ES1A thru ES1G Surface Mount Glass Passivated Super Fast Rectifiers Reverse Voltage 50 to 400V Forward Current 1.0A FEATURES * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * High temperature metallurgically bonded construction * For use in high frequency rectifier circuits * Fast switching for high efficiency * Cavity-free glass passivated junction * Capable of meeting environmental standards of MIL-S-19500 * 1.0 A operation at TA=75°C with no thermal runaway * Typical IR less than 1.0µA * High temperature soldering guaranteed: 260°C/10 seconds Mechanical Data Case: JEDEC DO-214AC, molded plastic over glass die Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.0023 oz., 0.065 g Handling precautin:None We declare that the material of product compliance with ROHS requirements 1.Electrical Characteristic Maximum & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Parameter Symbol symbol ES1A ES1B Maximum repetitive peak reverse voltage VRRM 50 100 150 200 400 V Maximum RMS voltage VRMS 35 70 105 140 280 V Maximum DC blocking voltage VDC 50 100 150 200 400 V Maximum average forward rectified current 0.375" (9.5mm) lead length at TT = 110°C IF(AV) Peak forward surge current 8.3ms single half sine-wave IFSM superimposed on rated load (JEDEC Method) Typical thermal resistance (Note 2) RθJA TJ, Operating junction and storage temperature range TSTG ES1C ES1D ES1G Unit 1.0 A 30 A 55 °C/W –50 to +150 °C Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Parameter Symbol Maximum instantaneous forward voltage at 0.6A Maximum instantaneous forward voltage at 1.0A Maximum DC reverse current TA = 25°C at rated DC blocking voltage TA = 100°C Typical reverse recovery time (Note 1) Typical junction capacitance at 4.0V, 1MHz NOTES: 1. IF = 0.5A, IR = 1.0A, IRR = 0.25A 2. 8.0mm2 (.013mm thick) land areas symbol ES1A VF IR trr CJ ES1B ES1C 0.90 0.98 5.0 200 20 10.0 ES1D ES1G Unit - V 1.25 V µA ns PF ES1A thru ES1G 2.Ratings and Characteristic Curves ( TA = 25°C unless otherwise noted ) 1.0 0.5 0.375" (9.5mm) Lead Length 0 100 25 50 75 100 125 Ambient Temperature, °C Fig 3. – Typical Instantaneous Forward Characteristics 0.1 100 0.8 1.0 1.2 1.4 Instantaneous Forward Voltage (V) 1.6 Fig 5. –typical transient thermal impedance 1.0 0.1 0.1 1.0 10 t,Pulse duration,sec 40 30 20 10 0 1 10 Number of Cycles at 60Hz 100 Tj=125℃ 10 1.0 Tj=25℃ 0.1 0.01 0 20 40 60 80 100 Percent of Rated Peak Reverse Voltage (%) Fig 6. – Typical Junction Capacitance 10 0.01 TJ = TJ max 8.3ms Single Half Sine-wave (JEDEC Method) Fig 4. – Typical Reverse Characteristics 1.0 0.01 0.6 Fig. 2 – Maximum Non-repetitive Peak Forward Surge Current 100 TJ = 25°C Pulse width = 300µs 1% Duty Cycle 10 50 150 175 Instantaneous Reverse Current (µA) Instantaneous Forward Current (A) 0 Transient thermal impedance(°C/W) Average Forward Rectified Current (A) 60 Hz Resistive or Inductive Load Junction Capacitance (pF) Average Forward Rectified Current (A) Fig. 1 – Forward Current Derating Curve 100 20 10 1.0 0.1 100 TJ = 25°C f = 1.0 MHz Vsig = 50mVp-p 1 10 Reverse Voltage (V) ES1A thru ES1G 3. dimension: 文件编号： 标题Titile: 塑封生产线SMD产品包装规范 第 3 版 Packaging specification of SMD 第 WI-258 第 0 次修改 2 页 SMD产品通用包装材料规格以及包装产品数量 General packaging materials spec. and quantity 1.1 卷装 reel A.卷盘规格reel spec 单位：mm 规格 SMA 7"卷盘 SMA13"卷盘 SMB13"卷盘 SMC13"卷盘 A 177.0±2.0 330.0±2.0 330.0±2.0 330.0±2.0 B 54.0±0.5 75.0±0.5 75.0±0.5 75.0±0.5 C 13.0±0.5 13.0±0.5 13.0±0.5 13.0±0.5 每卷数量 2K 5K 3K 3K W 13.2±0.2 13.2±0.2 13.5±0.5 17.0±0.5 B. 13"卷盘内盒 inner box 单位：mm 尺寸 A 335±5.0 B 335±2.0 C 40±1.0 按以上包装方式，产品包装数量：quantity 规格 SMA13"卷盘 SMB13"卷盘 SMC13"卷盘 每盒数量 10K 6K 6K 标题Titile: 塑封生产线SMD产品包装规范 文件编号： WI-258 文件编号： WI-258 Packaging specification of SMD 第 3 页 C. 7"卷盘盒 box 单位：mm 尺寸 A B C 188±2.0 188±2.0 138±2.0 按以上包装方式，产品包装数量：quantity 每盒数量 16K 7"卷盘 D. 卷盘外箱 reel carton 单位：mm 尺寸 A B C 350±2.0 340±2.0 350±2.0 按以上包装方式，产品包装数量： 规格 SMA 7"卷盘 SMA13"卷盘 SMB13"卷盘 SMC13"卷盘 1.2 编带规格 tape spec A. 盖带 Cover tape 单位：mm A SMA SMB 9.30±0.10 SMC 13.30±0.10 B 0.068±0.005 每箱数量 80K 80K 48K 36K 文件编号： 标题Titile: 第 3 版 Packaging specification of SMD B. 载带 t Do Po P2 B' 第 P1 A D1 A' Bo W F E 塑封生产线SMD产品包装规范 B SEC.:B-B' Ao Ko 产品负极端(编 带有孔一边） SEC.:A-A' WI-258 第 0 次修改 4 页 类型 SMA SMB SMC W 12±0.3 12±0.3 16±0.3 P1 4±0.1 8±0.1 8±0.1 E 1.75±0.1 F 5.5±.05 1.75±0.1 1.75±0.1 5.5±0.05 7.5±.05 D0 D1 1.55±0.05 1.55±0.05 1.55±0.05 1.5±0.1 1.55±0.05 1.55±0.05 P0 4±0.1 4±0.1 4±0.1 P2 2±0.05 2±0.05 2±0.05 10P0 40±0.2 40±0.2 40±0.2 A0 2.79±0.1 3.8±0.1 6.05±0.1 B0 5.33±0.1 5.4±0.1 8.31±0.1 K0 2.36±0.1 T 2.45±0.1 2.54±0.1 0.25±0.05 0.25±0.05 0.25±0.05 2、SMD产品通用包装规范 General spec of SMD 5.2.1国内客户domestic A. 7"卷盘reel 所有标签贴在卷盘负极 all the label on cathode side Ｂ A C C A处:贴LRC标签; B处:贴ROHS标签 C处:贴无卤标签 HF label B. 13"卷盘 所有标签贴在卷盘负极 all the label on （无卤产品才贴HF cathode side only） A Ｂ C Ｂ C A A处:贴LRC标签; B处:贴ROHS标签 C处:贴无卤标签（无卤产品才贴HF only） 文件编号： 标题Titile: 塑封生产线SMD产品包装规范 第 3 版 Packaging specification of SMD 第 WI-258 第 0 次修改 5 页 C. 标签要求label spec： LRC标签label ****** LRC产品型号 type ****** 产品数量 quantity ****** 产品批号 LOT ****** 产品生产日期 ROHS标签 date 无卤标签 HF label Green 2.2 国外客户 overseas 所有标签贴在卷盘负极 all the label on cathode side A Ｂ C 7"卷盘盒 inner box 13"卷盘内盒inner box Ｂ C C A A处:贴LRC标签; B处:贴ROHS标签 C处:贴无卤标签HF label （无卤产品才贴HF only） 文件编号： 标题Titile: 塑封生产线SMD产品包装规范 第 3 版 Packaging specification of SMD 第 WI-258 第 0 次修改 6 页 LRC标签label TYPE:****** MARK:****** Q'TY:****** DATE:****** LRC产品型号 印字型号 产品数量 产品生产日期 ROHS标签 无卤标签 HF label Green 注意事项NOTE: 1. 13"卷盘内盒装好产品,需用热缩膜包装;13"reel’inner box must be packed by shrink film 2. 所有编带产品卷装完成后,用白色胶带将编带粘牢; every tape after packing，must be fixed by white adhesive tape 3.1产品出厂检验报告 testing report of the OQC 每批出货时，需要附上出厂检验报告 every lot must with test report 3.2尾箱 同一编码每批次只允许出现一个尾数箱，对于尾数物料，须用缓冲材料对空余部分填充好， 保证物料在受到一定的外作用力下不发生明显移动，且物料间无碰撞。 The same coding is only one ending for each batch box materials for the mantissa to be good filled with cushioning material. ES1A thru ES1G 4. Update Record 版次 更新记录 更新作者 更新日期 1 第一版 周杰 2010-4-13 2 1.增加包装规范；2增加建议焊盘尺寸； 周杰 2011-10-10