EIC BZG03-C15 Voltage regulator diode Datasheet

TH97/10561QM
BZG03-C10 ~ BZG03-C200
TW00/17276EM
IATF 0060636
SGS TH07/1033
VOLTAGE REGULATOR DIODES
SMA
FEATURES :
* Complete Voltage Range 10 to 200 Volts
* High maximum operating temperature
* Excellent stability
* Low leakage current
4.2 ± 0.25
5.3 ± 0.35
1.3 ± 0.2
* Pb / RoHS Free
1.6 ± 0.25
2.3 ± 0.2
2.6 ± 0.15
MECHANICAL DATA :
* Case : SMA Molded plastic
* Epoxy : UL94V-O rate flame retardant
* Polarity : Color band denotes cathode end
* Mounting position : Any
* Weight : 0.060 gram (Approximately)
1.6 ± 0.25
Dimensions in millimeters
MAXIMUM RATINGS
Rating at 25 °C ambient temperature unless otherwise specified
Parameter
Symbol
Power dissipation
Ptot
Power dissipation
Ptot
Non-repetitive peak reverse
PZSM
Condition
Ttp = 100 °C, see Fig. 1
Ta = 50 °C, see Fig. 1; device
mounted on an Al 2O3 PCB (Fig. 4)
tp = 100 µs; square pulse;
Tj = 25°C prior to surge; see Fig. 2
Min.
Max.
Unit
-
3
W
-
1.25
W
-
600
W
-
1.2
V
Forward voltage
VF
Junction Temperature Range
Tj
-65
+175
°C
Storage Temperature Range
Tstg
-65
+175
°C
IF = 0.5 A; Tj = 25 °C; see Fig. 3
THERMAL CHARACTERISTICS
Parameter
Symbol
Thermal resistance from junction to tie-point
Rth j-tp
Thermal resistance from junction to ambient
Rth j-a
Condition
(Note 1)
Value
Unit
25
K/W
100
K/W
Note
1. Device mounted on an Al2O3 printed-circuit board, 0.7 mm thick; thickness of Cu-layer ≥35 µm, see Fig.4.
Page 1 of 3
Rev. 08 : September 18, 2008
TH97/10561QM
TW00/17276EM
IATF 0060636
SGS TH07/1033
ELECTRICAL CHARACTERISTICS
Rating at Tj = 25 °C unless otherwise specified
Type No.
Working Voltage
Differental
VZ @ I Z
Marking
Code
Temperature
Test
Maximum Reverse
Resistance
Coefficient
Current
Leakage Current
rdiff(Ω) at I Z
SZ (%/K) at I Z
IZ
IR @ V R
Min.
Nom.
Max.
Typ.
Max.
Min.
Max.
(mA)
(μA)
(V)
BZG03-C10
C10
9.4
10
10.6
2
4
0.05
0.09
50
7.0
7.5
BZG03-C11
C11
10.4
11
11.6
4
7
0.05
0.10
50
4.0
8.2
BZG03-C12
C12
11.4
12
12.7
4
7
0.05
0.10
50
3.0
9.1
BZG03-C13
C13
12.4
13
14.1
5
10
0.05
0.10
50
2.0
10
BZG03-C15
C15
13.8
15
15.6
5
10
0.05
0.10
50
1.0
11
BZG03-C16
C16
15.3
16
17.1
6
15
0.05
0.11
25
1.0
12
BZG03-C18
C18
16.8
18
19.1
6
15
0.06
0.11
25
1.0
13
BZG03-C20
C20
18.8
20
21.2
6
15
0.06
0.11
25
1.0
15
BZG03-C22
C22
20.8
22
23.3
6
15
0.06
0.11
25
1.0
16
BZG03-C24
C24
22.8
24
25.6
7
15
0.06
0.11
25
1.0
18
BZG03-C27
C27
25.1
27
28.9
7
15
0.06
0.11
25
1.0
20
BZG03-C30
C30
28
30
32
8
15
0.06
0.11
25
1.0
22
BZG03-C33
C33
31
33
35
8
15
0.06
0.11
25
1.0
24
BZG03-C36
C36
34
36
38
21
40
0.06
0.11
10
1.0
27
BZG03-C39
C39
37
39
41
21
40
0.06
0.11
10
1.0
30
BZG03-C43
C43
40
43
46
24
45
0.07
0.12
10
1.0
33
BZG03-C47
C47
44
47
50
24
45
0.07
0.12
10
1.0
36
BZG03-C51
C51
48
51
54
25
60
0.07
0.12
10
1.0
39
BZG03-C56
C56
52
56
60
25
60
0.07
0.12
10
1.0
43
BZG03-C62
C62
58
62
66
25
80
0.08
0.13
10
1.0
47
BZG03-C68
C68
64
68
72
25
80
0.08
0.13
10
1.0
51
BZG03-C75
C75
70
75
79
30
100
0.08
0.13
10
1.0
56
BZG03-C82
C82
77
82
87
30
100
0.08
0.13
10
1.0
62
BZG03-C91
C91
85
91
96
60
200
0.09
0.13
5
1.0
68
BZG03-C100
C100
94
100
106
60
200
0.09
0.13
5
1.0
75
BZG03-C110
C110
104
110
116
80
250
0.09
0.13
5
1.0
82
BZG03-C120
C120
114
120
127
80
250
0.09
0.13
5
1.0
91
BZG03-C130
C130
124
130
141
110
300
0.09
0.13
5
1.0
100
BZG03-C150
C150
138
150
156
130
300
0.09
0.13
5
1.0
110
BZG03-C160
C160
153
160
171
150
350
0.09
0.13
5
1.0
120
BZG03-C180
C180
168
180
191
180
400
0.09
0.13
5
1.0
130
BZG03-C200
C200
188
200
212
200
500
0.09
0.13
5
1.0
150
Page 2 of 3
Rev. 08 : September 18, 2008
TH97/10561QM
TW00/17276EM
IATF 0060636
SGS TH07/1033
RATING AND CHARACTERISTIC CURVES ( BZG03-C10 ~ BZG03-C200 )
FIG.1 - Maximum total power dissipation as a
function of temperature.
Ptot
(W)
FIG.2 - Maximum non-repetitive peak reverse
power dissipation as a function of pulse
duration (square pulse).
PZSM
(W)
4
104
3
103
2
102
1
0
100
0
10
T, (°C)
175
10-2
Solid line: tie-point temperature.
Dotted line: ambient temperature; device mounted
on an Al2O3 PCB as shown in Fig.5.
10-1
1
tp (ms)
10
Tj= 25 °C prior to surge.
FIG. 3 - Forward current as a function of forward
voltage; typical values.
FIG.4 - Printed-circuit board for surface mounting.
50
3
IF (A)
4.5
2
50
□ 2.5
1
1.25
0
0
1
VF (V)
2
Dimensions in mm.
Tj= 25 °C.
Page 3 of 3
Rev. 08 : September 18, 2008
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