AP95T07GS-HF Halogen-Free Product Advanced Power Electronics Corp. N-CHANNEL ENHANCEMENT MODE POWER MOSFET ▼ Simple Drive Requirement D ▼ Lower On-resistance ▼ Fast Switching Characteristic G ▼ RoHS Compliant & Halogen-Free BVDSS 75V RDS(ON) 5mΩ ID 80A S Description Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. GD S TO-263(S) The TO-263 package is widely preferred for commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. Absolute Maximum Ratings Symbol Parameter VDS Drain-Source Voltage VGS Gate-Source Voltage 3 Rating Units 75 V +20 V ID@TC=25℃ Continuous Drain Current, VGS @ 10V 80 A ID@TC=100℃ Continuous Drain Current, VGS @ 10V 70 A 320 A 300 W 2 W/℃ 450 mJ 1 IDM Pulsed Drain Current PD@TC=25℃ Total Power Dissipation Linear Derating Factor 4 EAS Single Pulse Avalanche Energy TSTG Storage Temperature Range -55 to 175 ℃ TJ Operating Junction Temperature Range -55 to 175 ℃ Thermal Data Symbol Parameter Rthj-c Maximum Thermal Resistance, Junction-case Rthj-a Maximum Thermal Resistance, Junction-ambient (PCB mount)5 Data and specifications subject to change without notice Value Units 0.5 ℃/W 40 ℃/W 1 201105092 AP95T07GS-HF Electrical Characteristics@Tj=25oC(unless otherwise specified) Symbol BVDSS Parameter Test Conditions Drain-Source Breakdown Voltage 2 Min. Typ. Max. Units VGS=0V, ID=1mA 75 - - V VGS=10V, ID=60A - - 5 mΩ RDS(ON) Static Drain-Source On-Resistance VGS(th) Gate Threshold Voltage VDS=VGS, ID=250uA 2 - 4 V gfs Forward Transconductance VDS=10V, ID=60A - 88 - S IDSS Drain-Source Leakage Current VDS=75V, VGS=0V - - 10 uA Drain-Source Leakage Current (T j=125 C) VDS=60V ,VGS=0V - - 250 uA Gate-Source Leakage VGS= +20V, VDS=0V - - +100 nA ID=80A - 85 135 nC o IGSS 2 Qg Total Gate Charge Qgs Gate-Source Charge VDS=40V - 25 - nC Qgd Gate-Drain ("Miller") Charge VGS=10V - 36 - nC VDS=40V - 22 - ns 2 td(on) Turn-on Delay Time tr Rise Time ID=80A - 160 - ns td(off) Turn-off Delay Time RG=3.3Ω,VGS=10V - 38 - ns tf Fall Time RD=0.5Ω - 165 - ns Ciss Input Capacitance VGS=0V - 4290 6870 pF Coss Output Capacitance VDS=25V - 985 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 390 - pF Rg Gate Resistance f=1.0MHz - 1.2 1.8 Ω Min. Typ. IS=60A, VGS=0V - - 1.3 V IS=40A, VGS=0V - 75 - ns dI/dt=100A/µs - 190 - nC Source-Drain Diode Symbol VSD Parameter 2 Forward On Voltage 2 trr Reverse Recovery Time Qrr Reverse Recovery Charge Test Conditions Max. Units Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse test 3.Package limitation current is 80A, calculated continuous current based on maximum allowable junction temperature is 169A. 4.Starting Tj=25oC , L=1mH , IAS=30A. 5.Surface mounted on 1 in2 copper pad of FR4 board THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. 2 AP95T07GS-HF 250 120 10 V 9.0 V 8.0 V 7.0 V ID , Drain Current (A) 200 10V 9.0V 8.0V 7.0V V G = 6.0 V T C = 1 75 o C 100 ID , Drain Current (A) o T C = 25 C 150 100 V G = 6.0 V 80 60 40 50 20 0 0 0 1 2 3 0 4 Fig 1. Typical Output Characteristics 2 3 Fig 2. Typical Output Characteristics 12 2.4 I D =60A V G =10V I D =30A o T C =25 C Normalized RDS(ON) 2.0 10 RDS(ON) (mΩ) 1 V DS , Drain-to-Source Voltage (V) V DS , Drain-to-Source Voltage (V) 8 1.6 1.2 6 0.8 4 0.4 4 5 6 7 8 9 10 -50 0 50 100 150 200 T j , Junction Temperature ( o C) V GS Gate-to-Source Voltage (V) Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature 60 1.4 50 IS(A) o T j =175 C 40 Normalized VGS(th) (V) 1.2 o T j =25 C 30 20 1 0.8 0.6 10 0.4 0 0 0.2 0.4 0.6 0.8 1 1.2 V SD , Source-to-Drain Voltage (V) Fig 5. Forward Characteristic of Reverse Diode 1.4 -50 0 50 100 150 200 T j ,Junction Temperature ( o C) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3 AP95T07GS-HF f=1.0MHz 12 6000 5000 V DS = 40 V V DS = 48 V V DS = 64 V 8 C iss 4000 C (pF) VGS , Gate to Source Voltage (V) I D = 80 A 10 6 3000 4 2000 2 1000 0 C oss C rss 0 0 20 40 60 80 100 120 1 5 9 Q G , Total Gate Charge (nC) 13 17 21 25 29 V DS ,Drain-to-Source Voltage (V) Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics 1000 Normalized Thermal Response (Rthjc) 1 100us ID (A) 100 1ms 10ms 10 100ms DC o T c =25 C Single Pulse Duty factor=0.5 0.2 0.1 0.1 0.05 PDM t 0.02 T 0.01 Duty factor = t/T Peak Tj = PDM x Rthjc + T C Single Pulse 0.01 1 0.1 1 10 100 1000 0.00001 0.0001 V DS , Drain-to-Source Voltage (V) Fig 9. Maximum Safe Operating Area 0.001 0.01 0.1 1 t , Pulse Width (s) Fig 10. Effective Transient Thermal Impedance VG VDS 90% QG 10V QGS QGD 10% VGS td(on) tr td(off) tf Fig 11. Switching Time Waveform Charge Q Fig 12. Gate Charge Waveform 4