-page 153
dsPIC30F6010A/6015
21.2.6
LOW-POWER RC OSCILLATOR
(LPRC)
The LPRC oscillator is a component of the Watchdog
Timer (WDT) and oscillates at a nominal frequency of
512 kHz. The LPRC oscillator is the clock source for
the Power-up Timer (PWRT) circuit, WDT and clock
monitor circuits. It may also be used to provide a low
frequency clock source option for applications where
power consumption is critical, and timing accuracy is
not required.
The LPRC oscillator is always enabled at a Power-on
Reset, because it is the clock source for the PWRT.
After the PWRT expires, the LPRC oscillator will remain
ON if one of the following is TRUE:
• The Fail-Safe Clock Monitor is enabled
• The WDT is enabled
• The LPRC oscillator is selected as the system
clock via the COSC<2:0> control bits in the
OSCCON register
If one of the above conditions is not true, the LPRC will
shut-off after the PWRT expires.
Note 1: OSC2 pin function is determined by the
Primary Oscillator mode selection
(FPR<4:0>).
2: Note that OSC1 pin cannot be used as an
I/O pin, even if the secondary oscillator or
an internal clock source is selected at all
times.
21.2.7
FAIL-SAFE CLOCK MONITOR
The Fail-Safe Clock Monitor (FSCM) allows the device
to continue to operate even in the event of an oscillator
failure. The FSCM function is enabled by appropriately
programming the FCKSM Configuration bits (Clock
Switch and Monitor Selection bits) in the FOSC device
Configuration register. If the FSCM function is
enabled, the LPRC internal oscillator will run at all
times (except during Sleep mode) and will not be
subject to control by the SWDTEN bit.
In the event of an oscillator failure, the FSCM will
generate a clock failure trap event and will switch the
system clock over to the FRC oscillator. The user will
then have the option to either attempt to restart the
oscillator or execute a controlled shutdown. The user
may decide to treat the trap as a warm Reset by simply
loading the Reset address into the oscillator fail trap
vector. In this event, the CF (Clock Fail) Status bit
(OSCCON<3>) is also set whenever a clock failure is
recognized.
In the event of a clock failure, the WDT is unaffected
and continues to run on the LPRC clock.
If the oscillator has a very slow start-up time coming
out of POR, BOR or Sleep, it is possible that the
PWRT timer will expire before the oscillator has
started. In such cases, the FSCM will be activated and
DS70150D-page 154
the FSCM will initiate a clock failure trap, and the
COSC<2:0> bits are loaded with FRC oscillator
selection. This will effectively shut-off the original
oscillator that was trying to start.
The user may detect this situation and restart the
oscillator in the clock fail trap ISR.
Upon a clock failure detection, the FSCM module will
initiate a clock switch to the FRC oscillator as follows:
1.
2.
3.
The COSC bits (OSCCON<14:12>) are loaded
with the FRC oscillator selection value.
CF bit is set (OSCCON<3>).
OSWEN control bit (OSCCON<0>) is cleared.
For the purpose of clock switching, the clock sources
are sectioned into four groups:
•
•
•
•
Primary
Secondary
Internal FRC
Internal LPRC
The user can switch between these functional groups,
but cannot switch between options within a group. If the
primary group is selected, then the choice within the
group is always determined by the FPR<4:0>
Configuration bits.
The OSCCON register holds the control and Status bits
related to clock switching.
• COSC<2:0>: Read-only Status bits always reflect
the current oscillator group in effect.
• NOSC<2:0>: Control bits which are written to
indicate the new oscillator group of choice.
- On POR and BOR, COSC<2:0> and
NOSC<2:0> are both loaded with the
Configuration bit values FOS<2:0>.
• LOCK: The LOCK Status bit indicates a PLL lock.
• CF: Read-only Status bit indicating if a clock fail
detect has occurred.
• OSWEN: Control bit changes from a ‘0’ to a ‘1’
when a clock transition sequence is initiated.
Clearing the OSWEN control bit will abort a clock
transition in progress (used for hang-up situations).
If Configuration bits FCKSM<1:0> = 1x, then the clock
switching and Fail-Safe Clock Monitor functions are
disabled. This is the default Configuration bit setting.
If clock switching is disabled, then the FOS<2:0> and
FPR<4:0> bits directly control the oscillator selection
and the COSC<2:0> bits do not control the clock
selection. However, these bits will reflect the clock
source selection.
Note:
The application should not attempt to
switch to a clock of frequency lower than
100 kHz when the Fail-Safe Clock Monitor
is enabled. If clock switching is performed,
the device may generate an oscillator fail
trap and switch to the fast RC oscillator.
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
21.2.8
PROTECTION AGAINST
ACCIDENTAL WRITES TO OSCCON
A write to the OSCCON register is intentionally made
difficult because it controls clock switching and clock
scaling.
To write to the OSCCON low byte, the following code
sequence must be executed without any other
instructions in between:
Byte Write “0x46” to OSCCON low
Byte Write “0x57” to OSCCON low
Byte write is allowed for one instruction cycle. Write the
desired value or use bit manipulation instruction.
To write to the OSCCON high byte, the following
instructions must be executed without any other
instructions in between:
Byte Write “0x78” to OSCCON high
Byte Write “0x9A” to OSCCON high
Byte write is allowed for one instruction cycle. Write the
desired value or use bit manipulation instruction.
21.3
Reset
The dsPIC30F differentiates between various kinds of
Reset:
a)
b)
c)
d)
e)
f)
g)
h)
Power-on Reset (POR)
MCLR Reset during normal operation
MCLR Reset during Sleep
Watchdog Timer (WDT) Reset (during normal
operation)
Programmable Brown-out Reset (BOR)
RESET Instruction
Reset caused by trap lockup (TRAPR)
Reset caused by illegal opcode, or by using an
uninitialized W register as an Address Pointer
(IOPUWR)
Different registers are affected in different ways by
various Reset conditions. Most registers are not
affected by a WDT wake-up, since this is viewed as the
resumption of normal operation. Status bits from the
RCON register are set or cleared differently in different
Reset situations, as indicated in Table 21-5. These bits
are used in software to determine the nature of the
Reset.
A block diagram of the on-chip Reset circuit is shown in
Figure 21-2.
A MCLR noise filter is provided in the MCLR Reset
path. The filter detects and ignores small pulses.
Internally generated Resets do not drive MCLR pin low.
FIGURE 21-2:
RESET SYSTEM BLOCK DIAGRAM
RESET
Instruction
Digital
Glitch Filter
MCLR
Sleep or Idle
WDT
Module
POR
VDD Rise
Detect
S
VDD
Brown-out
Reset
BOR
BOREN
R
Trap Conflict
Q
SYSRST
Illegal Opcode/
Uninitialized W Register
© 2008 Microchip Technology Inc.
DS70150D-page 155
dsPIC30F6010A/6015
21.3.1
POR: POWER-ON RESET
A power-on event will generate an internal POR pulse
when a VDD rise is detected. The Reset pulse will occur
at the POR circuit threshold voltage (VPOR), which is
nominally 1.85V. The device supply voltage
characteristics must meet specified starting voltage
and rise rate requirements. The POR pulse will reset a
POR timer and place the device in the Reset state. The
POR also selects the device clock source identified by
the oscillator configuration fuses.
FIGURE 21-3:
The POR circuit inserts a small delay, TPOR, which is
nominally 10 μs and ensures that the device bias
circuits are stable. Furthermore, a user selected
power-up time-out (TPWRT) is applied. The TPWRT
parameter is based on device Configuration bits and
can be 0 ms (no delay), 4 ms, 16 ms or 64 ms. The total
delay is at device power-up TPOR + TPWRT. When
these delays have expired, SYSRST will be negated on
the next leading edge of the Q1 clock, and the PC will
jump to the Reset vector.
The timing for the SYSRST signal is shown in
Figure 21-3 through Figure 21-5.
TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD)
VDD
MCLR
Internal POR
TOST
OST Time-out
TPWRT
PWRT Time-out
Internal Reset
TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1
FIGURE 21-4:
VDD
MCLR
Internal POR
TOST
OST Time-out
TPWRT
PWRT Time-out
Internal Reset
DS70150D-page 156
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 21-5:
TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2
VDD
MCLR
Internal POR
TOST
OST Time-out
TPWRT
PWRT Time-out
Internal Reset
21.3.1.1
POR with Long Crystal Start-up Time
(with FSCM Enabled)
The oscillator start-up circuitry is not linked to the POR
circuitry. Some crystal circuits (especially low frequency
crystals) will have a relatively long start-up time.
Therefore, one or more of the following conditions is
possible after the POR timer and the PWRT have
expired:
• The oscillator circuit has not begun to oscillate.
• The Oscillator Start-up Timer has NOT expired (if
a crystal oscillator is used).
• The PLL has not achieved a LOCK (if PLL is
used).
If the FSCM is enabled and one of the above conditions
is true, then a clock failure trap will occur. The device
will automatically switch to the FRC oscillator and the
user can switch to the desired crystal oscillator in the
trap ISR.
21.3.1.2
Operating without FSCM and PWRT
If the FSCM is disabled and the Power-up Timer
(PWRT) is also disabled, then the device will exit rapidly
from Reset on power-up. If the clock source is FRC,
LPRC, EXTRC or EC, it will be active immediately.
If the FSCM is disabled and the system clock has not
started, the device will be in a frozen state at the Reset
vector until the system clock starts. From the user’s
perspective, the device will appear to be in Reset until
a system clock is available.
© 2008 Microchip Technology Inc.
21.3.2
BOR: PROGRAMMABLE
BROWN-OUT RESET
The BOR (Brown-out Reset) module is based on an
internal voltage reference circuit. The main purpose of
the BOR module is to generate a device Reset when a
brown-out condition occurs. Brown-out conditions are
generally caused by glitches on the AC mains (i.e.,
missing portions of the AC cycle waveform due to bad
power transmission lines or voltage sags due to excessive current draw when a large inductive load is turned
on).
The BOR module allows selection of one of the
following voltage trip points:
• 2.6V–2.71V
• 4.1V–4.4V
• 4.58V–4.73V
Note:
The BOR voltage trip points indicated here
are nominal values provided for design
guidance only.
A BOR will generate a Reset pulse which will reset the
device. The BOR will select the clock source, based on
the device Configuration bit values (FOS<2:0> and
FPR<4:0>). Furthermore, if an oscillator mode is
selected, the BOR will activate the Oscillator Start-up
Timer (OST). The system clock is held until OST
expires. If the PLL is used, then the clock will be held
until the LOCK bit (OSCCON<5>) is ‘1’.
DS70150D-page 157
dsPIC30F6010A/6015
Concurrently, the POR time-out (TPOR) and the PWRT
time-out (TPWRT) will be applied before the internal
Reset is released. If TPWRT = 0 and a crystal oscillator
is being used, then a nominal delay of TFSCM = 100 μs
is applied. The total delay in this case is
(TPOR + TFSCM).
The BOR Status bit (RCON<1>) will be set to indicate
that a BOR has occurred. The BOR circuit, if enabled,
will continue to operate while in Sleep or Idle modes
and will reset the device should VDD fall below the BOR
threshold voltage.
FIGURE 21-6:
EXTERNAL POWER-ON
RESET CIRCUIT (FOR
SLOW VDD POWER-UP)
VDD
D
R
R1
C
MCLR
dsPIC30F
Note 1: External Power-on Reset circuit is
required only if the VDD power-up slope
is too slow. The diode D helps discharge
the capacitor quickly when VDD powers
down.
2: R should be suitably chosen so as to
make sure that the voltage drop across
R does not violate the device’s electrical
specification.
3: R1 should be suitably chosen so as to
limit any current flowing into MCLR from
external capacitor C, in the event of
MCLR/VPP pin breakdown due to Electrostatic Discharge (ESD) or Electrical
Overstress (EOS).
Note:
DS70150D-page 158
Dedicated supervisory devices, such as
the MCP1XX and MCP8XX, may also be
used as an external Power-on Reset
circuit.
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
Table 21-5 shows the Reset conditions for the RCON
register. Since the control bits within the RCON register
are R/W, the information in the table means that all the
bits are negated prior to the action specified in the
condition column.
TABLE 21-5:
INITIALIZATION CONDITION FOR RCON REGISTER CASE 1
Condition
Program
Counter
TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR BOR
Power-on Reset
0x000000
0
0
0
0
0
0
0
1
1
Brown-out Reset
0x000000
0
0
0
0
0
0
0
0
1
MCLR Reset during normal
operation
0x000000
0
0
1
0
0
0
0
0
0
Software Reset during
normal operation
0x000000
0
0
0
1
0
0
0
0
0
MCLR Reset during Sleep
0x000000
0
0
1
0
0
0
1
0
0
MCLR Reset during Idle
0x000000
0
0
1
0
0
1
0
0
0
WDT Time-out Reset
0x000000
0
0
0
0
1
0
0
0
0
WDT Wake-up
PC + 2
0
0
0
0
1
0
1
0
0
Interrupt Wake-up from
Sleep
PC + 2(1)
0
0
0
0
0
0
1
0
0
Clock Failure Trap
0x000004
0
0
0
0
0
0
0
0
0
Trap Reset
0x000000
1
0
0
0
0
0
0
0
0
Illegal Operation Trap
0x000000
0
1
0
0
0
0
0
0
0
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’
Note 1: When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector.
Table 21-6 shows a second example of the bit
conditions for the RCON register. In this case, it is not
assumed the user has set/cleared specific bits prior to
action specified in the condition column.
TABLE 21-6:
INITIALIZATION CONDITION FOR RCON REGISTER CASE 2
Condition
Program
Counter
TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR BOR
Power-on Reset
0x000000
0
0
0
0
0
0
0
1
1
Brown-out Reset
0x000000
u
u
u
u
u
u
u
0
1
MCLR Reset during normal
operation
0x000000
u
u
1
0
0
0
0
u
u
Software Reset during
normal operation
0x000000
u
u
0
1
0
0
0
u
u
MCLR Reset during Sleep
0x000000
u
u
1
u
0
0
1
u
u
MCLR Reset during Idle
0x000000
u
u
1
u
0
1
0
u
u
WDT Time-out Reset
0x000000
u
u
0
0
1
0
0
u
u
WDT Wake-up
PC + 2
u
u
u
u
1
u
1
u
u
Interrupt Wake-up from
Sleep
PC + 2(1)
u
u
u
u
u
u
1
u
u
Clock Failure Trap
0x000004
u
u
u
u
u
u
u
u
u
Trap Reset
0x000000
1
u
u
u
u
u
u
u
u
Illegal Operation Reset
0x000000
u
1
u
u
u
u
u
u
u
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’
Note 1: When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector.
© 2008 Microchip Technology Inc.
DS70150D-page 159
dsPIC30F6010A/6015
21.4
21.4.1
Watchdog Timer (WDT)
WATCHDOG TIMER OPERATION
The primary function of the Watchdog Timer (WDT) is
to reset the processor in the event of a software
malfunction. The WDT is a free running timer, which
runs off an on-chip RC oscillator, requiring no external
component. Therefore, the WDT timer will continue to
operate even if the main processor clock (e.g., the
crystal oscillator) fails.
21.4.2
ENABLING AND DISABLING THE
WDT
The Watchdog Timer can be “Enabled” or “Disabled”
only through a Configuration bit (FWDTEN) in the
Configuration register FWDT.
The processor wakes up from Sleep if at least one of
the following conditions has occurred:
• any interrupt that is individually enabled and
meets the required priority level
• any Reset (POR, BOR and MCLR)
• WDT time-out
On waking up from Sleep mode, the processor will
restart the same clock that was active prior to entry
into Sleep mode. When clock switching is enabled,
bits COSC<2:0> will determine the oscillator source
that will be used on wake-up. If clock switch is
disabled, then there is only one system clock.
Note:
If a POR or BOR occurred, the selection of
the oscillator is based on the FOS<2:0>
and FPR<4:0> Configuration bits.
Setting FWDTEN = 1 enables the Watchdog Timer.
The enabling is done when programming the device.
By default, after chip-erase, FWDTEN bit = 1. Any
device programmer capable of programming
dsPIC30F devices allows programming of this and
other Configuration bits.
If the clock source is an oscillator, the clock to the
device is held off until OST times out (indicating a
stable oscillator). If PLL is used, the system clock is
held off until LOCK = 1 (indicating that the PLL is
stable). Either way, TPOR, TLOCK and TPWRT delays are
applied.
If enabled, the WDT will increment until it overflows or
“times out”. A WDT time-out will force a device Reset
(except during Sleep). To prevent a WDT time-out, the
user must clear the Watchdog Timer using a CLRWDT
instruction.
If EC, FRC, LPRC or ERC oscillators are used, then a
delay of TPOR (~ 10 μs) is applied. This is the smallest
delay possible on wake-up from Sleep.
If a WDT times out during Sleep, the device will
wake-up. The WDTO bit in the RCON register will be
cleared to indicate a wake-up resulting from a WDT
time-out.
Setting FWDTEN = 0 allows user software to
enable/disable the Watchdog Timer via the SWDTEN
(RCON<5>) control bit.
21.5
Power-Saving Modes
There are two power-saving states that can be entered
through the execution of a special instruction, PWRSAV.
These are: Sleep and Idle.
The format of the PWRSAV instruction is as follows:
PWRSAV <parameter>, where ‘parameter’ defines
Idle or Sleep mode.
21.5.1
SLEEP MODE
In Sleep mode, the clock to the CPU and peripherals is
shut down. If an on-chip oscillator is being used, it is
shut down.
The Fail-Safe Clock Monitor is not functional during
Sleep, since there is no clock to monitor. However,
LPRC clock remains active if WDT is operational during
Sleep.
The Brown-out protection circuit, if enabled, will remain
functional during Sleep.
DS70150D-page 160
Moreover, if LP oscillator was active during Sleep, and
LP is the oscillator used on wake-up, then the start-up
delay will be equal to TPOR. PWRT delay and OST
timer delay are not applied. In order to have the
smallest possible start-up delay when waking up from
Sleep, one of these faster wake-up options should be
selected before entering Sleep.
Any interrupt that is individually enabled (using the
corresponding IE bit) and meets the prevailing priority
level will be able to wake-up the processor. The
processor will process the interrupt and branch to the
ISR. The Sleep Status bit in RCON register is set upon
wake-up.
Note:
In spite of various delays applied (TPOR,
TLOCK and TPWRT), the crystal oscillator
(and PLL) may not be active at the end of
the time-out (e.g., for low-frequency
crystals). In such cases, if FSCM is
enabled, then the device will detect this as
a clock failure and process the clock failure
trap, the FRC oscillator will be enabled, and
the user will have to re-enable the crystal
oscillator. If FSCM is not enabled, then the
device will simply suspend execution of
code until the clock is stable, and will
remain in Sleep until the oscillator clock has
started.
All Resets will wake-up the processor from Sleep
mode. Any Reset, other than POR, will set the Sleep
Status bit. In a POR, the Sleep bit is cleared.
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
If Watchdog Timer is enabled, then the processor will
wake-up from Sleep mode upon WDT time-out. The
Sleep and WDTO Status bits are both set.
21.5.2
IDLE MODE
In Idle mode, the clock to the CPU is shutdown while
peripherals keep running. Unlike Sleep mode, the clock
source remains active.
Several peripherals have a control bit in each module,
that allows them to operate during Idle.
LPRC fail-safe clock remains active if clock failure
detect is enabled.
The processor wakes up from Idle if at least one of the
following conditions is true:
• on any interrupt that is individually enabled (IE bit
is ‘1’) and meets the required priority level
• on any Reset (POR, BOR, MCLR)
• on WDT time-out
Upon wake-up from Idle mode, the clock is re-applied
to the CPU and instruction execution begins
immediately, starting with the instruction following the
PWRSAV instruction.
Any interrupt that is individually enabled (using IE bit)
and meets the prevailing priority level will be able to
wake-up the processor. The processor will process the
interrupt and branch to the ISR. The Idle Status bit in
RCON register is set upon wake-up.
Any Reset, other than POR, will set the Idle Status bit.
On a POR, the Idle bit is cleared.
If Watchdog Timer is enabled, then the processor will
wake-up from Idle mode upon WDT time-out. The Idle
and WDTO Status bits are both set.
Unlike wake-up from Sleep, there are no time delays
involved in wake-up from Idle.
21.6
Device Configuration Registers
The Configuration bits in each device Configuration
register specify some of the device modes and are
programmed by a device programmer, or by using the
In-Circuit Serial Programming™ (ICSP™) feature of the
device. Each device Configuration register is a 24-bit
register, but only the lower 16 bits of each register are
used to hold configuration data. There are six device
Configuration registers available to the user:
1.
2.
3.
4.
5.
6.
7.
FOSC (0xF80000): Oscillator Configuration
register
FWDT (0xF80002): Watchdog Timer
Configuration register
FBORPOR (0xF80004): BOR and POR
Configuration register
FBS (0xF80006): Boot Code Segment
Configuration register
FSS (0xF80008): Secure Code Segment
Configuration register
FGS (0xF8000A): General Code Segment
Configuration register
FICD (0xF8000C): FUSE Configuration
Register
The placement of the Configuration bits is automatically
handled when you select the device in your device
programmer. The desired state of the Configuration bits
may be specified in the source code (dependent on the
language tool used), or through the programming
interface. After the device has been programmed, the
application software may read the Configuration bit
values through the table read instructions. For additional
information, please refer to the “dsPIC30F/33F
Programmers Reference Manual” (DS70157) and the
“dsPIC30F Family Reference Manual” (DS70046).
Note 1: If the code protection Configuration Fuse
bits (FBS(BSS<2:0>), FSS(SSS<2:0>),
FGS<GCP> and FGS<GWRP>) have
been programmed, an erase of the entire
code-protected device is only possible at
voltages VDD ≥ 4.5V.
2: This device supports an Advanced
implementation
of
CodeGuard™
Security. Please refer to the “CodeGuard
Security”
chapter
(DS70180)
for
information on how CodeGuard Security
may be used in your application.
© 2008 Microchip Technology Inc.
DS70150D-page 161
dsPIC30F6010A/6015
21.7
Peripheral Module Disable (PMD)
Registers
The Peripheral Module Disable (PMD) registers
provide a method to disable a peripheral module by
stopping all clock sources supplied to that module.
When a peripheral is disabled via the appropriate PMD
control bit, the peripheral is in a minimum power
consumption state. The control and STATUS registers
associated with the peripheral will also be disabled so
writes to those registers will have no effect and read
values will be invalid.
A peripheral module will only be enabled if both the
associated bit in the PMD register is cleared and the
peripheral is supported by the specific dsPIC DSC
variant. If the peripheral is present in the device, it is
enabled in the PMD register by default.
Note:
If a PMD bit is set, the corresponding
module is disabled after a delay of 1
instruction cycle. Similarly, if a PMD bit is
cleared, the corresponding module is
enabled after a delay of 1 instruction cycle
(assuming the module control registers
are already configured to enable module
operation).
21.8
When MPLAB® ICD 2 is selected as a debugger, the
In-Circuit Debugging functionality is enabled. This
function allows simple debugging functions when used
with MPLAB IDE. When the device has this feature
enabled, some of the resources are not available for
general use. These resources include the first 80 bytes
of data RAM and two I/O pins.
One of four pairs of debug I/O pins may be selected by
the user using configuration options in MPLAB IDE.
These pin pairs are named EMUD/EMUC,
EMUD1/EMUC1, EMUD2/EMUC2 and MUD3/EMUC3.
In each case, the selected EMUD pin is the
Emulation/Debug Data line, and the EMUC pin is the
Emulation/Debug Clock line. These pins will interface
to the MPLAB ICD 2 module available from Microchip.
The selected pair of debug I/O pins is used by MPLAB
ICD 2 to send commands and receive responses, as
well as to send and receive data. To use the In-Circuit
Debugger function of the device, the design must
implement ICSP connections to MCLR, VDD, VSS,
PGC, PGD and the selected EMUDx/EMUCx pin pair.
This gives rise to two possibilities:
1.
2.
DS70150D-page 162
In-Circuit Debugger
If EMUD/EMUC is selected as the debug I/O pin
pair, then only a 5-pin interface is required, as
the EMUD and EMUC pin functions are
multiplexed with the PGD and PGC pin functions
in all dsPIC30F devices.
If
EMUD1/EMUC1,
EMUD2/EMUC2
or
EMUD3/EMUC3 is selected as the debug I/O
pin pair, then a 7-pin interface is required, as the
EMUDx/EMUCx pin functions (x = 1, 2 or 3) are
not multiplexed with the PGD and PGC pin
functions.
© 2008 Microchip Technology Inc.
© 2008 Microchip Technology Inc.
TABLE 21-7:
SFR
Name
Addr.
RCON
SYSTEM INTEGRATION REGISTER MAP FOR dsPIC30F6010A(1)
Bit 15
Bit 14
Bit 13
0740 TRAPR IOPUWR BGST
—
—
OSCCON 0742
OSCTUN 0744
PMD1
0770
T5MD
COSC<2:0>
—
—
T4MD
T3MD
Bit 12
Bit 11
Bit 10
—
—
—
—
—
T2MD
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
—
—
—
EXTR
SWR
SWDTEN
WDTO
SLEEP
IDLE
LOCK
—
—
NOSC<2:0>
—
POST<1:0>
—
—
—
T1MD QEIMD PWMMD
—
I2CMD
U2MD
PMD2
0772 IC8MD IC7MD IC6MD IC5MD IC4MD IC3MD IC2MD IC1MD OC8MD OC7MD
Legend:
— = unimplemented bit, read as ‘0’
Note 1:
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
TABLE 21-8:
SFR
Name
Addr.
RCON
PMD1
Bit 14
Bit 13
0740 TRAPR IOPUWR BGST
—
—
0770
T5MD
COSC<2:0>
—
—
T4MD
T3MD
Bit 12
Bit 11
Bit 10
BOR
POR
Depends on type of Reset.
LPOSCEN OSWEN Depends on Configuration bits.
0000 0000 0000 0000
C1MD
ADCMD
0000 0000 0000 0000
OC2MD
OC1MD
0000 0000 0000 0000
—
—
—
—
—
T2MD
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
—
—
—
EXTR
SWR
SWDTEN
WDTO
SLEEP
IDLE
LOCK
—
—
NOSC<2:0>
—
T1MD QEIMD PWMMD
POST<1:0>
—
—
—
—
I2CMD
U2MD
U1MD
OC6MD
CF
—
TUN<5:0>
BOR
POR
SPI2MD SPI1MD
—
OC5MD OC4MD OC3MD
Depends on type of Reset.
LPOSCEN OSWEN Depends on Configuration bits.
0000 0000 0000 0000
C1MD
ADCMD
0000 0000 0000 0000
OC2MD
OC1MD
0000 0000 0000 0000
DEVICE CONFIGURATION REGISTER MAP(1)
Addr.
Bits 23-16
F80000
—
Bit 15
Bit 14
FCKSM<1:0>
Bit 13
Bit 12
Bit 11
—
—
—
Bit 10
Bit 9
Bit 8
FOS<2:0>
Bit 7
Bit 6
Bit 5
—
—
—
Bit 4
FWDT
F80002
—
FWDTEN
—
—
—
—
—
—
—
—
—
FWPSA<1:0>
F80004
—
MCLREN
—
—
—
—
PWMPIN
HPOL
LPOL
BOREN
—
BORV<1:0>
FBS
F80006
RBS1
RBS0
FSS
F80008
RSS1
RSS0
FGS
F8000A
—
—
—
—
—
—
—
—
—
—
—
—
—
—
F8000C
— = unimplemented bit, read as ‘0’
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
Bit 3
Bit 2
Bit 1
Bit 0
FPR<4:0>
FBORPOR
FICD
Legend:
Note 1:
Reset State
FWPSB<3:0>
—
—
FPWRT<1:0>
EBS
BSS<2:0>
ESS1
ESS0
SSS<2:0>
—
—
—
—
—
—
—
GSS<1:0>
—
—
BKBUG
COE
—
—
—
—
BWRP
SWRP
GWRP
ICS<1:0>
DS70150D-page 163
dsPIC30F6010A/6015
File Name
FOSC
C2MD
OC5MD OC4MD OC3MD
Bit 9
PMD2
0772 IC8MD IC7MD IC6MD IC5MD IC4MD IC3MD IC2MD IC1MD OC8MD OC7MD
Legend:
— = unimplemented bit, read as ‘0’
Note 1:
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
TABLE 21-9:
SPI2MD SPI1MD
Bit 0
SYSTEM INTEGRATION REGISTER MAP FOR dsPIC30F6015(1)
Bit 15
OSCCON 0742
OSCTUN 0744
U1MD
OC6MD
CF
—
TUN<5:0>
Bit 1
dsPIC30F6010A/6015
NOTES:
DS70150D-page 164
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
22.0
Note:
INSTRUCTION SET SUMMARY
This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
“dsPIC30F Family Reference Manual”
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmers
Reference Manual” (DS70157).
The dsPIC30F instruction set adds many
enhancements to the previous PIC® Microcontroller
(MCU) instruction sets, while maintaining an easy
migration from PIC MCU instruction sets.
Most instructions are a single program memory word
(24-bits). Only three instructions require two program
memory locations.
Each single-word instruction is a 24-bit word divided
into an 8-bit opcode which specifies the instruction
type, and one or more operands which further specify
the operation of the instruction.
The instruction set is highly orthogonal and is grouped
into five basic categories:
•
•
•
•
•
Word or byte-oriented operations
Bit-oriented operations
Literal operations
DSP operations
Control operations
Table 22-1 shows the general symbols used in
describing the instructions.
The dsPIC30F instruction set summary in Table 22-2
lists all the instructions along with the Status flags
affected by each instruction.
Most word or byte-oriented W register instructions
(including barrel shift instructions) have three
operands:
• The first source operand, which is typically a
register ‘Wb’ without any address modifier
• The second source operand, which is typically a
register ‘Ws’ with or without an address modifier
• The destination of the result, which is typically a
register ‘Wd’ with or without an address modifier
However, word or byte-oriented file register instructions
have two operands:
• The file register specified by the value ‘f’
• The destination, which could either be the file
register ‘f’ or the W0 register, which is denoted as
‘WREG’
© 2008 Microchip Technology Inc.
Most bit oriented instructions (including simple rotate/
shift instructions) have two operands:
• The W register (with or without an address
modifier) or file register (specified by the value of
‘Ws’ or ‘f’)
• The bit in the W register or file register
(specified by a literal value, or indirectly by the
contents of register ‘Wb’)
The literal instructions that involve data movement may
use some of the following operands:
• A literal value to be loaded into a W register or file
register (specified by the value of ‘k’)
• The W register or file register where the literal
value is to be loaded (specified by ‘Wb’ or ‘f’)
However, literal instructions that involve arithmetic or
logical operations use some of the following operands:
• The first source operand, which is a register ‘Wb’
without any address modifier
• The second source operand, which is a literal
value
• The destination of the result (only if not the same
as the first source operand), which is typically a
register ‘Wd’ with or without an address modifier
The MAC class of DSP instructions may use some of the
following operands:
• The accumulator (A or B) to be used (required
operand)
• The W registers to be used as the two operands
• The X and Y address space prefetch operations
• The X and Y address space prefetch destinations
• The accumulator write-back destination
The other DSP instructions do not involve any
multiplication, and may include:
• The accumulator to be used (required)
• The source or destination operand (designated as
Wso or Wdo, respectively) with or without an
address modifier
• The amount of shift, specified by a W register ‘Wn’
or a literal value
The control instructions may use some of the following
operands:
• A program memory address
• The mode of the table read and table write
instructions
All instructions are a single word, except for certain
double word instructions, which were made double
word instructions so that all the required information is
available in these 48 bits. In the second word, the
8 MSbs are ‘0’s. If this second word is executed as an
instruction (by itself), it will execute as a NOP.
DS70150D-page 165
dsPIC30F6010A/6015
Most single-word instructions are executed in a single
instruction cycle, unless a conditional test is true or the
program counter is changed as a result of the
instruction. In these cases, the execution takes two
instruction cycles with the additional instruction
cycle(s) executed as a NOP. Notable exceptions are the
BRA (unconditional/computed branch), indirect CALL/
GOTO, all table reads and writes and RETURN/RETFIE
instructions, which are single-word instructions, but
take two or three cycles. Certain instructions that
involve skipping over the subsequent instruction,
TABLE 22-1:
require either two or three cycles if the skip is
performed, depending on whether the instruction being
skipped is a single-word or two-word instruction.
Moreover, double word moves require two cycles. The
double word instructions execute in two instruction
cycles.
Note:
For more details on the instruction set,
refer to the “dsPIC30F/33F Programmers
Reference Manual” (DS70157).
SYMBOLS USED IN OPCODE DESCRIPTIONS
Field
#text
(text)
[text]
{ }
<n:m>
.b
.d
.S
.w
Acc
AWB
bit4
C, DC, N, OV, Z
Expr
f
lit1
lit4
lit5
lit8
lit10
lit14
lit16
lit23
None
OA, OB, SA, SB
PC
Slit10
Slit16
Slit6
DS70150D-page 166
Description
Means literal defined by “text”
Means “content of “text”
Means “the location addressed by text”
Optional field or operation
Register bit field
Byte mode selection
Double Word mode selection
Shadow register select
Word mode selection (default)
One of two accumulators {A, B}
Accumulator Write-Back Destination Address register ∈ {W13, [W13]+ = 2}
4-bit bit selection field (used in word addressed instructions) ∈ {0...15}
MCU Status bits: Carry, Digit Carry, Negative, Overflow, Zero
Absolute address, label or expression (resolved by the linker)
File register address ∈ {0x0000...0x1FFF}
1-bit unsigned literal ∈ {0,1}
4-bit unsigned literal ∈ {0...15}
5-bit unsigned literal ∈ {0...31}
8-bit unsigned literal ∈ {0...255}
10-bit unsigned literal ∈ {0...255} for Byte mode, {0:1023} for Word mode
14-bit unsigned literal ∈ {0...16384}
16-bit unsigned literal ∈ {0...65535}
23-bit unsigned literal ∈ {0...8388608}; LSB must be ‘0’
Field does not require an entry, may be blank
DSP Status bits: AccA Overflow, AccB Overflow, AccA Saturate, AccB Saturate
Program Counter
10-bit signed literal ∈ {-512...511}
16-bit signed literal ∈ {-32768...32767}
6-bit signed literal ∈ {-16...16}
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 22-1:
SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED)
Field
Wb
Wd
Wdo
Wm,Wn
Wm*Wm
Wm*Wn
Wn
Wnd
Wns
WREG
Ws
Wso
Wx
Wxd
Wy
Wyd
© 2008 Microchip Technology Inc.
Description
Base W register ∈ {W0..W15}
Destination W register ∈ { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] }
Destination W register ∈
{ Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] }
Dividend, Divisor working register pair (direct addressing)
Multiplicand and Multiplier working register pair for Square instructions ∈
{W4*W4,W5*W5,W6*W6,W7*W7}
Multiplicand and Multiplier working register pair for DSP instructions ∈
{W4*W5,W4*W6,W4*W7,W5*W6,W5*W7,W6*W7}
One of 16 working registers ∈ {W0..W15}
One of 16 destination working registers ∈ {W0..W15}
One of 16 source working registers ∈ {W0..W15}
W0 (working register used in file register instructions)
Source W register ∈ { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] }
Source W register ∈
{ Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] }
X data space prefetch address register for DSP instructions
∈ {[W8]+ = 6, [W8]+ = 4, [W8]+ = 2, [W8], [W8]- = 6, [W8]- = 4, [W8]- = 2,
[W9]+ = 6, [W9]+ = 4, [W9]+ = 2, [W9], [W9]- = 6, [W9]- = 4, [W9]- = 2,
[W9+W12], none}
X data space prefetch destination register for DSP instructions ∈ {W4..W7}
Y data space prefetch address register for DSP instructions
∈ {[W10]+ = 6, [W10]+ = 4, [W10]+ = 2, [W10], [W10]- = 6, [W10]- = 4, [W10]- = 2,
[W11]+ = 6, [W11]+ = 4, [W11]+ = 2, [W11], [W11]- = 6, [W11]- = 4, [W11]- = 2,
[W11+W12], none}
Y data space prefetch destination register for DSP instructions ∈ {W4..W7}
DS70150D-page 167
dsPIC30F6010A/6015
TABLE 22-2:
INSTRUCTION SET OVERVIEW
Base
Assembly
Instr
Mnemonic
#
1
2
3
4
5
6
7
8
ADD
ADDC
AND
ASR
BCLR
BRA
BSET
BSW
Assembly Syntax
ADD
Acc
Description
Add Accumulators
# of
words
# of
cycles
Status Flags
Affected
1
1
OA,OB,SA,S
B
C,DC,N,OV,Z
ADD
f
f = f + WREG
1
1
ADD
f,WREG
WREG = f + WREG
1
1
C,DC,N,OV,Z
ADD
#lit10,Wn
Wd = lit10 + Wd
1
1
C,DC,N,OV,Z
ADD
Wb,Ws,Wd
Wd = Wb + Ws
1
1
C,DC,N,OV,Z
ADD
Wb,#lit5,Wd
Wd = Wb + lit5
1
1
C,DC,N,OV,Z
ADD
Wso,#Slit4,Acc
16-bit Signed Add to Accumulator
1
1
OA,OB,SA,S
B
C,DC,N,OV,Z
ADDC
f
f = f + WREG + (C)
1
1
ADDC
f,WREG
WREG = f + WREG + (C)
1
1
C,DC,N,OV,Z
ADDC
#lit10,Wn
Wd = lit10 + Wd + (C)
1
1
C,DC,N,OV,Z
ADDC
Wb,Ws,Wd
Wd = Wb + Ws + (C)
1
1
C,DC,N,OV,Z
ADDC
Wb,#lit5,Wd
Wd = Wb + lit5 + (C)
1
1
C,DC,N,OV,Z
AND
f
f = f .AND. WREG
1
1
N,Z
AND
f,WREG
WREG = f .AND. WREG
1
1
N,Z
N,Z
AND
#lit10,Wn
Wd = lit10 .AND. Wd
1
1
AND
Wb,Ws,Wd
Wd = Wb .AND. Ws
1
1
N,Z
AND
Wb,#lit5,Wd
Wd = Wb .AND. lit5
1
1
N,Z
C,N,OV,Z
ASR
f
f = Arithmetic Right Shift f
1
1
ASR
f,WREG
WREG = Arithmetic Right Shift f
1
1
C,N,OV,Z
ASR
Ws,Wd
Wd = Arithmetic Right Shift Ws
1
1
C,N,OV,Z
ASR
Wb,Wns,Wnd
Wnd = Arithmetic Right Shift Wb by Wns
1
1
N,Z
ASR
Wb,#lit5,Wnd
Wnd = Arithmetic Right Shift Wb by lit5
1
1
N,Z
BCLR
f,#bit4
Bit Clear f
1
1
None
BCLR
Ws,#bit4
Bit Clear Ws
1
1
None
None
BRA
C,Expr
Branch if Carry
1
1 (2)
BRA
GE,Expr
Branch if greater than or equal
1
1 (2)
None
BRA
GEU,Expr
Branch if unsigned greater than or equal
1
1 (2)
None
BRA
GT,Expr
Branch if greater than
1
1 (2)
None
BRA
GTU,Expr
Branch if unsigned greater than
1
1 (2)
None
None
BRA
LE,Expr
Branch if less than or equal
1
1 (2)
BRA
LEU,Expr
Branch if unsigned less than or equal
1
1 (2)
None
BRA
LT,Expr
Branch if less than
1
1 (2)
None
BRA
LTU,Expr
Branch if unsigned less than
1
1 (2)
None
BRA
N,Expr
Branch if Negative
1
1 (2)
None
BRA
NC,Expr
Branch if Not Carry
1
1 (2)
None
BRA
NN,Expr
Branch if Not Negative
1
1 (2)
None
BRA
NOV,Expr
Branch if Not Overflow
1
1 (2)
None
BRA
NZ,Expr
Branch if Not Zero
1
1 (2)
None
BRA
OA,Expr
Branch if Accumulator A overflow
1
1 (2)
None
BRA
OB,Expr
Branch if Accumulator B overflow
1
1 (2)
None
BRA
OV,Expr
Branch if Overflow
1
1 (2)
None
BRA
SA,Expr
Branch if Accumulator A saturated
1
1 (2)
None
BRA
SB,Expr
Branch if Accumulator B saturated
1
1 (2)
None
BRA
Expr
Branch Unconditionally
1
2
None
BRA
Z,Expr
Branch if Zero
1
1 (2)
None
BRA
Wn
Computed Branch
1
2
None
BSET
f,#bit4
Bit Set f
1
1
None
BSET
Ws,#bit4
Bit Set Ws
1
1
None
None
BSW.C
Ws,Wb
Write C bit to Ws<Wb>
1
1
BSW.Z
Ws,Wb
Write Z bit to Ws<Wb>
1
1
None
1
1
None
9
BTG
BTG
f,#bit4
Bit Toggle f
BTG
Ws,#bit4
Bit Toggle Ws
1
1
None
10
BTSC
BTSC
f,#bit4
Bit Test f, Skip if Clear
1
None
BTSC
Ws,#bit4
Bit Test Ws, Skip if Clear
1
1
(2 or 3)
1
(2 or 3)
DS70150D-page 168
None
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 22-2:
INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Assembly
Instr
Mnemonic
#
11
12
13
BTSS
BTST
BTSTS
Assembly Syntax
Description
# of
words
# of
cycles
Status Flags
Affected
None
BTSS
f,#bit4
Bit Test f, Skip if Set
1
BTST
f,#bit4
Bit Test f
1
1
(2 or 3)
1
(2 or 3)
1
BTSS
Ws,#bit4
Bit Test Ws, Skip if Set
1
BTST.C
Ws,#bit4
Bit Test Ws to C
1
1
None
Z
C
BTST.Z
Ws,#bit4
Bit Test Ws to Z
1
1
Z
BTST.C
Ws,Wb
Bit Test Ws<Wb> to C
1
1
C
Z
BTST.Z
Ws,Wb
Bit Test Ws<Wb> to Z
1
1
BTSTS
f,#bit4
Bit Test then Set f
1
1
Z
BTSTS.C
Ws,#bit4
Bit Test Ws to C, then Set
1
1
C
BTSTS.Z
Ws,#bit4
Bit Test Ws to Z, then Set
1
1
Z
14
CALL
CALL
lit23
Call Subroutine
2
2
None
CALL
Wn
Call indirect Subroutine
1
2
None
15
CLR
CLR
f
f = 0x0000
1
1
None
CLR
WREG
WREG = 0x0000
1
1
None
CLR
Ws
Ws = 0x0000
1
1
None
CLR
Acc,Wx,Wxd,Wy,Wyd,AWB
Clear Accumulator
1
1
16
CLRWDT
CLRWDT
Clear Watchdog Timer
1
1
OA,OB,SA,S
B
WDTO,Sleep
17
COM
COM
f
f=f
1
1
N,Z
COM
f,WREG
WREG = f
1
1
N,Z
COM
CP
Ws,Wd
Wd = Ws
Compare f with WREG
1
1
1
1
N,Z
C,DC,N,OV,Z
18
19
20
CP
CP0
CPB
f
CP
Wb,#lit5
Compare Wb with lit5
1
1
C,DC,N,OV,Z
CP
Wb,Ws
Compare Wb with Ws (Wb – Ws)
1
1
C,DC,N,OV,Z
CP0
f
Compare f with 0x0000
1
1
C,DC,N,OV,Z
CP0
Ws
Compare Ws with 0x0000
1
1
C,DC,N,OV,Z
CPB
f
Compare f with WREG, with Borrow
1
1
C,DC,N,OV,Z
CPB
Wb,#lit5
Compare Wb with lit5, with Borrow
1
1
C,DC,N,OV,Z
CPB
Wb,Ws
1
1
C,DC,N,OV,Z
1
21
CPSEQ
CPSEQ
Wb, Wn
Compare Wb with Ws, with Borrow
(Wb – Ws – C)
Compare Wb with Wn, skip if =
22
CPSGT
CPSGT
Wb, Wn
Compare Wb with Wn, skip if >
1
23
CPSLT
CPSLT
Wb, Wn
Compare Wb with Wn, skip if <
1
24
CPSNE
CPSNE
Wb, Wn
Compare Wb with Wn, skip if ≠
1
25
DAW
DAW
Wn
Wn = decimal adjust Wn
1
1
(2 or 3)
1
(2 or 3)
1
(2 or 3)
1
(2 or 3)
1
26
DEC
DEC
f
f = f –1
1
1
27
DEC2
None
None
None
None
C
C,DC,N,OV,Z
DEC
f,WREG
WREG = f –1
1
1
C,DC,N,OV,Z
DEC
Ws,Wd
Wd = Ws – 1
1
1
C,DC,N,OV,Z
DEC2
f
f=f–2
1
1
C,DC,N,OV,Z
DEC2
f,WREG
WREG = f – 2
1
1
C,DC,N,OV,Z
DEC2
Ws,Wd
Wd = Ws – 2
1
1
C,DC,N,OV,Z
28
DISI
DISI
#lit14
Disable Interrupts for k instruction cycles
1
1
None
29
DIV
DIV.S
DIV.SD
Wm,Wn
Signed 16/16-bit Integer Divide
1
18
N,Z,C, OV
Wm,Wn
Signed 32/16-bit Integer Divide
1
18
N,Z,C, OV
DIV.U
Wm,Wn
Unsigned 16/16-bit Integer Divide
1
18
N,Z,C, OV
DIV.UD
Wm,Wn
Unsigned 32/16-bit Integer Divide
1
18
N,Z,C, OV
30
DIVF
DIVF
Wm,Wn
Signed 16/16-bit Fractional Divide
1
18
N,Z,C, OV
31
DO
DO
#lit14,Expr
Do code to PC + Expr, lit14 + 1 times
2
2
None
DO
Wn,Expr
Do code to PC + Expr, (Wn) + 1 times
2
2
None
OA,OB,OAB,
SA,SB,SAB
OA,OB,OAB,
SA,SB,SAB
32
ED
ED
Wm*Wm,Acc,Wx,Wy,Wxd
Euclidean Distance (no accumulate)
1
1
33
EDAC
EDAC
Wm*Wm,Acc,Wx,Wy,Wxd
Euclidean Distance
1
1
© 2008 Microchip Technology Inc.
DS70150D-page 169
dsPIC30F6010A/6015
TABLE 22-2:
INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Assembly
Instr
Mnemonic
#
Assembly Syntax
Description
# of
words
# of
cycles
Status Flags
Affected
34
EXCH
EXCH
Wns,Wnd
Swap Wns with Wnd
1
1
None
35
36
FBCL
FF1L
FBCL
FF1L
Ws,Wnd
Ws,Wnd
Find Bit Change from Left (MSb) Side
Find First One from Left (MSb) Side
1
1
1
1
C
C
37
FF1R
FF1R
Ws,Wnd
Find First One from Right (LSb) Side
1
1
C
38
GOTO
GOTO
Expr
Go to address
2
2
None
GOTO
Wn
Go to indirect
1
2
None
39
INC
INC
f
f=f+1
1
1
C,DC,N,OV,Z
INC
f,WREG
WREG = f + 1
1
1
C,DC,N,OV,Z
C,DC,N,OV,Z
40
41
INC2
IOR
INC
Ws,Wd
Wd = Ws + 1
1
1
INC2
f
f=f+2
1
1
C,DC,N,OV,Z
INC2
f,WREG
WREG = f + 2
1
1
C,DC,N,OV,Z
C,DC,N,OV,Z
INC2
Ws,Wd
Wd = Ws + 2
1
1
IOR
f
f = f .IOR. WREG
1
1
N,Z
IOR
f,WREG
WREG = f .IOR. WREG
1
1
N,Z
N,Z
IOR
#lit10,Wn
Wd = lit10 .IOR. Wd
1
1
IOR
Wb,Ws,Wd
Wd = Wb .IOR. Ws
1
1
N,Z
IOR
Wb,#lit5,Wd
Wd = Wb .IOR. lit5
1
1
N,Z
42
LAC
LAC
Wso,#Slit4,Acc
Load Accumulator
1
1
43
LNK
LNK
#lit14
Link Frame Pointer
1
1
OA,OB,OAB,
SA,SB,SAB
None
44
LSR
LSR
f
f = Logical Right Shift f
1
1
C,N,OV,Z
LSR
f,WREG
WREG = Logical Right Shift f
1
1
C,N,OV,Z
LSR
Ws,Wd
Wd = Logical Right Shift Ws
1
1
C,N,OV,Z
45
MAC
LSR
Wb,Wns,Wnd
Wnd = Logical Right Shift Wb by Wns
1
1
N,Z
LSR
Wb,#lit5,Wnd
Wnd = Logical Right Shift Wb by lit5
1
1
N,Z
MAC
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd, Multiply and Accumulate
AWB
Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square and Accumulate
1
1
OA,OB,OAB,
SA,SB,SAB
1
1
MOV
f,Wn
Move f to Wn
1
1
OA,OB,OAB,
SA,SB,SAB
None
MOV
f
Move f to f
1
1
N,Z
MOV
f,WREG
Move f to WREG
1
1
N,Z
MOV
#lit16,Wn
Move 16-bit literal to Wn
1
1
None
MAC
46
MOV
MOV.b
#lit8,Wn
Move 8-bit literal to Wn
1
1
None
MOV
Wn,f
Move Wn to f
1
1
None
MOV
Wso,Wdo
Move Ws to Wd
1
1
None
MOV
WREG,f
Move WREG to f
1
1
N,Z
MOV.D
Wns,Wd
Move Double from W(ns):W(ns + 1) to Wd
1
2
None
MOV.D
Ws,Wnd
Move Double from Ws to W(nd + 1):W(nd)
1
2
None
None
MOV.D
Ws,Wnd
Move Double from Ws to W(nd + 1):W(nd)
1
2
47
MOVSAC
MOVSAC
Acc,Wx,Wxd,Wy,Wyd,AWB
Prefetch and store Accumulator
1
1
None
48
MPY
MPY
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd
Multiply Wm by Wn to Accumulator
1
1
MPY
Wm*Wm,Acc,Wx,Wxd,Wy,Wyd
Square Wm to Accumulator
1
1
-(Multiply Wm by Wn) to Accumulator
OA,OB,OAB,
SA,SB,SAB
OA,OB,OAB,
SA,SB,SAB
None
49
MPY.N
MPY.N
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd
50
MSC
MSC
Wm*Wm,Acc,Wx,Wxd,Wy,Wyd, Multiply and Subtract from Accumulator
AWB
51
MUL
MUL.SS
MUL.SU
Wb,Ws,Wnd
Wb,Ws,Wnd
1
1
1
1
OA,OB,OAB,
SA,SB,SAB
{Wnd + 1, Wnd} = signed(Wb) * signed(Ws)
{Wnd + 1, Wnd} = signed(Wb) * unsigned(Ws)
1
1
1
1
None
None
MUL.US
Wb,Ws,Wnd
{Wnd + 1, Wnd} = unsigned(Wb) * signed(Ws)
1
1
None
MUL.UU
Wb,Ws,Wnd
{Wnd + 1, Wnd} = unsigned(Wb) * unsigned(Ws)
1
1
None
MUL.SU
Wb,#lit5,Wnd
{Wnd + 1, Wnd} = signed(Wb) * unsigned(lit5)
1
1
None
MUL.UU
Wb,#lit5,Wnd
{Wnd + 1, Wnd} = unsigned(Wb) * unsigned(lit5)
1
1
None
MUL
f
W3:W2 = f * WREG
1
1
None
DS70150D-page 170
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 22-2:
INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Assembly
Instr
Mnemonic
#
52
NEG
# of
words
# of
cycles
Status Flags
Affected
Negate Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
C,DC,N,OV,Z
Assembly Syntax
NEG
Acc
Description
NEG
f
f=f+1
1
1
NEG
f,WREG
WREG = f + 1
1
1
C,DC,N,OV,Z
Ws,Wd
Wd = Ws + 1
No Operation
1
1
1
1
C,DC,N,OV,Z
None
None
53
NOP
NEG
NOP
No Operation
1
1
54
POP
POP
f
Pop f from Top-of-Stack (TOS)
1
1
None
POP
Wdo
Pop from Top-of-Stack (TOS) to Wdo
1
1
None
POP.D
Wnd
1
2
None
POP.S
PUSH
f
Pop from Top-of-Stack (TOS) to
W(nd):W(nd+1)
Pop Shadow Registers
Push f to Top-of-Stack (TOS)
1
1
1
1
All
None
None
NOPR
55
56
57
58
PUSH
PWRSAV
RCALL
REPEAT
PUSH
Wso
Push Wso to Top-of-Stack (TOS)
1
1
PUSH.D
Wns
Push W(ns):W(ns +1) to Top-of-Stack (TOS)
1
2
None
PUSH.S
PWRSAV
RCALL
#lit1
Expr
Push Shadow Registers
Go into Sleep or Idle mode
Relative Call
1
1
1
1
1
2
None
WDTO,Sleep
None
RCALL
Wn
Computed Call
1
2
None
REPEAT
#lit14
Repeat Next Instruction lit14 + 1 times
1
1
None
REPEAT
Wn
Repeat Next Instruction (Wn) + 1 times
1
1
None
59
RESET
RESET
Software device Reset
1
1
None
60
RETFIE
RETFIE
Return from interrupt
1
3 (2)
None
61
RETLW
RETLW
Return with literal in Wn
1
3 (2)
None
62
RETURN
RETURN
Return from Subroutine
1
3 (2)
None
63
RLC
RLC
f
f = Rotate Left through Carry f
1
1
C,N,Z
RLC
f,WREG
WREG = Rotate Left through Carry f
1
1
C,N,Z
RLC
Ws,Wd
Wd = Rotate Left through Carry Ws
1
1
C,N,Z
N,Z
64
65
66
67
RLNC
RRC
RRNC
SAC
#lit10,Wn
RLNC
f
f = Rotate Left (No Carry) f
1
1
RLNC
f,WREG
WREG = Rotate Left (No Carry) f
1
1
N,Z
RLNC
Ws,Wd
Wd = Rotate Left (No Carry) Ws
1
1
N,Z
RRC
f
f = Rotate Right through Carry f
1
1
C,N,Z
RRC
f,WREG
WREG = Rotate Right through Carry f
1
1
C,N,Z
RRC
Ws,Wd
Wd = Rotate Right through Carry Ws
1
1
C,N,Z
RRNC
f
f = Rotate Right (No Carry) f
1
1
N,Z
RRNC
f,WREG
WREG = Rotate Right (No Carry) f
1
1
N,Z
RRNC
Ws,Wd
Wd = Rotate Right (No Carry) Ws
1
1
N,Z
SAC
Acc,#Slit4,Wdo
Store Accumulator
1
1
None
SAC.R
Acc,#Slit4,Wdo
Store Rounded Accumulator
1
1
None
68
SE
SE
Ws,Wnd
Wnd = sign extended Ws
1
1
C,N,Z
69
SETM
SETM
f
f = 0xFFFF
1
1
None
70
71
SFTAC
SL
SETM
WREG
WREG = 0xFFFF
1
1
None
SETM
Ws
Ws = 0xFFFF
1
1
None
SFTAC
Acc,Wn
Arithmetic Shift Accumulator by (Wn)
1
1
SFTAC
Acc,#Slit6
Arithmetic Shift Accumulator by Slit6
1
1
OA,OB,OAB,
SA,SB,SAB
OA,OB,OAB,
SA,SB,SAB
SL
SL
f
f = Left Shift f
WREG = Left Shift f
1
1
1
1
C,N,OV,Z
C,N,OV,Z
C,N,OV,Z
f,WREG
SL
Ws,Wd
Wd = Left Shift Ws
1
1
SL
Wb,Wns,Wnd
Wnd = Left Shift Wb by Wns
1
1
N,Z
SL
Wb,#lit5,Wnd
Wnd = Left Shift Wb by lit5
1
1
N,Z
© 2008 Microchip Technology Inc.
DS70150D-page 171
dsPIC30F6010A/6015
TABLE 22-2:
INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Assembly
Instr
Mnemonic
#
72
73
74
75
SUB
SUBB
SUBR
SUBBR
Assembly Syntax
Description
# of
cycles
Status Flags
Affected
1
1
SUB
f
f = f – WREG
1
1
OA,OB,OAB,
SA,SB,SAB
C,DC,N,OV,Z
SUB
f,WREG
WREG = f – WREG
1
1
C,DC,N,OV,Z
SUB
#lit10,Wn
Wn = Wn – lit10
1
1
C,DC,N,OV,Z
SUB
Wb,Ws,Wd
Wd = Wb – Ws
1
1
C,DC,N,OV,Z
C,DC,N,OV,Z
SUB
Acc
Subtract Accumulators
# of
words
SUB
Wb,#lit5,Wd
Wd = Wb – lit5
1
1
SUBB
f
f = f – WREG – (C)
1
1
C,DC,N,OV,Z
SUBB
f,WREG
WREG = f – WREG – (C)
1
1
C,DC,N,OV,Z
SUBB
#lit10,Wn
Wn = Wn – lit10 - (C)
1
1
C,DC,N,OV,Z
SUBB
Wb,Ws,Wd
Wd = Wb – Ws – (C)
1
1
C,DC,N,OV,Z
SUBB
SUBR
Wb,#lit5,Wd
Wd = Wb – lit5 – (C)
f = WREG – f
1
1
1
1
C,DC,N,OV,Z
C,DC,N,OV,Z
f
SUBR
f,WREG
WREG = WREG – f
1
1
C,DC,N,OV,Z
SUBR
Wb,Ws,Wd
Wd = Ws – Wb
1
1
C,DC,N,OV,Z
C,DC,N,OV,Z
SUBR
Wb,#lit5,Wd
Wd = lit5 - Wb
1
1
SUBBR
f
f = WREG – f - (C)
1
1
C,DC,N,OV,Z
SUBBR
f,WREG
WREG = WREG – f – (C)
1
1
C,DC,N,OV,Z
SUBBR
Wb,Ws,Wd
Wd = Ws – Wb – (C)
1
1
C,DC,N,OV,Z
Wb,#lit5,Wd
Wn
Wd = lit5 – Wb – (C)
Wn = nibble swap Wn
1
1
1
1
C,DC,N,OV,Z
None
None
76
SWAP
SUBBR
SWAP.b
SWAP
Wn
Wn = byte swap Wn
1
1
77
TBLRDH
TBLRDH
Ws,Wd
Read Prog<23:16> to Wd<7:0>
1
2
None
78
TBLRDL
TBLRDL
Ws,Wd
Read Prog<15:0> to Wd
1
2
None
79
TBLWTH
TBLWTH
Ws,Wd
Write Ws<7:0> to Prog<23:16>
1
2
None
80
TBLWTL
TBLWTL
Ws,Wd
Write Ws to Prog<15:0>
1
2
None
81
ULNK
ULNK
Unlink Frame Pointer
1
1
None
82
XOR
XOR
f
f = f .XOR. WREG
1
1
N,Z
XOR
f,WREG
WREG = f .XOR. WREG
1
1
N,Z
N,Z
83
ZE
XOR
#lit10,Wn
Wd = lit10 .XOR. Wd
1
1
XOR
Wb,Ws,Wd
Wd = Wb .XOR. Ws
1
1
N,Z
XOR
Wb,#lit5,Wd
Wd = Wb .XOR. lit5
1
1
N,Z
ZE
Ws,Wnd
Wnd = Zero-Extend Ws
1
1
C,Z,N
DS70150D-page 172
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
23.0
DEVELOPMENT SUPPORT
The PIC® microcontrollers are supported with a full
range of hardware and software development tools:
• Integrated Development Environment
- MPLAB® IDE Software
• Assemblers/Compilers/Linkers
- MPASMTM Assembler
- MPLAB C18 and MPLAB C30 C Compilers
- MPLINKTM Object Linker/
MPLIBTM Object Librarian
- MPLAB ASM30 Assembler/Linker/Library
• Simulators
- MPLAB SIM Software Simulator
• Emulators
- MPLAB ICE 2000 In-Circuit Emulator
- MPLAB REAL ICE™ In-Circuit Emulator
• In-Circuit Debugger
- MPLAB ICD 2
• Device Programmers
- PICSTART® Plus Development Programmer
- MPLAB PM3 Device Programmer
- PICkit™ 2 Development Programmer
• Low-Cost Demonstration and Development
Boards and Evaluation Kits
23.1
MPLAB Integrated Development
Environment Software
The MPLAB IDE software brings an ease of software
development previously unseen in the 8/16-bit
microcontroller market. The MPLAB IDE is a Windows®
operating system-based application that contains:
• A single graphical interface to all debugging tools
- Simulator
- Programmer (sold separately)
- Emulator (sold separately)
- In-Circuit Debugger (sold separately)
• A full-featured editor with color-coded context
• A multiple project manager
• Customizable data windows with direct edit of
contents
• High-level source code debugging
• Visual device initializer for easy register
initialization
• Mouse over variable inspection
• Drag and drop variables from source to watch
windows
• Extensive on-line help
• Integration of select third party tools, such as
HI-TECH Software C Compilers and IAR
C Compilers
The MPLAB IDE allows you to:
• Edit your source files (either assembly or C)
• One touch assemble (or compile) and download
to PIC MCU emulator and simulator tools
(automatically updates all project information)
• Debug using:
- Source files (assembly or C)
- Mixed assembly and C
- Machine code
MPLAB IDE supports multiple debugging tools in a
single development paradigm, from the cost-effective
simulators, through low-cost in-circuit debuggers, to
full-featured emulators. This eliminates the learning
curve when upgrading to tools with increased flexibility
and power.
© 2008 Microchip Technology Inc.
DS70150D-page 173
dsPIC30F6010A/6015
23.2
MPASM Assembler
The MPASM Assembler is a full-featured, universal
macro assembler for all PIC MCUs.
The MPASM Assembler generates relocatable object
files for the MPLINK Object Linker, Intel® standard HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code and COFF files for
debugging.
The MPASM Assembler features include:
• Integration into MPLAB IDE projects
• User-defined macros to streamline
assembly code
• Conditional assembly for multi-purpose
source files
• Directives that allow complete control over the
assembly process
23.3
MPLAB C18 and MPLAB C30
C Compilers
The MPLAB C18 and MPLAB C30 Code Development
Systems are complete ANSI C compilers for
Microchip’s
PIC18
and
PIC24
families
of
microcontrollers and the dsPIC30 and dsPIC33 family
of digital signal controllers. These compilers provide
powerful integration capabilities, superior code
optimization and ease of use not found with other
compilers.
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE
debugger.
23.4
MPLINK Object Linker/
MPLIB Object Librarian
23.5
MPLAB ASM30 Assembler, Linker
and Librarian
MPLAB ASM30 Assembler produces relocatable
machine code from symbolic assembly language for
dsPIC30F devices. MPLAB C30 C Compiler uses the
assembler to produce its object file. The assembler
generates relocatable object files that can then be
archived or linked with other relocatable object files and
archives to create an executable file. Notable features
of the assembler include:
•
•
•
•
•
•
Support for the entire dsPIC30F instruction set
Support for fixed-point and floating-point data
Command line interface
Rich directive set
Flexible macro language
MPLAB IDE compatibility
23.6
MPLAB SIM Software Simulator
The MPLAB SIM Software Simulator allows code
development in a PC-hosted environment by
simulating the PIC MCUs and dsPIC® DSCs on an
instruction level. On any given instruction, the data
areas can be examined or modified and stimuli can be
applied from a comprehensive stimulus controller.
Registers can be logged to files for further run-time
analysis. The trace buffer and logic analyzer display
extend the power of the simulator to record and track
program execution, actions on I/O, most peripherals
and internal registers.
The MPLAB SIM Software Simulator fully supports
symbolic debugging using the MPLAB C18 and
MPLAB C30 C Compilers, and the MPASM and
MPLAB ASM30 Assemblers. The software simulator
offers the flexibility to develop and debug code outside
of the hardware laboratory environment, making it an
excellent, economical software development tool.
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler and the
MPLAB C18 C Compiler. It can link relocatable objects
from precompiled libraries, using directives from a
linker script.
The MPLIB Object Librarian manages the creation and
modification of library files of precompiled code. When
a routine from a library is called from a source file, only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
• Efficient linking of single libraries instead of many
smaller files
• Enhanced code maintainability by grouping
related modules together
• Flexible creation of libraries with easy module
listing, replacement, deletion and extraction
DS70150D-page 174
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
23.7
MPLAB ICE 2000
High-Performance
In-Circuit Emulator
The MPLAB ICE 2000 In-Circuit Emulator is intended
to provide the product development engineer with a
complete microcontroller design tool set for PIC
microcontrollers. Software control of the MPLAB ICE
2000 In-Circuit Emulator is advanced by the MPLAB
Integrated Development Environment, which allows
editing, building, downloading and source debugging
from a single environment.
The MPLAB ICE 2000 is a full-featured emulator
system with enhanced trace, trigger and data monitoring features. Interchangeable processor modules allow
the system to be easily reconfigured for emulation of
different processors. The architecture of the MPLAB
ICE 2000 In-Circuit Emulator allows expansion to
support new PIC microcontrollers.
The MPLAB ICE 2000 In-Circuit Emulator system has
been designed as a real-time emulation system with
advanced features that are typically found on more
expensive development tools. The PC platform and
Microsoft® Windows® 32-bit operating system were
chosen to best make these features available in a
simple, unified application.
23.8
MPLAB REAL ICE In-Circuit
Emulator System
MPLAB REAL ICE In-Circuit Emulator System is
Microchip’s next generation high-speed emulator for
Microchip Flash DSC and MCU devices. It debugs and
programs PIC® Flash MCUs and dsPIC® Flash DSCs
with the easy-to-use, powerful graphical user interface of
the MPLAB Integrated Development Environment (IDE),
included with each kit.
The MPLAB REAL ICE probe is connected to the design
engineer’s PC using a high-speed USB 2.0 interface and
is connected to the target with either a connector
compatible with the popular MPLAB ICD 2 system
(RJ11) or with the new high-speed, noise tolerant,
Low-Voltage Differential Signal (LVDS) interconnection
(CAT5).
23.9
MPLAB ICD 2 In-Circuit Debugger
Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a
powerful, low-cost, run-time development tool,
connecting to the host PC via an RS-232 or high-speed
USB interface. This tool is based on the Flash PIC
MCUs and can be used to develop for these and other
PIC MCUs and dsPIC DSCs. The MPLAB ICD 2 utilizes
the in-circuit debugging capability built into the Flash
devices. This feature, along with Microchip’s In-Circuit
Serial ProgrammingTM (ICSPTM) protocol, offers
cost-effective, in-circuit Flash debugging from the graphical user interface of the MPLAB Integrated Development Environment. This enables a designer to develop
and debug source code by setting breakpoints, single
stepping and watching variables, and CPU status and
peripheral registers. Running at full speed enables
testing hardware and applications in real time. MPLAB
ICD 2 also serves as a development programmer for
selected PIC devices.
23.10 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64) for menus and error messages and a
modular, detachable socket assembly to support
various package types. The ICSP™ cable assembly is
included as a standard item. In Stand-Alone mode, the
MPLAB PM3 Device Programmer can read, verify and
program PIC devices without a PC connection. It can
also set code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 has high-speed communications and
optimized algorithms for quick programming of large
memory devices and incorporates an SD/MMC card for
file storage and secure data applications.
MPLAB REAL ICE is field upgradeable through future
firmware downloads in MPLAB IDE. In upcoming
releases of MPLAB IDE, new devices will be
supported, and new features will be added, such as
software breakpoints and assembly code trace.
MPLAB REAL ICE offers significant advantages over
competitive emulators including low-cost, full-speed
emulation, real-time variable watches, trace analysis,
complex breakpoints, a ruggedized probe interface and
long (up to three meters) interconnection cables.
© 2008 Microchip Technology Inc.
DS70150D-page 175
dsPIC30F6010A/6015
23.11 PICSTART Plus Development
Programmer
23.13 Demonstration, Development and
Evaluation Boards
The PICSTART Plus Development Programmer is an
easy-to-use, low-cost, prototype programmer. It
connects to the PC via a COM (RS-232) port. MPLAB
Integrated Development Environment software makes
using the programmer simple and efficient. The
PICSTART Plus Development Programmer supports
most PIC devices in DIP packages up to 40 pins.
Larger pin count devices, such as the PIC16C92X and
PIC17C76X, may be supported with an adapter socket.
The PICSTART Plus Development Programmer is CE
compliant.
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows quick application development on fully
functional systems. Most boards include prototyping
areas for adding custom circuitry and provide application
firmware and source code for examination and
modification.
23.12 PICkit 2 Development Programmer
The PICkit™ 2 Development Programmer is a low-cost
programmer and selected Flash device debugger with
an easy-to-use interface for programming many of
Microchip’s baseline, mid-range and PIC18F families of
Flash memory microcontrollers. The PICkit 2 Starter Kit
includes a prototyping development board, twelve
sequential lessons, software and HI-TECH’s PICC™
Lite C compiler, and is designed to help get up to speed
quickly using PIC® microcontrollers. The kit provides
everything needed to program, evaluate and develop
applications using Microchip’s powerful, mid-range
Flash memory family of microcontrollers.
DS70150D-page 176
The boards support a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory.
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™
demonstration/development board series of circuits,
Microchip has a line of evaluation kits and
demonstration software for analog filter design,
KEELOQ® security ICs, CAN, IrDA®, PowerSmart
battery management, SEEVAL® evaluation system,
Sigma-Delta ADC, flow rate sensing, plus many more.
Check the Microchip web page (www.microchip.com)
for the complete list of demonstration, development
and evaluation kits.
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
24.0
ELECTRICAL CHARACTERISTICS
This section provides an overview of dsPIC30F electrical characteristics. Additional information will be provided in future
revisions of this document as it becomes available.
For detailed information about the dsPIC30F architecture and core, refer to the “dsPIC30F Family Reference Manual”
(DS70046).
Absolute maximum ratings for the dsPIC30F family are listed below. Exposure to these maximum rating conditions for
extended periods may affect device reliability. Functional operation of the device at these or any other conditions above
the parameters indicated in the operation listings of this specification is not implied.
Absolute Maximum Ratings(†)
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to VSS (except VDD and MCLR) (Note 1) ..................................... -0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +5.5V
Voltage on MCLR with respect to VSS........................................................................................................ 0V to +13.25V
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin (Note 2)................................................................................................................250 mA
Input clamp current, IIK (VI < 0 or VI > VDD) .......................................................................................................... ±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) ................................................................................................... ±20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports (Note 2)....................................................................................................200 mA
Note 1: Voltage spikes below VSS at the MCLR/VPP pin, inducing currents greater than 80 mA, may cause latch-up.
Thus, a series resistor of 50-100Ω should be used when applying a “low” level to the MCLR/VPP pin, rather
than pulling this pin directly to VSS.
2: Maximum allowable current is a function of device maximum power dissipation. See Table 24-6.
†NOTICE:
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
© 2008 Microchip Technology Inc.
DS70150D-page 177
dsPIC30F6010A/6015
24.1
DC Characteristics
TABLE 24-1:
OPERATING MIPS VS. VOLTAGE FOR dsPIC30F6010A
Max MIPS
VDD Range
(in Volts)
Temp Range
(in °C)
dsPIC30F6010A-30I
dsPIC30F6010A-20E
4.5-5.5
-40 to +85
30
—
4.5-5.5
-40 to +125
—
20
3.0-3.6
-40 to +85
20
—
3.0-3.6
-40 to +125
—
15
2.5-3.0
-40 to +85
10
—
TABLE 24-2:
OPERATING MIPS VS. VOLTAGE FOR dsPIC30F6015
Max MIPS
VDD Range
(in Volts)
Temp Range
(in °C)
dsPIC30F6015-30I
dsPIC30F6015-20E
4.5-5.5
-40 to +85
30
—
4.5-5.5
-40 to +125
—
20
3.0-3.6
-40 to +85
20
—
3.0-3.6
-40 to +125
—
15
2.5-3.0
-40 to +85
10
—
TABLE 24-3:
THERMAL OPERATING CONDITIONS
Rating
Symbol
Min
Typ
Max
Unit
Operating Junction Temperature Range
TJ
-40
—
+125
°C
Operating Ambient Temperature Range
TA
-40
—
+85
°C
Operating Junction Temperature Range
TJ
-40
—
+150
°C
Operating Ambient Temperature Range
TA
-40
—
+125
°C
dsPIC30F6010A-30I/dsPIC30F6015-30I
dsPIC30F6010A-20E/dsPIC30F6015-20E
Power Dissipation:
Internal chip power dissipation:
P INT = V D D × ( I DD – ∑ I O H)
PD
PINT + PI/O
W
PDMAX
(TJ – TA)/θJA
W
I/O Pin Power Dissipation:
I/O =
∑ ( { VD D – VO H } × IOH ) + ∑ ( VOL × I OL )
Maximum Allowed Power Dissipation
TABLE 24-4:
THERMAL PACKAGING CHARACTERISTICS
Characteristic
Package Thermal Resistance, 80-pin TQFP (14x14x1mm)
Package Thermal Resistance, 80-pin TQFP (12x12x1mm)
Package Thermal Resistance, 64-pin TQFP (10x10x1mm)
Note 1:
Symbol
Typ
Max
Unit
Notes
θJA
θJA
θJA
36
—
°C/W
1
39
—
°C/W
1
39
—
°C/W
1
Junction to ambient thermal resistance, Theta-ja (θJA) numbers are achieved by package simulations.
DS70150D-page 178
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 24-5:
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min
Typ(1)
Max
Units
2.5
—
5.5
V
Industrial temperature
Extended temperature
Conditions
Operating Voltage(2)
DC10
VDD
Supply Voltage
DC11
VDD
Supply Voltage
3.0
—
5.5
V
DC12
VDR
RAM Data Retention Voltage(3)
1.75
—
—
V
DC16
VPOR
VDD Start Voltage
to ensure internal
Power-on Reset signal
—
—
VSS
V
DC17
SVDD
VDD Rise Rate
to ensure internal
Power-on Reset signal
0.05
—
—
Note 1:
2:
3:
V/ms 0-5V in 0.1 sec
0-3V in 60 ms
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
This is the limit to which VDD can be lowered without losing RAM data.
© 2008 Microchip Technology Inc.
DS70150D-page 179
dsPIC30F6010A/6015
TABLE 24-6:
DC CHARACTERISTICS: OPERATING CURRENT (IDD)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Parameter
No.
Typical(1)
Max
Units
Conditions
Operating Current (IDD)(2)
DC31a
9.5
15
mA
25°C
DC31b
9.5
15
mA
85°C
3.3V
DC31c
9.4
15
mA
125°C
0.128 MIPS
LPRC (512 kHz)
DC31e
18
27
mA
25°C
DC31f
17
27
mA
85°C
5V
DC31g
17
27
mA
125°C
DC30a
15
23
mA
25°C
DC30b
15
23
mA
85°C
3.3V
DC30c
14
23
mA
125°C
(1.8 MIPS)
FRC (7.37 MHz)
DC30e
30
45
mA
25°C
DC30f
29
45
mA
85°C
5V
DC30g
27
45
mA
125°C
DC23a
40
50
mA
25°C
DC23b
40
50
mA
85°C
3.3V
DC23c
36
50
mA
125°C
4 MIPS
DC23e
44
64
mA
25°C
DC23f
43
64
mA
85°C
5V
DC23g
43
64
mA
125°C
DC24a
50
75
mA
25°C
DC24b
51
75
mA
85°C
3.3V
DC24c
51
75
mA
125°C
10 MIPS
DC24e
85
125
mA
25°C
DC24f
84
125
mA
85°C
5V
DC24g
84
125
mA
125°C
DC27a
89
115
mA
25°C
3.3V
DC27b
89
115
mA
85°C
DC27d
147
185
mA
25°C
20 MIPS
DC27e
146
185
mA
85°C
5V
DC27f
145
185
mA
125°C
DC29a
206
255
mA
25°C
5V
30 MIPS
DC29b
205
255
mA
85°C
Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have
an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1
driven with external square wave from rail-to-rail. All I/O pins are configured as Inputs and pulled to VDD.
MCLR = VDD, WDT, FSCM, LVD and BOR are disabled. CPU, SRAM, Program Memory and Data
Memory are operational. No peripheral modules are operating.
DS70150D-page 180
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 24-7:
DC CHARACTERISTICS: IDLE CURRENT (IIDLE)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Parameter
No.
Typical(1,2)
Max
Units
Conditions
Operating Current (IDD)(3)
DC51a
9.0
14
mA
25°C
DC51b
9.0
14
mA
85°C
3.3V
DC51c
9.0
14
mA
125°C
0.128 MIPS
LPRC (512 kHz)
DC51e
17
26
mA
25°C
DC51f
16
26
mA
85°C
5V
DC51g
16
26
mA
125°C
DC50a
11
18
mA
25°C
DC50b
12
18
mA
85°C
3.3V
DC50c
11
18
mA
125°C
(1.8 MIPS)
FRC (7.37 MHz)
DC50e
25
38
mA
25°C
DC50f
24
38
mA
85°C
5V
DC50g
23
38
mA
125°C
DC43a
19
30
mA
25°C
DC43b
20
30
mA
85°C
3.3V
DC43c
20
30
mA
125°C
4 MIPS
DC43e
34
51
mA
25°C
DC43f
33
51
mA
85°C
5V
DC43g
33
51
mA
125°C
DC44a
34
53
mA
25°C
DC44b
35
53
mA
85°C
3.3V
DC44c
35
53
mA
125°C
10 MIPS
DC44e
59
89
mA
25°C
DC44f
59
89
mA
85°C
5V
DC44g
59
89
mA
125°C
DC47a
59
70
mA
25°C
3.3V
DC47b
60
70
mA
85°C
DC47d
99
115
mA
25°C
20 MIPS
DC47e
99
115
mA
85°C
5V
DC47f
100
115
mA
125°C
DC49a
138
155
mA
25°C
5V
30 MIPS
DC49b
139
155
mA
85°C
Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
2: Base IIDLE current is measured with Core off, Clock on and all modules turned off.
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have
an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1
driven with external square wave from rail-to-rail. All I/O pins are configured as Inputs and pulled to VDD.
MCLR = VDD, WDT, FSCM, LVD and BOR are disabled. CPU, SRAM, Program Memory and Data
Memory are operational. No peripheral modules are operating.
© 2008 Microchip Technology Inc.
DS70150D-page 181
dsPIC30F6010A/6015
TABLE 24-8:
DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Parameter
No.
Typical(1)
Max
Units
—
μA
Conditions
Power-Down Current (IPD)(2)
DC60a
0.2
25°C
DC60b
1.2
40
μA
85°C
DC60c
12
65
μA
125°C
DC60e
0.4
—
μA
25°C
DC60f
1.7
55
μA
85°C
DC60g
15
90
μA
125°C
DC61a
9
15
μA
25°C
DC61b
9
15
μA
85°C
DC61c
9
15
μA
125°C
DC61e
18
30
μA
25°C
DC61f
17
30
μA
85°C
DC61g
16
30
μA
125°C
DC62a
4
10
μA
25°C
DC62b
5
10
μA
85°C
DC62c
4
10
μA
125°C
DC62e
4
15
μA
25°C
DC62f
6
15
μA
85°C
DC62g
5
15
μA
125°C
DC63a
29
52
μA
25°C
DC63b
32
52
μA
85°C
DC63c
33
52
μA
125°C
DC63e
34
60
μA
25°C
DC63f
39
60
μA
85°C
38
60
μA
125°C
DC63g
Note 1:
2:
3:
3.3V
Base Power-Down Current(3)
5V
3.3V
Watchdog Timer Current: ΔIWDT(3)
5V
3.3V
Timer1 w/32 kHz Crystal: ΔITI32(3)
5V
3.3V
BOR On: ΔIBOR(3)
5V
Data in the “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and
pulled high. BOR, WDT, etc. are all switched off.
The Δ current is the additional current consumed when the module is enabled. This current should be
added to the base IPD current.
DS70150D-page 182
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 24-9:
DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
Symbol
No.
VIL
Characteristic
Min
Typ(1)
Max
Units
Conditions
Input Low Voltage(2)
DI10
I/O pins:
with Schmitt Trigger buffer
VSS
—
0.2 VDD
V
DI15
MCLR
VSS
—
0.2 VDD
V
DI16
OSC1 (in XT, HS and LP modes)
VSS
—
0.2 VDD
V
DI17
OSC1 (in RC mode)(3)
VSS
—
0.3 VDD
V
DI18
SDA, SCL
VSS
—
0.3 VDD
V
SMBus disabled
SDA, SCL
VSS
—
0.2 VDD
V
SMBus enabled
I/O pins:
with Schmitt Trigger buffer
0.8 VDD
—
VDD
V
DI25
MCLR
0.8 VDD
—
VDD
V
DI26
OSC1 (in XT, HS and LP modes) 0.7 VDD
—
VDD
V
DI19
VIH
DI20
Input High Voltage(2)
mode)(3)
DI27
OSC1 (in RC
0.9 VDD
—
VDD
V
DI28
SDA, SCL
0.7 VDD
—
VDD
V
SMBus disabled
SDA, SCL
0.8 VDD
—
VDD
V
SMBus enabled
50
250
400
μA
VDD = 5V, VPIN = VSS
DI29
ICNPU
CNXX Pull-up Current(2)
IIL
Input Leakage Current(2)(4)(5)
DI30
DI50
I/O ports
—
0.01
±1
μA
VSS ≤ VPIN ≤ VDD,
Pin at high-impedance
DI51
Analog Input Pins
—
0.50
—
μA
VSS ≤ VPIN ≤ VDD,
Pin at high-impedance
DI55
MCLR
—
0.05
±5
μA
VSS ≤ VPIN ≤ VDD
DI56
OSC1
—
0.05
±5
μA
VSS ≤ VPIN ≤ VDD, XT, HS
and LP Osc mode
Note 1:
2:
3:
4:
5:
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
In RC oscillator configuration, the OSC1/CLKl pin is a Schmitt Trigger input. It is not recommended that
the dsPIC30F device be driven with an external clock while in RC mode.
The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
Negative current is defined as current sourced by the pin.
© 2008 Microchip Technology Inc.
DS70150D-page 183
dsPIC30F6010A/6015
TABLE 24-10: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
Symbol
No.
VOL
DO10
Characteristic
VOH
DO20
Max
Units
Conditions
—
—
0.6
V
IOL = 8.5 mA, VDD = 5V
—
—
0.15
V
IOL = 2.0 mA, VDD = 3V
OSC2/CLKO
—
—
0.6
V
IOL = 1.6 mA, VDD = 5V
(RC or EC Osc mode)
—
—
0.72
V
IOL = 2.0 mA, VDD = 3V
VDD – 0.7
—
—
V
IOH = -3.0 mA, VDD = 5V
VDD – 0.2
—
—
V
IOH = -2.0 mA, VDD = 3V
OSC2/CLKO
VDD – 0.7
—
—
V
IOH = -1.3 mA, VDD = 5V
(RC or EC Osc mode)
VDD – 0.1
—
—
V
IOH = -2.0 mA, VDD = 3V
15
pF
In XTL, XT, HS and LP modes
when external clock is used to
drive OSC1.
Output High Voltage
(2)
I/O ports
DO26
Typ(1)
Output Low Voltage(2)
I/O ports
DO16
Min
Capacitive Loading Specs
on Output Pins(2)
DO50
COSC2
OSC2/SOSC2 pin
—
—
DO56
CIO
All I/O pins and OSC2
—
—
50
pF
RC or EC Osc mode
DO58
CB
SCL, SDA
—
—
400
pF
In I2C™ mode
Note 1:
2:
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
FIGURE 24-1:
BROWN-OUT RESET CHARACTERISTICS
VDD
BO10
(Device in Brown-out Reset)
BO15
(Device not in Brown-out Reset)
Reset (due to BOR)
Power-up Time-out
DS70150D-page 184
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 24-11: ELECTRICAL CHARACTERISTICS: BOR
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
No.
BO10
Symbol
VBOR
Characteristic
BOR Voltage(2) on
VDD transition
high-to-low
Min
Typ(1)
Max
Units
—
—
—
V
BORV = 11(3)
BORV = 10
2.6
—
2.71
V
BORV = 01
4.1
—
4.4
V
BORV = 00
4.58
—
4.73
V
—
5
—
mV
Conditions
Not in operating
range
BO15
VBHYS
Note 1:
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
‘11’ values not in usable operating range.
2:
3:
TABLE 24-12: DC CHARACTERISTICS: PROGRAM AND EEPROM
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
Symbol
No.
Characteristic
Min
Typ(1)
Max
Units
Conditions
Data EEPROM Memory(2)
-40°C ≤ TA ≤ +85°C
D120
ED
Byte Endurance
100K
1M
—
E/W
D121
VDRW
VDD for Read/Write
VMIN
—
5.5
V
D122
TDEW
Erase/Write Cycle Time
—
2
—
ms
D123
TRETD
Characteristic Retention
40
100
—
Year
Provided no other specifications
are violated
D124
IDEW
IDD During Programming
—
10
30
mA
Row Erase
-40°C ≤ TA ≤ +85°C
Using EECON to read/write
VMIN = Minimum operating
voltage
Program FLASH Memory(2)
D130
EP
Cell Endurance
10K
100K
—
E/W
D131
VPR
VDD for Read
VMIN
—
5.5
V
D132
VEB
VDD for Bulk Erase
4.5
—
5.5
V
D133
VPEW
VDD for Erase/Write
3.0
—
5.5
V
VMIN = Minimum operating
voltage
D134
TPEW
Erase/Write Cycle Time
1
—
2
ms
D135
TRETD
Characteristic Retention
40
100
—
Year
D136
TEB
ICSP™ Block Erase Time
—
4
—
ms
D137
IPEW
IDD During Programming
—
10
30
mA
Row Erase
D138
IEB
IDD During Programming
—
10
30
mA
Bulk Erase
Note 1:
2:
Provided no other specifications are violated
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
These parameters are characterized but not tested in manufacturing.
© 2008 Microchip Technology Inc.
DS70150D-page 185
dsPIC30F6010A/6015
24.2
AC Characteristics and Timing Parameters
The information contained in this section defines dsPIC30F AC characteristics and timing parameters.
TABLE 24-13: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Operating voltage VDD range as described in DC Spec Section 24.1 “DC
Characteristics”.
AC CHARACTERISTICS
FIGURE 24-2:
LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
Load Condition 1 – for all pins except OSC2
Load Condition 2 – for OSC2
VDD/2
VSS
Legend:
RL = 464 Ω
CL = 50 pF for all pins except OSC2
5 pF for OSC2 output
CL
Pin
VSS
FIGURE 24-3:
CL
Pin
RL
EXTERNAL CLOCK TIMING
Q4
Q1
Q2
Q3
Q4
Q1
OSC1
OS20
OS30
OS25
OS30
OS31
OS31
CLKO
OS40
DS70150D-page 186
OS41
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 24-14: EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
OS10
Symb
ol
FOSC
Characteristic
External CLKN Frequency(2)
(External clocks allowed only
in EC mode)
Oscillator Frequency(2)
Min
Typ(1)
Max
Units
Conditions
DC
4
4
4
—
—
—
—
40
10
10
7.5(3)
MHz
MHz
MHz
MHz
EC
EC with 4x PLL
EC with 8x PLL
EC with 16x PLL
DC
0.4
4
4
4
4
10
10
10
10
12(4)
12(4)
12(4)
—
—
—
—
—
—
—
—
—
—
—
—
—
—
32.768
4
4
10
10
10
7.5(3)
25
20(4)
20(4)
15(3)
25
25
22.5(3)
—
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
kHz
RC
XTL
XT
XT with 4x PLL
XT with 8x PLL
XT with 16x PLL
HS
HS/2 with 4x PLL
HS/2 with 8x PLL
HS/2 with 16x PLL
HS/3 with 4x PLL
HS/3 with 8x PLL
HS/3 with 16x PLL
LP
OS20
TOSC
TOSC = 1/FOSC
—
—
—
—
See parameter OS10
for FOSC value
OS25
TCY
Instruction Cycle Time(2)(5)
33
—
DC
ns
See Table 24-16
(2)
OS30
TosL,
TosH
External Clock in (OSC1)
High or Low Time
.45 x TOSC
—
—
ns
EC
OS31
TosR,
TosF
External Clock(2) in (OSC1)
Rise or Fall Time
—
—
20
ns
EC
OS40
TckR
CLKO Rise Time(2)(6)
—
—
—
ns
See parameter DO31
OS41
TckF
CLKO Fall Time(2)(6)
—
—
—
ns
See parameter DO32
Note 1:
2:
3:
4:
5:
6:
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
Limited by the PLL output frequency range.
Limited by the PLL input frequency range.
Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values
are based on characterization data for that particular oscillator type under standard operating conditions
with the device executing code. Exceeding these specified limits may result in an unstable oscillator
operation and/or higher than expected current consumption. All devices are tested to operate at “min.”
values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the
“Max.” cycle time limit is “DC” (no clock) for all devices.
Measurements are taken in EC or ERC modes. The CLKO signal is measured on the OSC2 pin. CLKO is
low for the Q1-Q2 period (1/2 TCY) and high for the Q3-Q4 period (1/2 TCY).
© 2008 Microchip Technology Inc.
DS70150D-page 187
dsPIC30F6010A/6015
TABLE 24-15: PLL CLOCK TIMING SPECIFICATIONS (VDD = 2.5 TO 5.5 V)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Characteristic(1)
Symbol
Min
Typ(2)
Max
Units
Conditions
OS50
FPLLI
PLL Input Frequency Range(2)
4
4
4
4
4
4
5(3)
5(3)
5(3)
4
4
4
—
—
—
—
—
—
—
—
—
—
—
—
10
10
7.5(4)
10
10
7.5(4)
10
10
7.5(4)
8.33(3)
8.33(3)
7.5(4)
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
EC with 4x PLL
EC with 8x PLL
EC with 16x PLL
XT with 4x PLL
XT with 8x PLL
XT with 16x PLL
HS/2 with 4x PLL
HS/2 with 8x PLL
HS/2 with 16x PLL
HS/3 with 4x PLL
HS/3 with 8x PLL
HS/3 with 16x PLL
OS51
FSYS
On-Chip PLL Output(2)
16
—
120
MHz
EC, XT, HS/2, HS/3 modes
with PLL
OS52
TLOC
PLL Start-up Time (Lock Time)
—
20
50
μs
Note 1:
2:
3:
4:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
Limited by oscillator frequency range.
Limited by device operating frequency range.
TABLE 24-16: PLL JITTER
AC CHARACTERISTICS
Param
No.
Characteristic
Min
Typ(1)
Max
Units
x4 PLL
—
0.251
0.413
%
-40°C ≤ TA ≤ +85°C
—
0.251
0.413
%
-40°C ≤ TA ≤ +125°C
VDD = 3.0 to 3.6V
—
0.256
0.47
%
-40°C ≤ TA ≤ +85°C
VDD = 4.5 to 5.5V
OS61
x8 PLL
x16 PLL
Note 1:
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
-40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Conditions
VDD = 3.0 to 3.6V
—
0.256
0.47
%
-40°C ≤ TA ≤ +125°C
VDD = 4.5 to 5.5V
—
0.355
0.584
%
-40°C ≤ TA ≤ +85°C
VDD = 3.0 to 3.6V
—
0.355
0.584
%
-40°C ≤ TA ≤ +125°C
VDD = 3.0 to 3.6V
—
0.362
0.664
%
-40°C ≤ TA ≤ +85°C
VDD = 4.5 to 5.5V
—
0.362
0.664
%
-40°C ≤ TA ≤ +125°C
VDD = 4.5 to 5.5V
—
0.67
0.92
%
-40°C ≤ TA ≤ +85°C
VDD = 3.0 to 3.6V
—
0.632
0.956
%
-40°C ≤ TA ≤ +85°C
VDD = 4.5 to 5.5V
—
0.632
0.956
%
-40°C ≤ TA ≤ +125°C
VDD = 4.5 to 5.5V
These parameters are characterized but not tested in manufacturing.
DS70150D-page 188
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 24-17: INTERNAL CLOCK TIMING EXAMPLES
Clock
Oscillator
Mode
FOSC
(MHz)(1)
TCY (μsec)(2)
MIPS(3)
w/o PLL
EC
0.200
20.0
0.05
—
—
—
4
1.0
1.0
4.0
8.0
16.0
XT
Note 1:
2:
3:
MIPS(3)
w/PLL x4
MIPS(3)
w/PLL x8
MIPS(3)
w/PLL x16
10
0.4
2.5
10.0
20.0
—
25
0.16
6.25
—
—
—
4
1.0
1.0
4.0
8.0
16.0
10
0.4
2.5
10.0
20.0
—
Assumption: Oscillator Postscaler is divide by 1.
Instruction Execution Cycle Time: TCY = 1/MIPS.
Instruction Execution Frequency: MIPS = (FOSC * PLLx)/4 [since there are 4 Q clocks per instruction
cycle].
© 2008 Microchip Technology Inc.
DS70150D-page 189
dsPIC30F6010A/6015
TABLE 24-18: AC CHARACTERISTICS: INTERNAL FRC ACCURACY
AC CHARACTERISTICS
Param
No.
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
-40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Characteristic
Min
Typ
Max
Units
Conditions
Internal FRC Accuracy @ FRC Freq. = 7.37 MHz(1)
OS63
Note 1:
FRC
—
—
±2.00
%
-40°C ≤ TA ≤ +85°C
VDD = 3.0-5.5V
—
—
±5.00
%
-40°C ≤ TA ≤ +125°C
VDD = 3.0-5.5V
Frequency calibrated at 25°C and 5V. TUN bits can be used to compensate for temperature drift.
TABLE 24-19: AC CHARACTERISTICS: INTERNAL LPRC ACCURACY
AC CHARACTERISTICS
Param
No.
Characteristic
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Min
Typ
Max
Units
-50
—
+50
%
Conditions
LPRC @ Freq. = 512 kHz(1)
OS65A
VDD = 5.0V, ±10%
OS65B
-60
—
+60
%
VDD = 3.3V, ±10%
OS65C
-70
—
+70
%
VDD = 2.5V
Note 1:
Change of LPRC frequency as VDD changes.
DS70150D-page 190
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 24-4:
CLKOUT AND I/O TIMING CHARACTERISTICS
I/O Pin
(Input)
DI35
DI40
I/O Pin
(Output)
New Value
Old Value
DO31
DO32
Note: Refer to Figure 24-2 for load conditions.
TABLE 24-20: CLKOUT AND I/O TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Characteristic(1)(2)(3)
Symbol
Min
Typ(4)
Max
Units
DO31
TIOR
Port output rise time
—
7
20
ns
DO32
TIOF
Port output fall time
—
7
20
ns
DI35
TINP
INTx pin high or low time (output)
20
—
—
ns
DI40
TRBP
CNx high or low time (input)
2 TCY
—
—
—
Note 1:
2:
3:
4:
Conditions
These parameters are asynchronous events not related to any internal clock edges.
Measurements are taken in RC mode and EC mode where CLKO output is 4 x TOSC.
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
© 2008 Microchip Technology Inc.
DS70150D-page 191
dsPIC30F6010A/6015
FIGURE 24-5:
VDD
RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING CHARACTERISTICS
SY12
MCLR
SY10
Internal
POR
PWRT
Time-out
OSC
Time-out
SY11
SY30
Internal
Reset
Watchdog
Timer
Reset
SY13
SY20
SY13
I/O Pins
SY35
FSCM
Delay
Note: Refer to Figure 24-2 for load conditions.
DS70150D-page 192
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 24-21: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SY10
TmcL
MCLR Pulse Width (low)
2
—
—
μs
-40°C to +85°C
SY11
TPWRT
Power-up Timer Period
2
10
43
4
16
64
8
32
128
ms
-40°C to +85°C, VDD =
5V
User programmable
SY12
TPOR
Power-on Reset Delay(4)
3
10
30
μs
-40°C to +85°C
SY13
TIOZ
I/O High-impedance from MCLR
Low or Watchdog Timer Reset
—
0.8
1.0
μs
SY20
TWDT1
TWDT2
TWDT3
Watchdog Timer Time-out Period
(No Prescaler)
1.1
1.2
1.3
2.0
2.0
2.0
6.6
5.0
4.0
ms
ms
ms
VDD = 2.5V
VDD = 3.3V, ±10%
VDD = 5V, ±10%
SY25
TBOR
Brown-out Reset Pulse Width(3)
100
—
—
μs
VDD ≤ VBOR (D034)
SY30
TOST
Oscillator Start-up Timer Period
—
1024 TOSC
—
—
TOSC = OSC1 period
SY35
TFSCM
Fail-Safe Clock Monitor Delay
—
500
900
μs
-40°C to +85°C
Note 1:
2:
3:
4:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
Refer to Figure 24-1 and Table for BOR
Characterized by design but not tested.
FIGURE 24-6:
BAND GAP START-UP TIME CHARACTERISTICS
VBGAP
0V
Enable Band Gap
(see Note)
Band Gap
Stable
SY40
Note: Set FBORPOR<7>.
TABLE 24-22: BAND GAP START-UP TIME REQUIREMENTS
AC CHARACTERISTICS
Param
No.
SY40
Note 1:
Symbol
TBGAP
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Characteristic(1)
Min
Typ
Max
Units
Band Gap Start-up Time
—
40
65
μs
Conditions
Defined as the time between the
instant that the band gap is enabled
and the moment that the band gap
reference voltage is stable
(RCON<13>Status bit).
These parameters are characterized but not tested in manufacturing.
© 2008 Microchip Technology Inc.
DS70150D-page 193
dsPIC30F6010A/6015
FIGURE 24-7:
TIMER1, 2, 3, 4 AND 5 EXTERNAL CLOCK TIMING CHARACTERISTICS
TxCK
Tx11
Tx10
Tx15
Tx20
OS60
TMRX
Note: Refer to Figure 24-2 for load conditions.
TABLE 24-23: TIMER1 EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
TA10
TA11
Symbol
TTXH
TTXL
Characteristic
TxCK High Time
TxCK Low Time
Min
Typ
Max
Units
Conditions
Synchronous,
no prescaler
0.5 TCY + 20
—
—
ns
Must also meet
parameter TA15
Synchronous,
with prescaler
10
—
—
ns
Asynchronous
10
—
—
ns
Synchronous,
no prescaler
0.5 TCY + 20
—
—
ns
Synchronous,
with prescaler
10
—
—
ns
Asynchronous
TA15
TTXP
10
—
—
ns
TCY + 10
—
—
ns
Synchronous,
with prescaler
Greater of:
20 ns or
(TCY + 40)/N
—
—
—
Asynchronous
20
—
—
ns
DC
—
50
kHz
0.5 TCY
—
1.5 TCY
—
TxCK Input Period Synchronous,
no prescaler
OS60
Ft1
TA20
TCKEXTMRL Delay from External TxCK Clock
Edge to Timer Increment
Note:
SOSC1/T1CK oscillator input
frequency range (oscillator enabled
by setting bit TCS (T1CON, bit 1))
Must also meet
parameter TA15
N = prescale
value
(1, 8, 64, 256)
Timer1 is a Type A.
DS70150D-page 194
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 24-24: TIMER2 AND TIMER4 EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
TB10
TB11
TB15
Symbol
TtxH
TtxL
TtxP
Characteristic
TxCK High Time
TxCK Low Time
Min
Typ
Max
Units
Conditions
Synchronous,
no prescaler
0.5 TCY + 20
—
—
ns
Must also meet
parameter TB15
Synchronous,
with prescaler
10
—
—
ns
Synchronous,
no prescaler
0.5 TCY + 20
—
—
ns
Synchronous,
with prescaler
10
—
—
ns
TCY + 10
—
—
ns
—
1.5 TCY
—
TxCK Input Period Synchronous,
no prescaler
Synchronous,
with prescaler
TB20
TCKEXTMRL Delay from External TxCK Clock
Edge to Timer Increment
Greater of:
20 ns or
(TCY + 40)/N
0.5 TCY
Must also meet
parameter TB15
N = prescale
value
(1, 8, 64, 256)
TABLE 24-25: TIMER3 AND TIMER5 EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min
Typ
Max
Units
Conditions
TC10
TtxH
TxCK High Time
Synchronous
0.5 TCY + 20
—
—
ns
Must also meet
parameter TC15
TC11
TtxL
TxCK Low Time
Synchronous
0.5 TCY + 20
—
—
ns
Must also meet
parameter TC15
TC15
TtxP
TxCK Input Period Synchronous,
no prescaler
TCY + 10
—
—
ns
N = prescale
value
(1, 8, 64, 256)
—
1.5
TCY
—
Synchronous,
with prescaler
TC20
TCKEXTMRL Delay from External TxCK Clock
Edge to Timer Increment
© 2008 Microchip Technology Inc.
Greater of:
20 ns or
(TCY + 40)/N
0.5 TCY
DS70150D-page 195
dsPIC30F6010A/6015
FIGURE 24-8:
TIMERQ (QEI MODULE) EXTERNAL CLOCK TIMING CHARACTERISTICS
QEB
TQ11
TQ10
TQ15
TQ20
POSCNT
TABLE 24-26: QEI MODULE EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ
Max
Units
Conditions
TQ10
TtQH
TQCK High Time
Synchronous,
with prescaler
TCY + 20
—
—
ns
Must also meet
parameter TQ15
TQ11
TtQL
TQCK Low Time
Synchronous,
with prescaler
TCY + 20
—
—
ns
Must also meet
parameter TQ15
TQ15
TtQP
TQCP Input
Period
Synchronous, 2 * TCY + 40
with prescaler
—
—
ns
TQ20
TCKEXTMRL Delay from External TxCK Clock
Edge to Timer Increment
—
1.5 TCY
—
Note 1:
0.5 TCY
These parameters are characterized but not tested in manufacturing.
DS70150D-page 196
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 24-9:
INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS
ICX
IC10
IC11
IC15
Note: Refer to Figure 24-2 for load conditions.
TABLE 24-27: INPUT CAPTURE TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
IC10
TccL
Characteristic(1)
ICx Input Low Time
Min
No Prescaler
TccH
ICx Input High Time
No Prescaler
—
ns
10
—
ns
0.5 TCY + 20
—
ns
10
—
ns
(2 TCY + 40)/N
—
ns
With Prescaler
IC15
Note 1:
TccP
ICx Input Period
Units
0.5 TCY + 20
With Prescaler
IC11
Max
Conditions
N = prescale
value (1, 4, 16)
These parameters are characterized but not tested in manufacturing.
FIGURE 24-10:
OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS
OCx
(Output Compare
or PWM Mode)
OC10
OC11
Note: Refer to Figure 24-2 for load conditions.
TABLE 24-28: OUTPUT COMPARE MODULE TIMING REQUIREMENTS
AC CHARACTERISTICS
Param
Symbol
No.
Characteristic(1)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Min
Typ(2)
Max
Units
Conditions
OC10
TccF
OCx Output Fall Time
—
—
—
ns
See parameter DO32
OC11
TccR
OCx Output Rise Time
—
—
—
ns
See parameter DO31
Note 1:
2:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
© 2008 Microchip Technology Inc.
DS70150D-page 197
dsPIC30F6010A/6015
FIGURE 24-11:
OC/PWM MODULE TIMING CHARACTERISTICS
OC20
OCFA/OCFB
OC15
OCx
TABLE 24-29: SIMPLE OC/PWM MODE TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
OC15
TFD
Fault Input to PWM I/O
Change
—
—
50
ns
OC20
TFLT
Fault Input Pulse Width
50
—
—
ns
Note 1:
2:
Conditions
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
DS70150D-page 198
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 24-12:
MOTOR CONTROL PWM MODULE FAULT TIMING CHARACTERISTICS
MP30
FLTA/B
MP20
PWMx
FIGURE 24-13:
MOTOR CONTROL PWM MODULE TIMING CHARACTERISTICS
MP11 MP10
PWMx
Note: Refer to Figure 24-2 for load conditions.
TABLE 24-30: MOTOR CONTROL PWM MODULE TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
—
—
—
ns
See parameter DO32
See parameter DO31
MP10
TFPWM
PWM Output Fall Time
MP11
TRPWM
PWM Output Rise Time
—
—
—
ns
TFD
Fault Input ↓ to PWM
I/O Change
—
—
50
ns
TFH
Minimum Pulse Width
50
—
—
ns
MP20
MP30
Note 1:
2:
Conditions
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
© 2008 Microchip Technology Inc.
DS70150D-page 199
dsPIC30F6010A/6015
FIGURE 24-14:
QEA/QEB INPUT CHARACTERISTICS
TQ36
QEA
(input)
TQ30
TQ31
TQ35
QEB
(input)
TQ41
TQ40
TQ30
TQ31
TQ35
QEB
Internal
TABLE 24-31: QUADRATURE DECODER TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Typ(2)
Max
Units
Conditions
TQ30
TQUL
Quadrature Input Low Time
6 TCY
—
ns
TQ31
TQUH
Quadrature Input High Time
6 TCY
—
ns
TQ35
TQUIN
Quadrature Input Period
12 TCY
—
ns
TQ36
TQUP
Quadrature Phase Period
3 TCY
—
ns
TQ40
TQUFL
Filter Time to Recognize Low,
with Digital Filter
3 * N * TCY
—
ns
N = 1, 2, 4, 16, 32, 64,
128 and 256 (Note 2)
TQ41
TQUFH
Filter Time to Recognize High,
with Digital Filter
3 * N * TCY
—
ns
N = 1, 2, 4, 16, 32, 64,
128 and 256 (Note 2)
Note 1:
2:
These parameters are characterized but not tested in manufacturing.
N = Index Channel Digital Filter Clock Divide Select Bits. Refer to Section 16. “Quadrature Encoder
Interface (QEI)” in the “dsPIC30F Family Reference Manual” (DS70046).
DS70150D-page 200
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 24-15:
QEI MODULE INDEX PULSE TIMING CHARACTERISTICS
QEA
(input)
QEB
(input)
Ungated
Index
TQ50
TQ51
Index Internal
TQ55
Position Coun-
TABLE 24-32: QEI INDEX PULSE TIMING REQUIREMENTS
AC CHARACTERISTICS
Param
No.
Symbol
TQ50
TqIL
TQ51
TQ55
Note 1:
2:
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Characteristic(1)
Min
Max
Units
Conditions
Filter Time to Recognize Low,
with Digital Filter
3 * N * TCY
—
ns
N = 1, 2, 4, 16, 32, 64,
128 and 256 (Note 2)
TqiH
Filter Time to Recognize High,
with Digital Filter
3 * N * TCY
—
ns
N = 1, 2, 4, 16, 32, 64,
128 and 256 (Note 2)
Tqidxr
Index Pulse Recognized to Position
Counter Reset (Ungated Index)
3 TCY
—
ns
These parameters are characterized but not tested in manufacturing.
Alignment of index pulses to QEA and QEB is shown for position counter reset timing only. Shown for
forward direction only (QEA leads QEB). Same timing applies for reverse direction (QEA lags QEB) but
index pulse recognition occurs on falling edge.
© 2008 Microchip Technology Inc.
DS70150D-page 201
dsPIC30F6010A/6015
FIGURE 24-16:
SPI MODULE MASTER MODE (CKE = 0) TIMING CHARACTERISTICS
SCKx
(CKP = 0)
SP11
SP10
SP21
SP20
SP20
SP21
SCKx
(CKP = 1)
SP35
BIT14 - - - - - -1
MSb
SDOx
SP31
SDIx
LSb
SP30
MSb IN
LSb IN
BIT14 - - - -1
SP40 SP41
Note: Refer to Figure 24-2 for load conditions.
TABLE 24-33: SPI MASTER MODE (CKE = 0) TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SP10
TscL
SCKX Output Low Time(3)
TCY/2
—
—
ns
SP11
TscH
SCKX Output High Time(3)
TCY/2
—
—
ns
—
—
—
ns
See parameter DO32
—
—
—
ns
See parameter DO31
Time(4)
Time(4)
SP20
TscF
SCKX Output Fall
SP21
TscR
SCKX Output Rise Time(4)
SP30
TdoF
SDOX Data Output Fall
—
—
—
ns
See parameter DO32
SP31
TdoR
SDOX Data Output Rise Time(4)
—
—
—
ns
See parameter DO31
SP35
TscH2doV,
TscL2doV
SDOX Data Output Valid after
SCKX Edge
—
—
30
ns
SP40
TdiV2scH,
TdiV2scL
Setup Time of SDIX Data Input
to SCKX Edge
20
—
—
ns
SP41
TscH2diL,
TscL2diL
Hold Time of SDIX Data Input
to SCKX Edge
20
—
—
ns
Note 1:
2:
3:
4:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
Assumes 50 pF load on all SPI pins.
DS70150D-page 202
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 24-17:
SPI MODULE MASTER MODE (CKE =1) TIMING CHARACTERISTICS
SP36
SCKX
(CKP = 0)
SP11
SCKX
(CKP = 1)
SP10
SP21
SP20
SP20
SP21
SP35
SP40
SDIX
LSb
BIT14 - - - - - -1
MSb
SDOX
SP30,SP31
MSb IN
BIT14 - - - -1
LSb IN
SP41
Note: Refer to Figure 24-2 for load conditions.
TABLE 24-34: SPI MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
SP10
Symbol
TscL
Characteristic(1)
SCKX output low time(3)
time(3)
SP11
TscH
SCKX output high
SP20
TscF
SCKX output fall time(4)
time(4)
SP21
TscR
SCKX output rise
SP30
TdoF
SDOX data output fall time(4)
(4)
Typ(2)
Max
Units
TCY/2
—
—
ns
TCY/2
—
—
ns
—
—
—
ns
See parameter DO32
—
—
—
ns
See parameter DO31
—
—
—
ns
See parameter DO32
See parameter DO31
SP31
TdoR
—
—
—
ns
SP35
TscH2doV, SDOX data output valid after
TscL2doV SCKX edge
—
—
—
ns
SP36
TdoV2sc,
TdoV2scL
30
—
—
ns
SP40
TdiV2scH, Setup time of SDIX data input
TdiV2scL to SCKX edge
20
—
—
ns
SP41
TscH2diL,
TscL2diL
20
—
—
ns
Note 1:
2:
3:
4:
SDOX data output rise time
Min
SDOX data output setup to
first SCKX edge
Hold time of SDIX data input
to SCKX edge
Conditions
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
Assumes 50 pF load on all SPI pins.
© 2008 Microchip Technology Inc.
DS70150D-page 203
dsPIC30F6010A/6015
FIGURE 24-18:
SPI MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS
SSX
SP52
SP50
SCKX
(CKP = 0)
SP71
SP70
SP73
SP72
SP72
SP73
SCKX
(CKP = 1)
SP35
MSb
SDOX
LSb
BIT14 - - - - - -1
SP51
SP30,SP31
SDIX
MSb IN
BIT14 - - - -1
SP41
LSb IN
Note: Refer to Figure 24-2 for load conditions.
SP40
TABLE 24-35: SPI MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
—
—
ns
Conditions
SP70
TscL
SCKX Input Low Time
30
SP71
TscH
SCKX Input High Time
30
—
—
ns
SP72
TscF
SCKX Input Fall Time(3)
—
10
25
ns
SP73
TscR
SCKX Input Rise Time(3)
—
10
25
ns
SP30
TdoF
SDOX Data Output Fall Time(3)
—
—
—
ns
See parameter DO32
See parameter DO31
SP31
TdoR
—
—
—
ns
SP35
TscH2doV, SDOX Data Output Valid after
TscL2doV SCKX Edge
—
—
30
ns
SP40
TdiV2scH, Setup Time of SDIX Data Input
TdiV2scL to SCKX Edge
20
—
—
ns
SP41
TscH2diL,
TscL2diL
20
—
—
ns
SP50
TssL2scH, SSX↓ to SCKX↑ or SCKX↓ Input
TssL2scL
120
—
—
ns
SP51
TssH2doZ
10
—
50
ns
SP52
TscH2ssH SSX after SCK Edge
TscL2ssH
1.5 TCY +40
—
—
ns
Note 1:
2:
3:
SDOX Data Output Rise Time
(3)
Hold Time of SDIX Data Input
to SCKX Edge
SSX↑ to SDOX Output
High-impedance(3)
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
Assumes 50 pF load on all SPI pins.
DS70150D-page 204
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 24-19:
SPI MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS
SP60
SSX
SP52
SP50
SCKX
(CKP = 0)
SP71
SP70
SP73
SP72
SP72
SP73
SCKX
(CKP = 1)
SP35
SP52
MSb
SDOX
BIT14 - - - - - -1
LSb
SP30,SP31
SDIX
MSb IN
SP51
BIT14 - - - -1
LSb IN
SP41
SP40
Note: Refer to Figure 24-2 for load conditions.
TABLE 24-36: SPI MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
—
—
ns
Conditions
SP70
TscL
SCKX Input Low Time
30
SP71
TscH
SCKX Input High Time
30
—
—
ns
SP72
TscF
SCKX Input Fall Time(3)
—
10
25
ns
—
10
25
ns
—
—
—
ns
See parameter DO32
See parameter DO31
(3)
SP73
TscR
SCKX Input Rise Time
SP30
TdoF
SDOX Data Output Fall Time(3)
SP31
TdoR
—
—
—
ns
SP35
TscH2doV, SDOX Data Output Valid after
TscL2doV SCKX Edge
—
—
30
ns
SP40
TdiV2scH, Setup Time of SDIX Data Input
TdiV2scL to SCKX Edge
20
—
—
ns
SP41
TscH2diL,
TscL2diL
20
—
—
ns
SP50
TssL2scH, SSX↓ to SCKX↓ or SCKX↑ input
TssL2scL
120
—
—
ns
Note 1:
2:
3:
4:
SDOX Data Output Rise Time
(3)
Hold Time of SDIX Data Input
to SCKX Edge
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
Assumes 50 pF load on all SPI pins.
© 2008 Microchip Technology Inc.
DS70150D-page 205
dsPIC30F6010A/6015
TABLE 24-36: SPI MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS (CONTINUED)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
SP51
TssH2doZ
SS↑ to SDOX Output
High-impedance(4)
SP52
TscH2ssH
TscL2ssH
SSX↑ after SCKX Edge
SP60
TssL2doV
SDOX Data Output Valid after
SSX Edge
Note 1:
2:
3:
4:
Min
Typ(2)
Max
Units
10
—
50
ns
1.5 TCY +
40
—
—
ns
—
—
50
ns
Conditions
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
Assumes 50 pF load on all SPI pins.
DS70150D-page 206
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 24-20:
I2C™ BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE)
SCL
IM31
IM34
IM30
IM33
SDA
Stop
Condition
Start
Condition
Note: Refer to Figure 24-2 for load conditions.
FIGURE 24-21:
I2C™ BUS DATA TIMING CHARACTERISTICS (MASTER MODE)
IM20
IM21
IM11
IM10
SCL
IM11
IM26
IM10
IM25
IM33
SDA
In
IM40
IM40
IM45
SDA
Out
Note: Refer to Figure 24-2 for load conditions.
© 2008 Microchip Technology Inc.
DS70150D-page 207
dsPIC30F6010A/6015
TABLE 24-37: I2C™ BUS DATA TIMING REQUIREMENTS (MASTER MODE)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
IM10
Min(1)
Max
Units
TLO:SCL Clock Low Time 100 kHz mode
TCY/2 (BRG + 1)
—
μs
400 kHz mode
TCY/2 (BRG + 1)
—
μs
mode(2)
TCY/2 (BRG + 1)
—
μs
Clock High Time 100 kHz mode
TCY/2 (BRG + 1)
—
μs
400 kHz mode
TCY/2 (BRG + 1)
—
μs
1 MHz mode(2)
TCY/2 (BRG + 1)
—
μs
100 kHz mode
—
300
ns
400 kHz mode
20 + 0.1 CB
300
ns
1 MHz mode(2)
—
100
ns
100 kHz mode
—
1000
ns
Characteristic
1 MHz
IM11
THI:SCL
IM20
TF:SCL
IM21
TR:SCL
IM25
SDA and SCL
Fall Time
SDA and SCL
Rise Time
TSU:DAT Data Input
Setup Time
400 kHz mode
20 + 0.1 CB
300
ns
1 MHz mode(2)
—
300
ns
100 kHz mode
250
—
ns
400 kHz mode
100
—
ns
mode(2)
—
—
ns
100 kHz mode
0
—
ns
1 MHz
IM26
THD:DAT Data Input
Hold Time
IM30
TSU:STA
IM31
Start Condition
Setup Time
THD:STA Start Condition
Hold Time
IM33
TSU:STO Stop Condition
Setup Time
400 kHz mode
0
0.9
μs
1 MHz mode(2)
—
—
ns
100 kHz mode
TCY/2 (BRG + 1)
—
μs
400 kHz mode
TCY/2 (BRG + 1)
—
μs
1 MHz mode(2)
TCY/2 (BRG + 1)
—
μs
100 kHz mode
TCY/2 (BRG + 1)
—
μs
400 kHz mode
TCY/2 (BRG + 1)
—
μs
1 MHz mode(2)
TCY/2 (BRG + 1)
—
μs
100 kHz mode
TCY/2 (BRG + 1)
—
μs
400 kHz mode
TCY/2 (BRG + 1)
—
μs
mode(2)
TCY/2 (BRG + 1)
—
μs
100 kHz mode
TCY/2 (BRG + 1)
—
ns
1 MHz
IM34
THD:STO Stop Condition
Hold Time
IM40
TAA:SCL
Output Valid
From Clock
400 kHz mode
TCY/2 (BRG + 1)
—
ns
1 MHz mode(2)
TCY/2 (BRG + 1)
—
ns
100 kHz mode
—
3500
ns
400 kHz mode
—
1000
ns
mode(2)
—
—
ns
100 kHz mode
4.7
—
μs
400 kHz mode
1.3
—
μs
1 MHz mode(2)
—
—
μs
—
400
pF
1 MHz
IM45
TBF:SDA Bus Free Time
IM50
CB
Note 1:
2:
Bus Capacitive Loading
Conditions
CB is specified to be
from 10 to 400 pF
CB is specified to be
from 10 to 400 pF
Only relevant for
Repeated Start
condition
After this period the
first clock pulse is
generated
Time the bus must be
free before a new
transmission can start
BRG is the value of the I2C Baud Rate Generator. Refer to Section 21. “Inter-Integrated Circuit (I2C™)”
in the “dsPIC30F Family Reference Manual” (DS70046).
Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only).
DS70150D-page 208
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 24-22:
I2C™ BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE)
SCL
IS34
IS31
IS30
IS33
SDA
Stop
Condition
Start
Condition
FIGURE 24-23:
I2C™ BUS DATA TIMING CHARACTERISTICS (SLAVE MODE)
IS20
IS21
IS11
IS10
SCL
IS30
IS26
IS31
IS25
IS33
SDA
In
IS40
IS40
IS45
SDA
Out
© 2008 Microchip Technology Inc.
DS70150D-page 209
dsPIC30F6010A/6015
TABLE 24-38: I2C™ BUS DATA TIMING REQUIREMENTS (SLAVE MODE
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
IS10
IS11
IS20
IS21
IS25
IS26
IS30
IS31
IS33
IS34
IS40
IS45
IS50
Note
Symbol
TLO:SCL
THI:SCL
Characteristic
Clock Low Time
Clock High Time
Min
Max
Units
100 kHz mode
4.7
—
μs
400 kHz mode
1.3
—
μs
1 MHz mode(1)
100 kHz mode
0.5
4.0
—
—
µs
µs
400 kHz mode
0.6
—
µs
0.5
—
µs
1 MHz mode(1)
SDA and SCL
100 kHz mode
—
300
ns
TF:SCL
Fall Time
300
ns
400 kHz mode
20 + 0.1 CB
1 MHz mode(1)
—
100
ns
SDA and SCL
100 kHz mode
—
1000
ns
TR:SCL
Rise Time
300
ns
400 kHz mode
20 + 0.1 CB
1 MHz mode(1)
—
300
ns
100 kHz mode
250
—
ns
TSU:DAT Data Input
Setup Time
400 kHz mode
100
—
ns
(1)
100
—
ns
1 MHz mode
100 kHz mode
0
—
ns
THD:DAT Data Input
Hold Time
400 kHz mode
0
0.9
μs
0
0.3
μs
1 MHz mode(1)
100 kHz mode
4.7
—
μs
TSU:STA Start Condition
Setup Time
400 kHz mode
0.6
—
μs
0.25
—
μs
1 MHz mode(1)
100 kHz mode
4.0
—
μs
THD:STA Start Condition
Hold Time
400 kHz mode
0.6
—
μs
0.25
—
μs
1 MHz mode(1)
100 kHz mode
4.7
—
μs
TSU:STO Stop Condition
Setup Time
400 kHz mode
0.6
—
μs
(1)
0.6
—
μs
1 MHz mode
100 kHz mode
4000
—
ns
THD:STO Stop Condition
Hold Time
400 kHz mode
600
—
ns
250
ns
1 MHz mode(1)
0
3500
ns
TAA:SCL Output Valid From 100 kHz mode
Clock
400 kHz mode
0
1000
ns
0
350
ns
1 MHz mode(1)
100 kHz mode
4.7
—
μs
TBF:SDA Bus Free Time
400 kHz mode
1.3
—
μs
0.5
—
μs
1 MHz mode(1)
CB
Bus Capacitive Loading
—
400
pF
1: Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only).
DS70150D-page 210
Conditions
Device must operate at a
minimum of 1.5 MHz
Device must operate at a
minimum of 10 MHz
Device must operate at a
minimum of 1.5 MHz
Device must operate at a
minimum of 10 MHz
CB is specified to be from
10 to 400 pF
CB is specified to be from
10 to 400 pF
Only relevant for Repeated
Start condition
After this period, the first
clock pulse is generated
Time the bus must be free
before a new transmission
can start
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 24-24:
CXTX Pin
(output)
CAN MODULE I/O TIMING CHARACTERISTICS
New Value
Old Value
CA10 CA11
CXRX Pin
(input)
CA20
TABLE 24-39: CAN MODULE I/O TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Characteristic(1)
Symbol
Min
Typ(2)
Max
Units
Conditions
—
—
—
ns
See parameter DO32
See parameter DO31
TioF
Port Output Fall Time
CA11
TioR
Port Output Rise Time
—
—
—
ns
CA20
Tcwf
Pulse Width to Trigger
CAN Wake-up Filter
500
—
—
ns
CA10
Note 1:
2:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
© 2008 Microchip Technology Inc.
DS70150D-page 211
dsPIC30F6010A/6015
TABLE 24-40: 10-BIT HIGH-SPEED A/D MODULE SPECIFICATIONS(1)
Standard Operating Conditions: 2.7V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min.
Typ
Max.
Units
Conditions
Device Supply
AD01
AVDD
Module VDD Supply
AD02
AVSS
Module VSS Supply
Greater of
VDD – 0.3
or 2.7
—
Lesser of
VDD + 0.3
or 5.5
V
Vss - 0.3
—
VSS + 0.3
V
AVDD
V
Reference Inputs
AD05
VREFH
Reference Voltage High
AVss + 2.7
AD06
VREFL
Reference Voltage Low
AVss
AD07
VREF
Absolute Reference Voltage AVss – 0.3
AD08
IREF
Current Drain
AD10
VINH-VINL Full-Scale Input Span
AD12
—
Leakage Current
—
AD13
—
Leakage Current
AD17
RIN
Recommended Impedance
of Analog Voltage Source
AD20
Nr
Resolution
—
—
AVDD – 2.7
V
—
AVDD + 0.3
V
200
.001
300
3
μA
μA
VREFH
V
±0.001
±0.244
μA
VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 5V
Source Impedance = 5 kΩ
—
±0.001
±0.244
μA
VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3V
Source Impedance = 5 kΩ
—
—
—
Ω
See Table 20-2
—
A/D operating
A/D off
Analog Input
VREFL
DC Accuracy
10 data bits
bits
—
Nonlinearity(2)
—
±1
±1
LSb VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 5V
AD21A INL
Integral Nonlinearity(2)
—
±1
±1
LSb VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3V
AD22
DNL
Differential Nonlinearity(2)
—
±1
±1
LSb VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 5V
AD22A DNL
Differential Nonlinearity(2)
—
±1
±1
LSb VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3V
AD23
GERR
Gain Error(2)
+1
±5
±6
LSb VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 5V
AD23A GERR
Gain Error(2)
+1
±5
±6
LSb VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3V
AD21
Note 1:
2:
3:
INL
Integral
These parameters are characterized but not tested in manufacturing.
Measurements taken with external VREF+ and VREF- used as the ADC voltage references.
The A/D conversion result never decreases with an increase in the input voltage, and has no missing
codes.
DS70150D-page 212
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 24-40: 10-BIT HIGH-SPEED A/D MODULE SPECIFICATIONS(1) (CONTINUED)
Standard Operating Conditions: 2.7V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min.
Typ
Max.
Units
Conditions
EOFF
Offset Error(2)
±1
±2
±3
LSb VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 5V
AD24A EOFF
Offset Error(2)
±1
±2
±3
LSb VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3V
AD25
Monotonicity(3)
—
—
—
—
AD24
—
Guaranteed
Dynamic Performance
AD30
THD
Total Harmonic Distortion
—
-64
-67
dB
AD31
SINAD
Signal to Noise and
Distortion
—
57
58
dB
AD32
SFDR
Spurious Free Dynamic
Range
—
67
71
dB
AD33
FNYQ
Input Signal Bandwidth
—
—
500
kHz
AD34
ENOB
Effective Number of Bits
9.29
9.41
—
bits
Note 1:
2:
3:
These parameters are characterized but not tested in manufacturing.
Measurements taken with external VREF+ and VREF- used as the ADC voltage references.
The A/D conversion result never decreases with an increase in the input voltage, and has no missing
codes.
© 2008 Microchip Technology Inc.
DS70150D-page 213
dsPIC30F6010A/6015
FIGURE 24-25:
10-BIT HIGH-SPEED A/D CONVERSION TIMING CHARACTERISTICS
(CHPS = 01, SIMSAM = 0, ASAM = 0, SSRC = 000)
AD50
ADCLK
Instruction
Execution SET SAMP
CLEAR SAMP
SAMP
ch0_dischrg
ch0_samp
ch1_dischrg
ch1_samp
eoc
AD61
AD60
AD55
TSAMP
AD55
DONE
ADIF
ADRES(0)
ADRES(1)
1
2
3
4
5
6
8
9
5
6
8
9
1 - Software sets ADCON. SAMP to start sampling.
2 - Sampling starts after discharge period.
TSAMP is described in Section 17. “10-bit A/D Converter” of the “dsPIC30F Family Reference Manual” (DS70046).
3 - Software clears ADCON. SAMP to start conversion.
4 - Sampling ends, conversion sequence starts.
5 - Convert bit 9.
6 - Convert bit 8.
8 - Convert bit 0.
9 - One TAD for end of conversion.
DS70150D-page 214
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 24-26:
10-BIT HIGH-SPEED A/D CONVERSION TIMING CHARACTERISTICS
(CHPS = 01, SIMSAM = 0, ASAM = 1, SSRC = 111, SAMC = 00001)
AD50
ADCLK
Instruction
Execution SET ADON
SAMP
ch0_dischrg
ch0_samp
ch1_dischrg
ch1_samp
eoc
TSAMP
AD55
TSAMP
AD55
TCONV
DONE
ADIF
ADRES(0)
ADRES(1)
1
2
3
4
5
6
7
3
4
5
6
8
3
4
1 - Software sets ADCON. ADON to start AD operation.
5 - Convert bit 0.
2 - Sampling starts after discharge period.
TSAMP is described in Section 17. “10-bit A/D Converter”
of the “dsPIC30F Family Reference Manual” (DS70046).
6 - One TAD for end of conversion.
3 - Convert bit 9.
8 - Sample for time specified by SAMC.
TSAMP is described in Section 17. “10-bit A/D Converter”
of the “dsPIC30F Family Reference Manual” (DS70046).
4 - Convert bit 8.
© 2008 Microchip Technology Inc.
7 - Begin conversion of next channel.
DS70150D-page 215
dsPIC30F6010A/6015
TABLE 24-41: 10-BIT HIGH-SPEED A/D CONVERSION TIMING REQUIREMENTS
Standard Operating Conditions: 2.7V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
Characteristic
Min.
Typ(1)
Max.
Units
Conditions
Clock Parameters
See Table 20-2(2)
AD50
TAD
A/D Clock Period
84
—
—
ns
AD51
tRC
A/D Internal RC Oscillator Period
700
900
1100
ns
AD55
tCONV
Conversion Time
—
12 TAD
—
—
AD56
FCNV
Throughput Rate
—
1.0
—
Msps
See Table 20-2(2)
AD57
TSAMP
Sample Time
1 TAD
—
—
—
See Table 20-2(2)
AD60
tPCS
Conversion Start from Sample
Trigger(3)
Auto-Convert Trigger
(SSRC = 111) not
selected
AD61
tPSS
Sample Start from Setting
Sample (SAMP) Bit
AD62
tCSS
AD63
tDPU(4)
Conversion Rate
Timing Parameters
Note 1:
2:
3:
4:
—
1.0 TAD
—
—
0.5 TAD
—
1.5 TAD
—
Conversion Completion to
Sample Start (ASAM = 1)(3)
—
0.5 TAD
—
—
Time to Stabilize Analog Stage
from A/D Off to A/D On(3)
—
—
20
μs
These parameters are characterized but not tested in manufacturing.
Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures.
Characterized by design but not tested.
tDPU is the time required for the ADC module to stabilize when it is turned on (ADCON1<ADON> = 1). During this time the ADC result is indeterminate.
DS70150D-page 216
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
25.0
PACKAGING INFORMATION
25.1
Package Marking Information
64-Lead TQFP
Example
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
80-Lead TQFP
Example
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
dsPIC30F6015
-30I/PT e3
0712XXX
dsPIC30F6010
A-30I/PT e3
0712XXX
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2008 Microchip Technology Inc.
DS70150D-page 217
dsPIC30F6010A/6015
64-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
E
e
E1
N
b
NOTE 1
123
NOTE 2
α
A
c
φ
A2
β
A1
L
L1
Units
Dimension Limits
Number of Leads
MILLIMETERS
MIN
N
NOM
MAX
64
Lead Pitch
e
Overall Height
A
–
0.50 BSC
–
Molded Package Thickness
A2
0.95
1.00
1.05
Standoff
A1
0.05
–
0.15
Foot Length
L
0.45
0.60
0.75
Footprint
L1
1.20
1.00 REF
Foot Angle
φ
Overall Width
E
12.00 BSC
Overall Length
D
12.00 BSC
0°
3.5°
Molded Package Width
E1
10.00 BSC
Molded Package Length
D1
10.00 BSC
7°
Lead Thickness
c
0.09
–
0.20
Lead Width
b
0.17
0.22
0.27
Mold Draft Angle Top
α
11°
12°
13°
Mold Draft Angle Bottom
β
11°
12°
13°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-085B
DS70150D-page 218
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
80-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm Footprint [TQFP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
E
e
E1
N
b
NOTE 1
12 3
α
NOTE 2
A
c
β
φ
A2
A1
L1
L
Units
Dimension Limits
Number of Leads
MILLIMETERS
MIN
N
NOM
MAX
80
Lead Pitch
e
Overall Height
A
–
0.50 BSC
–
Molded Package Thickness
A2
0.95
1.00
1.05
Standoff
A1
0.05
–
0.15
Foot Length
L
0.45
0.60
0.75
Footprint
L1
1.20
1.00 REF
Foot Angle
φ
Overall Width
E
14.00 BSC
Overall Length
D
14.00 BSC
Molded Package Width
E1
12.00 BSC
Molded Package Length
D1
12.00 BSC
0°
3.5°
7°
Lead Thickness
c
0.09
–
0.20
Lead Width
b
0.17
0.22
0.27
Mold Draft Angle Top
α
11°
12°
13°
Mold Draft Angle Bottom
β
11°
12°
13°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-092B
© 2008 Microchip Technology Inc.
DS70150D-page 219
dsPIC30F6010A/6015
80-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm Footprint [TQFP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
E
e
E1
b
N
NOTE 1
1 23
c
φ
β
α
NOTE 2
A
A1
L
L1
Units
Dimension Limits
Number of Leads
A2
MILLIMETERS
MIN
N
NOM
MAX
80
Lead Pitch
e
Overall Height
A
–
0.65 BSC
–
Molded Package Thickness
A2
0.95
1.00
1.05
Standoff
A1
0.05
–
0.15
Foot Length
L
0.45
0.60
0.75
Footprint
L1
1.20
1.00 REF
Foot Angle
φ
Overall Width
E
16.00 BSC
Overall Length
D
16.00 BSC
Molded Package Width
E1
14.00 BSC
Molded Package Length
D1
14.00 BSC
0°
3.5°
7°
Lead Thickness
c
0.09
–
0.20
Lead Width
b
0.22
0.32
0.38
Mold Draft Angle Top
α
11°
12°
13°
Mold Draft Angle Bottom
β
11°
12°
13°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-116B
DS70150D-page 220
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
APPENDIX A:
REVISION HISTORY
Revision A (July 2005)
Original data sheet for dsPIC30F6010A/6015 devices.
Revision B (September 2006)
This revision reflects updates in these areas:
• Data Ram protection feature enables segments of
RAM to be protected when used in conjunction
with Boot and Secure Code Segment Security
(see Section 3.2.7 “Data Ram Protection Feature”)
• BSRAM and SSRAM SFRs added to support
Data Ram Protection (see Table 3-3)
• Base Instruction CP1 removed (see Table 22-2)
• Supported I2C Slave addresses (see Table 17-2)
• Revised Electrical Characteristics:
- Operating current (IDD) specifications (see
Table 24-6)
- Idle current (IIDLE) specifications (see
Table 24-7)
- Power-down current (IPD) specifications (see
Table 24-8)
- I/O Pin input specifications (see Table 24-9)
- BOR voltage limits (see Table 24-11)
- Watchdog Timer time-out limits (see
Table 24-21)
• Added note to package drawings.
Revision C (January 2007)
This revision includes updates to the packaging
diagrams.
© 2008 Microchip Technology Inc.
Revision D (June 2008)
This revision reflects these updates:
• Changed the location of the input reference in the
10-bit High-Speed ADC Functional Block Diagram
(see Figure 20-1)
• Added FUSE Configuration Register (FICD)
details (see Section 21.6 “Device Configuration
Registers” and Table 21-9)
• Removed erroneous statement regarding generation of CAN receive errors (see Section 19.4.5
“Receive Errors”)
• Electrical Specifications:
- Resolved TBD values for parameters DO10,
DO16, DO20, and DO26 (see Table 24-10)
- 10-bit High-Speed ADC tPDU timing parameter (time to stabilize) has been updated from
20 µs typical to 20 µs maximum (see
Table 24-41)
- Parameter OS65 (Internal RC Accuracy) has
been expanded to reflect multiple Min and
Max values for different temperatures (see
Table 24-19)
- Parameter DC12 (RAM Data Retention Voltage) Min and Max values have been updated
(see Table 24-5)
- Parameter D134 (Erase/Write Cycle Time)
has been updated to include Min and Max
values and the Typ value has been removed
(see Table 24-12)
- Removed parameters OS62 (Internal FRC
Jitter) and OS64 (Internal FRC Drift) and
Note 2 from AC Characteristics (see
Table 24-18)
- Parameter OS63 (Internal FRC Accuracy)
has been expanded to reflect multiple Min
and Max values for different temperatures
(see Table 24-18)
- Updated Min and Max values and Conditions
for parameter SY11 and updated Min, Typ,
and Max values and Conditions for parameter SY20 (see Table 24-21)
• Additional minor corrections throughout the
document
DS70150D-page 221
dsPIC30F6010A/6015
NOTES:
DS70150D-page 222
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
INDEX
A
A/D
Aborting a Conversion ............................................. 140
Acquisition Requirements ........................................ 144
ADCHS .................................................................... 137
ADCON1 .................................................................. 137
ADCON2 .................................................................. 137
ADCON3 .................................................................. 137
ADCSSL ................................................................... 137
ADPCFG .................................................................. 137
Configuring Analog Port Pins ................................... 146
Connection Considerations ...................................... 146
Conversion Operation .............................................. 139
Conversion Rate Parameters ................................... 141
Conversion Speeds .................................................. 141
Effects of a Reset ..................................................... 145
Operation During CPU Idle Mode ............................ 145
Operation During CPU Sleep Mode ......................... 145
Output Formats ........................................................ 145
Power-Down Modes ................................................. 145
Programming the Start of Conversion Trigger ......... 140
Register Map ............................................................ 147
Result Buffer ............................................................ 139
Selecting the Conversion Clock ............................... 140
Selecting the Conversion Sequence ........................ 139
Voltage Reference Schematic ................................. 142
1 Msps Configuration Guideline ............................... 142
10-bit High-Speed Analog-to-Digital
Converter Module .................................................... 137
600 ksps Configuration Guideline ............................ 143
750 ksps Configuration Guideline ............................ 143
AC Characteristics ........................................................... 186
Internal FRC Jitter, Accuracy and Drift .................... 190
Internal LPRC Accuracy ........................................... 190
Load Conditions ....................................................... 186
Temperature and Voltage Specifications ................. 186
Address Generator Units ................................................... 35
Alternate Vector Table ....................................................... 45
Alternate 16-bit Timer/Counter ........................................... 91
Assembler
MPASM Assembler .................................................. 174
Automatic Clock Stretch ................................................... 112
During 10-bit Addressing (STREN = 1) .................... 112
During 7-bit Addressing (STREN = 1) ...................... 112
Receive Mode .......................................................... 112
Transmit Mode ......................................................... 112
B
Barrel Shifter ...................................................................... 22
Bit-Reversed Addressing ................................................... 38
Example ..................................................................... 38
Implementation .......................................................... 38
Modifier Values (table) ............................................... 39
Sequence Table (16-Entry) ........................................ 39
Block Diagrams
CAN Buffers and Protocol Engine ............................ 126
Dedicated Port Structure ............................................ 59
DSP Engine ............................................................... 19
dsPIC30F6010A ......................................................... 10
dsPIC30F6015 ........................................................... 11
External Power-on Reset Circuit .............................. 158
Input Capture Mode ................................................... 81
I2C ............................................................................ 110
© 2008 Microchip Technology Inc.
Oscillator System ..................................................... 151
Output Compare Mode .............................................. 85
PWM Module ............................................................. 96
Quadrature Encoder Interface ................................... 89
Reset System .......................................................... 155
Shared Port Structure ................................................ 60
SPI ........................................................................... 106
SPI Master/Slave Connection .................................. 106
UART Receiver ........................................................ 118
UART Transmitter .................................................... 117
10-bit High-Speed A/D Functional ........................... 138
16-bit Timer1 Module (Type A Timer) ........................ 66
16-bit Timer2 (Type B Timer) for dsPIC30F6010A .... 72
16-bit Timer2 (Type B Timer) for dsPIC30F6015 ...... 72
16-bit Timer3 (Type C Timer) .................................... 73
16-bit Timer4 (Type B Timer) .................................... 78
16-bit Timer5 (Type C Timer) .................................... 78
32-bit Timer2/3 for dsPIC30F6010A .......................... 70
32-bit Timer2/3 for dsPIC30F6015 ............................ 71
32-bit Timer4/5 .......................................................... 77
BOR. See Brown-out Reset.
Brown-out Reset (BOR) ................................................... 149
C
C Compilers
MPLAB C18 ............................................................. 174
MPLAB C30 ............................................................. 174
CAN
Baud Rate Setting ................................................... 130
Bit Timing ......................................................... 130
Phase Segments ............................................. 131
Prescaler ......................................................... 131
Propagation Segment ...................................... 131
Sample Point ................................................... 131
Synchronization ............................................... 131
CAN1 Register Map for dsPIC30F6010A/6015 ....... 132
CAN2 Register Map for dsPIC30F6010A ................ 134
Frame Types ........................................................... 125
Message Reception ................................................. 128
Acceptance Filter Masks ................................. 128
Acceptance Filters ........................................... 128
Receive Buffers ............................................... 128
Receive Errors ................................................. 128
Receive Interrupts ........................................... 128
Receive Overrun .............................................. 128
Message Transmission ............................................ 129
Aborting ........................................................... 129
Errors ............................................................... 129
Priority ............................................................. 129
Sequence ........................................................ 129
Transmit Buffers .............................................. 129
Transmit Interrupts .......................................... 130
Operation Modes ..................................................... 127
Disable ............................................................ 127
Error Recognition ............................................. 127
Initialization ...................................................... 127
Listen-Only ...................................................... 127
Loopback ......................................................... 127
Normal ............................................................. 127
Overview .................................................................. 125
CAN Module .................................................................... 125
Center-Aligned PWM ......................................................... 99
Code Examples
Data EEPROM Block Erase ...................................... 56
DS70150D-page 223
dsPIC30F6010A/6015
Data EEPROM Block Write ........................................ 58
Data EEPROM Read ................................................. 55
Data EEPROM Word Erase ....................................... 56
Data EEPROM Word Write ........................................ 57
Erasing a Row of Program Memory ........................... 51
Initiating a Programming Sequence ........................... 52
Loading Write Latches ............................................... 52
Port Write/Read Example .......................................... 60
Code Protection ............................................................... 149
Complementary PWM Operation ..................................... 100
Configuring Analog Port Pins ............................................. 60
Core Overview ................................................................... 15
CPU Architecture Overview ............................................... 15
Customer Change Notification Service ............................ 228
Customer Notification Service .......................................... 228
Customer Support ............................................................ 228
D
Data Access from Program Memory Using
Program Space Visibility .................................................... 26
Data Accumulators and Adder/Subtracter .......................... 20
Data Space Write Saturation ..................................... 22
Write Back .................................................................. 21
Data Accumulators and Adder/Subtractor
Overflow and Saturation ............................................ 20
Round Logic ............................................................... 21
Data Address Space .......................................................... 27
Alignment ................................................................... 30
Alignment (Figure) ..................................................... 30
Effect of Invalid Memory Accesses ............................ 30
MCU and DSP (MAC Class) Instructions Example .... 29
Memory Map ........................................................ 27, 28
Near Data Space ....................................................... 31
Software Stack ........................................................... 31
Spaces ....................................................................... 30
Width .......................................................................... 30
Data EEPROM Memory ..................................................... 55
Erasing ....................................................................... 56
Erasing, Block ............................................................ 56
Erasing, Word ............................................................ 56
Protection Against Spurious Write ............................. 58
Reading ...................................................................... 55
Write Verify ................................................................ 58
Writing ........................................................................ 57
Writing, Block ............................................................. 58
Writing, Word ............................................................. 57
DC Characteristics ........................................................... 178
Brown-out Reset ...................................................... 184
I/O Pin Output Specifications ................................... 184
Idle Current (IIDLE) ................................................... 181
Operating Current (IDD) ............................................ 180
Operating MIPS vs. Voltage for dsPIC30F6010A .... 178
Operating MIPS vs. Voltage for dsPIC30F6015 ...... 178
Power-Down Current (IPD) ....................................... 182
Program and EEPROM ............................................ 185
Thermal Operating Conditions for
dsPIC30F6010A/6015 .............................................. 178
Thermal Packaging Characteristics ......................... 178
Dead-Time Generators .................................................... 100
Assignment .............................................................. 100
Ranges ..................................................................... 100
Selection Bits ........................................................... 100
Development Support ...................................................... 173
Device Configuration
Register Map ............................................................ 163
Device Configuration Registers ........................................ 161
DS70150D-page 224
FBORPOR ............................................................... 161
FGS ......................................................................... 161
FOSC ....................................................................... 161
FWDT ...................................................................... 161
Device Overview .................................................................. 9
Divide Support ................................................................... 18
DSP Engine ....................................................................... 18
Multiplier .................................................................... 20
dsPIC30F6010A Port Register Map .................................. 61
dsPIC30F6015 Port Register Map ..................................... 62
Dual Output Compare Match Mode ................................... 86
Continuous Pulse Mode ............................................. 86
Single Pulse Mode ..................................................... 86
E
Edge-Aligned PWM ........................................................... 98
Electrical Characteristics ................................................. 177
Absolute Maximum Ratings ..................................... 177
BOR ......................................................................... 185
Equations
A/D Conversion Clock .............................................. 140
Baud Rate ................................................................ 121
PWM Period ............................................................... 98
PWM Resolution ........................................................ 98
Serial Clock Rate ..................................................... 114
Time Quantum for Clock Generation ....................... 131
Errata ................................................................................... 7
External Interrupt Requests ............................................... 45
F
Fast Context Saving .......................................................... 45
Flash Program Memory ..................................................... 49
In-Circuit Serial Programming (ICSP) ........................ 49
Run-Time Self-Programming (RTSP) ........................ 49
Table Instruction Operation Summary ....................... 49
I
I/O Ports ............................................................................. 59
Parallel I/O (PIO) ....................................................... 59
Idle Current (IIDLE) ........................................................... 181
In-Circuit Debugger (ICD 2) ............................................. 162
In-Circuit Serial Programming (ICSP) .............................. 149
Independent PWM Output ............................................... 101
Initialization Condition for RCON Register Case 1 .......... 159
Initialization Condition for RCON Register Case 2 .......... 159
Input Capture Module ........................................................ 81
Interrupts ................................................................... 82
Operation During Sleep and Idle Modes .................... 82
Register Map ............................................................. 83
Simple Capture Event Mode ...................................... 81
Input Change Notification Module ...................................... 63
Register Map (bits 15-8) ............................................ 63
Register Map (bits 7-0 for dsPIC30F6010A) .............. 63
Register Map (bits 7-0 for dsPIC30F6015) ................ 63
Instruction Addressing Modes ........................................... 35
File Register Instructions ........................................... 35
Fundamental Modes Supported ................................ 35
MAC Instructions ....................................................... 36
MCU Instructions ....................................................... 35
Move and Accumulator Instructions ........................... 36
Other Instructions ...................................................... 36
Instruction Set
Overview .................................................................. 168
Summary ................................................................. 165
Internet Address .............................................................. 228
Interrupt Controller
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
Register Map (dsPIC30F6010A) ................................ 46
Register Map (dsPIC30F6015) .................................. 47
Interrupt Priority ................................................................. 42
Interrupt Sequence ............................................................ 45
Interrupt Stack Frame ................................................ 45
Interrupts ............................................................................ 41
I2C Master Operation
Baud Rate Generator ............................................... 113
Clock Arbitration ....................................................... 114
Multi-Master Communication, Bus Collision
and Bus Arbitration .................................................. 114
Reception ................................................................. 113
Transmission ............................................................ 113
I2C Module
Addresses ................................................................ 111
General Call Address Support ................................. 113
Interrupts .................................................................. 113
IPMI Support ............................................................ 113
Master Operation ..................................................... 113
Master Support ........................................................ 113
Operating Function Description ............................... 109
Operation During CPU Sleep and Idle Modes ......... 114
Pin Configuration ..................................................... 109
Programmer’s Model ................................................ 109
Register Map ............................................................ 115
Registers .................................................................. 109
Slope Control ........................................................... 113
Software Controlled Clock Stretching (STREN = 1) . 112
Various Modes ......................................................... 109
I2C 10-bit Slave Mode Operation ..................................... 111
10-bit Mode Slave Reception ................................... 112
10-bit Mode Slave Transmission .............................. 112
I2C 7-bit Slave Mode Operation ....................................... 111
Reception ................................................................. 111
Transmission ............................................................ 111
I2C™ Module ................................................................... 109
M
Memory Organization ......................................................... 23
Core Register Map ..................................................... 32
Microchip Internet Web Site ............................................. 228
Modulo Addressing ............................................................ 36
Applicability ................................................................ 38
Operation Example .................................................... 37
Start and End Address ............................................... 37
W Address Register Selection ................................... 37
Motor Control PWM Module ............................................... 95
8-Output Register Map ............................................. 104
MPLAB ASM30 Assembler, Linker, Librarian .................. 174
MPLAB ICD 2 In-Circuit Debugger .................................. 175
MPLAB ICE 2000 High-Performance Universal
In-Circuit Emulator ........................................................... 175
MPLAB Integrated Development Environment
Software ........................................................................... 173
MPLAB PM3 Device Programmer ................................... 175
MPLAB REAL ICE In-Circuit Emulator System ................ 175
MPLINK Object Linker/MPLIB Object Librarian ............... 174
O
Operating Current (IDD) .................................................... 180
Oscillator
Operating Modes (Table) ......................................... 150
System Overview ..................................................... 149
Oscillator Configurations .................................................. 152
Fail-Safe Clock Monitor ............................................ 154
Fast RC (FRC) ......................................................... 153
© 2008 Microchip Technology Inc.
Initial Clock Source Selection .................................. 152
Low-Power RC (LPRC) ........................................... 154
LP Oscillator Control ................................................ 153
Phase Locked Loop (PLL) ....................................... 153
Start-up Timer (OST) ............................................... 153
Oscillator Selection .......................................................... 149
Output Compare Module ................................................... 85
Interrupts ................................................................... 87
Operation During CPU Idle Mode .............................. 87
Operation During CPU Sleep Mode .......................... 87
Register Map ............................................................. 88
P
Packaging Information ..................................................... 217
Marking .................................................................... 217
Peripheral Module Disable (PMD) Registers ................... 162
PICSTART Plus Development Programmer .................... 176
Pin Diagrams ................................................................... 5–6
Pinout Descriptions ............................................................ 12
POR. See Power-on Reset.
Position Measurement Mode ............................................. 90
Power Saving Modes
Idle ........................................................................... 161
Sleep ....................................................................... 160
Power-on Reset (POR) .................................................... 149
Oscillator Start-up Timer (OST) ............................... 149
Power-up Timer (PWRT) ......................................... 149
Power-Saving Modes ....................................................... 160
Power-Saving Modes (Sleep and Idle) ............................ 149
Program Address Space .................................................... 23
Construction .............................................................. 24
Data Access from Program Memory Using Table Instructions ................................................................... 25
Data Access from, Address Generation .................... 24
Memory Map .............................................................. 23
Table Instructions
TBLRDH ............................................................ 25
TBLRDL ............................................................. 25
TBLWTH ............................................................ 25
TBLWTL ............................................................ 25
Program Counter ............................................................... 16
Program Data Table Access .............................................. 26
Program Space Visibility
Window into Program Space Operation .................... 27
Programmable ................................................................. 149
Programmable Digital Noise Filters ................................... 91
Programmer’s Model ......................................................... 16
Diagram ..................................................................... 17
Programming Operations ................................................... 51
Algorithm for Program Flash ...................................... 51
Erasing a Row of Program Memory .......................... 51
Initiating the Programming Sequence ....................... 52
Loading Write Latches ............................................... 52
Protection Against Accidental Writes to OSCCON .......... 155
PWM Duty Cycle Comparison Units .................................. 99
Duty Cycle Immediate Updates ................................. 99
Duty Cycle Register Buffers ...................................... 99
PWM Fault Pins ............................................................... 102
Enable Bits .............................................................. 102
Fault States ............................................................. 102
Input Modes ............................................................. 102
Cycle-by-Cycle ................................................ 102
Latched ............................................................ 102
Priority ..................................................................... 102
PWM Operation During CPU Idle Mode .......................... 103
PWM Operation During CPU Sleep Mode ....................... 103
DS70150D-page 225
dsPIC30F6010A/6015
PWM Output and Polarity Control .................................... 102
Output Pin Control ................................................... 102
PWM Output Override ...................................................... 101
Complementary Output Mode .................................. 101
Synchronization ....................................................... 101
PWM Period ....................................................................... 98
PWM Special Event Trigger ............................................. 103
Postscaler ................................................................ 103
PWM Time Base ................................................................ 97
Continuous Up/Down Counting Modes ...................... 97
Double Update Mode ................................................. 98
Free-Running Mode ................................................... 97
Postscaler .................................................................. 98
Prescaler .................................................................... 98
Single-Shot Mode ...................................................... 97
PWM Update Lockout ...................................................... 103
Q
QEI
16-bit Up/Down Position Counter Mode ..................... 90
Count Direction Status ....................................... 90
Error Checking ................................................... 90
Quadrature Encoder Interface (QEI) Module ..................... 89
Interrupts .................................................................... 92
Logic .......................................................................... 90
Operation During CPU Idle Mode .............................. 91
Operation During CPU Sleep Mode ........................... 91
Register Map .............................................................. 93
Timer Operation During CPU Idle Mode .................... 92
Timer Operation During CPU Sleep Mode ................. 91
R
Reader Response ............................................................ 229
Reset ........................................................................ 149, 155
Reset Sequence ................................................................. 43
Reset Sources ........................................................... 43
Resets
Brown-out Rest (BOR), Programmable ................... 157
POR with Long Crystal Start-up Time ...................... 157
POR, Operating without FSCM and PWRT ............. 157
Power-on Reset (POR) ............................................ 156
Revision History ............................................................... 221
RTSP Control Registers ..................................................... 50
NVMADR ................................................................... 50
NVMADRU ................................................................. 50
NVMCON ................................................................... 50
NVMKEY .................................................................... 50
S
Simple Capture Event Mode
Capture Buffer Operation ........................................... 82
Capture Prescaler ...................................................... 81
Hall Sensor Mode ...................................................... 82
Timer2 and Timer3 Selection Mode ........................... 82
Simple Output Compare Match Mode ................................ 86
Simple PWM Mode ............................................................ 86
Input Pin Fault Protection ........................................... 86
Period ......................................................................... 87
Single-Pulse PWM Operation .......................................... 101
Software Controlled Clock Stretching (STREN = 1) ......... 112
Software Simulator (MPLAB SIM) .................................... 174
Software Stack Pointer, Frame Pointer .............................. 16
CALL Stack Frame ..................................................... 31
SPI Module ....................................................................... 105
Framed SPI Support ................................................ 107
Operating Function Description ............................... 105
DS70150D-page 226
Operation During CPU Idle Mode ............................ 107
Operation During CPU Sleep Mode ......................... 107
SDOx Disable .......................................................... 105
Slave Select Synchronization .................................. 107
SPI1 Register Map ................................................... 108
SPI2 Register Map ................................................... 108
Word and Byte Communication ............................... 105
STATUS Register .............................................................. 16
Symbols Used in Opcode Descriptions ........................... 166
System Integration ........................................................... 149
Register Map for dsPIC30F6010A ........................... 163
Register Map for dsPIC30F6015 ............................. 163
T
Timer1 Module ................................................................... 65
Gate Operation .......................................................... 66
Interrupt ..................................................................... 67
Operation During Sleep Mode ................................... 66
Prescaler ................................................................... 66
Real-Time Clock ........................................................ 67
Interrupts ........................................................... 67
Oscillator Operation ........................................... 67
Register Map ............................................................. 68
16-bit Asynchronous Counter Mode .......................... 65
16-bit Synchronous Counter Mode ............................ 65
16-bit Timer Mode ...................................................... 65
Timer2 and Timer3 Selection Mode ................................... 86
Timer2/3 Module ................................................................ 69
ADC Event Trigger ..................................................... 74
Gate Operation .......................................................... 74
Interrupt ..................................................................... 74
Operation During Sleep Mode ................................... 74
Register Map ............................................................. 75
Timer Prescaler ......................................................... 74
32-bit Synchronous Counter Mode ............................ 69
32-bit Timer Mode ...................................................... 69
Timer4/5 Module ................................................................ 77
Register Map ............................................................. 79
Timing Diagrams
Band Gap Start-up Time .......................................... 193
CAN Bit .................................................................... 130
CAN I/O ................................................................... 211
Center-Aligned PWM ................................................. 99
Dead-Time ............................................................... 101
Edge-Aligned PWM ................................................... 98
External Clock .......................................................... 186
Input Capture (CAPx) .............................................. 197
I2C Bus Data (Master Mode) ................................... 207
I2C Bus Data (Slave Mode) ..................................... 209
I2C Bus Start/Stop Bits (Master Mode) .................... 207
I2C Bus Start/Stop Bits (Slave Mode) ...................... 209
Motor Control PWM ................................................. 199
Motor Control PWM Fault ........................................ 199
OC/PWM .................................................................. 198
Output Compare (OCx) ............................................ 197
PWM Output .............................................................. 87
QEA/QEB Input ....................................................... 200
QEI Module Index Pulse .......................................... 201
Reset, Watchdog Timer, Oscillator Start-up
Timer and Power-up Timer ...................................... 192
SPI Master Mode (CKE = 0) .................................... 202
SPI Master Mode (CKE = 1) .................................... 203
SPI Slave Mode (CKE = 0) ...................................... 204
SPI Slave Mode (CKE = 1) ...................................... 205
Time-out Sequence on Power-up
(MCLR Not Tied to VDD), Case 1 ............................. 156
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
Time-out Sequence on Power-up (MCLR
Not Tied to VDD), Case 2 ......................................... 157
Time-out Sequence on Power-up (MCLR
Tied to VDD) ............................................................. 156
TimerQ (QEI Module) External Clock ...................... 196
Timer1, 2, 3, 4, 5 External Clock .............................. 194
10-bit High-Speed A/D Conversion (CHPS = 01,
SIMSAM = 0, ASAM = 0, SSRC = 000) ................... 214
10-bit High-Speed A/D Conversion (CHPS = 01,
SIMSAM = 0, ASAM = 1, SSRC = 111,
SAMC = 00001) ....................................................... 215
Timing Requirements
Input Capture ........................................................... 197
Timing Specifications
Band Gap Start-up Time Requirements ................... 193
CAN I/O Requirements ............................................ 211
CLKOUT and I/O Characteristics ............................. 191
CLKOUT and I/O Requirements .............................. 191
External Clock Requirements .................................. 187
Internal Clock Examples .......................................... 189
I2C Bus Data Requirements (Master Mode) ............ 208
I2C Bus Data Requirements (Slave Mode) .............. 210
Motor Control PWM Requirements .......................... 199
Output Compare Requirements ............................... 197
PLL Clock ................................................................. 188
PLL Jitter .................................................................. 188
QEI External Clock Requirements ........................... 196
QEI Index Pulse Requirements ................................ 201
Quadrature Decoder Requirements ......................... 200
Reset, Watchdog Timer, Oscillator Start-up
Timer, Power-up Timer and Brown-out
Reset Requirements ................................................ 193
Simple OC/PWM Mode Requirements .................... 198
SPI Master Mode (CKE = 0) Requirements ............. 202
SPI Master Mode (CKE = 1) Requirements ............. 203
SPI Slave Mode (CKE = 0) Requirements ............... 204
SPI Slave Mode (CKE = 1) Requirements ............... 205
Timer1 External Clock Requirements ...................... 194
Timer2 and Timer4 External Clock Requirements ... 195
Timer3 and Timer5 External Clock Requirements ... 195
10-bit High-Speed A/D ............................................. 212
10-bit High-Speed A/D Conversion Requirements .. 216
Traps .................................................................................. 43
Hard and Soft ............................................................. 44
Sources ...................................................................... 43
Vectors ....................................................................... 44
Receive Buffer Overrun Error (OERR Bit) ....... 120
Setting Up Data, Parity and Stop Bit Selections ...... 119
Transmitting Data .................................................... 119
In 8-bit Data Mode ........................................... 119
In 9-bit Data Mode ........................................... 119
Interrupt ........................................................... 120
Transmit Break ................................................ 120
Transmit Buffer (UxTXB) ................................. 119
UART1 Register Map .............................................. 123
UART2 Register Map .............................................. 123
Unit ID Locations ............................................................. 149
Universal Asynchronous Receiver
Transmitter Module (UART) ............................................. 117
W
Wake-up from Sleep ........................................................ 149
Wake-up from Sleep and Idle ............................................ 45
Watchdog Timer (WDT) ........................................... 149, 160
Enabling and Disabling ............................................ 160
Operation ................................................................. 160
WWW Address ................................................................ 228
WWW, On-Line Support ...................................................... 7
U
UART
Address Detect Mode .............................................. 121
Auto-Baud Support .................................................. 122
Baud Rate Generator (BRG) .................................... 121
Disabling .................................................................. 119
Enabling and Setup .................................................. 119
Loopback Mode ....................................................... 121
Module Overview ..................................................... 117
Operation During CPU Sleep and Idle Modes ......... 122
Receiving Data ......................................................... 120
In 8-bit or 9-bit Data Mode ............................... 120
Interrupt ........................................................... 120
Receive Buffer (UxRXB) .................................. 120
Reception Error Handling ......................................... 120
Framing Error (FERR) ..................................... 121
Idle Status ........................................................ 121
Parity Error (PERR) ......................................... 121
Receive Break ................................................. 121
© 2008 Microchip Technology Inc.
DS70150D-page 227
dsPIC30F6010A/6015
NOTES:
DS70150D-page 228
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
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To register, access the Microchip web site at
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© 2008 Microchip Technology Inc.
DS70150D-page 229
dsPIC30F6010A/6015
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
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Device: dsPIC30F6010A/6015
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Literature Number: DS70150D
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS70150D-page 230
© 2008 Microchip Technology Inc.
dsPIC30F6010A/6015
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
d s P I C 3 0 F 6 0 1 0 AT- 3 0 I / P F - 0 0 0
Custom ID (3 digits) or
Engineering Sample (ES)
Trademark
Architecture
PF
PT
PT
S
W
Flash
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
=
=
=
=
=
Package
TQFP 14x14
TQFP 12x12
TQFP 10x10
Die (Waffle Pack)
Die (Wafers)
Temperature
I = Industrial -40°C to +85°C
E = Extended High Temp -40°C to +125°C
Device ID
Speed
20 = 20 MIPS
30 = 30 MIPS
T = Tape and Reel
A,B,C… = Revision Level
Example:
dsPIC30F6010AT-30I/PF = 30 MIPS, Industrial temp., TQFP package, Rev. A
© 2008 Microchip Technology Inc.
DS70150D-page 231
Worldwide Sales and Service
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01/02/08
DS70150D-page 232
© 2008 Microchip Technology Inc.
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