CDCV857B, CDCV857BI
2.5-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS689A − FEBRUARY 2003 − REVISED NOVEMBER 2010
D Phase-Lock Loop Clock Driver for Double
D
D
D
D
D
D
D Enters Low-Power Mode When No CLK
Data-Rate Synchronous DRAM
Applications
Spread Spectrum Clock Compatible
Operating Frequency: 60 MHz to 200 MHz
Low Jitter (cycle-cycle): ±50 ps
Low Static Phase Offset: ±50 ps
Low Jitter (Period): ±35 ps
Distributes One Differential Clock Input to
10 Differential Outputs
D
D
D
D
D
Input Signal Is Applied or PWRDWN Is Low
Operates From Dual 2.5-V Supplies
Available in a 48-Pin TSSOP Package or
56-Ball MicroStar Junior™ BGA Package
Consumes < 100-μA Quiescent Current
External Feedback Pins (FBIN, FBIN) Are
Used to Synchronize the Outputs to the
Input Clocks
Meets/Exceeds the Latest DDR JEDEC
Spec JESD82−1
Description
The CDCV857B is a high-performance, low-skew, low-jitter zero delay buffer that distributes a differential clock
input pair (CLK, CLK) to 10 differential pairs of clock outputs (Y[0:9], Y[0:9]) and one differential pair of feedback
clock outputs (FBOUT, FBOUT). The clock outputs are controlled by the clock inputs (CLK, CLK), the feedback
clocks (FBIN, FBIN), and the analog power input (AVDD). When PWRDWN is high, theoutputs switch in phase
and frequency with CLK. When PWRDWN is low, all outputs are disabled to a high-impedance state (3-state)
and the PLL is shut down (low-power mode). The device also enters this low-power mode when the input
frequency falls below a suggested detection frequency that is below 20 MHz (typical 10 MHz). An input
frequency detection circuit detects the low frequency condition and, after applying a >20-MHz input signal, this
detection circuit turns the PLL on and enables the outputs.
When AVDD is strapped low, the PLL is turned off and bypassed for test purposes. The CDCV857B is also able
to track spread spectrum clocking for reduced EMI.
Since the CDCV857B is based on PLL circuitry, it requires a stabilization time to achieve phase-lock of the PLL.
This stabilization time is required following power up. The CDCV857B is characterized for both commercial and
industrial temperature ranges.
AVAILABLE OPTIONS
TA
TSSOP (DGG)
MicroStar Junior™ BGA (GQL)
0°C to 85°C
CDCV857BDGG
CDCV857BGQL
−40°C to 85°C
CDCV857BIDGG
—
FUNCTION TABLE
(Select Functions)
INPUTS
OUTPUTS
PLL
AVDD
PWRDWN
CLK
CLK
Y[0:9]
Y[0:9]
FBOUT
FBOUT
GND
H
L
H
L
H
L
H
Bypassed/Off
GND
H
H
L
H
L
H
L
Bypassed/Off
X
L
L
H
Z
Z
Z
Z
Off
X
L
H
L
Z
Z
Z
Z
Off
2.5 V (nom)
H
L
H
L
H
L
H
On
2.5 V (nom)
H
H
L
H
L
H
L
On
2.5 V (nom)
X
<20 MHz
<20 MHz
Z
Z
Z
Z
Off
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MicroStar Junior is a trademark of Texas Instruments Incorporated.
Copyright © 2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
CDCV857B, CDCV857BI
2.5-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS689A − FEBRUARY 2003 − REVISED NOVEMBER 2010
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
2
POST OFFICE BOX 655303
Y5
GND
V DDQ
V DDQ
GND
Y5
5
6
A
B
Y6
Y6
C
NC
D
NC
NC
GND
GND
NC
Y7
Y7
NC
E
F
NC
NC
G
NC
NC
H
NC
NC
PWRDN
VDDQ
FBIN
FBIN
VDDQ
FBOUT
FBOUT
GND
J
Y8
Y8
K
• DALLAS, TEXAS 75265
Y9
45
4
Y9
4
3
GND
46
2
V DDQ
47
3
1
GND
2
GND
Y5
Y5
VDDQ
Y1
Y6
Y1
Y6
GND
GND
GND
GND
Y7
Y7
Y2
Y2
VDDQ
PWRDWN
VDDQ
FBIN
VDDQ
FBIN
CLK
VDDQ
CLK
FBOUT
FBOUT
VDDQ
GND
AVDD
Y8
AGND
Y8
GND
VDDQ
Y9
Y3
Y3
Y9
GND
V DDQ
48
Y4
1
Y4
GND
Y0
Y0
VDDQ
Y1
Y1
GND
GND
Y2
Y2
VDDQ
VDDQ
CLK
CLK
VDDQ
AVDD
AGND
GND
Y3
Y3
VDDQ
Y4
Y4
GND
Y0
DGG PACKAGE
(TOP VIEW)
Y0
MicroStar™ Junior (GQL) Package
(TOP VIEW)
CDCV857B, CDCV857BI
2.5-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS689A − FEBRUARY 2003 − REVISED NOVEMBER 2010
functional block diagram
3
2
PWRDWN
AVDD
5
37
16
6
Power Down
and Test
Logic
10
9
20
19
22
23
46
47
CLK
CLK
FBIN
FBIN
13
44
14
36
43
PLL
39
35
40
29
30
27
26
32
33
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
Y0
Y0
Y1
Y1
Y2
Y2
Y3
Y3
Y4
Y4
Y5
Y5
Y6
Y6
Y7
Y7
Y8
Y8
Y9
Y9
FBOUT
FBOUT
3
CDCV857B, CDCV857BI
2.5-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS689A − FEBRUARY 2003 − REVISED NOVEMBER 2010
Terminal Functions
TERMINAL
NAME
AGND
AVDD
DGG
GQL
17
H1
16
G2
CLK, CLK
13, 14
F1, F2
FBIN, FBIN
35, 36
FBOUT, FBOUT
32, 33
1, 7, 8, 18,
24, 25, 31,
41, 42, 48
A3, A4,
C1, C2,
C5, C6,
H2, H5,
K3, K4
GND
PWRDWN
DESCRIPTION
Ground for 2.5-V analog supply
2.5-V Analog supply
I
Differential clock input
F5, F6
I
Feedback differential clock input
H6, G5
O
Feedback differential clock output
Ground
37
E6
VDDQ
4, 11, 12,
15, 21, 28,
34, 38, 45
B3, B4,
E1, E2,
E5, G1,
G6, J3, J4
I
Output enable for Y and Y
Y[0:9]
3, 5, 10,
20, 22, 27,
29, 39, 44,
46
A1, B2,
D1, J2,
K1, A6,
B5, D6,
J5, K6
O
Buffered output copies of input clock, CLK
Y[0:9]
2, 6, 9, 19,
23, 26, 30,
40, 43, 47
A2, B1,
D2, J1,
K2, A5,
B6, D5,
J6, K5
O
Buffered output copies of input clock, CLK
2.5-V Supply
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage range, VDDQ, AVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 3.6 V
Input voltage range, VI (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VDDQ + 0.5 V
Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VDDQ + 0.5 V
Input clamp current, IIK (VI < 0 or VI > VDDQ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Output clamp current, IOK (VO < 0 or VO > VDDQ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous output current, IO (VO = 0 to VDDQ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current to GND or VDDQ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA
Package thermal impedance, θJA (see Note 3): GQL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137.6°C/W
Storage temperature range Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.
2. This value is limited to 3.6 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
CDCV857B, CDCV857BI
2.5-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS689A − FEBRUARY 2003 − REVISED NOVEMBER 2010
recommended operating conditions (see Note 4)
MIN
Supply voltage
TYP
MAX
VDDQ
2.3
2.7
V
AVDD
VDDQ − 0.12
2.7
V
CLK, CLK, FBIN, FBIN
Low level input voltage,
Low-level
voltage VIL
VDDQ/2 – 0.18
PWRDWN
−0.3
CLK, CLK, FBIN, FBIN
High level input voltage
High-level
voltage, VIH
0.7
VDDQ/2 + 0.18
PWRDWN
DC input signal voltage (see Note 5)
Differential input signal voltage,
voltage VID (see Note 6)
1.7
VDDQ + 0.3
–0.3
VDDQ + 0.3
dc
CLK, FBIN
0.36
VDDQ + 0.6
ac
CLK, FBIN
0.7
VDDQ + 0.6
VDDQ/2 – 0.2
VDDQ/2 + 0.2
Input differential pair cross voltage, VIX (see Note 7)
High-level output current, IOH
−12
Low-level output current, IOL
Input slew rate, SR
Commercial
Operating free-air
free air temperature
temperature, TA
UNIT
Industrial
V
V
V
V
V
mA
12
mA
1
4
V/ns
0
85
−40
85
°C
NOTES: 4. The unused inputs must be held high or low to prevent them from floating.
5. The dc input signal voltage specifies the allowable dc execution of the differential input.
6. The differential input signal voltage specifies the differential voltage |VTR − VCP| required for switching, where VTR is the true input
level and VCP is the complementary input level.
7. The differential cross-point voltage is expected to track variations of VCC and is the voltage at which the differential signals must
be crossing.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
All inputs
MIN
TYP†
VDDQ = 2.3 V, II = –18 mA
MAX
UNIT
–1.2
V
VIK
Input voltage
VOH
High level output voltage
High-level
VOL
Low level output voltage
Low-level
VOD
Output voltage swing}
VOX
Output differential cross-voltagew
Differential outputs are terminated
with 120 Ω /CL = 14 pF (See
Figure 3)
II
Input current
VDDQ = 2.7 V, VI = 0 V to 2.7 V
±10
μA
IOZ
High-impedance state output current
VDDQ = 2.7 V, VO= VDDQ or GND
±10
μA
IDDPD
Power-down current on
VDDQ + AVDD
CLK and CLK = 0 MHz; PWRDWN
= Low; Σ of IDD and AIDD
20
100
μA
AIDD
Supply current on AVDD
fO = 170 MHz
7
10
fO = 200 MHz
9
12
CI
Input capacitance
2.5
3.5
VDDQ = min to max, IOH = –1 mA
VDDQ – 0.1
VDDQ = 2.3 V, IOH = –12 mA
V
1.7
VDDQ = min to max, IOL = 1 mA
0.1
VDDQ = 2.3 V, IOL = 12 mA
0.6
1.1
VDDQ/2 – 0.15
VDDQ = 2.5 V, VI = VDDQ or GND
2
VDDQ – 0.4
VDDQ/2
VDDQ/2 + 0.15
V
V
mA
pF
†
All typical values are at a respective nominal VDDQ.
‡ The differential output signal voltage specifies the differential voltage ⎮VTR − VCP⎮, where VTR is the true output level and VCP is the
complementary output level.
§ The differential cross-point voltage is expected to track variations of V
DDQ and is the voltage at which the differential signals must be crossing.
The frequency range is 100 MHz to 200 MHz.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
CDCV857B, CDCV857BI
2.5-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS689A − FEBRUARY 2003 − REVISED NOVEMBER 2010
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted) (continued)
PARAMETER
Without load
IDD
TYP†
MAX
fO = 170 MHz
100
110
TEST CONDITIONS
Dynamic current on VDDQ
MIN
fO = 200 MHz
105
120
Differential outputs
t
terminated
i t d with
ith
120 Ω/CL = 0 pF
fO = 170 MHz
200
240
fO = 200 MHz
210
250
Differential outputs
t
terminated
i t d with
ith
120 Ω/CL = 14 pF
fO = 170 MHz
260
300
fO = 200 MHz
280
320
UNIT
mA
ΔC
Part-to-part input capacitance
variation
VDDQ = 2.5 V, VI = VDDQ or GND
1
pF
CI(Δ)
Input capacitance difference between
CLK and CLKB, FBIN, and FBINB
VDDQ = 2.5 V, VI = VDDQ or GND
0.25
pF
CO
Output capacitance
VDDQ = 2.5 V, VO = VDDQ or GND
3.5
pF
†
2.5
3
All typical values are at a respective nominal VDDQ.
timing requirements over recommended ranges of supply voltage and operating free-air
temperature
Operating clock frequency
fCLK
Application clock frequency
Input clock duty cycle
MIN
MAX
UNIT
60
200
MHz
40%
60%
Stabilization time{ (PLL mode)
Stabilization
time} (Bypass
mode)
10
μs
30
ns
†
The time required for the integrated PLL circuit to obtain phase lock of its feedback signal to its reference signal. For phase lock to be obtained,
a fixed-frequency, fixed-phase reference signal must be present at CLK and VDD must be applied. Until phase lock is obtained, the specifications
for propagation delay, skew, and jitter parameters given in the switching characteristics table are not applicable. This parameter does not apply
for input modulation under SSC application.
‡ A recovery time is required when the device goes from power-down mode into bypass mode (AVDD at GND).
switching characteristics
PARAMETER
TEST CONDITIONS
MIN
TYP
w
Low to high level propagation delay time
Test mode/CLK to any output
3.5
tPHLw
High-to low level propagation delay time
Test mode/CLK to any output
3.5
tPLH
tjit(per)W
Jitter (period),
(period) See Figure 7
tjit(cc)W
Jitter (cycle-to-cycle),
(cycle to cycle) See Figure 4
tjit(hper)W
Half period jitter,
Half-period
jitter See Figure 8
tslr(o)
Output clock slew rate, See Figure 9
ns
ns
−60
60
ps
ps
100/133/167/200 MHz
−35
35
66 MHz
−75
75
100/133/167/200 MHz
−50
50
−100
100
−75
75
66 MHz
100/133/167/200 MHz
Load: 120 Ω/14 pF
66 MHz
Static phase offset,
offset See Figure 5
tsk(o)
Output skew, See Figure 6
Load: 120 Ω/14 pF
tr, tf
Output rise and fall times (20% − 80%)
Load: 120 Ω/14 pF
100/133/167/200 MHz
§
Refers to the transition of the noninverting output.
¶ This parameter is assured by design but can not be 100% production tested.
POST OFFICE BOX 655303
UNIT
66 MHz
t(Ø)
6
MAX
• DALLAS, TEXAS 75265
1
2
–100
100
–50
50
70
600
ps
ps
V/ns
ps
100
ps
900
ps
CDCV857B, CDCV857BI
2.5-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS689A − FEBRUARY 2003 − REVISED NOVEMBER 2010
PARAMETER MEASUREMENT INFORMATION
VDD
VYx
R = 60 Ω
R = 60 Ω
VDD/2
VYx
CDCV857B
GND
Figure 1. IBIS Model Output Load
VDD/2
CDCV857B
C = 14 pF
R = 10 Ω
Z = 60 Ω
SCOPE
−VDD/2
Z = 50 Ω
R = 50 Ω
V(TT)
Z = 60 Ω
R = 10 Ω
Z = 50 Ω
C = 14 pF
R = 50 Ω
V(TT)
−VDD/2
V(TT) = GND
−VDD/2
Figure 2. Output Load Test Circuit
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
CDCV857B, CDCV857BI
2.5-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS689A − FEBRUARY 2003 − REVISED NOVEMBER 2010
VDD
CDCV857B
C = 14 pF
PROBE
GND
Z = 60 Ω
C = 1 pF
R = 120 Ω
R = 1 MΩ
V(TT)
Z = 60 Ω
C = 1 pF
C = 14 pF
R = 1 MΩ
V(TT)
GND
V(TT) = GND
GND
Figure 3. Output Load Test Circuit for Crossing Point
Yx, FBOUT
Yx, FBOUT
tc(n)
tc(n+1)
tjit(cc) = tc(n) − tc(n+1)
Figure 4. Cycle-to-Cycle Jitter
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
CDCV857B, CDCV857BI
2.5-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS689A − FEBRUARY 2003 − REVISED NOVEMBER 2010
PARAMETER MEASUREMENT INFORMATION
CLK
CLK
FBIN
FBIN
t( ) n
t ( ) n+1
n=N
t( ) =
∑1
t( ) n
N
(N > 1000 Samples)
Figure 5. Phase Offset
Yx
Yx
Yx, FBOUT
Yx, FBOUT
tsk(o)
Figure 6. Output Skew
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
CDCV857B, CDCV857BI
2.5-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS689A − FEBRUARY 2003 − REVISED NOVEMBER 2010
PARAMETER MEASUREMENT INFORMATION
Yx, FBOUT
Yx, FBOUT
tc(n)
Yx, FBOUT
Yx, FBOUT
1
fo
tjit(per) = tcn −
1
fo
fO = Average input frequency measured at CLK/CLK
Figure 7. Period Jitter
Yx, FBOUT
Yx, FBOUT
t(hper_n+1)
t(hper_n)
1
fo
tjit(hper) = t(hper_n) −
1
2xfo
n = any half cycle
fO = Average input frequency measured at CLK/CLK
Figure 8. Half-Period Jitter
VOH, VIH
80%
Clock Inputs
and Outputs
80%
20%
20%
tr
t
slr(IńO)
V
* V 20%
+ 80%
t
r(IńO)
tf
t
slf(IńO)
V
* V 20%
+ 80%
t
f(IńO)
Figure 9. Input and Output Slew Rates
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
VOL, VIL
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
CDCV857BDGG
ACTIVE
TSSOP
DGG
48
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
CDCV857B
CDCV857BDGGG4
ACTIVE
TSSOP
DGG
48
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
CDCV857B
CDCV857BDGGR
ACTIVE
TSSOP
DGG
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
CDCV857B
CDCV857BDGGRG4
ACTIVE
TSSOP
DGG
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
CDCV857B
CDCV857BIDGG
ACTIVE
TSSOP
DGG
48
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
CDCV857B-I
CDCV857BIDGGG4
ACTIVE
TSSOP
DGG
48
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
CDCV857B-I
CDCV857BIDGGR
ACTIVE
TSSOP
DGG
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
CDCV857B-I
CDCV857BIDGGRG4
ACTIVE
TSSOP
DGG
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
CDCV857B-I
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
(4)
10-Jun-2016
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
CDCV857BIDGGR
Package Package Pins
Type Drawing
TSSOP
DGG
48
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
24.4
Pack Materials-Page 1
8.6
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
15.8
1.8
12.0
24.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CDCV857BIDGGR
TSSOP
DGG
48
2000
367.0
367.0
45.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated