Ceramic Resonators (Chip Type) Ceramic Resonators, Chip Type (Built-In Capacitors Type) Type: Type: Type: S ( 2 to 13 MHz) B (13.1 to 20 MHz) J (30.1 to 50 MHz) n Recommended Applications n Features l Clock generator for microprocessers l Carrier between telecommunication equipment (Telephone to telephone, personal computer to printer) l Encased in ceramic package l High reliability against soldering heat and mechanical stress l Moisture-proof sealing l Low Profile Type (1.8 mm maximum in thickness) l Designed for reflow soldering l Flat-bottom plate for better mountings l Contributes simplification of oscillation circuits and reduces the numbers of circuit parts n Precautions for Safety (See Page 218 to 219) n Explanation of Part Numbers E F O 3 5 8 4 n Ratings and Characteristics Part Number Oscillation Frequency (fo) Loop Gain (G) Bulk Pack Embossed Taping EFOS3584B5 EFOS3584E5 3.58 MHz ±0.5 % EFOS4004B5 EFOS4004E5 4.00 MHz ±0.5 % EFOS8004B5 EFOS8004E5 8.00 MHz ±0.5 % EFOS1005B5 EFOS1005E5 10.00 MHz ±0.5 % EFOS1205B5 EFOS1205E5 12.00 MHz ±0.5 % EFOB1605B5 EFOB1605E5 16.00 MHz ±0.5 % EFOB1695B5 EFOB1695E5 16.93 MHz ±0.5 % EFOB2005B5 EFOB2005E5 20.00 MHz ±0.5 % EFOJ3205B5 EFOJ3205E5 32.00 MHz ±0.5 % EFOJ3385B5 EFOJ3385E5 33.868 MHz ±0.5 % EFOJ4005B5 EFOJ4005E5 40.00 MHz ±0.5 % l Operating Temperature Range: Ð20 to 80 ûC 10 dB min. 15 dB min. 15 dB min. 6 dB min. Temperature Characteristics Maximum frequency drift: ±0.2 %, Ð20 to 80 ¡C Maximum frequency drift: ±1.0 %, Ð20 to 80 ¡C Maximum frequency drift: ±0.5 %, Ð20 to 80 ¡C Maximum frequency drift: ±0.2 %, Ð20 to 80 ¡C Built-in Capacitors (Reference) 33 pF 33 pF 33 pF 10 pF Note: Also available are types other than above standard products in the frequency range of 3 to 50 MHz. Please contact us for more information. Ceramic Resonators (Chip Type) n Dimensions in mm (not to scale) l Bulk [Type S] EFOS1111B1 ± l Embossed Taping EFOS1111E1 ± Dim. A B W (mm) 3.7 8.3 16.0±0.3 Dim. (mm) [Type B] EFOB1111B1 P2 P0 2.0±0.1 4.0±0.1 F fD0 1.5 +0.1 0 E P1 7.5±0.1 1.75±0.10 8.0±0.1 t1 t2 0.6 max. 3.0 max. fC fD 1.55 1.0 EFOB1111E1 Dim. A B W (mm) 3.7 6.0 12.0±0.3 Dim. (mm) [Type J] EFOJ1111B1 P2 P0 2.0±0.1 4.0±0.1 F fD0 1.5 +0.1 0 E P1 5.5±0.1 1.75±0.10 8.0±0.1 t1 t2 0.6 max. 3.0 max. EFOJ1111E1 ,, ,, ,, + + Dim. A B W (mm) 4.1 4.9 12.0±0.3 Dim. (mm) P2 P0 2.0±0.1 4.0±0.1 fD0 1.5 +0.1 0 F E P1 5.5±0.1 1.75±0.10 8.0±0.1 t1 t2 0.6 max. 3.0 max. Ceramic Resonators (Chip Type) n Test Circuits Diagram Ω Ω Ω Frequency IC 2.00 to 8.38 MHz 8.4 to 50 MHz n Typical Characteristics µPD 4069UBC µPD 74HCU04 n Recommended Land Dimensions (Type S,B,J) Temperature Characteristics a b c d Type S 2.5 0.9 to 1.2 3.8 to 4.7 Ñ Type B 1.9 1.2 4.2 Ñ Type J 1.7 0.8 to 1.0 4.2 to 5.1 1.0 to 1.2 (mm) n Packaging Specifications Supplied in bulk or taped & reel packing style l Standard Packing Quantity Type Embossed Taping Bulk S 2500 pcs./reel 500 pcs./bag B,J 1000 pcs./reel 500 pcs./bag l Dimensions for Reel in mm (not to scale) [Type S] Dim. fA (mm) 330±5 Dim. W (mm) 16.4+2.0 0 fB C D E 80 min. 13.0±0.5 21.0±0.8 2.0±0.5 T t 22.4 max. 3 max. r 1.0 [Type B,J] Dim. fA (mm) 180±5 Dim. (mm) W fB C D E 60 min. 13.0±0.5 21.0±0.8 2.0±0.5 T t 12.4+2.0 0 18.4 max. 3 max. r 1.0