Kemet C2220V392MCRACTU Arcshield technology, high voltage, x7r dielectric, 500 - 1,000 vdc (commercial & automotive grade) Datasheet

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield™ Technology, High Voltage, X7R Dielectric,
500 – 1,000 VDC (Commercial & Automotive Grade)
Overview
KEMET ArcShield high voltage surface mount capacitors
in X7R dielectric are designed for use in high voltage
applications susceptible to surface arcing (arc-over
discharge).
The phenomenon of surface arcing is caused by a high
voltage gradient between the two termination surfaces or
between one of the termination surfaces and the counter
internal electrode structure within the ceramic body. It
occurs most frequently at application voltages that meet
or exceed 300 V, in high humidity environments, and in
chip sizes with minimal bandwidth separation (creepage
distance). This phenomenon can either damage surrounding
components or lead to a breakdown of the dielectric
material, ultimately resulting in a short-circuit condition
(catastrophic failure mode).
Patented ArcShield technology features KEMET's highly
reliable base metal dielectric system combined with a
unique internal shield electrode structure that is designed
to suppress an arc-over event while increasing available
capacitance. Developed on the principle of a partial Faraday
cage, this internal system offers unrivaled performance
and reliability when compared to external surface coating
technologies.
For added reliability, KEMET's Flexible Termination technology
is an available option that provides superior flex performance
over standard termination systems. This technology was
developed to address flex cracks, which are the primary failure
mode of MLCCs and typically the result of excessive tensile
and shear stresses produced during board flexure and thermal
cycling. Flexible Termination technology inhibits the transfer of
board stress to the rigid body of the MLCC, therefore mitigating
flex cracks which can result in low IR or short circuit failures.
KEMET’s ArcShield high voltage surface mount MLCCs are
available in Automotive Grade, which undergo stricter testing
protocol and inspection criteria. Whether under-hood or
in-cabin, these devices are designed for mission and safetycritical automotive circuits or applications requiring proven,
reliable performance in harsh environments. Automotive Grade
devices meet the demanding Automotive Electronics Council's
AEC-Q200 qualification requirements.
Click image above for interactive 3D content
Ordering Information
C
Ceramic
0603
W
Case Size Specification/
(L" x W")
Series
0603
0805
1206
1210
1808
1812
1825
2220
2225
Open PDF in Adobe Reader for full functionality
392
K
C
R
A
C
TU
Capacitance
Code (pF)
Capacitance
Tolerance
Rated
Voltage
(VDC)
Dielectric
Failure
Rate/
Design
Termination Finish1
Packaging/
Grade
(C-Spec)2
J = ±5%
K = ±10%
M = ±20%
C = 500
B = 630
D = 1,000
R = X7R
A = N/A
V = ArcShield Two significant
digits and
W = ArcShield
number of
with Flexible
zeros.
Termination
C = 100% Matte Sn
L = SnPb (5% PB minimum)
See
"Packaging
C-Spec
Ordering
Options Table"
below
Additional termination finish options may be available. Contact KEMET for details.
SnPb termination finish option is not available on Automotive Grade product.
2
Additional reeling or packaging options may be available. Contact KEMET for details.
1
1, 2
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1034_X7R_HV_ARC_SMD • 11/29/2016
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging/Grade
Ordering Code (C-Spec)
Packaging Type
Commercial Grade1
Bulk Bag
7" Reel/Unmarked
Not Required (Blank)
TU
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
TM
7040 (EIA 0603 and smaller case sizes)
7215 (EIA 0805 and larger case sizes)
7081
7082
13" Reel/Unmarked
7" Reel/Marked
13" Reel/Marked
7" Reel/Unmarked/2 mm pitch2
13" Reel/Unmarked/2 mm pitch2
Automotive Grade3
7" Reel
13" Reel/Unmarked
7" Reel/Unmarked/2 mm pitch2
13" Reel/Unmarked/2 mm pitch2
AUTO
AUTO7411 (EIA 0603 and smaller case sizes)
AUTO7210 (EIA 0805 and larger case sizes)
3190
3191
Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging.
The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors
that have not been laser marked.
2
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".
3
Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel
Packaging Quantities" and "Tape & Reel Packaging Information".
3
For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information".
3
All Automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For
more information see "Capacitor Marking".
1
1
Benefits
•
•
•
•
•
•
•
•
•
Patented technology
Permanent internal arc protection
Protective surface coating not required
Base metal electrode (BME) dielectric system
Industry leading CV values
−55°C to +125°C operating temperature range
Exceptional performance at high frequencies
Lead (Pb)-free, RoHS and REACH compliant
EIA 0603, 0805, 1206, 1210, 1808, 1812, 1825,
2220, and 2225 case sizes
• DC voltage ratings of 500 V, 630 V and 1 KV
•
•
•
•
•
•
Capacitance offerings ranging from 1,000 pF to 560 nF
Available capacitance tolerances of ±5%, ±10% and ±20%
Low ESR and ESL
Non-polar device, minimizing installation concerns
Commercial & Automotive (AEC-Q200) grades available
100% pure matte tin-plated termination finish allowing for
excellent solderability
• SnPb plated termination finish option available upon
request (5% Pb minimum)
• Flexible Termination option available upon request
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1034_X7R_HV_ARC_SMD • 11/29/2016
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process
warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec,
“AUTO”. This C-Spec was developed in order to better serve small and medium sized companies that prefer an automotive
grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review
by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers
and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are
limited (see details below).
Product Change Notification (PCN)
The KEMET Product Change Notification system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fit, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence
Process/Product change
Obsolescence*
Days prior to
implementation
KEMET assigned
Yes (with approval and sign off)
Yes
180 days Minimum
AUTO
Yes (without approval)
Yes
90 days Minimum
1
1
Customer Notification due to:
KEMET Automotive
C-Spec
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design record and specification requirements are properly
understood and
fulfilled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part
1
2
3
4
5
KEMET assigned
●
●
●
●
●
AUTO
○
1
1
PPAP (Product Part Approval Process) Level
KEMET Automotive
C-Spec
○
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
● Part Number specific PPAP available
○ Product family PPAP only
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1034_X7R_HV_ARC_SMD • 11/29/2016
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Applications
Typical applications include switch mode power supplies (input filters, resonators, tank circuits, snubber circuits, output
filters), high voltage coupling and DC blocking, lighting ballasts, voltage multiplier circuits, DC/DC converters and coupling
capacitors in Ćuk converters. Markets include power supply, LCD fluorescent backlight ballasts, HID lighting, telecom
equipment, industrial and medical equipment/control, LAN/WAN interface, analog and digital modems, and automotive
(electric and hybrid vehicles, charging stations and lighting) applications.
Application Notes
X7R dielectric is not recommended for AC line filtering or pulse applications.
Qualification/Certification
Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are
referenced in Table 4, Performance & Reliability.
Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details
regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their
website at www.aecouncil.com.
Environmental Compliance
Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1034_X7R_HV_ARC_SMD • 11/29/2016
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches) – Standard Termination
L
W
B
T
S
EIA Size
Code
Metric Size
Code
L
Length
W
Width
0603
1608
0805
2012
1206
3216
1210
3225
1808
4520
1812
4532
1825
4564
2220
5650
2225
5664
1.60 (0.063)
±0.15 (0.006)
2.00 (0.079)
±0.20 (0.008)
3.20 (0.126)
±0.20 (0.008)
3.20 (0.126)
±0.20 (0.008)
4.70 (0.185)
±0.50 (0.020)
4.50 (0.177)
±0.30 (0.012)
4.50 (0.177)
±0.30 (0.012)
5.70 (0.224)
±0.40 (0.016)
5.60 (0.220)
±0.40 (0.016)
0.80 (0.032)
±0.15 (0.006)
1.25 (0.049)
±0.20 (0.008)
1.60 (0.063)
±0.20 (0.008)
2.50 (0.098)
±0.20 (0.008)
2.00 (0.079)
±0.20 (0.008)
3.20 (0.126)
±0.30 (0.012)
6.40 (0.252)
±0.40 (0.016)
5.00 (0.197)
±0.40 (0.016)
6.40 (0.248)
±0.40 (0.016)
T Thickness
B
Bandwidth
See Table 2 for
Thickness
0.35 (0.014)
±0.15 (0.006)
0.50 (0.02)
±0.25 (0.010)
0.50 (0.02)
±0.25 (0.010)
0.50 (0.02)
±0.25 (0.010)
0.60 (0.024)
±0.35 (0.014)
0.60 (0.024)
±0.35 (0.014)
0.60 (0.024)
±0.35 (0.014)
0.60 (0.024)
±0.35 (0.014)
0.60 (0.024)
±0.35 (0.014)
S
Separation
Minimum
Mounting
Technique
0.70 (0.028)
0.75 (0.030)
N/A
Solder Wave or
Solder Reflow
Solder Reflow
Only
Dimensions – Millimeters (Inches) – Flexible Termination
EIA Size
Code
Metric Size
Code
L
Length
W
Width
0603
1608
0805
2012
1206
3216
1210
3225
1808
4520
1812
4532
1825
4564
2220
5650
2225
5664
1.60 (0.064)
±0.17 (0.007)
2.00 (0.079)
±0.30 (0.012)
3.30 (0.130)
±0.40 (0.016)
3.30 (0.130)
±0.40 (0.016)
4.70 (0.185)
±0.50 (0.020)
4.50 (0.178)
±0.40 (0.016)
4.60 (0.181)
±0.40 (0.016)
5.90 (0.232)
±0.75 (0.030)
5.90 (0.232)
±0.75 (0.030)
0.80 (0.032)
±0.15 (0.006)
1.25 (0.049)
±0.30 (0.012)
1.60 (0.063)
±0.35 (0.013)
2.60 (0.102)
±0.30 (0.012)
2.00 (0.079)
±0.20 (0.008)
3.20 (0.126)
±0.30 (0.012)
6.40 (0.252)
±0.40 (0.016)
5.00 (0.197)
±0.40 (0.016)
6.40 (0.248)
±0.40 (0.016)
T Thickness
B
Bandwidth
See Table 2 for
Thickness
0.45 (0.018)
±0.15 (0.006)
0.50 (0.02)
±0.25 (0.010)
0.60 (0.024)
±0.25 (0.010)
0.60 (0.024)
±0.25 (0.010)
0.70 (0.028)
±0.35 (0.014)
0.70 (0.028)
±0.35 (0.014)
0.70 (0.028)
±0.35 (0.014)
0.70 (0.028)
±0.35 (0.014)
0.70 (0.028)
±0.35 (0.014)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
S
Separation
Minimum
Mounting
Technique
0.58 (0.023)
0.75 (0.030)
N/A
Solder Wave or
Solder Reflow
Solder Reflow
Only
C1034_X7R_HV_ARC_SMD • 11/29/2016
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
−55°C to +125°C
Capacitance Change with Reference to
+25°C and 0 Vdc Applied (TCC)
±15%
Aging Rate (Maximum % Capacitance Loss/Decade Hour)
3.0%
1
2
3
4
Dielectric Withstanding Voltage (DWV)
Dissipation Factor (DF) Maximum Limit at 25°C
Insulation Resistance (IR) Minimum Limit at 25°C
150% of rated voltage for voltage rating of < 1000V
120% of rated voltage for voltage rating of ≥ 1000V
(5±1 seconds and charge/discharge not exceeding 50mA)
2.5%
100 megohm microfarads or 10GΩ
(500VDC applied for 120±5 seconds at 25°C)
Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.
DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the
capacitor.
3
Capacitance and dissipation factor (DF) measured under the following conditions:
1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF
120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF
4
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON".
1
2
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric
Rated DC
Voltage
Capacitance
Value
> 25
X7R
16/25
< 16
Dissipation Factor
(Maximum %)
Capacitance
Shift
Insulation
Resistance
±20%
10% of Initial
Limit
3.0
All
5.0
7.5
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1034_X7R_HV_ARC_SMD • 11/29/2016
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Table 1 – Capacitance Range/Selection Waterfall (0603 – 1812 Case Sizes)
Cap
Cap
Code
Case Size/
C0603W/V C0805W/V C1206W/V C1210W/V C1808W/V C1812W/V C1825W/V C2220W/V C2225W/V
Series
Voltage Code
C
B
D
C
B
D
C
B
D
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
623
683
823
104
124
154
184
224
274
334
394
474
564
Cap
Cap
Code
B
D
C
B
D
C
B
D
C
B
C
B
C
B
500
630
500
630
500
630
JE
JE
JK
JK
JL
JN
JN
JE
JE
JK
JL
JN
KF
KE
KF
KF
KH
KH
KJ
KE
KF
KH
KH
KJ
KJ
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
Capacitance
Tolerance
1,000 pF
1,200 pF
1,500 pF
1,800 pF
2,200 pF
2,700 pF
3,300 pF
3,900 pF
4,700 pF
5,600 pF
6,800 pF
8,200 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
39,000 pF
47,000 pF
56,000 pF
62,000 pF
68,000 pF
82,000 pF
0.10 µF
0.12 µF
0.15 µF
0.18 µF
0.22 µF
0.27 µF
0.33 µF
0.39 µF
0.47 µF
0.56 µF
C
Rated Voltage
500 630 1000 500 630 1000 500 630 1000 500 630 1000 500 630 1000 500 630 1000
(VDC)
J
K
M CG
J
K
M CG
J
K
M CG
J
K
M CG
J
K
M CG
J
K
M CG
J
K
M CG
J
K
M CG
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
Rated Voltage
500
(VDC)
CG
CG
CG
CG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
EJ
EJ
EJ
EJ
EJ
EJ
EJ
EJ
EJ
EJ
EJ
EJ
EJ
EJ
EJ
EJ
EJ
EJ
EJ
EJ
EJ
FZ
FZ
FZ
FZ
FZ
FZ
FZ
FZ
FU
FK
FK
FK
FZ
FZ
FZ
FZ
FU
FU
FK
FK
FK
FS
FZ
FZ
FU
FU
FK
FK
FS
FS
LE
LE
LA
LA
LA
LA
LA
LA
LA
LA
LA
LA
LB
LE
LE
LA
LA
LA
LA
LA
LA
LA
LC
LC
LE
LE
LA
LA
LA
LB
LB
LC
LC
GB
GB
GB
GB
GB
GB
GE
GB
GB
GE
GE
GF
GJ
GL
GS
GB
GB
GB
GB
GB
GB
GE
GE
GH
GK
GN
GB
GB
GB
GC
GE
GE
GE
GK
GJ
630 1000 500 630 1000 500 630 1000 500 630 1000 500 630 1000 500 630 1000
Voltage Code
C
Case Size/
Series
B
D
C0603W/V
C
B
D
C0805W/V
C
B
D
C1206W/V
C
B
D
C1210W/V
C
B
D
C1808W/V
C
B
D
C1812W/V
HE
HE
HE
HE
HJ
HJ
HK
HE
HE
HG
HJ
HJ
500
630
500
630
500
630
C
B
C
B
C
B
C1825W/V
C2220W/V
C2225W/V
These products are protected under US Patents 8,885,319 B2 and 9,490,072 B2, other patents pending, and any foreign counterparts.
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage
capability within the same form factor (configuration and dimensions).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1034_X7R_HV_ARC_SMD • 11/29/2016
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Table 2A – Chip Thickness/Tape & Reel Packaging Quantities
Paper Quantity1
Plastic Quantity
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
CG
DG
EJ
FZ
FU
FK
FS
LE
LA
LB
LC
GB
GE
GC
GH
GF
GK
GJ
GN
GL
GS
HE
HG
HJ
HK
JE
JK
JL
JN
KE
KF
KH
KJ
0603
0805
1206
1210
1210
1210
1210
1808
1808
1808
1808
1812
1812
1812
1812
1812
1812
1812
1812
1812
1812
1825
1825
1825
1825
2220
2220
2220
2220
2225
2225
2225
2225
0.80 ± 0.10
1.25 ± 0.15
1.70 ± 0.20
1.25 ± 0.20
1.55 ± 0.20
2.10 ± 0.20
2.50 ± 0.30
1.00 ± 0.10
1.40 ± 0.15
1.60 ± 0.15
2.00 ± 0.15
1.00 ± 0.10
1.30 ± 0.10
1.10 ± 0.10
1.40 ± 0.15
1.50 ± 0.10
1.60 ± 0.20
1.70 ± 0.15
1.70 ± 0.20
1.90 ± 0.20
2.10 ± 0.20
1.40 ± 0.15
1.60 ± 0.20
2.00 ± 0.20
2.50 ± 0.20
1.40 ± 0.15
1.60 ± 0.20
2.00 ± 0.20
2.50 ± 0.20
1.40 ± 0.15
1.60 ± 0.20
2.00 ± 0.20
2.50 ± 0.20
4,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
15,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2,500
2,000
2,500
2,000
2,000
1,000
2,500
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
500
500
1,000
1,000
500
500
1,000
1,000
500
500
1,000
1,000
500
500
0
10,000
8,000
10,000
8,000
8,000
4,000
10,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
2,000
2,000
4,000
4,000
2,000
2,000
4,000
4,000
2,000
2,000
4,000
4,000
2,000
2,000
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
Paper Quantity
1
Plastic Quantity
Package quantity based on finished chip thickness specifications.
1
If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603
(1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1034_X7R_HV_ARC_SMD • 11/29/2016
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Table 2B – Bulk Packaging Quantities
Loose Packaging
Packaging Type
Bulk Bag (default)
Packaging C-Spec1
N/A 2
Case Size
Packaging Quantities (pieces/unit packaging)
EIA (in)
Metric (mm)
0402
0603
0805
1206
1210
1808
1005
1608
2012
3216
3225
4520
1812
1825
2220
2225
4532
4564
5650
5664
Minimum
Maximum
50,000
1
20,000
The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be included in
the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details. Commercial Grade
product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk bag packaging option for
Automotive Grade products.
2
A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The 15th
through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our standard "Bulk
Bag" packaging.
1
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1034_X7R_HV_ARC_SMD • 11/29/2016
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Table 3A – Land Pattern Design Recommendations per IPC–7351 – Standard Termination
EIA
Size
Code
Metric
Size
Code
0603
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
1608
0.90
1.15
1.10
4.00
2.10
0.80
0.95
1.00
3.10
1.50
0.60
0.75
0.90
2.40
1.20
0805
2012
1.00
1.35
1.55
4.40
2.60
0.90
1.15
1.45
3.50
2.00
0.75
1.50
1.35
2.80
1.70
1206
3216
1.60
1.35
1.90
5.60
2.90
1.50
1.15
1.80
4.70
2.30
1.40
0.95
1.70
4.00
2.00
1210
3225
1.60
1.35
2.80
5.65
3.80
1.50
1.15
2.70
4.70
3.20
1.40
0.95
2.60
4.00
2.90
1808
4520
2.30
1.75
2.30
7.40
3.30
2.20
1.55
2.20
6.50
2.70
2.10
1.35
2.10
5.80
2.40
1812
4532
2.15
1.60
3.60
6.90
4.60
2.05
1.40
3.50
6.00
4.00
1.95
1.20
3.40
5.30
3.70
1825
4564
2.15
1.60
6.90
6.90
7.90
2.05
1.40
6.80
6.00
7.30
1.95
1.20
6.70
5.30
7.00
2220
5650
2.75
1.70
5.50
8.20
6.50
2.65
1.50
5.40
7.30
5.90
2.55
1.30
5.30
6.60
5.60
2225
5664
2.70
1.70
6.90
8.10
7.90
2.60
1.50
6.80
7.20
7.30
2.50
1.30
6.70
6.50
7.00
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
Y
Y
X
X
C
C
V2
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1034_X7R_HV_ARC_SMD • 11/29/2016
10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Table 3B – Land Pattern Design Recommendations per IPC–7351 – Flexible Termination
EIA
Size
Code
Metric
Size
Code
0603
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
1608
0.85
1.25
1.10
4.00
2.10
0.75
1.05
1.00
3.10
1.50
0.65
0.85
0.90
2.40
1.20
0805
2012
0.99
1.44
1.66
4.47
2.71
0.89
1.24
1.56
3.57
2.11
0.79
1.04
1.46
2.42
1.81
1206
3216
1.59
1.62
2.06
5.85
3.06
1.49
1.42
1.96
4.95
2.46
1.39
1.22
1.86
4.25
2.16
1210
3225
1.59
1.62
3.01
5.90
4.01
1.49
1.42
2.91
4.95
3.41
1.39
1.22
2.81
4.25
3.11
1808
4520
2.30
1.75
2.30
7.40
3.30
2.20
1.55
2.20
6.50
2.70
2.10
1.35
2.10
5.80
2.40
1812
4532
2.10
1.80
3.60
7.00
4.60
2.00
1.60
3.50
6.10
4.00
1.90
1.40
3.40
5.40
3.70
1825
4564
2.15
1.80
6.90
7.10
7.90
2.05
1.60
6.80
6.20
7.30
1.95
1.40
6.70
5.50
7.00
2220
5650
2.85
2.10
5.50
8.80
6.50
2.75
1.90
5.40
7.90
5.90
2.65
1.70
5.30
7.20
5.60
2225
5664
2.85
2.10
6.90
8.80
7.90
2.75
1.90
6.80
7.90
7.30
2.65
1.70
6.70
7.20
7.00
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
Y
Y
X
C
V2
X
C
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1034_X7R_HV_ARC_SMD • 11/29/2016
11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/JSTD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at
these conditions.
Termination Finish
SnPb
TP
100% Matte Sn
Preheat/Soak
Temperature Minimum (TSmin)
Temperature Maximum (TSmax)
Time (tS) from TSmin to TSmax
100°C
150°C
60 – 120 seconds
150°C
200°C
60 – 120 seconds
Ramp-Up Rate (TL to TP)
3°C/second
maximum
3°C/second
maximum
Liquidous Temperature (TL)
183°C
217°C
Time Above Liquidous (tL)
60 – 150 seconds
60 – 150 seconds
Peak Temperature (TP)
235°C
260°C
Time Within 5°C of Maximum
Peak Temperature (tP)
20 seconds
maximum
30 seconds
maximum
Ramp-Down Rate (TP to TL)
6°C/second
maximum
6°C/second
maximum
Time 25°C to Peak
Temperature
6 minutes
maximum
8 minutes
maximum
TL
Temperature
Profile Feature
tP
Maximum Ramp Up Rate = 3ºC/sec
Maximum Ramp Down Rate = 6ºC/sec
tL
Tsmax
Tsmin
25
ts
25ºC to Peak
Time
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1034_X7R_HV_ARC_SMD • 11/29/2016
12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Reference
Test or Inspection Method
Terminal Strength
JIS–C–6429
Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Board Flex
JIS–C–6429
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm
for C0G. Flexible termination system – 3.0 mm (minimum).
Magnification 50 X. Conditions:
Solderability
J–STD–002
a) Method B, 4 hours at 155°C, dry heat at 235°C
b) Method B at 215°C category 3
c) Method D, category 3 at 260°C
Temperature Cycling
JESD22 Method JA–104
Biased Humidity
MIL–STD–202 Method
103
Moisture Resistance
Storage Life
MIL–STD–202 Method
106
MIL–STD–202 Method
107
MIL–STD–202 Method
108
MIL–STD–202 Method
108
Vibration
MIL–STD–202 Method
204
Mechanical Shock
MIL–STD–202 Method
213
MIL–STD–202 Method
215
Thermal Shock
High Temperature Life
Resistance to Solvents
1,000 cycles (−55°C to +125°C). Measurement at 24 hours +/−4 hours after test conclusion.
Load Humidity: 1,000 hours 85°C/85% RH and 200 VDC maximum. Add 100 K ohm resistor.
Measurement at 24 hours +/−4 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/−4 hours after test conclusion.
t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered. Measurement at 24 hours
+/−4 hours after test conclusion.
®55°C/+125°C. Note: Number of cycles required – 300. Maximum transfer time – 20
seconds. Dwell time – 15 minutes. Air – Air.
1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 1.2 X rated voltage applied.
150°C, 0 VDC for 1,000 hours.
5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7
secure points on one long side and 2 secure points at corners of opposite sides. Parts
mounted within 2" from any secure point. Test from 10 – 2,000 Hz
Figure 1 of Method 213, Condition F.
Add aqueous wash chemical, OKEM Clean or equivalent.
Storage & Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum
storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1034_X7R_HV_ARC_SMD • 11/29/2016
13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Construction – Standard Termination
Detailed Cross Section
Shield Electrodes Dielectric Material
(BaTiO3)
(Ni)
Dielectric
Barrier Layer
Material (BaTiO3)
(Ni)
Termination Finish
End Termination/
(100% Matte Sn/
External Electrode
SnPb - 5% Pb min)
(Cu)
Inner Electrodes
(Ni)
Shield Electrodes End Termination/
(Ni)
External Electrode
(Cu)
Barrier Layer
(Ni)
Inner Electrodes
(Ni)
Termination Finish
(100% Matte Sn/
SnPb - 5% Pb min)
Shield Electrode
(Ni)
Construction – Flexible Termination
Detailed Cross Section
Shield Electrodes Dielectric Material
(Ni)
(BaTiO3)
Barrier Layer
End Termination/
(Ni)
External Electrode
Termination Finish
(Cu)
(100% Matte Sn/
Epoxy Layer
SnPb - 5% Pb min)
(Ag)
Dielectric
Material (BaTiO3)
Inner Electrodes
(Ni)
Shield Electrodes End Termination/
(Ni)
External Electrode
(Cu)
Epoxy Layer
(Ag)
Inner Electrodes
(Ni)
Shield Electrode
(Ni)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn/
SnPb - 5% Pb min)
C1034_X7R_HV_ARC_SMD • 11/29/2016
14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Capacitor Marking (Optional):
These surface mount multilayer ceramic capacitors are
normally supplied unmarked. If required, they can be
marked as an extra cost option. Marking is available
on most KEMET devices but must be requested using
the correct ordering code identifier(s). If this option is
requested, two sides of the ceramic body will be laser
marked with a “K” to identify KEMET, followed by two
characters (per EIA–198 - see table below) to identify the
capacitance value. EIA 0603 case size devices are limited
to the “K” character only.
Laser marking option is not available on:
• C0G, Ultra Stable X8R and Y5V dielectric devices
• EIA 0402 case size devices
• EIA 0603 case size devices with Flexible Termination
option.
• KPS Commercial and Automotive Grade stacked devices.
EIA Case Size
Metric Size Code
Capacitance
0603
0805
1206
1210
1808
1812
1825
2220
2225
1608
2012
3216
3225
4520
4532
4564
5650
5664
≤ 170 pF
≤ 150 pF
≤ 910 pF
≤ 2,000 pF
≤ 3,900 pF
≤ 6,700 pF
≤ 0.018 µF
≤ 0.027 µF
≤ 0.033 µF
• X7R dielectric products in capacitance values outlined
below
Marking appears in legible contrast. Illustrated below is an
example of an MLCC with laser marking of “KA8”, which
designates a KEMET device with rated capacitance of 100 µF.
Orientation of marking is vendor optional.
KEMET
ID
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
2-Digit
Capacitance
Code
C1034_X7R_HV_ARC_SMD • 11/29/2016
15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Capacitor Marking (Optional) cont’d
Alpha
Character
Capacitance (pF) For Various Alpha/Numeral Identifiers
Numeral
9
0
1
2
3
4
5
6
7
8
100,000,000
Capacitance (pF)
A
0.1
10
10
100
1,000
10,000
100,000
1,000,000
10,000,000
B
0.11
1.1
11
110
1,100
11,000
110,000
1,100,000
11,000,000
110,000,000
C
0.12
12
12
120
1,200
12,000
120,000
1,200,000
12,000,000
120,000,000
D
0.13
13
13
130
1,300
13,000
130,000
1,300,000
13,000,000
130,000,000
E
0.15
15
15
150
1,500
15,000
150,000
1,500,000
15,000,000
150,000,000
160,000,000
F
0.16
16
16
160
1,600
16,000
160,000
1,600,000
16,000,000
G
0.18
18
18
180
1,800
18,000
180,000
1,800,000
18,000,000
180,000,000
H
0.2
20
20
200
2,000
20,000
200,000
2,000,000
20,000,000
200,000,000
J
0.22
22
22
220
2,200
22,000
220,000
2,200,000
22,000,000
220,000,000
K
0.24
2.4
24
240
2,400
24,000
240,000
2,400,000
24,000,000
240,000,000
L
0.27
2.7
27
270
2,700
27,000
270,000
2,700,000
27,000,000
270,000,000
M
0.3
30
30
300
3,000
30,000
300,000
3,000,000
30,000,000
300,000,000
N
0.33
33
33
330
3,300
33,000
330,000
3,300,000
33,000,000
330,000,000
P
0.36
36
36
360
3,600
36,000
360,000
3,600,000
36,000,000
360,000,000
Q
0.39
39
39
390
3,900
39,000
390,000
3,900,000
39,000,000
390,000,000
R
0.43
43
43
430
4,300
43,000
430,000
4,300,000
43,000,000
430,000,000
470,000,000
S
0.47
4.7
47
470
4,700
47,000
470,000
4,700,000
47,000,000
T
0.51
5.1
51
510
5,100
51,000
510,000
5,100,000
51,000,000
510,000,000
U
0.56
56
56
560
5,600
56,000
560,000
5,600,000
56,000,000
560,000,000
V
0.62
62
62
620
6,200
62,000
620,000
6,200,000
62,000,000
620,000,000
W
0.68
68
68
680
6,800
68,000
680,000
6,800,000
68,000,000
680,000,000
X
0.75
75
75
750
7,500
75,000
750,000
7,500,000
75,000,000
750,000,000
Y
0.82
82
82
820
8,200
82,000
820,000
8,200,000
82,000,000
820,000,000
Z
0.91
9.1
91
910
9,100
91,000
910,000
9,100,000
91,000,000
910,000,000
a
0.25
25
25
250
2,500
25,000
250,000
2,500,000
25,000,000
250,000,000
b
0.35
35
35
350
3,500
35,000
350,000
3,500,000
35,000,000
350,000,000
d
0.4
40
40
400
4,000
40,000
400,000
4,000,000
40,000,000
400,000,000
e
0.45
45
45
450
4,500
45,000
450,000
4,500,000
45,000,000
450,000,000
f
0.5
50
50
500
5,000
50,000
500,000
5,000,000
50,000,000
500,000,000
m
0.6
60
60
600
6,000
60,000
600,000
6,000,000
60,000,000
600,000,000
n
0.7
70
70
700
7,000
70,000
700,000
7,000,000
70,000,000
700,000,000
t
0.8
80
80
800
8,000
80,000
800,000
8,000,000
80,000,000
800,000,000
y
0.9
90
90
900
9,000
90,000
900,000
9,000,000
90,000,000
900,000,000
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1034_X7R_HV_ARC_SMD • 11/29/2016
16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with
EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
Bar Code Label
Anti-Static Reel
®
Embossed Plastic* or
Punched Paper Carrier.
ET
KEM
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 and 2225 Military)
Sprocket Holes
Embossment or Punched Cavity
8 mm, 12 mm
or 16 mm Carrier Tape
178 mm (7.00")
or
330 mm (13.00")
Anti-Static Cover Tape
(.10 mm (.004") Maximum Thickness)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)
EIA Case Size
Tape
Size
(W)*
Embossed Plastic
7" Reel
13" Reel
Pitch (P1)*
Punched Paper
7" Reel
13" Reel
Pitch (P1)*
01005 – 0402
8
2
2
0603
8
2/4
2/4
0805
8
4
4
4
4
1206 – 1210
8
4
4
4
4
1805 – 1808
12
4
4
≥ 1812
12
8
8
KPS 1210
12
8
8
KPS 1812 & 2220
16
12
12
Array 0508 & 0612
8
4
4
*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 & 7 for tolerance specifications.
New 2 mm Pitch Reel Options*
Packaging
Ordering Code
(C-Spec)
Packaging Type/Options
C-3190
C-3191
C-7081
C-7082
Automotive grade 7" reel unmarked
Automotive grade 13" reel unmarked
Commercial grade 7" reel unmarked
Commercial grade 13" reel unmarked
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
Benefits of Changing from 4 mm to 2 mm Pitching Spacing
• Lower placement costs
• Double the parts on each reel results in fewer reel
changes and increased efficiency
• Fewer reels result in lower packaging, shipping and
storage costs, reducing waste
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1034_X7R_HV_ARC_SMD • 11/29/2016
17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P2
T
T2
ØDo
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Po
E1
Ao
F
Ko
B1
E2
Bo
S1
W
P1
T1
Center Lines of Cavity
ØD
Cover Tape
B 1 is for tape feeder reference only,
including draft concentric about B
o.
1
Embossment
For cavity size,
see Note 1 Table 4
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
8 mm
12 mm
1.5 +0.10/-0.0
(0.059 +0.004/0.0)
16 mm
D1 Minimum
Note 1
1.0
(0.039)
1.5
(0.059)
R Reference S1 Minimum
T
Note 2
Note 3
Maximum
25.0
(0.984)
1.75 ±0.10
4.0 ±0.10
2.0 ±0.05
0.600
0.600
(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)
(0.024)
(0.024)
30
(1.181)
E1
P0
P2
T1
Maximum
0.100
(0.004)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Single (4 mm)
12 mm
Single (4 mm) &
Double (8 mm)
16 mm
Triple (12 mm)
B1 Maximum
Note 4
4.35
(0.171)
8.2
(0.323)
12.1
(0.476)
E2
Minimum
6.25
(0.246)
10.25
(0.404)
14.25
(0.561)
F
P1
3.5 ±0.05
4.0 ±0.10
(0.138 ±0.002) (0.157 ±0.004)
5.5 ±0.05
8.0 ±0.10
(0.217 ±0.002) (0.315 ±0.004)
7.5 ±0.05
12.0 ±0.10
(0.138 ±0.002) (0.157 ±0.004)
T2
Maximum
2.5
(0.098)
4.6
(0.181)
4.6
(0.181)
W
Maximum
8.3
(0.327)
12.3
(0.484)
16.3
(0.642)
A0,B0 & K0
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see
Figure 4).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1034_X7R_HV_ARC_SMD • 11/29/2016
18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
T
Po
ØDo
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
A0
F
P1
T1
T1
Top Cover Tape
W
E2
B0
Bottom Cover Tape
E1
G
Cavity Size,
See
Note 1, Table 7
Center Lines of Cavity
Bottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
E1
P0
P2
T1 Maximum
G Minimum
8 mm
1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004)
Maximum
R Reference
Note 2
0.75
(0.030)
25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Half (2 mm)
8 mm
Single (4 mm)
E2 Minimum
F
P1
T Maximum
W Maximum
A0 B 0
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
1.1
(0.098)
8.3
(0.327)
8.3
(0.327)
Note 1
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1034_X7R_HV_ARC_SMD • 11/29/2016
19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 to 1.0 Newton (10 to 100 gf)
12 and 16 mm
0.1 to 1.3 Newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Maximum
Width (mm) Rotation (
8,12
20
16 – 200
10
Bo
°
T)
Typical Component Centerline
Ao
Figure 4 – Maximum Lateral Movement
8 mm & 12 mm Tape
0.5 mm maximum
0.5 mm maximum
°
s
Tape
Width (mm)
8,12
16 – 56
72 – 200
Maximum
Rotation (
20
10
5
Figure 5 – Bending Radius
Embossed
Carrier
16 mm Tape
°
S)
Punched
Carrier
1.0 mm maximum
1.0 mm maximum
R
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
Bending
Radius
R
C1034_X7R_HV_ARC_SMD • 11/29/2016
20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
Full Radius,
See Note
W3
(Includes
flange distortion
at outer edge)
Access Hole at
Slot Location
(Ø 40 mm minimum)
W2
D
A
(See Note)
N
C
(Arbor hole
diameter)
B
(see Note)
(Measured at hub)
W1
(Measured at hub)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
A
B Minimum
C
D Minimum
8 mm
178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size
N Minimum
W1
W2 Maximum
W3
50
(1.969)
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
12.4 +2.0/-0.0
(0.488 +0.078/-0.0)
16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
14.4
(0.567)
18.4
(0.724)
22.4
(0.882)
Shall accommodate tape
width without interference
8 mm
12 mm
16 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1034_X7R_HV_ARC_SMD • 11/29/2016
21
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Embossed Carrier
Carrier Tape
Punched Carrier
8 mm & 12 mm only
END
Round Sprocket Holes
START
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
Trailer
160 mm Minimum
Components
100 mm
Minimum Leader
400 mm Minimum
Top Cover Tape
Figure 8 – Maximum Camber
Elongated sprocket holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm Maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1034_X7R_HV_ARC_SMD • 11/29/2016
22
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
KEMET Electronic Corporation Sales Offices
For a complete list of our global sales offices, please visit www.kemet.com/sales.
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no
obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or
property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1034_X7R_HV_ARC_SMD • 11/29/2016
23