EPCOS B57621C472J62 Smd ntc thermistors with silver palladium termination, size 1206 Datasheet

Temperature Measurement
B57621
SMD NTC Thermistors with Silver Palladium Termination, Size 1206
Applications
1,6±0,2
C 621
1,3 max.
■ Temperature measurement and
3,2±0,2
compensation in
– hybrid circuits
– data systems
– telecom systems
– automotive electronics
0,5±0,25
Features
■ Silver palladium termination (AgPd)
■ Cost-effective
■ Suitable for wave and reflow soldering
Termination
Options
TNT0398-F
Dimensions in mm/Approx. weight 18 mg
Alternative resistance ratings and resistance tolerance
< 5% available on request
Delivery mode
Blister tape, 180-mm reel, PU: 4000 or 2000 pcs, depending on chip thickness
Climatic category (IEC 60068-1)
Max. power at 25 °C (on PCB)
Resistance tolerance
Rated temperature
B value tolerance
Dissipation factor (on PCB)
Thermal cooling time constant (on PCB)
Heat capacity
P25
∆R N/R N
TN
∆B/B
δth1)
τc1)
Cth1)
B25/85
55/125/21
300
± 5 %, ± 10 %, ± 20 %
25
±3%
approx. 5
approx. 10
approx. 50
B 25/100
mW
°C
mW/K
s
mJ/K
Ordering code
No. of R/T
characteristic
B 25/50
K
K
K
2,2 k
1308
3010
3040
3060
B57621C0222+062
3,3 k
1309
3430
3500
3520
B57621C0332+062
4,7 k
1309
3430
3500
3520
B57621C0472+062
10 k
1010
3470
3510
3530
B57621C0103+062
15 k
1008
3480
3550
3560
B57621C0153+062
22 k
1008
3480
3550
3560
B57621C0223+062
33 k
2003
3930
3960
3980
B57621C0333+062
47 k
2001
3860
3890
3920
B57621C0473+062
68 k
2001
3860
3890
3920
B57621C0683+062
R 25
Ω
+: J for ∆RN/RN = ± 5 %
K for ∆RN/RN = ± 10 %
M for ∆RN/RN = ± 20 %
1) Depends on mounting situation
60
05/02
Temperature Measurement
B57621
SMD NTC Thermistors with Silver Palladium Termination, Size 1206
R 25
No. of R/T
characteristic
Ω
B 25/50
B 25/85
B 25/100
C 621
Ordering code
K
K
K
100 k
4901
3870
3930
3950
B57621C0104+062
150 k
2903
4120
4190
4200
B57621C0154+162
220 k
2903
4120
4190
4200
B57621C0224+062
330 k
1014
4090
4210
4250
B57621C0334+062
470 k
1014
4090
4210
4250
B57621C0474+062
+: J for ∆RN/RN = ± 5 %
K for ∆RN/RN = ± 10 %
M for ∆RN/RN = ± 20 %
Reliability data
SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a
standardized PCB in accordance with IEC 60539-1.
Test
Standard
Test conditions
∆R25/R 25
(typical)
Storage in
dry heat
IEC
60068-2-2
JIS C 0021
Storage at upper
category temperature
T: (125 ± 2) °C
t: 1000 h
<3%
Storage in damp
heat, steady state
IEC
60068-2-3
JIS C 0022
Temperature of air: (40 ± 2) °C
Relative humidity of air:
(93 +2/–3) %
Duration: 21 days
<3%
Rapid temperature
cycling
IEC
60068-2-14
JIS C 0025
Lower test temperature: – 55 °C < 3 %
Upper test temperature: 125 °C
Number of cycles: 10
Endurance
Solderability
Pmax: 300 mW
T: (65 ± 2) °C
t: 1000 h
IEC
60068-2-58
JIS C 0054
95 % of
terminations
wetted
Solderability:
(215 ± 3) °C / (3 ± 0,3) s
(235 ± 5) °C / (2 ± 0,2) s
Reflow soldering profile
Wave soldering profile
61
No visible
damage
<5%
Resistance to soldering heat:
(260 ± 5) °C / (10 ± 1) s
Resistance drift
after soldering
Remarks
05/02
<5%
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Published by EPCOS AG
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++49 89 636 09, FAX (0 89) 636-2 26 89
(
 EPCOS AG 2002. Reproduction, publication and dissemination of this brochure and the information contained therein without
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