Everlight EHP-A07/SUR01-P01 High power led - 1w Datasheet

EVERLIGHT ELECTRONICS CO.,LTD.
Technical Data Sheet
High Power LED – 1W
EHP-A07/SUR01-P01
Features
feature of the device: small package with high efficiency
View angle: 120°.
high luminous flux output: more than [email protected]
ESD protection.
soldering methods: SMT.
grouping parameter: total luminous flux, dominant
wavelength.
z optical efficiency: 37 lm/W.
z Thermal resistance (junction to lead): 17 K/W.
z RoHS: The product itself will remain within RoHS
compliant version
z
z
z
z
z
z
Applications
z
z
z
z
TFT LCD display backlight
Decorative and entertainment illumination
Signal and symbol luminaries for orientation signals (e.g.
steps, exit ways, etc.)
Exterior and interior automotive illumination
Materials
Items
Description
Housing
Heat resistant polymer
Encapsulating Resin
Clear silicone resin
Electrodes
Ag plating copper alloy
Die attach
Silver paste
Chip
AlGaInP
Everlight Electronics Co., Ltd.
http://www.everlight.com
Rev. 2.0
Page: 1 of 10
Device No. : DSE-7N1-002
Prepared date: Sep 10, 2006
Prepared by: Peggy Chen
EVERLIGHT ELECTRONICS CO.,LTD.
EHP-A07/SUR01-P01
Dimensions
Cathode mark
Notes: 1. Dimensions are in millimeters
2. Tolerances unless dimensions ±0.25mm
Everlight Electronics Co., Ltd.
http://www.everlight.com
Rev. 2.0
Page: 2 of 10
Device No. : DSE-7N1-002
Prepared date: Sep 10, 2006
Prepared by: Peggy Chen
EVERLIGHT ELECTRONICS CO.,LTD.
EHP-A07/SUR01-P01
Maximum Ratings (T Ambient=25ºC)
Parameter
Symbol
Rating
Unit
Operating Temperature
Topr
-40 ~ +100
ºC
Storage Temperature
Tstg
-40 ~ +100
ºC
Junction temperature
Tj
125
ºC
Forward Current
IF
500
mA
Power Dissipation
Pd
1.5
W
Junction to heat-sink thermal resistance
Rth
17
K/W
Electro-Optical Characteristics (T Ambient=25ºC)
Parameter
Bin
Symbol
Min
Typ.
Max
23
----
27
27
----
33
33
----
39
----
120
----
2.05
----
2.35
2.35
----
2.65
U4
2.65
----
2.95
R3
610
----
615
R4
615
----
620
620
----
625
R6
625
----
630
R7
630
----
635
J1
Luminous Flux(1)
J2
Фv
J3
Viewing Angle(2)
----
2θ1/2
U2
Forward Voltage(3)
Wavelength(4)
U3
R5
VF
λd
Unit
Condition
lm
deg
V
IF=350mA
nm
Note. 1. Luminous flux measurement tolerance : ±10%
2. 2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value.
3. Forward Voltage measurement tolerance : ±0.1V
4. Wavelength measurement tolerance : ±1nm
Everlight Electronics Co., Ltd.
http://www.everlight.com
Rev. 2.0
Page: 3 of 10
Device No. : DSE-7N1-002
Prepared date: Sep 10, 2006
Prepared by: Peggy Chen
EVERLIGHT ELECTRONICS CO.,LTD.
EHP-A07/SUR01-P01
Typical Electro-Optical Characteristics Curves
Relative Spectral Distribution,
IF=350mA, T Ambient=25ºC
Forward Voltage vs Forward Current,
T Ambient=25ºC
2.4
2.3
Forward Voltage (Volt)
Relative Luminous Intensity (%)
1.0
0.8
0.6
0.4
0.2
2.2
2.1
2.0
1.9
0.0
500
600
700
800
1.8
0
100
Wavelength (nm)
400
500
400
1.4
Forward Current (mA)
1.2
Relative Luminous Intensity
300
Forward Current Derating Curve,
Derating based on TJMAX=125°C
Relative Luminous Intensity vs Forward
Current, T Ambient=25ºC
1.0
0.8
0.6
0.4
350
300
250
200
150
0.2
0.0
200
Forward Current (mA)
100
0
50
100
150
200
250
300
350
400
450
500
550
Forward Current (mA)
0
20
40
60
80
Ambient Temperature (οC)
Everlight Electronics Co., Ltd.
http://www.everlight.com
Rev. 2.0
Page: 4 of 10
Device No. : DSE-7N1-002
Prepared date: Sep 10, 2006
Prepared by: Peggy Chen
100
EVERLIGHT ELECTRONICS CO.,LTD.
EHP-A07/SUR01-P01
Typical Representative Spatial Radiation Pattern
0
10
1.0
30
0.9
Relative Intensity
20
40
0.8
50
0.7
0.6
60
0.5
0.4
70
0.3
0.2
80
0.1
90
0.0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0
Angle (Degree)
Everlight Electronics Co., Ltd.
http://www.everlight.com
Rev. 2.0
Page: 5 of 10
Device No. : DSE-7N1-002
Prepared date: Sep 10, 2006
Prepared by: Peggy Chen
EVERLIGHT ELECTRONICS CO.,LTD.
EHP-A07/SUR01-P01
Label explanation
CPN: Customer’s Production Number
P/N : Production Number
QTY: Packing Quantity
CAT: Ranks
HUE: Peak Wavelength
REF: Reference
LOT No: Lot Number
MADE IN TAIWAN: Production Place
Reel Dimensions
Note: 1. Dimensions are in millimeters
2. The tolerances unless mentioned is ±0.1mm
Everlight Electronics Co., Ltd.
http://www.everlight.com
Rev. 2.0
Page: 6 of 10
Device No. : DSE-7N1-002
Prepared date: Sep 10, 2006
Prepared by: Peggy Chen
EVERLIGHT ELECTRONICS CO.,LTD.
EHP-A07/SUR01-P01
Carrier Tape Dimensions: Loaded quantity 800 PCS per reel.
Note: 1. Dimensions are in millimeters
2. The tolerances unless mentioned is ±0.1mm
Moisture Resistant Packaging
Label
Aluminum moistue-proof bag
Desiccant
Label
Everlight Electronics Co., Ltd.
http://www.everlight.com
Rev. 2.0
Page: 7 of 10
Device No. : DSE-7N1-002
Prepared date: Sep 10, 2006
Prepared by: Peggy Chen
EVERLIGHT ELECTRONICS CO.,LTD.
EHP-A07/SUR01-P01
Reliability Test Items and Results
Stress Test
Stress Condition
Stress Duration
Solderability
Tsol=230℃, 5sec
1 times
Reflow
Tsol=260℃, 10sec, 6min
3 times
H:+110℃ 20min.
'∫ 10sec.
'L:-
40℃
20min.
500 Cycles
Temperature Cycle
H:+100℃ 30min.
'∫ 5min.
'L:- 40℃ 30min.
1000 Cycles
High Temperature/Humidity
Reverse Bias
Ta=85℃ , RH=85%
1000hours
High Temperature Storage
Ta=110℃
1000hours
Low Temperature Storage
Ta=-40℃
1000hours
Intermittent operational Life
Ta=25℃, IF=1000mA
30mS on/ 2500mS off
1000hours
High Temperature Operation
Life #1
Ta=55℃, IF=350mA
1000hours
High Temperature Operation
Life #2
Ta=85℃, IF=225mA
1000hours
High Temperature Operation
Life #3
Ta=100℃, IF=150mA
1000hours
Low Temperature Operation
Life
Ta=-40℃, IF=350mA
1000hours
Power Temperature Cycle
H:+85℃ 15min.
'∫ 5min.
'L:- 40℃ 15min.
IF=225mA,2min on/off
1000cycles
ESD Human Body Model
2000V, Interval:0.5sec
3 times
ESD Machine Model
200V, Interval:0.5sec
3 times
Thermal
Shock
*lm: BRIGHTNESS ATTENUATE DIFFERENCE(1000hrs)<50%
*VF: FORWARD VOLTAGE
DIFFERENCE<20%
Everlight Electronics Co., Ltd.
http://www.everlight.com
Rev. 2.0
Page: 8 of 10
Device No. : DSE-7N1-002
Prepared date: Sep 10, 2006
Prepared by: Peggy Chen
EVERLIGHT ELECTRONICS CO.,LTD.
EHP-A07/SUR01-P01
Precautions For Use
1. Over-current-proof
Though EHP-A07 has conducted ESD protection mechanism, customer must not use the device in
reverse and should apply resistors for extra protection. Otherwise slight voltage shift may cause
enormous current change and burn out failure would happen.
2. Storage
i.
Do not open moisture proof bag before the products are ready to use.
ii.
Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less.
iii.
The LEDs should be used within a year.
iv.
After opening the package, the LEDs should be kept at 30℃ or less and 70%RH or less.
v.
The LEDs should be used within 168 hours (7 days) after opening the package.
vi.
If the moisture absorbent material (silicone gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
vii.
Pre-curing treatment : 60±5℃ for 24 hours.
3. Thermal Management
i.
Because EHP-A07 LED is a high power dissipation device, special and sufficient consideration in
thermal management design must be made to optimize the thermal performance.
ii.
Heat sink design is implemented in the device for an additional thermal connection. Since the device
is capable of SMT process, tin must be spread both heat sink and solder pads areas to dissipate the
heat.
iii.
A high thermal conductivity substrate, such as Aluminum or Copper plate etc, must be applied for
external thermal management. It is strongly recommended that the outer heat sink or PCB
dimension per LED can not be less than 25 x 25 x 1 (L x W x H) mm. The materials for outer heat
sink can be FR4 on Aluminum, MCPCB, or FPC on Aluminum.
iv.
Sspecial thermal designs are also recommended to take in outer heat sink design, such as FR4 PCB
on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc.
v.
Sufficient thermal management must be conducted, or the die junction temperature will be over the
limit under large electronic driving and LED lifetime will decrease critically.
Everlight Electronics Co., Ltd.
http://www.everlight.com
Rev. 2.0
Page: 9 of 10
Device No. : DSE-7N1-002
Prepared date: Sep 10, 2006
Prepared by: Peggy Chen
EVERLIGHT ELECTRONICS CO.,LTD.
EHP-A07/SUR01-P01
4. Soldering Condition
i.
Lead reflow soldering temperature profile
ii.
Reflow soldering should not be done more than two times.
iii.
While soldering, do not put stress on the LEDs during heating.
iv.
After soldering, do not warp the circuit board
5. Soldering Iron
i.
For prototype builds or small series production runs it is possible to place and solder the LED by
hand.
Dispensing thermal conductive glue or grease on the substrates and follow its curing spec. Press
ii.
LED housing to closely connect LED and substrate.
It is recommended to hand solder the leads with a solder tip temperature of 280°C for less than 3
iii.
seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more
intervals, and do soldering of each terminal.
iv.
Be careful because the damage of the product is often started at the time of the hand solder.
6. Handling Indications
During processing, mechanical stress on the surface should be minimized as much as possible. Sharp
objects of all types should not be used to pierce the sealing compound.
Everlight Electronics Co., Ltd.
http://www.everlight.com
Rev. 2.0
Page: 10 of 10
Device No. : DSE-7N1-002
Prepared date: Sep 10, 2006
Prepared by: Peggy Chen
Similar pages