Effective April 2016 Supersedes November 2014 Technical Data 4309 CC12H High I²t Chip fuses HALOGEN Pb HF FREE Applications Secondary circuit protection • Laptop, notebook, netbook • Tablets, e-readers • Flat panel displays • High definition television (HDTV) • LCD/LED backlighting • Computers and peripherals • Gaming console systems • Handheld/portable equipment • Mobile device chargers Automotive Product description • Central body control module • Heating ventilation and air conditioning controllers (HVAC) • High I²t • Doors, window lift and seat control • High inrush withstand capability • Digital instrument cluster • AEC-Q200 qualified: (750 mA to 20 A) • In-vehicle infotainment (IVI) and navigation • Excellent temperature and cycling characteristics • Electric pumps, motor control and auxiliaries • Powertrain control module (PCU)/Engine Control unit (ECU) • Transmission Control Unit (TCU) • 1206 (3216 metric) compact design utilizes less board space • Compatible with solder reflow and wave solder • Halogen free, lead free, RoHS compliant Agency information • cURus Recognition: File E19180, Guide JDYX2/JDYX8 • AEC-Q200 qualified (750 mA to 20 A) Ordering • Use ordering number (see page 6 for details) Packaging suffixes • -TR (3000 parts per 7” diameter reel, tape width 8 mm) CC12H High I²t Chip fuses Technical Data 4309 Effective April 2016 Electrical characteristics Amp Rating % of Amp Rating Opening Time 250 mA – 30 A 100% 4 hours minimum 1A–3A 200% 1.0 s – 60 s 25 A – 30 A 200% 120 s max 1A–5A 250% 5.0 s max 1A–5A 300% 0.1 s – 3.0 s 250 mA – 750 mA 350% 5 s max 6 A – 20 A 350% 5 s max 250 mA – 500 mA 1000% 0.01 ms – 1.0 ms 750 mA – 30 A 1000% 0.2 ms – 20 ms Product specifications Current rating (A) Voltage rating (VDC) Interrupting rating¹ (A) Typical DC cold resistance² (mΩ) Typical pre-arcing³ I²t (A2s) Typical voltage drop (mV) Part marking CC12H250mA 0.25 63 50 3500 0.00038 1400 .25 CC12H375mA 0.375 63 50 1750 0.00077 730 A CC12H500mA 0.5 63 50 980 0.0019 700 .5 CC12H750mA 0.75 63 50 800 0.15 700 E CC12H1A 1 63 50 470 0.18 490 H CC12H1.5A 1.5 63 50 218 0.4 355 K CC12H2A 2 63 50 133 1.1 305 N CC12H2.5A 2.5 63 50 79 1.7 240 O CC12H3A 3 63 50 49 2.2 185 P CC12H3.5A 3.5 63 50 37 2.7 180 R CC12H4A 4 63 50 33 3.2 169 S CC12H4.5A 4.5 32 100 28 4.2 160 X CC12H5A 5 32 100 23 6 140 T CC12H6A 6 32 100 15.5 12 150 F CC12H7A 7 32 100 11.5 18 130 J CC12H8A 8 32 100 7.3 18 110 V CC12H10A 10 32 100 6.5 30 90 U CC12H12A 12 32 100 4.7 45 90 W CC12H15A 15 32 100 3 33 90 Y CC12H20A 20 32 100 2 80 90 Q CC12H25A 25 32 200 3 60 90 L CC12H30A 30 32 200 2.1 100 90 Z Part Number 1. DC interrupting rating measured at rated voltage, time constant of less than 50 microseconds, battery source. 2. Typical DC cold resistance measured at <10% of rated current. 3. Typical pre-arcing I²t value is measured at 10In rated current. 2 www.eaton.com/elx CC12H High I²t Chip fuses Technical Data 4309 Effective April 2016 Dimensions–mm Packaging information- mm Supplied in tape and reel packaging, 3000 parts per 7” diameter reel. www.eaton.com/elx 3 CC12H High I²t Chip fuses Technical Data 4309 Effective April 2016 I2t vs. time curve I2t (A2s) CC12H Time (s) 4 www.eaton.com/elx CC12H High I²t Chip fuses Technical Data 4309 Effective April 2016 Time (s) Time vs. current curve www.eaton.com/elx 5 CC12H High I²t Chip fuses Technical Data 4309 Effective April 2016 Temperature derating curve Environmental data Operating temperature: -55 °C to +125 °C (with derating); (20 A- 30 A) -40 °C to +85 °C (with derating) Thermal shock: MIL- STD- 202G, Method 107, (300 cycles -55 °C to +125 °C) Vibration: MIL-STD- 202G, Method 204, (20 g's for 20 minutes, 12 cycles in each of 3 orientations, 10- 2000 Hz) Humidity: MIL- STD- 202G, Method 103, (+85 °C, 85% relative humidty, 1000 hours 10% of operating power Mechanical shock: MIL-STD- 202G, Method 213, Condition C Ordering codes The ordering code is the part number replacing the “.” with a “-” plus adding the packaging suffix. Packaging suffix • -TR (3000 parts on a 7” reel, tape width 8 mm). Ordering code Ordering code Part Number -TR option Part Number -TR option CC12H250mA CC12H250mA-TR CC12H4A CC12H4A-TR CC12H375mA CC12H375mA-TR CC12H4.5A CC12H4-5A-TR CC12H500mA CC12H500mA-TR CC12H5A CC12H5A-TR CC12H750mA CC12H750mA-TR CC12H6A CC12H6A-TR CC12H1A CC12H1A-TR CC12H7A CC12H7A-TR CC12H1.5A CC12H1-5A-TR CC12H8A CC12H8A-TR CC12H2A CC12H2A-TR CC12H10A CC12H10A-TR CC12H2.5A CC12H2-5A-TR CC12H12A CC12H12A-TR CC12H3A CC12H3A-TR CC12H15A CC12H15A-TR CC12H3.5A CC12H3-5A-TR CC12H20A CC12H20A-TR CC12H25A CC12H25A-TR CC12H30A CC12H30A-TR 6 www.eaton.com/elx CC12H Technical Data 4309 Effective April 2016 High I²t Chip fuses Wave solder profile tp Temperature Tp First Wave Second Wave Tsmax Tstyp Tsmin Preheat area Cool down area Time Reference EN 61760-1:2006 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder • Temperature min. (Tsmin) 100°C 100°C • Temperature typ. (Tstyp) 120°C 120°C • Temperature max. (Tsmax) 130°C 130°C • Time (Tsmin to Tsmax) (ts) 70 seconds 70 seconds D preheat to max Temperature 150°C max. 150°C max. Peak temperature (TP)* 235°C – 260°C 250°C – 260°C Time at peak temperature (tp) 10 seconds max 5 seconds max each wave 10 seconds max 5 seconds max each wave Ramp-down rate ~ 2 K/s min ~3.5 K/s typ ~5 K/s max ~ 2 K/s min ~3.5 K/s typ ~5 K/s max Time 25°C to 25°C 4 minutes 4 minutes Preheat Manual solder 350°C, 4-5 seconds. (by soldering iron), generally manual, hand soldering is not recommended. www.eaton.com/elx 7 CC12H High I²t Chip fuses Technical Data 4309 Effective April 2016 Solder reflow profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL Preheat A T smax Package Thickness Volume mm3 <350 Volume mm3 ≥350 <2.5mm) 235°C 220°C ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Tsmin 25°C t Table 1 - Standard SnPb Solder (Tc) ts Time 25°C to Peak Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C Time Reference JDEC J-STD-020D Profile Feature Preheat and Soak Standard SnPb Solder Lead (Pb) Free Solder • Temperature min. (Tsmin) 100°C 150°C • Temperature max. (Tsmax) 150°C 200°C • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx © 2016 Eaton All Rights Reserved Printed in USA Publication No. 4309 BU-MC16040 April 2016 Eaton is a registered trademark. All other trademarks are property of their respective owners.