Product Folder Order Now Technical Documents Tools & Software Support & Community AWR1642 SWRS203 – MAY 2017 AWR1642 Single-Chip 77- and 79-GHz FMCW Radar Sensor 1 Device Overview 1.1 Features • FMCW Transceiver – Integrated PLL, Transmitter, Receiver, Baseband, and A2D – 76- to 81-GHz Coverage With 4 GHz Available Bandwidth – Four Receive Channels – Two Transmit Channels – Ultra-Accurate Chirp (Timing) Engine Based on Fractional-N PLL – TX Power: 12 dBm – RX Noise Figure: – 15 dB (76 to 77 GHz) – 16 dB (77 to 81 GHz) – Phase Noise at 1 MHz: – –94 dBc/Hz (76 to 77 GHz) – –91 dBc/Hz (77 to 81 GHz) • Built-in Calibration and Self-Test (Monitoring) – ARM® Cortex®-R4F-Based Radio Control System – Built-in Firmware (ROM) – Self-calibrating System Across Frequency and Temperature • C674x DSP for FMCW Signal Processing – On-Chip Memory: 1.5MB • Cortex-R4F Microcontroller for Object Tracking and Classification, AUTOSAR, and Interface Control – Supports Autonomous Mode (Loading User Application from QSPI Flash Memory) • Integrated Peripherals – Internal Memories With ECC • Host Interface – CAN (Two Instances, One Being CAN-FD) 1.2 • • • • • Other Interfaces Available to User Application – Up to 6 ADC Channels – Up to 2 SPI Channels – Up to 2 UARTs – I2C – GPIOs – 2-Lane LVDS Interface for Raw ADC Data and Debug Instrumentation • ASIL B Capable • AECQ100 Qualified • AWR1642 Advanced Features – Embedded Self-monitoring With No Host Processor Involvement – Complex Baseband Architecture – Embedded Interference Detection Capability • Power Management – Built-in LDO Network for Enhanced PSRR – I/Os Support Dual Voltage 3.3 V/1.8 V • Clock Source – 40.0-MHz Crystal With Internal Oscillator – Supports External Oscillator at 40 and 50 MHz – Supports Externally Driven Clock (Square/Sine) at 40 and 50 MHz • Easy Hardware Design – 0.65-mm Pitch, 161-Pin 10.4 mm × 10.4 mm Flip Chip BGA Package for Easy Assembly and Low-Cost PCB Design – Small Solution Size • Supports Automotive Temperature Operating Range Applications Blind Spot Detection Lane Change Assistance Cross Traffic Alert Parking Assistance • • • Occupancy Detection Simple Gesture Recognition Car Door Opener Applications 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for pre-production products; subject to change without notice. ADVANCE INFORMATION 1 AWR1642 SWRS203 – MAY 2017 www.ti.com 40-MHz Crystal Serial FLASH Power Management QSPI Integrated MCU ARM Cortex-R4F Antenna Structure RX1 RX2 RX3 RX4 CAN DCAN PHY Automotive Network CAN FD MCAN PHY Automotive Network Radar Front End TX1 TX2 Integrated DSP TI C674x AWR1642 Figure 1-1. Autonomous Radar Sensor For Automotive Applications 1.3 Description ADVANCE INFORMATION The AWR1642 device is an integrated single-chip FMCW radar sensor capable of operation in the 76- to 81-GHz band. The device is built with TI’s low-power 45-nm RFCMOS process and enables unprecedented levels of integration in an extremely small form factor. The AWR1642 is an ideal solution for low-power, self-monitored, ultra-accurate radar systems in the automotive space. The AWR1642 device is a self-contained FMCW radar sensor single-chip solution that simplifies the implementation of Automotive Radar sensors in the band of 76 to 81 GHz. It is built on TI’s low-power 45nm RFCMOS process, which enables a monolithic implementation of a 2TX, 4RX system with built-in PLL and A2D converters. It integrates the DSP subsystem, which contains TI's high performance C674x DSP for the Radar Signal processing. The device includes an ARM R4F-based processor subsystem, which is responsible for radio configuration, control, and calibration. Simple programming model changes can enable a wide variety of sensor implementation (Short, Mid, Long) with the possibility of dynamic reconfiguration for implementing a multimode sensor. Additionally, the device is provided as a complete platform solution including reference hardware design, software drivers, sample configurations, API guide, and user documentation. Device Information (1) PART NUMBER X1642BIGABL (Tray) (1) 2 PACKAGE BODY SIZE FCBGA (161) 10.4 mm × 10.4 mm For more information, see Section 10, Mechanical Packaging and Orderable Information. Device Overview Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com 1.4 SWRS203 – MAY 2017 Functional Block Diagram QSPI LNA IF Cortex-R4F @ 200-MHz ADC SPI Optional External MCU interface SPI / I2C PMIC control (User programmable) LNA IF Serial Flash interface ADC Digital Front End LNA IF ADC LNA IF ADC Prog RAM (256kB*) (Decimation filter chain) Data RAM (192kB*) Boot ROM DCAN Primary communication interfaces (automotive) Bus Matrix CAN-FD PA DMA Master subsystem (Customer programmed) Debug UARTs Test/ Debug For debug JTAG for debug/ development Mailbox PA x4 Ramp Generator HIL C674x DSP @600 MHz High-speed ADC output interface (for recording) High-speed input for hardware-in-loop verification ADC Buffer 6 RF Control/ BIST GPADC Osc. VMON Temp RF/Analog subsystem L1P (32KB) DMA L1D (32KB) CRC DSP subsystem (Customer programmed) L2 (256KB) Radar Data Memory (L3) 768KB* * Up to 512KB of Radar Data Memory can be switched to the Master R4F if required Copyright © 2017, Texas Instruments Incorporated Device Overview Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 3 ADVANCE INFORMATION LVDS Synth (20 GHz) AWR1642 SWRS203 – MAY 2017 www.ti.com Table of Contents 1 2 3 Device Overview ......................................... 1 6.1 Overview 1.2 Applications ........................................... 1 6.2 Functional Block Diagram ........................... 55 1.3 Description ............................................ 2 6.3 Subsystems 1.4 Functional Block Diagram ............................ 3 6.4 Other Subsystems................................... 62 ............................................ ......................................... 55 55 Revision History ......................................... 4 Device Comparison ..................................... 5 7 Monitoring and Diagnostics.......................... 64 Related Products ..................................... 6 8 Applications, Implementation, and Layout........ 69 7.1 Monitoring and Diagnostic Mechanisms ............ Terminal Configuration and Functions .............. 7 8.1 .......................................... 7 4.2 Pin Attributes ........................................ 11 4.3 Signal Descriptions .................................. 19 4.4 Pin Multiplexing ..................................... 24 Specifications ........................................... 27 5.1 Absolute Maximum Ratings ......................... 27 5.2 ESD Ratings ........................................ 27 5.3 Power-On Hours (POH) ............................. 27 5.4 Recommended Operating Conditions ............... 28 5.5 Power Supply Specifications ........................ 28 5.6 Power Consumption Summary...................... 29 5.7 RF Specification ..................................... 30 5.8 CPU Specifications .................................. 31 ................................. 8.3 Reference Schematic ............................... 8.4 Layout ............................................... Device and Documentation Support ............... 9.1 Device Nomenclature ............................... 9.2 Tools and Software ................................. 9.3 Documentation Support ............................. 9.4 Community Resources .............................. 9.5 Trademarks.......................................... 9.6 Electrostatic Discharge Caution ..................... 9.7 Export Control Notice ............................... 9.8 Glossary ............................................. 4.1 5 Detailed Description ................................... 55 Features .............................................. 1 3.1 4 6 1.1 Pin Diagram ADVANCE INFORMATION 5.9 Thermal Resistance Characteristics for FCBGA Package [ABL0161] ................................. 31 5.10 Timing and Switching Characteristics ............... 32 8.2 9 64 Application Information .............................. 69 Short-Range Radar 69 69 72 76 76 77 77 78 78 78 78 78 10 Mechanical, Packaging, and Orderable Information .............................................. 79 10.1 Packaging Information .............................. 79 2 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. 4 DATE REVISION NOTES May 2017 * Initial Release Revision History Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 3 Device Comparison Table 3-1. Device Features Comparison FUNCTION AWR1243 AWR1443 AWR1642 Number of receivers 4 4 4 Number of transmitters 3 3 2 On-chip memory — 576KB 1.5MB B-Capable — B-Capable 15 5 5 37.5 12.5 12.5 MCU (R4F) — Yes Yes DSP (C674x) — — Yes ASIL Max interface (MHz) Max real sampling rate (Msps) Processor Serial Peripheral Interface (SPI) ports 1 1 2 Quad Serial Peripheral Interface (QSPI) — Yes Yes Inter-Integrated Circuit (I2C) interface — 1 1 Controller Area Network (DCAN) interface — Yes Yes CAN FD — — Yes Trace — — Yes PWM — — Yes Hardware In Loop (HIL/DMM) — — Yes GPADC — Yes Yes LVDS/Debug Yes Yes Yes CSI2 Yes — — — Yes — 1-V bypass mode Yes Yes Yes Cascade (20-GHz sync) Yes — — — Yes Yes AI AI AI Hardware accelerator JTAG Product status (1) (1) PRODUCT PREVIEW (PP), ADVANCE INFORMATION (AI), or PRODUCTION DATA (PD) ADVANCE INFORMATION Peripherals ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and other specifications are subject to change without notice. Device Comparison Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 5 AWR1642 SWRS203 – MAY 2017 3.1 www.ti.com Related Products For information about other devices in this family of products or related products see the links that follow. mmWave Sensors TI’s mmWave sensors rapidly and accurately sense range, angle and velocity with less power using the smallest footprint mmWave sensor portfolio for automotive applications. Automotive mmWave Sensors TI’s automotive mmWave sensor portfolio offers high-performance radar front end to ultra-high resolution, small and low-power single-chip radar solutions. TI’s scalable sensor portfolio enables design and development of ADAS system solution for every performance, application and sensor configuration ranging from comfort functions to safety functions in all vehicles. Companion Products for AWR1642 Review products that are frequently purchased or used in conjunction with this product. Reference Designs for AWR1642 TI Designs Reference Design Library is a robust reference design library spanning analog, embedded processor and connectivity. Created by TI experts to help you jump-start your system design, all TI Designs include schematic or block diagrams, BOMs and design files to speed your time to market. Search and download designs at ti.com/tidesigns. ADVANCE INFORMATION 6 Device Comparison Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 4 Terminal Configuration and Functions 4.1 Pin Diagram 1 2 3 A VSSA VOUT_PA VSSA B VSSA VOUT_PA VSSA TX1 VSSA TX2 VSSA C VSSA VIN _13RF2 VSSA VSSA VSSA VSSA VSSA VSSA F G VSSA H J VSSA K L 5 6 VSSA 7 8 9 10 GPIO_46 VOUT _14APLL1 GPIO_45 GPIO_44 VBGAP GPIO_43 GPIO_42 VSSA 11 13 14 15 VOUT _14SYNTH OSC _CLKOUT VSSA GPADC5 GPIO_40 GPIO_41 SPIA_cs_n GPADC6 CLKP SPIA_mosi GPIO_39 CLKM VSS SPIA_clk SPIA_miso VIOIN _18DIFF VSS SPIB_mosi SPIB_clk VIOIN SYNC_OUT SPIB_miso VIN_SRAM GPIO_0 SPIB_cs_n VDDIN GPIO_1 LVDS_TXP0 LVDS_TXM0 GPIO_2 LVDS_TXP1 LVDS_TXM1 VPP LVDS_CLKP LVDS_CLKM LVDS _FRCLKP LVDS _FRCLKM VIN _18CLK 12 VIN _18VCO VIN _13RF2 D E 4 VSSA M VSSA VSSA VSS RX4 VSSA VIN_18BB VSSA VSSA VIN _13RF1 RX3 VSSA VIN _13RF1 VSSA VSSA VIN _13RF1 RX2 VSSA VIN_18BB VSSA VSSA VSS RX1 VSSA VSS VSS VSS VSS VSS VSS VSS VSS VSS N VSSA VSSA VSSA rs232_rx rs232_tx P GPADC1 GPADC2 GPADC3 SYNC_in GPIO_32 GPIO_34 R VSSA GPADC4 NRESET GPIO_31 GPIO_33 VDDIN VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS MCU _CLKOUT Warm _Reset TMS VDDIN QSPI[1] TDO GPIO_48 GPIO_47 GPIO_36 GPIO_38 PMIC _CLKOUT TCK QSPI_cs_n QSPI[3] SPI_HOST_INTR VNWA VDDIN GPIO_35 GPIO_37 VIOIN_18 VIOIN TDI QSPI_clk QSPI[0] QSPI[2] VSS nERROR_OUT nERROR_IN ADVANCE INFORMATION Figure 4-1 shows the pin locations for the 161-pin FCBGA package. Figure 4-2, Figure 4-3, Figure 4-4, and Figure 4-5 show the same pins, but split into four quadrants. Not to scale Figure 4-1. Pin Diagram Terminal Configuration and Functions Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 7 AWR1642 SWRS203 – MAY 2017 www.ti.com 1 2 3 4 5 6 A VSSA VOUT_PA VSSA B VSSA VOUT_PA VSSA TX1 VSSA TX2 VSSA GPIO_45 C VSSA VIN _13RF2 VSSA VSSA VSSA VSSA VSSA GPIO_43 VSS VSSA 7 8 VSSA VIN _13RF2 D E VSSA ADVANCE INFORMATION F G VSSA VSSA VSSA VSS RX4 VSSA VIN_18BB VSSA VSSA VIN _13RF1 VSS VSS VSS VSS Not to scale 1 2 3 4 Figure 4-2. Top Left Quadrant 8 Terminal Configuration and Functions Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 10 11 A VSSA VOUT _14APLL1 B VSSA VBGAP C VSSA VIN _18CLK 12 VIN _18VCO 13 14 15 VOUT _14SYNTH OSC _CLKOUT VSSA VSSA VSSA FM_CW _CLKOUT ANAMUX/ GPADC5 VSENSE/ GPADC6 VSSA VIOIN _18DIFF D E VSS F VSS G VSS FM_CW _SYNCIN2 VSS VSSA CLKP VSSA VSS VDDIN CLKM Reserved CSI2 _TXM[0] ADVANCE INFORMATION 9 CSI2 _TXP[0] Not to scale 1 2 3 4 Figure 4-3. Top Right Quadrant Terminal Configuration and Functions Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 9 AWR1642 SWRS203 – MAY 2017 www.ti.com 1 H J VSSA K L VSSA M 2 3 4 5 RX3 VSSA VIN _13RF1 VSSA VSSA VIN _13RF1 RX2 VSSA VIN_18BB VSSA VSSA VSS RX1 VSSA 6 7 8 VSS VSS VSS VSS VSS VSS VSS VSS ADVANCE INFORMATION nERROR_OUT nERROR_IN MCU _CLKOUT N VSSA VSSA VSSA rs232_rx rs232_tx P GPADC1 GPADC2 GPADC3 SYNC_in GPIO_32 GPIO_34 GPIO_36 GPIO_38 R VSSA GPADC4 NRESET GPIO_31 GPIO_33 VDDIN GPIO_35 GPIO_37 Not to scale 1 2 3 4 Figure 4-4. Bottom Left Quadrant 10 Terminal Configuration and Functions Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 SWRS203 – MAY 2017 9 H 10 VSS J 11 12 VSS VSS K VSS L VSS VSS VSS 13 14 15 GPIO_0 SPIB_cs_n VDDIN GPIO_1 LVDS_TXP0 LVDS_TXM0 GPIO_2 LVDS_TXP1 LVDS_TXM1 VPP LVDS_CLKP LVDS_CLKM LVDS _FRCLKP LVDS _FRCLKM M N Warm _Reset TMS VDDIN QSPI[1] TDO GPIO_48 GPIO_47 P PMIC _CLKOUT TCK QSPI_cs_n QSPI[3] SPI_HOST_INTR VNWA VDDIN R VIOIN_18 VIOIN TDI QSPI_clk QSPI[0] QSPI[2] VSS ADVANCE INFORMATION www.ti.com Not to scale 1 2 3 4 Figure 4-5. Bottom Right Quadrant 4.2 Pin Attributes Terminal Configuration and Functions Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 11 AWR1642 SWRS203 – MAY 2017 www.ti.com Table 4-1. Pin Attributes (ABL0161 Package) BALL NUMBER [1] H13 J13 ADVANCE INFORMATION K13 R4 P5 BALL NAME [2] GPIO_0 GPIO_1 GPIO_2 GPIO_31 GPIO_32 SIGNAL NAME [3] GPIO_13 PINCNTL ADDRESS [4] 0xFFFFEA04 0 IO 1 IO PMIC_CLKOUT 2 O ePWM1b 10 O ePWM2a 11 O 0 IO GPIO_1 1 IO SYNC_OUT 2 O DMM_MUX_IN 12 I SPIB_cs_n_1 13 IO SPIB_cs_n_2 14 IO ePWM1SYNCI 15 I 0 IO GPIO_2 1 IO OSC_CLKOUT 2 O MSS_uartb_tx 7 O BSS_uart_tx 8 O SYNC_OUT 9 O PMIC_CLKOUT 10 O 0 O GPIO_31 1 IO DMM0 2 I MSS_uarta_tx 4 IO 0 O 1 IO 2 I 0 O 1 IO 2 I 0 O GPIO_34 1 IO DMM3 2 I ePWM3SYNCO 4 O 0 O GPIO_35 1 IO DMM4 2 I ePWM2SYNCO 4 O GPIO_16 0xFFFFEA08 GPIO_26 0xFFFFEA64 TRACE_DATA_0 0xFFFFEA7C TRACE_DATA_1 0xFFFFEA80 DMM1 GPIO_33 TRACE_DATA_2 0xFFFFEA84 GPIO_33 DMM2 P6 R7 12 GPIO_34 GPIO_35 TYPE [6] GPIO_0 GPIO_32 R5 MODE [5] TRACE_DATA_3 0xFFFFEA88 TRACE_DATA_4 0xFFFFEA8C Terminal Configuration and Functions BALL RESET STATE [7] PULL UP/DOWN TYPE [8] Output Disabled Pull Down Output Disabled Pull Down Output Disabled Pull Down Output Disabled Pull Down Output Disabled Pull Down Output Disabled Pull Down Output Disabled Pull Down Output Disabled Pull Down Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 Table 4-1. Pin Attributes (ABL0161 Package) (continued) P7 R8 P8 D14 B14 B15 C9 C8 BALL NAME [2] GPIO_36 GPIO_37 GPIO_38 GPIO_39 GPIO_40 GPIO_41 GPIO_42 GPIO_43 SIGNAL NAME [3] TRACE_DATA_5 PINCNTL ADDRESS [4] 0xFFFFEA90 MODE [5] TYPE [6] 0 O GPIO_36 1 IO DMM5 2 I MSS_uartb_tx 5 O 0 O GPIO_37 1 IO DMM6 2 I BSS_uart_tx 5 O 0 O GPIO_38 1 IO DMM7 2 I DSS_uart_tx 5 O 0 O GPIO_39 1 IO DMM8 2 I CAN_FD_tx 4 IO ePWM1SYNCI 5 I 0 O GPIO_40 1 IO DMM9 2 I CAN_FD_rx 4 IO ePWM1SYNCO 5 O 0 O GPIO_41 1 IO DMM10 2 I ePWM3a 4 O 0 O GPIO_42 1 IO DMM11 2 I ePWM3b 4 O 0 O GPIO_43 1 IO DMM12 2 I ePWM1a 4 O CAN_tx 5 IO TRACE_DATA_6 0xFFFFEA94 TRACE_DATA_7 0xFFFFEA98 TRACE_DATA_8 0xFFFFEA9C TRACE_DATA_9 0xFFFFEAA0 TRACE_DATA_10 TRACE_DATA_11 TRACE_DATA_12 0xFFFFEAA4 0xFFFFEAA8 0xFFFFEAAC BALL RESET STATE [7] PULL UP/DOWN TYPE [8] Output Disabled Pull Down Output Disabled Pull Down Output Disabled Pull Down Output Disabled Pull Down Output Disabled Pull Down Output Disabled Pull Down Output Disabled Pull Down Output Disabled Pull Down Terminal Configuration and Functions Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 ADVANCE INFORMATION BALL NUMBER [1] 13 AWR1642 SWRS203 – MAY 2017 www.ti.com Table 4-1. Pin Attributes (ABL0161 Package) (continued) BALL NUMBER [1] B9 B8 ADVANCE INFORMATION A9 N15 BALL NAME [2] GPIO_44 GPIO_45 GPIO_46 GPIO_47 SIGNAL NAME [3] TRACE_DATA_13 PINCNTL ADDRESS [4] 0 O 1 IO DMM13 2 I ePWM1b 4 O CAN_rx 5 I 0 O GPIO_45 1 IO DMM14 2 I ePWM2a 4 O 0 O GPIO_46 1 IO DMM15 2 I ePWM2b 4 O 0 O 1 IO 2 I 0 O 1 IO 2 I 0 IO 1 O TRACE_DATA_15 TRACE_CLK 0xFFFFEAB4 0xFFFFEAB8 0xFFFFEABC GPIO_47 DMM_CLK N14 GPIO_48 TRACE_CTL 0xFFFFEAC0 GPIO_48 DMM_SYNC N8 MCU_CLKOUT TYPE [6] GPIO_44 TRACE_DATA_14 0xFFFFEAB0 MODE [5] GPIO_25 0xFFFFEA60 MCU_CLKOUT ePWM1a BALL RESET STATE [7] PULL UP/DOWN TYPE [8] Output Disabled Pull Down Output Disabled Pull Down Output Disabled Pull Down Output Disabled Pull Down Output Disabled Pull Down Output Disabled Pull Down 12 O N7 nERROR_IN nERROR_IN 0xFFFFEA44 0 I Input N6 nERROR_OUT nERROR_OUT 0xFFFFEA4C 0 O Hi-Z (Open Drain) P9 PMIC_CLKOUT SOP[2] 0xFFFFEA68 During Power Up I Output Disabled Pull Down GPIO_27 0 IO PMIC_CLKOUT 1 O ePWM1b 11 O ePWM2a 12 O 0 IO Output Disabled Pull Down 1 IO 2 IO 0 IO Output Disabled Pull Down QSPI[1] 1 IO SPIB_mosi 2 IO SPIB_cs_n_2 8 IO 0 IO Output Disabled Pull Down QSPI[2] 1 I CAN_FD_tx 8 O R13 QSPI[0] GPIO_8 0xFFFFEA2C QSPI[0] SPIB_miso N12 R14 14 QSPI[1] QSPI[2] GPIO_9 0xFFFFEA30 GPIO_10 0xFFFFEA34 Terminal Configuration and Functions Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 Table 4-1. Pin Attributes (ABL0161 Package) (continued) P12 BALL NAME [2] QSPI[3] SIGNAL NAME [3] GPIO_11 PINCNTL ADDRESS [4] 0xFFFFEA38 IO 1 IO 8 I 0 IO QSPI_clk 1 IO SPIB_clk 2 IO DSS_uart_tx 6 O 0 IO 1 IO 2 IO 0 IO rs232_rx 1 I MSS_uarta_rx 2 I BSS_uart_tx 6 IO MSS_uartb_rx 7 IO CAN_FD_rx 8 I I2C_scl 9 IO ePWM2a 10 O ePWM2b 11 O ePWM3a 12 O 0 IO rs232_tx 1 O MSS_uarta_tx 5 IO MSS_uartb_tx 6 IO BSS_uart_tx 7 IO CAN_FD_tx 10 O I2C_sda 11 IO ePWM1a 12 O ePWM1b 13 O NDMM_EN 14 I ePWM2a 15 O 0 IO SPIA_clk 1 IO CAN_rx 6 I DSS_uart_tx 7 O 0 IO SPIA_cs_n 1 IO CAN_tx 6 O CAN_FD_rx P11 QSPI_clk QSPI_cs_n GPIO_7 0xFFFFEA3C GPIO_6 0xFFFFEA40 QSPI_cs_n SPIB_cs_n N4 N5 E13 C13 rs232_rx rs232_tx SPIA_clk SPIA_cs_n TYPE [6] 0 QSPI[3] R12 MODE [5] GPIO_15 0xFFFFEA74 GPIO_14 0xFFFFEA78 GPIO_3 0xFFFFEA14 GPIO_30 0xFFFFEA18 BALL RESET STATE [7] PULL UP/DOWN TYPE [8] Output Disabled Pull Down Output Disabled Pull Down Output Disabled Pull Up Input Enabled Pull Up Output Enabled Output Disabled Pull Up Output Disabled Pull Up Terminal Configuration and Functions Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 ADVANCE INFORMATION BALL NUMBER [1] 15 AWR1642 SWRS203 – MAY 2017 www.ti.com Table 4-1. Pin Attributes (ABL0161 Package) (continued) BALL NUMBER [1] E14 BALL NAME [2] SPIA_miso SIGNAL NAME [3] GPIO_20 PINCNTL ADDRESS [4] 0xFFFFEA10 IO 1 IO 2 O 0 IO SPIA_mosi 1 IO CAN_FD_rx 2 I DSS_uart_tx 8 O 0 IO SPIB_clk1 1 IO MSS_uarta_rx 2 I MSS_uartb_tx 6 O BSS_uart_tx 7 O CAN_FD_rx 8 I 0 IO SPIB_cs_n 1 IO MSS_uarta_tx 2 O MSS_uartb_tx 6 O BSS_uart_tx 7 IO QSPI_clk_ext 8 I CAN_FD_tx 9 O 0 IO SPIB_miso 1 IO I2C_scl 2 IO DSS_uart_tx 6 O 0 IO 1 IO 2 IO 0 IO 1 O 6 IO 0 IO SYNC_IN 1 I MSS_uartb_rx 6 IO DMM_MUX_IN 7 I SYNC_OUT 9 O CAN_FD_tx F14 ADVANCE INFORMATION H14 G14 F13 SPIA_mosi SPIB_clk SPIB_cs_n SPIB_miso SPIB_mosi GPIO_19 0xFFFFEA0C GPIO_5 0xFFFFEA24 GPIO_4 0xFFFFEA28 GPIO_22 0xFFFFEA20 GPIO_21 0xFFFFEA1C SPIB_mosi I2C_sda P13 SPI_HOST_INTR GPIO_12 0xFFFFEA00 SPI_HOST_INTR SPIB_cs_n_1 P4 16 SYNC_in TYPE [6] 0 SPIA_miso D13 MODE [5] GPIO_28 0xFFFFEA6C Terminal Configuration and Functions BALL RESET STATE [7] PULL UP/DOWN TYPE [8] Output Disabled Pull Up Output Disabled Pull Up Output Disabled Pull Up Output Disabled Pull Up Output Disabled Pull Up Output Disabled Pull Up Output Disabled Pull Down Output Disabled Pull Down Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 Table 4-1. Pin Attributes (ABL0161 Package) (continued) G13 P10 R11 BALL NAME [2] SYNC_OUT TCK TDI SIGNAL NAME [3] SOP[1] PINCNTL ADDRESS [4] 0xFFFFEA70 During Power Up I 0 IO SYNC_OUT 1 O DMM_MUX_IN 9 I SPIB_cs_n_1 10 IO SPIB_cs_n_2 11 IO 0 IO TCK 1 I MSS_uartb_tx 2 O CAN_FD_tx 8 O 0 IO 1 I 2 I During Power Up I GPIO_24 0 IO TDO 1 O MSS_uarta_tx 2 O MSS_uartb_tx 6 O BSS_uart_tx 7 O NDMM_EN 9 I 0 IO TMS 1 I BSS_uart_tx 2 O CAN_FD_rx 6 I 0 IO GPIO_17 0xFFFFEA50 GPIO_23 0xFFFFEA58 MSS_uarta_rx N10 N9 TDO TMS Warm_Reset TYPE [6] GPIO_29 TDI N13 MODE [5] SOP[0] 0xFFFFEA5C GPIO_18 0xFFFFEA54 Warm_Reset 0xFFFFEA48 BALL RESET STATE [7] PULL UP/DOWN TYPE [8] Output Disabled Pull Down Input Enabled Pull Down Input Enabled Pull Up Output Enabled Input Enabled Pull Down Hi-Z Input (Open Drain) The following list describes the table column headers: 1. BALL NUMBER: Ball numbers on the bottom side associated with each signal on the bottom. 2. BALL NAME: Mechanical name from package device (name is taken from muxmode 0). 3. SIGNAL NAME: Names of signals multiplexed on each ball (also notice that the name of the ball is the signal name in muxmode 0). 4. PINCNTL ADDRESS: MSS Address for PinMux Control 5. MODE: Multiplexing mode number: value written to PinMux Cntl register to select specific Signal name for this Ball number. Mode column has bit range value. 6. TYPE: Signal type and direction: – I = Input – O = Output Terminal Configuration and Functions Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 17 ADVANCE INFORMATION BALL NUMBER [1] AWR1642 SWRS203 – MAY 2017 www.ti.com – IO = Input or Output 7. BALL RESET STATE: The state of the terminal at power-on reset 8. PULL UP/DOWN TYPE: indicates the presence of an internal pullup or pulldown resistor. Pullup and pulldown resistors can be enabled or disabled via software. – Pull Up: Internal pullup – Pull Down: Internal pulldown – An empty box means No pull. ADVANCE INFORMATION 18 Terminal Configuration and Functions Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com 4.3 SWRS203 – MAY 2017 Signal Descriptions Table 4-2. Signal Descriptions - Digital PIN TYPE DESCRIPTION BALL NO. BSS_UART_TX O Debug UART Transmit [Radar Block] F14, H14, K13, N10, N13, N4, N5, R8 CAN_FD_RX I CAN FD (MCAN) Receive Signal B14, D13, F14, N10, N4, P12 CAN_FD_TX O CAN FD (MCAN) Transmit Signal D14, E14, H14, N5, P10, R14 CAN_RX I CAN (DCAN) Receive Signal B9, E13 CAN_TX IO CAN (DCAN) Transmit Signal C13, C8 DMM0 I Debug Interface (Hardware In Loop) - Data Line R4 DMM1 I Debug Interface (Hardware In Loop) - Data Line P5 DMM2 I Debug Interface (Hardware In Loop) - Data Line R5 DMM3 I Debug Interface (Hardware In Loop) - Data Line P6 DMM4 I Debug Interface (Hardware In Loop) - Data Line R7 DMM5 I Debug Interface (Hardware In Loop) - Data Line P7 DMM6 I Debug Interface (Hardware In Loop) - Data Line R8 DMM7 I Debug Interface (Hardware In Loop) - Data Line P8 DMM8 I Debug Interface (Hardware In Loop) - Data Line D14 DMM9 I Debug Interface (Hardware In Loop) - Data Line B14 DMM10 I Debug Interface (Hardware In Loop) - Data Line B15 DMM11 I Debug Interface (Hardware In Loop) - Data Line C9 DMM12 I Debug Interface (Hardware In Loop) - Data Line C8 DMM13 I Debug Interface (Hardware In Loop) - Data Line B9 DMM14 I Debug Interface (Hardware In Loop) - Data Line B8 DMM15 I Debug Interface (Hardware In Loop) - Data Line DMM_CLK I Debug Interface (Hardware In Loop) - Clock DMM_MUX_IN I Debug Interface (Hardware In Loop) Mux Select between DMM1 and DMM2 (Two Instances) DMM_SYNC I Debug Interface (Hardware In Loop) - Sync DSS_UART_TX O Debug UART Transmit [DSP] EPWM1A O PWM Module 1 - OutPut A C8, N5, N8 EPWM1B O PWM Module 1 - OutPut B B9, H13, N5, P9 EPWM1SYNCI I D14, J13 EPWM1SYNCO O B14 EPWM2A O PWM Module 2- OutPut A B8, H13, N4, N5, P9 EPWM2B O PWM Module 2 - OutPut B A9, N4 EPWM2SYNCO O EPWM3A O PWM Module 3 - OutPut A B15, N4 EPWM3B O PWM Module 3 - OutPut B C9 EPWM3SYNCO O GPIO_0 IO General-Purpose IO H13 GPIO_1 IO General-Purpose IO J13 GPIO_2 IO General-Purpose IO K13 GPIO_3 IO General-Purpose IO E13 GPIO_4 IO General-Purpose IO H14 GPIO_5 IO General-Purpose IO F14 GPIO_6 IO General-Purpose IO P11 GPIO_7 IO General-Purpose IO R12 A9 N15 G13, J13, P4 N14 D13, E13, G14, P8, R12 R7 P6 Terminal Configuration and Functions Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 19 ADVANCE INFORMATION SIGNAL NAME AWR1642 SWRS203 – MAY 2017 www.ti.com Table 4-2. Signal Descriptions - Digital (continued) SIGNAL NAME PIN TYPE DESCRIPTION BALL NO. ADVANCE INFORMATION GPIO_8 IO General-Purpose IO R13 GPIO_9 IO General-Purpose IO N12 GPIO_10 IO General-Purpose IO R14 GPIO_11 IO General-Purpose IO P12 GPIO_12 IO General-Purpose IO P13 GPIO_13 IO General-Purpose IO H13 GPIO_14 IO General-Purpose IO N5 GPIO_15 IO General-Purpose IO N4 GPIO_16 IO General-Purpose IO J13 GPIO_17 IO General-Purpose IO P10 GPIO_18 IO General-Purpose IO N10 GPIO_19 IO General-Purpose IO D13 GPIO_20 IO General-Purpose IO E14 GPIO_21 IO General-Purpose IO F13 GPIO_22 IO General-Purpose IO G14 GPIO_23 IO General-Purpose IO R11 GPIO_24 IO General-Purpose IO N13 GPIO_25 IO General-Purpose IO N8 GPIO_26 IO General-Purpose IO K13 GPIO_27 IO General-Purpose IO P9 GPIO_28 IO General-Purpose IO P4 GPIO_29 IO General-Purpose IO G13 GPIO_30 IO General-Purpose IO C13 GPIO_31 IO General-Purpose IO R4 GPIO_32 IO General-Purpose IO P5 GPIO_33 IO General-Purpose IO R5 GPIO_34 IO General-Purpose IO P6 GPIO_35 IO General-Purpose IO R7 GPIO_36 IO General-Purpose IO P7 GPIO_37 IO General-Purpose IO R8 GPIO_38 IO General-Purpose IO P8 GPIO_39 IO General-Purpose IO D14 GPIO_40 IO General-Purpose IO B14 GPIO_41 IO General-Purpose IO B15 GPIO_42 IO General-Purpose IO C9 GPIO_43 IO General-Purpose IO C8 GPIO_44 IO General-Purpose IO B9 GPIO_45 IO General-Purpose IO B8 GPIO_46 IO General-Purpose IO A9 GPIO_47 IO General-Purpose IO N15 GPIO_48 IO General-Purpose IO N14 I2C_SCL IO I2C Clock G14, N4 I2C_SDA IO I2C Data F13, N5 LVDS_TXP[0] O LVDS_TXM[0] O LVDS_CLKP O LVDS_CLKM O 20 Differential data Out – Lane 0 Differential data Out – Lane 1 Terminal Configuration and Functions J14 J15 L14 L15 Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 Table 4-2. Signal Descriptions - Digital (continued) SIGNAL NAME PIN TYPE DESCRIPTION BALL NO. LVDS_TXP[1] O K14 LVDS_TXM[1] O LVDS_FRCLKP O LVDS_FRCLKM O MCU_CLKOUT O Programmable clock given out to external MCU or the processor MSS_UARTA_RX I Master Subsystem - UART A Receive F14, N4, R11 MSS_UARTA_TX O Master Subsystem - UART A Transmit H14, N13, N5, R4 MSS_UARTB_RX IO Master Subsystem - UART B Receive N4, P4 F14, H14, K13, N13, N5, P10, P7 Differential clock Out K15 M14 Differential Frame Clock M15 N8 MSS_UARTB_TX O Master Subsystem - UART B Transmit NDMM_EN I Debug Interface (Hardware In Loop) Enable - Active Low Signal nERROR_IN I Failsafe input to the device. Nerror output from any other device can be concentrated in the error signaling monitor module inside the device and appropriate action can be taken by Firmware N7 nERROR_OUT O Open drain fail safe output signal. Connected to PMIC/Processor/MCU to indicate that some severe criticality fault has happened. Recovery would be through reset. N6 PMIC_CLKOUT O Output Clock from AWR1642 device for PMIC QSPI[0] IO QSPI Data Line #0 (Used with Serial Data Flash) R13 QSPI[1] IO QSPI Data Line #1 (Used with Serial Data Flash) N12 QSPI[2] I QSPI Data Line #2 (Used with Serial Data Flash) R14 QSPI[3] IO QSPI Data Line #3 (Used with Serial Data Flash) P12 QSPI_CLK IO QSPI Clock (Used with Serial Data Flash) R12 I QSPI Clock (Used with Serial Data Flash) H14 QSPI Chip Select (Used with Serial Data Flash) P11 N4 QSPI_CS_N IO H13, K13, P9 RS232_RX I Debug UART (Operates as Bus Master) - Receive Signal RS232_TX O Debug UART (Operates as Bus Master) - Receive Signal N5 SOP[0] I Sense On Power - Line#0 N13 SOP[1] I Sense On Power - Line#1 G13 SOP[2] I Sense On Power - Line#2 P9 SPIA_CLK IO SPI Channel A - Clock E13 SPIA_CS_N IO SPI Channel A - Chip Select C13 SPIA_MISO IO SPI Channel A - Master In Slave Out E14 SPIA_MOSI IO SPI Channel A - Master Out Slave In D13 SPIB_CLK IO SPI Channel B - Clock SPIB_CS_N IO SPI Channel B Chip Select (Instance ID 0) H14, P11 SPIB_CS_N_1 IO SPI Channel B Chip Select (Instance ID 1) G13, J13, P13 SPIB_CS_N_2 IO SPI Channel B Chip Select (Instance ID 2) G13, J13, N12 SPIB_MISO IO SPI Channel B - Master In Slave Out G14, R13 SPIB_MOSI IO SPI Channel B - Master Out Slave In F13, N12 SPI_HOST_INTR O Out of Band Interrupt to an external host communicating over SPI P13 SYNC_IN I Low frequency Synchronization signal input P4 SYNC_OUT O Low Frequency Synchronization Signal output TCK I JTAG Test Clock P10 TDI I JTAG Test Data Input R11 TDO O JTAG Test Data Output N13 TMS I JTAG Test Mode Signal N10 TRACE_CLK O Debug Trace Output - Clock N15 TRACE_CTL O Debug Trace Output - Control N14 F14, R12 G13, J13, K13, P4 Terminal Configuration and Functions Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 ADVANCE INFORMATION QSPI_CLK_EXT N13, N5 21 AWR1642 SWRS203 – MAY 2017 www.ti.com Table 4-2. Signal Descriptions - Digital (continued) SIGNAL NAME PIN TYPE DESCRIPTION BALL NO. ADVANCE INFORMATION TRACE_DATA_0 O Debug Trace Output - Data Line TRACE_DATA_1 O Debug Trace Output - Data Line P5 TRACE_DATA_2 O Debug Trace Output - Data Line R5 TRACE_DATA_3 O Debug Trace Output - Data Line P6 TRACE_DATA_4 O Debug Trace Output - Data Line R7 TRACE_DATA_5 O Debug Trace Output - Data Line P7 TRACE_DATA_6 O Debug Trace Output - Data Line R8 TRACE_DATA_7 O Debug Trace Output - Data Line P8 TRACE_DATA_8 O Debug Trace Output - Data Line D14 TRACE_DATA_9 O Debug Trace Output - Data Line B14 TRACE_DATA_10 O Debug Trace Output - Data Line B15 TRACE_DATA_11 O Debug Trace Output - Data Line C9 TRACE_DATA_12 O Debug Trace Output - Data Line C8 TRACE_DATA_13 O Debug Trace Output - Data Line B9 TRACE_DATA_14 O Debug Trace Output - Data Line B8 TRACE_DATA_15 O Debug Trace Output - Data Line A9 IO Open drain fail safe warm reset signal. Can be driven from PMIC for diagnostic or can be used as status signal that the device is going through reset. N9 WARM_RESET R4 Table 4-3. Signal Descriptions - Analog INTERFACE SIGNAL NAME PIN TYPE DESCRIPTION BALL NO. TX1 O Single ended transmitter1 o/p TX2 O Single ended transmitter2 o/p B6 RX1 I Single ended receiver1 i/p M2 RX2 I Single ended receiver2 i/p K2 RX3 I Single ended receiver3 i/p H2 RX4 I Single ended receiver4 i/p F2 Reset NRESET I Power on reset for chip. Active low R3 Reference Oscillator CLKP I CLKM I Transmitters Receivers Differential input ports for reference crystal Reference clock output from clocking sub system after cleanup PLL (1.8V output voltage swing). C15 D15 Reference clock OSC_CLKOUT Bandgap voltage VBGAP O VDDIN Power 1.2V digital power supply VIN_SRAM Power 1.2V power rail for internal SRAM G15 VNWA Power 1.2V power rail for SRAM array back bias P14 VIOIN Power I/O Supply (3.3V or 1.8V): All CMOS I/Os would operate on this supply VIOIN_18 Power 1.8V supply for CMOS IO R9 VIN_18CLK Power 1.8V supply for clock module B11 VIOIN_18DIFF Power 1.8V supply for LVDS port E15 VPP Power Voltage supply for fuse chain L13 Power supply 22 O B4 A14 B10 Terminal Configuration and Functions H15, N11, P15, R6 R10, R14, F15 Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 Table 4-3. Signal Descriptions - Analog (continued) PIN TYPE SIGNAL NAME DESCRIPTION VIN_13RF1 Power 1.3V Analog and RF supply,VIN_13RF1 and VIN_13RF2 could be shorted on the board VIN_13RF2 Power 1.3V Analog and RF supply C2,D2 VIN_18BB Power 1.8V Analog base band power supply K5, F5 VIN_18VCO Power 1.8V RF VCO supply VSS Ground VSSA Test and Debug output for preproduction phase. Can be pinned out on production hardware for field debug (1) Ground G5, H5, J5 B12 Digital ground L5, L6, L8, L10, K7, K8, K9, K10, K11, J6, J7, J8, J10, H7, H9, H11, G6, G7, G8, G10, F9, F11, E5, E6, E8, E10, E11 Analog ground A1, A3, A5, A7, A15, B1, B3, B5, B7, C1, C3, C4, C5, C6, C7, E1, E2, E3, F3, G1, G2, G3, H3, J1, J2, J3, K3, L1, L2, L3, M3, N1, N2, N3, R1 Power supply Internal LDO output/inputs BALL NO. VOUT_14APLL O A10 VOUT_14SYNTH O A13 VOUT_PA O Analog Test1 / ADC1 IO ADC Channel 1 (1) P1 Analog Test2 / ADC2 IO ADC Channel 2 (1) P2 Analog Test3 / ADC3 IO ADC Channel 3 (1) P3 Analog Test4 / ADC4 IO ADC Channel 4 (1) R2 ANAMUX / ADC5 IO ADC Channel 5 (1) B13 IO (1) C14 VSENSE / ADC6 A2, B2 ADC Channel 6 For details, see Section 6.4.1. Terminal Configuration and Functions Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 23 ADVANCE INFORMATION INTERFACE AWR1642 SWRS203 – MAY 2017 4.4 www.ti.com Pin Multiplexing Table 4-4. Pin Multiplexing (ABL0161 Package) MUXMODE[15:During Power Up] SETTINGS ADDRESS REGISTE R NAME BALL NUMBER During Power Up 0 1 2 4 5 6 7 8 ADVANCE INFORMATION 0xFFFFEA00 P13 GPIO_12 SPI_HOST _INTR 0xFFFFEA04 H13 GPIO_13 GPIO_0 PMIC_CLK OUT 0xFFFFEA08 J13 GPIO_16 GPIO_1 SYNC_OU T 0xFFFFEA0C D13 GPIO_19 SPIA_mosi CAN_FD_r x 0xFFFFEA10 E14 GPIO_20 SPIA_miso CAN_FD_t x 0xFFFFEA14 E13 GPIO_3 SPIA_clk CAN_rx 0xFFFFEA18 C13 GPIO_30 SPIA_cs_n CAN_tx 0xFFFFEA1C F13 GPIO_21 SPIB_mosi I2C_sda 0xFFFFEA20 G14 GPIO_22 SPIB_miso I2C_scl DSS_uart_ tx 0xFFFFEA24 F14 GPIO_5 SPIB_clk MSS_uartb BSS_uart_ CAN_FD_r _tx tx x 0xFFFFEA28 H14 GPIO_4 SPIB_cs_n MSS_uarta _tx 0xFFFFEA2C R13 GPIO_8 QSPI[0] SPIB_miso 0xFFFFEA30 N12 GPIO_9 QSPI[1] SPIB_mosi 0xFFFFEA34 R14 GPIO_10 QSPI[2] CAN_FD_t x 0xFFFFEA38 P12 GPIO_11 QSPI[3] CAN_FD_r x 0xFFFFEA3C R12 GPIO_7 QSPI_clk 0xFFFFEA40 P11 GPIO_6 QSPI_cs_n SPIB_cs_n 0xFFFFEA44 N7 nERROR_I N 0xFFFFEA48 N9 Warm_Res et 0xFFFFEA4C N6 nERROR_ OUT 0xFFFFEA50 P10 GPIO_17 TCK MSS_uartb _tx 0xFFFFEA54 N10 GPIO_18 TMS BSS_uart_ tx 0xFFFFEA58 R11 GPIO_23 TDI MSS_uarta _rx 24 9 10 11 12 13 14 15 SPIB_cs_n _1 MSS_uarta _rx SPIB_clk ePWM1b ePWM2a DMM_MU SPIB_cs_n SPIB_cs_n ePWM1SY X_IN _1 _2 NCI DSS_uart_ tx DSS_uart_ tx MSS_uartb BSS_uart_ QSPI_clk_ CAN_FD_t _tx tx ext x SPIB_cs_n _2 DSS_uart_ tx CAN_FD_t x CAN_FD_r x Terminal Configuration and Functions Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 Table 4-4. Pin Multiplexing (ABL0161 Package) (continued) MUXMODE[15:During Power Up] SETTINGS REGISTE R NAME BALL NUMBER 0xFFFFEA5C N13 0xFFFFEA60 During Power Up SOP[0] 0 1 2 4 5 GPIO_24 TDO N8 GPIO_25 MCU_CLK OUT 0xFFFFEA64 K13 GPIO_26 GPIO_2 0xFFFFEA68 P9 GPIO_27 PMIC_CLK OUT 0xFFFFEA6C P4 GPIO_28 SYNC_IN 0xFFFFEA70 G13 GPIO_29 SYNC_OU T 0xFFFFEA74 N4 GPIO_15 rs232_rx 0xFFFFEA78 N5 GPIO_14 rs232_tx 0xFFFFEA7C R4 TRACE_D GPIO_31 ATA_0 DMM0 0xFFFFEA80 P5 TRACE_D GPIO_32 ATA_1 DMM1 0xFFFFEA84 R5 TRACE_D GPIO_33 ATA_2 DMM2 0xFFFFEA88 P6 TRACE_D GPIO_34 ATA_3 DMM3 ePWM3SY NCO 0xFFFFEA8C R7 TRACE_D GPIO_35 ATA_4 DMM4 ePWM2SY NCO 0xFFFFEA90 P7 TRACE_D GPIO_36 ATA_5 DMM5 MSS_uartb _tx 0xFFFFEA94 R8 TRACE_D GPIO_37 ATA_6 DMM6 BSS_uart_ tx 0xFFFFEA98 P8 TRACE_D GPIO_38 ATA_7 DMM7 DSS_uart_ tx 0xFFFFEA9C D14 TRACE_D GPIO_39 ATA_8 DMM8 CAN_FD_t ePWM1SY x NCI 0xFFFFEAA0 B14 TRACE_D GPIO_40 ATA_9 DMM9 CAN_FD_r ePWM1SY x NCO 0xFFFFEAA4 B15 TRACE_D GPIO_41 ATA_10 DMM10 ePWM3a 0xFFFFEAA8 C9 TRACE_D GPIO_42 ATA_11 DMM11 ePWM3b 0xFFFFEAAC C8 TRACE_D GPIO_43 ATA_12 DMM12 ePWM1a CAN_tx 0xFFFFEAB0 B9 TRACE_D GPIO_44 ATA_13 DMM13 ePWM1b CAN_rx 0xFFFFEAB4 B8 TRACE_D GPIO_45 ATA_14 DMM14 ePWM2a SOP[2] SOP[1] MSS_uarta _tx 6 7 MSS_uartb BSS_uart_ _tx tx 8 9 10 11 12 13 14 15 NDMM_EN ePWM1a OSC_CLK OUT MSS_uartb BSS_uart_ SYNC_OU PMIC_CLK _tx tx T OUT ePWM1b MSS_uartb DMM_MU _rx X_IN ePWM2a SYNC_OU T DMM_MU SPIB_cs_n SPIB_cs_n X_IN _1 _2 MSS_uarta _rx BSS_uart_ MSS_uartb CAN_FD_r I2C_scl tx _rx x MSS_uarta MSS_uartb BSS_uart_ _tx _tx tx ePWM2a ePWM2b CAN_FD_t I2C_sda x ePWM3a ePWM1a ePWM1b NDMM_EN ePWM2a MSS_uarta _tx Terminal Configuration and Functions Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 25 ADVANCE INFORMATION ADDRESS AWR1642 SWRS203 – MAY 2017 www.ti.com Table 4-4. Pin Multiplexing (ABL0161 Package) (continued) MUXMODE[15:During Power Up] SETTINGS ADDRESS REGISTE R NAME BALL NUMBER During Power Up 0 1 2 4 0xFFFFEAB8 A9 TRACE_D GPIO_46 ATA_15 DMM15 0xFFFFEABC N15 TRACE_C GPIO_47 LK DMM_CLK 0xFFFFEAC0 N14 TRACE_C GPIO_48 TL DMM_SYN C 5 6 7 8 9 10 11 12 13 14 15 ePWM2b ADVANCE INFORMATION 26 Terminal Configuration and Functions Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 5 Specifications Absolute Maximum Ratings (1) (2) 5.1 over operating free-air temperature range (unless otherwise noted) MAX 1.2 V digital power supply –0.5 1.4 V VIN_SRAM 1.2 V power rail for internal SRAM –0.5 1.4 V VNWA 1.2 V power rail for SRAM array back bias –0.5 1.4 V VIOIN I/O supply (3.3 V or 1.8 V): All CMOS I/Os would operate on this supply. –0.5 3.8 V VIOIN_18 1.8 V supply for CMOS IO –0.5 2 V VIN_18CLK 1.8 V supply for clock module –0.5 2 V VIOIN_18DIFF 1.8 V supply for LVDS port –0.5 2 V VIN_13RF1 1.3 V Analog and RF supply,VIN_13RF1 and VIN_13RF2 could be shorted on the board. –0.5 1.45 V –0.5 1.45 V –0.5 1.4 V –0.5 1.4 V –0.5 2 V –0.5 2 V –0.3V VIOIN + 0.3 VIN_13RF2 VIN_13RF1 (1-V LDO bypass mode) Device supports mode where external Power Management block can supply 1 V on VIN_13RF1 and VIN_13RF2 rails. In this configuration, the internal LDO of the device would be kept bypassed. VIN_13RF2 (1-V Internal LDO bypass mode) VIN_18BB 1.8-V Analog baseband power supply VIN_18VCO supply 1.8-V RF VCO supply Input and output voltage range Dual-voltage LVCMOS inputs, 3.3 V or 1.8 V (Steady State) Dual-voltage LVCMOS inputs, operated at 3.3 V/1.8 V (Transient Overshoot/Undershoot) UNIT V VIOIN + 20% up to 20% of signal period CLKP, CLKM Input ports for reference crystal –0.5 2 V Clamp current Input or Output Voltages 0.3 V above or below their respective power rails. Limit clamp current that flows through the internal diode protection cells of the I/O. –20 20 mA TJ Operating junction temperature range –40 125 ºC TSTG Storage temperature range after soldered onto PC board –55 150 ºC (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to VSS, unless otherwise noted. (2) 5.2 ESD Ratings VALUE V(ESD) (1) Electrostatic discharge Human-body model (HBM), per AEC Q100-002 (1) ±1000 Charged-device model (CDM), per AEC Q100-011 ±250 V AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 5.3 Power-On Hours (POH) (1) OPERATING CONDITION NOMINAL CVDD VOLTAGE (V) 100% duty cycle (1) UNIT 1.2 JUNCTION TEMPERATURE (Tj) POWER-ON HOURS [POH] (HOURS) –40°C 600 (6%) 75°C 2000 (20%) 95°C 6500 (65%) 125°C 900 (9%) This information is provided solely for your convenience and does not extend or modify the warranty provided under TI's standard terms and conditions for TI semiconductor products. Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 27 ADVANCE INFORMATION MIN VDDIN AWR1642 SWRS203 – MAY 2017 5.4 www.ti.com Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDDIN 1.2 V digital power supply 1.14 1.2 1.32 V VIN_SRAM 1.2 V power rail for internal SRAM 1.14 1.2 1.32 V VNWA 1.2 V power rail for SRAM array back bias 1.14 1.2 1.32 V VIOIN I/O supply (3.3 V or 1.8 V): All CMOS I/Os would operate on this supply. 3.15 3.3 3.45 1.71 1.8 1.89 VIOIN_18 1.8 V supply for CMOS IO 1.71 1.8 1.9 V VIN_18CLK 1.8 V supply for clock module 1.71 1.8 1.9 V VIOIN_18DIFF 1.8 V supply for LVDS port 1.71 1.8 1.9 V VIN_13RF1 1.3 V Analog and RF supply. VIN_13RF1 and VIN_13RF2 could be shorted on the board 1.23 1.3 1.36 V 1.23 1.3 1.36 V 0.95 1 1.05 V 0.95 1 1.05 V VIN_13RF2 VIN_13RF1 (1-V Internal LDO bypass mode) ADVANCE INFORMATION Device supports mode where external Power Management block can supply 1 V on VIN_13RF1 and VIN_13RF2 rails. In this configuration, the internal LDO of the device would be kept bypassed. VIN_13RF2 (1-V Internal LDO bypass mode) V VIN18BB 1.8-V Analog baseband power supply 1.71 1.8 1.9 V VIN_18VCO 1.8V RF VCO supply 1.71 1.8 1.9 V Voltage Input High (1.8 V mode) 1.17 Voltage Input High (3.3 V mode) 2.25 VIH VIL Voltage Input Low (1.8 V mode) 0.63 Voltage Input Low (3.3 V mode) 0.8 VOH High-level output threshold (IOH = 6 mA) VOL Low-level output threshold (IOL = 6 mA) CLKP,CLKM 5.5 V 85%*VIOIN mV 350 Voltage Input High 0.96 Voltage Input Low V 0.24 mV V Power Supply Specifications Table 5-1 describes the four rails from an external power supply block of the AWR1642 device. Table 5-1. Power Supply Rails Characteristics SUPPLY DEVICE BLOCKS POWERED FROM THE SUPPLY RELEVANT IOS IN THE DEVICE 1.8 V Synthesizer and APLL VCOs, crystal oscillator, IF Amplifier stages, ADC, LVDS Input: VIN_18VCO, VIN18CLK, VIN_18BB, VIOIN_18DIFF, VIOIN_18IO LDO Output: VOUT_14SYNTH, VOUT_14APLL 1.3 V (or 1 V in internal LDO bypass mode) Power Amplifier, Low Noise Amplifier, Mixers and LO Distribution Input: VIN_13RF2, VIN_13RF1 LDO Output: VOUT_PA 3.3 V (or 1.8 V for 1.8 V I/O mode) Digital I/Os Input VIOIN 1.2 V Core Digital and SRAMs Input: VDDIN, VIN_SRAM 28 Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 Table 5-2 lists tolerable ripple specifications for 1.3-V (1.0-V) and 1.8-V supply rails. Table 5-2. Ripple Specifications RF RAIL 5.6 VCO/IF RAIL FREQUENCY (kHz) 1.0 V (INTERNAL LDO BYPASS) (µVRMS) 1.3 V (µVRMS) 1.8 V (µVRMS) 137.5 7.76 648.73 83.41 275 5.83 76.48 21.27 550 3.44 22.74 11.43 1100 2.53 4.05 6.73 2200 11.29 82.44 13.39 4200 13.65 93.35 19.70 6600 22.91 117.78 29.63 Power Consumption Summary Table 5-3. Maximum Current Ratings at Power Terminals PARAMETER Current consumption SUPPLY NAME DESCRIPTION MIN TYP MAX VDDIN, VIN_SRAM, VNWA Total current drawn by all nodes driven by 1.2V rail 1000 VIN_13RF1, VIN_13RF2 Total current drawn by all nodes driven by 1.3V rail 2000 VIOIN_18, VIN_18CLK, VIOIN_18DIFF, VIN_18BB, VIN_18VCO Total current drawn by all nodes driven by 1.8V rail 850 VIOIN Total current drawn by all nodes driven by 3.3V rail 50 UNIT mA Table 5-4. Average Power Consumption at Power Terminals PARAMETER Average power consumption CONDITION DESCRIPTION 1.0-V internal LDO bypass mode 1TX, 4RX 1.3-V internal LDO enabled mode 1TX, 4RX 2TX, 4RX 2TX, 4RX Sampling: 3.2 MSps complex Transceiver, 25-ms frame time, 256 Chirps, 128 Samples/chirp, 8-μs interchirp time (50 duty cycle), DSP active MIN TYP MAX 1.91 2.05 2.1 Submit Documentation Feedback Product Folder Links: AWR1642 W 2.27 Specifications Copyright © 2017, Texas Instruments Incorporated UNIT 29 ADVANCE INFORMATION Table 5-3 and Table 5-4 summarize the power consumption at the power terminals. AWR1642 SWRS203 – MAY 2017 5.7 www.ti.com RF Specification over recommended operating conditions (unless otherwise noted) PARAMETER MIN Noise figure Receiver TYP 76 to 77 GHz 15 77 to 81 GHz 16 –5 dBm 48 dB Gain range 24 dB Gain step size 2 dB IQ gain mismatch 1 dB IQ phase mismatch 2 A2D sampling rate (complex) degree 5 MHz 12.5 Msps 6.25 Msps A2D resolution 12 Bits Output power 12 dBm –145 76 dBc/Hz 81 Ramp rate GHz 100 MHz/µs Phase noise at 1-MHz offset 76 to 77 GHz –94 77 to 81 GHz –91 dBc/Hz The analog IF stages include high-pass filtering, with two independently configurable first-order high-pass corner frequencies. The set of available HPF corners is summarized as follows: Available HPF Corner Frequencies (kHz) HPF1 175, 235, 350, 700 HPF2 350, 700, 1400, 2800 The filtering performed by the baseband chain is targeted to provide: • Less than ±0.5 dB pass-band ripple/droop, and • Better than 60 dB anti-aliasing attenuation for any frequency that can alias back into the pass-band. 15.6 15.3 -20 NF (db) IB P1db (dBm) -24 15 -28 14.7 -32 14.4 -36 14.1 -40 13.8 -44 13.5 24 26 28 30 32 34 36 38 RX Gain (dB) 40 42 44 46 IB P1dB (dBm) Figure 5-1 shows variations of noise figure and in-band P1dB parameters with respect to receiver gain programmed. NF (dB) ADVANCE INFORMATION Amplitude noise Frequency range (1) dB Maximum gain step A2D sampling rate (real) Clock subsystem UNIT 1-dB compression point IF bandwidth (1) Transmitter MAX -48 48 Figure 5-1. Noise Figure, In-band P1dB vs Receiver Gain 30 Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com 5.8 SWRS203 – MAY 2017 CPU Specifications over recommended operating conditions (unless otherwise noted) PARAMETER DSP Subsystem (C674 Family) Master Controller Subsystem (R4F Family) Shared Memory MIN Clock Speed TYP MAX 600 MHz L1 Code Memory 32 KB L1 Data Memory 32 KB L2 Memory 256 KB Clock Speed 200 MHz Tightly Couple Memory - A (Program) 256 KB Tightly Coupled Memory - B (Data) 192 KB Shared L3 Memory 768 KB Thermal Resistance Characteristics for FCBGA Package [ABL0161] (1) THERMAL METRICS (2) °C/W (3) RΘJC Junction-to-case 4.92 RΘJB Junction-to-board 6.57 RΘJA Junction-to-free air 22.3 RΘJMA Junction-to-moving air PsiJT Junction-to-package top 4.92 PsiJB Junction-to-board 6.4 (4) ADVANCE INFORMATION 5.9 (1) (2) (3) (4) UNIT N/A (1) N/A = not applicable For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics. °C/W = degrees Celsius per watt. These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements A junction temperature of 125ºC is assumed. Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 31 AWR1642 SWRS203 – MAY 2017 www.ti.com 5.10 Timing and Switching Characteristics 5.10.1 Power Supply Sequencing and Reset Timing The AWR1642 device expects all external voltage rails to be stable before reset is deasserted. Figure 5-2 describes the device wake-up sequence. PMIC_OUT, SYNC_OUT, TDO 001 (Functional) CAN BE CHANGED. (VIOIN) Includes ramping of VIOIN_18 (VIOIN_18DIFF) (VDDIN) Includes ramping of all other supplies VIN_18BB, VIN_18CLK, VIN_13RF*,VIOIN_18DIFF (VIN_*) 3mS (NRESET) MCU_CLK_OUT (1) External Signals ADVANCE INFORMATION (1) MCU_CLK_OUT in autonomous mode, where AWR1642 application is booted from the serial flash, MCU_CLK_OUT is not enabled by default by the device bootloader. PORZ_1P8V PORZ_TOP/ GEN_TOP FUSE_SHIFT_EN Controls HHV of IO Reset Control to Top Digital and Analog ~400 cycles EFC_READY XTAL_DET_STAT XTAL_EN/ SLICER_EN XTAL STATUS 1 if XTAL FOUND/ ‘0’ if EXTERNAL CLK is FORCED Reference Clock Stabilization time ~5mS SLICER_REF_CLK (CLKP+CLKM thru’ SLICER) CPU_CLK CPU CLK is REF CLK if STATUS is 1 ELSE INT_RCOSC_CLK if STATUS is 0 1 IF REF CLK is NOT PRESENT LIMP_MODE_STATUS PORZ_CPU/ PORZ_DIG/ GEN_ANA Reset Control to Digital Processor and Analog/RF Internal Signals Mentioned for reference only *Names are representative Wake Up Done Figure 5-2. Device Wake-up Sequence 32 Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 5.10.2 Input Clocks and Oscillators 5.10.2.1 Clock Specifications The AWR1642 requires external clock source (that is, a 40-MHz crystal) for initial boot and as a reference for an internal APLL hosted in the device. An external crystal is connected to the device pins. Figure 5-3 shows the crystal implementation. Cf1 XTALP Cp 40 / 50 MHz XTALM Cf2 NOTE The load capacitors, Cf1 and Cf2 in Figure 5-3, should be chosen such that Equation 1 is satisfied. CL in the equation is the load specified by the crystal manufacturer. All discrete components used to implement the oscillator circuit should be placed as close as possible to the associated oscillator CLKP and CLKM pins. C L = C f1 ´ C f2 C f1 + C f 2 +CP (1) Table 5-5 lists the electrical characteristics of the clock crystal. Table 5-5. Crystal Electrical Characteristics NAME DESCRIPTION fP Parallel resonance crystal frequency CL Crystal load capacitance ESR Crystal ESR MIN TYP MAX 40, 50 5 UNIT MHz 8 12 pF 50 Ω Temperature range Expected temperature range of operation –40 150 ºC Frequency tolerance –50 50 ppm 200 µW Crystal frequency tolerance (1) (2) Drive level (1) (2) 50 The crystal manufacturer's specification must satisfy this requirement. Includes initial tolerance of the crystal, drift over temperature, aging and frequency pulling due to incorrect load capacitance. Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 33 ADVANCE INFORMATION Figure 5-3. Crystal Implementation AWR1642 SWRS203 – MAY 2017 www.ti.com 5.10.3 Multibuffered / Standard Serial Peripheral Interface (MibSPI) 5.10.3.1 Peripheral Description The MibSPI/SPI is a high-speed synchronous serial input/output port that allows a serial bit stream of programmed length (2 to 16 bits) to be shifted into and out of the device at a programmed bit-transfer rate. The MibSPI/SPI is normally used for communication between the microcontroller and external peripherals or another microcontroller. Standard and MibSPI modules have the following features: • 16-bit shift register • Receive buffer register • 8-bit baud clock generator • SPICLK can be internally-generated (master mode) or received from an external clock source (slave mode) • Each word transferred can have a unique format. • SPI I/Os not used in the communication can be used as digital input/output signals ADVANCE INFORMATION 5.10.3.2 MibSPI Transmit and Receive RAM Organization The Multibuffer RAM is comprised of 256 buffers. Each entry in the Multibuffer RAM consists of 4 parts: a 16-bit transmit field, a 16-bit receive field, a 16-bit control field and a 16-bit status field. The Multibuffer RAM can be partitioned into multiple transfer group with variable number of buffers each. Table 5-7 to Table 5-10 assume the operating conditions stated in Table 5-6. Table 5-6. SPI Timing Conditions MIN TYP MAX UNIT Input Conditions tR Input rise time 1 3 ns tF Input fall time 1 3 ns 2 15 pF Output Conditions CLOAD 34 Output load capacitance Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 Table 5-7. SPI Master Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input) (1) (2) (3) 1 2 (4) 3 (4) 4 (4) 5 (4) PARAMETER tc(SPC)M Cycle time, SPICLK (4) tw(SPCH)M 6 (1) (2) (3) (4) (5) MAX 256tc(VCLK) Pulse duration, SPICLK high (clock polarity = 0) 0.5tc(SPC)M – 4 0.5tc(SPC)M + 4 tw(SPCL)M Pulse duration, SPICLK low (clock polarity = 1) 0.5tc(SPC)M – 4 0.5tc(SPC)M + 4 tw(SPCL)M Pulse duration, SPICLK low (clock polarity = 0) 0.5tc(SPC)M – 4 0.5tc(SPC)M + 4 tw(SPCH)M Pulse duration, SPICLK high (clock polarity = 1) 0.5tc(SPC)M – 4 0.5tc(SPC)M + 4 td(SPCH-SIMO)M Delay time, SPISIMO valid before SPICLK low, (clock polarity = 0) 0.5tc(SPC)M – 3 td(SPCL-SIMO)M Delay time, SPISIMO valid before SPICLK high, (clock polarity = 1) 0.5tc(SPC)M – 3 tv(SPCL-SIMO)M Valid time, SPISIMO data valid after SPICLK low, (clock polarity = 0) 0.5tc(SPC)M – 10.5 tv(SPCH-SIMO)M Valid time, SPISIMO data valid after SPICLK high, (clock polarity = 1) 0.5tc(SPC)M – 10.5 (C2TDELAY+2) * tc(VCLK) + 7 CSHOLD = 1 (C2TDELAY +3) * tc(VCLK) – 7.5 (C2TDELAY+3) * tc(VCLK) + 7 CSHOLD = 0 (C2TDELAY+2)*tc(VCLK ) – 7.5 (C2TDELAY+2) * tc(VCLK) + 7 CSHOLD = 1 (C2TDELAY +3) * tc(VCLK) – 7.5 (C2TDELAY+3) * tc(VCLK) + 7 Hold time, SPICLK low until CS inactive (clock polarity = 0) 0.5*tc(SPC)M + (T2CDELAY + 1) *tc(VCLK) – 7 0.5*tc(SPC)M + (T2CDELAY + 1) * tc(VCLK) + 7.5 Hold time, SPICLK high until CS inactive (clock polarity = 1) 0.5*tc(SPC)M + (T2CDELAY + 1) *tc(VCLK) – 7 0.5*tc(SPC)M + (T2CDELAY + 1) * tc(VCLK) + 7.5 tT2CDELAY ns ns ns ns (C2TDELAY+2)*tc(VCLK ) – 7.5 tC2TDELAY UNIT ns CSHOLD = 0 Setup time CS active until SPICLK low (clock polarity = 1) 7 (5) TYP 25 Setup time CS active until SPICLK high (clock polarity = 0) (5) MIN ns ns The MASTER bit (SPIGCRx.0) is set and the CLOCK PHASE bit (SPIFMTx.16) is cleared ( where x= 0 or 1). tc(MSS_VCLK) = master subsystem clock time = 1 / f(MSS_VCLK). For more details, please refer to the Technical Reference Manual. When the SPI is in Master mode, the following must be true: For PS values from 1 to 255: tc(SPC)M ≥ (PS +1)tc(MSS_VCLK) ≥ 25ns, where PS is the prescale value set in the SPIFMTx.[15:8] register bits. For PS values of 0: tc(SPC)M = 2tc(MSS_VCLK) ≥ 25ns. The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPIFMTx.17). C2TDELAY and T2CDELAY is programmed in the SPIDELAY register Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 35 ADVANCE INFORMATION NO. AWR1642 SWRS203 – MAY 2017 www.ti.com Table 5-8. SPI Master Mode Input Timing Requirements (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input) (1) NO. 8 9 (1) (2) MIN tsu(SOMI-SPCL)M Setup time, SPISOMI before SPICLK low (clock polarity = 0) 5 tsu(SOMI-SPCH)M Setup time, SPISOMI before SPICLK high (clock polarity = 1) 5 th(SPCL-SOMI)M Hold time, SPISOMI data valid after SPICLK low (clock polarity = 0) 3 th(SPCH-SOMI)M Hold time, SPISOMI data valid after SPICLK high (clock polarity = 1) 3 (2) (2) TYP MAX UNIT ns ns The MASTER bit (SPIGCR1.0) is set and the CLOCK PHASE bit (SPIFMTx.16) is cleared. The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPIFMTx.17). 1 SPICLK (clock polarity = 0) 2 1 ADVANCE INFORMATION 3 SPICLK (clock polarity = 1 5 4 Master Out Data Is Valid SPISIMO 1 8 9 Master In Data Must Be Valid SPISOMI Figure 5-4. SPI Master Mode External Timing (CLOCK PHASE = 0) Write to buffer SPICLK (clock polarity=0) SPICLK (clock polarity=1) SPISIMO Master Out Data Is Valid 6 7 SPICSn Figure 5-5. SPI Master Mode Chip Select Timing (CLOCK PHASE = 0) 36 Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 Table 5-9. SPI Master Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input) (1) (2) (3) 1 2 (4) 3 (4) 4 (4) 5 (4) PARAMETER tc(SPC)M Cycle time, SPICLK (4) tw(SPCH)M MIN Pulse duration, SPICLK high (clock polarity = 0) 0.5tc(SPC)M – 4 0.5tc(SPC)M + 4 tw(SPCL)M Pulse duration, SPICLK low (clock polarity = 1) 0.5tc(SPC)M – 4 0.5tc(SPC)M + 4 tw(SPCL)M Pulse duration, SPICLK low (clock polarity = 0) 0.5tc(SPC)M – 4 0.5tc(SPC)M + 4 tw(SPCH)M Pulse duration, SPICLK high (clock polarity = 1) 0.5tc(SPC)M – 4 0.5tc(SPC)M + 4 td(SPCH-SIMO)M Delay time, SPISIMO valid before SPICLK low, (clock polarity = 0) 0.5tc(SPC)M – 3 td(SPCL-SIMO)M Delay time, SPISIMO valid before SPICLK high, (clock polarity = 1) 0.5tc(SPC)M – 3 tv(SPCL-SIMO)M Valid time, SPISIMO data valid after SPICLK low, (clock polarity = 0) 0.5tc(SPC)M – 10.5 tv(SPCH-SIMO)M Valid time, SPISIMO data valid after SPICLK high, (clock polarity = 1) 0.5tc(SPC)M – 10.5 7 0.5*tc(SPC)M + (C2TDELAY+2) * tc(VCLK) + 7.5 CSHOLD = 1 0.5*tc(SPC)M + (C2TDELAY + 2)*tc(VCLK) – 7 0.5*tc(SPC)M + (C2TDELAY+2) * tc(VCLK) + 7.5 CSHOLD = 0 0.5*tc(SPC)M + (C2TDELAY+2)*tc( VCLK) – 7 0.5*tc(SPC)M + (C2TDELAY+2) * tc(VCLK) + 7.5 CSHOLD = 1 0.5*tc(SPC)M + (C2TDELAY+3)*tc( VCLK) – 7 0.5*tc(SPC)M + (C2TDELAY+3) * tc(VCLK) + 7.5 Hold time, SPICLK low until CS inactive (clock polarity = 0) (T2CDELAY + 1) *tc(VCLK) – 7.5 (T2CDELAY + 1) *tc(VCLK) + 7 Hold time, SPICLK high until CS inactive (clock polarity = 1) (T2CDELAY + 1) *tc(VCLK) – 7.5 (T2CDELAY + 1) *tc(VCLK) + 7 (1) (2) (3) (4) (5) tT2CDELAY ns ns ns ns 0.5*tc(SPC)M + (C2TDELAY + 2)*tc(VCLK) – 7 tC2TDELAY UNIT ns CSHOLD = 0 Setup time CS active until SPICLK low (clock polarity = 1) (5) MAX 256tc(VCLK) Setup time CS active until SPICLK high (clock polarity = 0) 6 (5) TYP 25 ns ns The MASTER bit (SPIGCRx.0) is set and the CLOCK PHASE bit (SPIFMTx.16) is set ( where x = 0 or 1 ). tc(MSS_VCLK) = master subsystem clock time = 1 / f(MSS_VCLK). For more details, please refer to the Technical Reference Manual. When the SPI is in Master mode, the following must be true: For PS values from 1 to 255: tc(SPC)M ≥ (PS +1)tc(MSS_VCLK) ≥ 25 ns, where PS is the prescale value set in the SPIFMTx.[15:8] register bits. For PS values of 0: tc(SPC)M = 2tc(MSS_VCLK) ≥ 25 ns. The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPIFMTx.17). C2TDELAY and T2CDELAY is programmed in the SPIDELAY register Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 37 ADVANCE INFORMATION NO. AWR1642 SWRS203 – MAY 2017 www.ti.com Table 5-10. SPI Master Mode Input Requirements (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input) (1) NO. 8 9 (1) (2) MIN tsu(SOMI-SPCL)M Setup time, SPISOMI before SPICLK low (clock polarity = 0) 5 tsu(SOMI-SPCH)M Setup time, SPISOMI before SPICLK high (clock polarity = 1) 5 th(SPCL-SOMI)M Hold time, SPISOMI data valid after SPICLK low (clock polarity = 0) 3 th(SPCH-SOMI)M Hold time, SPISOMI data valid after SPICLK high (clock polarity = 1) 3 (2) (2) TYP MAX UNIT ns ns The MASTER bit (SPIGCR1.0) is set and the CLOCK PHASE bit (SPIFMTx.16) is set. The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPIFMTx.17). 1 SPICLK (clock polarity = 0) 2 ADVANCE INFORMATION 3 SPICLK (clock polarity = 1) 5 4 Master Out Data Is Valid SPISIMO 8 Data Valid 9 Master In Data Must Be Valid SPISOMI Figure 5-6. SPI Master Mode External Timing (CLOCK PHASE = 1) Write to buffer SPICLK (clock polarity=0) SPICLK (clock polarity=1) SPISIMO Master Out Data Is Valid 6 7 SPICSn Figure 5-7. SPI Master Mode Chip Select Timing (CLOCK PHASE = 1) 38 Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 5.10.3.3 SPI Slave Mode I/O Timings Table 5-11. SPI Slave Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output) (1) (2) (3) 1 2 (5) 3 (5) 4 5 (1) (2) (3) (4) (5) PARAMETER MIN TYP MAX tc(SPC)S Cycle time, SPICLK (4) 25 tw(SPCH)S Pulse duration, SPICLK high (clock polarity = 0) 10 tw(SPCL)S Pulse duration, SPICLK low (clock polarity = 1) 10 tw(SPCL)S Pulse duration, SPICLK low (clock polarity = 0) 10 tw(SPCH)S Pulse duration, SPICLK high (clock polarity = 1) 10 td(SPCH-SOMI)S Delay time, SPISOMI valid after SPICLK high (clock polarity = 0) 10 td(SPCL-SOMI)S Delay time, SPISOMI valid after SPICLK low (clock polarity = 1) 10 th(SPCH-SOMI)S Hold time, SPISOMI data valid after SPICLK high (clock polarity = 0) 2 th(SPCL-SOMI)S Hold time, SPISOMI data valid after SPICLK low (clock polarity = 1) 2 (5) (5) UNIT ns ns ns ns ns The MASTER bit (SPIGCRx.0) is cleared ( where x = 0 or 1 ). The CLOCK PHASE bit (SPIFMTx.16) is either cleared or set for CLOCK PHASE = 0 or CLOCK PHASE = 1 respectively. tc(MSS_VCLK) = master subsystem clock time = 1 / f(MSS_VCLK). For more details, please refer to the Technical Reference Manual. When the SPI is in Slave mode, the following must be true: For PS values from 1 to 255: tc(SPC)S ≥ (PS +1)tc(MSS_VCLK) ≥ 25 ns, where PS is the prescale value set in the SPIFMTx.[15:8] register bits.For PS values of 0: tc(SPC)S = 2tc(MSS_VCLK) ≥ 25 ns. The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPIFMTx.17). Table 5-12. SPI Slave Mode Timing Requirements (SPICLK = input, SPISIMO = input, and SPISOMI = output) NO. 6 (1) 7 (1) (1) MIN tsu(SIMO-SPCL)S Setup time, SPISIMO before SPICLK low (clock polarity = 0) 3 tsu(SIMO-SPCH)S Setup time, SPISIMO before SPICLK high (clock polarity = 1) 3 th(SPCL-SIMO)S Hold time, SPISIMO data valid after SPICLK low (clock polarity = 0) 0 th(SPCL-SIMO)S Hold time, SPISIMO data valid after SPICLK low (clock polarity = 0) 0 TYP MAX UNIT ns ns The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPIFMTx.17). Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 39 ADVANCE INFORMATION NO. AWR1642 SWRS203 – MAY 2017 www.ti.com 1 SPICLK (clock polarity = 0) 2 3 SPICLK (clock polarity = 1) 5 4 SPISOMI SPISOMI Data Is Valid 6 ADVANCE INFORMATION 7 SPISIMO Data Must Be Valid SPISIMO Figure 5-8. SPI Slave Mode External Timing (CLOCK PHASE = 0) 1 SPICLK (clock polarity = 0) 2 3 SPICLK (clock polarity = 1) 4 5 SPISOMI SPISOMI Data Is Valid 6 7 SPISIMO SPISIMO Data Must Be Valid Figure 5-9. SPI Slave Mode External Timing (CLOCK PHASE = 1) 40 Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 5.10.3.4 Typical Interface Protocol Diagram (Slave Mode) 1. Host should ensure that there is a delay of two SPI clocks between CS going low and start of SPI clock. 2. Host should ensure that CS is toggled for every 16 bits of transfer through SPI. Figure 5-10 shows the SPI communication timing of the typical interface protocol. 2 SPI clocks CS CLK 0x1234 0x4321 CRC 0x5678 0x8765 MOSI 16 bytes 0xDCBA 0xABCD CRC MISO IRQ ADVANCE INFORMATION Figure 5-10. SPI Communication Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 41 AWR1642 SWRS203 – MAY 2017 www.ti.com 5.10.4 LVDS Interface Configuration The AWR1642 supports four differential LVDS IOs/Lanes. The lane configuration supported is two Data lanes (LVDS_TXP/M), one Bit Clock lane (LVDS_CLKP/M) and one Frame clock lane (LVDS_FRCLKP/M). The LVDS interface supports the following data rates: • 900 Mbps (450 MHz DDR Clock) • 600 Mbps (300 MHz DDR Clock) • 450 Mbps (225 MHz DDR Clock) • 400 Mbps (200 MHz DDR Clock) • 300 Mbps (150 MHz DDR Clock) • 225 Mbps (112.5 MHz DDR Clock) • 150 Mbps (75 MHz DDR Clock) Note that the bit clock is in DDR format and hence the numbers of toggles in the clock is equivalent to data. ADVANCE INFORMATION LVDS_TXP/M LVDS_FRCLKP/M Data bitwidth LVDS_CLKP/M Figure 5-11. LVDS Interface Lane Configuration And Relative Timings 5.10.4.1 LVDS Interface Timings LVDS_CLK twH1 twL1 twH2 twL2 Calculation showing tw parameters: Freq = 900MHz, Period = 1.11ns At 50% twH1/twL1 = 1.11ns/2 = 0.55ns Rise time = Fall time = 200ps (as per LVDS IO spec @1pF load) twH2/twL2 = (1.11ns-2*200ps)/2 = 0.35ns 200ps LVDS_CLK LVDS_TXP/M LVDS_FRCLKP/M Clock Jitter = 6sigma = 60ps 200ps 200ps 1100ps Figure 5-12. Timing Parameters 42 Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 Table 5-13. LVDS Electrical Characteristics PARAMETER TEST CONDITIONS MIN TYP twH1 / twL1 0.55 twH2 / twL2 0.35 Duty Cycle Requirements max 1 pF lumped capacitive load on LVDS lanes 48% VOH UNIT ns ns 52% 1475 VOL Output Differential Voltage MAX 925 peak-to-peak single-ended with 100 Ω resistive load between differential pairs mV mV 250 450 1125 1275 mV ADVANCE INFORMATION Output Offset Voltage mV Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 43 AWR1642 SWRS203 – MAY 2017 www.ti.com 5.10.5 General-Purpose Input/Output Table 5-14 lists the switching characteristics of output timing relative to load capacitance. Table 5-14. Switching Characteristics for Output Timing versus Load Capacitance (CL) (1) (2) PARAMETER tr TEST CONDITIONS Max rise time Slew control = 0 tf tr Max fall time Max rise time Slew control = 1 tf ADVANCE INFORMATION (1) (2) 44 Max fall time VIOIN = 1.8V VIOIN = 3.3V CL = 20 pF 2.878 3.013 CL = 50 pF 6.446 6.947 CL = 75 pF 9.43 10.249 CL = 20 pF 2.827 2.883 CL = 50 pF 6.442 6.687 CL = 75 pF 9.439 9.873 CL = 20 pF 3.307 3.389 CL = 50 pF 6.77 7.277 CL = 75 pF 9.695 10.57 CL = 20 pF 3.128 3.128 CL = 50 pF 6.656 6.656 CL = 75 pF 9.605 9.605 UNIT ns ns ns ns Slew control, which is configured by PADxx_CFG_REG, changes behavior of the output driver (faster or slower output slew rate). The rise/fall time is measured as the time taken by the signal to transition from 10% and 90% of VIOIN voltage. Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 5.10.6 Controller Area Network Interface (DCAN) The DCAN supports the CAN 2.0B protocol standard and uses a serial, multimaster communication protocol that efficiently supports distributed real-time control with robust communication rates of up to 1 Mbps. The DCAN is ideal for applications operating in noisy and harsh environments that require reliable serial communication or multiplexed wiring. ADVANCE INFORMATION The DCAN has the following features: • Supports CAN protocol version 2.0 part A, B • Bit rates up to 1 Mbps • Configurable Message objects • Individual identifier masks for each message object • Programmable FIFO mode for message objects • Suspend mode for debug support • Programmable loop-back modes for self-test operation • Direct access to Message RAM in test mode • Supports two interrupt lines - Level 0 and Level 1 • Automatic Message RAM initialization Table 5-15. Dynamic Characteristics for the DCANx TX and RX Pins PARAMETER MIN TYP MAX UNIT td(CAN_tx) Delay time, transmit shift register to CAN_tx pin (1) 15 ns td(CAN_rx) Delay time, CAN_rx pin to receive shift register (1) 10 ns (1) These values do not include rise/fall times of the output buffer. Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 45 AWR1642 SWRS203 – MAY 2017 www.ti.com 5.10.7 Controller Area Network - Flexible Data-rate (CAN-FD) The CAN-FD module supports both classic CAN and CAN FD (CAN with Flexible Data-Rate) specifications. CAN FD feature allows high throughput and increased payload per data frame. The classic CAN and CAN FD devices can coexist on the same network without any conflict. ADVANCE INFORMATION The CAN-FD has the following features: • Conforms with CAN Protocol 2.0 A, B and ISO 11898-1 • Full CAN FD support (up to 64 data bytes per frame) • AUTOSAR and SAE J1939 support • Up to 32 dedicated Transmit Buffers • Configurable Transmit FIFO, up to 32 elements • Configurable Transmit Queue, up to 32 elements • Configurable Transmit Event FIFO, up to 32 elements • Up to 64 dedicated Receive Buffers • Two configurable Receive FIFOs, up to 64 elements each • Up to 128 11-bit filter elements • Internal Loopback mode for self-test • Mask-able interrupts, two interrupt lines • Two clock domains (CAN clock / Host clock) • Parity / ECC support - Message RAM single error correction and double error detection (SECDED) mechanism • Full Message Memory capacity (4352 words). Table 5-16. Dynamic Characteristics for the DCANx TX and RX Pins PARAMETER MIN TYP MAX UNIT td(CAN_FD_tx) Delay time, transmit shift register to CAN_FD_tx pin (1) 15 ns td(CAN_FD_rx) Delay time, CAN_FD_rx pin to receive shift register (1) 10 ns MAX UNIT (1) These values do not include rise/fall times of the output buffer. 5.10.8 Serial Communication Interface (SCI) The SCI has the following features: • Standard universal asynchronous receiver-transmitter (UART) communication • Standard non-return to zero (NRZ) format • Double-buffered receive and transmit functions • Asynchronous or iso-synchronous communication modes with no CLK pin • Capability to use Direct Memory Access (DMA) for transmit and receive data • Two external pins: RS232_RX and RS232_TX Table 5-17. SCI Timing Requirements MIN f(baud) 46 Supported baud rate at 20 pF TYP 921.6 Specifications kHz Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 5.10.9 Inter-Integrated Circuit Interface (I2C) The I2C has the following features: • Compliance to the Philips I2C bus specification, v2.1 (The I2C Specification, Philips document number 9398 393 40011) – Bit/Byte format transfer – 7-bit and 10-bit device addressing modes – General call – START byte – Multi-master transmitter/ slave receiver mode – Multi-master receiver/ slave transmitter mode – Combined master transmit/receive and receive/transmit mode – Transfer rates of 100 kbps up to 400 kbps (Phillips fast-mode rate) • Free data format • Two DMA events (transmit and receive) • DMA event enable/disable capability • Module enable/disable capability • The SDA and SCL are optionally configurable as general purpose I/O • Slew rate control of the outputs • Open drain control of the outputs • Programmable pullup/pulldown capability on the inputs • Supports Ignore NACK mode NOTE This I2C module does not support: • High-speed (HS) mode • C-bus compatibility mode • The combined format in 10-bit address mode (the I2C sends the slave address second byte every time it sends the slave address first byte) Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 47 ADVANCE INFORMATION The inter-integrated circuit (I2C) module is a multimaster communication module providing an interface between devices compliant with Philips Semiconductor I2C-bus specification version 2.1 and connected by an I2C-bus™. This module will support any slave or master I2C compatible device. AWR1642 SWRS203 – MAY 2017 www.ti.com Table 5-18. I2C Timing Requirements (1) STANDARD MODE MIN FAST MODE MAX MIN MAX UNIT tc(SCL) Cycle time, SCL 10 2.5 μs tsu(SCLH-SDAL) Setup time, SCL high before SDA low (for a repeated START condition) 4.7 0.6 μs th(SCLL-SDAL) Hold time, SCL low after SDA low (for a START and a repeated START condition) 4 0.6 μs tw(SCLL) Pulse duration, SCL low 4.7 1.3 μs tw(SCLH) Pulse duration, SCL high 4 0.6 μs tsu(SDA-SCLH) Setup time, SDA valid before SCL high th(SCLL-SDA) Hold time, SDA valid after SCL low tw(SDAH) Pulse duration, SDA high between STOP and START conditions tsu(SCLH-SDAH) Setup time, SCL high before SDA high (for STOP condition) tw(SP) Pulse duration, spike (must be suppressed) ADVANCE INFORMATION Cb (1) (2) (3) (2) (3) 250 0 100 3.45 (1) 0 μs 0.9 μs 4.7 1.3 μs 4 0.6 μs 0 Capacitive load for each bus line 400 50 ns 400 pF The I2C pins SDA and SCL do not feature fail-safe I/O buffers. These pins could potentially draw current when the device is powered down. The maximum th(SDA-SCLL) for I2C bus devices has only to be met if the device does not stretch the low period (tw(SCLL)) of the SCL signal. Cb = total capacitance of one bus line in pF. If mixed with fast-mode devices, faster fall-times are allowed. SDA tw(SDAH) tsu(SDA-SCLH) tw(SCLL) tw(SP) tsu(SCLH-SDAH) tw(SCLH) tr(SCL) SCL tc(SCL) tf(SCL) th(SCLL-SDAL) th(SDA-SCLL) tsu(SCLH-SDAL) th(SCLL-SDAL) Stop Start Repeated Start Stop Figure 5-13. I2C Timing Diagram NOTE • • 48 A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge the undefined region of the falling edge of SCL. The maximum th(SDA-SCLL) has only to be met if the device does not stretch the LOW period (tw(SCLL)) of the SCL signal. E.A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement tsu(SDA-SCLH) ≥ 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line tr max + tsu(SDA-SCLH). Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 5.10.10 Quad Serial Peripheral Interface (QSPI) The quad serial peripheral interface (QSPI™) module is a kind of SPI module that allows single, dual, or quad read access to external SPI devices. This module has a memory mapped register interface, which provides a direct interface for accessing data from external SPI devices and thus simplifying software requirements. The QSPI works as a master only. The QSPI in the device is primarily intended for fast booting from quad-SPI flash memories. The QSPI supports the following features: • Programmable clock divider • Six-pin interface • Programmable length (from 1 to 128 bits) of the words transferred • Programmable number (from 1 to 4096) of the words transferred • Support for 3-, 4-, or 6-pin SPI interface • Optional interrupt generation on word or frame (number of words) completion • Programmable delay between chip select activation and output data from 0 to 3 QSPI clock cycles ADVANCE INFORMATION Table 5-20 and Table 5-21 assume the operating conditions stated in Table 5-19. Table 5-19. QSPI Timing Conditions MIN TYP MAX UNIT Input Conditions tR Input rise time 1 3 ns tF Input fall time 1 3 ns 2 15 pF Output Conditions CLOAD Output load capacitance Table 5-20. Timing Requirements for QSPI Input (Read) Timings (1) (2) MIN tsu(D-SCLK) Setup time, d[3:0] valid before falling sclk edge th(SCLK-D) Hold time, d[3:0] valid after falling sclk edge tsu(D-SCLK) Setup time, final d[3:0] bit valid before final falling sclk edge th(SCLK-D) Hold time, final d[3:0] bit valid after final falling sclk edge (1) (2) (3) TYP MAX UNIT 6.2 ns 1 ns 6.2 – P (3) ns 1 + P (3) ns Clock Mode 0 (clk polarity = 0 ; clk phase = 0 ) is the mode of operation. The Device captures data on the falling clock edge in Clock Mode 0, as opposed to the traditional rising clock edge. Although nonstandard, the falling-edge-based setup and hold time timings have been designed to be compatible with standard SPI sevices that launch data on the falling edge in Clock Mode 0. P = SCLK period in ns. Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 49 AWR1642 SWRS203 – MAY 2017 www.ti.com Table 5-21. QSPI Switching Characteristics NO. Q1 ADVANCE INFORMATION (2) (3) MIN Cycle time, sclk ns Pulse duration, sclk low Y*P – 3 tw(SCLKH) Pulse duration, sclk high Y*P – 3 (1) (1) Delay time, sclk falling edge to cs active edge Q5 td(SCLK-CS) Delay time, sclk falling edge to cs inactive edge Q6 td(SCLK-D1) Delay time, sclk falling edge to d[1] transition UNIT ns tw(SCLKL) td(CS-SCLK) MAX (1) (2) Q3 Q4 TYP 25 Q2 ns (1) (3) –M*P + 2.5 (1) (3) ns N*P – 1 (1) (3) N*P + 2.5 (1) (3) ns –3.5 7 ns (3) (3) ns –M*P – 1 Q7 tena(CS-D1LZ) Enable time, cs active edge to d[1] driven (lo-z) –P – 4 Q8 tdis(CS-D1Z) Disable time, cs active edge to d[1] tri-stated (hi-z) –P – 4 (3) –P +1 (3) ns td(SCLK-D1) Delay time, sclk first falling edge to first d[1] transition (for PHA = 0 only) (3) (3) ns Q9 (1) PARAMETER tc(SCLK) –3.5 – P –P +1 7–P The Y parameter is defined as follows: If DCLK_DIV is 0 or ODD then, Y equals 0.5. If DCLK_DIV is EVEN then, Y equals (DCLK_DIV/2) / (DCLK_DIV+1). For best performance, it is recommended to use a DCLK_DIV of 0 or ODD to minimize the duty cycle distortion. The HSDIVIDER on CLKOUTX2_H13 output of DPLL_PER can be used to achieve the desired clock divider ratio. All required details about clock division factor DCLK_DIV can be found in the device-specific Technical Reference Manual. P = SCLK period in ns. M = QSPI_SPI_DC_REG.DDx + 1, N = 2 PHA=0 cs Q5 Q4 Q1 Q2 POL=0 Q3 sclk Q7 d[0] Q6 Q9 Command Command Bit n-1 Bit n-2 Q12 Q13 Read Data Bit 1 Q12 Q13 Read Data Bit 1 d[3:1] Q12 Q13 Read Data Bit 0 Q12 Q13 Read Data Bit 0 SPRS85v_TIMING_OSPI1_02 Figure 5-14. QSPI Read (Clock Mode 0) 50 Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 PHA=0 cs Q5 Q4 Q1 Q2 POL=0 Q3 sclk Q7 d[0] Q9 Q6 Command Command Bit n-1 Bit n-2 Q6 Q8 Q6 Write Data Bit 1 Write Data Bit 0 SPRS85v_TIMING_OSPI1_04 Figure 5-15. QSPI Write (Clock Mode 0) Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 51 ADVANCE INFORMATION d[3:1] AWR1642 SWRS203 – MAY 2017 www.ti.com 5.10.11 ETM Trace Interface Table 5-23 and assume the recommended operating conditions stated in Table 5-22. Table 5-22. ETMTRACE Timing Conditions MIN TYP MAX UNIT Output Conditions CLOAD Output load capacitance 2 20 pF MAX UNIT Table 5-23. ETM TRACE Switching Characteristics NO. PARAMETER 1 tcyc(ETM) Cycle time, TRACECLK period 2 th(ETM) 3 tl(ETM) 4 tr(ETM) Clock and data rise time 5 tf(ETM) Clock and data fall time MIN ns Pulse Duration, TRACECLK High 9 ns Pulse Duration, TRACECLK Low 9 td(ETMTRAC ADVANCE INFORMATION 6 ECLKHETMDATAV) ECLKlETMDATAV) ns 3.3 ns 3.3 ns 1 7 ns 1 7 ns Delay time, ETM trace clock high to ETM data valid td(ETMTRAC 7 TYP 20 Delay time, ETM trace clock low to ETM data valid tl(ETM) tr(ETM) th(ETM) tf(ETM) tcyc(ETM) Figure 5-16. ETMTRACECLKOUT Timing Figure 5-17. ETMDATA Timing 52 Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 5.10.12 Data Modification Module (DMM) A Data Modification Module (DMM) gives the ability to write external data into the device memory. The DMM has the following features: • Acts as a bus master, thus enabling direct writes to the 4GB address space without CPU intervention • Writes to memory locations specified in the received packet (leverages packets defined by trace mode of the RAM trace port [RTP] module) • Writes received data to consecutive addresses, which are specified by the DMM (leverages packets defined by direct data mode of RTP module) • Configurable port width (1, 2, 4, 8, 16 pins) • Up to 65 Mbit/s pin data rate Table 5-24. DMM Timing Requirements TYP MAX UNIT Clock period 15.4 tR Clock rise time 1 3 ns ns tF Clock fall time 1 3 ns th(DMM) High pulse width 6 ns tl(DMM) Low pulse width 6 ns tssu(DMM) SYNC active to clk falling edge setup time 2 ns tsh(DMM) DMM clk falling edge to SYNC deactive hold time 3 ns tdsu(DMM) DATA to DMM clk falling edge setup time 2 ns tdh(DMM) DMM clk falling edge to DATA hold time 3 ns ADVANCE INFORMATION MIN tcyc(DMM) tl(DMM) tr th(DMM) tf tcyc(DMM) Figure 5-18. DMMCLK Timing tssu(DMM) tsh(DMM) DMMSYNC DMMCLK DMMDATA tdsu(DMM) tdh(DMM) Figure 5-19. DMMDATA Timing Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 53 AWR1642 SWRS203 – MAY 2017 www.ti.com 5.10.13 JTAG Interface Table 5-26 and Table 5-27 assume the operating conditions stated in Table 5-25. Table 5-25. JTAG Timing Conditions MIN TYP MAX UNIT Input Conditions tR Input rise time 1 3 ns tF Input fall time 1 3 ns 2 15 pF MAX UNIT Output Conditions CLOAD Output load capacitance Table 5-26. Timing Requirements for IEEE 1149.1 JTAG NO. MIN TYP ADVANCE INFORMATION 1 tc(TCK) Cycle time TCK 66.66 ns 1a tw(TCKH) Pulse duration TCK high (40% of tc) 26.67 ns 1b tw(TCKL) Pulse duration TCK low(40% of tc) 26.67 ns tsu(TDI-TCK) Input setup time TDI valid to TCK high 2.5 ns tsu(TMS-TCK) Input setup time TMS valid to TCK high 2.5 ns th(TCK-TDI) Input hold time TDI valid from TCK high 18 ns th(TCK-TMS) Input hold time TMS valid from TCK high 18 ns 3 4 Table 5-27. Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG NO. 2 PARAMETER td(TCKL-TDOV) MIN Delay time, TCK low to TDO valid 0 TYP MAX 25 UNIT ns 1 1a 1b TCK 2 TDO 3 4 TDI/TMS SPRS91v_JTAG_01 Figure 5-20. JTAG Timing 54 Specifications Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 6 Detailed Description 6.1 Overview The AWR1642 device includes the entire Millimeter Wave blocks and analog baseband signal chain for two transmitters and four receivers, as well as a customer-programmable MCU. This device is applicable as a radar-on-a-chip in use-cases with modest requirements for memory, processing capacity and application code size. These could be cost-sensitive automotive applications that are evolving from 24 GHz narrowband implementation and some emerging simple ultra-short-range radar applications. Typical application examples for this device include basic Blind Spot Detect, Parking Assist, and so forth. In terms of scalability, the AWR1642 device could be paired with a low-end external MCU, to address more complex applications that might require additional memory for larger application software footprint and faster interfaces. Because the AWR1642 device also provides high speed data interfaces like SerialLVDS, it is suitable for interfacing with more capable external processing blocks. Here system designers can choose the AWR1642 to provide raw ADC data. Functional Block Diagram Serial Flash interface QSPI LNA IF Cortex-R4F @ 200-MHz ADC SPI Optional External MCU interface SPI / I2C PMIC control (User programmable) LNA IF ADC Digital Front End LNA IF ADC LNA IF ADC Prog RAM (256kB*) (Decimation filter chain) Data RAM (192kB*) Boot ROM Primary communication interfaces (automotive) DCAN Bus Matrix CAN-FD PA DMA Master subsystem (Customer programmed) Debug UARTs Test/ Debug For debug JTAG for debug/ development Mailbox LVDS PA x4 Synth (20 GHz) Ramp Generator HIL C674x DSP @600 MHz High-speed ADC output interface (for recording) High-speed input for hardware-in-loop verification ADC Buffer 6 RF Control/ BIST GPADC Osc. VMON Temp RF/Analog subsystem L1P (32KB) DMA L1D (32KB) CRC DSP subsystem (Customer programmed) L2 (256KB) Radar Data Memory (L3) 768KB* * Up to 512KB of Radar Data Memory can be switched to the Master R4F if required Copyright © 2017, Texas Instruments Incorporated 6.3 6.3.1 Subsystems RF and Analog Subsystem The RF and analog subsystem includes the RF and analog circuitry – namely, the synthesizer, PA, LNA, mixer, IF, and ADC. This subsystem also includes the crystal oscillator and temperature sensors. The three transmit channels can be operated up to a maximum of two at a time (simultaneously) for transmit beamforming purpose as required; whereas the four receive channels can all be operated simultaneously. Detailed Description Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 55 ADVANCE INFORMATION 6.2 AWR1642 SWRS203 – MAY 2017 6.3.1.1 www.ti.com Clock Subsystem The AWR1642 clock subsystem generates 76 to 81 GHz from an input reference of 40-MHz crystal. It has a built-in oscillator circuit followed by a clean-up PLL and a RF synthesizer circuit. The output of the RF synthesizer is then processed by an X4 multiplier to create the required frequency in the 76- to 81-GHz spectrum. The RF synthesizer output is modulated by the timing engine block to create the required waveforms for effective sensor operation. The clean-up PLL also provides a reference clock for the host processor after system wakeup. The clock subsystem also has built-in mechanisms for detecting the presence of a crystal and monitoring the quality of the generated clock. Self Test ADCs TX Phase Mod. PA Envelope Lock Detect Figure 6-1 describes the clock subsystem. ADVANCE INFORMATION Timing Engine RESYNTH Approx. 1 GHz (fixed clock domain) CleanUp PLL REFOUT XO/ Slicer SYNCIN TX LO RX LO x4 MULT Lock Detect SoC Clock CLK Detect 40 and 50 MHz Figure 6-1. Clock Subsystem 56 Detailed Description Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com 6.3.1.2 SWRS203 – MAY 2017 Transmit Subsystem The AWR1642 transmit subsystem consists of two parallel transmit chains, each with independent binary phase and amplitude control. The device supports binary phase modulation for MIMO radar and interference mitigation. Each transmit chain can deliver a maximum of 12 dBm at the antenna port on the PCB. The transmit chains also support programmable backoff for system optimization. Figure 6-2 describes the transmit subsystem. Loopback Path Chip 12 dBm at 50 W LO DF 0 or 180° (from Timing Engine) Figure 6-2. Transmit Subsystem (Per Channel) 6.3.1.3 Receive Subsystem The AWR1642 receive subsystem consists of four parallel channels. A single receive channel consists of an LNA, mixer, IF filtering, A2D conversion, and decimation. All four receive channels can be operational at the same time an individual power-down option is also available for system optimization. Unlike conventional real-only receivers, the AWR1642 device supports a complex baseband architecture, which uses quadrature mixer and dual IF and ADC chains to provide complex I and Q outputs for each receiver channel. The AWR1642 is targeted for fast chirp systems. The band-pass IF chain has configurable lower cutoff frequencies above 350 kHz and can support bandwidths up to 5 MHz. Self Test LO Q DSM RSSI ADC Buffer I 50 W GSG I/Q Correction Decimation DSM Image Rejection Loopback Path Chip PCB Package DAC Saturation Detect Figure 6-3 describes the receive subsystem. DAC Figure 6-3. Receive Subsystem (Per Channel) Detailed Description Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 57 ADVANCE INFORMATION PCB Package Self Test AWR1642 SWRS203 – MAY 2017 6.3.2 www.ti.com Processor Subsystem Unified 128KB x 2 L2 ROM Cache/ RAM L1P 32 KB L1d 32 KB EDMA Master R4F DSP HIL JTAG CRC HIL DSP Interconnect ± 128 bit @ 200 MHz Data Handshake Memory ADC Buffer L3 TCM A 256KB TCM B 192KB Master Interconnect BSS Interconnect CRC Mail Box MSS DMA 32KB 32KB ADVANCE INFORMATION 768KB (static sharing with R4F Space) Interconnect LVDS SPI UART 12C QSPI CAN FD CAN PWM, PMIC CLK Figure 6-4. Processor Subsystem Figure 6-4 shows the block diagram for customer programmable processor subsystems in the AWR1642 device. At a high level there are two customer programmable subsystems, as shown separated by a dotted line in the diagram. Left hand side shows the DSP Subsystem which contains TI's highperformance C674x DSP, a high-bandwidth interconnect for high performance (128-bit, 200MHz) and associated peripherals – four DMAs for data transfer, LVDS interface for Measurement data output, L3 Radar data cube memory, ADC buffers, CRC engine, and data handshake memory (additional memory provided on interconnect). The right-hand side of the diagram shows the Master subsystem. Master subsystem as name suggests is the master of the device and controls all the device peripherals and house-keeping activities of the device. Master subsystem contains Cortex-R4F (Master R4F) processor and associated peripherals and housekeeping components such as DMAs, CRC and Peripherals (I2C, UART, SPIs, CAN, PMIC clocking module, PWM, and others) connected to Master Interconnect through Peripheral Central Resource (PCR interconnect). Details of the DSP CPU core can be found at http://www.ti.com/product/TMS320C6748. HIL module is shown in both the subsystems and can be used to perform the radar operations feeding the captured data from outside into the device without involving the RF subsystem. HIL on master SS is for controlling the configuration and HIL on DSPSS for high speed ADC data input to the device. Both HIL modules uses the same IOs on the device, one additional IO (DMM_MUX_IN) allows selecting either of the two. 6.3.3 Automotive Interface The AWR1642 communicates with the automotive network over the following main interfaces: • CAN (2 interfaces available, one of them being CAN-FD) 58 Detailed Description Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com 6.3.4 SWRS203 – MAY 2017 Master Subsystem Cortex-R4F Memory Map Table 6-1 shows the master subsystem, Cortex-R4F memory map. NOTE There are separate Cortex-R4F addresses and DMA MSS addresses for the master subsystem. See the Technical Reference Manual for a complete list. Table 6-1. Master Subsystem, Cortex-R4F Memory Map Name Frame Address (Hex) Start Size Description End CPU Tightly-Coupled Memories TCMA ROM 0x0000_0000 0x0001_FFFF 128 KiB Program ROM TCM RAM-A 0x0020_0000 0x0023_FFFF (or 0x0027_FFFF) 512 KiB 256/512KB based on variant TCM RAM-B 0x0800_0000 0x0802_FFFF 192 KiB Data RAM 0x0C20_0000 0x0C20_1FFF 8 KiB S/W Scratchpad memory 0xF060_1000 0xF060_17FF 2 KiB RADARSS to MSS mailbox memory space 0xF060_2000 0xF060_27FF 0xF060_8000 0xF060_80FF 0xF060_8060 0xF060_86FF 0xF060_4000 0xF060_47FF 0xF060_5000 0xF060_57FF 0xF060_8400 0xF060_84FF 0xF060_8300 0xF060_83FF 0xF060_6000 0xF060_67FF 0xF060_7000 0xF060_7FFF 0xF060_8200 0xF060_82FF 0xF060_8100 0xF060_81FF 0xFFFF_E100 0xFFFF_E2FF 756 B TOP Level Reset, Clock management registers 0xFFFF_FF00 0xFFFF_FFFF 256 B MSS Reset, Clock management registers 0xFFFF_EA00 0xFFFF_EBFF 512 KiB IO Mux module registers 0xFFFF_F800 0xFFFF_FBFF 352 B General purpose control registers GIO 0xFFF7_BC00 0xFFF7_BDFF 180 B GIO module configuration registers DMA-1 0xFFFF_F000 0xFFFF_F3FF 1 KiB DMA-1 module configuration registers DMA-2 0xFCFF_F800 0xFCFF_FBFF 1 KiB DMA-2 module configuration registers DMM-1 0xFCFF_F700 0xFCFF_F7FF 472 B DMM-1 module configuration registers DMM-2 0xFCFF_F600 0xFCFF_F6FF 472 B DMM-2 module configuration registers VIM 0xFFFF_FD00 0xFFFF_FEFF 512 B VIM module configuration registers RTI-A/WD 0xFFFF_FC00 0xFFFF_FCFF 192 B RTI-A module configuration registers RTI-B 0xFFFF_EE00 0xFFFF_EEFF 192 B RTI-B module configuration registers 0xC000_0000 0xC07F_FFFF 8 MB QSPI –flash memory space 0xC080_0000 0xC0FF_FFFF 116 B QSPI module configuration registers 0xFFF7_F400 0xFFF7_F5FF 512 B MIBSPI-A module configuration registers SW_ Buffer ADVANCE INFORMATION S/W Scratch Pad Memory System Peripherals Mail Box MSS<->RADARSS Mail Box MSS<->DSPSS Mail Box RADARSS<>DSPSS PRCM and Control Module MSS to RADARSS mailbox memory space 188 B MSS to RADARSS mailbox Configuration registers RADARSS to MSS mailbox Configuration registers 2 KiB DSPSS to MSS mailbox memory space MSS to DSPSS mailbox memory space 188 B MSS to DSPSS mailbox Configuration registers DSPSS to MSS mailbox Configuration registers 2 KiB RADARSS to DSPSS mailbox memory space DSPSS to RADARSS mailbox memory space 188 B RADARSS to DSPSS mailbox Configuration registers DSPSS to RADARSS mailbox Configuration registers Serial Interfaces and Connectivity QSPI MIBSPI-A Detailed Description Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 59 AWR1642 SWRS203 – MAY 2017 www.ti.com Table 6-1. Master Subsystem, Cortex-R4F Memory Map (continued) Name Frame Address (Hex) Size Description 0xFFF7_F7FF 512 B MIBSPI-B module configuration registers 0xFFF7_E5FF 148 B SCI-A module configuration registers 0xFFF7_E700 0xFFF7_E7FF 148 B SCI-B module configuration registers CAN 0xFFF7_DC00 0xFFF7_DDFF 512 B CAN module configuration registers CAN_FD(MCAN) 0xFFF7_C800 0xFFF7_CFFF 768 B CAN-FD module configuration registers 0xFFF7_A000 0xFFF7_A1FF 452 B MCAN ECC module registers 0xFFF7_D400 0xFFF7_D4FF 112 B I2C module configuration registers PCR-1 0xFFF7_8000 0xFFF7_87FF 1 KiB PCR-1 interconnect configuration port PCR-2 0xFCFF_1000 0xFCFF_17FF 1 KiB PCR-2 interconnect configuration port CRC 0xFE00_0000 0xFEFF_FFFF 16 KiB CRC module configuration registers PBIST 0xFFFF_E400 0xFFFF_E5FF 464 B PBIST module configuration registers STC 0xFFFF_E600 0xFFFF_E7FF 284 B STC module configuration registers DCC-A 0xFFFF_EC00 0xFFFF_ECFF 44 B DCC-A module configuration registers DCC-B 0xFFFF_F400 0xFFFF_F4FF 44 B DCC-B module configuration registers ESM 0xFFFF_F500 0xFFFF_F5FF 156 B ESM module configuration registers CCMR4 0xFFFF_F600 0xFFFF_F6FF 136 B CCMR4 module configuration registers 0xFD00_0000 0XFDFF_FFFF 3 KiB Crypto module configuration registers DSS_TPTC0 0x5000 0000 0x5000 0317 792 B TPTC0 module configuration space DSS_REG 0x5000 0400 0x5000 075F 864 B DSPSS control module registers DSS_TPTC1 0x5000 0800 0x5000 0B17 792 B TPTC1 module configuration space DSS_REG2 0x5000 0C00 0x5000 0EA3 676 B DSPSS control module registers DSS_TPCC0 0x5001 0000 0x5001 3FFF 16 KB TPCC0 module configuration space DSS_RTIA/WDT 0x5002 0000 0x5002 00BF 192 B DSS_RTIA/WDT configuration space DSS_SCI 0x5003 0000 0x5003 0093 148 B SCI memory space DSS_STC 0x5004 0000 0x5004 011B 284 B STC module configuration space DSS_CBUFF 0x5007 0000 0x5007 0233 564 B Common Buffer module configuration registers DSS_TPTC2 0x5009 0000 0x5009 0317 792 B TPTC2 module configuration space DSS_TPTC3 0x5009 0400 0x5009 0717 792 B TPTC3 module configuration space DSS_TPCC1 0x500A 0000 0x500A 3FFF 16 KB TPCC1 module configuration space DSS_ESM 0x500D 0000 0x500D 005B 92 B ESM module configuration registers DSS_RTIB 0x500F 0000 0x500F 00BF 192 B RTI-B module configuration registers DSS_L3RAM Shared memory 0x5100 0000 0x511F FFFF 2 MB L3 shared memory space DSS_ADCBUF Buffer 0x5200 0000 0x5200 7FFF 32 KB ADC buffer memory space DSS_CBUFF_FIFO 0x5202 0000 0x5202 3FFF 16 KB Common buffer FIFO space DSS_HSRAM1 Start End MIBSPI-B 0xFFF7_F600 SCI-A 0xFFF7_E500 SCI-B I2C Interconnects Safety Modules ADVANCE INFORMATION Security Modules Crypto Other Subsystems 0x5208 0000 0x5208 7FFF 32 KB Handshake memory space DSS_DSP_L2_UMA 0x577E 0000 P1 0x577F FFFF 128 KB L2 RAM space DSS_DSP_L2_UMA 0x5780 0000 P0 0x5781 FFFF 128 KB L2 RAM space DSS_DSP_L1P 0x57E0 0000 0x57E0 7FFF 32 KB L1 program memory space DSS_DSP_L1D 0x57F0 0000 0x57F0 7FFF 32 KB L1 data memory space 60 Detailed Description Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 Table 6-1. Master Subsystem, Cortex-R4F Memory Map (continued) Name Frame Address (Hex) Start Size Description End Peripheral Memories (System and Nonsystem) CAN RAM 0xFF1E_0000 0xFF1F_FFFF 128 KB CAN RAM memory space CAN-FD RAM 0xFF50_0000 0xFF51_FFFF 68 KB CAN-FD RAM memory space DMA1 RAM 0xFFF8_0000 0xFFF8_0FFF 4 KB DMA1 RAM memory space DMA2 RAM 0xFCF8 1000 0xFCF8_0FFF 4 KB DMA2 RAM memory space VIM RAM 0xFFF8_2000 0xFFF8_2FFF 2 KB VIM RAM memory space MIBSPIB-TX RAM 0xFF0C_0000 0xFF0C_01FF 0.5 KB MIBSPIB-TX RAM memory space MIBSPIB-RX RAM 0xFF0C_0200 0xFF0C_03FF 0.5 KB MIBSPIB-RX RAM memory space MIBSPIA-TX RAM 0xFF0E_0000 0xFF0E_01FF 0.5 KB MIBSPIA-TX RAM memory space MIBSPIA- RX RAM 0xFF0E_0200 0xFF0E_03FF 0.5 KB MIBSPIA- RX RAM memory space 0xFFA0_0000 0xFFAF_FFFF 244 KiB Debug subsystem memory space and registers Debug Modules Debug subsystem DSP Subsystem Memory Map ADVANCE INFORMATION 6.3.5 Table 6-2 shows the DSP C674x memory map. Table 6-2. DSP C674x Memory Map Name Frame Address (Hex) Size Description 0x00F0_7FFF 32 KiB L1 data memory space 0x00E0_7FFF 32 KiB L1 program memory space 0x0080_0000 0x0081_FFFF 128 KiB L2 RAM space 0x007E_0000 0x007F_FFFF 128 KiB L2 RAM space TPCC0 0x0201_0000 0x0201_3FFF 16 KiB TPCC0 module configuration space TPCC1 0x020A_0000 0x020A_3FFF 16 KiB TPCC1 module configuration space TPTC0 0x0200 0000 0x0200 03FF 1 KiB TPTC0 module configuration space TPTC1 0x0200 0800 0x0200 0BFF 1 KiB TPTC1 module configuration space TPTC2 0x0209_0000 0x0209_03FF 1 KiB TPTC2 module configuration space TPTC3 0x0209_0400 0x0209_07FF 1 KiB TPTC3 module configuration space DSS_REG 0x0200_0400 0x0200_07FF 864 B DSPSS control module registers DSS_REG2 0x0200_0C00 0x0200_0FFF 624 B DSPSS control module registers ADC Buffer 0x2100_0000 0x2100_7FFC 32 KiB ADC buffer memory space CBUFF-FIFO 0x2102_0000 0x2102_3FFC 16 KiB Common buffer FIFO space L3-Shared memory 0x2000_0000 0x201F_FFFF 2 MB L3 shared memory space Start End DSP_L1D 0x00F0_0000 DSP_L1P 0x00E0_0000 DSP_L2_UMAP0 DSP_L2_UMAP1 DSP Memories EDMA Control Registers System Memories Detailed Description Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 61 AWR1642 SWRS203 – MAY 2017 www.ti.com Table 6-2. DSP C674x Memory Map (continued) Name Frame Address (Hex) Size Description 0x2108_7FFC 32 KiB Handshake memory space 0x0202_0000 0x0202_00FF 192 B RTI-A module configuration registers RTI-B 0x020F_0000 0x020F_00FF 192 B RTI-B module configuration registers CBUFF 0x0207_0000 0x0207_03FF 564 B Common Buffer module Configuration registers Mail Box MSS<->RADARSS 0x5060_1000 0x5060_17FF 2 KiB RADARSS to MSS mailbox memory space 0x5060_2000 0x5060_27FF 0x0460_8000 0x0460_80FF 0x0460_8060 0x0460_86FF 0x5060_4000 0x5060_47FF 0x5060_5000 0x5060_57FF 0x0460_8400 0x0460_84FF 0x0460_8300 0x0460_83FF 0x5060_6000 0x5060_67FF 0x5060_7000 0x5060_7FFF 0x0460_8200 0x0460_82FF 0x0460_8100 0x0460_81FF Start End 0x2108_0000 RTI-A/WD HS-RAM System Peripherals ADVANCE INFORMATION Mail Box MSS<->DSPSS Mail Box RADARSS<->DSPSS MSS to RADARSS mailbox memory space 188 B MSS to RADARSS mailbox Configuration registers RADARSS to MSS mailbox Configuration registers 2 KiB DSPSS to MSS mailbox memory space MSS to DSPSS mailbox memory space 188 B MSS to DSPSS mailbox Configuration registers DSPSS to MSS mailbox Configuration registers 2 KiB RADARSS to DSPSS mailbox memory space DSPSS to RADARSS mailbox memory space 188 B RADARSS to DSPSS mailbox Configuration registers DSPSS to RADARSS mailbox Configuration registers Safety Modules ESM 0x020D_0000 92 B ESM module Configuration registers CRC 0x2200_0000 0x2200_03FF 1 KiB CRC module Configuration registers STC 0x0204_0000 0x0204_01FF 284 B STC module Configuration registers 0x0203_0000 0x0203_00FF 148 B SCI module Configuration registers Nonsystem Peripherals SCI 6.4 6.4.1 Other Subsystems ADC Channels (Service) for User Application The AWR1642 device includes provision for an ADC service for user application, where the GPADC engine present inside the device can be used to measure up to six external voltages. The ADC1, ADC2, ADC3, ADC4, ADC5, and ADC6 pins are used for this purpose. 62 Detailed Description Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com • • SWRS203 – MAY 2017 ADC itself is controlled by TI firmware running inside the BIST subsystem and access to it for customer’s external voltage monitoring purpose is via ‘monitoring API’ calls routed to the BIST subsystem. This API could be linked with the user application running on the Master R4. BIST subsystem firmware will internally schedule these measurements along with other RF and Analog monitoring operations. The API allows configuring the settling time (number of ADC samples to skip) and number of consecutive samples to take. At the end of a frame, the minimum, maximum and average of the readings will be reported for each of the monitored voltages. ANALOG TEST 1-4, ANAMUX ADVANCE INFORMATION GPADC Specifications: • 625 Ksps SAR ADC • 0 to 1.8V input range • 10-bit resolution and ENOB of ~9 bits. • For 5 out of the 6 inputs, an optional internal buffer (0.4-1.4V input range) is available. Without the buffer, the ADC has a switched capacitor input load modeled with 5pF of sampling capacitance and 12pF parasitic capacitance. [for ADC channel mapped to B12, the internal buffer is not available] 5 GPADC 5 VSENSE Figure 6-5. ADC Path Table 6-3. GP-ADC Parameter over operating free-air temperature range (unless otherwise noted) PARAMETER CONDITION MIN ADC supply/reference voltage TYP MAX 1.8 ± 1% ADC input voltage range 0 ADC resolution V 1.8 10 ADC STND 100 kHz input frequency UNIT V bit 47 dB ADC offset error –5 5 LSB ADC gain error –5 5 LSB –1 3.5 LSB –2.5 2.5 ADC DNL ADC INL ADC sample rate ADC sampling time ADC internal capacitance 400 ns 7 parasitic 12 pF 3 Input buffer input range (1) 0.4 Input buffer input capacitance (1) Ksps sampling ADC leakage current LSB 625 µA 1.4 0.5 V pF Outside of given range, the buffer output will become nonlinear. Detailed Description Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 63 AWR1642 SWRS203 – MAY 2017 www.ti.com 7 Monitoring and Diagnostics 7.1 Monitoring and Diagnostic Mechanisms Below is the list given for the main monitoring and diagnostic mechanisms available in the AWR1642. Table 7-1. Monitoring and Diagnostic Mechanisms for AWR1642 S No 1 2 ADVANCE INFORMATION 3 4 5 6 64 Feature Description Boot time LBIST For Master R4F Core and associated VIM AWR1642 architecture supports hardware logic BIST (LBIST) engine self-test Controller (STC). This logic is used to provide a very high diagnostic coverage (>90%) on the Master R4F CPU core and Vectored Interrupt Module (VIM) at a transistor level. LBIST for the CPU and VIM is triggered by Bootloader at the boot time, before handing over the control to the downloaded application. CPU stays there in while loop and does not proceed further if a fault is identified. Periodic LBIST is not supported. Boot time PBIST for Master R4F TCM Memories Master R4F has three Tightly coupled Memories (TCM) memories TCMA, TCMB0 and TCMB1. AWR1642 architecture supports a hardware programmable memory BIST (PBIST) engine. This logic is used to provide a very high diagnostic coverage (March-13n) on the implemented Master R4F TCMs at a transistor level. PBIST for TCM memories is triggered by Bootloader at the boot time before starting download of application from Flash or peripheral interface. CPU stays there in while loop and does not proceed further if a fault is identified. End to End ECC for Master R4F TCM Memories TCMs diagnostic is supported by Single error correction double error detection (SECDED) ECC diagnostic. An 8-bit code word is used to store the ECC data as calculated over the 64bit data bus. ECC evaluation is done by the ECC control logic inside the CPU. This scheme provides end-to-end diagnostics on the transmissions between CPU and TCM. CPU can be configured to have predetermined response (Ignore or Abort generation) to single and double bit error conditions. Master R4F TCM bit multiplexing Logical TCM word and its associated ECC code is split and stored in two physical SRAM banks. This scheme provides an inherent diagnostic mechanism for address decode failures in the physical SRAM banks. Faults in the bank addressing are detected by the CPU as an ECC fault. Further, bit multiplexing scheme implemented such that the bits accessed to generate a logical (CPU) word are not physically adjacent. This scheme helps to reduce the probability of physical multi-bit faults resulting in logical multi-bit faults; rather they manifest as multiple single bit faults. As the SECDED TCM ECC can correct a single bit fault in a logical word, this scheme improves the usefulness of the TCM ECC diagnostic. Both these features are hardware features and cannot be enabled or disabled by application software. Clock Monitor AWR1642 architecture supports Three Digital Clock Comparators (DCCs) and an internal RCOSC. Dual functionality is provided by these modules – Clock detection and Clock Monitoring. DCCint is used to check the availability/range of Reference clock at boot otherwise the device is moved into limp mode (Device still boots but on 10MHz RCOSC clock source. This provides debug capability). DCCint is only used by boot loader during boot time. It is disabled once the APLL is enabled and locked. DCC1 is dedicated for APLL lock detection monitoring, comparing the APLL output divided version with the Reference input clock of the device. Initially (before configuring APLL), DCC1 is used by bootloader to identify the precise frequency of reference input clock against the internal RCOSC clock source. Failure detection for DCC1 would cause the device to go into limp mode. DCC2 module is one which is available for user software . From the list of clock options given in detailed spec, any two clocks can be compared. One example usage is to compare the CPU clock with the Reference or internal RCOSC clock source. Failure detection is indicated to the Master R4F CPU via Error Signaling Module (ESM). Voltage Monitor Voltage Monitor (VMON) can detect grossly out of range supply voltages. The VMON operates continuously and requires no software configuration or CPU overhead. VMON monitors are the primary supplies. If the supplies go out of range after the device is out of the safe operating state, it will be placed into the safe operating state by VMON. When power supplies are in range, the VMON will not interfere with the nRESET signal. Primary Supplies not responsible for right functionality of MCU (RF, ANA) are also monitored by VMON but MCU is triggered with error response and safe state transfer is responsibility of Master R4F. The VMON is a continuously operating diagnostic. It is not possible to disable the VMON diagnostic. Monitoring and Diagnostics Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 Table 7-1. Monitoring and Diagnostic Mechanisms for AWR1642 (continued) Feature Description RTI/WD for Master R4F AWR1642 architecture supports the use of an internal watchdog that is implemented in the real-time interrupt (RTI) module. The internal watchdog has two modes of operation: digital watchdog (DWD) and digital windowed watchdog (DWWD). The modes of operation are mutually exclusive; the designer can elect to use one mode or the other but not both at the same time. Watchdog can issue either an internal (warm) system reset or a CPU non-mask able interrupt upon detection of a failure. The Watchdog is enabled by the bootloader in DWD mode at boot time to track the boot process. Once the application code takes up the control, Watchdog can be configured again for mode and timings based on specific customer requirements. MPU for Master R4F Cortex-R4F CPU includes an MPU. The MPU logic can be used to provide spatial separation of software tasks in the device memory. Cortex-R4F MPU supports 12 regions. It is expected that the operating system controls the MPU and changes the MPU settings based on the needs of each task. A violation of a configured memory protection policy results in a CPU abort. PBIST for Peripheral interface SRAMs - SPIs, CANs AWR1642 architecture supports a hardware programmable memory BIST (PBIST) engine for Peripheral SRAMs as well. PBIST for peripheral SRAM memories can be triggered by the application. User can elect to run the PBIST on one SRAM or on groups of SRAMs based on the execution time, which can be allocated to the PBIST diagnostic. The PBIST tests are destructive to memory contents, and as such are typically run only at boot time. However, the user has the freedom to initiate the tests at any time if peripheral communication can be hindered. Any fault detected by the PBIST results in an error indicated in PBIST status registers. ECC for Peripheral interface SRAMs – SPIs, CANs Peripheral interface SRAMs diagnostic is supported by Single error correction double error detection (SECDED) ECC diagnostic. When a single or double bit error is detected the Master R4F is notified via ESM (Error Signaling Module). This feature is disabled after reset. Software must configure and enable this feature in the peripheral and ESM module. ECC failure (both single bit corrected and double bit uncorrectable error conditions) is reported to the Master R4F as an interrupt via ESM module. Configuration registers protection for Master SS peripherals All the Master SS peripherals (SPIs, CANs, I2C, DMAs, RTI/WD, DCCs, IOMUX etc.) are connected to interconnect via Peripheral Central resource (PCR). This provides two diagnostic mechanisms that can limit access to peripherals. Peripherals can be clock gated per peripheral chip select in the PCR. This can be utilized to disable unused features such that they cannot interfere. In addition, each peripheral chip select can be programmed to limit access based on privilege level of transaction. This feature can be used to limit access to entire peripherals to privileged operating system code only. These diagnostic mechanisms are disabled after reset. Software must configure and enable these mechanisms. Protection violation also generates an ‘aerror’ that result in abort to Master R4F or error response to other masters such as DMAs. Cyclic Redundancy Check –Master SS AWR1642 architecture supports hardware CRC engine on Master SS implementing the below polynomials. • CRC16 CCITT - 0x10 • CRC32 Ethernet - 0x04C11DB7 • CRC64 • CRC 32C- CASTAGNOLI - 0x1EDC6F4 • CRC32P4 – E2E Profile4 - 0xF4ACFB1 • CRC-8 – H2F Autosar - 0x2F • CRC-8 – VDA CAN - 0x1D The read operation of the SRAM contents to the CRC can be done by CPU or by DMA. The comparison of results, indication of fault, and fault response are the responsibility of the software managing the test. 13 MPU for DMAs AWR1642 architecture supports MPUs on Master SS DMAs. Failure detection by MPU is reported to the Master R4F CPU core as an interrupt via ESM. DSPSS’s high performance EDMAs also includes MPUs on both read and writes master ports. EDMA MPUs supports 8 regions. Failure detection by MPU is reported to the DSP core as an interrupt via local ESM. 14 Boot time LBIST For BIST R4F Core and associated VIM AWR1642 architecture supports hardware logic BIST (LBIST) even for BIST R4F core and associated VIM module. This logic provides very high diagnostic coverage (>90%) on the BIST R4F CPU core and VIM. This is triggered by Master R4F boot loader at boot time and it does not proceed further if the fault is detected. 7 8 9 10 11 12 Monitoring and Diagnostics Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 65 ADVANCE INFORMATION S No AWR1642 SWRS203 – MAY 2017 www.ti.com Table 7-1. Monitoring and Diagnostic Mechanisms for AWR1642 (continued) S No Description ADVANCE INFORMATION 15 Boot time PBIST for BIST R4F TCM Memories AWR1642 architecture supports a hardware programmable memory BIST (PBIST) engine for BIST R4F TCMs which provide a very high diagnostic coverage (March-13n) on the BIST R4F TCMs. PBIST is triggered by Master R4F Bootloader at the boot time and it does not proceed further if the fault is detected. 16 End to End ECC for BIST R4F TCM Memories BIST R4F TCMs diagnostic is supported by Single error correction double error detection (SECDED) ECC diagnostic. Single bit error is communicated to the BIST R4FCPU while double bit error is communicated to Master R4F as an interrupt so that application code becomes aware of this and takes appropriate action. 17 BIST R4F TCM bit multiplexing Logical TCM word and its associated ECC code is split and stored in two physical SRAM banks. This scheme provides an inherent diagnostic mechanism for address decode failures in the physical SRAM banks and helps to reduce the probability of physical multi-bit faults resulting in logical multi-bit faults. 18 RTI/WD for BIST R4F AWR1642 architecture supports an internal watchdog for BIST R4F. Timeout condition is reported via an interrupt to Master R4F and rest is left to application code to either go for SW reset for BIST SS or warm reset for the AWR1642 device to come out of faulty condition. 19 Boot time PBIST for L1P, L1D, L2 and L3 Memories AWR1642 architecture supports a hardware programmable memory BIST (PBIST) engine for DSPSS’s L1P, L1D, L2 and L3 memories which provide a very high diagnostic coverage (March-13n). PBIST is triggered by Master R4F Bootloader at the boot time and it does not proceed further if the fault is detected. 20 Parity on L1P AWR1642 architecture supports Parity diagnostic on DSP’s L1P memory. Parity error is reported to the CPU as an interrupt. Note:- L1D memory is not covered by parity or ECC and need to be covered by application level diagnostics. 21 ECC on DSP’s L2 Memory AWR1642 architecture supports both Parity Single error correction double error detection (SECDED) ECC diagnostic on DSP’s L2 memory. L2 Memory is a unified 256KB of memory used to store program and Data sections for the DSP. A 12-bit code word is used to store the ECC data as calculated over the 256-bit data bus (logical instruction fetch size). The ECC logic for the L2 access is located in the DSP and evaluation is done by the ECC control logic inside the DSP. This scheme provides end-to-end diagnostics on the transmissions between DSP and L2. Byte aligned Parity mechanism is also available on L2 to take care of data section. 22 ECC on Radar Data Cube (L3) Memory L3 memory is used as Radar data section in AWR1642. AWR1642 architecture supports Single error correction double error detection (SECDED) ECC diagnostic on L3 memory. An 8-bit code word is used to store the ECC data as calculated over the 64-bit data bus. Failure detection by ECC logic is reported to the Master R4F CPU core as an interrupt via ESM. RTI/WD for DSP Core AWR1642 architecture supports the use of an internal watchdog for BIST R4F that is implemented in the real-time interrupt (RTI) module – replication of same module as used in Master SS. This module supports same features as that of RTI/WD for Master/BIST R4F. This watchdog is enabled by customer application code and Timeout condition is reported via an interrupt to Master R4F and rest is left to application code in Master R4F to either go for SW reset for DSP SS or warm reset for the AWR1642 device to come out of faulty condition. 24 CRC for DSP Sub-System AWR1642 architecture supports dedicated hardware CRC on DSPSS implementing the below polynomials. • CRC16 CCITT - 0x10 • CRC32 Ethernet - 0x04C11DB7 • CRC64 The read of SRAM contents to the CRC can be done by DSP CPU or by DMA. The comparison of results, indication of fault, and fault response are the responsibility of the software managing the test. 25 MPU for DSP AWR1642 architecture supports MPUs for DSP memory accesses (L1D, L1P, and L2). L2 memory supports 64 regions and 16 regions for L1P and L1D each. Failure detection by MPU is reported to the DSP core as an abort. 23 66 Feature Monitoring and Diagnostics Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 Table 7-1. Monitoring and Diagnostic Mechanisms for AWR1642 (continued) (1) (2) Feature Description 26 Temperature Sensors AWR1642 architecture supports various temperature sensors all across the device (next to power hungry modules such as PAs, DSP etc) which is monitored during the inter-frame period. (1) 27 Tx Power Monitors AWR1642 architecture supports power detectors at the Tx output. (2) 28 Error Signaling Error Output When a diagnostic detects a fault, the error must be indicated. The AWR1642 architecture provides aggregation of fault indication from internal monitoring/diagnostic mechanisms using a peripheral logic known as the Error Signaling Module (ESM). The ESM provides mechanisms to classify errors by severity and to provide programmable error response. ESM module is configured by customer application code and specific error signals can be enabled or masked to generate an interrupt (Low/High priority) for the Master R4F CPU. AWR1642 supports Nerror output signal (IO) which can be monitored externally to identify any kind of high severity faults in the design which could not be handled by the R4F. 29 Synthesizer (Chirp) frequency monitor Monitors Synthesizer’s frequency ramp by counting (divided-down) clock cycles and comparing to ideal frequency ramp. Excess frequency errors above a certain threshold, if any, are detected and reported. 30 AWR1642 architecture supports a ball break detection mechanism based on Impedance measurement at the TX output(s) to detect and report any large deviations that can indicate a ball break. Ball break detection for TX Monitoring is done by TIs code running on BIST R4F and failure is reported to the Master ports (TX Ball break monitor) R4F via Mailbox. It is completely up to customer SW to decide on the appropriate action based on the message from BIST R4F. 31 RX loopback test Built-in TX to RX loopback to enable detection of failures in the RX path(s), including Gain/Noise figure, inter-RX balance, etc. 32 IF loopback test Built-in IF (square wave) test tone input to monitor IF filter’s frequency response and detect failure. 33 RX saturation detect Provision to detect ADC saturation due to excessive incoming signal level and/or interference. 34 Boot time LBIST for DSP core AWR1642 device supports boot time LBIST for the DSP Core. LBIST can be triggered by the Master R4F application code during boot time. Monitoring is done by the TI's code running on BIST R4F. There are two modes in which it could be configured to report the temperature sensed via API by customer application. • Report the temperature sensed after every N frames • Report the condition once the temperature crosses programmed threshold. It is completely up to customer SW to decide on the appropriate action based on the message from BIST R4Fvia Mailbox. Monitoring is done by the TI's code running on BIST R4F. There are two modes in which it could be configured to report the detected output power via API by customer application. • Report the power detected after every N frames • Report the condition once the output power degrades by more than configured threshold from the configured. It is completely up to customer SW to decide on the appropriate action based on the message from BIST R4F. Monitoring and Diagnostics Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 67 ADVANCE INFORMATION S No AWR1642 SWRS203 – MAY 2017 7.1.1 www.ti.com Error Signaling Module From Hardware Diagnostics When a diagnostic detects a fault, the error must be indicated. AWR1642 architecture provides aggregation of fault indication from internal diagnostic mechanisms using a peripheral logic known as the error signaling module (ESM). The ESM provides mechanisms to classify faults by severity and allows programmable error response. Below is the high level block diagram for ESM module. Low Priority Interrupt Handing Low Priority Interrupy High Priority Interrupt Handing High Priority Interrupy Error Signal Handling Device Output Pin Error Group 1 Interrupt Enable Interrupt Priority Error Group 2 Nerror Enable ADVANCE INFORMATION Error Group 3 Figure 7-1. ESM Module Diagram 68 Monitoring and Diagnostics Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 8 Applications, Implementation, and Layout NOTE Information in the following Applications section is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information Key device features driving the following applications are: • Integration of Radar Front End and Programmable MCU • Flexible boot modes: Autonomous Application boot using a serial flash or external boot over SPI. Short-Range Radar 40-MHz Crystal Serial FLASH Power Management ADVANCE INFORMATION 8.2 QSPI Integrated MCU ARM Cortex-R4F Antenna Structure RX1 RX2 RX3 RX4 CAN DCAN PHY Automotive Network CAN FD MCAN PHY Automotive Network Radar Front End TX1 TX2 Integrated DSP TI C674x AWR1642 Figure 8-1. Short-Range Radar 8.3 Reference Schematic Figure 8-2 and Figure 8-3 show the reference schematic and low-noise LDO circuitry for the AWR1642 device. Applications, Implementation, and Layout Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 69 AWR1642 SWRS203 – MAY 2017 www.ti.com +3.3VD AR_1V8 AR_1V8 AR_1P3_RF2 PMIC_1V2 AR_1V4_APLL AR_1V4_SYNTH AR_1V8 PMIC_1V2 1V8 SUPPLY AR_VBGAP AR_VOUT_PA BB SUPPLY AR_1V8 AR_1P3_RF1 0.22UF B4 B6 A14 ADVANCE INFORMATION AR_OSC_CLKOUT AR_XTALP AR_XTALM AR_PMIC_CLKOUT_SOP2 AR_MCUCLKOUT C15 D15 P9 N8 P1 AR_ANATEST1 AR_ANATEST2 AR_ANATEST3 AR_ANATEST4 AR_ANAMUX AR_VSENSE P2 P3 R2 B13 C14 N15 AR_DMM_CLK AR_DMM_SYNC AR_DP0 AR_DP1 AR_DP2 AR_DP3 AR_DP4 AR_DP5 AR_DP6 AR_DP7 AR_DP8 AR_DP9 AR_DP10 AR_DP11 AR_DP12 AR_DP13 AR_DP14 AR_DP15 N14 R4 P5 R5 P6 R7 P7 R8 P8 D14 B14 B15 C9 C8 B9 B8 A9 AR_SYNC_IN P4 G13 AR_SYNC_OUT_SOP1 B10 B2 VBGAP VOUT_PA VOUT_PA OSC_CLKOUT CLKP CLKM PMIC_CLKOUT MCU_CLKOUT GPADC_1 GPADC_2 GPADC_3 GPADC_4 GPADC_5 GPADC_6 AWR1642 DMM_CLK DMM_SYNC DP0 DP1 DP2 DP3 DP4 DP5 DP6 DP7 DP8 DP9 DP10 DP11 DP12 DP13 DP14 DP15 AWR1642_PRELIMINARY SYNC_IN SYNC_OUT XTAL R15 AR_XTALM K11 Y1 H11 F11 E11 40MHZ L10 AR_LVDS_0P AR_LVDS_0M AR_LVDS_1P AR_LVDS_1M AR_LVDS_CLKP AR_LVDS_CLKM AR_LVDS_FRCLKP AR_LVDS_FRCLKM LVDS_TXP_0 LVDS_TXM_0 LVDS_TXP_1 LVDS_TXM_1 LVDS_CLKP LVDS_CLKM LVDS_FRCLKP LVDS_FRCLKM J14 NRESET WARM_RESET NERROR_IN NERROR_OUT R3 RS232_RX RS232_TX N4 AR_RS232RX N5 AR_RS232TX QSPI_CLK QSPI_CS QSPI_0 QSPI_1 QSPI_2 QSPI_3 R12 TCK TMS TDO TDI P10 SPI_HOST_INTR_1 SPI_CLK_1 SPI_CS_1 MISO_1 MOSI_1 P13 SPI_CLK_2 SPI_CS_2 MISO_2 MOSI_2 F14 GPIO_0 GPIO_1 GPIO_2 H13 VSSA VSSA VSSA VSSA VSSA VCLK SUPPLY AR_1V8 10UF C6 C10 0.22UF 0.22UF 0.22UF 0.22UF 10UF C14 C20 C28 C33 C35 J15 K14 K15 L14 L15 M14 M15 AR_NRST AR_WARMRST AR_NERRIN AR_NERR_OUT N9 N7 N6 P11 R13 N12 R14 P12 R11 E14 D13 H14 G14 F13 RF1 SUPPLY RF2 SUPPLY +3.3VD AR_1P3_RF2 AR_1P3_RF1 OPENDRAIN SIGNALS PLACE ONBOARD PULLUPS 0.22UF 10UF 0.22UF 10UF C5 C7 C13 C17 AR_TCK AR_TMS AR_TDO_SOP0 AR_TDI N13 C13 3V3 IO SUPPLY 1V3 SUPPLY TRACES 0.22UF 0.22UF C29 C32 2.2UF C87 AR_QSPI_SCLK AR_QSPI_CS AR_QSPI_D0 AR_QSPI_D1 AR_QSPI_D2 AR_QSPI_D3 N10 E13 100 OHMS DIFFERENTIAL OUTPUT DECAPS AR_VBGAP AR_HOSTINTR1 AR_SPICLK1 AR_CS1 AR_MISO1 AR_MOSI1 0.22UF AR_MSS_LOGGER AR_BSS_LOGGER C4 AR_VOUT_PA 0.22UF C11 AR_1V4_APLL AR_1V4_SYNTH 10UF C12 1UF 1UF C30 C24 AR_SCL AR_SDA J13 AR_GPIO_0 AR_GPIO_1 K13 AR_GPIO_2 A1 B1 1V2 SUPPLY C1 E1 VNWA SUPPLY G1 SRAM SUPPLY DIG SUPPLY J1 L1 N1 J2 R1 L2 E2 G2 B3 A3 C3 N2 E3 J3 F3 H3 G3 L3 K3 N3 M3 B5 A5 C5 C4 B7 A7 C7 C6 E5 A15 J6 L5 E6 G6 J7 L6 H7 G7 J8 E8 K7 G8 L8 F9 K8 K9 H9 K10 J10 4.7PF E10 Y1 Y1 4.7PF VCOLDO SUPPLY AR_1V8 VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA C9 C15 VSS VSS VSS VSS VSS VSS G10 AR_XTALP 1P8V IO SUPPLY AR_1V8 A2 A13 A10 F5 K5 VIN_18BB VIN_18BB VOUT_14APLL B11 B12 VIN_18CLK VIN_18VCO D2 C2 VIN_13RF2 VIN_13RF2 H5 G5 G15 J5 VIN_SRAM VIN_13RF1 VIN_13RF1 VIN_13RF1 R6 P14 VNWA R10 H15 N11 P15 E15 F15 R9 L13 RX1 RX2 RX3 RX4 TX1 TX2 VOUT_14SYNTH F2 VIOIN VIOIN VDDIN VDDIN VDDIN VDDIN H2 TO ANTENNA VIOIN_18DIFF 50 OHMS RF TRACES VPP VIOIN_18 U2 0.22UF C3 0.1UF C8 K2 AR_1V8 AR_1V8 PMIC_1V2 VPP_1P7 M2 DIFF SUPPLY AR_1V8 +3.3VD AR_TDO_SOP0 10K R10 SOP0 R11 SOP1 0.1UF 0.1UF 2.2UF 0.22UF C16 C26 C27 C31 0.22UF C34 SOP LINES TO BE SET R5 +3.3VD AR_SYNC_OUT_SOP1 10K DURING BOOTUP TO DECIDE 0 THE POWERUP MODE. +3.3VD +3.3VD AR_PMIC_CLKOUT_SOP2 R3 R1 1UF 47.5K 10K C1 S25FL132K0XNFB01 10K R12 SOP2 10K 0.1UF R9 C2 U1 S25FL132K0XN AR_QSPI_CS AR_QSPI_D1 1 33.2 R4 2 3 33.2 R2 4 8 7 6 5 R6 R8 R7 33.2 33.2 33.2 AR_QSPI_D3 AR_QSPI_SCLK AR_QSPI_D0 EP AR_QSPI_D2 CS_N VCC SO/IO1 HOLD_N/IO3 WP_N/IO2 SCK VSS SI/IO0 EP Copyright © 2017, Texas Instruments Incorporated Figure 8-2. AWR1642 Reference Schematic 70 Applications, Implementation, and Layout Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 LDO_01 (1.8V OUTPUT) PMIC_2V3 AR_1V8 U4 PMIC_2V3 8 7 6 5 R84 10K 0.1UF R83 C21 10K 22UF C25 10UF 0.47UF C23 OUT OUT FB/SNS GND EPAD 1 2 3 4 EP LDO_EN LDO_EN TPS7A8101 IN IN NR EN 0.47UF 12.7K R82 10UF C18 C19 C22 DNI=TRUE ADVANCE INFORMATION 10K R81 LDO_02 (1.3V LDO) AR_1P3_RF1 C42 R15 C44 0.01UF 1.96K 1UF C48 C46 SS_CTRL C40 0.01UF C36 C37 C38 C39 5 LDO_EN 0.01UF 17 16 20 19 18 EN1 NR/SS1 SS_CTRL1 PG1 FB1 TPS7A8801 9 4 IN1 IN1 GND IN2 IN2 OUT1 OUT1 GND OUT2 OUT2 GND 14 AR_1P3_RF2 13 12 11 EP 0 C41 3K 15 10 3 TPS7A8801RTJ 1.96K R14 0.01UF C43 1UF 10UF 10UF C45 C47 C49 SS_CTRL 10UF EN2 NR/SS2 SS_CTRL2 PG2 FB2 22UF 6 2 10UF 7 1 22UF 8 PMIC_1V8 10UF R132 LDO_EN U3 10UF R13 3K R121 Copyright © 2017, Texas Instruments Incorporated Figure 8-3. AWR1642 Low-Noise LDO Circuitry Applications, Implementation, and Layout Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 71 AWR1642 SWRS203 – MAY 2017 8.4 www.ti.com Layout The top layer routing, top layer closeup, and bottom layer routing are shown in Figure 8-4, Figure 8-5, and Figure 8-6, respectively. 8.4.1 Layout Guidelines ADVANCE INFORMATION Figure 8-4. Top Layer Routing 72 Applications, Implementation, and Layout Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 SWRS203 – MAY 2017 ADVANCE INFORMATION www.ti.com Figure 8-5. Top Layer Routing Closeup Applications, Implementation, and Layout Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 73 AWR1642 SWRS203 – MAY 2017 www.ti.com ADVANCE INFORMATION Figure 8-6. Bottom Layer Routing 74 Applications, Implementation, and Layout Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com 8.4.2 SWRS203 – MAY 2017 Stackup Details 1 Rogers 4835 4mil coreH/1 Low Pro Rogers 4835 0.689 4.000 1.260 2.067 4.000 1.260 3.480 Iteq IT180A Prepreg 1080 Dielectric 4.195 2.830 3.700 Iteq IT180A Prepreg 1080 Dielectric 4.195 2.830 3.700 Iteq IT180A 28 mil core 1/1 FR4 1.260 28.000 1.260 1.260 28.000 1.260 4.280 Iteq IT180A Prepreg 1080 Dielectric 4.195 2.691 3.700 Iteq IT180A Prepreg 1080 Dielectric 4.195 2.691 3.700 FR4 1.260 4.000 0.689 1.260 4.000 2.067 3.790 3 4 56.21 2 5 Iteq IT180A 4 mil core 1/H 73.000 69.000 48.000 72.000 100.000 ADVANCE INFORMATION 6 100.000 Applications, Implementation, and Layout Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 75 AWR1642 SWRS203 – MAY 2017 www.ti.com 9 Device and Documentation Support TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions follow. 9.1 Device Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (for example, AWR1642). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMDX) through fully qualified production devices and tools (TMDS). Device development evolutionary flow: ADVANCE INFORMATION X Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow. P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications. null Production version of the silicon die that is fully qualified. Support tool development evolutionary flow: TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing. TMDS Fully-qualified development-support product. X and P devices and TMDX development-support tools are shipped against the following disclaimer: "Developmental product is intended for internal evaluation purposes." Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies. Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used. TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, ABL0161), the temperature range (for example, blank is the default commercial temperature range). Figure 9-1 provides a legend for reading the complete device name for any AWR1642 device. For orderable part numbers of AWR1642 devices in the ABL0161 package types, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative. For additional description of the device nomenclature markings on the die, see the AWR1642 Device Errata. 76 Device and Documentation Support Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 X 1 6 42 B I G ABL Prefix Tray or Tape & Reel T = Small Reel R = Big Reel <Blank> = Tray X= Experimental Generation 1 = 76 to 81 GHz Package ABL = BGA Variant 2 = FE 4 = FE + FFT + MCU 6 = FE + MCU + DSP + 1.5 MB Security G = General S = Secure D = Development Secure Temperature (Tj) C = 0°C to 70°C K = ±40°C to 85°C A = ±40°C to 105°C I = ±40°C to 125°C Num RX/TX Channels RX = 1,2,3,4 TX = 1,2,3 Silicon PG Revision Blank = Rev 1.0 Safety Level A = ASIL A Capable B = ASIL B Capable Copyright © 2017, Texas Instruments Incorporated Figure 9-1. Device Nomenclature 9.2 Tools and Software Models AWR1642 BSDL Model Boundary scan database of testable input and output pins for IEEE 1149.1 of the specific device. AWR1642 IBIS Model IO buffer information model for the IO buffers of the device. For simulation on a circuit board, see IBIS Open Forum. AWR1642 Checklist for Schematic Review, Layout Review, Bringup/Wakeup A set of steps in spreadsheet form to select system functions and pinmux options. Specific EVM schematic and layout notes to apply to customer engineering. A bringup checklist is suggested for customers. 9.3 Documentation Support To receive notification of documentation updates—including silicon errata—go to the product folder for your device on ti.com (AWR1642). In the upper right-hand corner, click the "Alert me" button. This registers you to receive a weekly digest of product information that has changed (if any). For change details, check the revision history of any revised document. The current documentation that describes the DSP, related peripherals, and other technical collateral follows. Errata AWR1642 Device Errata Describes known advisories, limitations, and cautions on silicon and provides workarounds. Device and Documentation Support Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 77 ADVANCE INFORMATION Features Blank = Baseline AWR1642 SWRS203 – MAY 2017 9.4 www.ti.com Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. TI Embedded Processors Wiki Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices. 9.5 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 9.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ADVANCE INFORMATION ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 9.7 Export Control Notice Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from disclosing party under nondisclosure obligations (if any), or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws. 9.8 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 78 Device and Documentation Support Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AWR1642 AWR1642 www.ti.com SWRS203 – MAY 2017 10 Mechanical, Packaging, and Orderable Information 10.1 Packaging Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. CAUTION ADVANCE INFORMATION The following package information is subject to change without notice. Copyright © 2017, Texas Instruments Incorporated Mechanical, Packaging, and Orderable Information Submit Documentation Feedback Product Folder Links: AWR1642 79 PACKAGE OUTLINE ABL0161B FCBGA - 1.17 mm max height SCALE 1.400 PLASTIC BALL GRID ARRAY 10.5 10.3 A B BALL A1 CORNER 10.5 10.3 1.17 MAX C SEATING PLANE BALL TYP 0.37 TYP 0.27 0.1 C 9.1 TYP PKG (0.65) TYP R P (0.65) TYP N M L K J 9.1 TYP PKG H G F E D 161X C B 0.45 0.35 0.15 0.08 C A B C A 0.65 TYP BALL A1 CORNER 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 0.65 TYP 4223365/A 10/2016 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com EXAMPLE BOARD LAYOUT ABL0161B FCBGA - 1.17 mm max height PLASTIC BALL GRID ARRAY (0.65) TYP 161X ( 0.32) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 A (0.65) TYP B C D E F G PKG H J K L M N P R PKG LAND PATTERN EXAMPLE SCALE:10X 0.05 MAX 0.05 MIN ( 0.32) METAL METAL UNDER SOLDER MASK ( 0.32) SOLDER MASK OPENING SOLDER MASK OPENING SOLDER MASK DEFINED NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS NOT TO SCALE 4223365/A 10/2016 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For information, see Texas Instruments literature number SPRAA99 (www.ti.com/lit/spraa99). www.ti.com EXAMPLE STENCIL DESIGN ABL0161B FCBGA - 1.17 mm max height PLASTIC BALL GRID ARRAY (0.65) TYP 161X ( 0.32) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 A B (0.65) TYP C D E F G PKG H J K L M N P R PKG SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:10X 4223365/A 10/2016 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com PACKAGE OPTION ADDENDUM www.ti.com 15-May-2017 PACKAGING INFORMATION Orderable Device Status (1) X1642BIGABL ACTIVE Package Type Package Pins Package Drawing Qty FC/CSP ABL 161 1 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) TBD Call TI Call TI Op Temp (°C) Device Marking (4/5) -40 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. 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